ISP1103DH [NXP]
Universal Serial Bus transceiver; 通用串行总线收发器
| 型号： | ISP1103DH |
| 厂家： | 
NXP |
| 描述： | Universal Serial Bus transceiver |
| 文件： | 总17页 (文件大小：443K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ISP1103
Universal Serial Bus transceiver
Rev. 01 — 4 October 1999
Preliminary specification
1. General description
The ISP1103 is a single-chip generic Universal Serial Bus (USB) transceiver that is
fully compliant with the Universal Serial Bus Specification Rev. 1.1. It allows 3.3 V
USB Application Specific ICs (ASICs) and Programmable Logic Devices (PLDs) to
interface with the physical layer of the Universal Serial Bus. It supports transmitting
and receiving serial data at both full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s)
data rates. It also supports the low-power single-ended input receiver interface in
‘suspend’ mode operation. The ISP1103 operates on a 3.3 V supply voltage.
The pin configuration conforms to the ‘Serial Interface Engine’ from the Universal
Serial Bus Implementers Forum (USB-IF). The ISP1103 allows for both the ‘USB-IF
Standard Data Interface’ and the ‘Philips Encoded Data Interface’. The ISP1103 is
fully pin compatible with the industry-standard Philips Semiconductors USB
transceiver PDIUSBP11A.
2. Features
■ Complies with Universal Serial Bus Specification Rev. 1.1
■ Supports full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) serial data rates
■ Slew-rate controlled differential data driver
c
c
■ Differential input receiver with wide common-mode range and very high data input
sensitivity
■ Stable RCV output during SE0 condition
■ Two single-ended receivers with hysteresis
■ Supports ‘Philips Encoded Data Interface’ and ‘USB-IF Standard Data Interface’
■ Low-power operation in ‘suspend’ mode
■ Operates on a 3.3 V supply voltage
■ Fully backward compatible with PDIUSBP11A
■ Compatible with VHDL ‘Serial Interface Engine’ from USB Implementers Forum
■ Higher than 8 kV ESD protection
■ Full industrial operating temperature range −40 to +85 °C
■ Available in SO14, SSOP14 and TSSOP14 packages.
ISP1103
USB transceiver
Philips Semiconductors
3. Ordering information
Table 1: Ordering information
Type number
Package
Name
Description
Version
ISP1103D
SO14
plastic small outline package; 14 leads; body width 3.9 mm
plastic shrink small outline package; 14 leads; body width 5.3 mm
plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT108-1
SOT337-1
SOT402-1
ISP1103DB
ISP1103DH
SSOP14
TSSOP14
4. Functional diagram
handbook, halfpage
14
10
11
8
n.c.
V
CC(3.3)
1
MODE
OE
2
D−
D+
9
SPEED
13
12
VMO/FSE0
VPO/VO
6
3
SUSPND
RCV
4
5
VP
VM
7
GND
ISP1103x
MBL094
Fig 1. Functional diagram.
9397 750 06329
© Philips Electronics N.V. 1999. All rights reserved.
Preliminary specification
Rev. 01 — 4 October 1999
2 of 17
ISP1103
USB transceiver
Philips Semiconductors
5. Pinning information
5.1 Pinning
fpage
fpage
fpage
MODE
1
2
3
4
5
6
7
V
MODE
1
2
3
4
5
6
7
V
MODE
1
2
3
4
5
6
7
V
CC(3.3)
14
13
12
11
10
9
14
13
12
11
10
9
14
13
12
11
10
9
CC(3.3)
CC(3.3)
OE
RCV
VMO/FSE0
VPO/VO
D+
OE
RCV
VP
VMO/FSE0
VPO/VO
D+
OE
RCV
VP
VMO/FSE0
VPO/VO
D+
VP
ISP1103D
ISP1103DB
ISP1103DH
VM
VM
VM
D−
D−
D−
SUSPND
GND
SPEED
n.c.
SUSPND
GND
SPEED
n.c.
