HTRC11001 [NXP]
HITAG reader chip; HITAG阅读器芯片
| 型号： | HTRC11001 |
| 厂家： | 
NXP |
| 描述： | HITAG reader chip |
| 文件： | 总20页 (文件大小：95K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
HTRC11001T
HITAG reader chip
Product specification
2001 Nov 23
Supersedes data of 1999 Jan 01
File under Integrated Circuits, IC11
Philips Semiconductors
Product specification
HITAG reader chip
HTRC11001T
CONTENTS
13
PACKAGE OUTLINE
SOLDERING
14
1
2
3
4
5
6
7
8
FEATURES
14.1
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
APPLICATIONS
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAM
14.2
14.3
14.4
14.5
Suitability of surface mount IC packages for
wave and reflow soldering methods
PINNING
15
16
17
DATA SHEET STATUS
DEFINITIONS
FUNCTIONAL DESCRIPTION
8.1
Power supply
DISCLAIMERS
8.2
Antenna drivers
8.3
Diagnosis
8.4
8.5
8.6
8.7
Oscillator with programmable divider
Adaptive sampling time demodulator
Idle and Power-down mode
Serial interface
8.7.1
8.7.2
8.8
Communication protocol
Glitch filter
Commands
8.8.1
8.8.2
8.8.3
8.8.4
8.8.5
8.8.6
8.8.7
8.8.8
Command READ_TAG
Command WRITE_TAG_N
Command WRITE_TAG
Command READ_PHASE
Command SET_SAMPLING_TIME
Command GET_SAMPLING_TIME
Command SET_CONFIG_PAGE
Command GET_CONFIG_PAGE
9
LIMITING VALUES
10
11
12
DC CHARACTERISTICS
AC CHARACTERISTICS
APPLICATION INFORMATION
2001 Nov 23
2
Philips Semiconductors
Product specification
HITAG reader chip
HTRC11001T
1
FEATURES
• Combines all analog RFID reader hardware in one
single chip
• Optimized for HITAG transponder family
The receiver parameters (gain factors and filter cut-off
frequencies) can be optimized to system and transponder
requirements. The HTRC11001T is designed for easy
integration into RF identification readers.
• Robust antenna coil power driver stage with modulator
• High performance adaptive sampling time AM/PM
demodulator (patent pending)
• Read and write function
State-of-the-art technology allows almost complete
integration of the necessary building blocks. A powerful
antenna demodulator and driver, together with a low-noise
adaptive sampling time demodulator, a programmable
filter, amplifier and digitizer, build the complete transceiver
unit, required to design high-performance readers.
• On-chip clock oscillator
• Antenna rupture and short circuit detection
• Low power consumption
• Very low power standby mode
• Low external component count
• Small package SO14.
A three-pin microcontroller interface is employed for
programming the HTRC11001T as well as for the
bidirectional communication with the transponders. The
three-wire interface can be changed into a two-wire
interface by connecting the data input and the data output.
2
APPLICATIONS
• RFID systems.
Tolerance dependent zero amplitude modulation will
cause severe problems in envelope detector systems,
resulting in the need of very low tolerance reader
antennas. These problems are solved by the new Adaptive
Sampling Time (AST) technique.
3
GENERAL DESCRIPTION
HITAG(1) is the family name of the reader chip
HTRC11001T to use with transponders which are based
on the HITAG tag ICs (HT1ICS3002x or HT2ICS2002x).
(1) HITAG - is a trademark of Philips Semiconductors
Gratkorn GmbH.
4
QUICK REFERENCE DATA
SYMBOL
VDD
PARAMETER
CONDITIONS
MIN.
4.5
TYP.
5.0
MAX.
