HEF4094BT,653 [NXP]
HEF4094B - 8-stage shift-and-store register SOP 16-Pin;型号: | HEF4094BT,653 |
厂家: | NXP |
描述: | HEF4094B - 8-stage shift-and-store register SOP 16-Pin 光电二极管 输出元件 逻辑集成电路 触发器 |
文件: | 总20页 (文件大小:202K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
HEF4094B
8-stage shift-and-store register
Rev. 11 — 29 August 2013
Product data sheet
1. General description
The HEF4094B is an 8-stage serial shift register. It has a storage latch associated with
each stage for strobing data from the serial input to parallel buffered 3-state outputs
QP0 to QP7. The parallel outputs may be connected directly to common bus lines. Data is
shifted on positive-going clock transitions. The data in each shift register stage is
transferred to the storage register when the strobe (STR) input is HIGH. Data in the
storage register appears at the outputs whenever the output enable (OE) signal is HIGH.
Two serial outputs (QS1 and QS2) are available for cascading a number of HEF4094B
devices. Serial data is available at QS1 on positive-going clock edges to allow high-speed
operation in cascaded systems with a fast clock rise time. The same serial data is
available at QS2 on the next negative going clock edge. This is used for cascading
HEF4094B devices when the clock has a slow rise time.
It operates over a recommended VDD power supply range of 3 V to 15 V referenced to VSS
(usually ground). Unused inputs must be connected to VDD, VSS, or another input.
2. Features and benefits
Fully static operation
5 V, 10 V, and 15 V parametric ratings
Standardized symmetrical output characteristics
Specified from 40 C to +85 C and 40 C to +125 C
Complies with JEDEC standard JESD 13-B
3. Ordering information
Table 1.
Ordering information
All types operate from 40 C to +125 C.
Type number
Package
Name
Description
Version
HEF4094BP
HEF4094BT
HEF4094BTS
HEF4094BTT
DIP16
plastic dual in-line package; 16 leads (300 mil)
plastic small outline package; 16 leads; body width 3.9 mm
plastic shrink small outline package; 16 leads; body width 5.3 mm
plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT38-4
SOT109-1
SOT338-1
SOT403-1
SO16
SSOP16
TSSOP16
HEF4094B
NXP Semiconductors
8-stage shift-and-store register
4. Functional diagram
3
1
CP
STR
D
QS1
QS2
QP0
QP1
QP2
9
2
8-STAGE SHIFT
REGISTER
QS2
QS1
10
9
10
4
CP
3
5
STR
8-BIT STORAGE
REGISTER
1
6
2
D
QP3
QP4
QP5
QP6
QP7
7
14
13
12
11
OE
15
3-STATE OUTPUTS
QP0 QP1 QP2 QP3 QP4 QP5 QP6 QP7
4
5
6
7
14
13
12
11
001aaf119
OE
15
001aaf111
Fig 1. Functional diagram
Fig 2. Logic symbol
STAGE 0
STAGES 1 TO 6
STAGE 7
D
D
Q
D
Q
D
Q
QS1
CP
CP
D
Q
QS2
FF 0
FF 7
CP
CP
LE
LATCH
D
Q
D
Q
LE
LE
LATCH 0
LATCH 7
STR
OE
001aag799
QP0
QP2
QP4
QP6
QP1
QP3
QP5
QP7
Fig 3. Logic diagram
HEF4094B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 11 — 29 August 2013
2 of 20
HEF4094B
NXP Semiconductors
8-stage shift-and-store register
5. Pinning information
5.1 Pinning
HEF4094B
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
STR
D
V
DD
OE
+()ꢀꢁꢂꢀ%
CP
QP4
QP5
QP6
QP7
QS2
QS1
ꢃ
ꢅ
ꢇ
ꢀ
ꢂ
ꢄ
ꢆ
ꢈ
ꢃꢄ
ꢃꢂ
ꢃꢀ
ꢃꢇ
ꢃꢅ
ꢃꢃ
ꢃꢁ
ꢉ
675
'
9
''
QP0
QP1
QP2
QP3
2(
&3
43ꢀ
43ꢂ
43ꢄ
43ꢆ
46ꢅ
46ꢃ
43ꢁ
43ꢃ
43ꢅ
43ꢇ
V
SS
9
66
001aae662
DDDꢀꢁꢁꢂꢃꢃꢃ
Fig 4. Pin configuration SOT38-4 and SOT109-1
Fig 5. Pin configuration SOT338-1 and SOT403-1
5.2 Pin description
Table 2.
