CBTD3384PW,118 [NXP]
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型号: | CBTD3384PW,118 |
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描述: | CBTD3384 - 10-bit level shifting bus switch with 5-bit output enables TSSOP2 24-Pin |
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CBTD3384
10-bit level shifting bus switch with 5-bit output enables
Rev. 8 — 12 December 2012
Product data sheet
1. General description
The CBTD3384 provides ten bits of high-speed TTL-compatible bus switching. The low
ON resistance of the switch allows connections to be made with minimal propagation
delay.
The CBTD3384 device is organized as two 5-bit bus switches with two separate output
enable (1OE, 2OE) inputs. When nOE is LOW, the switch is on and port A is connected to
the B port. When nOE is HIGH, each switch is disabled.
The CBTD3384 is characterized for operation from 40 C to +85 C.
2. Features and benefits
Designed to be used in 5 V to 3.3 V level shifting applications with internal diode
5 switch connection between two ports
TTL-compatible control input levels
Multiple package options
Latch-up protection exceeds 100 mA per JESD78
ESD protection:
HBM JESD22-A114E exceeds 2000 V
CDM JESD22-C101C exceeds 1000 V
3. Ordering information
Table 1.
Type number Package
Temperature range Name
Ordering information
Description
Version
CBTD3384D
40 C to +85 C
SO24
plastic small outline package; 24 leads; body width 7.5 mm SOT137-1
CBTD3384DB 40 C to +85 C
SSOP24
plastic shrink small outline package; 24 leads;
body width 5.3 mm
SOT340-1
SOT556-1
SOT355-1
CBTD3384DK 40 C to +85 C
CBTD3384PW 40 C to +85 C
SSOP24[1] plastic shrink small outline package; 24 leads;
body width 3.9 mm; lead pitch 0.635 mm
TSSOP24 plastic thin shrink small outline package; 24 leads;
body width 4.4 mm
[1] Also known as QSOP24 package
CBTD3384
NXP Semiconductors
10-bit level shifting bus switch with 5-bit output enables
4. Functional diagram
3
2
1A1
1B1
11
1
10
1A5
1OE
2A1
1B5
14
15
2B1
22
13
23
2A5
2B5
2OE
001aak877
Fig 1. Logic diagram
5. Pinning information
5.1 Pinning
CBTD3384
CBTD3384
1
2
24
23
22
21
20
19
18
17
16
15
14
13
1
2
24
23
22
21
20
19
18
17
16
15
14
13
1OE
1B1
1A1
1A2
1B2
1B3
1A3
1A4
1B4
1B5
1A5
GND
V
1OE
1B1
1A1
1A2
1B2
1B3
1A3
1A4
1B4
1B5
1A5
GND
V
CC
CC
2B5
2B5
2A5
2A4
2B4
2B3
2A3
2A2
2B2
2B1
2A1
2OE
3
3
2A5
2A4
2B4
2B3
2A3
2A2
2B2
2B1
2A1
2OE
4
4
5
5
6
6
7
7
8
8
9
9
10
11
12
10
11
12
001aan060
001aan061
Fig 2. Pin configuration for SO24 (SOT137-1)
Fig 3. Pin configuration for SSOP24 (SOT340-1) and
TSSOP24 (SOT355-1)
CBTD3384
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 8 — 12 December 2012
2 of 17
CBTD3384
NXP Semiconductors
10-bit level shifting bus switch with 5-bit output enables
CBTD3384
24
23
22
21
20
19
18
17
16
15
14
13
1OE
1B1
1A1
1A2
1B2
1B3
1A3
1A4
1B4
1B5
1A5
GND
1
2
V
CC
2B5
2A5
2A4
2B4
2B3
2A3
2A2
2B2
2B1
2A1
2OE
3
4
5
6
7
8
9
10
11
12
001aan062
Fig 4. Pin configuration for SSOP24 (SOT556-1)
5.2 Pin description
Table 2.
Symbol
1OE, 2OE
1A1 to 1A5
2A1 to 2A5
1B1 to 1B5
2B1 to 2B5
GND
Pin description
Pin
Description
1, 13
output enable input (active LOW)
data input/output (A port)
3, 4, 7, 8, 11
14, 17, 18, 21, 22 data input/output (A port)
2, 5, 6, 9, 10 data input/output (B port)
15, 16, 19, 20, 23 data input/output (B port)
12
24
ground (0 V)
VCC
positive supply voltage
6. Functional description
Table 3.
