CBT3126DB,118 [NXP]
CBT3126 - Quad FET bus switch SSOP1 14-Pin;型号: | CBT3126DB,118 |
厂家: | NXP |
描述: | CBT3126 - Quad FET bus switch SSOP1 14-Pin 驱动 光电二极管 逻辑集成电路 |
文件: | 总13页 (文件大小:93K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CBT3126
Quad FET bus switch
Rev. 04 — 12 October 2009
Product data sheet
1. General description
The CBT3126 is a quad FET bus switch with independent line switches. Each switch is
disabled when the associated Output Enable (OE) input is LOW.
The CBT3126 is characterized for operation from −40 °C to +85 °C.
2. Features
I Standard ’126-type pinout
I Multiple package options
I 5 Ω switch connection between two ports
I TTL-compatible input levels
I Minimal propagation delay through the switch
I Latch-up protection exceeds 500 mA per JEDEC standard JESD78 class II level A
I ESD protection:
N HBM JESD22-A114E exceeds 2000 V
N MM JESD22-A115-A exceeds 200 V
N CDM JESD22-C101C exceeds 1000 V
I Specified from −40 °C to +85 °C
3. Ordering information
Table 1.
Ordering information
Type number
Temperature range Package
Name
Description
Version
CBT3126D
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
SO14
plastic small outline package; 14 leads;
body width 3.9 mm
SOT108-1
CBT3126DB
CBT3126PW
CBT3126DS
SSOP14
TSSOP14
SSOP16[1]
plastic shrink small outline package; 14 leads;
body width 5.3 mm
SOT337-1
plastic thin shrink small outline package; 14 leads; SOT402-1
body width 4.4 mm
plastic shrink small outline package; 16 leads;
body width 3.9 mm; lead pitch 0.635 mm
SOT519-1
[1] Also known as QSOP16.
CBT3126
NXP Semiconductors
Quad FET bus switch
4. Functional diagram
2
3
1A
1B
1OE
1A
1
5
1OE
2A
1B
2B
3B
4B
6
2B
2OE
2A
4
9
2OE
3A
8
3OE
3A
3B
10
12
3OE
4A
4OE
4A
11
4B
13
4OE
001aaj023
001aaj024
Pin numbers are for the 14 pin packages.
Fig 1. Logic symbol
Fig 2. Logic diagram
5. Pinning information
5.1 Pinning
CBT3126
1
2
3
4
5
6
7
14
13
12
11
10
9
1OE
1A
V
CC
CBT3126
CBT3126
4OE
4A
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
n.c.
1OE
1A
V
CC
1
2
3
4
5
6
7
14
13
12
11
10
9
1OE
1A
V
CC
4OE
4A
1B
4OE
4A
2OE
2A
4B
1B
1B
4B
2OE
2A
4B
3OE
3A
2OE
2A
3OE
3A
3OE
3A
2B
2B
2B
3B
8
GND
3B
GND
8
3B
GND
n.c.
001aaj111
001aaj025
001aaj026
Fig 3. Pin configuration
SOT108-1 (SO14)
Fig 4. Pin configuration
Fig 5. Pin configuration
SOT519-1 (SSOP16)
SOT337-1 (SSOP14) and
SOT402-1 (TSSOP14)
5.2 Pin description
Table 2.
Symbol
Pin description
Pin
Description
SOT108-1 SOT337-1 and SOT402-1
SOT519-1
2, 5, 12, 15
3, 6, 11, 14
4, 7, 10, 13
1OE to 4OE 1, 4, 10, 13
output enable input
A input/output
1A to 4A,
1B to 4B
2, 5, 9, 12
3, 6, 8, 11
B output/input
CBT3126_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 12 October 2009
2 of 13
CBT3126
NXP Semiconductors
Quad FET bus switch
Table 2.
Symbol
Pin description …continued
Pin
Description
SOT108-1 SOT337-1 and SOT402-1
SOT519-1
GND
VCC
n.c.
7
8
ground (0 V)
14
-
16
positive supply voltage
not connected
1, 9
6. Functional description
Table 3.
Function selection
H = HIGH voltage level; L = LOW voltage level.
