FXPQ3115BVT1_技术文档

FXPQ3115BV

I²C precision pressure sensor with altimetry

Rev. 1 — 9 October 2017

Short data sheet: technical data

1 General description

The FXPQ3115BV is a compact, piezoresistive, absolute pressure sensor with an I²C

digital interface. FXPQ3115BV has a wide operating range of 20 kPa to 110 kPa. This

sensor is ideal for inhalers, continuous positive airway pressure (CPAP) masks or

other medical devices coming in contact with a patient's airway. The MEMS and ASIC

die are coated with a biomedically-approved gel. The gel is a nontoxic, nonallergenic

elastomer which meets all United States Pharmacopeia (USP) biological testing class

VI requirements. The gel properties allow uniform pressure transmission to the MEMS

diaphragm.

A high resolution ADC provides fully compensated and digitized outputs for pressure in

Pascals and temperature in °C. The compensated output is available as either barometric

pressure in Pascals or as an altitude in meters. The internal processing in FXPQ3115BV

removes compensation and unit conversion load from the system MCU, simplifying

system design.

FXPQ3115BV's advanced ASIC has multiple user programmable modes such as power

saving, interrupt and autonomous data acquisition modes, including programmed

acquisition cycle timing, and poll-only modes. Typical active supply current is 40 μA per

measurement-second.

2 Features and benefits

• Operating range: 20 kPa to 110 kPa absolute pressure

• Calibrated range: 50 kPa to 110 kPa absolute pressure

• Calibrated temperature output: −40 °C to 85 °C

• I²C digital output interface

• Fully compensated internally

• Precision ADC resulting in 1.5 Pa of effective resolution

• Direct reading

• Programmable interrupts

• Autonomous data acquisition

– Embedded 32-sample FIFO

– Data logging up to 12 days using the FIFO

– One-second to nine-hour data acquisition rate

• 1.95 V to 3.6 V supply voltage, internally regulated

• 1.6 V to 3.6 V digital interface supply voltage

• Operating temperature from −40 °C to +85 °C

– Pressure: 20-bit measurement (Pascals)

–

20 to 110 kPa

– Temperature: 12-bit measurement (°C)

–40 °C to 85 °C

–

NXP Semiconductors

FXPQ3115BV

I²C precision pressure sensor with altimetry

3 Applications

• Inhalers/nebulizers

• Medical tablets

• Health activity monitors

• Oxygen concentrators

• CPAP machine and mask

• Spyrometry

4 Ordering information

Table 1.ꢀOrdering information

Device number Shipping

Package

Number of ports

Pressure Type

Digital

interface

None Single Dual Gauge Differential Absolute

FXPQ3115BV

Tray

98ASA002260D

●

—

●

FXPQ3115BVT1 Tape and reel 98ASA002260D

5 Block diagram

Figure 1.ꢀBlock diagram

FXPQ3115BVSDS

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Short data sheet: technical data

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FXPQ3115BV

I²C precision pressure sensor with altimetry

6 Pinning information

6.1 Pinning

FXPQ3115BV

V_DD

1

2

3

4

8

7

6

5

SCL

SDL

CAP

GND

V_DDIO

INT1

INT2

Transparent top view

Figure 2.ꢀ8-pin LGA pinout

6.2 Pin description

Table 2.ꢀPin description

Symbol

V_DD

1

Description

V_DDpower supply connection (1.95 to 3.6 V)

External capacitor

CAP

2

GND

V_DDIO

INT2

INT1

SDL

3

Ground

4

Digital interface power supply (1.62 to 3.6 V)

Pressure interrupt 2

5

6

Pressure interrupt 1

7

I²C serial data

SCL

8

I²C serial clock

7 Handling and board mount recommendations

The sensor die is sensitive to light exposure. Direct light exposure through the port hole

can lead to varied accuracy of pressure measurement. Avoid such exposure to the port

during normal operation.