Function selection[1]
Input
Input/output
1OE
L
2OE
1An, 1Bn
2An, 2Bn
L
1An = 1Bn
2An = 2Bn
L
H
L
1An = 1Bn
Z
H
Z
Z
2An = 2Bn
Z
H
H
[1] H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF-state.
CBTD3384
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 8 — 12 December 2012
3 of 17
CBTD3384
NXP Semiconductors
10-bit level shifting bus switch with 5-bit output enables
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol
VCC
VI
Parameter
Conditions
Min
0.5
0.5
-
Max
+7.0
+7.0
128
-
Unit
V
supply voltage
input voltage
[2]
V
IO
output current
VO < 0 V
mA
mA
C
IIK
input clamping current
storage temperature
VI/O = 0 V
50
65
Tstg
+150
[1] Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under Section 8. is not implied. Exposure to absolute-maximum-rated
conditions for extended periods may affect device reliability.
[2] The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
8. Recommended operating conditions
Table 5.
Operating conditions
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation.
Symbol
VCC
Parameter
Conditions
Min
4.5
2.0
-
Typ
Max
5.5
-
Unit
V
supply voltage
-
-
-
-
VIH
HIGH-level input voltage
LOW-level input voltage
ambient temperature
V
VIL
0.8
+85
V
Tamb
operating in free air
40
C
9. Static characteristics
Table 6.
Static characteristics
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions
Tamb = 40 C to +85 C
Unit
Min
Typ[1]
Max
1.2
1
VIK
II
input clamping voltage
VCC = 4.5 V; II = 18 mA
-
-
-
-
-
-
V
input leakage current
supply current
VCC = 5.5 V; VI = GND or 5.5 V
A
mA
ICC
VCC = 5.5 V; IO = 0 mA;
VI = VCC or GND
1.5
[2]
ICC
additional supply current per input pin; VCC = 5.5 V; one input
at 3.4 V, other inputs at VCC or GND
-
-
2.5
mA
Vpass
CI
pass voltage
see Figure 5 to Figure 9
-
-
-
-
-
-
-
V
input capacitance
control pins; VI = 3 V or 0 V
port off; VI = 3 V or 0 V; nOE = VCC
3.2
6.0
pF
pF
Cio(off)
off-state input/output
capacitance
CBTD3384
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 8 — 12 December 2012
4 of 17
CBTD3384
NXP Semiconductors
10-bit level shifting bus switch with 5-bit output enables
Table 6.
Static characteristics …continued
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Tamb = 40 C to +85 C
Unit
Min
Typ[1]
Max
7
[3]
[3]
[3]
RON
ON resistance
VCC = 4.5 V; VI = 0 V; II = 64 mA
VCC = 4.5 V; VI = 0 V; II = 30 mA
VCC = 4.5 V; VI = 2.4 V; II = 15 mA
-
-
-
5
5
7
17
50
[1] All typical values are at VCC = 5 V, Tamb = 25 C.
[2] This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
[3] Measured by the voltage drop between the nAn and the nBn terminals at the indicated current through the switch. ON resistance is
determined by the lowest voltage of the two (nAn or nBn) terminals.
9.1 Typical pass voltage graphs
001aak834
001aak835
3.6
3.6
V
V
pass
pass
(V)
(V)
(1)
(2)
(1)
3.2
3.2
(2)
(3)
2.8
2.4
2.0
2.8
2.4
2.0
(3)
(4)
(4)
4.4
4.8
5.2
5.6
4.4
4.8
5.2
5.6
V
(V)
V
(V)
CC
CC
(1) ISW = 100 A
(1) ISW = 100 A
(2) ISW = 6 mA
(2) ISW = 6 mA
(3)
I
SW =12 mA
(3)
ISW =12 mA
(4) ISW = 24 mA
(4) ISW = 24 mA
Fig 5. Pass voltage versus supply voltage;
Fig 6. Pass voltage versus supply voltage;
amb = 70 C (typical)
Tamb = 85 C (typical)
T
CBTD3384
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 8 — 12 December 2012
5 of 17
CBTD3384
NXP Semiconductors
10-bit level shifting bus switch with 5-bit output enables
001aak836
001aak837
3.6
3.6
V
V
pass
pass
(V)
(V)
(1)
(1)
(2)
3.2
3.2
(2)
(3)
(3)
(4)
2.8
2.4
2.0
2.8
2.4
2.0
(4)
4.4
4.8
5.2
5.6
4.4
4.8
5.2
5.6
V
(V)
V
(V)
CC
CC
(1) ISW = 100 A
(2) SW = 6 mA
(1) ISW = 100 A
(2) SW = 6 mA
I
I
(3) ISW =12 mA
(4) ISW = 24 mA
(3) ISW =12 mA
(4) ISW = 24 mA
Fig 7. Pass voltage versus supply voltage;
Fig 8. Pass voltage versus supply voltage;
Tamb = 25 C (typical)
Tamb = 0 C (typical)
001aak838
3.6
V
pass
(V)
3.2
(1)
(2)
2.8
2.4
2.0
(3)
(4)
4.4
4.8
5.2
5.6
V
(V)
CC
(1) ISW = 100 A
(2) SW = 6 mA
I
(3) ISW =12 mA
(4) ISW = 24 mA
Fig 9. Pass voltage versus supply voltage; Tamb = 40 C (typical)
CBTD3384
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 8 — 12 December 2012
6 of 17
CBTD3384
NXP Semiconductors
10-bit level shifting bus switch with 5-bit output enables
10. Dynamic characteristics
Table 7.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 12.