Symbol
STR
Pin description
Pin
1
Description
strobe input
data input
D
2
CP
3
clock input
QP0 to QP7
VSS
4, 5, 6, 7, 14, 13, 12, 11
parallel output
8
ground supply voltage
serial output
QS1
9
QS2
10
15
16
serial output
OE
output enable input
supply voltage
VDD
HEF4094B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 11 — 29 August 2013
3 of 20
HEF4094B
NXP Semiconductors
8-stage shift-and-store register
6. Functional description
Table 3.
Function table[1]
Inputs
Parallel outputs
Serial outputs
CP
OE
L
STR
X
D
X
X
X
L
QP0
Z
QPn
QS1
Q6S
NC
QS2
NC
Z
L
X
Z
Z
Q7S
NC
H
H
H
H
L
NC
L
NC
Q6S
Q6S
Q6S
NC
H
QPn 1
QPn 1
NC
NC
H
H
H
H
NC
H
NC
Q7S
[1] At the positive clock edge, the information in the 7th register stage is transferred to the 8th register stage and the QSn outputs.
H = HIGH voltage level; L = LOW voltage level; X = don’t care;
= positive-going transition; = negative-going transition;
Z = HIGH-impedance OFF-state; NC = no change;
Q6S = the data in register stage 6 before the LOW to HIGH clock transition;
Q7S = the data in register stage 7 before the HIGH to LOW clock transition.
CLOCK INPUT
DATA INPUT
STROBE INPUT
OUTPUT ENABLE INPUT
INTERNAL Q0S (FF 0)
Z-state
OUTPUT QP0
INTERNAL Q6S (FF 6)
Z-state
OUTPUT QP6
SERIAL OUTPUT QS1
SERIAL OUTPUT QS2
001aaf117
Fig 6. Timing diagram
HEF4094B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 11 — 29 August 2013
4 of 20
HEF4094B
NXP Semiconductors
8-stage shift-and-store register
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to VSS = 0 V (ground).
Symbol Parameter
Conditions
Min
Max
+18
Unit
V
VDD
IIK
supply voltage
0.5
input clamping current
input voltage
VI < 0.5 V or VI > VDD + 0.5 V
VO < 0.5 V or VO > VDD + 0.5 V
-
10
mA
V
VI
0.5
VDD + 0.5
10
IOK
II/O
output clamping current
input/output current
supply current
-
mA
mA
mA
C
-
10
IDD
Tstg
Tamb
Ptot
-
50
storage temperature
ambient temperature
total power dissipation
65
+150
+125
750
40
C
[1]
[2]
DIP16
-
-
-
mW
mW
mW
SO16, SSOP16 and TSSOP16
per output
500
P
power dissipation
100
[1] For DIP16 packages: above Tamb = 70 C, Ptot derates linearly with 12 mW/K.
[2] For SO16 package: Ptot derates linearly with 8 mW/K above 70 C.
For (T)SSOP16 package: Ptot derates linearly with 5.5 mW/K above 60 C.
8. Recommended operating conditions
Table 5.
Symbol
VDD
Recommended operating conditions
Parameter
Conditions
Min
Typ
Max
15
Unit
supply voltage
3
-
-
-
-
-
-
V
VI
input voltage
0
VDD
+125
3.75
0.5
V
Tamb
ambient temperature
input transition rise and fall rate
in free air
40
C
t/V
VDD = 5 V
VDD = 10 V
VDD = 15 V
-
-
-
s/V
s/V
s/V
0.08
HEF4094B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 11 — 29 August 2013
5 of 20
HEF4094B
NXP Semiconductors
8-stage shift-and-store register
9. Static characteristics
Table 6.
