GTL2014PW_技术文档

GTL2014

4-bit LVTTL to GTL transceiver

Rev. 01 — 19 May 2005

Product data sheet

1. General description

The GTL2014 is a 4-bit translating transceiver designed for 3.3 V LVTTL system interface

with a GTL−/GTL/GTL+ bus.

The direction pin allows the part to function as either a GTL to LVTTL sampling receiver or

as a LVTTL to GTL interface.

The GTL2014 LVTTL inputs (only) are tolerant up to 5.5 V allowing direct access to TTL or

5 V CMOS inputs. The LVTTL outputs are not 5.5 V tolerant.

The GTL2014 GTL inputs and outputs operate up to 3.6 V, allowing the device to be used

in higher voltage open-drain output applications.

2. Features

■ Operates as a 4-bit GTL−/GTL/GTL+ sampling receiver or as a LVTTL to

GTL−/GTL/GTL+ driver

■ 3.0 V to 3.6 V operation with 5 V tolerant LVTTL input

■ GTL input and output 3.6 V tolerant

■ V_refadjustable from 0.5 V to V_CC/2

■ Partial power-down permitted

■ ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per

JESD22-A115, and 1000 V CDM per JESD22-CC101

■ Latch-up protection exceeds 500 mA per JESD78

■ Package offered: TSSOP14

3. Quick reference data

Table 1:

Quick reference data

T_amb= 25 °C

Symbol

t_PLH

Parameter

Conditions

Min

Typ

2.8

3.4

5.2

4.9

2

Max

Unit

ns

propagation delay; An-to-Bn

C_L= 50 pF; V_CC= 3.3 V

-

t_PHL

-

ns

t_PLH

propagation delay; Bn-to-An

C_L= 50 pF; V_CC= 3.3 V

V_I= 0 V or V_CC

-

ns

t_PHL

-

ns

C_i

input capacitance on pin DIR;

A-to-B or B-to-A

2.5

pF

C_io

input/output capacitance; A-to-B

input/output capacitance; B-to-A

outputs disabled;

V_Iand V_O= 0 V or 3.0 V

-

4.6

3.4

6.0

4.3

pF

GTL2014

Philips Semiconductors

4-bit LVTTL to GTL transceiver

4. Ordering information

Table 2:

Ordering information

Type number

Package

Name

Description

Version

GTL2014PW

TSSOP14

plastic thin shrink small outline package; 14 leads;

body width 4.4 mm

SOT402-1

Standard packing quantities and other packaging data are available at

www.standardics.philips.com/packaging.

4.1 Ordering options

Table 3:

Ordering options

Type number

Topside mark

Temperature range

GTL2014PW

GTL2014

T_amb= −40 °C to +85 °C

5. Functional diagram

GTL2014

B0

B1

B2

B3

A0

A1

A2

A3

002aab139

VREF

DIR

Fig 1. Logic diagram for GTL2014

9397 750 13534

Product data sheet

Rev. 01 — 19 May 2005

2 of 15

GTL2014

Philips Semiconductors

4-bit LVTTL to GTL transceiver

6. Pinning information

6.1 Pinning

1

2

3

4

5

6

7

14

13

12

11

10

9

DIR

B0

V

CC

A0

B1

A1

VREF

B2

GTL2014PW

GND

A2

B3

A3

GND

8

GND

002aab138

Fig 2. Pin conﬁguration for TSSOP14

6.2 Pin description

Table 4:

Pin description

Symbol

DIR

B0

Description

1

direction control input (LVTTL)

data inputs/outputs (GTL)

2

B1

3

B2

5

B3

6

A0

13

data inputs/outputs (LVTTL)

A1

12

A2

10

A3

9

VREF

GND

V_CC

4

GTL reference voltage

ground (0 V)

7, 8, 11

14

positive supply voltage

7. Functional description

Refer to Figure 1 “Logic diagram for GTL2014” on page 2.

7.1 Function table

Table 5:

Function table

H = HIGH voltage level; L = LOW voltage level.

Input

DIR

H

Input/output

A (LVTTL)

input

B (GTL)

Bn = An

input

L

An = Bn

9397 750 13534

Product data sheet

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GTL2014

Philips Semiconductors

4-bit LVTTL to GTL transceiver

8. Limiting values

Table 6:

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). ^[1]

Voltages are referenced to GND (ground = 0 V).

