CBTU04083 [NXP]
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 multiplexer/demultiplexer switch; 1.8伏，宽带宽，4差分通道， 2： 1复用器/解复用器开关
| 型号： | CBTU04083 |
| 厂家： | 
NXP |
| 描述： | 1.8 V, wide bandwidth, 4 differential channel, 2 : 1 multiplexer/demultiplexer switch |
| 文件： | 总14页 (文件大小：299K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CBTU04083
1.8 V, wide bandwidth, 4 differential channel,
2 : 1 multiplexer/demultiplexer switch
Rev. 1 — 16 July 2010
Product data sheet
1. General description
CBTU04083 is an 8-to-4 differential channel multiplexer/demultiplexer switch. The
CBTU04083 can switch four differential signals to one of two locations. Using a unique
design technique, NXP has minimized the impedance of the switch such that the
attenuation observed through the switch is negligible, and also minimized the
channel-to-channel skew as well as channel-to-channel crosstalk, as required by the
high-speed serial interface. CBTU04083 allows expansion of existing high speed ports for
extremely low power.
2. Features and benefits
4 differential channel, 2 : 1 multiplexer/demultiplexer
High-speed signal switching; 8.0 Gbit/s
Low intra-pair skew: 10 ps maximum (between positive and negative bits)
Low inter-pair skew: 35 ps maximum
Low crosstalk: −30 dB at 4 GHz
Low off-state isolation: −30 dB at 4 GHz
VDD operating range: 1.8 V ± 10 %
ESD tolerance:
6 kV HBM
1 kV CDM
HVQFN42 package
3. Applications
Routing of high-speed differential signals with low signal attenuation
PCIe Gen3
DisplayPort 1.2
USB 3.0
SATA 6 Gbit/s
CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
CBTU04083BS
HVQFN42
plastic thermal enhanced very thin quad flat package; no leads;
SOT1144-1
42 terminals; body 3.5 × 9 × 0.85 mm
5. Functional diagram
A0_P
A0_N
A1_P
A1_N
B0_P
B0_N
B1_P
B1_N
C0_P
C0_N
C1_P
C1_N
A2_P
A2_N
A3_P
A3_N
B2_P
B2_N
B3_P
B3_N
C2_P
C2_N
C3_P
C3_N
SEL
002aae642
Fig 1. Functional diagram of CBTU04083
CBTU04083
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 16 July 2010
2 of 14
CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
6. Pinning information
6.1 Pinning
GND
A0_P
A0_N
GND
1
2
3
4
5
6
7
8
9
38 B0_P
37 B0_N
36 B1_P
35 B1_N
34 C0_P
33 C0_N
32 C1_P
31 C1_N
V
DD
A1_P
A1_N
V
DD
SEL
CBTU04083BS 30 V
DD
GND 10
A2_P 11
A2_N 12
29 B2_P
28 B2_N
27 B3_P
26 B3_N
25 C2_P
24 C2_N
23 C3_P
22 C3_N
V
DD
13
GND 14
A3_P 15
A3_N 16
GND 17
GND
(exposed
thermal pad)
002aaf592
Transparent top view
Fig 2. Pin configuration for HVQFN42
6.2 Pin description
Table 2.
Symbol
Pin description
Pin
Type
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Description
A0_P
A0_N
A1_P
A1_N
A2_P
A2_N
A3_P
A3_N
B0_P
B0_N
B1_P
B1_N
2
channel 0, port A differential signal input/output
channel 1, port A differential signal input/output
channel 2, port A differential signal input/output
channel 3, port A differential signal input/output
channel 0, port B differential signal input/output
channel 1, port B differential signal input/output
3
6
7
11
12
15
16
38
37
36
35
CBTU04083
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 16 July 2010
3 of 14
CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
Table 2.
Pin description …continued
Symbol
B2_P
B2_N
B3_P
B3_N
C0_P
C0_N
C1_P
C1_N
C2_P
C2_N
C3_P
C3_N
SEL
Pin
29
28
27
26
34
33
32
31
25
24
23
22
9
Type
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Description
channel 2, port B differential signal input/output
channel 3, port B differential signal input/output
channel 0, port C differential signal input/output
channel 1, port C differential signal input/output
channel 2, port C differential signal input/output
channel 3, port C differential signal input/output
CMOS
operation mode select
single-ended input
SEL = LOW: A → B
SEL = HIGH: A → C
VDD
5, 8, 13, 18, 20, power
30, 40, 42
positive supply voltage, 1.8 V to 2.0 V (± 0.1 V)
GND
1, 4, 10, 14, 17, power
19, 21, 39, 41,
supply ground
center pad
7. Functional description
Refer to Figure 1 “Functional diagram of CBTU04083”.
