CGD1042HI,112 [NXP]

CGD1042HI - 1 GHz, 22 dB gain GaAs high output power doubler SFM 7-Pin;
CGD1042HI,112
型号: CGD1042HI,112
厂家: NXP    NXP
描述:

CGD1042HI - 1 GHz, 22 dB gain GaAs high output power doubler SFM 7-Pin

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CGD1042HI  
1 GHz, 22 dB gain GaAs high output power doubler  
Rev. 2 — 29 September 2010  
Product data sheet  
1. Product profile  
1.1 General description  
Hybrid amplifier module in a SOT115J package, operating at a supply voltage of  
24 V (DC), employing Hetero junction Field Effect Transistor (HFET) GaAs dies.  
1.2 Features and benefits  
Excellent linearity  
Superior levels of ESD protection  
Extremely low noise  
Excellent return loss properties  
Gain compensation over temperature  
Rugged construction  
Unconditionally stable  
Thermally optimized design  
Compliant with Directive 2002/95/EC, regarding Restriction of the use of certain  
Hazardous Substances (RoHS)  
Integrated ring wave surge protection  
1.3 Applications  
CATV systems operating in the 40 MHz to 1003 MHz frequency range  
1.4 Quick reference data  
Table 1.  
Quick reference data  
Bandwidth 40 MHz to 1003 MHz; VB = 24 V (DC); ZS = ZL = 75; Tmb = 35 C; unless otherwise  
specified.  
Symbol Parameter  
Conditions  
Min Typ Max Unit  
Gp  
power gain  
f = 50 MHz  
-
21.5 -  
dB  
f = 1003 MHz  
22  
-
22.7 23.5 dB  
[1]  
[1]  
[2]  
CTB  
CCN  
Itot  
composite triple beat  
Vo = 56.4 dBmV at 1003 MHz  
75 65 dBc  
carrier-to-composite noise Vo = 56.4 dBmV at 1003 MHz  
total current  
57  
-
63  
-
dBc  
440 460 mA  
[1] 79 NTSC channels [f = 54 MHz to 550 MHz] + 75 digital channels [f = 550 MHz to 1003 MHz] (6 dB offset);  
tilt extrapolated to 13.5 dB at 1003 MHz.  
[2] Direct Current (DC).  
 
 
 
 
 
 
 
CGD1042HI  
NXP Semiconductors  
1 GHz, 22 dB gain GaAs high output power doubler  
2. Pinning information  
Table 2.  
Pinning  
Pin  
1
Description  
input  
Simplified outline  
Graphic symbol  
5
2, 3  
5
common  
+VB  
1 3 5 7 9  
1
9
7, 8  
9
common  
output  
2
3
7
8
sym095  
3. Ordering information  
Table 3.  
Ordering information  
Type number  
Package  
Name Description  
Version  
CGD1042HI  
-
rectangular single-ended package; aluminium flange;  
2 vertical mounting holes; 2 6-32 UNC and 2 extra  
horizontal mounting holes; 7 gold-plated in-line leads  
SOT115J  
4. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol Parameter  
Conditions  
Min Max Unit  
VB  
supply voltage  
-
-
-
30  
V
Vi(RF)  
VESD  
RF input voltage  
single tone  
75  
dBmV  
V
[1]  
electrostatic discharge voltage Human Body Model (HBM);  
According JEDEC standard  
2000  
22-A114E  
Biased; According  
IEC61000-4-2  
-
1500  
V
Tstg  
Tmb  
storage temperature  
40 +100 C  
20 +100 C  
mounting base temperature  
[1] The ESD pulse of 2000 V corresponds to a class 2 sensitivity level.  
CGD1042HI  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 2 — 29 September 2010  
2 of 8  
 
 
 