Symbol

V_CC

I_IK

Parameter

Conditions

Min

−0.5

-

−0.5^[2]

−0.5 ^[2]

-

Max

+4.6

−50

Unit

V

DC supply voltage

input clamping diode current

DC input voltage

V_I< 0 V

A port

B port

mA

V

V_I

+7.0

+4.6

−50

V

I_OK

V_O

output diode clamping current A port; V_O< 0 V

mA

V

DC output voltage

output in OFF or

−0.5^[2]

+7.0

HIGH state; A port

output in OFF or

−0.5 ^[2]

+4.6

V

HIGH state; B port

I_OL

current into any output in

the LOW state

A port

B port

A port

-

32

mA

80

I_OH

current into any output in

the HIGH state

−32

[3]

T_stg

storage temperature range

−60

+150

°C

[1] Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only

and functional operation of the device at these or any other conditions beyond those indicated under

Section 9 “Recommended operating conditions” is not implied. Exposure to absolute-maximum-rated

conditions for extended periods may affect device reliability.

[2] The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings

are observed.

[3] The performance capability of a high-performance integrated circuit in conjunction with its thermal

environment can create junction temperatures which are detrimental to reliability. The maximum junction

temperature of this integrated circuit should not exceed 150 °C.

9397 750 13534

Product data sheet

Rev. 01 — 19 May 2005

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GTL2014

Philips Semiconductors

4-bit LVTTL to GTL transceiver

9. Recommended operating conditions

[1]

Table 7:

Operating conditions

Symbol Parameter

Conditions

Min

Typ

-

Max

3.6

Unit

V

V_CC

V_TT

supply voltage

3.0

termination

voltage^[2]

GTL−

GTL

0.85

0.9

1.2

1.5

0.95

1.26

1.65

V

1.14

V

GTL+

1.35

V

V_ref

reference voltage overall

0.5

²⁄₃V_TTV_CC/2

V

GTL−

GTL

0.5

0.6

0.8

1.0

V_TT

3.3

-

0.63

0.84

1.10

3.6

5.5^[3]

-

V

0.76

V

GTL+

0.87

V

V_I

input voltage

B port

0

V

except B port

B port

0

V

V_IH

V_IL

HIGH-level input

voltage

V_ref+ 0.050

V

except B port

B port

2

-

V

LOW-level input

voltage

-

V

_ref− 0.050

V

except B port

-

0.8

−16

V

I_OH

I_OL

HIGH-level output A port

current

-

mA

LOW-level output B port

current

-

40

mA

°C

A port

-

16

T_amb

operating ambient in free-air

temperature

−40

+85

[1] Unused inputs must be held HIGH or LOW to prevent them from ﬂoating.

[2] V_TTmaximum of 3.6 V with resistor sized so I_OLmaximum is not exceeded.

[3] A0, A1, A2, A3 V_I(max)is 3.6 V if conﬁgured as outputs (DIR = L).

9397 750 13534

Product data sheet

Rev. 01 — 19 May 2005

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GTL2014

Philips Semiconductors

4-bit LVTTL to GTL transceiver

10. Static characteristics

Table 8:

Static characteristics

Recommended operating conditions; voltages are referenced to GND (ground = 0 V). T_amb= −40 °C to +85 °C

Symbol Parameter

V_OHHIGH-level output

Conditions

Min

Typ ^[1]

-

Max

-

Unit

V

[2]

A port; V_CC= 3.0 V to 3.6 V; I_OH= −100 µA

A port; V_CC= 3.0 V; I_OH= −16 mA

B port; V_CC= 3.0 V; I_OL= 40 mA

A port; V_CC= 3.0 V; I_OL= 8 mA

A port; V_CC= 3.0 V; I_OL= 12 mA

A port; V_CC= 3.0 V; I_OL= 16 mA

V_CC− 0.2

voltage

2.0

-

V

V_OL

LOW-level output

voltage

-

0.23

0.28

0.40

0.55

-

0.4

0.55

0.8

±1

V

I_I

input current

control inputs; V_CC= 3.6 V;

V_I= V_CCor GND

µA

B port; V_CC= 3.6 V; V_I= V_TTor GND

A port; V_CC= 0 V or 3.6 V; V_I= 5.5 V

A port; V_CC= 3.6 V; V_I= V_CC

-

±1

µA

10

±1

A port; V_CC= 3.6 V; V_I= 0 V

−5

I_OZ

I_CC

off-state output

current

A port; V_CC= 0 V; V_Ior V_O= 0 V to 3.6 V

±100

quiescent supply

current

A port; V_CC= 3.6 V; V_I= V_CCor GND;

I_O= 0 mA

-

4

-

10

mA

µA

B port; V_CC= 3.6 V; V_I= V_TTor GND;

I_O= 0 mA

10

[3]

∆I_CC

additional quiescent

current (per input)

A port or control inputs; V_CC= 3.6 V;

V_I= V_CC− 0.6 V

500

C_i

input capacitance

control inputs; V_I= 3.0 V or 0 V

A port; V_O= 3.0 V or 0 V

B port; V_O= V_TTor 0 V

-

2

2.5

6

pF

C_io

input/output

capacitance

4.6

3.4

4.3

[1] All typical values are measured at V_CC= 3.3 V and T_amb= 25 °C.