Static characteristics
VSS = 0 V; VI = VSS or VDD; unless otherwise specified.
Symbol Parameter
Conditions
VDD
Tamb = 40 C Tamb = +25 C Tamb = +85 C Tamb = +125 C Unit
Min
Max
Min
Max
-
Min
Max
Min
Max
VIH
HIGH-level
input voltage
IO < 1 A
IO < 1 A
IO < 1 A
IO < 1 A
5 V
10 V
15 V
5 V
3.5
-
-
3.5
3.5
-
-
3.5
-
-
V
V
V
V
V
V
V
V
V
V
V
V
7.0
7.0
-
7.0
7.0
11.0
-
11.0
-
11.0
-
11.0
-
VIL
LOW-level
input voltage
-
1.5
3.0
4.0
-
-
1.5
3.0
4.0
-
-
1.5
3.0
4.0
-
-
1.5
3.0
4.0
-
10 V
15 V
5 V
-
-
-
-
-
-
-
-
VOH
VOL
IOH
HIGH-level
output voltage
4.95
4.95
4.95
4.95
10 V
15 V
5 V
9.95
-
9.95
-
9.95
-
9.95
-
14.95
-
14.95
-
14.95
-
14.95
-
LOW-level
output voltage
-
0.05
0.05
0.05
1.7
0.64
1.6
4.2
-
-
0.05
0.05
0.05
1.4
0.5
1.3
3.4
-
-
0.05
0.05
0.05
1.1
0.36
0.9
2.4
-
-
0.05
0.05
0.05
10 V
15 V
5 V
-
-
-
-
-
-
-
-
HIGH-level
output current
VO = 2.5 V
VO = 4.6 V
VO = 9.5 V
VO = 13.5 V
VO = 0.4 V
VO = 0.5 V
VO = 1.5 V
-
-
-
-
-
1.1 mA
0.36 mA
0.9 mA
2.4 mA
5 V
-
-
-
-
-
-
10 V
15 V
5 V
-
-
-
-
-
IOL
LOW-level
output current
0.64
1.6
4.2
-
0.5
1.3
3.4
-
0.36
0.9
2.4
-
0.36
0.9
2.4
-
-
-
mA
mA
mA
A
10 V
15 V
15 V
-
-
-
-
-
-
-
IOZ
OFF-state
output current
QPn output
is HIGH;
0.4
0.4
12
12
VO = 15 V
II
input leakage
current
15 V
-
0.1
-
0.1
-
1.0
-
1.0 A
IDD
supply current all valid input
combinations;
5 V
10 V
15 V
-
-
-
-
5
10
20
-
-
-
-
-
5
-
-
-
-
150
300
600
-
-
-
-
-
150 A
300 A
600 A
10
20
7.5
IO = 0 A
CI
input
-
pF
capacitance
HEF4094B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 11 — 29 August 2013
6 of 20
HEF4094B
NXP Semiconductors
8-stage shift-and-store register
10. Dynamic characteristics
Table 7.
Dynamic characteristics
VSS = 0 V; Tamb = 25 C; for test circuit see Figure 11; unless otherwise specified.
