HT2MOA3S20/E/3 [NXP]

HITAGTM2 Chip Module; HITAGTM2芯片模块


型号：	HT2MOA3S20/E/3
厂家：	NXP
描述：	HITAGTM2 Chip Module HITAGTM2芯片模块
文件：	总22页 (文件大小：162K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

HT2 MOA3 S20

HITAG^TM2 Chip Module

Preliminary Specification

Revision 1.1

August 1997

Specifications of the HT2 MOA3 S20

Rev. 1.1

1997-08-19

Table of Contents

1 Definitions.............................................................................................................................. 3

1.1 Objective of the Specifications ..................................................................................................................... 3

1.2 Definition of the Chip Module ..................................................................................................................... 3

1.3 Use of the Modules ...................................................................................................................................... 3

2 Specifications ......................................................................................................................... 4

2.1 Mechanical Properties ................................................................................................................................. 4

2.2 Materials ..................................................................................................................................................... 4

2.3 Temperature Range .................................................................................................................................... 4

2.4 Storage Conditions ...................................................................................................................................... 5

2.5 Delivery Conditions..................................................................................................................................... 5

2.6 Electrical Specifications............................................................................................................................... 6

3 Drawing of the Chip Module HT2 MOA3 S20..................................................................... 7

3.1 Drawing of the Reel..................................................................................................................................... 7

3.2 Module outline suggestion ........................................................................................................................... 8

3.3 Splicing Specification.................................................................................................................................. 9

4 Coil Specifications................................................................................................................ 10

5 Functional Description of HITAG 2 ................................................................................... 12

5.1 Memory Organization................................................................................................................................ 12

5.2 Operation Modes and Configuration.......................................................................................................... 13

5.2.1 Modes of Operation............................................................................................................................ 13

5.2.2 Status Flow ........................................................................................................................................ 14

5.2.3 Configuration..................................................................................................................................... 15

5.3 Configuration of Delivered HITAG 2 Transponders................................................................................... 16

5.4 Definition of Passwords and Keys.............................................................................................................. 17

6 Quality Inspection ............................................................................................................... 18

7 Characterisation and Test of the Final Transponder......................................................... 19

7.1 Characterisation of the Transponder .......................................................................................................... 19

7.2 Final Test of the Transponder.................................................................................................................... 19

8 Ordering Information.......................................................................................................... 20

HITAG^TMis a trademark of Philips Electronics N.V.

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Specifications of the HT2 MOA3 S20

Rev. 1.1

1997-08-19

1 Definitions

1.1 Objective of the Specifications

This specification lists the parameters to be fulfilled by the HITAG 2 chip module

HT2 MOA3 S20 for contactless smart cards or similar transponders (as e.g. discs).

1.2 Definition of the Chip Module

A chip module is an electronically packaged chip covered with a globe top cap. The

HT2 MOA3 S20 is above all used as card module, i.e. for further lamination into contactless

smart cards according to ISO 10536.1.

So the HITAG 2 chip module HT2 MOA3 S20 is best suited for customers that do not want to

spend time with micro assembly and therefore start - e.g. ISO card production - with the

HITAG 2 chip module.

1.3 Use of the Modules

The HITAG 2 modules are designed to be connected to a coil and then to be further processed by

packaging into a transponder (e.g. lamination into an ISO smart card). Specific processing

information for the coil-module connection and packaging is given in the specification.

For production of contactless chip cards it is recommended to prepunch card foils to create a

recess for the chip module in the card body.

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Specifications of the HT2 MOA3 S20

Rev. 1.1

1997-08-19

2 Specifications

2.1 Mechanical Properties

Width

7.55 mm

(Proposed Punching Outline)

Length

11.75 mm

see also drawing in chapter 3

(Proposed Punching Outline)

Overall Thickness

Film Thickness

0.45 mm ± 0.03 mm

0.16 mm ± 0.005 mm

1.9 x 3.5 mm

Bondpad Size for

Suitable for Welding/Soldering/

Conductive Gluing

Transponder Coil / Module

Interconnection

2.2 Materials

Tape

110 µm

35 µm

Ni / Au

Glass epoxy

ED copper

Copper Plating

Bond Plating

Suitable for Al and Au wire

bonding

Backside Plating

Glob Top

Ni / Au

Filled Epoxy

Thermal curing

2.3 Temperature Range

Operating

-25°C to +85°C

For packed transponder,

depending on type of package

Processing

150°C for 30 minutes

at a standard lamination

pressure for contactless smart

card plastic materials (e.g. PVC,

PET, ...)

