HEC4093BT-112 [NXP]

FBQuad 2-input NAND Schmitt trigger; FBQuad二输入NAND施密特触发器
HEC4093BT-112
型号: HEC4093BT-112
厂家: NXP    NXP
描述:

FBQuad 2-input NAND Schmitt trigger
FBQuad二输入NAND施密特触发器

触发器
文件: 总15页 (文件大小:158K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HEF4093B  
Quad 2-input NAND Schmitt trigger  
Rev. 8 — 21 November 2011  
Product data sheet  
1. General description  
The HEF4093B is a quad two-input NAND gate. Each input has a Schmitt trigger circuit.  
The gate switches at different points for positive-going and negative-going signals. The  
difference between the positive voltage (VT+) and the negative voltage (VT) is defined as  
hysteresis voltage (VH).  
It operates over a recommended VDD power supply range of 3 V to 15 V referenced to VSS  
(usually ground). Unused inputs must be connected to VDD, VSS, or another input.  
2. Features and benefits  
Schmitt trigger input discrimination  
Fully static operation  
5 V, 10 V, and 15 V parametric ratings  
Standardized symmetrical output characteristics  
Specified from40 C to +85 C and 40 C to +125 C  
Complies with JEDEC standard JESD 13-B  
3. Applications  
Wave and pulse shapers  
Astable multivibrators  
Monostable multivibrators  
4. Ordering information  
Table 1.  
Ordering information  
All types operate from 40 C to +125 C  
Type number  
Package  
Name  
Description  
Version  
HEF4093BP  
HEF4093BT  
DIP14  
SO14  
plastic dual in-line package; 14 leads (300 mil)  
plastic small outline package; 14 leads; body width 3.9 mm  
SOT27-1  
SOT108-1  
HEF4093B  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
5. Functional diagram  
1
1A  
3
4
1Y  
2Y  
3Y  
4Y  
2
1B  
5
2A  
6
2B  
nA  
nB  
nY  
8
3A  
001aag105  
10  
11  
9
3B  
12  
4A  
13  
4B  
001aag104  
Fig 1. Functional diagram  
Fig 2. Logic diagram (one gate)  
6. Pinning information  
6.1 Pinning  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
1A  
1B  
1Y  
2Y  
2A  
2B  
V
DD  
4B  
4A  
4Y  
3Y  
3B  
3A  
HEF4093B  
V
SS  
8
001aag106  
Fig 3. Pin configuration  
HEF4093B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 8 — 21 November 2011  
2 of 15  
HEF4093B  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
6.2 Pin description  
Table 2.  
Symbol  
1A to 4A  
1B to 4B  
1Y to 4Y  
VDD  
Pin description  
Pin  
Description  
input  
1, 5, 8, 12  
2, 6, 9, 13  
3, 4, 10, 11  
14  
input  
output  
supply voltage  
ground (0 V)  
VSS  
7
7. Functional description  
Table 3.  
Function table[1]  
Input  
nA  
L
Output  
nB  
L
nY  
H
L
H
L
H
H
H
H
H
L
[1] H = HIGH voltage level; L = LOW voltage level.  
8. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to VSS = 0 V (ground).  
Symbol Parameter  
Conditions  
Min  
0.5  
-
Max  
+18  
Unit  
V
VDD  
IIK  
supply voltage  
input clamping current  
input voltage  
VI < 0.5 V or VI > VDD + 0.5 V  
VO < 0.5 V or VO > VDD + 0.5 V  
10  
mA  
V
VI  
0.5  
-
VDD + 0.5  
10  
IOK  
II/O  
output clamping current  
input/output current  
supply current  
mA  
mA  
mA  
C  
-
10  
IDD  
Tstg  
Tamb  
Ptot  
-
50  
storage temperature  
ambient temperature  
total power dissipation  
65  
40  
+150  
+125  
C  
Tamb = 40 C to +125 C  
[1]  
[2]  
DIP14  
SO14  
-
-
-
750  
500  
100  
mW  
mW  
mW  
P
power dissipation  
per output  
[1] For DIP14 packages: above Tamb = 70 C, Ptot derates linearly with 12 mW/K.  
[2] For SO14 packages: above Tamb = 70 C, Ptot derates linearly with 8 mW/K.  
HEF4093B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 8 — 21 November 2011  
3 of 15  
HEF4093B  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
9. Recommended operating conditions  
Table 5.  
