ISP1122D [NXP]
Universal Serial Bus stand-alone hub; 通用串行总线独立的集线器
| 型号： | ISP1122D |
| 厂家： | 
NXP |
| 描述： | Universal Serial Bus stand-alone hub |
| 文件： | 总48页 (文件大小：1054K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ISP1122
Universal Serial Bus stand-alone hub
Rev. 03 — 29 March 2000
Product specification
1. General description
The ISP1122 is a stand-alone Universal Serial Bus (USB) hub device which complies
with USB Specification Rev. 1.1. It integrates a Serial Interface Engine (SIE), hub
repeater, hub controller, USB data transceivers and a 3.3 V voltage regulator. It has a
configurable number of downstream ports, ranging from 2 to 5.
The ISP1122 can be bus-powered, self-powered or hybrid-powered. When it is
hybrid-powered the hub functions are powered by the upstream power supply (VBUS),
but the downstream ports are powered by an external 5 Volt supply. The low power
consumption in ‘suspend’ mode allows easy design of equipment that is compliant
with the ACPI™, OnNow™ and USB power management requirements.
The ISP1122 has built-in overcurrent sense inputs, supporting individual and global
overcurrent protection for downstream ports. All ports (including the hub) have
GoodLink™ indicator outputs for easy visual monitoring of USB traffic. The ISP1122
has a serial I2C-bus interface for external EEPROM access and a reduced frequency
(6 MHz) crystal oscillator. These features allow significant cost savings in system
design and easy implementation of advanced USB functionality into PC peripherals.
2. Features
c
c
■ High performance USB hub device with integrated hub repeater, hub controller,
Serial Interface Engine (SIE), data transceivers and 3.3 V voltage regulator
■ Complies with Universal Serial Bus Specification Rev. 1.1 and ACPI, OnNow and
USB power management requirements
■ Configurable from 2 to 5 downstream ports with automatic speed detection
■ Internal power-on reset and low voltage reset circuit
■ Supports bus-powered, hybrid-powered and self-powered application
■ Individual or ganged power switching for downstream ports
■ Individual or global port overcurrent protection with built-in sense circuits
■ 6 MHz crystal oscillator with on-chip PLL for low EMI
■ Visual USB traffic monitoring (GoodLink™) for hub and downstream ports
■ I2C-bus interface to read vendor ID, product ID and configuration bits from
external EEPROM
■ Operation over the extended USB bus voltage range (4.0 to 5.5 V)
■ Operating temperature range −40 to +85 °C
■ 8 kV in-circuit ESD protection for lower cost of external components
ISP1122
USB stand-alone hub
Philips Semiconductors
■ Full-scan design with high test coverage
■ Available in 32-pin SDIP, SO and LQFP packages.
3. Ordering information
Table 1: Ordering information
Type number
Package
Name
Description
Version
ISP1122D
ISP1122NB
ISP1122BD
SO32
plastic small outline package; 32 leads; body width 7.5 mm
plastic shrink dual in-line package; 32 leads (400 mil)
SOT287-1
SOT232-1
SDIP32
LQFP32
plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm
SOT358-1
4. Block diagram
ht
upstream
port
6 MHz
PLL
V
V
reg(3.3)
D+ D−
LED
CC
2
SDA
SCL
PACKET
GENERATOR
I C-BUS
5 V
SUPPLY
INTERFACE
ANALOG
Tx/Rx
HUB
GoodLink
REGULATOR
BIT CLOCK
RECOVERY
ISP1122
3.3 V
full
speed
INDV
PHILIPS
SIE
HUB
CONTROLLER
OPTION
END OF
FRAME
TIMERS
HUB
REPEATER
GENERAL
PORT
CONTROLLER
self/bus
powered
ANALOG
Tx/Rx
ANALOG
Tx/Rx
ANALOG
Tx/Rx
ANALOG
Tx/Rx
ANALOG
Tx/Rx
GoodLink/
POWER SWITCH/
OC DETECT
GoodLink/
POWER SWITCH/
OC DETECT
GoodLink/
POWER SWITCH/
OC DETECT
GoodLink/
POWER SWITCH/
OC DETECT
GoodLink/
POWER SWITCH/
OC DETECT
D+ D− overcurrent
LED/
D+ D− overcurrent
LED/
D+ D− overcurrent
LED/
D+ D− overcurrent
LED/
D+ D− overcurrent
LED/
detection power switch
detection power switch
detection power switch
detection power switch
detection power switch
downstream
port 1
downstream
port 2
downstream
port 3
downstream
port 4
downstream
port 5
MGR774
This is a conceptual block diagram and does not include each individual signal.
Fig 1. Block diagram.
9397 750 07002
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Product specification
Rev. 03 — 29 March 2000
2 of 48
ISP1122
USB stand-alone hub
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5. Pinning information
5.1 ISP1122D (SO32) and ISP1122NB (SDIP32)
5.1.1 Pinning
handbook, halfpage
V
handbook, halfpage
V
reg(3.3)
1
2
32
1
2
32
reg(3.3)
PSW1/GL1
DP2
PSW1/GL1
DP2
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
PSW2/GL2
GND
PSW2/GL2
GND
DM2
DM2
3
3
DM3
DP0
DM3
DP0
4
4
DP3
DM0
DP3
DM0
5
5
V
V
DP1
DP1
6
6
CC
CC
DM1
DM1
7
7
OC1
OC2
OC1
OC2
DP5
DP5
8
8
ISP1122D
ISP1122NB
DM5
DM5
9
9
OC3
OC3
INDV/SDA
OPTION/SCL
INDV/SDA
OPTION/SCL
10
11
12
13
14
15
16
10
11
12
13
14
15
16
OC4
OC4
OC5/GOC
DM4
OC5/GOC
DM4
RESET
XTAL2
XTAL1
RESET
XTAL2
XTAL1
DP4
DP4
SP/BP
HUBGL
SP/BP
HUBGL
PSW5/GL5/GPSW
PSW4/GL4
PSW5/GL5/GPSW
PSW4/GL4
PSW3/GL3
PSW3/GL3
MGR772
MGR773
Fig 2. Pin configuration SO32.
Fig 3. Pin configuration SDIP32.