Welding Parameters

Soldering Parameters

max. 25 ms @ 500 °C

max. 3 s @ 390 °C

on bond pads

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Specifications of the HT2 MOA3 S20

Rev. 1.1

1997-08-19

2.4 Storage Conditions

Temperature

Relative Humidity

Duration

15 - 30 °C

40 - 70 %

1 year

2.5 Delivery Conditions

Delivery Identification

Date of ready for shipment, reel numbers, total quantity of good

modules with the detail of good modules per reel, order number,

product type, no supplier identification on reels, bags and boxes.

approx. 15.000 to 20.000

Chip modules on reel

Types of Delivery

pcs. per reel,

tape width super 35 mm,

pitch 9,5 mm, 2 rows

single chip modules (bulk goods)

500 pcs . per bag

Packing and Transport According to documentation

"Packing Method Modules (reel)"

Order-No. 3322 845 04881

"Packing Method Modules (singulated)"

Bad Module Marking

All bad modules (mechanical and

electrical faults) must be punched by

reject hole for customer

see drawings chapter 3

Bad positions (reel): <20%

Splicing Specifications Tape material: adhes. tape 15,5 +/- 0,7 see drawings chapter 3

mm, thermal resistance at

<190°C by < 100 cN tractive power and

< 30 sec. duration.

Labeling

Identification label on the reel and on

carton bag:

- Product type

- Number of the reel

- Total number of positions

- Number of good positions

- Date of sealing (to be checked)

- Two batches per reel only

- Batch number indication (only coded,

to be checked)

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Specifications of the HT2 MOA3 S20

Rev. 1.1

1997-08-19

2.6 Electrical Specifications

Symbol min

typ

max

Comment / Conditions

Absolute Maximum Ratings

Junction Temperature

Input Peak Current

Latch up Current

ESD

T_J

-55°C

140°C

30 mA

I_INpeak

100 mA

2 kV

MIL-STD 883D, Method 3023

MIL-STD 883D, Method 3015.7,

Human Body

Operating Range

Temperature

T_A

-40°C

85°C

≤

R_{ThJunctionAmbient}30 K/W @

I_INpeak= 30 mA

Input Read Only Threshold

V_IN,RO

2,8 V_p3,9 V_pstart modulation in read only

modes

Voltage ¹⁾

Input Threshold Voltage ¹⁾

V_IN,TH

V_IN,RD

V_IN,WR

3,1 V_p4,2 V_pstart modulation after SETCC

3,5 V_p4,5 V_pread E²PROM

Input Read Voltage ¹⁾

Input Write Voltage ¹⁾

3,7 V_p4,7 V_pwrite E²PROM

Demodulator

Range ³⁾

V_{DEM_R}

2,0 V_p

4,0 V_pV_INHigh- V_INLow@ V_INHigh= 5,0 V_p

T₀=8 µs, T_MOD=6*T₀

Modulator

R_MOD linear ³⁾

Ω

≤

R_MODL

4,5 k

V_INLow2,0 V_p

R_MOD nonlinear ³⁾

Resonance Capacitor ³⁾

≥

R_MODNL

3,6 k

V_INLow2,0 V_p

C_ResInit

189 pF

210 pF 231 pF V_IN= 4,0 V_p

EEPROM

Write Current ⁴⁾

I_W

I_R

25 µA

9 µA

V_DD= 2,8 V

@ 55°C

Read Current ⁴⁾

Data Retention

Write Endurance

Years

Cycles

100.000

V_IN= V_IN1− V_IN2... voltage between connection pads

V_INHigh

V_INLow

T_MOD

input voltage before modulation

input voltage during modulation

duration of the modulation

@ R = 10 Ω resistance of measurement equipment

tested on silicon level

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Specifications of the HT2 MOA3 S20

Rev. 1.1

1997-08-19

3 Drawing of the Chip Module HT2 MOA3 S20

3.1 Drawing of the Reel

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Specifications of the HT2 MOA3 S20

Rev. 1.1

1997-08-19

3.2 Module outline suggestion

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Specifications of the HT2 MOA3 S20

Rev. 1.1

1997-08-19

3.3 Splicing Specification

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Specifications of the HT2 MOA3 S20

Rev. 1.1

1997-08-19

4 Coil Specifications

The HITAG 2 chip module has to be connected to a coil whose parameters are briefly described

in the following.