7.1 Methods of handling

Components can be picked from the carrier tape using either the vacuum assist or the

mechanical type pickup heads. A vacuum assist nozzle type is most common due to its

lower cost of maintenance and ease of operation. The recommended vacuum nozzle

configuration should be designed to make contact with the device directly on the metal

cover and avoid vacuum port location directly over the vent hole in the metal cover of the

FXPQ3115BVSDS

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Short data sheet: technical data

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FXPQ3115BV

I²C precision pressure sensor with altimetry

device. Multiple vacuum ports within the nozzle may be required to effectively handle the

device and prevent shifting during movement to placement position.

Vacuum pressure required to adequately support the component should be

approximately 25 in Hg (85kPa). This level is typical of in-house vacuum supply.

Pickup nozzles are available in various sizes and configurations to suit a variety of

component geometries. To select the nozzle best suited for the specific application, it

is recommended that the customer consult their pick and place equipment supplier to

determine the correct nozzle. In some cases it may be necessary to fabricate a special

nozzle depending on the equipment and speed of operation.

Tweezers or other mechanical forms of handling that have a sharp point are not

recommended since they can inadvertently be inserted into the vent hole of the device.

This can lead to a puncture of the MEMS element that will render the device inoperable.

7.2 Board mount recommendations

Components can be mounted using solder paste stencil, screen printed or dispensed

onto the PCB pads prior to placement of the component. The volume of solder paste

applied to the PCB is normally sufficient to secure the component during transport to the

subsequent reflow soldering process. Use of adhesives to secure the component is not

recommended, but where necessary can be applied to the underside of the device.

Solder pastes are available in variety of metal compositions, particle size and flux types.

The solder paste consists of metals and flux required for a reliable connection between

the component lead and the PCB pad. Flux aids the removal of oxides that may be

present on PCB pads and prevents further oxidation from occurring during the solder

process.

The use of a No-Clean (NC) flux is recommended for exposed cavity components.

Using pressure spray, wire brush, or other methods of cleaning is not recommended

since it can puncture the MEMS device and render it unusable. If cleaning of the pcb

is performed Water Soluble (WS) flux can be used. However, it is recommended the

component cavity is protected by adhesive Kapton tape, vinyl cap or other means

prior to the cleaning process. This covering will prevent damage to the MEMS device,

contamination, and foreign materials from being introduced into device cavity as result of

cleaning processes.

Ultrasonic cleaning is not recommended as the frequencies can damage wire bond

interconnections and the MEMS device.

8 Mechanical and electrical specifications

8.1 Absolute maximum ratings

Absolute maximum ratings are the limits the device can be exposed to without

permanently damaging it. Absolute maximum ratings are stress ratings only, functional

operation at these ratings is not guaranteed. Exposure to absolute maximum ratings

conditions for extended periods may affect device reliability.

This device contains circuitry to protect against damage due to high static voltage

or electrical fields. It is advised, however, that normal precautions be taken to avoid

application of any voltages higher than maximum-rated voltages to this high-impedance

circuit.

FXPQ3115BVSDS

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FXPQ3115BV

I²C precision pressure sensor with altimetry

Table 3.ꢀMaximum ratings

Symbol

P_max

V_DD

Characteristic

Value

500

Unit

kPa

V

Maximum applied pressure

Supply voltage

−0.3 to 3.6

−0.3 to V_DDIO+ 0.3

−40 to +85

−40 to +125

V_DDIO

V_IN

Interface supply voltage

V

Input voltage on any control pin (SCL, SDA)

Operating temperature range

Storage temperature range

V

T_OP

°C

T_STG

Table 4.ꢀESD and latchup protection characteristics

Symbol

HBM

CDM

—

Rating

Value

±2000

±500

Unit

V

Human body model

Charge device model

V

Latchup current at T = 85 °C

±100

mA

Caution

This device is sensitive to mechanical shock. Improper handling can cause permanent damage to the part or

cause the part to otherwise fail.

