HEF4094B_10 [NXP]

8-stage shift-and-store register; 8级移位 - 和 - 存储寄存器
HEF4094B_10
型号: HEF4094B_10
厂家: NXP    NXP
描述:

8-stage shift-and-store register
8级移位 - 和 - 存储寄存器

存储
文件: 总19页 (文件大小:169K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HEF4094B  
8-stage shift-and-store register  
Rev. 08 — 2 April 2010  
Product data sheet  
1. General description  
The HEF4094B is an 8-stage serial shift register. It has a storage latch associated with  
each stage for strobing data from the serial input to parallel buffered 3-state outputs  
QP0 to QP7. The parallel outputs may be connected directly to common bus lines. Data is  
shifted on positive-going clock transitions. The data in each shift register stage is  
transferred to the storage register when the strobe (STR) input is HIGH. Data in the  
storage register appears at the outputs whenever the output enable (OE) signal is HIGH.  
Two serial outputs (QS1 and QS2) are available for cascading a number of HEF4094B  
devices. Serial data is available at QS1 on positive-going clock edges to allow high-speed  
operation in cascaded systems with a fast clock rise time. The same serial data is  
available at QS2 on the next negative going clock edge. This is used for cascading  
HEF4094B devices when the clock has a slow rise time.  
It operates over a recommended VDD power supply range of 3 V to 15 V referenced to VSS  
(usually ground). Unused inputs must be connected to VDD, VSS, or another input. It is  
also suitable for use over the industrial (40 °C to +85 °C) and automotive (40 °C to  
+125 °C) temperature ranges.  
2. Features and benefits  
„ Fully static operation  
„ 5 V, 10 V, and 15 V parametric ratings  
„ Standardized symmetrical output characteristics  
„ Operates across the automotive temperature range 40 °C to +125 °C  
„ Complies with JEDEC standard JESD 13-B  
3. Ordering information  
Table 1.  
Ordering information  
All types operate from 40 °C to +125 °C.  
Type number  
Package  
Name  
Description  
Version  
HEF4094BP  
HEF4094BT  
HEF4094BTS  
DIP16  
plastic dual in-line package; 16 leads (300 mil)  
plastic small outline package; 16 leads; body width 3.9 mm  
plastic shrink small outline package; 16 leads; body width 5.3 mm  
SOT38-4  
SOT109-1  
SOT338-1  
SO16  
SSOP16  
HEF4094B  
NXP Semiconductors  
8-stage shift-and-store register  
4. Functional diagram  
3
1
CP  
STR  
QS1  
QS2  
QP0  
QP1  
QP2  
9
10  
4
D
2
8-STAGE SHIFT  
REGISTER  
QS2  
QS1  
5
10  
9
CP  
3
6
2
D
QP3  
QP4  
QP5  
QP6  
QP7  
7
STR  
8-BIT STORAGE  
REGISTER  
1
14  
13  
12  
11  
OE  
15  
3-STATE OUTPUTS  
OE  
15  
QP0 QP1 QP2 QP3 QP4 QP5 QP6 QP7  
4
5
6
7
14  
13  
12  
11  
001aaf119  
001aaf111  
Fig 1. Functional diagram  
Fig 2. Logic symbol  
STAGE 0  
STAGES 1 TO 6  
STAGE 7  
D
D
Q
D
Q
D
Q
QS1  
CP  
CP  
D
Q
QS2  
FF 0  
FF 7  
CP  
CP  
LE  
LATCH  
D
Q
D
Q
LE  
LE  
LATCH 0  
LATCH 7  
STR  
OE  
001aag799  
QP0  
QP2  
QP4  
QP6  
QP1  
QP3  
QP5  
QP7  
Fig 3. Logic diagram  
HEF4094B_8  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 08 — 2 April 2010  
2 of 19  
HEF4094B  
NXP Semiconductors  
8-stage shift-and-store register  
5. Pinning information  
5.1 Pinning  
HEF4094B  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
STR  
D
V
DD  
OE  
CP  
QP4  
QP5  
QP6  
QP7  
QS2  
QS1  
QP0  
QP1  
QP2  
QP3  
V
SS  
001aae662  
Fig 4. Pin configuration  
5.2 Pin description  
Table 2.  