7.1 Function selection
Table 3.
SEL
Function selection
Function
An to Bn
An to Cn
LOW
HIGH
CBTU04083
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 16 July 2010
4 of 14
CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDD
Parameter
Conditions
Min
−0.5
−40
-
Max
+2.5
+85
Unit
V
supply voltage
Tcase
case temperature
electrostatic discharge voltage
°C
V
[1]
[2]
VESD
HBM
CDM
6000
1000
-
V
[1] Human Body Model: ANSI/EOS/ESD-S5.1-1994, standard for ESD sensitivity testing, Human Body Model -
Component level; Electrostatic Discharge Association, Rome, NY, USA.
[2] Charged Device Model: ANSI/EOS/ESD-S5.3-1-1999, standard for ESD sensitivity testing, Charged Device
Model - Component level; Electrostatic Discharge Association, Rome, NY, USA.
9. Recommended operating conditions
Table 5.
Recommended operating conditions
Symbol Parameter
Conditions
Min
1.62
−0.5
−40
Typ
Max
1.98
VDD
+85
Unit
V
VDD
VI
supply voltage
1.8
input voltage
-
-
V
Tamb
ambient temperature
operating in free air
°C
10. Static characteristics
Table 6.
Static characteristics
VDD = 1.8 V ± 10 %; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
IDD
Parameter
Conditions
Min
Typ[1]
Max
Unit
mA
μA
μA
V
supply current
VDD = max.; VI = GND or VDD
VDD = max.; VI = VDD
VDD = max.; VI = GND
SEL pin
-
-
4
IIH
HIGH-level input current
LOW-level input current
HIGH-level input voltage
LOW-level input voltage
input clamping voltage
-
-
±5[2]
±5[2]
-
IIL
-
-
VIH
0.65VDD
-
VIL
SEL pin
−0.5
-
0.15VDD
−1.2
V
VIK
VDD = max.; II = −18 mA
-
−0.7
V
[1] Typical values are at VDD = 1.8 V, Tamb = 25 °C, and maximum loading.
[2] Input leakage current is ±50 μA if differential pairs are pulled to HIGH and LOW.
CBTU04083
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 16 July 2010
5 of 14
CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
11. Dynamic characteristics
Table 7.
Dynamic characteristics
VDD = 1.8 V ± 10 %; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol Parameter
Conditions
f = 4 GHz
Min
Typ[1] Max
Unit
dB
αct
crosstalk attenuation
-
-
-
-
-
-
-
-
−30
−70
−30
−60
−2.8
−0.5
4.3
-
-
-
-
-
-
-
-
f = 100 MHz
f = 4 GHz
dB
αiso(off)
off-state isolation
dB
f = 100 MHz
f = 4 GHz
dB
DDIL
differential insertion loss
dB
f = 100 MHz
dB
B−3dB
tPD
−3 dB bandwidth
GHz
ps
propagation delay
from left-side port to
80
right-side port, or vice versa
Switching characteristics
tPZH
tPZL
tPHZ
tPLZ
tsk(dif)
tsk
OFF-state to HIGH propagation delay
-
-
-
-
-
-
-
-
-
-
-
-
8.0
8.0
8.0
8.0
10
ns
ns
ns
ns
ps
ps
OFF-state to LOW propagation delay
HIGH to OFF-state propagation delay
LOW to OFF-state propagation delay
differential skew time
intra-pair
inter-pair
skew time
35
[1] Typical values are at VDD = 1.8 V; Tamb = 25 °C, and maximum loading.
V
DD
SEL
output 1
output 2
0.5V
0.5V
t
DD
DD
0 V
t
PZL
PLZ
V
V
V
V
OH
0.5V
DD
V
OL
+ 0.15 V
OL
OH
OL
t
t
PZH
PHZ
V
OH
− 0.15 V
0.5V
DD
002aae654
Output 1 is for an output with internal conditions such that the output is LOW except when disabled
by the output control.
Output 2 is for an output with internal conditions such that the output is HIGH except when disabled
by the output control.