Caution

This is an ESD sensitive device. Improper handling can cause permanent damage to the part.

msc896

FXPQ3115BVSDS

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Short data sheet: technical data

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FXPQ3115BV

I²C precision pressure sensor with altimetry

8.2 Mechanical characteristics

Table 5.ꢀMechanical characteristics

V_DD= 2.5 V, T = 25 °C, over 50 kPa to 110 kPa, unless otherwise noted.

Symbol

Parameter

Test conditions

Min

Typ

Max

Unit

Pressure sensor

P_FSMeasurement range

Calibrated range

50

20

––

19

1.5

––

110

––

kPa

Operational range

1x oversample

Pressure reading noise ^[1]

––

Pa RMS

kPa

128x oversample

––

Pressure absolute accuracy 50 to 110 kPa over 0 °C to

50 °C

–0.75

0.75

50 to 110 kPa over −10 °C to

70 °C

––

±0.75

±0.05

––

kPa

Pressure relative accuracy

Relative accuracy during

pressure change between 70

to 110 kPa at any constant

temperature between −10 °C

to 50 °C

Relative accuracy during

changing temperature

––

±0.1

––

kPa

between −10 °C to 50 °C

at any constant pressure

between 50 kPa to 110 kPa

Pressure/altitude resolution Barometer mode

0.25

0.0625

––

1.5

0.3

––

Pa

m

[2][3][4]

Altimeter mode

Output data rate

One-shot mode

FIFO mode

100

––

Hz

––

1

Hz

Board mount drift

Long term drift

After solder reflow

After a period of 1 year

–0.45

–0.3

±0.15

±0.1

0.45

0.3

kPa

Temperature sensor

T_FSMeasurement range

––

–40

––

±1

±3

––

+85

––

°C

Temperature accuracy

@25 °C

Over temperature range

––

T_OP

Operating temperature

range

–40

+85

[1] Oversample (OSR) modes internally combine and average samples to reduce noise.

[2] Smallest bit change in register represents minimum value change in Pascals or meters. Typical resolution to signify change in altitude is 0.3 m.

[3] Reference pressure = 101.325 kPa (sea level).

[4] At 128x oversample ratio.

FXPQ3115BVSDS

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FXPQ3115BV

I²C precision pressure sensor with altimetry

8.3 Electrical characteristics

Table 6.ꢀElectrical characteristics

@ V_DD= 2.5 V, T = 25 °C unless otherwise noted.

Symbol

V_DDIO

V_DD

Parameter

Test conditions

Min

1.62

1.95

—

Typ

1.8

Max

3.6

—

Unit

V

I/O supply voltage

Operating supply voltage

—

2.5

V

I_DD

Integrated current 1 update

per second

Highest speed mode

oversample = 1

8.5

µA

Standard mode oversample

= 16

—

40

265

2

—

µA

High resolution mode

oversample = 128

I_DDMAX

I_DDSTBY

VIH

Max current during

acquisition and conversion

During acquisition/

conversion

—

mA

Supply current drain in

STANDBY mode

STANDBY mode selected

SBYB = 0

—

2

µA

Digital high level input

voltage

—

0.75

—

V_DDIO

SCL, SDA

VIL

Digital low level input voltage —

SCL, SDA

—

0.9

—

0.3

—

V_DDIO

VOH

VOL

VOLS

T_ON

High level output voltage

INT1, INT2

I_O= 500 µA

Low level output voltage

INT1, INT2

I_O= 500 µA

0.1

Low level output voltage

SDA

—

Turn-on time ^[1][2][3]

High speed mode

—

25

60

ms

°C

High resolution mode

1000

+85

T_OP

Operating temperature range —

−40

I²C addressing

I²C Address

—

0x60

Hex

The device uses 7-bit addressing and does not acknowledge general call address 000 0000. Slave address has been set

to 60h or 110 0000. 8-bit read is C1h, 8-bit write is C0h.

[1] Time to obtain valid data from STANDBY mode to ACTIVE mode

[2] High speed mode is achieved by setting the oversample rate of 1x.

[3] High resolution mode is achieved by setting the oversample to 128x.