Symbol  
STR  
Pin description  
Pin  
Description  
strobe input  
data input  
1
D
2
CP  
3
clock input  
QP0 to QP7  
VSS  
4, 5, 6, 7, 14, 13, 12, 11  
parallel output  
8
ground supply voltage  
serial output  
QS1  
9
QS2  
10  
15  
16  
serial output  
OE  
output enable input  
supply voltage  
VDD  
HEF4094B_8  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 08 — 2 April 2010  
3 of 19  
HEF4094B  
NXP Semiconductors  
8-stage shift-and-store register  
6. Functional description  
Table 3.  
Function table[1]  
Inputs  
Parallel outputs  
Serial outputs  
CP  
OE  
L
STR  
X
D
X
X
X
L
QP0  
Z
QPn  
QS1  
Q6S  
NC  
QS2  
NC  
Z
L
X
Z
Z
Q7S  
NC  
H
H
H
H
L
NC  
L
NC  
Q6S  
Q6S  
Q6S  
NC  
H
QPn 1  
QPn 1  
NC  
NC  
H
H
H
H
NC  
H
NC  
Q7S  
[1] At the positive clock edge, the information in the 7th register stage is transferred to the 8th register stage and the QSn outputs.  
H = HIGH voltage level; L = LOW voltage level; X = don’t care;  
= positive-going transition; = negative-going transition;  
Z = HIGH-impedance OFF-state; NC = no change;  
Q6S = the data in register stage 6 before the LOW to HIGH clock transition;  
Q7S = the data in register stage 7 before the HIGH to LOW clock transition.  
CLOCK INPUT  
DATA INPUT  
STROBE INPUT  
OUTPUT ENABLE INPUT  
INTERNAL Q0S (FF 0)  
Z-state  
OUTPUT QP0  
INTERNAL Q6S (FF 6)  
Z-state  
OUTPUT QP6  
SERIAL OUTPUT QS1  
SERIAL OUTPUT QS2  
001aaf117  
Fig 5. Timing diagram  
HEF4094B_8  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 08 — 2 April 2010  
4 of 19  
HEF4094B  
NXP Semiconductors  
8-stage shift-and-store register  
7. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to VSS = 0 V (ground).  
Symbol Parameter  
Conditions  
Min  
Max  
+18  
Unit  
V
VDD  
IIK  
supply voltage  
0.5  
input clamping current  
input voltage  
VI < 0.5 V or VI > VDD + 0.5 V  
VO < 0.5 V or VO > VDD + 0.5 V  
-
±10  
mA  
V
VI  
0.5  
VDD + 0.5  
±10  
IOK  
II/O  
output clamping current  
input/output current  
supply current  
-
mA  
mA  
mA  
°C  
-
±10  
IDD  
Tstg  
Tamb  
Ptot  
-
50  
storage temperature  
ambient temperature  
total power dissipation  
65  
+150  
+125  
750  
40  
°C  
[1]  
[2]  
DIP16  
-
-
-
mW  
mW  
mW  
SO16  
500  
P
power dissipation  
per output  
100  
[1] For DIP16 packages: above Tamb = 70 °C, Ptot derates linearly with 12 mW/K.  
[2] For SO16 packages: above Tamb = 70 °C, Ptot derates linearly with 8 mW/K.  
8. Recommended operating conditions  
Table 5.  
Symbol  
VDD  
Recommended operating conditions  
Parameter  
Conditions  
Min  
Typ  
Max  
15  
Unit  
supply voltage  
3
-
-
-
-
-
-
V
VI  
input voltage  
0
VDD  
+125  
3.75  
0.5  
V
Tamb  
ambient temperature  
input transition rise and fall rate  
in free air  
40  
°C  
Δt/ΔV  
VDD = 5 V  
VDD = 10 V  
VDD = 15 V  
-
-
-
μs/V  
μs/V  
μs/V  
0.08  
HEF4094B_8  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 08 — 2 April 2010  
5 of 19  
HEF4094B  
NXP Semiconductors  
8-stage shift-and-store register  
9. Static characteristics  
Table 6.  