Equivalent circuit of the transponder

Xpc

Rpc

Cchip

Rchip

U_c

...

voltage at the connection pads

resonant frequency of the transponder

f_res

...

X_pc

R_pc

C_p

parallel reactance of the coil (f = 125 kHz)

parallel resistance of the coil (f = 125 kHz)

parasitic capacitance of the package

capacitance of the chip (U_c> 4 Vpp)

resistance of the chip

C_chip

R_chip

f_resc

L_pc

C_chip

R_pc

f_resc

self resonant frequency of the coil

X_pc/2πf (f = 125 kHz)

7.72 mH ± x % (C_p= 0, x depends on the coil production process)

210 pF ± 10 %

45 k

750 kHz

Note: The parasitic capacitance of the package (C_p) must be considered.

res

= 125 kHz

L_pc=

)

2π (C^chip+ C ).L^pc

2πf

(

+ C_p

chip

(

)

res

Typical values for C_p

hot laminated cards: C_p= 1.5 pF

moulded tags:

C_p= 6.0 pF

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Page 10 of 22

Specifications of the HT2 MOA3 S20

Rev. 1.1

1997-08-19

For a rough estimation ( ± 10 %) of the number of coil windings following formula can be used.

It is assumed that the winding is done in circular form.

1 ,8 5

2 U ln (

)

... number of windings

... inductance [nH]

... average coil circumference [cm]

... copper diameter [mm]

... average coil circumference [mm]

For fine tuning a measurement of the inductance and an according adjustment of the number of

windings is necessary. This process always needs some iterations.

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Specifications of the HT2 MOA3 S20

Rev. 1.1

1997-08-19

5 Functional Description of HITAG 2

5.1 Memory Organization

The memory of the transponder consists of 256 bits EEPROM memory and is organized in 8

pages with 32 bits each.

Depending on the operation mode the EEPROM is organized as described in the following.

Crypto Mode:

Page

Content

Serial Number

32 bit "KEY LOW"

16 bit " KEY HIGH", 16 bit reserved

8 bit Configuration, 24 Bit Password TAG

read/write page

Password Mode:

Page

Content

Serial Number

Password RWD

reserved

8 bit Configuration, 24 bit Password TAG

read/write page

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Specifications of the HT2 MOA3 S20

Rev. 1.1

1997-08-19

5.2 Operation Modes and Configuration

With the Configuration Byte the operation mode and the access rights to the memory can be

selected. During Power-Up of the transponder the Configuration Byte is read from the

transponder’s EEPROM.

If you change the configuration, keys or passwords, you have to place the transponder

directly on the antenna or hold it directly to it (0-distance)! In order to avoid any errors

do not move the transponder during this write process and be sure that you are in a safe

environment without electrical noise.

5.2.1 Modes of Operation

The HITAG 2 can be operated in several modes.

Crypto Mode:

Mode for writing or reading the transponder with encrypted data transmission.

Password Mode:

Mode for writing or reading the transponder with plain data transmission.

A password check is performed.

Public Mode A (Manchester):

Read only mode emulating Philips Semiconductors´ MIRO transponders resp. µEM H400x

transponders.

The 64 bits of the user Pages 4 and 5 are cyclically transmitted to the read/write device.

Public Mode B (Biphase):

Read only mode according to ISO standards 11784 and 11785 for animal identification.

The 128 bits of the user Pages 4 to 7 are cyclically transmitted to the read/write device.

Public Mode C (Biphase):

Read only mode emulating the read operation of the PCF793X (with a slightly different Program

Mode Check).

In the Public Mode C the 128 bits of the user Pages 4 to 7 are cyclically transmitted to the

read/write device.

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Specifications of the HT2 MOA3 S20

Rev. 1.1

1997-08-19

5.2.2 Status Flow

After entering the RF-field the transponder waits for a command to start the authentication.

After issuing this command the mutual authentication takes place, followed by read- and write

commands.

In password mode the data transfer occurs plain, in crypto mode data are encrypted.

The halt mode can be entered for muting a transponder.

If the transponder is configured in one of the public modes, these modes are entered automatically

after a certain waiting time and data pages are sent cyclically to the read/write device.

By issuing the command to start the authentication during the waiting time also public mode

transponders can be brought into the authorized state.