5.1.2 Pin description
Table 2: Pin description for SO32 and SDIP32
Symbol[1]
Pin
Type Description
[2]
Vreg(3.3)
1
-
regulated supply voltage (3.3 V ± 10%) from internal
regulator; used to connect pull-up resistor on DP0 line
PSW2/GL2[3]
2
O
modes 4 to 6: power switch control output for downstream
port 2 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 2 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor
GND
DM3
DP3
VCC
3
4
5
6
-
ground supply
AI/O downstream port 3 D− connection (analog) [4]
AI/O downstream port 3 D+ connection (analog) [4]
-
supply voltage; connect to USB supply VBUS (bus-powered or
hybrid-powered) or to local supply VDD (self-powered)
OC1
7
AI/I
overcurrent sense input for downstream port 1 (analog[5]
)
9397 750 07002
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 03 — 29 March 2000
3 of 48
ISP1122
USB stand-alone hub
Philips Semiconductors
Table 2: Pin description for SO32 and SDIP32…continued
Symbol[1]
Pin
8
Type Description
OC2
AI/I
AI/I
AI/I
AI/I
overcurrent sense input for downstream port 2 (analog[5]
overcurrent sense input for downstream port 3 (analog[5]
overcurrent sense input for downstream port 4 (analog[5]
)
)
)
OC3
9
OC4
OC5/GOC[3]
10
11
modes 5, 7: overcurrent sense input for downstream port 5
(analog[5]
modes 0, 1, 3: global overcurrent sense input (analog[5]
)
)
DM4
12
13
14
AI/O downstream port 4 D− connection (analog)[4]
AI/O downstream port 4 D+ connection (analog) [4]
DP4
SP/BP
I
selects power mode:
self-powered: connect to VDD (local power supply); also use
this mode for hybrid-powered operation
bus-powered: connect to GND; disable downstream port 5 to
meet supply current requirements[4]
HUBGL
15
O
O
hub GoodLink LED indicator output (open-drain, 6 mA);
to connect an LED use a 330 Ω series resistor; if unused
connect to VCC via a 10 kΩ resistor
PSW3/GL3[3] 16
modes 4 to 6: power switch control output for downstream
port 3 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 3 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor
PSW4/GL4[3] 17
O
O
modes 4 to 6: power switch control output for downstream
port 4 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 4 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor
PSW5/GL5/
GPSW[3]
18
mode 5: power switch control output for downstream port 5
(open-drain, 6 mA)
modes 3, 7: GoodLink LED indicator output for downstream
port 5 (open-drain, 6 mA); to connect an LED use a 330 Ω
series resistor
modes 0 to 2: gang mode power switch control output
(open-drain, 6 mA)
XTAL1
19
20
21
I
crystal oscillator input (6 MHz)
crystal oscillator output (6 MHz)
XTAL2
RESET[2]
O
I
reset input (Schmitt trigger); a LOW level produces an
asynchronous reset; connect to VCC for power-on reset
(internal POR circuit)
OPTION/SCL 22
I/O
I/O
mode selection input; also functions as I2C-bus clock output
(open-drain, 6 mA)
INDV/SDA
23
selects individual (HIGH) or global (LOW) power switching
and overcurrent detection; also functions as bidirectional
I2C-bus data line (open-drain, 6 mA)
DM5
DP5
DM1
24
25
26
AI/O downstream port 5 D− connection (analog)[4]
AI/O downstream port 5 D+ connection (analog) [4]
AI/O downstream port 1 D− connection (analog) [6]
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Product specification
Rev. 03 — 29 March 2000
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ISP1122
USB stand-alone hub
Philips Semiconductors
Table 2: Pin description for SO32 and SDIP32…continued
Symbol[1]
Pin
27
28
29
30
31
Type Description
DP1
DM0
DP0
DM2
DP2
AI/O downstream port 1 D+ connection (analog) [6]
AI/O upstream port D− connection (analog)
AI/O upstream port D+ connection (analog)
AI/O downstream port 2 D− connection (analog) [6]
AI/O downstream port 2 D+ connection (analog) [6]
PSW1/GL1[3] 32
O
modes 4 to 6: power switch control output for downstream
port 1 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 1 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor
[1] Symbol names with an overscore (e.g. NAME) indicate active LOW signals.
[2] The voltage at pin Vreg(3.3) is gated by the RESET pin. This allows fully self-powered operation by
connecting RESET to VBUS (+5 V USB supply). If VBUS is lost upstream port D+ will not be driven.
[3] See Table 4 “Mode selection”.
[4] To disable a downstream port connect both D+ and D− to VCC via a 1 MΩ resistor; unused ports must
be disabled in reverse order starting from port 5.
[5] Analog detection circuit can be switched off using an external EEPROM, see Table 23; in this case,
the pin functions as a logic input (TTL level).
[6] Downstream ports 1 and 2 cannot be disabled.
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© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 03 — 29 March 2000
5 of 48
ISP1122
USB stand-alone hub
Philips Semiconductors
5.2 ISP1122BD (LQFP32)
5.2.1 Pinning
DP3
1
2
3
4
5
6
7
8
24 DM0
V
23 DP1
CC
OC1
OC2
22 DM1
21 DP5
ISP1122BD
OC3
20 DM5
OC4
19 INDV/SDA
18 OPTION/SCL
17 RESET
OC5/GOC
DM4
MBL018
Fig 4. Pin configuration LQFP32.
5.2.2 Pin description
Table 3: Pin description for LQFP32
Symbol[1]
Pin
Type Description
[2]
Vreg(3.3)
29
-
regulated supply voltage (3.3 V ± 10%) from internal
regulator; used to connect pull-up resistor on DP0 line
PSW2/GL2[3] 30
O
modes 4 to 6: power switch control output for downstream
port 2 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 2 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor
GND
DM3
DP3
VCC
31
32
1
-
ground supply
AI/O downstream port 3 D− connection (analog) [4]
AI/O downstream port 3 D+ connection (analog) [4]
2
-
supply voltage; connect to USB supply VBUS (bus-powered or
hybrid-powered) or to local supply VDD (self-powered)
OC1
OC2
OC3
OC4
3
4
5
6
AI/I
AI/I
AI/I
AI/I
overcurrent sense input for downstream port 1 (analog[5]
overcurrent sense input for downstream port 2 (analog[5]
overcurrent sense input for downstream port 3 (analog[5]
overcurrent sense input for downstream port 4 (analog[5]
)
)
)
)
9397 750 07002
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 03 — 29 March 2000
6 of 48
ISP1122
USB stand-alone hub
Philips Semiconductors
Table 3: Pin description for LQFP32…continued
Symbol[1]
OC5/GOC[3]
Pin
Type Description
AI/I modes 5, 7: overcurrent sense input for downstream port 5
(analog[5]
modes 0, 1, 3: global overcurrent sense input (analog[5]
7
)
)
DM4
8
AI/O downstream port 4 D− connection (analog)[4]
AI/O downstream port 4 D+ connection (analog) [4]
DP4
9
SP/BP
10
I
selects power mode:
self-powered: connect to VDD (local power supply); also use
this mode for hybrid-powered operation
bus-powered: connect to GND; disable downstream port 5 to
meet supply current requirements[4]
HUBGL
11
O
O
hub GoodLink LED indicator output (open-drain, 6 mA);
to connect an LED use a 330 Ω series resistor; if unused
connect to VCC via a 10 kΩ resistor
PSW3/GL3[3] 12
modes 4 to 6: power switch control output for downstream
port 3 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 3 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor
PSW4/GL4[3] 13
O
O
modes 4 to 6: power switch control output for downstream
port 4 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 4 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor
PSW5/GL5/
GPSW[3]
14
mode 5: power switch control output for downstream port 5
(open-drain, 6 mA)
modes 3, 7: GoodLink LED indicator output for downstream
port 5 (open-drain, 6 mA); to connect an LED use a 330 Ω
series resistor
modes 0 to 2: gang mode power switch control output
(open-drain, 6 mA)
XTAL1
15
16
17
I
crystal oscillator input (6 MHz)
crystal oscillator output (6 MHz)
XTAL2
RESET[2]
O
I
reset input (Schmitt trigger); a LOW level produces an
asynchronous reset; connect to VCC for power-on reset
(internal POR circuit)
OPTION/SCL 18
I/O
I/O
mode selection input; also functions as I2C-bus clock output
(open-drain, 6 mA)
INDV/SDA
19
selects individual (HIGH) or global (LOW) power switching
and overcurrent detection; also functions as bidirectional
I2C-bus data line (open-drain, 6 mA)
DM5
DP5
DM1
DP1
DM0
DP0
20
21
22
23
24
25
AI/O downstream port 5 D− connection (analog)[4]
AI/O downstream port 5 D+ connection (analog) [4]
AI/O downstream port 1 D− connection (analog) [6]
AI/O downstream port 1 D+ connection (analog) [6]
AI/O upstream port D− connection (analog)
AI/O upstream port D+ connection (analog)
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© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 03 — 29 March 2000
7 of 48
ISP1122
USB stand-alone hub
Philips Semiconductors
Table 3: Pin description for LQFP32…continued
Symbol[1]
Pin
26
Type Description
DM2
AI/O downstream port 2 D− connection (analog) [6]
AI/O downstream port 2 D+ connection (analog) [6]
DP2
27
PSW1/GL1[3] 28
O
modes 4 to 6: power switch control output for downstream
port 1 (open-drain, 6 mA)
modes 0 to 3, 7: GoodLink LED indicator output for
downstream port 1 (open-drain, 6 mA); to connect an LED
use a 330 Ω series resistor
[1] Symbol names with an overscore (e.g. NAME) indicate active LOW signals.