5.5
UNIT
supply voltage
V
fclk
clock frequency
programmable
4
−
16
MHz
kHz
mA
°C
fres
antenna resonant frequency
−
125
−
−
Iant(p)
Tamb
antenna driver output current (peak value) continuous
ambient temperature
−
200
+85
−40
−
5
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
HTRC11001T
SO14
plastic small outlet package; 14 leads; body width 3.9 mm
SOT108-1
2001 Nov 23
3
Philips Semiconductors
Product specification
HITAG reader chip
HTRC11001T
6
BLOCK DIAGRAM
V
DD
3
6
4
2
TX1
TX2
XTAL1
ANTENNA
DRIVERS
MODULATOR
OSCILLATOR
7
XTAL2
CONTROL
UNIT
8
SCLK
BANDPASS FILTER
AMPLIFIER
14
9
SYNCHRONOUS
DEMODULATOR
SERIAL
INTERFACE
RX
DIN
10
DOUT
DYNAMIC CONTROL
DIGITIZER
PHASE
MEASUREMENT
HTRC11001T
CONTROL
REGISTER
13
12
1
5
11
MGW265
QGND
CEXT
V
MODE
n.c.
SS
Fig.1 Block diagram.
2001 Nov 23
4
Philips Semiconductors
Product specification
HITAG reader chip
HTRC11001T
7
PINNING
SYMBOL
PIN
DESCRIPTION
VSS
1
2
ground supply
TX2
antenna driver output 2
supply voltage (5 V stabilized)
antenna driver output 1
VDD
3
TX1
4
MODE
XTAL1
XTAL2
SCLK
DIN
5
control input to enable filtering of serial clock and data input; for active antenna applications
oscillator input 1
6
7
oscillator input 2
8
serial clock input of microcontroller interface
serial data input of microcontroller interface
serial data output of microcontroller interface
not connected
9
DOUT
n.c.
10
11
12
13
14
CEXT
QGND
RX
high-pass filter coupling capacitor connection
internal analog virtual ground capacitor connection
demodulator input
handbook, halfpage
V
1
2
3
4
5
6
7
14
13
12
11
10
9
RX
SS
TX2
QGND
CEXT
n.c.
V
DD
TX1
HTRC11001T
MODE
XTAL1
XTAL2
DOUT
DIN
8
SCLK
MGW266
Fig.2 Pin configuration.
2001 Nov 23
5
Philips Semiconductors
Product specification
HITAG reader chip
HTRC11001T
8
FUNCTIONAL DESCRIPTION
Power supply
8.5
Adaptive sampling time demodulator
8.1
The demodulator senses the absorption modulation
applied by a transponder when inserted into the field. The
signal is picked up at the antenna tap point between
La and Ca. It is divided by Rv and the internal resistor Rint
to a level on pin RX below 8 V (peak value) with respect to
pin QGND (see Fig.4). Internally the signal is filtered with
a second-order low-pass filter.
The HTRC11001T works with an external 5 V ±10% power
supply at pin VDD. The maximum DC current is
2
π
10 mA +
× Iant(p) = 137 mA.
--
For optimum performance, the power supply connection
should be bypassed to ground with a 100 nF capacitor
close to the chip.
The antenna current and therefore the tap voltage is
modulated by the transponder in amplitude and/or phase.
This signal is fed into a synchronous demodulator
recovering the baseband signal. The amplification and the
bandpass filter edge frequencies of the demodulator can
be adapted to different transponders via settings in the
configuration pages (see Table 3).
8.2
Antenna drivers
The drivers deliver a square shaped voltage to the series
resonant antenna circuit (see Fig.4). Due to the full bridge
configuration of the drivers the output voltage Vant(p-p) is
approximately 10 V, corresponding to Vant(p) = 5 V.
The current flowing through the antenna is sine shaped
and the peak and RMS values are approximately:
The phase between the driver excitation signal and the
antenna tap voltage depends on the antenna tuning. With
optimum tuning, the phase of the antenna tap voltage is
90° off the antenna driver signal. Detuning of the antenna
resonant circuit results in a change of this phase
V ant(p)
4
π
I ant(p)
=
×
-- ---------------
Rant
relationship. The built-in phase measurement unit allows
the measurement of this phase relationship with a
1
1
I ant(rms)
=
× I
------
ant(p)
resolution of
× 360° = 5.625° . This can be used to
------
2
64
compute a sampling time that compensates the detuning
of the reader antenna.
