IP4060CX16/LF [NXP]
High-speed MultiMediaCard interface filter with ESD protection to IEC 61000-4-2 level 4; 具有ESD保护的高速多媒体卡接口，过滤器，符合IEC 61000-4-2第4级
| 型号： | IP4060CX16/LF |
| 厂家： | 
NXP |
| 描述： | High-speed MultiMediaCard interface filter with ESD protection to IEC 61000-4-2 level 4 |
| 文件： | 总10页 (文件大小：60K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IP4060CX16/LF
High-speed MultiMediaCard interface filter with ESD
protection to IEC 61000-4-2 level 4
Rev. 01 — 14 May 2009
Product data sheet
1. Product profile
1.1 General description
The IP4060CX16/LF is a diode array with integrated EMI/RF filters and pull-up resistors,
which is designed to protect downstream components from ElectroStatic Discharge (ESD)
voltages up to ±15 kV, far exceeding IEC 61000-4-2 standard, level 4.
The IP4060CX16/LF is fabricated using monolithic silicon semiconductor technology
integrating 6 resistors and 13 pseudo back-to-back diodes in a single Wafer-Level
Chip-Scale Package (WLCSP) measuring only 1.96 mm by 1.97 mm.These features
make the IP4060CX16/LF ideal for applications using miniaturized components, such as
mobile phone handsets, cordless telephones and personal digital devices.
1.2 Features
I Pb-free
I High-speed MMC card specific ESD protection with integrated EMI/RF filters and
pull-up resistors for all channels
I All channels with ±15 kV ESD contact protection at input terminals exceeding
IEC 61000-4-2 standard level 4
I WLCSP with 0.5 mm pitch
1.3 Applications
I ElectroMagnetic Interference (EMI) and Radio-Frequency Interference (RFI) reduction
and downstream ESD protection for high-speed MultiMediaCards (MMC) in:
N Cellular and Personal Communication System (PCS) mobile handsets
N PC/notebook card readers
N Cordless telephones
N Wireless data (WAN/LAN) systems
N PDAs
IP4060CX16/LF
NXP Semiconductors
High-speed MultiMediaCard interface filter with ESD protection
2. Pinning information
2.1 Pinning
bump A1
index area
IP4060CX16/LF
1
2
3
4
A
B
C
D
001aaj755
Transparent top view
Fig 1. Pin configuration IP4060CX16/LF
Table 1.
Pinning
Pin
Description
filter channel 1
filter channel 2
filter channel 3
filter channel 4
filter channel 5
filter channel 6
ground
A2 and A4
A1 and B4
B2 and C4
B1 and C3
C1 and D4
D1 and D3
B3, C2, D2
3. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
IP4060CX16/LF
WLCSP16 wafer level chip-size package; 16 bumps; 1.96 × 1.97 × 0.7 mm
IP4060CX16/LF
IP4060CX16LF_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 14 May 2009
2 of 10
IP4060CX16/LF
NXP Semiconductors
High-speed MultiMediaCard interface filter with ESD protection
4. Functional diagram
R14 R13 R12 R11 R10
A3
A4
B4
C4
C3
D4
D3
A3
R1
A2
R2
A1
R3
B2
R4
B1
R5
C1
R6
D1
IEC61000-4-2
level 4
protection pins
B3
C2
D2
001aaj756
Fig 2. Schematic diagram IP4060CX16/LF
5. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VI
Parameter
Conditions
Min Max Unit
input voltage
−
+5.0
V
VESD
electrostatic discharge
voltage
IEC 61000-4-2, level 4;
pins A1, A2, A3, B1, B2, C1
and D1 connected to ground
[1]
contact discharge
air discharge
−15 +15 kV
−15 +15 kV
IEC 61000-4-2, level 1;
all other pins connected to
ground
contact discharge
air discharge
−2
−2
-
+2
+2
20
kV
kV
Pch
Ptot
Tstg
channel power dissipation
total power dissipation
storage temperature
mW
-
120 mW
−55 +150 °C
260 °C
−30 +85 °C
Treflow(peak) peak reflow temperature
Tamb ambient temperature
10 s maximum
-
[1] Device withstands at least 1000 pulses of ±8 kV contact discharges without degradation, according to the
IEC 61000-4-2 model.
IP4060CX16LF_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 14 May 2009
3 of 10
IP4060CX16/LF
NXP Semiconductors
High-speed MultiMediaCard interface filter with ESD protection
6. Characteristics
Table 4.