Symbol  
VDD  
Recommended operating conditions  
Parameter  
Conditions  
Min  
3
Max  
15  
Unit  
V
supply voltage  
VI  
input voltage  
0
VDD  
+125  
V
Tamb  
ambient temperature  
in free air  
40  
C  
10. Static characteristics  
Table 6.  
Static characteristics  
VSS = 0 V; VI = VSS or VDD; unless otherwise specified.  
Symbol Parameter  
Conditions  
VDD  
Tamb = 40 C Tamb = +25 C Tamb = +85 C Tamb = +125 C Unit  
Min  
Max  
-
Min  
Max  
-
Min  
Max  
-
Min  
Max  
-
VOH  
HIGH-level  
output voltage  
IO< 1 A  
IO< 1 A  
5 V  
10 V  
15 V  
5 V  
4.95  
4.95  
4.95  
4.95  
V
V
V
V
V
V
9.95  
-
9.95  
-
9.95  
-
9.95  
-
14.95  
-
14.95  
-
14.95  
-
14.95  
-
VOL  
LOW-level  
output voltage  
-
0.05  
0.05  
0.05  
1.7  
0.64  
1.6  
4.2  
-
-
0.05  
0.05  
0.05  
1.4  
0.5  
1.3  
3.4  
-
-
0.05  
0.05  
0.05  
1.1  
0.36  
0.9  
2.4  
-
-
0.05  
0.05  
0.05  
10 V  
15 V  
5 V  
-
-
-
-
-
-
-
-
IOH  
HIGH-level  
output current  
VO = 2.5 V  
VO = 4.6 V  
VO = 9.5 V  
VO = 13.5 V  
VO = 0.4 V  
VO = 0.5 V  
VO = 1.5 V  
-
-
-
-
-
1.1 mA  
0.36 mA  
0.9 mA  
2.4 mA  
5 V  
-
-
-
-
-
-
10 V  
15 V  
5 V  
-
-
-
-
-
IOL  
LOW-level  
output current  
0.64  
1.6  
4.2  
-
0.5  
1.3  
3.4  
-
0.36  
0.9  
2.4  
-
0.36  
0.9  
2.4  
-
-
-
-
mA  
mA  
mA  
10 V  
15 V  
15 V  
-
-
-
-
-
-
II  
input leakage  
current  
0.1  
0.1  
1.0  
1.0 A  
IDD  
supply current all valid input  
combinations;  
5 V  
10 V  
15 V  
-
-
-
-
0.25  
0.5  
1.0  
-
-
-
-
-
0.25  
0.5  
-
-
-
-
7.5  
15.0  
30.0  
-
-
-
-
-
7.5 A  
15.0 A  
30.0 A  
IO = 0 A  
1.0  
CI  
input  
7.5  
-
pF  
capacitance  
HEF4093B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 8 — 21 November 2011  
4 of 15  
HEF4093B  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
11. Dynamic characteristics  
Table 7.  
Dynamic characteristics  
T
amb = 25 C; CL = 50 pF; tr = tf 20 ns; wave forms see Figure 4; test circuit see Figure 5; unless otherwise specified.  
Symbol Parameter  
Conditions  
VDD  
Extrapolation formula[1] Min  
Typ  
90  
40  
30  
85  
40  
30  
60  
30  
20  
60  
30  
20  
Max  
185  
80  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tPHL  
HIGH to LOW  
nA or nB to nY 5 V  
63 ns + (0.55 ns/pF)CL  
29 ns + (0.23 ns/pF)CL  
22 ns + (0.16 ns/pF)CL  
58 ns + (0.55 ns/pF)CL  
29 ns + (0.23 ns/pF)CL  
22 ns + (0.16 ns/pF)CL  
10 ns + (1.00 ns/pF)CL  
9 ns + (0.42 ns/pF)CL  
6 ns + (0.28 ns/pF)CL  
10 ns + (1.00 ns/pF)CL  
9 ns + (0.42 ns/pF)CL  
6 ns + (0.28 ns/pF)CL  
-
-
-
-
-
-
-
-
-
-
-
-
propagation delay  
10 V  
15 V  
nA or nB to nY 5 V  
10 V  
60  
tPLH  
tTHL  
tTLH  
LOW to HIGH  
propagation delay  
170  
80  
15 V  
60  
HIGH to LOW output  
transition time  
nY to LOW  
5 V  
10 V  
15 V  
5 V  
120  
60  
40  
LOW to HIGH output  
transition time  
nA or nB to  
HIGH  
120  
60  
10 V  
15 V  
40  
[1] Typical value of the propagation delay and output transition time can be calculated with the extrapolation formula (CL in pF).  