Symbol Parameter
Conditions
Tamb = 40 C to +85 C
Unit
Min
Typ
Max
[1][2]
[2]
tpd
ten
tdis
propagation delay
nAn, nBn to nBn, nAn; see Figure 10
VCC = 5.0 V 0.5 V
-
-
0.25
7.0
ns
ns
ns
enable time
disable time
nOE to nAn or nBn; see Figure 11
VCC = 5.0 V 0.5 V
1.2
1.7
4.3
3.0
[2]
nOE to nAn or nBn; see Figure 11
VCC = 5.0 V 0.5 V
5.3
[1] The propagation delay is the calculated RC time constant of the typical ON resistance of the switch and the specified load capacitance,
when driven by an ideal voltage source (zero output impedance).
[2] tpd is the same as tPLH and tPHL
ten is the same as tPZL and tPZH
.
.
tdis is the same as tPLZ and tPHZ
.
11. Waveforms
V
I
nAn, nBn,
input
V
M
GND
t
t
PLH
PHL
V
OH
nBn, nAn,
output
V
M
V
OL
001aan063
Measurement points are given in Table 8.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 10. The data input (nAn, nBn) to output (nBn, nAn) propagation delay times
CBTD3384
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 8 — 12 December 2012
7 of 17
CBTD3384
NXP Semiconductors
10-bit level shifting bus switch with 5-bit output enables
V
I
V
V
M
nOE input
output
M
GND
3.5 V
t
t
PZL
PLZ
V
M
LOW to OFF
OFF to LOW
V
X
V
OL
t
t
PZH
PHZ
V
OH
V
Y
output
HIGH to OFF
OFF to HIGH
V
M
GND
outputs
enabled
outputs
disabled
outputs
enabled
001aak298
Measurement points are given in Table 8.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 11. Enable and disable times
Table 8. Measurement points
Supply voltage
VCC
Input
VI
Output
VM
VM
VX
VY
VCC = 5.0 V 0.5 V GND to 3.0 V
1.5 V
1.5 V
VOL + 0.3 V
VOH 0.3 V
CBTD3384
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 8 — 12 December 2012
8 of 17
CBTD3384
NXP Semiconductors
10-bit level shifting bus switch with 5-bit output enables
12. Test information
t
W
V
I
90 %
negative
pulse
V
V
V
M
M
10 %
0 V
t
t
r
f
t
t
f
r
V
I
90 %
positive
pulse
V
M
M
10 %
0 V
t
W
V
EXT
R
V
CC
L
V
V
O
I
G
DUT
R
T
C
L
R
L
001aae331
Test data is given in Table 9.
All input pulses are supplied by generators having the following characteristics: PRR 10 MHz; Zo = 50 .
The outputs are measured one at a time with one transition per measurement.
Definitions for test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
V
EXT = External voltage for measuring switching times.