Static characteristics  
VSS = 0 V; VI = VSS or VDD; unless otherwise specified.  
Symbol Parameter  
Conditions  
VDD  
Tamb = 40 °C Tamb = +25 °C Tamb = +85 °C Tamb = +125 °C Unit  
Min  
3.5  
7.0  
11.0  
-
Max  
Min  
3.5  
7.0  
11.0  
-
Max  
Min  
3.5  
7.0  
11.0  
-
Max  
Min  
3.5  
7.0  
11.0  
-
Max  
VIH  
HIGH-level  
input voltage  
|IO| < 1 μA  
|IO| < 1 μA  
|IO| < 1 μA  
|IO| < 1 μA  
5 V  
10 V  
15 V  
5 V  
-
-
-
-
V
-
-
-
-
V
-
-
-
-
V
VIL  
LOW-level  
input voltage  
1.5  
1.5  
1.5  
1.5  
V
10 V  
15 V  
5 V  
-
3.0  
-
3.0  
-
3.0  
-
3.0  
V
-
4.0  
-
4.0  
-
4.0  
-
4.0  
V
VOH  
VOL  
IOH  
HIGH-level  
output voltage  
4.95  
9.95  
14.95  
-
-
4.95  
9.95  
14.95  
-
-
4.95  
9.95  
14.95  
-
-
4.95  
9.95  
14.95  
-
-
V
10 V  
15 V  
5 V  
-
-
-
-
V
-
-
-
-
V
LOW-level  
output voltage  
0.05  
0.05  
0.05  
0.05  
V
10 V  
15 V  
5 V  
-
0.05  
-
0.05  
-
0.05  
-
0.05  
V
-
0.05  
-
0.05  
-
0.05  
-
0.05  
V
HIGH-level  
output current  
VO = 2.5 V  
VO = 4.6 V  
VO = 9.5 V  
VO = 13.5 V  
VO = 0.4 V  
VO = 0.5 V  
VO = 1.5 V  
1.7  
0.64  
1.6  
4.2  
0.64  
1.6  
4.2  
-
-
1.4  
0.5  
1.3  
3.4  
0.5  
1.3  
3.4  
-
-
1.1  
0.36  
0.9  
2.4  
0.36  
0.9  
2.4  
-
-
-
1.1  
0.36  
0.9  
2.4  
0.36  
0.9  
2.4  
-
-
-
mA  
mA  
mA  
mA  
mA  
mA  
mA  
μA  
5 V  
-
-
10 V  
15 V  
5 V  
-
-
-
-
-
-
-
-
-
-
IOL  
LOW-level  
output current  
-
-
10 V  
15 V  
15 V  
-
-
-
-
-
-
-
-
IOZ  
OFF-state  
output current  
QPn output  
is HIGH;  
0.4  
0.4  
12  
12  
VO = 15 V  
II  
input leakage  
current  
15 V  
-
±0.1  
-
±0.1  
-
±1.0  
-
±1.0 μA  
IDD  
supply current all valid input  
combinations;  
5 V  
10 V  
15 V  
-
-
-
-
5
10  
20  
-
-
-
-
-
5
-
-
-
-
150  
300  
600  
-
-
-
-
-
150 μA  
300 μA  
600 μA  
10  
20  
7.5  
IO = 0 A  
CI  
input  
-
pF  
capacitance  
HEF4094B_8  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 08 — 2 April 2010  
6 of 19  
HEF4094B  
NXP Semiconductors  
8-stage shift-and-store register  
10. Dynamic characteristics  
Table 7.  
Dynamic characteristics  
VSS = 0 V; Tamb = 25 °C; for test circuit see Figure 10; unless otherwise specified.  