 
CGD1042HI  
NXP Semiconductors  
1 GHz, 22 dB gain GaAs high output power doubler  
5. Characteristics  
Table 5.  
Characteristics  
Bandwidth 40 MHz to 1003 MHz; VB = 24 V (DC); ZS = ZL = 75; Tmb = 35 C; unless otherwise specified.  
Symbol Parameter  
Conditions  
Min Typ  
Max Unit  
dB  
23.5 dB  
Gp  
power gain  
f = 50 MHz  
-
21.5  
-
f = 1003 MHz  
22  
0.5  
-
22.7  
[1]  
[2]  
SLsl  
FL  
slope straight line  
f = 40 MHz to 1003 MHz  
f = 40 MHz to 1003 MHz  
f = 40 MHz to 160 MHz  
f = 160 MHz to 320 MHz  
f = 320 MHz to 640 MHz  
f = 640 MHz to 870 MHz  
f = 870 MHz to 1003 MHz  
f = 40 MHz to 160 MHz  
f = 160 MHz to 320 MHz  
f = 320 MHz to 640 MHz  
f = 640 MHz to 870 MHz  
f = 870 MHz to 1003 MHz  
f = 50 MHz  
-
2
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
flatness of frequency response  
input return loss  
-
1
RLin  
20  
20  
19  
17  
16  
20  
20  
19  
18  
17  
-
-
-
-
-
-
-
-
-
-
-
RLout  
output return loss  
-
-
-
-
-
-
-
-
-
-
NF  
Itot  
noise figure  
total current  
4.6  
5.5  
440  
5.6  
6.5  
f = 1003 MHz  
-
[3]  
-
460 mA  
79 NTSC channels + 75 digital channels  
[4]  
[4]  
[4]  
[4]  
CTB  
composite triple beat  
Vo = 56.4 dBmV at 1003 MHz  
-
75  
77  
68  
63  
65 dBc  
65 dBc  
CSO  
Xmod  
CCN  
composite second-order distortion Vo = 56.4 dBmV at 1003 MHz  
-
cross modulation  
Vo = 56.4 dBmV at 1003 MHz  
Vo = 56.4 dBmV at 1003 MHz  
-
-
-
dB  
carrier-to-composite noise  
57  
dBc  
79 NTSC channels  
[5]  
[5]  
[5]  
CTB  
composite triple beat  
Vo = 58.4 dBmV at 1003 MHz  
-
-
-
70  
75  
65  
-
-
-
dBc  
dBc  
dB  
CSO  
Xmod  
composite second-order distortion Vo = 58.4 dBmV at 1003 MHz  
cross modulation  
Vo = 58.4 dBmV at 1003 MHz  
[1] Gp at 1003 MHz minus Gp at 40 MHz.  
[2] Flatness is defined as peak deviation to straight line.  
[3] Direct Current (DC).  
[4] 79 NTSC channels [f = 54 MHz to 550 MHz] + 75 digital channels [f = 550 MHz to 1003 MHz] (6 dB offset); tilt extrapolated to 13.5 dB  
at 1003 MHz.  
[5] 79 NTSC channels [f = 54 MHz to 550 MHz]; tilt extrapolated to 13.5 dB at 1003 MHz.  
CGD1042HI  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 2 — 29 September 2010  
3 of 8  
 
 
 
 
 
 
CGD1042HI  
NXP Semiconductors  
1 GHz, 22 dB gain GaAs high output power doubler  
6. Package outline  
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;  
2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads  
SOT115J  
D
E
Z
p
A
2
1
2
3
5
7
8
9
A
L
F
S
W
e
b
M
w
x
c
e
1
d
q
y
M
B
2
U
Q
2
B
q
M
B
1
y
M
B
p
U
q
1
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
A
max.  
D
max.  
E
max.  
L
min.  
Q
max.  
Z
y
2
UNIT  
e
e
p
q
W
w
x
b
c
d
F
q
q
S
U
U
2
1
1
2
1
max.  
max.  
4.15  
3.85  
0.51  
0.38  
2.04  
2.54  
44.75 8.2 6-32  
44.25 7.8 UNC  
mm 20.8 9.5  
0.25 27.2  
13.75 2.54 5.08 12.7 8.8  
2.4 38.1 25.4 10.2 4.2  
0.25 0.7 0.1 3.8  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
JEITA  
04-02-04  
10-06-18  
SOT115J  
Fig 1. Package outline SOT115J  
CGD1042HI  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 2 — 29 September 2010  
4 of 8  
 
CGD1042HI  
NXP Semiconductors  
1 GHz, 22 dB gain GaAs high output power doubler  
7. Abbreviations  
Table 6.  
Abbreviations  
Description  
Acronym  
CATV  
DC  
Community Antenna TeleVision  
Direct Current  
ESD  
ElectroStatic Discharge  
Gallium-Arsenide  
GaAs  
NTSC  
RF  
National Television Standard Committee  
Radio Frequency  
UNC  
UNified Coarse  
8. Revision history  
Table 7.  
Revision history  
Document ID  
CGD1042HI v.2  
Modifications:  
Release date  
Data sheet status  
Change notice  
Supersedes  
20100929  
Product data sheet  
-
CGD1042HI v.1  
Package outline drawings have been updated to the latest version.  
Legal texts have been updated.  
CGD1042HI v.1  
20090921  
Product data sheet  
-
-
CGD1042HI  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 2 — 29 September 2010  
5 of 8  
 
 
CGD1042HI  
NXP Semiconductors  
1 GHz, 22 dB gain GaAs high output power doubler  
9. Legal information  
9.1  
Data sheet status  
Document status[1][2]  
Product status[3]  
Definition  
Objective [short] data sheet  
Development  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
9.2  
Definitions  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
9.3  
Disclaimers  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
CGD1042HI  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 2 — 29 September 2010  
6 of 8  
 
 
 
 
CGD1042HI  
NXP Semiconductors  
1 GHz, 22 dB gain GaAs high output power doubler  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
non-automotive qualified products in automotive equipment or applications.  
9.4  
Trademarks  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
10. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
CGD1042HI  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 2 — 29 September 2010  
7 of 8  
 
 
CGD1042HI  
NXP Semiconductors  
1 GHz, 22 dB gain GaAs high output power doubler  
11. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1  
1.2  
1.3  
1.4  
General description . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits. . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Quick reference data . . . . . . . . . . . . . . . . . . . . 1  
2
3
4
5
6
7
8
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 5  
9
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 6  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
9.1  
9.2  
9.3  
9.4  
10  
11  
Contact information. . . . . . . . . . . . . . . . . . . . . . 7  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2010.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 29 September 2010  
Document identifier: CGD1042HI  
 

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