FXPQ3115BVSDS

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Short data sheet: technical data

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FXPQ3115BV

I²C precision pressure sensor with altimetry

9 Package information

9.1 Package dimensions

This drawing is located at http://nxp.com/files/shared/doc/

package_info/98ASA00260D.pdf.

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FXPQ3115BV

I²C precision pressure sensor with altimetry

Figure 3.ꢀCase 98ASA00260D, LGA package

10 Soldering/landing pad information

The LGA package is compliant with the RoHS standard.

Note: Pin 1 index area marker does not have any internal electrical connections.

Handling and soldering recommendations for pressure sensors are available in

application notes AN1984 and AN3150.

FXPQ3115BVSDS

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FXPQ3115BV

I²C precision pressure sensor with altimetry

Figure 4.ꢀRecommended PCB landing pattern

FXPQ3115BVSDS

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FXPQ3115BV

I²C precision pressure sensor with altimetry

11 Tape and reel specifications

(I) Measured from centerline of sprocket hole to

centerline of pocket.

(II) Cumulative tolerance of 10 sprocket holes is

±0.20.

(III) Measured from centerline of sprocket hole to

centerline of pocket.

(IV) Other material available.

Dimensions are in millimeters.

Ao

Bo

Ko

F

3.35 ± 0.10

5.35 ± 0.10

1.20 ± 0.10

5.50 ± 0.10

8.00 ± 0.10

12.00 ± 0.10

P1

W

Figure 5.ꢀLGA 3 mm ✕ 5 mm embossed carrier tape dimensions

Pin 1 Index Area

Figure 6.ꢀDevice orientation in chip carrier

12 Revision history

Table 7.ꢀRevision history

Document ID

Release date

Data sheet status

Change notice

Supercedes

FXPQ3115BVSDS v.1 20171009

Technical data

n.a.

FXPQ3115BVSDS

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FXPQ3115BV

I²C precision pressure sensor with altimetry

13 Legal information

13.1 Data sheet status

Document status^[1][2]

Product status^[3]

Definition

[short] Data sheet: product preview

Development

This document contains certain information on a product under development.

NXP reserves the right to change or discontinue this product without notice.

[short] Data sheet: advance information

[short] Data sheet: technical data

Qualification

Production

This document contains information on a new product. Specifications and

information herein are subject to change without notice.

This document contains the product specification. NXP Semiconductors

reserves the right to change the detail specifications as may be required to

permit improvements in the design of its products.

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple

devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

13.2 Definitions

to the publication hereof.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

modifications or additions. NXP Semiconductors does not give any

safety-critical systems or equipment, nor in applications where failure or

representations or warranties as to the accuracy or completeness of

malfunction of an NXP Semiconductors product can reasonably be expected

information included herein and shall have no liability for the consequences

to result in personal injury, death or severe property or environmental

of use of such information.

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

Short data sheet — A short data sheet is an extract from a full data sheet

applications and therefore such inclusion and/or use is at the customer’s own

with the same product type number(s) and title. A short data sheet is

risk.

intended for quick reference only and should not be relied upon to contain

detailed and full information. For detailed and full information see the

relevant full data sheet, which is available on request via the local NXP

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes

Semiconductors sales office. In case of any inconsistency or conflict with the

no representation or warranty that such applications will be suitable

short data sheet, the full data sheet shall prevail.

for the specified use without further testing or modification. Customers

are responsible for the design and operation of their applications and

Product specification — The information and data provided in a

products using NXP Semiconductors products, and NXP Semiconductors

technical data data sheet shall define the specification of the product as

accepts no liability for any assistance with applications or customer product

agreed between NXP Semiconductors and its customer, unless NXP

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors and customer have explicitly agreed otherwise in writing.