Symbol Parameter
Conditions
VDD
5 V
Extrapolation formula
108 ns + (0.55 ns/pF)CL
54 ns + (0.23 ns/pF)CL
42 ns + (0.16 ns/pF)CL
78 ns + (0.55 ns/pF)CL
39 ns + (0.23 ns/pF)CL
32 ns + (0.16 ns/pF)CL
138 ns + (0.55 ns/pF)CL
64 ns + (0.23 ns/pF)CL
47 ns + (0.16 ns/pF)CL
83 ns + (0.55 ns/pF)CL
39 ns + (0.23 ns/pF)CL
27 ns + (0.16 ns/pF)CL
78 ns + (0.55 ns/pF)CL
39 ns + (0.23 ns/pF)CL
32 ns + (0.16 ns/pF)CL
78 ns + (0.55 ns/pF)CL
39 ns + (0.23 ns/pF)CL
32 ns + (0.16 ns/pF)CL
123 ns + (0.55 ns/pF)CL
59 ns + (0.23 ns/pF)CL
47 ns + (0.16 ns/pF)CL
73 ns + (0.55 ns/pF)CL
34 ns + (0.23 ns/pF)CL
27 ns + (0.16 ns/pF)CL
10 ns + (1.00 ns/pF)CL
9 ns + (0.42 ns/pF)CL
6 ns + (0.28 ns/pF)CL
Min
-
Typ
135
65
Max
270
130
100
210
100
80
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
[1]
[1]
[1]
tPHL
HIGH to LOW
CP to QS1;
see Figure 7
propagation delay
10 V
15 V
5 V
-
-
50
CP to QS2;
see Figure 7
-
105
50
10 V
15 V
5 V
-
-
40
CP to QPn;
see Figure 7
-
165
75
330
150
110
220
100
70
10 V
15 V
5 V
-
-
55
STR to QPn;
see Figure 8
-
110
50
10 V
15 V
5 V
-
-
35
tPLH
LOW to HIGH
CP to QS1;
see Figure 7
-
105
50
210
100
80
propagation delay,
10 V
15 V
5 V
-
-
40
CP to QS2;
see Figure 7
-
105
50
210
100
80
10 V
15 V
5 V
-
-
40
CP to QPn;
see Figure 7
-
150
70
300
140
110
200
90
10 V
15 V
5 V
-
-
55
STR to QPn;
see Figure 8
-
100
45
10 V
15 V
5 V
-
-
35
70
tt
transition time
-
60
120
60
10 V
15 V
5 V
-
30
-
20
40
tPZH
tPZL
tPHZ
OFF-state to HIGH
propagation delay
OE to QPn;
see Figure 9
-
40
80
10 V
15 V
5 V
-
25
50
-
20
40
OFF-state to LOW
propagation delay
OE to QPn;
see Figure 9
-
40
80
10 V
15 V
5 V
-
25
50
-
20
40
HIGH to OFF-state
propagation delay
OE to QPn;
see Figure 9
-
75
150
80
10 V
15 V
-
40
-
30
60
HEF4094B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 11 — 29 August 2013
7 of 20
HEF4094B
NXP Semiconductors
8-stage shift-and-store register
Table 7.
Dynamic characteristics …continued
VSS = 0 V; Tamb = 25 C; for test circuit see Figure 11; unless otherwise specified.
Symbol Parameter
Conditions
VDD
5 V
Extrapolation formula
Min
-
Typ
80
40
30
30
10
5
Max
Unit
ns
tPLZ
tsu
th
LOW to OFF-state
propagation delay
OE to QPn;
see Figure 9
160
10 V
15 V
5 V
-
80
60
-
ns
-
ns
set-up time
D to CP;
see Figure 10
60
20
15
+5
20
20
60
30
24
40
30
24
5
ns
10 V
15 V
5 V
-
ns
-
ns
hold time
D to CP;
see Figure 10
15
5
-
ns
10 V
15 V
-
ns
5
-
ns
tW
pulse width
minimum LOW 5 V
clock pulse;
see Figure 7
15 V
30
15
12
20
15
12
10
22
28
-
ns
10 V
-
ns
-
ns
minimumHIGH 5 V
strobe pulse;
see Figure 8
15 V
-
ns
10 V
-
ns
-
ns
fmax
maximum frequency see Figure 7
5 V
10 V
15 V
-
MHz
MHz
MHz
11
14
-
-
[1] The typical values of the propagation delay and transition times are calculated from the extrapolation formulas shown (CL in pF).
Table 8.