[2] The voltage at pin Vreg(3.3) is gated by the RESET pin. This allows fully self-powered operation by
connecting RESET to VBUS (+5 V USB supply). If VBUS is lost upstream port D+ will not be driven.
[3] See Table 4 “Mode selection”.
[4] To disable a downstream port connect both D+ and D− to VCC via a 1 MΩ resistor; unused ports must
be disabled in reverse order starting from port 5.
[5] Analog detection circuit can be switched off using an external EEPROM, see Table 23; in this case,
the pin functions as a logic input (TTL level).
[6] Downstream ports 1 and 2 cannot be disabled.
6. Functional description
The ISP1122 is a stand-alone USB hub with up to 5 downstream ports. The number
of ports can be configured between 2 and 5. The downstream ports can be used to
connect low-speed or full-speed USB peripherals. All standard USB requests from
the host are handled by the hardware without the need for firmware intervention. The
block diagram is shown in Figure 1.
The ISP1122 requires only a single supply voltage. An internal 3.3 V regulator
provides the supply voltage for the analog USB data transceivers.
The ISP1122 supports both bus-powered and self-powered hub operation. When
using bus-powered operation a downstream port cannot supply more than 100 mA to
a peripheral. In case of self-powered operation an external supply is used to power
the downstream ports, allowing a current consumption of max. 500 mA per port.
A basic I2C-bus interface is provided for reading vendor ID, product ID and
configuration bits from an external EEPROM upon a reset.
6.1 Analog transceivers
The integrated transceiver interfaces directly to the USB cables through external
termination resistors. They are capable of transmitting and receiving serial data at
both ‘full-speed’ (12 Mbit/s) and ‘low-speed’ (1.5 Mbit/s) data rates. The slew rates
are adjusted according to the speed of the device connected and lie within the range
mentioned in the USB Specification Rev. 1.1.
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© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 03 — 29 March 2000
8 of 48
ISP1122
USB stand-alone hub
Philips Semiconductors
6.2 Philips Serial Interface Engine (SIE)
The Philips SIE implements the full USB protocol layer. It is completely hardwired for
speed and needs no firmware intervention. The functions of this block include:
synchronization pattern recognition, parallel/serial conversion, bit (de-)stuffing, CRC
checking/generation, Packet IDentifier (PID) verification/generation, address
recognition, handshake evaluation/generation.
6.3 Hub repeater
The hub repeater is responsible for managing connectivity on a ‘per packet’ basis. It
implements ‘packet signalling’ and ‘resume’ connectivity. Low-speed devices can be
connected to downstream ports. If a low-speed device is detected the repeater will
not propagate upstream packets to the corresponding port, unless they are preceded
by a PREAMBLE PID.
6.4 End-of-frame timers
This block contains the specified EOF1 and EOF2 timers which are used to detect
‘loss-of-activity’ and ‘babble’ error conditions in the hub repeater. The timers also
maintain the low-speed keep-alive strobe which is sent at the beginning of a frame.
6.5 General and individual port controller
The general and individual port controllers together provide status and control of
individual downstream ports. Any port status change will be reported to the host via
the hub status change (interrupt) endpoint.
6.6 GoodLink
Indication of a good USB connection is provided through GoodLink technology. An
LED can be directly connected via an external 330 Ω resistor.
During enumeration the LED blinks on momentarily. After successful configuration of
the ISP1122, the LED is permanently on. The LED blinks off for 100 ms upon each
successful packet transfer (with ACK). The hub GoodLink indicator blinks when the
hub receives a packet addressed to it. Downstream GoodLink indicators blink upon
an acknowledgment from the associated port. In ‘suspend’ mode the LED is off.
This feature provides a user-friendly indication of the status of the hub, the connected
downstream devices and the USB traffic. It is a useful diagnostics tool to isolate faulty
USB equipment and helps to reduce field support and hotline costs.
6.7 Bit clock recovery
The bit clock recovery circuit recovers the clock from the incoming USB data stream
using a 4× oversampling principle. It is able to track jitter and frequency drift as
specified by the USB Specification Rev. 1.1.
6.8 Voltage regulator
A 5 to 3.3 V DC-DC regulator is integrated on-chip to supply the analog transceiver
and internal logic. This can also be used to supply the terminal 1.5 kΩ pull-up resistor
on the D+ line of the upstream connection.
9397 750 07002
© Philips Electronics N.V. 2000. All rights reserved.
Product specification
Rev. 03 — 29 March 2000
9 of 48
ISP1122
USB stand-alone hub
Philips Semiconductors
6.9 PLL clock multiplier
A 6 to 48 MHz clock multiplier Phase-Locked Loop (PLL) is integrated on-chip. This
allows for the use of low-cost 6 MHz crystals. The low crystal frequency also
minimizes Electro-Magnetic Interference (EMI). The PLL requires no external
components.
6.10 Overcurrent detection
An overcurrent detection circuit for downstream ports has been integrated on-chip. It
is self-reporting, resets automatically, has a low trip time and requires no external
components. Both individual and global overcurrent detection are supported.
6.11 I2C-bus interface
A basic serial I2C-bus interface (single master, 100 kHz) is provided to read VID, PID
and configuration bits from an external I2C-bus EEPROM (e.g. Philips PCF8582 or
equivalent). At reset the ISP1122 reads 6 bytes of data from the external memory.
The I2C-bus interface timing complies with the standard mode of operation as
described in The I2C-bus and how to use it, order number 9398 393 40011.
7. Modes of operation
The ISP1122 has several modes of operation, each corresponding with a different pin
configuration. Modes are selected by means of pins INDV, OPTION and SP/BP, as
shown in Table 4.
Table 4: Mode selection
Mode
INDV
OPTION SP/BP
PSWn/GLn
(n = 1 to 4)
PSW5/GL5/GPSW OCn
(n = 1 to 4)
OC5/GOC
[1]
[2]
0
1
2
3
4
0
0
0
0
1
0
0
1
1
0
0
1
0
1
0
GoodLink
ganged power
ganged power
ganged power
GoodLink[4]
inactive
inactive
inactive
inactive [3]
inactive
global overcurrent
global overcurrent
inactive[3]
GoodLink
GoodLink
GoodLink[4]
global overcurrent
inactive
individual power
individual
overcurrent
5
1
0
1
individual power
individual power
individual
individual
overcurrent
overcurrent
6
7
1
1
1
1
0
1
individual power
GoodLink[4]
inactive
GoodLink[4]
inactive [3]
inactive[3]
individual
individual
overcurrent
overcurrent
[1] Port power switching: logic 0 = ganged, logic 1 = individual.
[2] Power mode: logic 0 = bus-powered, logic 1 = self-powered (or hybrid-powered).
[3] No overcurrent detection.
[4] No power switching.
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Product specification
Rev. 03 — 29 March 2000
10 of 48
ISP1122
USB stand-alone hub
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8. Endpoint descriptions
Each USB device is logically composed of several independent endpoints. An
endpoint acts as a terminus of a communication flow between the host and the
device. At design time each endpoint is assigned a unique number (endpoint
identifier, see Table 5). The combination of the device address (given by the host
during enumeration), the endpoint number and the transfer direction allows each
endpoint to be uniquely referenced.
The ISP1122 has two endpoints, endpoint 0 (control) and endpoint 1 (interrupt).