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Specifications of the HT2 MOA3 S20

Rev. 1.1

1997-08-19

5.2.3 Configuration

The Configuration Byte is represented by the first 8 bits of Page 3 of the transponder memory.

Configuration Byte:

0: Manchester Code

1: Biphase Code

Bit 2 Bit1

Version

Coding

biphase

manchester

Coding in

HITAG 2-Operation

depending on bit 0

Public Mode

depending on bit 0

Public Mode C biphase

HITAG 2 depending on bit 0

depending on bit 0

0: password mode

1: crypto mode

0: PAGE 6 and 7 read/write

1: PAGE 6 and 7 read only

0: PAGE 4 and 5 read/write

1: PAGE 4 and 5 read only

THE SETTING OF THIS BIT IS

0: PAGE 3 read/write

OTP !

fixed

1: PAGE 3 read only; Configuration Byte and Password TAG

OTP !

THE SETTING OF THIS BIT IS

0: PAGE 1 and 2 read/write

1: PAGE 1 no read/no write

PAGE 2 read only (when transponder is in password mode)

PAGE 2 no read/no write (when transponder is in crypto mode)

Configuration Byte / Bit 6:

Bit 6 = ‘0’: Page 3 is read/write.

Bit 6 = ‘1’: Page 3 can only be read. This process is irreversible !

ATTENTION: Do not set Bit 6 of the Configuration Byte to ‘1’ before having written the

final data into Page 3 (including the Configuration Byte and Password TAG) of the

transponder.

Configuration Byte / Bit 7:

Bit 7 = ‘0’: Pages 1 and 2 are read/write.

Bit 7 = ‘1’: Pages 1 and 2 are locked against writing. This process is irreversible !

ATTENTION: Do not set Bit 7 of the Configuration Byte to ‘1’ before having written the

final data into Pages 1 and 2 of the transponder.

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Specifications of the HT2 MOA3 S20

Rev. 1.1

1997-08-19

Standard values for the Configuration Byte:

Password Mode:

Crypto Mode:

Public Mode A:

Public Mode B:

Public Mode C:

0x06

0x0E

0x02

0x00

0x04

5.3 Configuration of Delivered HITAG 2 Transponders

HITAG 2 transponders are delivered with the following configuration by Philips Semiconductors:

Unique Serial Number:

Serial Number:

Read Only

fixed

Configuration Byte:

0x06:

Password Mode (Manchester Code)

Page 6 and 7 read/write

Page 4 and 5 read/write

Page 3 read/write

can be changed

Page 1 and 2 read/write

Values for Transport Passwords, Transport Keys:

Password RWD: 0x4D494B52

Password TAG: 0xAA4854

(= ″MIKR″)

Key Low:

Key High:

0x4D494B52

0x4F4E

(= ″MIKR″)

(= ″ON″)

RECOMMENDATION:

Before delivering transponders to end users, Pages 1 to 3 should be locked (set Configuration

Byte / Bit 6 to ‘1’ for Page 3 and set Configuration Byte / Bit 7 to ‘1’ for Pages 1 and 2).

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Specifications of the HT2 MOA3 S20

Rev. 1.1

1997-08-19

5.4 Definition of Passwords and Keys

Keys are cryptographic codes, which determine data encryption during data transfer between

read/write device and transponder. They are used to select a HITAG 2 transponder in Crypto

Mode. The 16 bit KEY HIGH and 32 bit KEY LOW form one 48 bit key which has to be

identical on both the transponder and the read/write device.

Passwords are needed to select a HITAG 2 transponder in Password Mode. There is one pair of

passwords (Password TAG, Password RWD) which has to be identical both on the transponder

and the read/write device.

Password TAG:

Password that the transponder sends to the read/write device and which

may be verified by the latter (depending on the configuration of the

read/write device).

Password RWD:

Password that the read/write device sends to the transponder and which is

checked for identity by the latter.

It is important that the following values are in accordance with each other, i.e. the respective data

on the read/write device and on the transponder have to be identical pairs.

HITAG 2 in Password mode:

on the

read/write

device

on the

transponder

Password RWD

as an option (depending on the configuration of the read/write device):

Password TAG

HITAG 2 in Crypto mode:

on the

read/write

device

on the

transponder

KEY LOW

KEY HIGH

KEY LOW

KEY HIGH

as an option (depending on the configuration of the read/write device):

Password TAG Password TAG

The passwords and keys are predefined by Philips Semiconductors by means of defined Transport

Passwords and a Transport Key. They can be written to, which means that they can be changed

(see also Chapter “Configuration of Delivered HITAG 2 Transponders“).