Dynamic power dissipation
VSS = 0 V; tr = tf 20 ns; Tamb = 25 C.
Symbol
Parameter
VDD
5 V
Typical formula for PD (W)
PD = 2100 fi + (fo CL) VDD
PD = 9700 fi + (fo CL) VDD
where:
2
2
PD
dynamic power
dissipation
fi = input frequency in MHz,
fo = output frequency in MHz,
CL = output load capacitance in pF,
10 V
15 V
2
PD = 26000 fi + (fo CL) VDD
VDD = supply voltage in V,
(fo CL) = sum of the outputs.
HEF4094B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 11 — 29 August 2013
8 of 20
HEF4094B
NXP Semiconductors
8-stage shift-and-store register
11. Waveforms
1/f
max
V
I
CP input
V
M
GND
t
W
t
t
PHL
PLH
V
OH
QPn, QS1 output
V
M
V
OL
t
t
PHL
PLH
V
OH
QS2 output
V
M
V
OL
001aaf113
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 7. Clock to outputs propagation delays, and clock pulse width and maximum frequency
Table 9.
Measurement points
Supply voltage
VDD
Input
VM
Output
VM
VX
VY
5 V to 15 V
0.5VDD
0.5VDD
0.1VDD
0.9VDD
V
I
STR input
V
M
GND
t
W
t
t
PHL
PLH
V
OH
QPn output
V
M
V
OL
001aaj058
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 8. Strobe to output propagation delays, and strobe pulse width, set up and hold times
HEF4094B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 11 — 29 August 2013
9 of 20
HEF4094B
NXP Semiconductors
8-stage shift-and-store register
V
I
V
M
OE input
GND
t
PZL
t
PLZ
V
DD
output
V
LOW-to-OFF
OFF-to-LOW
M
V
X
V
OL
t
t
PHZ
PZH
V
OH
V
Y
output
HIGH-to-OFF
OFF-to-HIGH
V
M
GND
outputs
enabled
outputs
disabled
outputs
enabled
001aai545
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 9. 3-state output enable and disable times for OE input
V
I
V
CP input
M
GND
t
t
su
su
t
t
h
h
V
I
V
D input
M
GND
V
OH
V
QPn, QS1, QS2 output
M
V
OL
001aaf115
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 10. Data input data set up and hold times
HEF4094B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 11 — 29 August 2013
10 of 20
HEF4094B
NXP Semiconductors
8-stage shift-and-store register
t
W
V
I
90 %
90 %
negative
pulse
V
V
V
M
M
10 %
10 %
0 V
t
t
r
f
t
t
f
r
V
I
90 %
90 %
positive
pulse
V
M
M
10 %
10 %
0 V
t
W
001aaj781
a. Input waveform
V
EXT
V
DD
R
L
V
V
O
I
G
DUT
R
T
C
L
001aaj915
b. Test circuit
Test data is given in Table 10.
Definitions for test circuit:
DUT = Device Under Test.
CL = load capacitance including jig and probe capacitance.
RL = load resistance.