Table 8.  
Dynamic power dissipation  
VSS = 0 V; tr = tf 20 ns; Tamb = 25 C.  
Symbol Parameter  
VDD  
5 V  
Typical formula  
where:  
PD  
dynamic power  
dissipation  
PD = 1300 fi + (fo CL) VDD2 (W)  
PD = 6400 fi + (fo CL) VDD2 (W)  
PD = 18700 fi + (fo CL) VDD2 (W)  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
10 V  
15 V  
CL = output load capacitance in pF;  
(fo CL) = sum of the outputs;  
VDD = supply voltage in V.  
HEF4093B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 8 — 21 November 2011  
5 of 15  
HEF4093B  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
12. Waveforms  
t
t
f
r
V
I
90 %  
input  
V
M
10 %  
0 V  
t
t
PLH  
PHL  
V
OH  
90 %  
output  
V
M
10 %  
V
OL  
t
t
THL  
TLH  
001aag197  
Measurement points are given in Table 9.  
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.  
tr, tf = input rise and fall times.  
Fig 4. Propagation delay and output transition time  
Table 9.  
Measurement points  
Supply voltage  
VDD  
Input  
VM  
Output  
VM  
5 V to 15 V  
0.5VDD  
0.5VDD  
V
DD  
V
V
O
I
G
DUT  
C
L
R
T
001aag182  
Test data given in Table 10.  
Definitions for test circuit:  
DUT = Device Under Test.  
CL = load capacitance including jig and probe capacitance.  
RT = termination resistance should be equal to the output impedance Zo of the pulse generator.  
Fig 5. Test circuit  
Table 10. Test data  
Supply voltage  
VDD  
Input  
Load  
CL  
VI  
tr, tf  
5 V to 15 V  
VSS or VDD  
20 ns  
50 pF  
HEF4093B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 8 — 21 November 2011  
6 of 15  
HEF4093B  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
13. Transfer characteristics  
Table 11. Transfer characteristics  
VSS = 0 V; Tamb = 25 C; see Figure 6 and Figure 7.  
Symbol Parameter Conditions  
VDD  
5 V  
Min  
1.9  
3.6  
4.7  
1.5  
3
Typ  
2.9  
5.2  
7.3  
2.2  
4.2  
6.0  
0.7  
1.0  
1.3  
Max Unit  
VT+  
VT  
VH  
positive-going threshold voltage  
3.5  
7
V
V
V
V
V
V
V
V
V
10 V  
15 V  
5 V  
11  
3.1  
6.4  
10.3  
-
negative-going threshold voltage  
hysteresis voltage  
10 V  
15 V  
5 V  
4
0.4  
0.6  
0.7  
10 V  
15 V  
-
-
V
O
V
T+  
V
I
V
H
V
T  
V
I
V
O
V
H
V
V
T+  
T−  
001aag107  
001aag108  
Fig 6. Transfer characteristic  
Fig 7. Waveforms showing definition of VT+ and VT  
(between limits at 30 % and 70 %) and VH  
HEF4093B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 8 — 21 November 2011  
7 of 15  
HEF4093B  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
001aag109  
001aag110  
200  
1000  
I
I
DD  
DD  
(μA)  
(μA)  
100  
500  
0
0
0
2.5  
5
0
5
10  
V (V)  
I
V (V)  
I
a. VDD = 5 V; Tamb = 25 C  
b. VDD = 10 V; Tamb = 25 C  
001aag111  
2000  
I
DD  
(μA)  
1000  
0
0
10  
20  
V (V)  
I
c. VDD = 15 V; Tamb = 25 C  
Fig 8. Typical drain current as a function of input  
HEF4093B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 8 — 21 November 2011  
8 of 15  
HEF4093B  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
001aag112  
10  
V
I
(V)  
V
V
T+  
T−  
5
0
2.5  
5
7.5  
10  
12.5  
15  
17.5  
V
(V)  
DD  
Tamb = 25 C.  
Fig 9. Typical switching levels as a function of supply voltage  
14. Application information  
Some examples of applications for the HEF4093B are:  
Wave and pulse shapers  
Astable multivibrators  
Monostable multivibrators  
C
p
V
V
DD  
DD  
14  
14  
R
1
2
1
2
3
3
V
V
DD  
DD  
C
7
7
001aag113  
001aag114  
Fig 10. Astable multivibrator  
Fig 11. Schmitt trigger driven via a  
high-impedance input  
If a Schmitt trigger is driven via a high-impedance (R > 1 k), then it is necessary to  
V
DD VSS  
C
incorporate a capacitor C with a value of ------ > ------------------------ ; otherwise oscillation can occur  
CP VH  
on the edges of a pulse.  