Table 5: Hub endpoints
Function
Ports
Endpoint
identifier
Transfer
type
Direction[1] Max. packet
size (bytes)
OUT
IN
64
64
1
0
1
control
0: upstream
Hub
1 to 5: downstream
interrupt
IN
[1] IN: input for the USB host; OUT: output from the USB host.
8.1 Hub endpoint 0 (control)
All USB devices and functions must implement a default control endpoint (ID = 0).
This endpoint is used by the host to configure the device and to perform generic USB
status and control access.
The ISP1122 hub supports the following USB descriptor information through its
control endpoint 0, which can handle transfers of 64 bytes maximum:
Device descriptor
Configuration descriptor
Interface descriptor
Endpoint descriptor
Hub descriptor
•
•
•
•
•
•
String descriptor.
8.2 Hub endpoint 1 (interrupt)
Endpoint 1 is used by the ISP1122 hub to provide status change information to the
host. This endpoint can be accessed only after the hub has been configured by the
host (by sending the Set Configuration command).
Endpoint 1 is an interrupt endpoint: the host polls it once every 255 ms by sending an
IN token. If the hub has detected no change in the port status it returns a NAK (Not
AcKnowledge) response to this request, otherwise it sends the Status Change byte
(see Table 6).
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Table 6: Status Change byte: bit allocation
Bit
0
Symbol
Description
Hub SC
a logic 1 indicates a status change on the hub’s upstream port
a logic 1 indicates a status change on downstream port 1
a logic 1 indicates a status change on downstream port 2
a logic 1 indicates a status change on downstream port 3
a logic 1 indicates a status change on downstream port 4
a logic 1 indicates a status change on downstream port 5
not used
1
Port 1 SC
Port 2 SC
Port 3 SC
Port 4 SC
Port 5 SC
reserved
reserved
2
3
4
5
6
7
not used
9. Host requests
The ISP1122 handles all standard USB requests from the host via control endpoint 0.
The control endpoint can handle a maximum of 64 bytes per transfer.
Remark: Please note that the USB data transmission order is Least Significant Bit
(LSB) first. In the following tables multi-byte variables are displayed least significant
byte first.
9.1 Standard requests
Table 7 shows the supported standard USB requests. Some requests are explicitly
unsupported. All other requests will be responded with a STALL packet.
Table 7: Standard USB requests
Request name
bmRequestType bRequest
wValue
byte 2, 3
(Hex)
wIndex
byte 4, 5
(Hex)
wLength
byte 6, 7
(Hex)
Data
byte 0 [7:0]
(Bin)
byte 1
(Hex)
Address
Set Address
Configuration
Get Configuration
X000 0000
1000 0000
05
08
address[1]
00, 00
00, 00
00, 00
00, 00
01, 00
none
configuration
value = 01H
Set Configuration (0)
Set Configuration (1)
Descriptor
X000 0000
X000 0000
09
09
00, 00
01, 00
00, 00
00, 00
00, 00
00, 00
none
none
Get Configuration
Descriptor
1000 0000
06
00, 02
00, 00
length[2]
configuration,
interface and
endpoint
descriptors
Get Device Descriptor
1000 0000
06
06
06
06
00, 01
03, 00
03, 01
03, 02
00, 00
00, 00
00, 00
00, 00
length[2]
length[2]
length[2]
length[2]
device
descriptor
Get String Descriptor (0) 1000 0000
Get String Descriptor (1) 1000 0000
Get String Descriptor (2) 1000 0000
language ID
string
manufacturer
string
product string
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Table 7: Standard USB requests…continued
Request name
bmRequestType bRequest
wValue
byte 2, 3
(Hex)
wIndex
byte 4, 5
(Hex)
wLength
byte 6, 7
(Hex)
Data
byte 0 [7:0]
(Bin)
byte 1
(Hex)
Feature
Clear Device Feature
(REMOTE_WAKEUP)
X000 0000
X000 0010
X000 0000
X000 0010
01
01
03
03
01, 00
00, 00
01, 00
00, 00
00, 00
81, 00
00, 00
81, 00
00, 00
00, 00
00, 00
00, 00
none
none
none
none
Clear Endpoint (1)
Feature (HALT/STALL)
Set Device Feature
(REMOTE_WAKEUP)
Set Endpoint (1)
Feature (HALT/STALL)
Status
Get Device Status
Get Interface Status
Get Endpoint (0) Status
1000 0000
1000 0001
1000 0010
00
00
00
00, 00
00, 00
00, 00
00, 00
00, 00
02, 00
02, 00
device status
zero
00/80[3], 00 02, 00
endpoint 0
status
Get Endpoint (1) Status
1000 0010
0000 0000
00
07
00, 00
81, 00
02, 00
endpoint 1
status
Unsupported
Set Descriptor
XX, XX
XX, XX
XX, XX
descriptor;
STALL
Get Interface
Set Interface
Synch Frame
1000 0001
X000 0001
1000 0010
0A
0B
0C
00, 00
XX, XX
00, 00
XX, XX
XX, XX
XX, XX
01, 00
00, 00
02, 00
STALL
STALL
STALL
[1] Device address: 0 to 127.
[2] Returned value in bytes.
[3] MSB specifies endpoint direction: 0 = OUT, 1 = IN. The ISP1122 accepts either value.
9.2 Hub specific requests
In Table 8 the supported hub specific requests are listed, as well as some
unsupported requests. Table 9 provides the feature selectors for setting or clearing
port features.
Table 8: Hub specific requests
Request name
bmRequestType bRequest
wValue
byte 2, 3
(Hex)
wIndex
byte 4, 5
(Hex)
wLength
byte 6, 7
(Hex)
Data
byte 0 [7:0]
(Bin)
byte 1
(Hex)
Descriptor
Get Hub Descriptor
Feature
1010 0000
06
00, 00/29[1] 00, 00
length[2], 00 hub descriptor
Clear Hub Feature
(C_LOCAL_POWER)
X010 0000
X010 0011
X010 0011
01
01
03
00, 00
00, 00
00, 00
00, 00
00, 00
none
none
none
Clear Port Feature
(feature selectors)
feature[3], 00 port [4], 00
feature[3], 00 port [4], 00
Set Port Feature
(feature selectors)
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Table 8: Hub specific requests…continued
Request name
bmRequestType bRequest
wValue
byte 2, 3
(Hex)
wIndex
byte 4, 5
(Hex)
wLength
byte 6, 7
(Hex)
Data
byte 0 [7:0]
(Bin)
byte 1
(Hex)
Status
Get Hub Status
1010 0000
1010 0011
00
00
00, 00
00, 00
00, 00
04, 00
04, 00
hub status and
status change
field
Get Port Status
Unsupported
Get Bus Status
port[4], 00
port status
1010 0011
X010 0000
02
01
00, 00
01, 00
port [4], 00
00, 00
01, 00
00, 00
STALL
STALL
Clear Hub Feature
(C_OVER_CURRENT)
Set Hub Descriptor
0010 0000
X010 0000
07
03
XX, XX
00, 00
00, 00
00, 00
3E, 00
00, 00
STALL
STALL
Set Hub Feature
(C_LOCAL_POWER)
Set Hub Feature
X010 0000
03
01, 00
00, 00
00, 00
STALL
(C_OVER_CURRENT)
[1] USB Specification Rev. 1.0 uses 00H, USB Specification Rev. 1.1 specifies 29H.
[2] Returned value in bytes.
[3] Feature selector value, see Table 9.
[4] Downstream port identifier: 1 to N with N = number of enabled ports (2 to 5).
