IP4294CZ10 [NXP]
ESD protection for USB 3.0 (SuperSpeed USB) and eSATA data lines; 对于USB 3.0 (超高速USB )和eSATA数据线ESD保护型号: | IP4294CZ10 |
厂家: | NXP |
描述: | ESD protection for USB 3.0 (SuperSpeed USB) and eSATA data lines |
文件: | 总2页 (文件大小:609K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
NXP ESD protection device
IP4294CZ10
ESD protection for USB 3.0
(SuperSpeed USB) and eSATA data lines
Designed to protect even the most sensitive high-speed differential interfaces, this device delivers
a unique combination of strong system-level ESD protection with an extremely low «line-to-ground»
capacitance, minimal crosstalk, and excellent capacitance matching.
Key features
The ICs for high-speed interfaces like USB 3.0 are particularly
susceptible to ESD strikes since they’re popular in portable
applications that are exposed to a wide variety of ambient
conditions. Also, since the interfaces operate at high speeds,
they react quickly to ESD pulses. As a result, they need ESD
protection with extremely low clamping, which can at the same
time support their demanding requirements for signal integrity.
Industry’s best overall protection for USB 3.0 system chips
Extremely low channel capacitance: 0.5 pF (typ)
Extremely low differential crosstalk: less than -60 dB
@ 2.5 GHz
Very low dynamic resistance (less than 0.4 Ω) for both
polarities
RF-optimized DFN2510A-10 (SOT1176) package
USB 3.0 and eSATA require close line-to-line capacitance
matching to minimize intra-pair skew. Since they transmit and
receive simultaneously, these interfaces also require very low
differential crosstalk. The NXP IP4294CZ10 delivers a line-to-line
capacitance matching of better than 0.05 pF while offering an
extremely low differential crosstalk of less than 60 dB @ 2.5 GHz.
Key applications
USB 3.0 (SuperSpeed), eSATA, SATA, HDMI, DisplayPort,
or other high-speed datalines in:
Notebook PCs, motherboards, graphic cards
TVs, monitors
Hard-disk drives, digital still- and video cameras
(DSC, DVC)
To guard against exposure to ESD pulses during assembly,
the system chips for very fast data lines typically include
integrated ESD protection, commonly with fast snapback.
TLP measurements and several system-level board tests show
that the IP4294 is the only device in the ultra-low-capacitance
segment that can provide these ultra-fast system chips with
the ESD protection against positive and negative pulses they
need.
The IP4294 delivers ESD protection optimized for one USB
3.0 port or an eSATA port with up to four lines. It exceeds
IEC61000-4-2 standard level 4 by providing 10 kV of contact
ESD protection.
The IP4294 minimizes the addition of signal skew on sensitive
receivers when an adjacent transmitter channel is active.
The IP4294 is housed in a leadless DFN2510A-10 (SOT1176)
package, optimized for RF signals, that measures 1.0 x 2.5 x
0.5 mm. To optimize signal integrity and simplify board layout,
the package is designed for pass-through routing. It is also Pb-
free and RoHS-compliant.
A very wide differential mode pass band ensures, that even
higher harmonics see no attenuation
To avoid signal distortion, the IP4294 capacitance is nearly
independent from the bias voltage
018aaa202
2
S
21
(dB)
(1)
-2
-6
-10
-14
(2)
-1
10
2
3
4
1
10
10
10
10
f (MHz)
Comparative transmission line pulse (TLP) measurements
If the ESD device has a higher TLP voltage for a given TLP
current, the USB 3.0 system chip will see the majority of the
ESD pulse’s energy. The results shown in this diagram have
been confirmed with tests that brought complete boards
to destruction. When protected by the IP4294, the USB 3.0
system chip survived 10 kV IEC61000-4-2 pulses, but when
protected by the ESD device from supplier B, the USB 3.0
system chip failed already at 4 kV.
www.nxp.com
© 2012 NXP Semiconductors N.V.
All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The
information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and
may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof
does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Date of release: August 2012
Document order number: 9397 750 16928
Printed in the Netherlands
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