SUSPND
GND
SPEED
n.c.
8
8
8
MBL091
MBL092
MBL093
Fig 2. Pinning diagram SO14.
Fig 3. Pinning diagram SSOP14.
Fig 4. Pinning diagram TSSOP14.
5.2 Pin description
Table 2: Pin description
Symbol
Pin
Type Description
MODE
1
I
driver interface selection input (Schmitt trigger):
LOW: Philips Encoded Data Interface (pins VO, FSE0)
HIGH: USB-IF Standard Data Interface (pins VPO, VMO);
pulled HIGH by an internal pull-up transistor, if left floating
OE
2
3
I
output enable input (Schmitt trigger, active LOW); enables the
transceiver to transmit data on the bus
RCV
O
differential data receiver output (CMOS level); driven HIGH
when input SUSPND is HIGH; the output state of RCV is
preserved and stable during an SE0 condition
VP
4
5
6
O
O
I
single-ended D+ receiver output (CMOS level); used for
external detection of single-ended zero (SE0), error
conditions, speed of connected device
VM
single-ended D− receiver output (CMOS level); used for
external detection of single-ended zero (SE0), error
conditions, speed of connected device
SUSPND
suspend input (Schmitt trigger); a HIGH level enables
low-power state while the USB bus is inactive and drives
output RCV to a HIGH level
GND
n.c.
7
8
9
-
-
I
ground supply
not connected
SPEED
speed selection input (Schmitt trigger); adjusts the slew rate
of differential data outputs D+ and D− according to the
transmission speed:
LOW: low-speed (1.5 Mbit/s)
HIGH: full-speed (12 Mbit/s)
9397 750 06329
© Philips Electronics N.V. 1999. All rights reserved.
Preliminary specification
Rev. 01 — 4 October 1999
3 of 17
ISP1103
USB transceiver
Philips Semiconductors
Table 2: Pin description…continued
Symbol
Pin
Type Description
D−
10
AI/O negative USB data bus connection (analog, differential); for
low-speed mode connect to pin VCC(3.3) via a 1.5 kΩ resistor
D+
11
AI/O positive USB data bus connection (analog, differential); for
full-speed mode connect to pin VCC(3.3) via a 1.5 kΩ resistor
VPO/VO
VMO/FSE0
VCC(3.3)
12
13
14
I
I
-
differential driver data input (Schmitt trigger); see Table 4
differential driver data input (Schmitt trigger); see Table 4
supply voltage (3.0 to 3.6 V)
6. Functional description
6.1 Function selection
Table 3: Function table
SUSPND
OE
D+/D−
RCV
VP/VM
Function
L
L
driving
active
active
normal driving
(differential receiver active)
L
H
L
receiving [1]
driving
active
inactive[2]
active
active
receiving
H
driving during ‘suspend’
(differential receiver inactive)
H
H
high-Z[1]
inactive[2]
active
low-power state
[1] Signal levels on D+/D− are determined by other USB devices and external pull-up/down resistors.
[2] In ‘suspend’ mode (SUSPND = H) the differential receiver is inactive and output RCV is always HIGH.
Out-of-suspend (‘K’) signalling is detected via the single-ended receivers VP and VM.
6.2 Operating functions
Table 4: Driving function (OE = L)
MODE
Interface type
VPO/VO
VMO/FSE0
Data
differential logic 0
SE0
L
L
L
H
L
Philips Encoded
Data Interface
L
H
H
L
differential logic 1
SE0
H
L
SE0
L
H
L
differential logic 0
differential logic 1
illegal data
USB-IF Standard
Data Interface
H
H
H
H
Table 5: Receiving function (OE = H)
D+/D−
differential logic 0
differential logic 1
SE0
RCV
L
VP
VM
H
L
H
L
H
L
RCV*
L
[1] RCV* denotes the signal level on output RCV just before SE0 state occurs. This level is kept stable
during the SE0 period.
9397 750 06329
© Philips Electronics N.V. 1999. All rights reserved.