Table 9: Port feature selectors
Feature selector name
PORT_CONNECTION
PORT_ENABLE
Value (Hex) Set feature
Clear feature
00
01
02
03
04
not used
not used
not used
disables a port
resumes a port
not used
PORT_SUSPEND
PORT_OVERCURRENT
PORT_RESET
suspends a port
not used
resets and enables a not used
port
PORT_POWER
08
09
10
powers on a port
not used
powers off a port
PORT_LOW_SPEED
C_PORT_CONNECTION
not used
not used
clears port connection
change bit
C_PORT_ENABLE
11
12
not used
not used
not used
not used
clears port enable
change bit
C_PORT_SUSPEND
clears port suspend
change bit
C_PORT_OVERCURRENT 13
clears port overcurrent
change bit
C_PORT_RESET
14
clears port reset
change bit
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9.3 Descriptors
The ISP1122 hub controller supports the following standard USB descriptors:
Device
•
•
•
•
•
•
Configuration
Interface
Endpoint
Hub
String.
Table 10: Device descriptor
Values in square brackets are optional.
Offset
(bytes)
Field name
Size
Value
Comments
(bytes) (Hex)
0
1
2
4
5
6
7
8
bLength
1
1
2
1
1
1
1
2
12
descriptor length = 18 bytes
type = DEVICE
USB Specification Rev. 1.1
HUB_CLASSCODE
-
bDescriptorType
bcdUSB
01
10, 01
09
bDeviceClass
bDeviceSubClass
bDeviceProtocol
bMaxPacketSize0
idVendor
00
00
-
40
packet size = 64 bytes
CC, 04 Philips Semiconductors vendor ID
(04CC); can be customized using an
external EEPROM (see Table 23)
10
idProduct
2
22, 11
ISP1122 product ID; can be
customized using an external
EEPROM (see Table 23)
12
14
bcdDevice
2
1
01, 01
device release 1.1; silicon revision
increments this value
iManufacturer
00
no manufacturer string (default)
[01]
manufacturer string enabled
(using an external EEPROM)
15
iProduct
1
00
no product string (default)
[02]
product string enabled
(using an external EEPROM)
16
17
iSerialNumber
1
1
00
01
no serial number string
one configuration
bNumConfigurations
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Table 11: Configuration descriptor
Values in square brackets are optional.
Offset
(bytes)
Field name
Size
Value
Comments
(bytes) (Hex)
0
1
2
bLength
1
1
2
09
descriptor length = 9 bytes
type = CONFIGURATION
bDescriptorType
wTotalLength
02
19, 00
total length of configuration, interface
and endpoint descriptors (25 bytes)
4
5
6
7
bNumInterfaces
bConfigurationValue
iConfiguration
1
1
1
1
01
one interface
01
configuration value = 1
00
no configuration string
bmAttributes
E0
A0
32
self-powered with remote wake-up[1]
bus-powered with remote wake-up[1]
100 mA (default)
8
MaxPower[2]
1
[00]
[FA]
0 mA (using an external EEPROM)
500 mA (using an external EEPROM)
[1] Selected by input SP/BP.
[2] Value in units of 2 mA.
Table 12: Interface descriptor
Offset
(bytes)
Field name
Size
Value
Comments
(bytes) (Hex)
0
1
2
3
4
5
6
7
8
bLength
1
1
1
1
1
1
1
1
1
09
04
00
01
01
09
00
00
00
descriptor length = 9 bytes
type = INTERFACE
-
bDescriptorType
bInterfaceNumber
bAlternateSetting
bNumEndpoints
bInterfaceClass
bInterfaceSubClass
bInterfaceProtocol
bInterface
no alternate setting
status change (interrupt) endpoint
HUB_CLASSCODE
-
no class-specific protocol
no interface string
Table 13: Endpoint descriptor
Offset
(bytes)
Field name
Size
Value
Comments
(bytes) (Hex)
0
1
2
3
4
6
bLength
1
1
1
1
2
1
07
descriptor length = 7 bytes
type = ENDPOINT
bDescriptorType
bEndpointAddress
bmAttributes
wMaxPacketSize
bInterval
05
81
endpoint 1, direction: IN
interrupt endpoint
03
01, 00
FF
packet size = 1 byte
polling interval (255 ms)
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Table 14: Hub descriptor
Values in square brackets are optional.
Offset
(bytes)
Field name
Size
Value
Comments
(bytes) (Hex)
0
1
2
bDescLength
bDescriptorType
bNbrPorts
1
1
1
09
29
descriptor length = 9 bytes
type = HUB
05 to 02 number of enabled downstream ports;
selectable by DP/DM strapping
3
wHubCharacteristics
2
09, 00
individual power switching[1]
,
overcurrent protection active
(modes 0, 1, 3, 4, 5, 7)
11, 00
individual power switching[1], no
overcurrent protection (modes 2, 6) [2]
5
6
bPwrOn2PwrGood[3]
bHubContrCurrent
1
1
32
100 ms (default; modes 0, 1, 2, 4, 5, 6)
0 ms (default; modes 3, 7)
00
[FA]
500 ms (using an external EEPROM;
modes 0, 1, 2, 4, 5, 6); see Table 23
64
maximum hub controller current
(100 mA)
7
8
DeviceRemovable
PortPwrCtrlMask
1
1
00
FF
all devices removable
must be all ones for compatibility with
USB Specification Rev. 1.0
[1] ISP1122 always reports power management status on an individual basis, even for ganged/global
modes. This is compliant with USB Specification Rev. 1.1.
[2] Condition with no overcurrent detection is reported to the host.
[3] Value in units of 2 ms.
Table 15: String descriptors
String descriptors are optional and therefore disabled by default; they can be enabled through
an external EEPROM.
Offset
(bytes)
Field name
Size
Value
Comments
(bytes) (Hex)
String descriptor (0): language ID string
0
1
2
bLength
1
1
2
04
descriptor length = 4 bytes
type = STRING
bDescriptorType
bString
03
09, 04
LANGID code zero
String descriptor (1): manufacturer string
0
1
2
bLength
1
2E
descriptor length = 46 bytes
type = STRING
bDescriptorType
bString
1
03
UC[1]
44
“Philips Semiconductors”
String descriptor (2): product string
0
1
2
bLength
1
10
descriptor length = 16 bytes
type = STRING
bDescriptorType
bString
1
03
UC[1]
14
“ISP1122”
[1] Unicode encoded string.
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9.4 Hub responses
This section describes the hub responses to requests from the USB host.
9.4.1 Get device status
The hub returns 2 bytes, see Table 16.
Table 16: Get device status response
Bit #
Function
Value
Description
0
self-powered
0
1
0
1
0
bus-powered
self-powered
no remote wake-up
remote wake-up enabled
-
1
remote wake-up
reserved
2 to 15
9.4.2 Get configuration
The hub returns 1 byte, see Table 17.
Table 17: Get configuration response
Bit #
Function
Value
Description
device not configured
device configured
-
0
configuration value
0
1
0
1 to 7
reserved
9.4.3 Get interface status
The hub returns 2 bytes, see Table 18.
Table 18: Get interface status response
Bit #
Function
Value
Description
0 to 15
reserved
0
-
9.4.4 Get hub status
The hub returns 4 bytes, see Table 19.
Table 19: Get hub status response
Bit #
Function
Value
Description
0
local power source
0
1
0
1
0
0
1
local power supply good
local power supply lost
no overcurrent condition
hub overcurrent condition detected
-
1
overcurrent indicator
2 to 15
16
reserved
local power status change
no change in local power status
local power status changed
no change in overcurrent condition
overcurrent condition changed
-
17
overcurrent indicator change 0
1
18 to 31 reserved
0
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9.4.5 Get port status
The hub returns 4 bytes. The first 2 bytes contain the port status bits (wPortStatus,
see Table 20). The last 2 bytes hold the port status change bits (wPortChange, see
Table 21).