[2] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

[3] This is the increase in supply current for each input that is at the speciﬁed TTL voltage level rather than V_CCor GND.

9397 750 13534

Product data sheet

Rev. 01 — 19 May 2005

6 of 15

GTL2014

Philips Semiconductors

4-bit LVTTL to GTL transceiver

11. Dynamic characteristics

Table 9:

Dynamic characteristics

V_CC= 3.3 V ± 0.3 V

Symbol

Parameter

Conditions

see Figure 3

see Figure 4

Min

Typ ^[1]

Max

Unit

GTL−; V_ref= 0.6 V; V_TT= 0.9 V

t_PLH

t_PHL

t_PLH

t_PHL

propagation delay, An to Bn

-

2.8

3.3

5.3

5.2

5

7

8

ns

propagation delay, Bn to An

GTL; V_ref= 0.8 V; V_TT= 1.2 V

t_PLH

t_PHL

t_PLH

t_PHL

propagation delay, An to Bn

see Figure 3

see Figure 4

-

2.8

3.4

5.2

4.9

5

7

8

7

ns

propagation delay, Bn to An

GTL+; V_ref= 1.0 V; V_TT= 1.5 V

t_PLH

t_PHL

t_PLH

t_PHL

propagation delay, An to Bn

see Figure 3

see Figure 4

-

2.8

3.4

5.1

4.7

5

7

8

7

ns

propagation delay, Bn to An

[1] All typical values are at V_CC= 3.3 V and T_amb= 25 °C.

9397 750 13534

Product data sheet

Rev. 01 — 19 May 2005

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GTL2014

Philips Semiconductors

4-bit LVTTL to GTL transceiver

11.1 Waveforms

V_M= 1.5 V at V_CC≥ 3.0 V; V_M= V_CC/2 at V_CC≤ 2.7 V for A ports and control pins;

V_M= V_reffor B ports.

3.0 V

0 V

input

1.5 V

t

PHL

PLH

t

pulse

V

3.0 V

0 V

OH

output

V

ref

V

M

V

OL

002aab141

002aab140

V_M= 1.5 V for A port and V_reffor

B port

B port to A port

a. Pulse duration

b. Propagation delay times

Fig 3. Voltage waveforms

V

1

TT

input

V

ref

/ V

3

TT

t

PHL

PLH

V

OH

OL

output

1.5 V

V

002aab142

PRR ≤ 10 MHz; Z₀= 50 Ω; t_r≤ 2.5 ns; t_f≤ 2.5 ns

Fig 4. Propagation delay, Bn to An

9397 750 13534

Product data sheet

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GTL2014

Philips Semiconductors

4-bit LVTTL to GTL transceiver

12. Test information

V

CC

V

I

O

PULSE

GENERATOR

D.U.T.

R

500 Ω

C

50 pF

L

R

T

002aab006

Fig 5. Load circuitry for switching times

V

TT

V

CC

25 Ω

V

O

I

PULSE

GENERATOR

D.U.T.

C

30 pF

L

R

T

002aab143

Fig 6. Load circuit for B outputs

R_L— Load resistor

C_L— Load capacitance; includes jig and probe capacitance

R_T— Termination resistance; should be equal to output impedance of pulse generators.

9397 750 13534

Product data sheet

Rev. 01 — 19 May 2005

9 of 15

GTL2014

Philips Semiconductors

4-bit LVTTL to GTL transceiver

13. Package outline

TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm

SOT402-1

D

E

A

X

c

y

H

v

M

A

E

Z

8

14

Q

(A )

3

A

2

A

1

pin 1 index

θ

L

p

L

1

7

detail X

w

M

b

p

e

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

A

(1)

(2)

(1)

UNIT

A

b

c

D

E

e

H

L

Q

v

w

y

Z

θ

1

2

3

p

E

p

max.