Preliminary specification
Rev. 01 — 4 October 1999
4 of 17
ISP1103
USB transceiver
Philips Semiconductors
7. Limiting values
Table 6: Absolute maximum ratings
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCC(3.3)
VI
Parameter
Conditions
Min
−0.5
−0.5
-
Max
Unit
supply voltage
+6.0
V
input voltage
VCC + 0.5
200
V
Ilatchup
Vesd
latchup current
VI < 0 or VI > VCC
mA
V
[1]
electrostatic discharge voltage
storage temperature
total power dissipation
ILI < 1 µA
-
±8000
+150
Tstg
−60
-
°C
W
Ptot
<tbf>
[1] Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor (Human Body Model).
Table 7: Recommended operating conditions
Symbol
VCC(3.3)
VI
Parameter
Conditions
Min
Max
3.6
5.5
3.6
Unit
supply voltage
input voltage
3.0
0
V
V
V
VI(AI/O)
input voltage on analog I/O pins
0
(D+/D−)
Tamb
operating ambient temperature
−40
+85
°C
8. Static characteristics
Table 8: Static characteristics: supply pins
VCC = VCC(3.3); VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
<tbf>
-
Max
-
Unit
mA
µA
ICC
operating supply current
suspend supply current
-
-
ICC(susp
)
10
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© Philips Electronics N.V. 1999. All rights reserved.
Preliminary specification
Rev. 01 — 4 October 1999
5 of 17
ISP1103
USB transceiver
Philips Semiconductors
Table 9: Static characteristics: digital pins
VCC = VCC(3.3); VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol
Schmitt trigger input levels
Vth(LH) positive-going threshold
Parameter
Conditions
Min
Typ
Max
Unit
1.4
0.9
0.4
-
-
-
1.9
1.5
0.7
V
V
V
voltage
Vth(HL)
negative-going threshold
voltage
Vhys
hysteresis voltage
Output levels
VOL
LOW-level output voltage
HIGH-level output voltage
IOL = 3 mA
IOL = 20 µA
IOL = 3 mA
IOL = 20 µA
-
-
-
-
-
0.4
0.1
-
V
V
V
V
-
VOH
2.4
VCC(3.3)
0.1
−
-
Leakage current
ILI input leakage current
-
-
±1
µA
Table 10: Static characteristics: analog I/O pins (D+, D−)[1]
VCC = VCC(3.3); VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol
Input levels
VDI
Parameter
Conditions
Min
Typ
Max
Unit
differential input sensitivity
|VI(D+) − VI(D−)
|
0.2
0.8
-
-
-
V
V
VCM
differential common mode
voltage
includes VDI range
2.5
VIL
LOW-level input voltage
HIGH-level input voltage
hysteresis voltage
-
-
-
-
0.8
-
V
V
V
VIH
2.0
0.4
Vhys
0.7
Output levels
VOL
VOH
LOW-level output voltage
HIGH-level output voltage
RL = 1.5 kΩ to VCC(3.3)
RL = 15 kΩ to GND
-
-
-
0.3
V
V
2.8
VCC(3.3)
Leakage current
ILZ
OFF-state leakage current
-
-
-
-
±10
µA
Capacitance
CIN
transceiver capacitance
pin to GND
20
pF
Resistance
ZDRV
driver output impedance[2]
input impedance
steady-state drive
28
10
-
-
44
-
Ω
ZINP
MΩ
Termination
VTERM
termination voltage[3] for
upstream port pull-up (RPU
3.0[4]
-
3.6
V
)
[1] D+ is the USB positive data pin; D− is the USB negative data pin.
[2] Includes external resistors of 22 Ω ±1% or 24 Ω ±1% on both D+ and D−.
[3] This voltage is available at pin VCC(3.3)
.
[4] In ‘suspend’ mode the minimum voltage is 2.9 V.
9397 750 06329
© Philips Electronics N.V. 1999. All rights reserved.