8.3
Diagnosis
In order to detect an antenna short-circuit or open-circuit
the antenna tap voltage is monitored.
The phase measurement procedure can be carried out:
• Once before the first communication starts, if the
position of the transponder does not change with
respect to the reader antenna
An antenna fail condition is reported in the status
bit ANTFAIL (see Table 5) if the antenna tap voltage does
not go more negative than the diagnosis level voltage
(Vdiag = −1.15 V). This condition is checked for every coil
driver cycle.
• During the communication (after sending the write
pulses and before receiving the answer of the
transponder), if the tag is moving.
Before the system is switched into WRITE_TAG mode, the
demodulator has to be frozen. This is internally done by
clamping the input of the filter amplifier unit to the level on
pin QGND. Doing so avoids large transients in the
amplifier and digitizer, which could affect settling times.
In addition to the clamping, there exist other means in the
HTRC11001T which allow further reduction of the settling
times. All the parts of the circuitry which are associated
with these functions are controlled by the bits FREEZE0,
FREEZE1 and THRESET (see Table 2).
8.4
Oscillator with programmable divider
The crystal oscillator at pins XTAL1 and XTAL2 works with
either crystal or ceramic resonators. It delivers the input
clock frequency of 4, 8, 12 or 16 MHz. The oscillator
frequency is divided by a programmable divider (selection
bits FSEL1 and FSEL0) to obtain the carrier frequency of
125 kHz (see Table 3).
Alternatively, an external clock signal (CMOS compatible)
may connected to pin XTAL1. For example, this clock
signal can be derived from the microcontroller clock.
For more details concerning write timing, demodulator
setting, power-up sequence, etc. please refer to the
application note “AN 98080 Read/Write devices based on
the HITAG Read/Write IC HTRC110”.
2001 Nov 23
6
Philips Semiconductors
Product specification
HITAG reader chip
HTRC11001T
8.6
Idle and Power-down mode
All commands transmitted to the HTRC11001T serial
interface start with the Most Significant Bit (MSB).
The HTRC11001T can be switched into the Idle mode via
setting bit PD = 1 and resetting bit PD_MODE = 0
(see Table 3). In this Idle mode, only the oscillator and a
few other system components are active.
Input DIN and output DOUT are valid when pin SCLK is at
HIGH level.
8.7.2
GLITCH FILTER
It is also possible to switch the HTRC11001T completely
off. This is achieved by the Power-down mode (bit PD = 1
and bit PD_MODE = 1). Within this mode also the clock
oscillator is switched off. This reduces the supply current
of the HTRC11001T to less than 20 µA.
Connecting pin MODE to VDD enables digital filtering of the
SCLK and the DIN input signals. This mode offers
improved immunity against noise and interference
(glitches) on these interface signals. It is intended to be
used in the so called ‘active antenna applications’ where
the microcontroller and the reader communicate via long
signal lines (e.g. 1 meter).
8.7
Serial interface
The communication between the HTRC11001T and the
microcontroller is done via a 3-wire digital interface. The
interface is operated by the following signals:
In other applications pin MODE has to be connected to
ground (pin VSS).
• Clock pulse on pin SCLK
• Data input on pin DIN
For a detailed description of this feature, refer to the
application note “AN 98080 Read/Write devices based on
the HITAG Read/Write IC HTRC110”.
• Data output on pin DOUT.
Pins SCLK and DIN are realized as Schmitt-trigger inputs.
Pin DOUT is an open-drain output with an internal pull-up
resistor.
8.7.1
COMMUNICATION PROTOCOL
Every communication between the HTRC11001T and the
microcontroller begins with an initialization of the serial
interface. The interface initialization condition is a
LOW-to-HIGH transition on pin DIN while pin SCLK is at
HIGH level (see Fig.3).
t
h
initialization
t
su
SCLK
DIN
D7
D6
D1
D0
DOUT
D7
D6
D1
D0
MGW268
Fig.3 Serial interface communication protocol.