Inputs
nOE
L
Switch
nA to nB disconnected
nA to nB connected
H
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
−0.5
−0.5
-
Max
+7.0
+7.0
128
-
Unit
V
VCC
VI
supply voltage
[1]
input voltage
V
ISW
IIK
switch current
continuous current through each switch
VI < 0 V
mA
mA
°C
input clamping current
storage temperature
total power dissipation
−50
−65
Tstg
Ptot
+150
[2]
[3]
[4]
[4]
Tamb = −40 °C to +125 °C
SO14 package
-
-
-
500
500
500
mW
mW
mW
SSOP14 and SSOP16 package
TSSOP14 package
[1] The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
[2] The package thermal impedance is calculated from JESD51-7.
[3] For SO14 package; Ptot derates linearly with 8 mW/K above 70 °C.
[4] For SSOP14, SSOP16 and TSSOP14 packages; Ptot derates linearly with 5.5 mW/K above 70 °C.
8. Recommended operating conditions
Table 5.
Operating conditions
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation.
Symbol
VCC
Parameter
Conditions
Min
4.5
2.0
-
Max
5.5
-
Unit
supply voltage
V
VIH
HIGH-level input voltage
LOW-level input voltage
ambient temperature
V
VIL
0.8
+85
V
Tamb
operating in free-air
−40
°C
CBT3126_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 12 October 2009
3 of 13
CBT3126
NXP Semiconductors
Quad FET bus switch
9. Static characteristics
Table 6.
Static characteristics
Tamb = −40 °C to +85 °C.
Symbol
VIK
Parameter
Conditions
Min
Typ[1] Max
Unit
V
input clamping voltage
pass voltage
VCC = 4.5 V; II = −18 mA
VI = VCC = 5.0 V; ISW = −100 µA
VCC = 5.5 V; VI = GND or 5.5 V
-
-
-
-
-
−1.2
-
Vpass
II
3.8
V
input leakage current
supply current
-
-
±1
3
µA
µA
ICC
VCC = 5.5 V; ISW = 0 mA;
VI = VCC or GND
[2]
[3]
∆ICC
additional supply current
control pins; per input;
-
-
2.5
mA
VCC = 5.5 V; one input at 3.4 V,
other inputs at VCC or GND
CI
input capacitance
control pins; VI = 3 V or 0 V
-
-
1.7
3.4
-
-
pF
pF
Cio(off)
RON
off-state input/output capacitance VO = 3 V or 0 V; nOE = VCC
ON resistance
VCC = 4.0 V
VI = 2.4 V; II = 15 mA
VCC = 4.5 V
-
16
22
Ω
VI = 0 V; II = 64 mA
VI = 0 V; II = 30 mA
VI = 2.4 V; II = 15 mA
-
-
-
5
7
Ω
Ω
Ω
5
7
10
15
[1] All typical values are measured at VCC = 5 V; Tamb = 25 °C.
[2] This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
[3] Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. ON resistance is
determined by the lowest voltage of the two (A or B) terminals.
10. Dynamic characteristics
Table 7.
Dynamic characteristics
Tamb = −40 °C to +85 °C; VCC = 4.5 V to 5.5 V; for test circuit see Figure 8.
Symbol
tpd
Parameter
Conditions
Min
-
Max
0.25
4.5
Unit
[1][2]
[2]
propagation delay
enable time
nA to nB or nB to nA; see Figure 6
nOE to nA or nB; see Figure 7
nOE to nA or nB; see Figure 7
ns
ns
ns
ten
1.6
1.0
[2]
tdis
disable time
5.4
[1] This parameter is warranted but not production tested. The propagation delay is based on the RC time constant of the typical ON
resistance of the switch and a load capacitance, when driven by an ideal voltage source (zero output impedance).
[2] tPLH and tPHL are the same as tpd
tPZL and tPZH are the same as ten
tPLZ and tPHZ are the same as tdis
;
;
.
CBT3126_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 12 October 2009
4 of 13
CBT3126
NXP Semiconductors
Quad FET bus switch
11. AC waveforms
V
I
V
V
M
input
0 V
M
t
t
PLH
PHL
V
OH
V
V
M
output
M
V
OL
001aai367
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 6. The input (nA, nB) to output (nB, nA) propagation delay times
V
I
nOE input
V
M
GND
t
t
PZL
PLZ
V
CC
output
LOW-to-OFF
OFF-to-LOW
V
M
V
X
V
OL
t
t
PHZ
PZH
V
OH
V
Y
output
HIGH-to-OFF
OFF-to-HIGH
V
M
GND
switch
enabled
switch
disabled
switch
enabled
001aaj027
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 7. Enable and disable times
Table 8.
