HEC4093BT-112 [NXP]
FBQuad 2-input NAND Schmitt trigger; FBQuad二输入NAND施密特触发器型号: | HEC4093BT-112 |
厂家: | NXP |
描述: | FBQuad 2-input NAND Schmitt trigger |
文件: | 总15页 (文件大小:158K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
HEF4093B
Quad 2-input NAND Schmitt trigger
Rev. 8 — 21 November 2011
Product data sheet
1. General description
The HEF4093B is a quad two-input NAND gate. Each input has a Schmitt trigger circuit.
The gate switches at different points for positive-going and negative-going signals. The
difference between the positive voltage (VT+) and the negative voltage (VT) is defined as
hysteresis voltage (VH).
It operates over a recommended VDD power supply range of 3 V to 15 V referenced to VSS
(usually ground). Unused inputs must be connected to VDD, VSS, or another input.
2. Features and benefits
Schmitt trigger input discrimination
Fully static operation
5 V, 10 V, and 15 V parametric ratings
Standardized symmetrical output characteristics
Specified from40 C to +85 C and 40 C to +125 C
Complies with JEDEC standard JESD 13-B
3. Applications
Wave and pulse shapers
Astable multivibrators
Monostable multivibrators
4. Ordering information
Table 1.
Ordering information
All types operate from 40 C to +125 C
Type number
Package
Name
Description
Version
HEF4093BP
HEF4093BT
DIP14
SO14
plastic dual in-line package; 14 leads (300 mil)
plastic small outline package; 14 leads; body width 3.9 mm
SOT27-1
SOT108-1
HEF4093B
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
5. Functional diagram
1
1A
3
4
1Y
2Y
3Y
4Y
2
1B
5
2A
6
2B
nA
nB
nY
8
3A
001aag105
10
11
9
3B
12
4A
13
4B
001aag104
Fig 1. Functional diagram
Fig 2. Logic diagram (one gate)
6. Pinning information
6.1 Pinning
1
2
3
4
5
6
7
14
13
12
11
10
9
1A
1B
1Y
2Y
2A
2B
V
DD
4B
4A
4Y
3Y
3B
3A
HEF4093B
V
SS
8
001aag106
Fig 3. Pin configuration
HEF4093B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 21 November 2011
2 of 15
HEF4093B
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
6.2 Pin description
Table 2.
Symbol
1A to 4A
1B to 4B
1Y to 4Y
VDD
Pin description
Pin
Description
input
1, 5, 8, 12
2, 6, 9, 13
3, 4, 10, 11
14
input
output
supply voltage
ground (0 V)
VSS
7
7. Functional description
Table 3.
Function table[1]
Input
nA
L
Output
nB
L
nY
H
L
H
L
H
H
H
H
H
L
[1] H = HIGH voltage level; L = LOW voltage level.
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to VSS = 0 V (ground).
Symbol Parameter
Conditions
Min
0.5
-
Max
+18
Unit
V
VDD
IIK
supply voltage
input clamping current
input voltage
VI < 0.5 V or VI > VDD + 0.5 V
VO < 0.5 V or VO > VDD + 0.5 V
10
mA
V
VI
0.5
-
VDD + 0.5
10
IOK
II/O
output clamping current
input/output current
supply current
mA
mA
mA
C
-
10
IDD
Tstg
Tamb
Ptot
-
50
storage temperature
ambient temperature
total power dissipation
65
40
+150
+125
C
Tamb = 40 C to +125 C
[1]
[2]
DIP14
SO14
-
-
-
750
500
100
mW
mW
mW
P
power dissipation
per output
[1] For DIP14 packages: above Tamb = 70 C, Ptot derates linearly with 12 mW/K.
[2] For SO14 packages: above Tamb = 70 C, Ptot derates linearly with 8 mW/K.
HEF4093B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 21 November 2011
3 of 15
HEF4093B
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
9. Recommended operating conditions
Table 5.
Symbol
VDD
Recommended operating conditions
Parameter
Conditions
Min
3
Max
15
Unit
V
supply voltage
VI
input voltage
0
VDD
+125
V
Tamb
ambient temperature
in free air
40
C
10. Static characteristics
Table 6.
Static characteristics
VSS = 0 V; VI = VSS or VDD; unless otherwise specified.
