CGD1044HI [NXP]

1 GHz, 25 dB gain GaAs high output power doubler; 1 GHz的25 dB增益砷化镓高输出功率倍增


型号：	CGD1044HI
厂家：	NXP
描述：	1 GHz, 25 dB gain GaAs high output power doubler 1 GHz的25 dB增益砷化镓高输出功率倍增射频和微波射频倍频器微波倍频器
文件：	总7页 (文件大小：52K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CGD1044HI

1 GHz, 25 dB gain GaAs high output power doubler

Rev. 01 — 21 September 2009

Product data sheet

1. Product proﬁle

1.1 General description

Hybrid ampliﬁer module in a SOT115J package, operating at a supply voltage of 24 V

Direct Current (DC), employing Hetero junction Field Effect Transistor (HFET) GaAs dies.

1.2 Features

I Excellent linearity

I Superior levels of ESD protection

I Extremely low noise

I Excellent return loss properties

I Gain compensation over temperature

I Rugged construction

I Unconditionally stable

I Thermally optimized design

I Compliant to Directive 2002/95/EC, regarding Restriction of the use of certain

Hazardous Substances (RoHS)

I Integrated ring wave surge protection

1.3 Applications

I CATV systems operating in the 40 MHz to 1003 MHz frequency range

1.4 Quick reference data

Table 1.

Quick reference data

Bandwidth 40 MHz to 1003 MHz; V_B= 24 V (DC); Z_S= Z_L= 75 Ω; T_mb= 35 °C; unless otherwise

speciﬁed.

Symbol Parameter

Conditions

Min Typ Max Unit

23.2 - dB

23.5 24.4 25.5 dB

G_p

power gain

f = 50 MHz

f = 1003 MHz

[1]

[2]

CTB

CCN

I_tot

composite triple beat

V_o= 56.4 dBmV at 1003 MHz

−75 −69 dBc

63 dBc

440 460 mA

carrier-to-composite noise V_o= 56.4 dBmV at 1003 MHz

total current

[1] 79 NTSC channels [f = 54 MHz to 550 MHz] + 75 digital channels [f = 550 MHz to 1003 MHz] (−6 dB offset);

tilt extrapolated to 13.5 dB at 1003 MHz.

[2] Direct Current (DC).

CGD1044HI

NXP Semiconductors

1 GHz, 25 dB gain GaAs high output power doubler

2. Pinning information

Table 2.

Pinning

Description

input

Simpliﬁed outline

Graphic symbol

2, 3

common

+V_B

1 3 5 7 9

7, 8

common

output

sym095

3. Ordering information

Table 3.

Ordering information

Type number

Package

Name Description

Version

CGD1044HI

rectangular single-ended package; aluminium ﬂange;

2 vertical mounting holes; 2 × 6-32 UNC and 2 extra

horizontal mounting holes; 7 gold-plated in-line leads

SOT115J

4. Limiting values

Table 4.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter

Conditions

Min Max Unit

V_B

supply voltage

V_i(RF)

V_ESD

RF input voltage

single tone

dBmV

[1]

electrostatic discharge voltage Human Body Model (HBM);

According JEDEC standard

2000

22-A114E

Biased; According

IEC61000-4-2

1500

T_stg

T_mb

storage temperature

−40 +100 °C

−20 +100 °C

mounting base temperature

[1] The ESD pulse of 2000 V corresponds to a class 2 sensitivity level.

CGD1044HI_1

Product data sheet

Rev. 01 — 21 September 2009

2 of 7

CGD1044HI

NXP Semiconductors

1 GHz, 25 dB gain GaAs high output power doubler

5. Characteristics

Table 5.

Characteristics

Bandwidth 40 MHz to 1003 MHz; V_B= 24 V (DC); Z_S= Z_L= 75 Ω; T_mb= 35 °C; unless otherwise speciﬁed.

