IP4220CZ6 [NXP]

Dual USB 2.0 Integrated ESD protection to IEC 61000-4-2 level 4; 双USB 2.0集成ESD保护符合IEC 61000-4-2 4级
IP4220CZ6
型号: IP4220CZ6
厂家: NXP    NXP
描述:

Dual USB 2.0 Integrated ESD protection to IEC 61000-4-2 level 4
双USB 2.0集成ESD保护符合IEC 61000-4-2 4级

瞬态抑制器 二极管 光电二极管 PC
文件: 总6页 (文件大小:149K)
中文:  中文翻译
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INTEGRATED DISCRETES  
IP4220CZ6  
Dual USB 2.0 Integrated ESD  
protection to IEC 61000-4-2 level 4  
Product Specification  
2005 January 05  
Philips  
Semiconductors  
Philips Semiconductors  
Product Specification  
Dual USB 2.0  
Integrated ESD Protection  
IP4220CZ6  
FEATURES  
ESD IEC 61000-4-2 level 4,  
± 8kV contact discharge compliant protection  
Four ultra-low input capacitance (1 pF typ.)  
ESD rail-to-rail protection diodes  
Low voltage clamping due to integrated Zener  
diode  
Small 6 lead SO6 (SOT457) package  
APPLICATIONS  
General-purpose downstream ESD protection high  
frequency analog signals and high-speed serial data  
transmission for ports inside:  
Cellular and PCS mobile handsets  
PC-/Notebook USB2.0/IEEE1394 ports  
DVI interfaces  
Cordless telephones  
Wireless data (WAN/LAN) systems  
PDAs  
1
2
3
6
5
4
DESCRIPTION  
The IP4220CZ6 is designed to protect I/Os being  
sensitive concerning capacitive load, such as  
USB 2.0, Ethernet, DVI etc. from destruction by  
Electro Static Discharges (ESD).  
Therefore, the IP4220CZ6 incorporates four pairs of  
ultra-low capacity rail-to-rail diodes plus an  
additional Zener diode to provide protection to  
downstream signal and supply components from  
Electrostatic Discharge (ESD) voltages as high as  
±8 kV contact discharge.  
Due to the rail-to-rail diodes being connected to the  
Zener diode, the protection is working independent  
form the availability of a supply voltage.  
The IP4220CZ6 is fabricated using thin film-on-  
silicon technology and integrates 4 ultra-low capacity  
rail-to-rail ESD protection diodes in a miniature  
6-lead SOT457 package.  
Figure 1: IP4220CZ6  
schematic and pinning diagram  
2005 January 05  
2
Philips Semiconductors  
Product Specification  
Dual USB 2.0  
Integrated ESD Protection  
IP4220CZ6  
ABSOLUTE MAXIMUM RATINGS  
SYMBOL  
VI/O  
PARAMETER  
TEST CONDITIONS  
MIN  
MAX UNIT  
DC input voltage range  
0
+5.5  
V
ESD  
Electrostatic Discharge,  
all pins  
IEC 61000-4-2, Level 4,  
Contact  
-8  
+8  
kV  
Tstg  
Device storage temperature range  
-55  
+125  
°C  
RECOMMENDED OPERATING CONDITIONS  
MIN  
MAX UNIT  
+85  
Operating temperature range  
-40  
°C  
ELECTRICAL CHARACTERISTICS  
Tc = 25°C unless otherwise specified  
SYMBOL  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
CI/O  
Pin capacitance to ground,  
Pins 1, 3, 4, 6  
Vdc = 0 V; f = 1 MHz  
Pin 5 = +3.0 V  
-
1.0  
-
pF  
nA  
pF  
V
Ilkg  
Diode reverse leakage current,  
Pins 1, 3, 4, 6 to ground  
V = + 3.0V  
-
-
100  
CZener  
VBR I/O  
VF  
Zener diode capacitance to  
ground, Pin 5 to 2  
Vdc = 0 V; f = 1 MHz  
Pin 5 = +3.0 V  
-
40  
-
-
Zener diode breakdown voltage, I = 1mA  
Pin 5 to 2  
6
-
9
-
Forward voltage  
0.7  
V
2005 January 05  
3
Philips Semiconductors  
Product Specification  
Dual USB 2.0  
Integrated ESD Protection  
IP4220CZ6  
Application Information  
Universal Serial Bus 2.0 protection  
The IP4220CZ6 is optimized to protect e.g. two USB 2.0 ports of Electro-Static-Discharge (ESD).  
Each device is capable of protection both USB data lines and the VBUS supply.  
A typical application is shown in the schematic below.  
VBUS  
D+  
D -  
GND  
VBUS  
USB 2.0  
IEEE1394  
Controller  
6
1
VBUS  
D+  
D -  
GND  
GND  
Figure 2: Typical application of IP4220CZ6  
2005 January 05  
4
Philips Semiconductors  
Product Specification  
Dual USB 2.0  
Integrated ESD Protection  
IP4220CZ6  
PACKAGE OUTLINE  
Plastic small outline package; 6 leads; body width 1.5 mm  
SOT457  
Figure 3: IP4220CZ6 outline dimensions  
2005 January 05  
5
Philips Semiconductors  
Product Specification  
Dual USB 2.0  
Integrated ESD Protection  
IP4220CZ6  
DEFINITIONS  
Data Sheet  
Product Status  
Definition  
Identification  
This data sheet contains the target or goal specifications for  
product development. Specifications may change in any  
manner without notice.  
Objective Specification  
Preliminary Specification  
Formative or in Design  
Preproduction Product  
This data sheet contains preliminary data, and  
supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to make changes at any  
time without notice in order to improve the design and supply  
the best possible product.  
This data sheet contains Final Specifications. Philips  
Semiconductors reserves the right to make changes at any  
time without notice in order to improve the design and supply  
the best possible product.  
Product Specification  
Full Production  
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes,  
without notice in the products, including circuits, standard cells, and/or software, described or contained herein in  
order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the  
use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that these products are free from patent, copyright, or  
mask work infringement, unless otherwise specified. Applications that are described herein for any of these  
products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that  
such applications will be suitable for the specified use without further testing or modification.  
LIFE SUPPORT APPLICATIONS  
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in  
life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips  
Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips  
Semiconductors and Philips Electronics North America Corporation customers using or selling Philips  
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at  
their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America  
Corporation for any damages resulting from such improper use or sale.  
2005 January 05  
6

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