Input
VM
Measurement points
Output
VM
VX
VY
VOH − 0.3 V
1.5 V
1.5 V
VOL + 0.3 V
CBT3126_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 12 October 2009
5 of 13
CBT3126
NXP Semiconductors
Quad FET bus switch
12. Test information
t
W
V
I
90 %
negative
pulse
V
V
V
M
M
10 %
0 V
t
t
r
f
t
t
f
r
V
I
90 %
positive
pulse
V
M
M
10 %
0 V
t
W
V
EXT
V
CC
R
L
V
V
O
I
G
DUT
R
T
C
L
R
L
001aae331
Test data is given in Table 9.
Definitions for test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
VEXT = External voltage for measuring switching times.
Fig 8. Test circuit for measuring switching times
Table 9.
Test data
Supply voltage Input
Load
CL
VEXT
VCC
VI
tr, tf
RL
tPLH, tPHL
open
tPLZ, tPZL
7.0 V
tPHZ, tPZH
4.5 V to 5.5 V
GND to 3.0 V
≤ 2.5 ns
50 pF
500 Ω
open
CBT3126_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 12 October 2009
6 of 13
CBT3126
NXP Semiconductors
Quad FET bus switch
13. Package outline
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
H
v
M
A
E
Z
8
14
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
7
e
detail X
w
M
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.75
1.27
0.05
1.05
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches
0.041
0.01 0.004
0.069
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT108-1
076E06
MS-012
Fig 9. Package outline SOT108-1 (SO14)
CBT3126_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 12 October 2009
7 of 13
CBT3126
NXP Semiconductors
Quad FET bus switch
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm
SOT337-1
D
E
A
X
c
y
H
v
M
A
E
Z
8
14
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
7
1
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
E
max.
8o
0o
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
7.9
7.6
1.03
0.63
0.9
0.7
1.4
0.9
mm
2
0.25
0.65
1.25
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT337-1
MO-150
Fig 10. Package outline SOT337-1 (SSOP14)
CBT3126_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 12 October 2009
8 of 13
CBT3126
NXP Semiconductors
Quad FET bus switch
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
E
A
X
c
y
H
v
M
A
E
Z
8
14
Q
(A )
3
A
2
A
A
1
pin 1 index
θ
L
p
L
1
7
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.72
0.38
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT402-1
MO-153
Fig 11. Package outline SOT402-1 (TSSOP14)
CBT3126_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 12 October 2009
9 of 13
CBT3126
NXP Semiconductors
Quad FET bus switch
SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm
SOT519-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
A
2
A
(A )
3
A
1
θ
L
p
L
8
1
detail X
w
M
e
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
v
w
y
Z
θ
p
p
1
2
3
E
max.
8o
0o
0.25
0.10
1.55
1.40
0.31
0.20
0.25
0.18
5.0
4.8
4.0
3.8
6.2
5.8
0.89
0.41
0.18
0.05
mm
1.73
0.25
0.635
1
0.2
0.18
0.09
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-05-04
03-02-18
SOT519-1
Fig 12. Package outline SOT519-1 (SSOP16)
CBT3126_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 12 October 2009
10 of 13
CBT3126
NXP Semiconductors
Quad FET bus switch
14. Abbreviations
Table 10. Abbreviations
Acronym
CDM
DUT
Description
Charged Device Model
Device Under Test
ESD
ElectroStatic Discharge
Human Body Model
Machine Model
HBM
MM
TTL
Transistor-Transistor Logic
15. Revision history
Table 11. Revision history
Document ID
CBT3126_4
Modifications:
CBT3126_3
CBT3126_2
CBT3126_1
Release date
20091012
Data sheet status
Change notice
Supersedes
Product data sheet
-
.
CBT3126_3
• Section 7 “Limiting values” changed ICC to ISW
20081209
20081023
20011212
Product data sheet
Product data sheet
Product data sheet
-
-
-
CBT3126_2
CBT3126_1
-
CBT3126_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 12 October 2009
11 of 13
CBT3126
NXP Semiconductors
Quad FET bus switch
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
CBT3126_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 12 October 2009
12 of 13
CBT3126
NXP Semiconductors
Quad FET bus switch
18. Contents
1
2
3
4
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
6
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 3
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 4
AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11
7
8
9
10
11
12
13
14
15
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
16.1
16.2
16.3
16.4
17
18
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 12 October 2009
Document identifier: CBT3126_4
相关型号:
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