RT = termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig 11. Test circuit
Table 10. Test data
Supply voltage Input
VEXT
Load
CL
VDD
VI
tr, tf
tPHL, tPLH
open
tPHZ, tPZH
tPLZ, tPZL
RL
5 V to 15 V
VSS or VDD
20 ns
VSS
VDD
50 pF
1 k
HEF4094B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 11 — 29 August 2013
11 of 20
HEF4094B
NXP Semiconductors
8-stage shift-and-store register
12. Application information
Some examples of applications for the HEF4094B are:
• Serial-to-parallel data conversion
• Remote control holding register
DIGITALLY CONTROLLED
EQUIPMENT
DIGITALLY CONTROLLED
DIGITALLY CONTROLLED
EQUIPMENT
EQUIPMENT
(REQUIRES CONTINUOUS
DIGITAL CONTROL)
QP0
QP7
QS2
QP0
QP7
QS2
QP0
QP7
HEF4094B
HEF4094B
HEF4094B
D
D
D
STR
CP
STR
CP
STR
CP
CONTROL
AND
SYNC
CIRCUITRY
data
clock
from remote
control panel
001aae666
Fig 12. Remote control holding register
HEF4094B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 11 — 29 August 2013
12 of 20
HEF4094B
NXP Semiconductors
8-stage shift-and-store register
13. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
b
2
16
9
M
H
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
2
(1)
(1)
Z
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.73
1.30
0.53
0.38
1.25
0.85
0.36
0.23
19.50
18.55
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.1
7.62
0.3
0.254
0.01
0.76
0.068 0.021 0.049 0.014
0.051 0.015 0.033 0.009
0.77
0.73
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.02
0.13
0.03
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
95-01-14
03-02-13
SOT38-4
Fig 13. Package outline SOT38-4 (DIP16)
HEF4094B
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 11 — 29 August 2013
13 of 20
HEF4094B
NXP Semiconductors
8-stage shift-and-store register
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
H
v
M
A
E
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
e
w
M
detail X
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.39
0.014 0.0075 0.38
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.020
0.028
0.012
inches
0.069
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT109-1
076E07
MS-012
Fig 14. Package outline SOT109-1 (SO16)
HEF4094B
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 11 — 29 August 2013
14 of 20
HEF4094B
NXP Semiconductors
8-stage shift-and-store register
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
8
1
detail X
w M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
E
max.
8o
0o
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
7.9
7.6
1.03
0.63
0.9
0.7
1.00
0.55
mm
2
0.25
0.65
1.25
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT338-1
MO-150
Fig 15. Package outline SOT338-1 (SSOP16)
HEF4094B
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 11 — 29 August 2013
15 of 20
HEF4094B
NXP Semiconductors
8-stage shift-and-store register
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
Q
(A )
3
A
2
A
A
1
pin 1 index
θ
L
p
L
1
8
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.40
0.06
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT403-1
MO-153
Fig 16. Package outline SOT403-1 (TSSOP16)
HEF4094B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 11 — 29 August 2013
16 of 20
HEF4094B
NXP Semiconductors
8-stage shift-and-store register
14. Revision history
Table 11. Revision history
Document ID
Release date
20130829
Data sheet status
Change notice
Supersedes
HEF4094B v.11
Modifications:
Product data sheet
-
-
-
HEF4094B v.10
• Table 4: Table note corrected (errata).
20130625 Product data sheet
• added type number HEF4094BTT.
20111116 Product data sheet
HEF4094B v.10
Modifications:
HEF4094B v.9
HEF4094B v.8
HEF4094B v.9
Modifications:
• Table 6: IOH minimum values changed to maximum
HEF4094B v.8
HEF4094B v.7
HEF4094B v.6
HEF4094B v.5
HEF4094B v.4
HEF4094B_CNV v.3
HEF4094B_CNV v.2
20100402
20091216
20091103
20090728
20081030
19950101
19950101
Product data sheet
Product data sheet
Product data sheet
Product data sheet
Product data sheet
Product specification
Product specification
-
-
-
-
-
-
-
HEF4094B v.7
HEF4094B v.6
HEF4094B v.5
HEF4094B v.4
HEF4094B_CNV v.3
HEF4094B_CNV v.2
-
HEF4094B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 11 — 29 August 2013
17 of 20
HEF4094B
NXP Semiconductors
8-stage shift-and-store register
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
15.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
HEF4094B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 11 — 29 August 2013
18 of 20
HEF4094B
NXP Semiconductors
8-stage shift-and-store register
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
HEF4094B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 11 — 29 August 2013
19 of 20
HEF4094B
NXP Semiconductors
8-stage shift-and-store register
17. Contents
1
2
3
4
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
Functional description . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Application information. . . . . . . . . . . . . . . . . . 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17
7
8
9
10
11
12
13
14
15
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
15.1
15.2
15.3
15.4
16
17
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 29 August 2013
Document identifier: HEF4094B
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