2001 Nov 23
7
Philips Semiconductors
Product specification
HITAG reader chip
HTRC11001T
8.8
Table 1 Summary of the HTRC11001T command set
BIT 7 BIT 6 BIT5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
Commands
COMMAND NAME
REMARK
MSB
LSB
READ_TAG
1
0
1
0
1
0
−
−
−
−
−
READ_TAG mode
WRITE_TAG_N
1
N3
N2
N1
N0 WRITE_TAG mode with
pulse width programming
WRITE_TAG
1
0
0
1
0
0
0
1
0
0
0
0
0
1
0
−
0
−
−
−
−
WRITE_TAG mode
read command
READ_PHASE
0
1
0
0
0
D5
D5
0
D4
D4
0
D3
D3
0
D2
D2
0
D1
D1
1
D0 response
D0
SET_SAMPLING_TIME
GET_SAMPLING_TIME
0
read command
D5
P1
D4
P0
D3
D3
D2
D2
D1
D1
D0 response
SET_CONFIG_PAGE
GET_CONFIG_PAGE
D0 4 × 4 configuration bits
available
0
0
0
0
0
1
P1
D1
P0 read command
D0 response
X3
X2
X1
X0
D3
D2
8.8.1
COMMAND READ_TAG
NAME
Command bits
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
1
1
1
−
−
−
−
−
This command is used to read the demodulated bit stream from a transponder.
After the assertion of the three command bits the HTRC11001T instantaneously switches to the READ_TAG mode and
transmits the demodulated, filtered and digitized data to the microcontroller. This data should be decoded by the
microcontroller.
The READ_TAG mode is terminated by a LOW-to-HIGH transition on pin SCLK.
8.8.2
COMMAND WRITE_TAG_N
NAME
Command bits
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
0
0
0
1
N3
N2
N1
N0
This command is used to write data to a transponder.
If bits N3 to N0 are set to 0000, the signal on pin DIN is transparently switched to the drivers. A HIGH level on pin DIN
corresponds to antenna drivers switched off and a LOW level corresponds to antenna drivers switched on.
For any binary number N between 0001 and 1111, the drivers are switched off at the next positive transition on pin DIN.
This state is held for a time interval t = N × T0 (for T0 = 8 µs). This method relaxes the timing resolution requirements to
the microcontroller and to the software implementation while providing an exact, selectable write pulse timing.
The WRITE_TAG mode is terminated immediately by a LOW- to-HIGH transition on pin SCLK.
2001 Nov 23
8
Philips Semiconductors
Product specification
HITAG reader chip
HTRC11001T
8.8.3
COMMAND WRITE_TAG
NAME
Command bits
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
1
1
0
−
−
−
−
−
This is the 3-bit short form of the previously described command WRITE_TAG_N. It allows to switch into the
WRITE_TAG mode with a minimum communication time.
The behaviour of the WRITE_TAG command is identical to WRITE_TAG_N with two exceptions:
• WRITE_TAG mode is entered after assertion of the third command bit
• No N parameter is specified with this command; instead the N value which was programmed with the most recent
WRITE_TAG_N command is used. If no WRITE_TAG_N was issued so far, a default N = 0 (transparent mode) will be
assumed.
8.8.4
COMMAND READ_PHASE
NAME BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
Command bits
Response bits
0
0
0
0
0
0
1
0
0
0
D5
D4
D3
D2
D1
D0
This command is used to read the antenna phase, which is measured at every carrier cycle.
The response bits D5 to D0 represent the phase (coded binary).
8.8.5
COMMAND SET_SAMPLING_TIME
NAME
Command bits
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
1
0
D5
D4
D3
D2
D1
D0
This command specifies the demodulator sampling time ts. The sampling time is coded binary in bits D5 to D0.
8.8.6 COMMAND GET_SAMPLING_TIME
NAME
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
Command bits
Response bits
0
0
0
0
0
0
0
0
1
0
D5
D4
D3
D2
D1
D0
This command is used to read back the sampling time ts set with SET_SAMPLING_TIME.