Cp is the external parasitic capacitance between inputs and output; the value depends on  
the circuit board layout.  
Remark: The two inputs may be connected together, but this will result in a larger  
through-current at the moment of switching.  
HEF4093B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 8 — 21 November 2011  
9 of 15  
HEF4093B  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
15. Package outline  
DIP14: plastic dual in-line package; 14 leads (300 mil)  
SOT27-1  
D
M
E
A
2
A
A
1
L
c
e
w M  
Z
b
1
(e )  
1
b
M
H
14  
8
pin 1 index  
E
1
7
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
A
A
A
2
(1)  
(1)  
Z
1
UNIT  
mm  
b
b
c
D
E
e
e
L
M
M
H
w
1
1
E
max.  
min.  
max.  
max.  
1.73  
1.13  
0.53  
0.38  
0.36  
0.23  
19.50  
18.55  
6.48  
6.20  
3.60  
3.05  
8.25  
7.80  
10.0  
8.3  
4.2  
0.51  
3.2  
2.54  
0.1  
7.62  
0.3  
0.254  
0.01  
2.2  
0.068  
0.044  
0.021  
0.015  
0.014  
0.009  
0.77  
0.73  
0.26  
0.24  
0.14  
0.12  
0.32  
0.31  
0.39  
0.33  
inches  
0.17  
0.02  
0.13  
0.087  
Note  
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-13  
SOT27-1  
050G04  
MO-001  
SC-501-14  
Fig 12. Package outline SOT27-1 (DIP14)  
HEF4093B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 8 — 21 November 2011  
10 of 15  
HEF4093B  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
SO14: plastic small outline package; 14 leads; body width 3.9 mm  
SOT108-1  
D
E
A
X
v
c
y
H
M
A
E
Z
8
14  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
7
e
detail X  
w
M
b
p
0
2.5  
scale  
5 mm  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
8.75  
8.55  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.75  
1.27  
0.05  
1.05  
0.25  
0.01  
0.25  
0.1  
0.25  
0.01  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.35  
0.014 0.0075 0.34  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.024  
0.028  
0.012  
inches  
0.041  
0.01 0.004  
0.069  
Note  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT108-1  
076E06  
MS-012  
Fig 13. Package outline SOT108-1 (SO14)  
HEF4093B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 8 — 21 November 2011  
11 of 15  
HEF4093B  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
16. Revision history  
Table 12. Revision history  
Document ID  
Release date  
20111121  
Data sheet status  
Change notice  
Supersedes  
HEF4093B v.8  
Modifications:  
Product data sheet  
-
HEF4093B v.7  
Table 6: IOH minimum values changed to maximum  
HEF4093B v.7  
HEF4093B v.6  
HEF4093B v.5  
HEF4093B v.4  
HEF4093B_CNV v.3  
HEF4093B_CNV v.2  
20100901  
20091202  
20090728  
20080612  
19950101  
19950101  
Product data sheet  
Product data sheet  
Product data sheet  
Product data sheet  
Product specification  
Product specification  
-
-
-
-
-
-
HEF4093B v.6  
HEF4093B v.5  
HEF4093B v.4  
HEF4093B_CNV v.3  
HEF4093B_CNV v.2  
-
HEF4093B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 8 — 21 November 2011  
12 of 15  
HEF4093B  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
17. Legal information  
17.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of an NXP Semiconductors product can reasonably be expected  
17.2 Definitions  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
17.3 Disclaimers  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
HEF4093B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 8 — 21 November 2011  
13 of 15  
HEF4093B  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
non-automotive qualified products in automotive equipment or applications.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
17.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
18. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
HEF4093B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 8 — 21 November 2011  
14 of 15  
HEF4093B  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
19. Contents  
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 1  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
6
6.1  
6.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3  
7
Functional description . . . . . . . . . . . . . . . . . . . 3  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Recommended operating conditions. . . . . . . . 4  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Transfer characteristics . . . . . . . . . . . . . . . . . . 7  
Application information. . . . . . . . . . . . . . . . . . . 9  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12  
8
9
10  
11  
12  
13  
14  
15  
16  
17  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
17.1  
17.2  
17.3  
17.4  
18  
19  
Contact information. . . . . . . . . . . . . . . . . . . . . 14  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2011.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 21 November 2011  
Document identifier: HEF4093B  

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