ATTENTION: Passwords and Keys only can be changed if their current values are known!

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Specifications of the HT2 MOA3 S20

Rev. 1.1

1997-08-19

6 Quality Inspection

Quality inspection is performed with statistical quality control according to ISO 2859 part 1, with

AQL1.0.

Optical Properties

scratches,

according to the reference sample

encapsulation failures, catalogue

gold discolouration,

delamination

Geometrical Properies width

length

measured with gauge

overall thickness

measured with micrometer at the center of

the transfer mould cap

Electrical Properties

Shipment Quantity

Packing and Labeling

operation

basic read/write operations

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Specifications of the HT2 MOA3 S20

Rev. 1.1

1997-08-19

7 Characterisation and Test of the Final Transponder

7.1 Characterisation of the Transponder

The parameters recommended to be characterised for the transponder are:

Parameter

Comment

Resonant frequency

f_res

Transponder does not modulate

Resonant frequency @ T_amb= 22°C, @ B_TH

Threshold value

B_TH

Start of modulation

Threshold value for READ B_RD

Threshold value for WRITE B_WR

Command READ_PAGE OK

Command WRITE_PAGE OK

For the measurement of these parameters we recommend to use the test equipment available from

SCEMTEC, Marienheide-Rodt, Germany (Transponder Measurement System STM-1).

This device also supports functional testing (besides parameter testing). Therefore it can also be

used as production test equipment for the final transponder test. For further information please

contact Scemtec GmbH.

7.2 Final Test of the Transponder

In addition to the equipment described in the previous chapter Philips Semiconductors offers a

device for a final functional test of transponders, the HITAG^TMTest System HT OT490.

Parameter tests are not supportet by this device.

Basic flow for production and test:

1. Assembly of transponders

2. Functional test and final test of the EEPROM

Since the Keys and Logdata are changed during final test the Configuration and

personalization must take place after the final test. The final test is disabled (not reversible)

by setting the Tag-test mode bit to 0.

For the final test of transponders we recommend to use the

HITAG^TMTest System HT OT490 of Philips Semiconductors or the

Transponder Measurement System STM-1 of Scemtec.

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Specifications of the HT2 MOA3 S20

Rev. 1.1

1997-08-19

8 Ordering Information

Type Name

Description

Ordering Number

9352 600 62118

9352 602 19122

HT2 MOA3 S20/E/3 HITAG 2 S20 Chip Module, reel

HT2 MOA3 S20/E/1 HITAG 2 S20 Chip Module, bulk

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Page 20 of 22

Specifications of the HT2 MOA3 S20

Definitions

Rev. 1.1

1997-08-19

Data sheet status

Objective specification This data sheet conta ins target or goal specifications for product deve lopment.

Preliminary specification This data sheet conta ins preliminary data; supp lementary data may be

published later.

Product spec ification

This data sheet conta ins final product spec ifications.

Limiting values

Limiting values given are in acco rdance with the Abso lute Maximum Rating Syste m (IEC 134).

Stress above one o r more of the limiting values may cause pe rmanent da mage to the dev ice.

These are stress ratings on ly and ope ration of the dev ice at these o r at any othe r cond itions

above those g iven in the Characteristics sect ion of the spec ification is not implied. Exposu re to

limiting values for extended pe riods may affect dev ice rieliltiya.b

Application information

Where application information is given, it is advisory and does not form part of the spec ification.

Life support applications

These products are not designed for use in life support appliances, devices, or systems where

malfunction of these products can reasonably be expected to result in personal injury. Philips

Semiconductors´ customers using or selling these products for use in such applications do so on

their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from

such improper use or sale.