Fig 12. Test circuit for measuring switching times
Table 9. Test data
Supply voltage
Input
VI
Load
CL
VEXT
tr, tf
RL
tPLH, tPHL
open
tPLZ, tPZL
tPHZ, tPZH
VCC = 5.0 V 0.5 V
GND to 3.0 V 2.5 ns
50 pF
500
7.0 V
open
CBTD3384
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 8 — 12 December 2012
9 of 17
CBTD3384
NXP Semiconductors
10-bit level shifting bus switch with 5-bit output enables
13. Package outline
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A
X
c
H
v
M
A
E
y
Z
24
13
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
12
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
mm
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.3
0.1
2.45
2.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
2.65
0.1
0.25
0.01
1.27
0.05
1.4
0.25 0.25
0.01
0.1
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.61
0.014 0.009 0.60
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT137-1
075E05
MS-013
Fig 13. Package outline SOT137-1 (SO24)
CBTD3384
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 8 — 12 December 2012
10 of 17
CBTD3384
NXP Semiconductors
10-bit level shifting bus switch with 5-bit output enables
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
D
E
A
X
v
c
H
M
A
y
E
Z
24
13
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
12
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
8o
0o
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
8.4
8.0
5.4
5.2
7.9
7.6
1.03
0.63
0.9
0.7
0.8
0.4
mm
2
0.65
1.25
0.25
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT340-1
MO-150
Fig 14. Package outline SOT340-1 (SSOP24)
CBTD3384
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 8 — 12 December 2012
11 of 17
CBTD3384
NXP Semiconductors
10-bit level shifting bus switch with 5-bit output enables
SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm
SOT556-1
D
E
A
X
c
y
H
v
M
A
E
Z
13
24
A
2
A
(A )
3
A
1
θ
L
p
L
12
1
detail X
w M
e
b
p
0
2.5
5 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
1
L
p
v
w
y
Z
θ
1
2
3
p
E
max.
8o
0o
0.25
0.10
1.55
1.40
0.31
0.20
0.25
0.18
8.8
8.6
4.0
3.8
6.2
5.8
0.89
0.41
1.05
0.66
mm
1.73
0.25
0.01
0.635
0.025
0.25
0.18
0.1
0.0098 0.061
0.0040 0.055
0.012 0.0098 0.344 0.157
0.008 0.0075 0.337 0.150
0.244
0.228
0.035
0.016
0.040
0.026
8o
0o
inches
0.068
0.041
0.01 0.007 0.004
Note
1. Plastic or metal protrusions of 0.2 mm (0.008 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT556-1
MO-137
Fig 15. Package outline SOT556-1 (SSOP24)
CBTD3384
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 8 — 12 December 2012
12 of 17
CBTD3384
NXP Semiconductors
10-bit level shifting bus switch with 5-bit output enables
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355-1
D
E
A
X
c
H
v
M
A
y
E
Z
13
24
Q
A
2
(A )
3
A
A
1
pin 1 index
θ
L
p
L
1
12
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
7.9
7.7
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.5
0.2
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT355-1
MO-153
Fig 16. Package outline SOT355-1 (TSSOP24)
CBTD3384
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 8 — 12 December 2012
13 of 17
CBTD3384
NXP Semiconductors
10-bit level shifting bus switch with 5-bit output enables
14. Abbreviations
Table 10. Abbreviations
Acronym
CDM
ESD
Description
Charged Device Model
ElectroStatic Discharge
Human Body Model
HBM
PRR
Pulse Rate Repetition
Transistor-Transistor Logic
TTL
15. Revision history
Table 11. Revision history
Document ID
CBTD3384 v.8
Modifications:
CBTD3384 v.7
Modifications:
CBTD3384 v.6
Modifications:
CBTD3384 v.5
CBTD3384 v.4
CBTD3384 v.3
CBTD3384 v.2
Release date
20121212
Data sheet status
Change notice
Supersedes
Product data sheet
-
CBT3384 v.7
• Table 1: changed +125 °C into +85 °C (errata).
20121119 Product data sheet
• Table 1: changed +85 °C into +125 °C (errata).
-
CBT3384 v.6
20111121
Product data sheet
-
CBTD3384 v.5
• Legal pages updated.
20101119
20011220
20000830
20000830
Product data sheet
-
CBTD3384 v.4
CBTD3384 v.3
CBTD3384 v.2
-
Product specification
Product specification
Product specification
-
-
CBTD3384
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 8 — 12 December 2012
14 of 17
CBTD3384
NXP Semiconductors
10-bit level shifting bus switch with 5-bit output enables
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
16.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
CBTD3384
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 8 — 12 December 2012
15 of 17
CBTD3384
NXP Semiconductors
10-bit level shifting bus switch with 5-bit output enables
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
CBTD3384
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 8 — 12 December 2012
16 of 17
CBTD3384
NXP Semiconductors
10-bit level shifting bus switch with 5-bit output enables
18. Contents
1
2
3
4
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Typical pass voltage graphs . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14
7
8
9
9.1
10
11
12
13
14
15
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
16.1
16.2
16.3
16.4
17
18
Contact information. . . . . . . . . . . . . . . . . . . . . 16
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 12 December 2012
Document identifier: CBTD3384
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