Table 20: Get port status response (wPortStatus)
Bit #
Function
Value
Description
0
current connect status
0
1
0
1
0
1
0
1
0
1
0
0
1
0
1
0
no device present
device present on this port
port disabled
1
2
3
4
port enabled/disabled
suspend
port enabled
port not suspended
port suspended
no overcurrent condition
overcurrent condition detected
reset not asserted
reset asserted
overcurrent indicator
reset
5 to 7
8
reserved
-
port power
port powered off
port power on
9
low-speed device attached
full-speed device attached
low-speed device attached
-
10 to 15 reserved
Table 21: Get port status response (wPortChange)
Bit #
Function
Value
Description
0
connect status change
0
1
0
1
0
1
no change in current connect status
current connect status changed
no port error
1
port enabled/disabled
change
port disabled by a port error
no change in suspend status
resume complete
2
suspend change
3
overcurrent indicator change 0
1
no change in overcurrent status
overcurrent indicator changed
no change in reset status
reset complete
4
reset change
0
1
0
5 to 15
reserved
-
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9.4.6 Get configuration descriptor
The hub returns 25 bytes containing the configuration descriptor (9 bytes, see
Table 11), the interface descriptor (9 bytes, see Table 12) and the endpoint descriptor
(7 bytes, see Table 13).
9.4.7 Get device descriptor
The hub returns 18 bytes containing the device descriptor, see Table 10.
9.4.8 Get hub descriptor
The hub returns 9 bytes containing the hub descriptor, see Table 14.
9.4.9 Get string descriptor (0)
The hub returns 4 bytes containing the language ID, see Table 15.
9.4.10 Get string descriptor (1)
The hub returns 46 bytes containing the manufacturer name, see Table 15.
9.4.11 Get string descriptor (2)
The hub returns 16 bytes containing the product name, see Table 15.
10. I2C-bus interface
A simple I2C-bus interface is provided in the ISP1122 to read customized vendor ID,
product ID and some other configuration bits from an external EEPROM. The
interface supports single master operation at a nominal bus speed of 93.75 kHz.
The I2C-bus interface is intended for bidirectional communication between ICs via two
serial bus wires, SDA (data) and SCL (clock). Both lines are driven by open-drain
circuits and must be connected to the positive supply voltage via pull-up resistors.
10.1 Protocol
The I2C-bus protocol defines the following conditions:
Bus free: both SDA and SCL are HIGH
•
•
•
•
START: a HIGH-to-LOW transition on SDA, while SCL is HIGH
STOP: a LOW-to-HIGH transition on SDA, while SCL is HIGH
Data valid: after a START condition, data on SDA are stable during the HIGH
period of SCL; data on SDA may only change while SCL is LOW.
Each device on the I2C-bus has a unique slave address, which the master uses to
select a device for access.
The master starts a data transfer using a START condition and ends it by generating
a STOP condition. Transfers can only be initiated when the bus is free. The receiver
must acknowledge each byte by means of a LOW level on SDA during the ninth clock
pulse on SCL.
For detailed information please consult The I2C-bus and how to use it., order number
9398 393 40011.
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10.2 Hardware connections
Via the I2C-bus interface the ISP1122 can be connected to an external EEPROM
(PCF8582 or equivalent). The hardware connections are shown in Figure 5.
The SCL and SDA pins are multiplexed with pins OPTION and INDV respectively.
V
V
DD
id
DD
R
R
P
P
SCL
SDA
OPTION/SCL
INDV/SDA
A0
A1
A2
2
I C-bus
PCF8582
ISP1122
USB HUB
EEPROM
or
equivalent
MGR780
Fig 5. EEPROM connection diagram.
The slave address which ISP1122 uses to access the EEPROM is 1010000B. Page
mode addressing is not supported, so pins A0, A1 and A2 of the EEPROM must be
connected to GND (logic 0).
10.3 Data transfer
When the ISP1122 is reset, the I2C-bus interface tries to read 6 bytes of configuration
data from an external EEPROM. If no response is detected, the levels on inputs SDA
and SCL are interpreted as INDV and OPTION to select the operating mode (see
Table 4).
The data in the EEPROM memory are organized as shown in Table 22.
Table 22: EEPROM organization
Address
(Hex)
Default value
(Hex)
Contents
00
01
02
03
04
05
CC
04
22
11
-
idVendor [1] (lower byte)
idVendor [1] (upper byte)
idProduct [2] (lower byte)
idProduct [2] (upper byte)
configuration bits C7 to C0; see Table 23
signature
AA
[1] Vendor ID code in the Device descriptor, see Table 10.
[2] Product ID code in the Device descriptor, see Table 10.
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Table 23: Configuration bits
Bit
Function
Value
(Bin)
Description
C0
C1
C2
C3
OPTION
see Table 4 “Mode selection”
see Table 4 “Mode selection”
INDV
reserved
PwrOn2PwrGood[2]
0[1]
0[1]
1
must always be programmed to logic 0
100 ms (bPwrOn2PwrGood = 32H)
500 ms (bPwrOn2PwrGood = FAH)
string descriptors disabled
C4
C5
string descriptor enable
0[1]
1
string descriptors enabled (strings:
“Philips Semiconductors”, “ISP1122”)
internal analog overcurrent
detection enable
0
internal analog overcurrent detection
circuit disabled; overcurrent pins OCn
function as digital inputs (TTL level)
1[1]
internal analog overcurrent detection
circuit enabled
C7, C6
MaxPower[3]
00[1]
1X
100 mA (MaxPower = 32H)
500 mA (MaxPower = FAH)
0 mA (MaxPower = 00H)
01
[1] Default value at reset if no external EEPROM is present.
[2] Modifies the Hub Descriptor field ‘bPwrOn2PwrGood’, see Table 14.
[3] Modifies the Hub Descriptor field ‘MaxPower’, see Table 14.
11. Hub power modes
USB hubs can either be self-powered or bus-powered.
Self-powered — Self-powered hubs have a 5 V local power supply on board which
provide power to the hub and the downstream ports. The USB Specification Rev. 1.1
requires that these hubs limit the current to 500 mA per downstream port and report
overcurrent conditions to the host. The hub may optionally draw 100 mA from the
USB supply (VBUS) to power the interface functions (hybrid-powered).
Bus-powered — Bus-powered hubs obtain all power from the host or an upstream
self-powered hub. The maximum current is 100 mA per downstream port. Current
limiting and reporting of overcurrent conditions are both optional.
Power switching of downstream ports can be done individually or ganged, where all
ports are switched simultaneously with one power switch. The ISP1122 supports both
modes, which can be selected using input INDV (see Table 4).
11.1 Voltage drop requirements
11.1.1 Self-powered hubs
Self-powered hubs are required to provide a minimum of 4.75 V to its output port
connectors at all legal load conditions. To comply with Underwriters Laboratory Inc.
(UL) safety requirements, the power from any port must be limited to 25 W (5 A at
5 V). Overcurrent protection may be implemented on a global or individual basis.
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Assuming a 5 V ± 3% power supply the worst case supply voltage is 4.85 V. This only
allows a voltage drop of 100 mV across the hub printed-circuit board (PCB) to each
downstream connector. This includes a voltage drop across:
Power supply connector
•
•
•
•
Hub PCB (power and ground traces, ferrite beads)
Power switch (FET on-resistance)
Overcurrent sense device.
PCB resistance and power supply connector resistance may cause a drop of 25 mV,
leaving only 75 mV as the voltage drop allowed across the power switch and
overcurrent sense device. The individual voltage drop components are shown in
Figure 6.
voltage drop
75 mV
voltage drop
25 mV
4.85 V(min)
4.75 V(min)
V
5 V
+
−
BUS
POWER SUPPLY
± 3% regulated
hub board
D+
(1)
downstream
port
connector
low-ohmic
PMOS switch
resistance
D−
ISP1122
power
switch
GND
SHIELD
MGR781
(1) Includes PCB traces, ferrite beads, etc.