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Page 21 of 22

Philips Semiconductors - a worldwide company

Argentina: see South America

Australia: 34 Waterloo Road, NORTHRYDE, NSW 2113,

Tel. +612 9805 4455, Fax. +612 9805 4466

Austria: Computerstraße 6, A-1101 WIEN, P.O.Box 213,

Tel. +431 60 101, Fax. +431 30 101 1210

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. +3140 27 82785, Fax +3140 27 88399

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. +649 849 4160, Fax. +649 849 7811

Norway: Box 1, Manglerud 0612, OSLO,

Belarus: Hotel Minsk Business Centre, Bld. 3, r.1211, Volodarski Str. 6,

220050 MINSK, Tel. +375172 200 733, Fax. +375172 200 773

Belgium: see The Netherlands

Brazil: see South America

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA

Tel. +4722 74 8000, Fax. +4722 74 8341

Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O.Box 2108 MCC, MAKATI,

Metro MANILA, Tel. +632 816 6380, Fax. +632 817 3474

Poland: Ul. Lukiska 10, PL 04-123 WARSZWA,

Tel. +4822 612 2831, Fax. +4822 612 2327

Tel. +3592 689 211, Fax. +3592 689 102

Portugal: see Spain

Canada: Philips Semiconductors/Components,

Tel. +1800 234 7381

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,

72 Tat Chee Avenue, Kowloon Tong, HONG KONG,

Tel. +85223 19 7888, Fax. +85223 19 7700

Romania: see Italy

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. +7095 247 9145, Fax. +7095 247 9144

Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. +65350 2538, Fax. +65251 6500

Colombia: see South America

Slovakia: see Austria

Czech Republic: see Austria

Slovenia: see Italy

Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. +4532 88 2636, Fax. +4531 57 1949

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. +3589 61 5800, Fax. +3589 61 580/xxx

South Africa: S.A. Philips Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O.Box 7430 Johannesburg 2000,

Tel. +2711 470 5911, Fax. +2711 470 5494

South America: Al. Vicente Pinzon, 173 - 6th floor,

04547-130 Sao Paulo, SAO PAULO - SP, Brazil,

Tel. +5511 821 2333, Fax. +5511 829 1849

Spain: Balmes 22, 08007 BARCELONA,

Tel. +343 301 6312, Fax. +343 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

Tel. +468 632 2000, Fax. +468 632 2745

Switzerland: Allmendstraße 140, CH-8027 ZÜRICH,

Tel. +411 488 2686, Fax. +411 481 7730

France: 4 Rue du Port-aux-Vins, BP 317, 92156 SURESNES Cedex,

Tel. +331 40 99 6161, Fax. +331 40 99 6427

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. +4940 23 53 60, Fax. +4940 23 536 300

Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. +301 4894 339/239, Fax. +301 4814 240

Hungary: see Austria

India: Philips INDIA Ltd., Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400018, Tel. +9122 4938 541, Fax. +9122 4938 722

Indonesia: see Singapore

Taiwan: Philips Taiwan Ltd., 2330F, 66,

Chung Hsiao West Road, Sec. 1, P.O.Box 22978,

TAIPEI 100, Tel. +8862 382 4443, Fax. +8862 382 4444

Thailand: Philips Electronics (Thailand) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,

Tel. +662 745 4090, Fax. +662 398 0793

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +3531 7640 000, Fax. +3531 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St., TEL AVIV 61180,

Tel. +9723 645 0444, Fax. +9723 649 1007

Italy: Philips Semiconductors, Piazza IV Novembre 3,

20124 MILANO, Tel. +392 6752 2531, Fax. +392 6752 2557

Japan: Philips Bldg. 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. +813 3740 5130,Fax. +813 3740 5077

Korea: Philips House, 260-199, Itaewon-dong, Yonsan-ku, SEOUL,

Tel. +822 709 1412, Fax. +822 709 1415

Turkey: Talapasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,

Tel. +90212 279 2770, Fax. +90212 282 6707

Ukraine: Philips Ukraine, 4 Patrice Lumumba Str., Building B, Floor 7,

252042 KIEV, Tel. +38044 264 2776, Fax. +38044 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

MIDDLESEX UM3 5BX, Tel. +44181 730 5000, Fax. +44181 754 8421

United States: 811 Argues Avenue, SUNNYVALE, CA94088-3409,

Tel. +1800 234 7381

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, Selangor,

Tel. +60 3750 5214, Fax. +603 757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, Texas 79905,

Tel. +9 5800 234 7381

Uruguay: see South America

Vietnam: see Singapore

Middle East: see Italy

Yugoslavia: Philips, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. +38111 625 344, Fax. +38111 635 777

Philips Semiconductors, Mikron-Weg 1, A-8101 Gratkorn, Austria Fax: +43 / 3124 / 299 - 270

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,

Internet: http://www.semiconductors.philips.com

Building BE-p, P.O.Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax: +3140 27 24825

SCB52

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HT2MOA3S20/E/3 [NXP]

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