Symbol Parameter
Conditions
VDD
Tamb = 40 C Tamb = +25 C Tamb = +85 C Tamb = +125 C Unit
Min
Max
-
Min
Max
-
Min
Max
-
Min
Max
-
VOH
HIGH-level
output voltage
IO < 1 A
IO < 1 A
5 V
10 V
15 V
5 V
4.95
4.95
4.95
4.95
V
V
V
V
V
V
9.95
-
9.95
-
9.95
-
9.95
-
14.95
-
14.95
-
14.95
-
14.95
-
VOL
LOW-level
output voltage
-
0.05
0.05
0.05
1.7
0.64
1.6
4.2
-
-
0.05
0.05
0.05
1.4
0.5
1.3
3.4
-
-
0.05
0.05
0.05
1.1
0.36
0.9
2.4
-
-
0.05
0.05
0.05
10 V
15 V
5 V
-
-
-
-
-
-
-
-
IOH
HIGH-level
output current
VO = 2.5 V
VO = 4.6 V
VO = 9.5 V
VO = 13.5 V
VO = 0.4 V
VO = 0.5 V
VO = 1.5 V
-
-
-
-
-
1.1 mA
0.36 mA
0.9 mA
2.4 mA
5 V
-
-
-
-
-
-
10 V
15 V
5 V
-
-
-
-
-
IOL
LOW-level
output current
0.64
1.6
4.2
-
0.5
1.3
3.4
-
0.36
0.9
2.4
-
0.36
0.9
2.4
-
-
-
-
mA
mA
mA
10 V
15 V
15 V
-
-
-
-
-
-
II
input leakage
current
0.1
0.1
1.0
1.0 A
IDD
supply current all valid input
combinations;
5 V
10 V
15 V
-
-
-
-
0.25
0.5
1.0
-
-
-
-
-
0.25
0.5
-
-
-
-
7.5
15.0
30.0
-
-
-
-
-
7.5 A
15.0 A
30.0 A
IO = 0 A
1.0
CI
input
7.5
-
pF
capacitance
HEF4093B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 21 November 2011
4 of 15
HEF4093B
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
11. Dynamic characteristics
Table 7.
Dynamic characteristics
T
amb = 25 C; CL = 50 pF; tr = tf 20 ns; wave forms see Figure 4; test circuit see Figure 5; unless otherwise specified.
Symbol Parameter
Conditions
VDD
Extrapolation formula[1] Min
Typ
90
40
30
85
40
30
60
30
20
60
30
20
Max
185
80
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tPHL
HIGH to LOW
nA or nB to nY 5 V
63 ns + (0.55 ns/pF)CL
29 ns + (0.23 ns/pF)CL
22 ns + (0.16 ns/pF)CL
58 ns + (0.55 ns/pF)CL
29 ns + (0.23 ns/pF)CL
22 ns + (0.16 ns/pF)CL
10 ns + (1.00 ns/pF)CL
9 ns + (0.42 ns/pF)CL
6 ns + (0.28 ns/pF)CL
10 ns + (1.00 ns/pF)CL
9 ns + (0.42 ns/pF)CL
6 ns + (0.28 ns/pF)CL
-
-
-
-
-
-
-
-
-
-
-
-
propagation delay
10 V
15 V
nA or nB to nY 5 V
10 V
60
tPLH
tTHL
tTLH
LOW to HIGH
propagation delay
170
80
15 V
60
HIGH to LOW output
transition time
nY to LOW
5 V
10 V
15 V
5 V
120
60
40
LOW to HIGH output
transition time
nA or nB to
HIGH
120
60
10 V
15 V
40
[1] Typical value of the propagation delay and output transition time can be calculated with the extrapolation formula (CL in pF).
Table 8.
Dynamic power dissipation
VSS = 0 V; tr = tf 20 ns; Tamb = 25 C.
Symbol Parameter
VDD
5 V
Typical formula
where:
PD
dynamic power
dissipation
PD = 1300 fi + (fo CL) VDD2 (W)
PD = 6400 fi + (fo CL) VDD2 (W)
PD = 18700 fi + (fo CL) VDD2 (W)
fi = input frequency in MHz;
fo = output frequency in MHz;
10 V
15 V
CL = output load capacitance in pF;
(fo CL) = sum of the outputs;
VDD = supply voltage in V.
HEF4093B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 21 November 2011
5 of 15
HEF4093B
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
12. Waveforms
t
t
f
r
V
I
90 %
input
V
M
10 %
0 V
t
t
PLH
PHL
V
OH
90 %
output
V
M
10 %
V
OL
t
t
THL
TLH
001aag197
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
tr, tf = input rise and fall times.
Fig 4. Propagation delay and output transition time
Table 9.
Measurement points
Supply voltage
VDD
Input
VM
Output
VM
5 V to 15 V
0.5VDD
0.5VDD
V
DD
V
V
O
I
G
DUT
C
L
R
T
001aag182
Test data given in Table 10.
Definitions for test circuit:
DUT = Device Under Test.
CL = load capacitance including jig and probe capacitance.
RT = termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig 5. Test circuit
Table 10. Test data
Supply voltage
VDD
Input
Load
CL
VI
tr, tf
5 V to 15 V
VSS or VDD
20 ns
50 pF
HEF4093B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 21 November 2011
6 of 15
HEF4093B
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
13. Transfer characteristics
Table 11. Transfer characteristics
VSS = 0 V; Tamb = 25 C; see Figure 6 and Figure 7.
