CBTL05023 [NXP]

Multiplexer/demultiplexer switch for Thunderbolt applications; 多路复用器/多路分解器开关,用于霹雳应用
CBTL05023
型号: CBTL05023
厂家: NXP    NXP
描述:

Multiplexer/demultiplexer switch for Thunderbolt applications
多路复用器/多路分解器开关,用于霹雳应用

复用器 开关
文件: 总4页 (文件大小:107K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CBTL05023  
Multiplexer/demultiplexer switch for Thunderbolt applications  
Rev. 2 — 15 August 2012  
Product brief  
1. General description  
The CBTL05023 is a multiplexer/demultiplexer switch chip for DisplayPort v1.2 signals  
and the control signals of a 10 Gbit/s channel. The 10 Gbit/s channel does not pass  
through this switch. This chip provides BIASOUT output control signal, and the  
DC-biasing pull-down resistors to facilitate an external 10 Gbit/s channel.  
The AUX MUX is a 2 : 1 switch with CA_DETect pin selecting between AUX and DDC  
(Direct Display Control) signals.  
The DP MUX is a 2 : 1 switch that selects between DPML (DisplayPort Main Link) and  
LSTX/LSRX signals.  
This chip also includes three control signal buffers: HPDOUT, CA_DETOUT and  
BIASOUT.  
CBTL05023 is powered by a 3.3 V supply and it is available in 3 mm × 3 mm HVQFN24  
package with 0.4 mm pitch.  
2. Features and benefits  
2.1 AUX MUX 2 : 1 switch  
This 2 : 1 switch is controlled by CA_DET signal multiplexing of the 1 Mbit/s  
differential AUX and DDC (Direct Display Control) signals  
When CA_DET is HIGH, DDC path is selected  
Differential AUX channel:  
Low insertion loss: 0.5 dB at 5 MHz  
Low return loss: 19 dB at 5 MHz  
Low ON-state resistance: 7.5 Ω  
Bandwidth: 5 GHz  
Low off-state isolation: 75 dB at 5 MHz  
Low crosstalk: 40 dB at 5 MHz  
Common-mode input voltage VIC: 0 V to 3.3 V  
Differential input voltage VID: 1.4 V (maximum)  
DDC channel has DDC_CLK and DDC_DAT I2C signals  
100 kHz 3.3 V voltage swing  
Both AUXIO+ and AUXIOoutputs have 900 Ω ( 20 %) pull-down resistor that is  
enabled by the status of the BIASOUT output pin  
These pull-down resistors provide DC bias for the 10 Gbit/s channel  
CBTL05023  
NXP Semiconductors  
Multiplexer/de-multiplexer switch for Thunderbolt applications  
2.2 DP MUX 2 : 1 switch  
The DP MUX is a 2:1 switch that is controlled by DP_PD pin multiplexing of a differential  
DPML signal and LSTX/LSRX signals  
The DPML (DisplayPort Main Link) runs up to HBR2 data rate of 5.4 Gbit/s  
The low speed DC coupled signals LSTX and LSRX are 3.3 V single-ended signals  
that operated at 1 Mbit/s  
5.4 Gbit/s DPML channel:  
Low insertion loss for DP-DPMLO path: 2.0 dB at 2.5 GHz  
Low insertion loss for LS-DPMLO path: 2.0 dB at 2.5 GHz  
Low return loss for DP-DPMLO path: 15 dB at 2.5 GHz  
Low return loss for LS-DPMLO path: 14 dB at 2.5 GHz  
Low ON-state resistance for DP-DPMLO path: 9 Ω  
Low ON-state resistance for LS-DPMLO path: 13 Ω  
High bandwidth: 7 GHz  
Low off-state isolation: 20 dB at 2.5 GHz  
Low crosstalk: 25 dB at 2.5 GHz  
Common-mode input voltage VIC: 0 V to 3.3 V  
Differential input voltage VID: 1.4 V (maximum)  
2.3 General  
The input of the HPDOUT (Hug Plug Detect output) buffer is 5 V tolerant  
HPDOUT, CA_DETOUT and BIASOUT buffers  
CA_DET input leakage current < 0.1 μA to prevent driving the 1 MΩ pull-down to a  