Symbol Parameter  
Conditions  
VDD  
5 V  
Extrapolation formula  
108 ns + (0.55 ns/pF) CL  
54 ns + (0.23 ns/pF) CL  
42 ns + (0.16 ns/pF) CL  
78 ns + (0.55 ns/pF) CL  
39 ns + (0.23 ns/pF) CL  
32 ns + (0.16 ns/pF) CL  
138 ns + (0.55 ns/pF) CL  
64 ns + (0.23 ns/pF) CL  
47 ns + (0.16 ns/pF) CL  
83 ns + (0.55 ns/pF) CL  
39 ns + (0.23 ns/pF) CL  
27 ns + (0.16 ns/pF) CL  
78 ns + (0.55 ns/pF) CL  
39 ns + (0.23 ns/pF) CL  
32 ns + (0.16 ns/pF) CL  
78 ns + (0.55 ns/pF) CL  
39 ns + (0.23 ns/pF) CL  
32 ns + (0.16 ns/pF) CL  
123 ns + (0.55 ns/pF) CL  
59 ns + (0.23 ns/pF) CL  
47 ns + (0.16 ns/pF) CL  
73 ns + (0.55 ns/pF) CL  
34 ns + (0.23 ns/pF) CL  
27 ns + (0.16 ns/pF) CL  
10 ns + (1.00 ns/pF) CL  
9 ns + (0.42 ns/pF) CL  
6 ns + (0.28 ns/pF) CL  
Min  
-
Typ  
135  
65  
Max  
270  
130  
100  
210  
100  
80  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
[1]  
[1]  
[1]  
tPHL  
HIGH to LOW  
CP to QS1;  
see Figure 6  
propagation delay  
10 V  
15 V  
5 V  
-
-
50  
CP to QS2;  
see Figure 6  
-
105  
50  
10 V  
15 V  
5 V  
-
-
40  
CP to QPn;  
see Figure 6  
-
165  
75  
330  
150  
110  
220  
100  
70  
10 V  
15 V  
5 V  
-
-
55  
STR to QPn;  
see Figure 7  
-
110  
50  
10 V  
15 V  
5 V  
-
-
35  
tPLH  
LOW to HIGH  
CP to QS1;  
see Figure 6  
-
105  
50  
210  
100  
80  
propagation delay,  
10 V  
15 V  
5 V  
-
-
40  
CP to QS2;  
see Figure 6  
-
105  
50  
210  
100  
80  
10 V  
15 V  
5 V  
-
-
40  
CP to QPn;  
see Figure 6  
-
150  
70  
300  
140  
110  
200  
90  
10 V  
15 V  
5 V  
-
-
55  
STR to QPn;  
see Figure 7  
-
100  
45  
10 V  
15 V  
5 V  
-
-
35  
70  
tt  
transition time  
-
60  
120  
60  
10 V  
15 V  
5 V  
-
30  
-
20  
40  
tPZH  
tPZL  
tPHZ  
OFF-state to HIGH  
propagation delay  
OE to QPn;  
see Figure 8  
-
40  
80  
10 V  
15 V  
5 V  
-
25  
50  
-
20  
40  
OFF-state to LOW  
propagation delay  
OE to QPn;  
see Figure 8  
-
40  
80  
10 V  
15 V  
5 V  
-
25  
50  
-
20  
40  
HIGH to OFF-state  
propagation delay  
OE to QPn;  
see Figure 8  
-
75  
150  
80  
10 V  
15 V  
-
40  
-
30  
60  
HEF4094B_8  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 08 — 2 April 2010  
7 of 19  
HEF4094B  
NXP Semiconductors  
8-stage shift-and-store register  
Table 7.  
Dynamic characteristics …continued  
VSS = 0 V; Tamb = 25 °C; for test circuit see Figure 10; unless otherwise specified.  