Fig 6. Typical voltage drop components in self-powered mode using individual overcurrent detection.
In case of global overcurrent detection an increased voltage drop is needed for the
overcurrent sense device (in this case a low-ohmic resistor). This can be realized by
using a special power supply of 5.1 V ± 3%, as shown in Figure 7.
voltage drop
100 mV
voltage drop
75 mV
voltage drop
25 mV
4.95 V(min)
4.75 V(min)
V
5.1 V KICK-UP
POWER SUPPLY
± 3% regulated
+
−
BUS
low-ohmic
sense resistor
for overcurrent
detection
hub board
resistance
D+
(1)
downstream
port
connector
low-ohmic
PMOS switch
D−
ISP1122
power
GND
SHIELD
switch
MGR782
(1) Includes PCB traces, ferrite beads, etc.
Fig 7. Typical voltage drop components in self-powered mode using global overcurrent detection.
11.1.2 Bus-powered hubs
Bus-powered hubs are guaranteed to receive a supply voltage of 4.5 V at the
upstream port connector and must provide a minimum of 4.4 V to the downstream
port connectors. The voltage drop of 100 mV across bus-powered hubs includes:
Hub PCB (power and ground traces, ferrite beads)
Power switch (FET on-resistance)
Overcurrent sense device.
•
•
•
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The PCB resistance may cause a drop of 25 mV, which leaves 75 mV for the power
switch and overcurrent sense device. The voltage drop components are shown in
Figure 8.
For bus-powered hubs overcurrent protection is optional. It may be implemented for
all downstream ports on a global or individual basis.
voltage drop
75 mV
voltage drop
25 mV
4.50 V(min)
4.40 V(min)
V
V
BUS
BUS
hub board
resistance
D+
D+
(1)
upstream
port
connector
downstream
port
connector
low-ohmic
PMOS switch
D−
D−
ISP1122
power
switch
GND
GND
SHIELD
SHIELD
MGR783
(1) Includes PCB traces, ferrite beads, etc.
Fig 8. Typical voltage drop components in bus-powered mode (no overcurrent detection).
12. Overcurrent detection
The ISP1122 has an analog overcurrent detection circuit for monitoring downstream
port lines. This circuit automatically reports an overcurrent condition to the host and
turns off the power to the faulty port. The host must reset the condition flag.
Pins OC1 to OC5/GOC are used for individual port overcurrent detection. Pin
OC5/GOC can also be used for global overcurrent detection. This is controlled by
input INDV (see Table 4).
The overcurrent detection circuit can be switched off using an external EEPROM (see
Table 23). In this case, the overcurrent pins OCn function as logic inputs (TTL level).
12.1 Overcurrent circuit description
The integrated overcurrent detection circuit of ISP1122 senses the voltage drop
across the power switch or an extra low-ohmic sense resistor. When the port draws
too much current, the voltage drop across the power switch exceeds the trip voltage
threshold (∆Vtrip). The overcurrent circuit detects this and switches off the power
switch control signal after a delay of 15 ms (ttrip). This delay acts as a ‘debounce’
period to minimize false tripping, especially during the inrush current produced by ‘hot
plugging’ of a USB device.
12.2 Power switch selection
From the voltage drop analysis given in Figure 6, Figure 7 and Figure 8, the power
switch has a voltage drop budget of 75 mV. For individual self-powered mode, the
current drawn per port can be up to 500 mA. Thus the power switch should have
maximum on-resistance of 150 mΩ.
If the voltage drop due to the hub board resistance can be minimized, the power
switch can have more voltage drop budget and therefore a higher on-resistance.
Power switches with a typical on-resistance of around 100 mΩ fit into this application.
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The ISP1122 overcurrent detection circuit has been designed with a nominal trip
voltage (∆Vtrip) of 85 mV. This gives a typical trip current of approximately 850 mA for
a power switch with an on-resistance of 100 mΩ1.
12.3 Tuning the overcurrent trip voltage
The ISP1122 trip voltage can optionally be adjusted through external components to
set the desired trip current. This is done by inserting tuning resistors at pins SP/BP or
OCn (see Figure 9). Rtu tunes up the trip voltage ∆Vtrip and Rtd tunes it down
according to Equation 1.
∆Vtrip = ∆Vtrip(intrinsic) + Iref Rtu – IOC Rtd
with Iref(nom) = 5 µA and IOC(nom) = 0.5 µA.
(1)
handbook, halfpage
low-ohmic
handbook, halfpage
low-ohmic
PMOS switch
PMOS switch
V
V
CC
BUS
I
I
I
ref
OC
OC
R
R
R
td
tu
td
V
SP/BP
OCn
V
SP/BP
OCn
CC
CC
ISP1122
ISP1122
MBL042
MBL043
Iref(nom) = 5 µA
IOC(nom) = 0.5 µA
IOC(nom) = 0.5 µA
a. Self-powered mode.
Fig 9. Tuning the overcurrent trip voltage.
b. Bus-powered mode.
12.4 Reference circuits
Some typical examples of port power switching and overcurrent detection modes are
given in Figure 10 to Figure 13.
The RC circuit (47 kΩ and 0.1 µF) around the PMOS switch provides for soft turn-on.
The series resistor connecting the SP/BP pin to VCC tunes up the overcurrent trip
voltage slightly (see Figure 9). In the schematic diagram the resistor separates the
net names for pins VCC and SP/BP. This allows an automatic router to use a wide
trace for VCC and a narrow trace to connect pin SP/BP.
1. The following PMOS power switches have been tested to work well with the ISP1122: Philips PHP109, Vishay Siliconix Si2301DS,
Fairchild FDN338P.
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downstream
ports
low-ohmic
PMOS switch
ferrite bead
+4.85 V(min)
5 V
POWER SUPPLY
± 3%
V
+
−
BUS
+4.75 V
(min)
1
120
D+
0.1 µF
47 kΩ
µF
D−
1
2
3
GND
SHIELD
low-ohmic
PMOS switch
ferrite bead
330 kΩ
(5×)
V
BUS
+4.75 V
(min)
2
120
µF
D+
0.1 µF
47 kΩ
D−
GND
SHIELD
low-ohmic
PMOS switch
+4.85 V(min)
ferrite bead
V
CC
V
PSW1/GL1
PSW2/GL2
BUS
+4.75 V
(min)
3
120
µF
D+
GND
0.1 µF
47 kΩ
D−
GND
SHIELD
PSW3/GL3
100 Ω
to
1 kΩ
PSW4/GL4
low-ohmic
PMOS switch
ferrite bead
PSW5/GL5/GPSW
V
BUS
+4.75 V
(min)
4
120
µF
D+
0.1 µF
47 kΩ
D−
4
INDV
GND
SHIELD
SP/BP
low-ohmic
PMOS switch
ferrite bead
OPTION
V
BUS
+4.75 V
(min)
5
120
µF
D+
0.1 µF
47 kΩ
ISP1122
D−
5
GND
SHIELD
OC1
OC2
OC3
OC4
MGR784
OC5/GOC
Power switches 1 to 5 are low-ohmic PMOS devices as specified in Section 12.2.
Fig 10. Mode 5: self-powered hub; individual port power switching; individual overcurrent detection.