8^o

0^o

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

5.1

4.9

4.5

4.3

6.6

6.2

0.75

0.50

0.4

0.3

0.72

0.38

mm

1.1

0.65

0.25

1

0.2

0.13

0.1

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-18

SOT402-1

MO-153

Fig 7. Package outline SOT402-1 (TSSOP14)

9397 750 13534

Product data sheet

Rev. 01 — 19 May 2005

10 of 15

GTL2014

Philips Semiconductors

4-bit LVTTL to GTL transceiver

14. Soldering

14.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account of

soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface mount IC packages. Wave

soldering can still be used for certain surface mount ICs, but it is not suitable for ﬁne pitch

SMDs. In these situations reﬂow soldering is recommended.

14.2 Reﬂow soldering

Reﬂow soldering requires solder paste (a suspension of ﬁne solder particles, ﬂux and

binding agent) to be applied to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement. Driven by legislation and

environmental forces the worldwide use of lead-free solder pastes is increasing.

Several methods exist for reﬂowing; for example, convection or convection/infrared

heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)

vary between 100 seconds and 200 seconds depending on heating method.

Typical reﬂow peak temperatures range from 215 °C to 270 °C depending on solder paste

material. The top-surface temperature of the packages should preferably be kept:

• below 225 °C (SnPb process) or below 245 °C (Pb-free process)

– for all BGA, HTSSON..T and SSOP..T packages

– for packages with a thickness ≥ 2.5 mm

– for packages with a thickness < 2.5 mm and a volume ≥ 350 mm³so called

thick/large packages.

• below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a

thickness < 2.5 mm and a volume < 350 mm³so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

14.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices

(SMDs) or printed-circuit boards with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering method was speciﬁcally

developed.

If wave soldering is used the following conditions must be observed for optimal results:

• Use a double-wave soldering method comprising a turbulent wave with high upward

pressure followed by a smooth laminar wave.

• For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

9397 750 13534

Product data sheet

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GTL2014

Philips Semiconductors

4-bit LVTTL to GTL transceiver

– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

• For packages with leads on four sides, the footprint must be placed at a 45° angle to

the transport direction of the printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must be ﬁxed with a droplet of

adhesive. The adhesive can be applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C

or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated ﬂux will eliminate the need for removal of corrosive residues in most

applications.

14.4 Manual soldering

Fix the component by ﬁrst soldering two diagonally-opposite end leads. Use a low voltage

(24 V or less) soldering iron applied to the ﬂat part of the lead. Contact time must be

limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within

2 seconds to 5 seconds between 270 °C and 320 °C.

14.5 Package related soldering information

Table 10: Suitability of surface mount IC packages for wave and reﬂow soldering methods

Package ^[1]

Soldering method

Wave

Reﬂow^[2]

BGA, HTSSON..T^[3], LBGA, LFBGA, SQFP,

SSOP..T^[3], TFBGA, VFBGA, XSON

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,

HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,

HVSON, SMS

not suitable^[4]

suitable

PLCC^[5], SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended^{[5] [6]}

not recommended^[7]

not suitable

suitable

SSOP, TSSOP, VSO, VSSOP

CWQCCN..L^[8], PMFP^[9], WQCCN..L^[8]

suitable

not suitable

[1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);

order a copy from your Philips Semiconductors sales ofﬁce.

[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal or

external package cracks may occur due to vaporization of the moisture in them (the so called popcorn

effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit

Packages; Section: Packing Methods.

[3] These transparent plastic packages are extremely sensitive to reﬂow soldering conditions and must on no

account be processed through more than one soldering cycle or subjected to infrared reﬂow soldering with

peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reﬂow oven. The package

body peak temperature must be kept as low as possible.

9397 750 13534

Product data sheet

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GTL2014

Philips Semiconductors

4-bit LVTTL to GTL transceiver

[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the

solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink

on the top side, the solder might be deposited on the heatsink surface.

[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is

deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger

than 0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on ﬂex foil. However, the image sensor package can be mounted by the client on a ﬂex foil by

using a hot bar soldering process. The appropriate soldering proﬁle can be provided on request.

[9] Hot bar soldering or manual soldering is suitable for PMFP packages.