Symbol Parameter

Conditions

Min Typ

23.2

23.5 24.4

Max Unit

25.5 dB

G_p

power gain

f = 50 MHz

f = 1003 MHz

[1]

[2]

SL_sl

slope straight line

f = 40 MHz to 1003 MHz

f = 40 MHz to 160 MHz

f = 160 MHz to 320 MHz

f = 320 MHz to 640 MHz

f = 640 MHz to 870 MHz

f = 870 MHz to 1003 MHz

f = 40 MHz to 160 MHz

f = 160 MHz to 320 MHz

f = 320 MHz to 640 MHz

f = 640 MHz to 870 MHz

f = 870 MHz to 1003 MHz

f = 50 MHz

0.5

ﬂatness of frequency response

input return loss

RL_in

RL_out

output return loss

I_tot

noise ﬁgure

total current

4.5

5.5

f = 1003 MHz

[3]

440

460 mA

79 NTSC channels + 75 digital channels

[4]

CTB

composite triple beat

V_o= 56.4 dBmV at 1003 MHz

−75

−77

−68

−69 dBc

−65 dBc

CSO

Xmod

CCN

composite second-order distortion V_o= 56.4 dBmV at 1003 MHz

cross modulation

V_o= 56.4 dBmV at 1003 MHz

carrier-to-composite noise

dBc

79 NTSC channels

[5]

CTB

composite triple beat

V_o= 58.4 dBmV at 1003 MHz

−70

−75

−64

dBc

CSO

Xmod

composite second-order distortion V_o= 58.4 dBmV at 1003 MHz

cross modulation

V_o= 58.4 dBmV at 1003 MHz

[1] G_pat 1003 MHz minus G_pat 40 MHz.

[2] Flatness is deﬁned as peak deviation to straight line.

[3] Direct Current (DC).

[4] 79 NTSC channels [f = 54 MHz to 550 MHz] + 75 digital channels [f = 550 MHz to 1003 MHz] (−6 dB offset); tilt extrapolated to 13.5 dB

at 1003 MHz.

[5] 79 NTSC channels [f = 54 MHz to 550 MHz]; tilt extrapolated to 13.5 dB at 1003 MHz.

CGD1044HI_1

Product data sheet

Rev. 01 — 21 September 2009

3 of 7

CGD1044HI

NXP Semiconductors

1 GHz, 25 dB gain GaAs high output power doubler

6. Package outline

Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;

2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads

SOT115J

10 mm

scale

DIMENSIONS (mm are the original dimensions)

max.

min.

max.

UNIT

max.

4.15

3.85

0.51

0.38

44.75 8.2 6-32

44.25 7.8 UNC

mm 20.8 9.1

0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8

2.4 38.1 25.4 10.2 4.2

0.25 0.7 0.1 3.8

REFERENCES

EUROPEAN

PROJECTION

OUTLINE

VERSION

ISSUE DATE

IEC

JEDEC

JEITA

99-02-06

04-02-04

SOT115J

Fig 1. Package outline SOT115J

CGD1044HI_1

Product data sheet

Rev. 01 — 21 September 2009

4 of 7

CGD1044HI

NXP Semiconductors

1 GHz, 25 dB gain GaAs high output power doubler

7. Abbreviations

Table 6.

Abbreviations

Description

Acronym

CATV

ESD

Community Antenna TeleVision

ElectroStatic Discharge

Gallium-Arsenide

GaAs

NTSC

National Television Standard Committee

Radio Frequency

UNC

UNiﬁed Coarse

8. Revision history

Table 7.

Revision history

Document ID

Release date

Data sheet status

Change notice

Supersedes

CGD1044HI_1

20090921

Product data sheet

CGD1044HI_1

Product data sheet

Rev. 01 — 21 September 2009

5 of 7

CGD1044HI

NXP Semiconductors

1 GHz, 25 dB gain GaAs high output power doubler

9. Legal information

9.1

Data sheet status

Document status^[1][2]

Product status^[3]

Deﬁnition

Objective [short] data sheet

Development

This document contains data from the objective speciﬁcation for product development.

This document contains data from the preliminary speciﬁcation.

This document contains the product speciﬁcation.

Preliminary [short] data sheet Qualiﬁcation

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Deﬁnitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

9.2

Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

9.3

Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

9.4

Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

10. Contact information

For more information, please visit: http://www.nxp.com

For sales ofﬁce addresses, please send an email to: salesaddresses@nxp.com

CGD1044HI_1

Product data sheet

Rev. 01 — 21 September 2009

6 of 7

CGD1044HI

NXP Semiconductors

1 GHz, 25 dB gain GaAs high output power doubler

11. Contents

Product proﬁle . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1

1.2

1.3

1.4

General description. . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data. . . . . . . . . . . . . . . . . . . . . 1

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 5

Legal information. . . . . . . . . . . . . . . . . . . . . . . . 6

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6

Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

9.1

9.2

9.3

9.4

Contact information. . . . . . . . . . . . . . . . . . . . . . 6

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 21 September 2009

Document identifier: CGD1044HI_1

CGD1044HI [NXP]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E