HIGH level  
BIASOUT buffer is able to provide enough current to drive the bias circuit for the  
PIN diode path  
BIASOUT buffer can drive up to six sets of bias circuits for the 10 Gbit/s paths  
When AUXIO_EN is LOW or (BIASIN = 0 and DP_PD = 1), this chip is in Sleep mode  
AUXIO+ and AUXIOof AUX MUX are disabled  
CA_DETOUT and HPDOUT buffers are on  
When the chip is in Sleep mode, CBTL05023 will consume < 3.5 mW  
Patent-pending high-bandwidth analog pass-gate technology  
Very low intra-pair differential skew (5 ps typical)  
All channels have back current protection  
All channels support rail-to-rail input voltage  
CMOS input buffer with hysteresis  
Single 3.3 V 10 % power supply  
HVQFN24 3 mm × 3 mm package, 0.4 mm pitch, with exposed center pad for thermal  
relief and electrical ground  
ESD: 2500 V HBM, 1250 V CDM  
Operating temperature range: 0 °C to 85 °C  
CBTL05023  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product brief  
Rev. 2 — 15 August 2012  
2 of 4  
CBTL05023  
NXP Semiconductors  
Multiplexer/de-multiplexer switch for Thunderbolt applications  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Name  
Description  
plastic thermal enhanced very thin quad flat package; no leads;  
24 terminals; body 3 × 3 × 0.85 mm[1]  
Version  
CBTL05023BS  
HVQFN24  
SOT905-1  
[1] Maximum package height is 1 mm.  
4. Pinning information  
4.1 Pinning  
terminal 1  
index area  
BIASIN  
AUXIO_EN  
1
2
17 HPD  
16 CA_DETOUT  
CBTL05023BS  
V
3
15 V  
DD  
DD  
DDC_DAT  
DDC_CLK  
4
5
14 LSTX  
13 LSRX  
Transparent top view  
002aag230  
Center pad is connected to printed-circuit board ground plane for electrical grounding and  
thermal relief.  
Fig 1. Pin configuration for HVQFN24  
CBTL05023  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product brief  
Rev. 2 — 15 August 2012  
3 of 4  
CBTL05023  
NXP Semiconductors  
Multiplexer/de-multiplexer switch for Thunderbolt applications  
5. Package outline  
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;  
24 terminals; body 3 x 3 x 0.85 mm  
SOT905-1  
D
B
A
terminal 1  
index area  
E
A
A
1
c
detail X  
C
e
b
1
e
y
C
1
y
M
v
C
C
A
B
1
b
M
w
6
7
11  
12  
L
13  
5
e
e
b
1
E
2
h
17  
1
LC  
terminal 1  
index area  
24  
23  
19  
18  
X
D
h
L
1
LC  
0
1.5  
scale  
3 mm  
DIMENSIONS (mm are the original dimensions)  
(1)  
A
(1)  
(1)  
UNIT  
A
b
b
c
D
D
E
E
e
e
1
e
2
L
L
LC  
v
w
y
y
1
1
1
h
h
1
max  
0.05 0.25 0.45  
0.00 0.15 0.35  
3.1  
2.9  
2.05  
1.75  
3.1  
2.9  
2.05  
1.75  
0.35  
0.15  
0.1  
0.0  
0.3  
0.2  
mm  
1
0.2  
0.4  
1.8  
1.8  
0.1  
0.05 0.05  
0.1  
Note  
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included  
REFERENCES  
OUTLINE  
VERSION  
EUROPEAN  
PROJECTION  
ISSUE DATE  
IEC  
JEDEC  
- - -  
JEITA  
06-03-13  
06-03-31  
SOT905-1  
- - -  
- - -  
Fig 2. Package outline SOT905-1 (HVQFN24)  
© NXP B.V. 2012.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 15 August 2012  
Document identifier: CBTL05023  
CBTL05023  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product brief  
Rev. 2 — 15 August 2012  
4 of 4  

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