15. Abbreviations

Table 11: Abbreviations

Acronym

CDM

CMOS

ESD

Description

Charged Device Model

Complementary Metal Oxide Silicon

ElectroStatic Discharge

Gunning Transceiver Logic

Human Body Model

GTL

HBM

LVTTL

MM

Low Voltage Transistor-Transistor Logic

Machine Model

PRR

Pulse Rate Repetition

TTL

Transistor-Transistor Logic

16. Revision history

Table 12: Revision history

Document ID

Release date Data sheet status

20050519 Product data sheet

Change notice

Doc. number

9397 750 13534

Supersedes

GTL2014_1

-

9397 750 13534

Product data sheet

Rev. 01 — 19 May 2005

13 of 15

GTL2014

Philips Semiconductors

4-bit LVTTL to GTL transceiver

17. Data sheet status

Level Data sheet status^[1]Product status^{[2] [3]}

Deﬁnition

I

Objective data

Development

This data sheet contains data from the objective speciﬁcation for product development. Philips

Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

II

Preliminary data

Qualiﬁcation

This data sheet contains data from the preliminary speciﬁcation. Supplementary data will be published

at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in

order to improve the design and supply the best possible product.

III

Product data

Production

This data sheet contains data from the product speciﬁcation. Philips Semiconductors reserves the

right to make changes at any time in order to improve the design, manufacturing and supply. Relevant

changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN).

[1]

[2]

Please consult the most recently issued data sheet before initiating or completing a design.

The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at

URL http://www.semiconductors.philips.com.

[3]

For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

customers using or selling these products for use in such applications do so

at their own risk and agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

18. Deﬁnitions

Short-form speciﬁcation — The data in a short-form speciﬁcation is

extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook.

Right to make changes — Philips Semiconductors reserves the right to

make changes in the products - including circuits, standard cells, and/or

software - described or contained herein in order to improve design and/or

performance. When the product is in full production (status ‘Production’),

relevant changes will be communicated via a Customer Product/Process

Change Notiﬁcation (CPCN). Philips Semiconductors assumes no

responsibility or liability for the use of any of these products, conveys no

license or title under any patent, copyright, or mask work right to these

products, and makes no representations or warranties that these products are

free from patent, copyright, or mask work right infringement, unless otherwise

speciﬁed.

Limiting values deﬁnition — Limiting values given are in accordance with

the Absolute Maximum Rating System (IEC 60134). Stress above one or

more of the limiting values may cause permanent damage to the device.

These are stress ratings only and operation of the device at these or at any

other conditions above those given in the Characteristics sections of the

speciﬁcation is not implied. Exposure to limiting values for extended periods

may affect device reliability.

Application information — Applications that are described herein for any

of these products are for illustrative purposes only. Philips Semiconductors

make no representation or warranty that such applications will be suitable for

the speciﬁed use without further testing or modiﬁcation.

20. Trademarks

Notice — All referenced brands, product names, service names and

19. Disclaimers

trademarks are the property of their respective owners.

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips Semiconductors

21. Contact information

For additional information, please visit: http://www.semiconductors.philips.com

For sales ofﬁce addresses, send an email to: sales.addresses@www.semiconductors.philips.com

9397 750 13534

Product data sheet

Rev. 01 — 19 May 2005

14 of 15

GTL2014

Philips Semiconductors

4-bit LVTTL to GTL transceiver

22. Contents

1

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data . . . . . . . . . . . . . . . . . . . . . 1

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2

Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

2

3

4

4.1

5

6

6.1

6.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

7

7.1

8

Functional description . . . . . . . . . . . . . . . . . . . 3

Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

Recommended operating conditions. . . . . . . . 5

Static characteristics. . . . . . . . . . . . . . . . . . . . . 6

Dynamic characteristics . . . . . . . . . . . . . . . . . . 7

Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Test information. . . . . . . . . . . . . . . . . . . . . . . . . 9

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10

9

10

11

11.1

12

13

14

14.1

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Introduction to soldering surface mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Reﬂow soldering . . . . . . . . . . . . . . . . . . . . . . . 11

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 11

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 12

Package related soldering information . . . . . . 12

14.2

14.3

14.4

14.5

15

16

17

18

19

20

21

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 13

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 14

Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Contact information . . . . . . . . . . . . . . . . . . . . 14

All rights are reserved. Reproduction in whole or in part is prohibited without the prior

written consent of the copyright owner. The information presented in this document does

not form part of any quotation or contract, is believed to be accurate and reliable and may

be changed without notice. No liability will be accepted by the publisher for any

consequence of its use. Publication thereof does not convey nor imply any license under

patent- or other industrial or intellectual property rights.

Date of release: 19 May 2005

Document number: 9397 750 13534

Published in The Netherlands


型号：	GTL2014PW
厂家：	NXP
描述：	4-bit LVTTL to GTL transceiver 4位LVTTL到GTL收发器
文件：	总15页 (文件大小：78K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

GTL2014PW [NXP]

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