Preliminary specification
Rev. 01 — 4 October 1999
6 of 17
ISP1103
USB transceiver
Philips Semiconductors
9. Dynamic characteristics
Table 11: Dynamic characteristics: analog I/O pins (D+, D−); full-speed mode[1]
VCC = VCC(3.3); VGND = 0 V; Tamb = −40 to +85 °C; CL = 50 pF; RPU = 1.5 kΩ on D+ to VTERM.; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Driver characteristics
tFR
rise time
CL = 50 pF;
4
-
20
ns
10 to 90% of |VOH − VOL|;
see Figure 5
tFF
fall time
CL = 50 pF;
4
-
20
ns
90 to 10% of |VOH − VOL|;
see Figure 5
[2]
FRFM
differential rise/fall time
90
-
-
111.1
2.0
%
V
matching (tFR/tFF
)
[2] [3]
VCRS
Driver timing
tPLH
output signal crossover voltage
1.3
propagation delay
(VPO,VMO/FSE0 to D+,D−)
LOW-to-HIGH; see Figure 8
HIGH-to-LOW; see Figure 8
HIGH-to-OFF; see Figure 6
LOW-to-OFF; see Figure 6
OFF-to-HIGH; see Figure 6
OFF-to-LOW; see Figure 6
-
-
-
-
-
-
-
-
-
-
-
-
14
14
6
ns
ns
ns
ns
ns
ns
tPHL
tPHZ
3-state output disable time
(OE to D+,D−)
tPLZ
5
tPZH
14
15
3-state output enable time
(OE to D+,D−)
tPZL
Receiver timing
Differential receiver
tPLH
tPHL
Single-ended receiver
tPLH propagation delay
(D+,D− to VP,VM)
propagation delay
(D+,D− to RCV)
LOW-to-HIGH; see Figure 7
HIGH-to-LOW; see Figure 7
-
-
-
-
8
8
ns
ns
LOW-to-HIGH; see Figure 7
HIGH-to-LOW; see Figure 7
-
-
-
-
5
8
ns
ns
tPHL
[1] Test circuit: see Figure 11.
[2] Excluding the first transition from Idle state.
[3] Characterized only, not tested. Limits guaranteed by design.
Table 12: Dynamic characteristics: analog I/O pins (D+, D−); low-speed mode[1]
VCC = VCC(3.3); VGND = 0 V; Tamb = −40 to +85 °C; CL = 50 pF; RPU = 1.5 kΩ on D− to VTERM.; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Driver characteristics
tLR
rise time
CL = 200 to 600 pF;
10 to 90% of |VOH − VOL|;
see Figure 5
75
-
300
ns
tLF
fall time
CL = 200 to 600 pF;
90 to 10% of |VOH − VOL|;
see Figure 5
75
-
300
ns
[2]
LRFM
differential rise/fall time
85
-
-
118
2.0
%
V
matching (tLR/tLF
)
[2] [3]
VCRS
output signal crossover voltage
1.3
9397 750 06329
© Philips Electronics N.V. 1999. All rights reserved.
Preliminary specification
Rev. 01 — 4 October 1999
7 of 17
ISP1103
USB transceiver
Philips Semiconductors
Table 12: Dynamic characteristics: analog I/O pins (D+, D−); low-speed mode[1]…continued
VCC = VCC(3.3); VGND = 0 V; Tamb = −40 to +85 °C; CL = 50 pF; RPU = 1.5 kΩ on D− to VTERM.; unless otherwise specified.