The response bits D5 to D0 represent the sampling time (coded binary).
2001 Nov 23
9
Philips Semiconductors
Product specification
HITAG reader chip
HTRC11001T
8.8.7
COMMAND SET_CONFIG_PAGE
NAME
Command
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
0
1
P1
P0
D3
D2
D1
D0
This command is used to set the filter and amplifier parameters (cut-off frequencies and gain factors) and to select the
operation mode. Bits P1 and P0 select one of four configuration pages.
Table 2 Configuration page bit names
BIT
COMMAND
PAGE NUMBER
7
6
P1
P0
D3
GAIN1
D2
GAIN0
D1
D0
SET_CONFIG_PAGE 0
SET_CONFIG_PAGE 1
SET_CONFIG_PAGE 2
SET_CONFIG_PAGE 3
0
0
0
0
1
1
1
1
0
0
1
1
0
1
0
1
FILTERH
FILTERL
PD_MODE
THRESET
DISLP1
PD
HYSTERESIS TXDIS
FREEZE1 FREEZE0
FSEL0
ACQAMP
DISSMART- FSEL1
COMP
Table 3 Description of the configuration page bits
INITIAL
VALUE
BIT NAME
VALUE
DESCRIPTION
FILTERL
main low-pass cut-off frequency
fL = 3 kHz
0
1
0
fL = 6 kHz
FILTERH
GAIN0
main high-pass cut-off frequency
fH = 40 kHz
0
1
0
0
fH = 160 kHz
amplifier 0 gain factor
gain = 16
0
1
gain = 32
GAIN1
amplifier 1 gain factor
gain = 6.22
0
1
gain = 31.5
1
0
TXDIS
disable coil driver
coil driver active
coil driver inactive
data comparator hysteresis
hysteresis OFF
0
1
HYSTERESIS
PD
0
1
0
0
hysteresis ON
Power-down mode enable
device active
0
1
device power-down
2001 Nov 23
10
Philips Semiconductors
Product specification
HITAG reader chip
HTRC11001T
INITIAL
VALUE
BIT NAME
VALUE
DESCRIPTION
PD_MODE
select Power-down mode
Idle mode
0
1
0
Power-down mode
FREEZE1,
FREEZE0
facility to achieve fast settling times (MSB and LSB)
normal operation
00
01
10
00
main low-pass is frozen; main high-pass is pre-charged to level on pin QGND
main low-pass is frozen; time constant of main high-pass is reduced by a
factor of 16 for bit FILTERH = 0 and by a factor of 8 for bit FILTERH = 1
11
main high-pass time constant is reduced by a factor of 16 for bit FILTERH = 0
and by a factor of 8 for bit FILTERH = 1; second high-pass is pre-charged
ACQAMP
store signal amplitude (see also bit AMPCOMP in Table 5)
0
1
set status bit AMPCOMP when the actual data signal amplitude is higher than
the stored reference
0
store actual amplitude of the data signal as reference for later amplitude
comparison
THRESET
reset threshold generation of digitizer
0
1
no reset
0
reset
FSEL1, FSEL0
clock frequency selection (MSB and LSB)
4 MHz
00
01
10
11
00
8 MHz
12 MHz
16 MHz
DISSMART-
COMP
disable smart comparator
smart comparator: on
smart comparator: off
disable low-pass 1
low-pass: on
0
1
0
0
DISLP1
0
1
low-pass: off
2001 Nov 23
11
Philips Semiconductors
Product specification
HITAG reader chip
HTRC11001T
8.8.8
COMMAND GET_CONFIG_PAGE
?
NAME
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
Command bits
Response bits
0
0
0
0
0
1
P1
D1
P0
D0
X3
X2
X1
X0
D3
D2
This command has three functions:
1. Reading back the configuration parameters set by command SET_CONFIG_PAGE
2. Reading back the transmit pulse width programmed with command WRITE_TAG_N
3. Reading the system status information.
Bits P1 and P0 select one of four configuration pages.
