HT1DC20S30 [NXP]
HITAG 1 stick transponder; HITAG 1棒转发
| 型号： | HT1DC20S30 |
| 厂家： | 
NXP |
| 描述： | HITAG 1 stick transponder |
| 文件： | 总8页 (文件大小：57K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
HT1DC20S30
HITAG 1 stick transponder
Product specification
2001 Sep 24
Supersedes data of 2000 Apr 19
File under Integrated Circuits, IC11
Philips Semiconductors
Product specification
HITAG 1 stick transponder
HT1DC20S30
FEATURES
• Complete identification transponder for use in
contactless applications
• Operating frequency 125 kHz
The transponder acts as a passive device, thus not having
the need for any internal power supply (battery).
• Data transmission and supply energy via RF link, no
internal battery
• Low power EEPROM technology for writing distance
that equals reading distance
It derives power from the magnetic component of the
RF resonant frequency generated by the reader. Data is
transmitted by modulating this resonant frequency.
• Total memory size 2048 bits
The HT1DC20S30 is dedicated for use in secure access
systems where the transponder and the reader have to
identify each other.
• Parts of memory can be write protected by the user
• Effective communication protocol with outstanding data
integrity check
The EEPROM has a capacity of 2048 bits and is
organised in 64 pages. Access is provided either in page
mode or in block mode, where 1 block includes 4 pages.
• Secure mutual authentication function
• Encrypted data transmission
• Anticollision protocol for handling of multiple
Data transmission from the HT1DC20S30 to the reader
uses Manchester or biphase coding and Amplitude Shift
Keying (ASK) modulation. Absorption modulation is used
to transmit data from the transponder to the reader. The
transponder absorbs the magnetic field which hence
modulates the current in the reader antenna.
transponders inside the field of the reader antenna
• Special features:
– User defined write protection
– Unique 32-bit serial number for each transponder
– Encrypted data transmission possible.
Data transmission from the reader to the HT1DC20S30
uses Binary Pulse Length Modulation (BPLM).
GENERAL DESCRIPTION
The anticollision feature of the transponder allows to
operate several transponders simultaneously in the field of
the reader antenna. To use that feature, the reader needs
to have implemented the anticollision protocol and must be
able to detect bit-collisions (e.g. the Philips HTRM800 long
range reader module includes the anticollision protocol.
The HITAG(1) stick transponder HT1DC20S30, based on
the HITAG tag IC, is a high performance transponder for
bi-directional data transmission in full-duplex mode. Data
is stored in the transponder in a non-volatile memory
(EEPROM).
(1) HITAG - is a trademark of Philips Semiconductors
Gratkorn GmbH.
QUICK REFERENCE DATA
SYMBOL
f0
ftrans
PARAMETER
MIN.
120
TYP.
125
MAX.
130
UNIT
kHz
resonant frequency
data transfer rate
transponder to reader
reader to transponder
memory
−
−
4.0
5.2
−
−
kbits/s
kbits/s
M
size
−
−
2048
64
−
−
bits
organization
pages
N
encrypted mutual authentication bits
serial number
−
−
32
32
−
−
bits
bits
secret key
2001 Sep 24
2
Philips Semiconductors
Product specification
HITAG 1 stick transponder
HT1DC20S30
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
HT1DC20S30
PLLMC
plastic leadless module carrier
SOT385-1
BLOCK DIAGRAM
HT1DC20S30
CONTACTLESS INTERFACE
CONTROL LOGIC
RECTIFIER
DATA
VOLTAGE LIMITER
ACQUISITION
POWER-ON
RESET
EEPROM
ACCESS CONTROL
CLOCK
RECOVERY
L
C
CALCULATION UNIT
MODULATOR
DEMODULATOR
EEPROM
TRANSPONDER IC
MGW173
Fig.1 Block diagram.
2001 Sep 24
3
Philips Semiconductors
Product specification
HITAG 1 stick transponder
HT1DC20S30
FUNCTIONAL DESCRIPTION
Related documents
Write command - safety instructions
When writing to page 1 (configuration page) we strongly
recommend to carefully follow the instructions in the
document “HT1 Transponder Family Communication
Protocol Reader - HITAG 1 Transponder”. In particular,
overwriting the reserved bits in configuration page 1 may
lead to reduced reading range of the HT1DC20S30.
For additional information on the functional description of
the HT1DC20S30, in particular the protocol between
reader and transponder please refer to the document “HT1
Transponder Family Communication Protocol Reader -
HITAG 1 Transponder” (document number HT038522).