Symbol Parameter  
Conditions  
VDD  
5 V  
Extrapolation formula  
Min  
-
Typ  
80  
40  
30  
30  
10  
5
Max  
Unit  
ns  
tPLZ  
tsu  
th  
LOW to OFF-state  
propagation delay  
OE to QPn;  
see Figure 8  
160  
10 V  
15 V  
5 V  
-
80  
ns  
-
60  
ns  
set-up time  
D to CP;  
see Figure 9  
60  
20  
15  
+5  
20  
20  
60  
30  
24  
40  
30  
24  
5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ns  
10 V  
15 V  
5 V  
ns  
ns  
hold time  
D to CP;  
see Figure 9  
15  
5
ns  
10 V  
15 V  
ns  
5
ns  
tW  
pulse width  
minimum LOW 5 V  
clock pulse;  
see Figure 6  
15 V  
30  
15  
12  
20  
15  
12  
10  
22  
28  
ns  
10 V  
ns  
ns  
minimumHIGH 5 V  
strobe pulse;  
see Figure 7  
15 V  
ns  
10 V  
ns  
ns  
fmax  
maximum frequency see Figure 6  
5 V  
10 V  
15 V  
MHz  
MHz  
MHz  
11  
14  
[1] The typical values of the propagation delay and transition times are calculated from the extrapolation formulas shown (CL in pF).  
Table 8.  
Dynamic power dissipation  
VSS = 0 V; tr = tf 20 ns; Tamb = 25 °C.  
Symbol  
Parameter  
VDD  
5 V  
Typical formula for PD (μW)  
PD = 2100 × fi + Σ(fo × CL) × VDD  
PD = 9700 × fi + Σ(fo × CL) × VDD  
where:  
2
2
PD  
dynamic power  
dissipation  
fi = input frequency in MHz,  
fo = output frequency in MHz,  
CL = output load capacitance in pF,  
10 V  
15 V  
2
PD = 26000 × fi + Σ(fo × CL) × VDD  
VDD = supply voltage in V,  
Σ(fo × CL) = sum of the outputs.  
HEF4094B_8  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 08 — 2 April 2010  
8 of 19  
HEF4094B  
NXP Semiconductors  
8-stage shift-and-store register  
11. Waveforms  
1/f  
max  
V
I
CP input  
V
M
GND  
t
W
t
t
PHL  
PLH  
V
OH  
QPn, QS1 output  
V
M
V
OL  
t
t
PHL  
PLH  
V
OH  
QS2 output  
V
M
V
OL  
001aaf113  
Measurement points are given in Table 9.  
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.  
Fig 6. Clock to outputs propagation delays, and clock pulse width and maximum frequency  
Table 9.  
Measurement points  
Supply voltage  
VDD  
Input  
VM  
Output  
VM  
VX  
VY  
5 V to 15 V  
0.5VDD  
0.5VDD  
0.1VDD  
0.9VDD  
V
I
STR input  
V
M
GND  
t
W
t
t
PHL  
PLH  
V
OH  
QPn output  
V
M
V
OL  
001aaj058  
Measurement points are given in Table 9.  
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.  
Fig 7. Strobe to output propagation delays, and strobe pulse width, set up and hold times  
HEF4094B_8  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 08 — 2 April 2010  
9 of 19  
HEF4094B  
NXP Semiconductors  
8-stage shift-and-store register  
V
I
V
M
OE input  
GND  
t
PZL  
t
PLZ  
V
DD  
output  
LOW-to-OFF  
OFF-to-LOW  
V
M
V
X
V
OL  
t
t
PHZ  
PZH  
V
OH  
V
Y
output  
HIGH-to-OFF  
OFF-to-HIGH  
V
M
GND  
outputs  
enabled  
outputs  
disabled  
outputs  
enabled  
001aai545  
Measurement points are given in Table 9.  
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.  
Fig 8. 3-state output enable and disable times for OE input  
V
I
V
CP input  
M
GND  
t
t
su  
su  
t
t
h
h
V
I
V
D input  
M
GND  
V
OH  
V
QPn, QS1, QS2 output  
M
V
OL  
001aaf115  
Measurement points are given in Table 9.  
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.  