Semiconductors product is suitable and fit for the customer’s applications

In no event however, shall an agreement be valid in which the NXP

and products planned, as well as for the planned application and use of

Semiconductors product is deemed to offer functions and qualities beyond

customer’s third party customer(s). Customers should provide appropriate

those described in the technical data data sheet.

design and operating safeguards to minimize the risks associated with

their applications and products. NXP Semiconductors does not accept any

liability related to any default, damage, costs or problem which is based

on any weakness or default in the customer’s applications or products, or

the application or use by customer’s third party customer(s). Customer is

responsible for doing all necessary testing for the customer’s applications

13.3 Disclaimers

Limited warranty and liability — Information in this document is believed

and products using NXP Semiconductors products in order to avoid a

to be accurate and reliable. However, NXP Semiconductors does not

default of the applications and the products or of the application or use by

give any representations or warranties, expressed or implied, as to the

customer’s third party customer(s). NXP does not accept any liability in this

accuracy or completeness of such information and shall have no liability

respect.

for the consequences of use of such information. NXP Semiconductors

takes no responsibility for the content in this document if provided by an

information source outside of NXP Semiconductors. In no event shall NXP

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

Semiconductors be liable for any indirect, incidental, punitive, special or

damage to the device. Limiting values are stress ratings only and (proper)

consequential damages (including - without limitation - lost profits, lost

operation of the device at these or any other conditions above those

savings, business interruption, costs related to the removal or replacement

given in the Recommended operating conditions section (if present) or the

of any products or rework charges) whether or not such damages are based

Characteristics sections of this document is not warranted. Constant or

on tort (including negligence), warranty, breach of contract or any other

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

legal theory. Notwithstanding any damages that customer might incur for

any reason whatsoever, NXP Semiconductors’ aggregate and cumulative

liability towards customer for the products described herein shall be limited

in accordance with the Terms and conditions of commercial sale of NXP

Semiconductors.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

Right to make changes — NXP Semiconductors reserves the right to

make changes to information published in this document, including without

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FXPQ3115BV

I²C precision pressure sensor with altimetry

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

use the product without NXP Semiconductors’ warranty of the product for

such automotive applications, use and specifications, and (b) whenever

customer uses the product for automotive applications beyond NXP

Semiconductors’ specifications such use shall be solely at customer’s own

risk, and (c) customer fully indemnifies NXP Semiconductors for any liability,

damages or failed product claims resulting from customer design and use

of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or

the grant, conveyance or implication of any license under any copyrights,

patents or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor

tested in accordance with automotive testing or application requirements.

NXP Semiconductors accepts no liability for inclusion and/or use of non-

automotive qualified products in automotive equipment or applications. In

the event that customer uses the product for design-in and use in automotive

applications to automotive specifications and standards, customer (a) shall

13.4 Trademarks

Notice: All referenced brands, product names, service names and

trademarks are the property of their respective owners.

NXP — is a trademark of NXP B.V.

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FXPQ3115BV

I²C precision pressure sensor with altimetry

Contents

1

General description ............................................ 1

2

3

4

5

Features and benefits .........................................1

Applications .........................................................2

Ordering information .......................................... 2

Block diagram ..................................................... 2

Pinning information ............................................ 3

Pinning ...............................................................3

Pin description ...................................................3

6

6.1

6.2

7

Handling

and

board

mount

recommendations ............................................... 3

Methods of handling ..........................................3

Board mount recommendations .........................4

Mechanical and electrical specifications .......... 4

Absolute maximum ratings ................................ 4

Mechanical characteristics .................................6

Electrical characteristics .................................... 7

Package information ...........................................8

Package dimensions ..........................................8

Soldering/landing pad information ....................9

Tape and reel specifications ............................11

Revision history ................................................ 11

Legal information ..............................................12

7.1

7.2

8

8.1

8.2

8.3

9

9.1

10

11

12

13

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section 'Legal information'.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 9 October 2017

Document identifier: FXPQ3115BVSDS


型号：	FXPQ3115BVT1
厂家：	NXP
描述：	I2C precision pressure sensor with altimetry
文件：	总14页 (文件大小：523K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

FXPQ3115BVT1 [NXP]

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