The response bits (X3 to X0 and D3 to D0) contains the contents of the selected configuration page in its lower nibble.
For page 0 and page 1 the higher nibble reflects the current setting of the transmit pulse width N.
For page 2 and page 3 the system status information is returned in the higher nibble.
Table 4 Configuration page bit names
BIT
COMMAND
PAGE NUMBER
X3
X2
X1
X0
3
2
1
0
GET_CONFIG_PAGE 0
GET_CONFIG_PAGE 1
GET_CONFIG_PAGE 2
GET_CONFIG_PAGE 3
N3
N2
N1
N0
D3
D3
D3
D3
D2
D2
D2
D2
D1
D1
D1
D1
D0
D0
D0
D0
N3
N2
N1
N0
0 (RFU)
0 (RFU)
0 (RFU)
0 (RFU)
AMPCOMP
AMPCOMP
ANTFAIL
ANTFAIL
Table 5 Description of the configuration page bits
BIT NAME
VALUE
DESCRIPTION
contents of the selected configuration page
D3 to D0
N3 to N0
ANTFAIL
XXXX
XXXX
current setting of the transmit pulse width
antenna failure
0
1
no antenna failure
antenna failure
AMPCOMP
amplitude comparison result (see also bit ACQAMP in Table 3)
actual data signal amplitude is lower than the stored reference
actual data signal amplitude is higher than the stored reference
0
1
2001 Nov 23
12
Philips Semiconductors
Product specification
HITAG reader chip
HTRC11001T
9
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); note 1.
SYMBOL
PARAMETER
voltage at any pin (except pin RX)
MIN.
−0.3
MAX.
+6.5
UNIT
Vn
V
V
V
Vn(max)
VRX
Tj(max)
Tstg
maximum voltage at any pin with respect to VDD (except pin RX)
voltage at pin RX
−0.3
−10
−
VDD + 0.3
+12
maximum junction temperature
storage temperature
140
°C
°C
−65
+125
Note
1. Stress above one or more of the limiting values may cause permanent damage to the device. These are stresses
ratings only and operation of the device at these or at any other conditions above those given in Chapter 10 not
implied. Exposure or limiting values for extended periods may affect device reliability.
10 DC CHARACTERISTICS
All voltages are measured with respect to ground (pin VSS); Tamb = −40 to +85 °C
SYMBOL
Supply
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VDD
IDD
Iidle
Ipd
supply voltage
4.5
5.0
5.5
10
V
supply current
idle current
VDD = 5.5 V; ITX1 = ITX2 = 0
VDD = 5.5 V; note 1
VDD = 5.5 V
−
−
−
4
mA
mA
µA
0.2
7
0.4
20
power-down current
Driver outputs (pins TX1 and TX2)
Iant(p) antenna driver output current permanent
−
−
−
−
200
400
mA
mA
(peak value)
pulse load; ton < 400 ms;
ratio on : off = 1 : 4
Ro
output resistance
both drivers together
−
2.5
7
Ω
Demodulator input (pin RX)
VI
input voltage
with respect to pin QGND
with respect to pin QGND;