The outputs are measured one at a time with one transition per measurement.
Fig 3. Voltage waveforms for enable and disable times
CBTU04083
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 16 July 2010
6 of 14
CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
12. Test information
2 × V
open
GND
DD
V
DD
R
200 Ω
L
V
I
V
O
PULSE
DUT
GENERATOR
R
L
200 Ω
C
50 pF
L
R
T
002aae653
CL = load capacitance; includes jig and probe capacitance.
RT = termination resistance; should be equal to Zo of the pulse generator.
All input pulses are supplied by generators having the following characteristics: PRR ≤ MHz;
Zo = 50 Ω; tr ≤ 2.5 ns; tf ≤ 2.5 ns.
Fig 4. Test circuitry for switching times
4-PORT, 20 GHz
NETWORK ANALYZER
PORT 2 PORT 3
PORT 1
PORT 4
DUT
002aae655
Fig 5. Test circuit
Table 8.
Test
Test data
Load
CL
Switch
RL
tPLZ, tPZL (output on B side)
50 pF
50 pF
50 pF
200 Ω
200 Ω
200 Ω
2 × VDD
GND
tPHZ, tPZH (output on B side)
tPD
open
CBTU04083
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 16 July 2010
7 of 14
CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
13. Package outline
HVQFN42: plastic thermal enhanced very thin quad flat package; no leads;
42 terminals; body 3.5 x 9 x 0.85 mm
SOT1144-1
D
B
A
terminal 1
index area
E
A
A
1
c
detail X
e
1
1/2 e
e
C
v
w
C A
C
B
b
L
y
1
y
C
18
21
17
22
e
E
h
e
2
1
38
terminal 1
index area
42
39
X
D
h
0
2.5
5 mm
scale
Dimensions
(1)
Unit
A
A
1
b
c
D
D
h
E
E
h
e
e
1
e
2
L
v
w
y
y
1
max 1.00 0.05 0.30
3.6 2.30 9.1 7.70
0.5
mm nom 0.85 0.02 0.25 0.2 3.5 2.05 9.0 7.55 0.5 1.5 8.0 0.4 0.1 0.05 0.05 0.1
min 0.80 0.00 0.20 3.4 1.90 8.9 7.40 0.3
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
sot1144-1_po
References
Outline
version
European
projection
Issue date
IEC
- - -
JEDEC
- - -
JEITA
- - -
09-08-26
09-08-28
SOT1144-1
Fig 6. Package outline SOT1144-1 (HVQFN42)
CBTU04083
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 16 July 2010
8 of 14
CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
CBTU04083
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 16 July 2010
9 of 14
CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 7) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 9 and 10
Table 9.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
220
< 2.5
235
220
≥ 2.5
220
Table 10. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 7.
CBTU04083
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 16 July 2010
10 of 14
CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 7. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Abbreviations
Table 11. Abbreviations
Acronym
CDM
DUT
Description
Charged-Device Model
Device Under Test
ESD
ElectroStatic Discharge
Human Body Model
HBM
I/O
Input/Output
LVDS
PCI
Low-Voltage Differential Signalling
Peripheral Component Interconnect
PCI express
PCIe
PRR
SATA
USB
Pulse Repetition Rate
Serial Advanced Technology Attachment
Universal Serial Bus
16. Revision history
Table 12. Revision history
Document ID
Release date
20100716
Data sheet status
Change notice
Supersedes
CBTU04083 v.1
Product data sheet
-
-
CBTU04083
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 16 July 2010
11 of 14
CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
17.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
17.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
CBTU04083
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 16 July 2010
12 of 14
CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
CBTU04083
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 16 July 2010
13 of 14
CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
19. Contents
1
2
3
4
5
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
7.1
8
Functional description . . . . . . . . . . . . . . . . . . . 4
Function selection. . . . . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
9
10
11
12
13
14
Soldering of SMD packages . . . . . . . . . . . . . . . 9
Introduction to soldering . . . . . . . . . . . . . . . . . . 9
Wave and reflow soldering . . . . . . . . . . . . . . . . 9
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . . 9
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 10
14.1
14.2
14.3
14.4
15
16
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11
17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
17.1
17.2
17.3
17.4
18
19
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 16 July 2010
Document identifier: CBTU04083
相关型号：
CBTU04083BS
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 multiplexer/demultiplexer switch
NXP
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