Channel characteristics
Tamb = 25 °C; unless otherwise specified.
Symbol Parameter Conditions
channel series resistance −30 °C < tc < +85 °C
Min Typ Max Unit
Rs(ch)
R1 to R6
R10 to R13
R14
40
50
60
Ω
52.5 75
97.5 kΩ
4.9
-
7
9.1
20
kΩ
Cch
channel capacitance
breakdown voltage
Vbias(DC) = 0 V; f = 1 MHz;
pin A3 = +3 V
18
pF
VBR
Itest = +1 mA
Itest = −1 mA
per diode pair
VI = +5 V
7
-
-
10
V
V
−10
−7
ILR
reverse leakage current
-
-
100 nA
- nA
VI = −5 V
−100 -
IP4060CX16LF_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 14 May 2009
4 of 10
IP4060CX16/LF
NXP Semiconductors
High-speed MultiMediaCard interface filter with ESD protection
7. Package outline
WLCSP16: wafer level chip-size package; 16 bumps; 1.96 x 1.97 x 0.7 mm
IP4060CX16/LF
D
bump A1
index area
A
A
2
1
E
A
detail X
e
1
e
b
D
C
B
A
e
e
2
1
2
3
4
X
0
1
2 mm
scale
Dimensions
Unit
A
A
A
b
D
E
e
e
e
2
1
2
1
max 0.70 0.26 0.44 0.37 2.01 2.02
mm nom 0.65 0.24 0.41 0.32 1.96 1.97 0.5 1.5 1.5
min 0.60 0.22 0.38 0.27 1.91 1.92
ip4060cx16_lf_po
Issue date
References
Outline
version
European
projection
IEC
JEDEC
JEITA
09-02-25
09-03-12
IP4060CX16/LF
Fig 3. Package outline IP4060CX16/LF (WLCSP16)
IP4060CX16LF_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 14 May 2009
5 of 10
IP4060CX16/LF
NXP Semiconductors
High-speed MultiMediaCard interface filter with ESD protection
8. Soldering of WLCSP packages
8.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
8.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
8.3 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 4) than a PbSn process, thus
reducing the process window
• Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Table 5.
Table 5.
Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
260
350 to 2000
260
> 2000
260
< 1.6
1.6 to 2.5
> 2.5
260
250
245
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 4.
IP4060CX16LF_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 14 May 2009
6 of 10
IP4060CX16/LF
NXP Semiconductors
High-speed MultiMediaCard interface filter with ESD protection
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 4. Temperature profiles for large and small components
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”.
8.3.1 Stand off
The stand off between the substrate and the chip is determined by:
• The amount of printed solder on the substrate
• The size of the solder land on the substrate
• The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
8.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
8.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
IP4060CX16LF_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 14 May 2009
7 of 10
IP4060CX16/LF
NXP Semiconductors
High-speed MultiMediaCard interface filter with ESD protection
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
8.3.4 Cleaning
Cleaning can be done after reflow soldering.
9. Abbreviations
Table 6.
Abbreviations
Description
Acronym
EMI
ElectroMagnetic Interference
ElectroStatic Discharge
Local Area Network
ESD
LAN
MMC
PCS
MultiMediaCard
Personal Communication System
Personal Digital Assistant
Radio-Frequency Interference
Wide Area Network
PDA
RFI
WAN
WLCSP
Wafer-Level Chip-Scale Package
10. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
IP4060CX16LF_1
20090514
Product data sheet
-
-
IP4060CX16LF_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 14 May 2009
8 of 10
IP4060CX16/LF
NXP Semiconductors
High-speed MultiMediaCard interface filter with ESD protection
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
11.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
11.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
IP4060CX16LF_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 14 May 2009
9 of 10
IP4060CX16/LF
NXP Semiconductors
High-speed MultiMediaCard interface filter with ESD protection
13. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
2
2.1
3
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
4
5
6
7
8
8.1
8.2
8.3
8.3.1
8.3.2
8.3.3
8.3.4
Soldering of WLCSP packages. . . . . . . . . . . . . 6
Introduction to soldering WLCSP packages . . . 6
Board mounting . . . . . . . . . . . . . . . . . . . . . . . . 6
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . 6
Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Quality of solder joint . . . . . . . . . . . . . . . . . . . . 7
Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
9
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8
10
11
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
11.1
11.2
11.3
11.4
12
13
Contact information. . . . . . . . . . . . . . . . . . . . . . 9
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 14 May 2009
Document identifier: IP4060CX16LF_1
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