Symbol Parameter Conditions
VDD
5 V
Min
1.9
3.6
4.7
1.5
3
Typ
2.9
5.2
7.3
2.2
4.2
6.0
0.7
1.0
1.3
Max Unit
VT+
VT
VH
positive-going threshold voltage
3.5
7
V
V
V
V
V
V
V
V
V
10 V
15 V
5 V
11
3.1
6.4
10.3
-
negative-going threshold voltage
hysteresis voltage
10 V
15 V
5 V
4
0.4
0.6
0.7
10 V
15 V
-
-
V
O
V
T+
V
I
V
H
V
T−
V
I
V
O
V
H
V
V
T+
T−
001aag107
001aag108
Fig 6. Transfer characteristic
Fig 7. Waveforms showing definition of VT+ and VT
(between limits at 30 % and 70 %) and VH
HEF4093B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 21 November 2011
7 of 15
HEF4093B
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
001aag109
001aag110
200
1000
I
I
DD
DD
(μA)
(μA)
100
500
0
0
0
2.5
5
0
5
10
V (V)
I
V (V)
I
a. VDD = 5 V; Tamb = 25 C
b. VDD = 10 V; Tamb = 25 C
001aag111
2000
I
DD
(μA)
1000
0
0
10
20
V (V)
I
c. VDD = 15 V; Tamb = 25 C
Fig 8. Typical drain current as a function of input
HEF4093B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 21 November 2011
8 of 15
HEF4093B
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
001aag112
10
V
I
(V)
V
V
T+
T−
5
0
2.5
5
7.5
10
12.5
15
17.5
V
(V)
DD
Tamb = 25 C.
Fig 9. Typical switching levels as a function of supply voltage
14. Application information
Some examples of applications for the HEF4093B are:
• Wave and pulse shapers
• Astable multivibrators
• Monostable multivibrators
C
p
V
V
DD
DD
14
14
R
1
2
1
2
3
3
V
V
DD
DD
C
7
7
001aag113
001aag114
Fig 10. Astable multivibrator
Fig 11. Schmitt trigger driven via a
high-impedance input
If a Schmitt trigger is driven via a high-impedance (R > 1 k), then it is necessary to
V
DD – VSS
C
incorporate a capacitor C with a value of ------ > ------------------------ ; otherwise oscillation can occur
CP VH
on the edges of a pulse.
Cp is the external parasitic capacitance between inputs and output; the value depends on
the circuit board layout.
Remark: The two inputs may be connected together, but this will result in a larger
through-current at the moment of switching.
HEF4093B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 21 November 2011
9 of 15
HEF4093B
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
15. Package outline
DIP14: plastic dual in-line package; 14 leads (300 mil)
SOT27-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
M
H
14
8
pin 1 index
E
1
7
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
2
(1)
(1)
Z
1
UNIT
mm
b
b
c
D
E
e
e
L
M
M
H
w
1
1
E
max.
min.
max.
max.
1.73
1.13
0.53
0.38
0.36
0.23
19.50
18.55
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.1
7.62
0.3
0.254
0.01
2.2
0.068
0.044
0.021
0.015
0.014
0.009
0.77
0.73
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.02
0.13
0.087
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-13
SOT27-1
050G04
MO-001
SC-501-14
Fig 12. Package outline SOT27-1 (DIP14)
HEF4093B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 21 November 2011
10 of 15
HEF4093B
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
v
c
y
H
M
A
E
Z
8
14
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
7
e
detail X
w
M
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.75
1.27
0.05
1.05
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches
0.041
0.01 0.004
0.069
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT108-1
076E06
MS-012
Fig 13. Package outline SOT108-1 (SO14)
HEF4093B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 21 November 2011
11 of 15
HEF4093B
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
16. Revision history
Table 12. Revision history
Document ID
Release date
20111121
Data sheet status
Change notice
Supersedes
HEF4093B v.8
Modifications:
Product data sheet
-
HEF4093B v.7
• Table 6: IOH minimum values changed to maximum
HEF4093B v.7
HEF4093B v.6
HEF4093B v.5
HEF4093B v.4
HEF4093B_CNV v.3
HEF4093B_CNV v.2
20100901
20091202
20090728
20080612
19950101
19950101
Product data sheet
Product data sheet
Product data sheet
Product data sheet
Product specification
Product specification
-
-
-
-
-
-
HEF4093B v.6
HEF4093B v.5
HEF4093B v.4
HEF4093B_CNV v.3
HEF4093B_CNV v.2
-
HEF4093B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 21 November 2011
12 of 15
HEF4093B
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
17.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
17.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
HEF4093B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 21 November 2011
13 of 15
HEF4093B
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
HEF4093B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 21 November 2011
14 of 15
HEF4093B
NXP Semiconductors
Quad 2-input NAND Schmitt trigger
19. Contents
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Transfer characteristics . . . . . . . . . . . . . . . . . . 7
Application information. . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12
8
9
10
11
12
13
14
15
16
17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
17.1
17.2
17.3
17.4
18
19
Contact information. . . . . . . . . . . . . . . . . . . . . 14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 21 November 2011
Document identifier: HEF4093B
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