Fig 9. Data input data set up and hold times  
HEF4094B_8  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 08 — 2 April 2010  
10 of 19  
HEF4094B  
NXP Semiconductors  
8-stage shift-and-store register  
t
W
V
I
90 %  
negative  
pulse  
V
V
V
V
M
M
10 %  
0 V  
t
t
r
f
t
r
t
f
V
I
90 %  
positive  
pulse  
M
M
10 %  
0 V  
t
W
001aaj781  
a. Input waveform  
V
EXT  
R
V
DD  
L
V
V
O
I
G
DUT  
R
C
L
T
001aaj915  
b. Test circuit  
Test data is given in Table 10.  
Definitions for test circuit:  
DUT = Device Under Test.  
CL = load capacitance including jig and probe capacitance.  
RL = load resistance.  
RT = termination resistance should be equal to the output impedance Zo of the pulse generator.  
Fig 10. Test circuit  
Table 10. Test data  
Supply voltage Input  
VEXT  
Load  
CL  
VDD  
VI  
tr, tf  
tPHL, tPLH  
open  
tPHZ, tPZH  
tPLZ, tPZL  
RL  
5 V to 15 V  
VSS or VDD  
20 ns  
VSS  
VDD  
50 pF  
1 kΩ  
HEF4094B_8  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 08 — 2 April 2010  
11 of 19  
HEF4094B  
NXP Semiconductors  
8-stage shift-and-store register  
12. Application information  
Some examples of applications for the HEF4094B are:  
Serial-to-parallel data conversion  
Remote control holding register  
DIGITALLY CONTROLLED  
EQUIPMENT  
DIGITALLY CONTROLLED  
DIGITALLY CONTROLLED  
EQUIPMENT  
EQUIPMENT  
(REQUIRES CONTINUOUS  
DIGITAL CONTROL)  
QP0  
QP7  
QS2  
QP0  
QP7  
QS2  
QP0  
QP7  
HEF4094B  
HEF4094B  
HEF4094B  
D
D
D
STR  
CP  
STR  
CP  
STR  
CP  
CONTROL  
AND  
SYNC  
CIRCUITRY  
data  
clock  
from remote  
control panel  
001aae666  
Fig 11. Remote control holding register  
HEF4094B_8  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 08 — 2 April 2010  
12 of 19  
HEF4094B  
NXP Semiconductors  
8-stage shift-and-store register  
13. Package outline  
DIP16: plastic dual in-line package; 16 leads (300 mil)  
SOT38-4  
D
M
E
A
2
A
A
1
L
c
e
w M  
Z
b
1
(e )  
1
b
b
2
16  
9
M
H
pin 1 index  
E
1
8
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
A
A
A
2
(1)  
(1)  
Z
1
w
UNIT  
mm  
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.  
min.  
max.  
max.  
1.73  
1.30  
0.53  
0.38  
1.25  
0.85  
0.36  
0.23  
19.50  
18.55  
6.48  
6.20  
3.60  
3.05  
8.25  
7.80  
10.0  
8.3  
4.2  
0.51  
3.2  
2.54  
0.1  
7.62  
0.3  
0.254  
0.01  
0.76  
0.068 0.021 0.049 0.014  
0.051 0.015 0.033 0.009  
0.77  
0.73  
0.26  
0.24  
0.14  
0.12  
0.32  
0.31  
0.39  
0.33  
inches  
0.17  
0.02  
0.13  
0.03  
Note  
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
95-01-14  
03-02-13  
SOT38-4  
Fig 12. Package outline SOT38-4 (DIP16)  
HEF4094B_8  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 08 — 2 April 2010  
13 of 19  
HEF4094B  
NXP Semiconductors  
8-stage shift-and-store register  
SO16: plastic small outline package; 16 leads; body width 3.9 mm  
SOT109-1  
D
E
A
X
c
y
H
v
M
A
E
Z
16  
9
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
8
e
w
M
detail X  
b
p
0
2.5  
scale  
5 mm  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
10.0  
9.8  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.27  
0.05  
1.05  
0.041  
1.75  
0.25  
0.01  
0.25  
0.01  
0.25  
0.1  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.39  
0.014 0.0075 0.38  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.020  
0.028  
0.012  
inches  
0.069  
0.01 0.004  
Note  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT109-1  
076E07  
MS-012  
Fig 13. Package outline SOT109-1 (SO16)  
HEF4094B_8  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 08 — 2 April 2010  
14 of 19  
HEF4094B  
NXP Semiconductors  
8-stage shift-and-store register  
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm  
SOT338-1  
D
E
A
X
c
y
H
v
M
A
E
Z
9
16  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
8
1
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
E
max.  