−8
−
+8
V
V
Vdiag
diagnosis level voltage
−1.5
−1.15
−0.8
VDD = 5 V
VQGND
Ri
potential on pin QGND
0.35VDD 0.42VDD 0.50VDD
V
internal demodulator
impedance
17
25
33
kΩ
Digital inputs
VIH
VIL
HIGH-level input voltage
LOW-level input voltage
0.7VDD
−
−
VDD + 0.3 V V
−0.3
0.3VDD
V
Digital outputs
VOL
IOL
LOW-level output voltage
LOW-level output current
IOL(max) = 1 mA
OL ≤ 0.4 V
−
−
−
0.4
V
V
1
−
mA
Note
1. Power consumption of external quartz or any other component is not included.
2001 Nov 23 13
Philips Semiconductors
Product specification
HITAG reader chip
HTRC11001T
11 AC CHARACTERISTICS
Tamb = −40 to +85 °C.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Oscillator inputs (pins XTAL1 and XTAL2)
fosc
oscillator frequency
depending on bits FSEL1
and FSEL0
4
−
16
MHz
tst
Ci
Ri
start-up time
−
−
4
5
10
−
ms
pF
input capacitance on pin XTAL1
input resistance
between pins XTAL1
and XTAL2
0.9
1.3
3.0
MΩ
External clock input (pin XTAL1)
fext
external clock frequency
depending on bits FSEL1
and FSEL0
4
−
−
16
60
MHz
%
δ
duty cycle
40
Serial interface
tsu
th
set-up time
hold time
pin MODE at VSS
pin MODE at VSS
50
50
−
−
−
−
ns
ns
Receiver (pin RX)
VRX(p-p) sensitivity (peak-to-peak value) receiver input
td
2
1
−
mV
µs
receiver delay
bit FILTERL = 0
bit FILTERL = 1
290
160
310
175
340
190
µs
Demodulator valid time
trec
demodulator recovery time
after clock stable; note 1
after WRITE-pulse; note 1
after AST-step
−
−
−
−
−
5
ms
µs
−
500
1.5
±5.7
0.7
−
ms
deg
ϕ
phase measurement error
Note
1. These short times require special command sequences. Please refer to the application note “AN 98080 Read/Write
devices based on the HITAG Read/Write IC HTRC110”.
2001 Nov 23
14
Philips Semiconductors
Product specification
HITAG reader chip
HTRC11001T
12 APPLICATION INFORMATION
Alternatively to a crystal, a ceramic resonator can be used
or an external clock source can be connected to
pin XTAL1.
Figure 4 shows a minimal application circuitry for the
HTRC11001T.
The reader coil La together with the capacitor Ca forms a
series resonant LC circuit (f0 = 125 kHz). The high
voltages in the LC circuit are divided to safe operating
levels by Rv and the internal resistor Ri behind pin RX.
The two capacitors connected to pin XTAL1 and
pin XTAL2 shall be the recommended values and types
from the data sheet of the crystal.
V
DD
10 µF
100 nF
V
R
L
RX
14
SS
v
1
2
3
4
5
6
7
C
100 nF
a
QGND
TX2
13
V
CEXT
12
DD
a
HTRC11001T
100 nF
n.c.
TX1
11
MODE
XTAL1
XTAL2
DOUT
DIN
10
to microcontroller
9
8
SCLK
MGW267
Fig.4 Minimum application circuitry.
2001 Nov 23
15
Philips Semiconductors
Product specification
HITAG reader chip
HTRC11001T
13 PACKAGE OUTLINE
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
H
v
M
A
E
Z
8
14
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
7
e
detail X
w
M
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.75
1.27
0.050
1.05
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches
0.041
0.01 0.004
0.069
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
97-05-22
99-12-27
SOT108-1
076E06
MS-012
2001 Nov 23
16
Philips Semiconductors
Product specification
HITAG reader chip
HTRC11001T
14 SOLDERING
If wave soldering is used the following conditions must be
observed for optimal results:
14.1 Introduction to soldering surface mount
packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
14.2 Reflow soldering
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.
14.4 Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
14.3 Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
2001 Nov 23
17
Philips Semiconductors
Product specification
HITAG reader chip
HTRC11001T
14.5 Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
not suitable
REFLOW(1)
BGA, HBGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
PLCC(3), SO, SOJ
suitable
suitable
suitable
not suitable(2)
suitable
LQFP, QFP, TQFP
not recommended(3)(4) suitable
not recommended(5)
suitable
SSOP, TSSOP, VSO
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2001 Nov 23
18
Philips Semiconductors
Product specification
HITAG reader chip
HTRC11001T
15 DATA SHEET STATUS
PRODUCT
STATUS(2)
DATA SHEET STATUS(1)
DEFINITIONS
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Product data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
16 DEFINITIONS
17 DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2001 Nov 23
19
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2001
SCA73
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613502/02/pp20
Date of release: 2001 Nov 23
Document order number: 9397 750 08329
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