Symbol
Driver timing
tPLH
Parameter
Conditions
Min
Typ
Max
Unit
propagation delay (VPO/VO,
VMO/FSE0 to D+,D−)
LOW-to-HIGH; see Figure 8
HIGH-to-LOW; see Figure 8
HIGH-to-OFF; see Figure 6
LOW-to-OFF; see Figure 6
OFF-to-HIGH; see Figure 6
OFF-to-LOW; see Figure 6
-
-
-
-
-
-
-
-
-
-
-
-
165
145
6
ns
ns
ns
ns
ns
ns
tPHL
tPHZ
3-state output disable time
(OE to D+,D−)
tPLZ
5
tPZH
100
100
3-state output enable time
(OE to D+,D−)
tPZL
Receiver timing
Differential receiver
tPLH
tPHL
Single-ended receiver
tPLH propagation delay
(D+,D− to VP,VM)
propagation delay
(D+,D− to RCV)
LOW-to-HIGH; see Figure 7
HIGH-to-LOW; see Figure 7
-
-
-
-
9
ns
ns
10
LOW-to-HIGH; see Figure 7
HIGH-to-LOW; see Figure 7
-
-
-
-
5
8
ns
ns
tPHL
[1] Test circuit: see Figure 11.
[2] Excluding the first transition from Idle state.
[3] Characterized only, not tested. Limits guaranteed by design.
+3.0 to +5.5 V
logic input
1/2V
CC(3.3)
0 V
t
t
t
t
FF, LF
t
t
t
t
FR, LR
PZH
PZL
PHZ
PLZ
V
+3.3 V
V
V
− 0.3 V
OH
OH
OL
90%
90%
differential
data lines
V
CRS
10%
10%
+ 0.3 V
V
0 V
OL
MGS255
MGS257
Fig 5. Rise and fall times.
Fig 6. Timing of OE to D+, D-.
+3.3 V
+3.0 to +5.5 V
logic input
0 V
differential
data lines
V
1/2V
CRS
CC(3.3)
0 V
t
t
PHL
t
t
PHL
PLH
PLH
V
+3.3 V
OH
differential
data lines
1/2V
logic output
0 V
V
CC(3.3)
CRS
0 V
MGS256
MGS254
Fig 7. Timing of D+, D- to RCV, VP, VM.
Fig 8. Timing of VPO/VO, VMO/FSE0 to D+, D-.
9397 750 06329
© Philips Electronics N.V. 1999. All rights reserved.
Preliminary specification
Rev. 01 — 4 October 1999
8 of 17
ISP1103
USB transceiver
Philips Semiconductors
10. Test information
test point
handbook, halfpage
22 or 24 Ω
500 Ω
D.U.T.
50 pF
V
MGS258
V = 0 V for tPZH, tPHZ
V = VCC(3.3) for tPZL, tPLZ
Fig 9. Load for enable and disable times.
test point
handbook, halfpage
D.U.T.
25 pF
MGS259
Fig 10. Load for VM, VP and RCV.
V
handbook, halfpage
CC(3.3)
test point
R
PU
1.5 kΩ
S1
22 or 24 Ω
D.U.T.
C
L
15 kΩ
test
S1
D−/LS closed
D+/LS open
D−/FS open
closed
D+/FS
MGS260
Load capacitance:
CL = 50 pF or 125 pF (full-speed mode, minimum or maximum timing)
CL = 200 pF or 600 pF (low-speed mode, minimum or maximum timing).
Speed selection:
full-speed mode (FS): 1.5 kΩ pull-up resistor on D+
low-speed mode (LS): 1.5 kΩ pull-up resistor on D−.
Fig 11. Load for D+, D-.
9397 750 06329
© Philips Electronics N.V. 1999. All rights reserved.
Preliminary specification
Rev. 01 — 4 October 1999
9 of 17
ISP1103
USB transceiver
Philips Semiconductors
11. Package outline
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
H
v
M
A
E
Z
8
14
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
7
e
detail X
w
M
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.75
1.27
0.050
1.05
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches
0.041
0.01 0.004
0.069
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-23
97-05-22
SOT108-1
076E06S
MS-012AB
Fig 12. SO14 package outline.
9397 750 06329
© Philips Electronics N.V. 1999. All rights reserved.
Preliminary specification
Rev. 01 — 4 October 1999
10 of 17
ISP1103
USB transceiver
Philips Semiconductors
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm
SOT337-1
D
E
A
X
c
y
H
v
M
A
E
Z
8
14
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
7
1
detail X
w M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
E
max.