8o  
0o  
0.21  
0.05  
1.80  
1.65  
0.38  
0.25  
0.20  
0.09  
6.4  
6.0  
5.4  
5.2  
7.9  
7.6  
1.03  
0.63  
0.9  
0.7  
1.00  
0.55  
mm  
2
0.25  
0.65  
1.25  
0.2  
0.13  
0.1  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT338-1  
MO-150  
Fig 14. Package outline SOT338-1 (SSOP16)  
HEF4094B_8  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 08 — 2 April 2010  
15 of 19  
HEF4094B  
NXP Semiconductors  
8-stage shift-and-store register  
14. Revision history  
Table 11. Revision history  
Document ID  
HEF4094B_8  
Modifications:  
HEF4094B_7  
Modifications:  
Release date  
20100402  
Data sheet status  
Change notice  
Supersedes  
Product data sheet  
-
HEF4094B_7  
Section 4 “Functional diagram” Logic diagram corrected.  
20091216 Product data sheet  
Section 11 “Waveforms” Figure 10 “Test circuit”: updated.  
-
HEF4094B_6  
Section 11 “Waveforms” Table 10 “Test data” tPHZ and tPZH and tPLZ and tPZL  
values updated.  
HEF4094B_6  
20091103  
20090728  
20081030  
19950101  
19950101  
Product data sheet  
Product data sheet  
Product data sheet  
Product specification  
Product specification  
-
-
-
-
-
HEF4094B_5  
HEF4094B_4  
HEF4094B_CNV_3  
HEF4094B_CNV_2  
-
HEF4094B_5  
HEF4094B_4  
HEF4094B_CNV_3  
HEF4094B_CNV_2  
HEF4094B_8  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 08 — 2 April 2010  
16 of 19  
HEF4094B  
NXP Semiconductors  
8-stage shift-and-store register  
15. Legal information  
15.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
suitable for use in medical, military, aircraft, space or life support equipment,  
15.2 Definitions  
nor in applications where failure or malfunction of an NXP Semiconductors  
product can reasonably be expected to result in personal injury, death or  
severe property or environmental damage. NXP Semiconductors accepts no  
liability for inclusion and/or use of NXP Semiconductors products in such  
equipment or applications and therefore such inclusion and/or use is at the  
customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on a weakness or default in the  
customer application/use or the application/use of customer’s third party  
customer(s) (hereinafter both referred to as “Application”). It is customer’s  
sole responsibility to check whether the NXP Semiconductors product is  
suitable and fit for the Application planned. Customer has to do all necessary  
testing for the Application in order to avoid a default of the Application and the  
product. NXP Semiconductors does not accept any liability in this respect.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
15.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
15.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Suitability for use in automotive applications — This NXP  
Semiconductors product has been qualified for use in automotive  
applications. The product is not designed, authorized or warranted to be  
HEF4094B_8  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 08 — 2 April 2010  
17 of 19  
HEF4094B  
NXP Semiconductors  
8-stage shift-and-store register  
16. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
HEF4094B_8  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 08 — 2 April 2010  
18 of 19  
HEF4094B  
NXP Semiconductors  
8-stage shift-and-store register  
17. Contents  
1
2
3
4
General description. . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 1  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3  
6
Functional description . . . . . . . . . . . . . . . . . . . 4  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Recommended operating conditions. . . . . . . . 5  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Application information. . . . . . . . . . . . . . . . . . 12  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 16  
7
8
9
10  
11  
12  
13  
14  
15  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
15.1  
15.2  
15.3  
15.4  
16  
17  
Contact information. . . . . . . . . . . . . . . . . . . . . 18  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2010.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 2 April 2010  
Document identifier: HEF4094B_8  

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