LIMITING VALUES
All values are in accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
number of erase/write cycles of EEPROM
data retention time of EEPROM
operating temperature
CONDITIONS
amb = 22 °C
MIN.
MAX.
UNIT
N
T
100000
10
−
−
tD(ret)
Toper
Tstg
B
Tamb = 55 °C
years
−40
−55
−
+85
+125
0.2
°C
°C
T
storage temperature
magnetic flux density
note 1
av
vibration acceleration
10 to 2000 Hz; 3 axis;
IEC 68-2-6; Test Fc
−
10
g
as
shock acceleration
3 axis; IEC 68-2-27; Test Ea
−
1500
g
Note
1. Resistivity against magnetic pulses.
ELECTRICAL CHARACTERISTICS
Period time T0 = 8 µs (f0 = 125 kHz); note 1.
SYMBOL
PARAMETER
resonant frequency
bandwidth
CONDITIONS
MIN. TYP. MAX. UNIT
f0
B
120
2.3
50
125
−
130
kHz
kHz
−
BTHR(p-p) magnetic flux density for data
transmission from transponder
(peak-to-peak value)
f0 = 125 kHz
−
400(2) µT
BPRG(p-p) magnetic flux density for programming the f0 = 125 kHz; m = 0.95;
50
50
8
−
−
−
−
400(2) µT
400(2) µT
EEPROM (peak-to-peak value)
tLOW = 8T0
BAUTH(p-p) magnetic flux density for mutual
authentication (peak-to-peak value)
f0 = 125 kHz; m = 0.95;
tLOW = 8T0
BREAD(p-p) field absorption due to the modulation of f0 = 125 kHz;
−
µT
the transponder (peak-to-peak value)
Bfield = 50 µT (p-p)
MIPRG
modulation index (m) of the base station f0 = 125 kHz;
95
100
%
for programming and authentication
Bfield = 50 µT (p-p);
tLOW = 8 T0; see Fig.2
Notes
1. All parameters are characterized with the SCEMTEC test equipment (STM-1) available from SCEMTEC,
Reichshof-Wenrath, Germany. All parameters are guaranteed within the temperature range of Tamb = −40 to +85 °C.
2. Maximum available field strength of the test equipment. Transponder limit has not been characterized.
2001 Sep 24
4
Philips Semiconductors
Product specification
HITAG 1 stick transponder
HT1DC20S30
i
Definitions:
B
– B
max
min
m =
-----------------------------------
B
+ B
B
B
min
max
min
max
m
= B
– B
read
max
min
MGW174
Fig.2 Definition of modulation index.
MECHANICAL CHARACTERISTICS
The transponder is sealed in epoxy resin moulding compound. The designation of the package is SOT385-1
(see Chapter “Package outline”).
PARAMETER
VALUE
Mechanical dimensions
Protection class
12 × 6 × 3 mm
IP67
Casting material
epoxy resin
HT1ICS30
Transponder IC type
2001 Sep 24
5
Philips Semiconductors
Product specification
HITAG 1 stick transponder
HT1DC20S30
PACKAGE OUTLINE
PLLMC: plastic leadless module carrier
SOT385-1
A
D
1
A
2
E
1
α
E
D
1
A
3
A
Cross section
A-A
(not to scale)
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
(1)
(1)
(1)
UNIT
A
A
A
D
D
E
E
1
α
A
1
2
3
1
3.05 1.2
2.90 1.1
2.1
1.9
12.1 5.1
11.9 4.9
6.1
5.9
4.6
4.4
46o
44o
mm
0.165
Note
1. Plastic protrusions of 0.2 mm per side are not included.
REFERENCES
JEDEC
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
EIAJ
01-06-27
SOT385-1
2001 Sep 24
6
Philips Semiconductors
Product specification
HITAG 1 stick transponder
HT1DC20S30
DATA SHEET STATUS
PRODUCT
DATA SHEET STATUS(1)
STATUS(2)
DEFINITIONS
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2001 Sep 24
7
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2001
SCA73
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613502/02/pp8
Date of release: 2001 Sep 24
Document order number: 9397 750 08336
相关型号：
HT1DC20S30/F
IC SPECIALTY TELECOM CIRCUIT, PXSS, 12 X 6 MM, 3 MM HEIGHT, PLASTIC, SOT-385-1, Telecom IC:Other
NXP
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