8o
0o
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
7.9
7.6
1.03
0.63
0.9
0.7
1.4
0.9
mm
2.0
0.25
0.65
1.25
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-02-04
96-01-18
SOT337-1
MO-150AB
Fig 13. SSOP14 package outline.
9397 750 06329
© Philips Electronics N.V. 1999. All rights reserved.
Preliminary specification
Rev. 01 — 4 October 1999
11 of 17
ISP1103
USB transceiver
Philips Semiconductors
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
E
A
X
c
y
H
v
M
A
E
Z
8
14
Q
(A )
3
A
2
A
A
1
pin 1 index
θ
L
p
L
1
7
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.72
0.38
mm
1.10
0.65
0.25
1.0
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
94-07-12
95-04-04
SOT402-1
MO-153
Fig 14. TSSOP14 package outline.
9397 750 06329
© Philips Electronics N.V. 1999. All rights reserved.
Preliminary specification
Rev. 01 — 4 October 1999
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12. Soldering
12.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering is not always suitable for surface mount ICs, or for printed-circuit boards
with high population densities. In these situations reflow soldering is often used.
12.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, infrared/convection heating in a
conveyor type oven. Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 250 °C. The top-surface
temperature of the packages should preferable be kept below 230 °C.
12.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
•
•
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45° angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
•
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
9397 750 06329
© Philips Electronics N.V. 1999. All rights reserved.
Preliminary specification
Rev. 01 — 4 October 1999
13 of 17
ISP1103
USB transceiver
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Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.
12.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320 °C.
12.5 Package related soldering information
Table 13: Suitability of surface mount IC packages for wave and reflow soldering
methods
Package
Soldering method
Wave
Reflow[1]
suitable
suitable
BGA, LFBGA, SQFP, TFBGA
not suitable
not suitable[2]
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP,
SMS
PLCC[3], SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
suitable
suitable
suitable
not recommended [3] [4]
not recommended[5]
[1] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods.
[2] These packages are not suitable for wave soldering as a solder joint between the printed-circuit board
and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top
version).
[3] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[4] Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger
than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[5] Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
13. Revision history
Table 14: Revision history
Rev Date
CPCN
Description
01 19991004
Preliminary specification; initial version.
9397 750 06329
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Preliminary specification
Rev. 01 — 4 October 1999
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USB transceiver
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14. Data sheet status
Datasheet status
Product status Definition[1]
Objective specification
Development
This data sheet contains the design target or goal specifications for product development. Specification may
change in any manner without notice.
Preliminary specification Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any
time without notice in order to improve design and supply the best possible product.
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
15. Definitions
16. Disclaimers
Short-form specification — The data in
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
a
short-form specification is
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Right to make changes — Philips Semiconductors reserves the right to
make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve
design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products
are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
9397 750 06329
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Rev. 01 — 4 October 1999
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Philips Semiconductors - a worldwide company
Argentina: see South America
Netherlands: Tel. +31 40 278 2785, Fax. +31 40 278 8399
New Zealand: Tel. +64 98 49 4160, Fax. +64 98 49 7811
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For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications,
Building BE, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 272 4825
Internet: http://www.semiconductors.philips.com
(SCA68)
9397 750 06329
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Preliminary specification
Rev. 01 — 4 October 1999
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ISP1103
USB transceiver
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Contents
1
2
3
4
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
6.1
6.2
Functional description . . . . . . . . . . . . . . . . . . . 4
Function selection. . . . . . . . . . . . . . . . . . . . . . . 4
Operating functions. . . . . . . . . . . . . . . . . . . . . . 4
7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
8
9
10
11
12
12.1
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 13
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 14
Package related soldering information . . . . . . 14
12.2
12.3
12.4
12.5
13
14
15
16
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
© Philips Electronics N.V. 1999.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 4 October 1999
Document order number: 9397 750 06329
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