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downstream
d
ports
ferrite bead
+4.95 V(min)
V
+
−
5.1 V KICK-UP
POWER SUPPLY
BUS
+4.75 V
(min)
120
µF
D+
± 3%
low-ohmic
D−
1
2
3
4
5
sense resistor
for overcurrent
detection
GND
SHIELD
330
kΩ
+4.95 V(min)
ferrite bead
V
CC
V
BUS
PSW1/GL1
PSW2/GL2
PSW3/GL3
+4.75 V
(min)
120
µF
D+
GND
D−
low-ohmic
PMOS switch
GND
SHIELD
100 Ω
to
1 kΩ
0.1 µF
47 kΩ
PSW4/GL4
ferrite bead
V
PSW5/GL5/GPSW
BUS
+4.75 V
(min)
120
µF
D+
D−
GND
SHIELD
INDV
SP/BP
ferrite bead
OPTION
V
BUS
+4.75 V
(min)
120
µF
D+
ISP1122
D−
GND
SHIELD
OC1
OC2
OC3
OC4
ferrite bead
V
BUS
+4.75 V
(min)
120
µF
D+
D−
OC5/GOC
GND
SHIELD
MGR785
Power switch is low-ohmic PMOS device as specified in Section 12.2.
Fig 11. Mode 1: self-powered hub; ganged port power switching; global overcurrent detection.
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upstream
port
downstream
ports
low-ohmic
PMOS switch
ferrite bead
+4.50 V(min)
V
V
BUS
BUS
+4.40 V
(min)
1
120
D+
D+
0.1 µF
47 kΩ
µF
D−
D−
1
2
3
4
GND
GND
SHIELD
330 kΩ
(4×)
SHIELD
low-ohmic
PMOS switch
ferrite bead
V
BUS
+4.40 V
(min)
2
120
µF
D+
0.1 µF
47 kΩ
PSW1/GL1
V
D−
CC
GND
SHIELD
PSW2/GL2
PSW3/GL3
GND
low-ohmic
PMOS switch
ferrite bead
PSW4/GL4
V
BUS
+4.40 V
(min)
3
120
µF
D+
PSW5/GL5/GPSW
0.1 µF
47 kΩ
D−
GND
SHIELD
INDV
low-ohmic
PMOS switch
ferrite bead
V
SP/BP
OPTION
BUS
+4.40 V
(min)
4
120
µF
D+
0.1 µF
47 kΩ
D−
GND
SHIELD
ISP1122
MGR786
OC1
OC2
OC3
OC4
OC5/GOC
Power switches 1 to 4 are low-ohmic PMOS devices as specified in Section 12.2.
Fig 12. Mode 4: bus-powered hub; individual port power switching; individual overcurrent detection.
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upstream
port
downstream
ports
ferrite bead
+4.50 V(min)
V
V
BUS
BUS
+4.40 V
(min)
120
D+
D+
µF
D−
D−
1
2
3
4
GND
GND
SHIELD
SHIELD
330
kΩ
ferrite bead
V
BUS
+4.40 V
(min)
120
µF
D+
V
PSW1/GL1
PSW2/GL2
PSW3/GL3
D−
CC
GND
SHIELD
low-ohmic
PMOS switch
GND
ferrite bead
0.1 µF
47 kΩ
PSW4/GL4
V
BUS
+4.40 V
(min)
120
µF
D+
PSW5/GL5/GPSW
INDV
D−
GND
SHIELD
SP/BP
ferrite bead
OPTION
V
BUS
+4.40 V
(min)
120
µF
D+
D−
ISP1122
GND
SHIELD
MGR787
OC1
OC2
OC3
OC4
OC5/GOC
Power switch is low-ohmic PMOS device as specified in Section 12.2.
Fig 13. Mode 0: bus-powered hub; ganged port power switching; global overcurrent detection.
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13. Limiting values
Table 24: Absolute maximum ratings
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCC
Parameter
Conditions
Min
−0.5
−0.5
-
Max
Unit
V
supply voltage
+6.0
VI
input voltage
VCC + 0.5
V
Ilatchup
Vesd
Tstg
latchup current
VI < 0 or VI > VCC
200
mA
V
[1] [2]
electrostatic discharge voltage
storage temperature
total power dissipation
ILI < 15 µA
-
±4000[3]
+150
−60
-
°C
mW
Ptot
95
[1] Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor (Human Body Model).
[2] Values are given for device only; in-circuit Vesd(max) = ±8000 V.
[3] For open-drain pins Vesd(max) = ±2000 V.
Table 25: Recommended operating conditions
Symbol
VCC
Parameter
Conditions
Min
Max
5.5
5.5
3.6
Unit
supply voltage
input voltage
4.0
0
V
V
V
VI
VI(AI/O)
input voltage on analog I/O pins
0
(D+/D−)
VO(od)
Tamb
open-drain output pull-up voltage
operating ambient temperature
0
5.5
V
−40
+85
°C
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14. Static characteristics
Table 26: Static characteristics; supply pins
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol
Vreg(3.3)
ICC
Parameter
Conditions
Min
3.0[1]
Typ
3.3
18
-
Max
3.6
-
Unit
V
regulated supply voltage
operating supply current
suspend supply current
-
-
mA
µA
ICC(susp
)
1.5 kΩ pull-up on upstream
port D+ (pin DP0)
270
no pull-up on upstream port
-
-
80
µA
D+ (pin DP0)
[1] In ‘suspend’ mode the minimum voltage is 2.7 V.
Table 27: Static characteristics: digital pins
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol
Input levels
VIL
Parameter
Conditions
Min
Typ
Max
Unit
LOW-level input voltage
HIGH-level input voltage
-
-
-
0.8
-
V
V
VIH
2.0
Schmitt trigger inputs
Vth(LH) positive-going threshold
1.4
0.9
0.4
-
-
-
1.9
1.5
0.7
V
V
V
voltage
Vth(HL)
negative-going threshold
voltage
Vhys
hysteresis voltage
Output levels
VOL
LOW-level output voltage
(open drain outputs)
IOL = 6 mA
-
-
-
-
0.4
0.1
V
V
IOL = 20 µA
Leakage current
ILI
input leakage current
-
-
-
-
±1
±1
µA
µA
Open-drain outputs
IOZ
OFF-state output current
Table 28: Static characteristics: overcurrent sense pins
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
[1]
[2]
overcurrent detection
trip voltage on OCn pins
∆V = VCC − VOCn
∆V = VSP/BP − VOCn
∆Vtrip
65
85
105
mV
[1] Bus-powered mode.
[2] Self-powered or hybrid-powered mode.
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Table 29: Static characteristics: analog I/O pins (D+, D−)[1]
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol
Input levels
VDI
Parameter
Conditions
Min
Typ
Max
Unit
differential input sensitivity
|VI(D+) − VI(D−)
|
0.2
0.8
-
-
-
V
V
VCM
differential common mode
voltage
includes VDI range
2.5
VIL
LOW-level input voltage
HIGH-level input voltage
-
-
-
0.8
-
V
V
VIH
2.0
Output levels
VOL
VOH
LOW-level output voltage
HIGH-level output voltage
RL = 1.5 kΩ to +3.6V
RL = 15 kΩ to GND
-
-
-
0.3
3.6
V
V
2.8
Leakage current
ILZ
OFF-state leakage current
-
-
-
-
±10
µA
Capacitance
CIN
transceiver capacitance
pin to GND
20
pF
Resistance
[2]
ZDRV
driver output impedance
input impedance
steady-state drive
28
10
-
-
44
-
Ω
ZINP
MΩ
Termination
[3]
VTERM
termination voltage for
3.0[4]
-
3.6
V
upstream port pull-up (RPU
)
[1] D+ is the USB positive data pin (DPn); D− is the USB negative data pin (DMn).
[2] Includes external resistors of 20 Ω ±1% on both D+ and D−.
[3] This voltage is available at pin Vreg(3.3)
.
[4] In ‘suspend’ mode the minimum voltage is 2.7 V.
15. Dynamic characteristics
Table 30: Dynamic characteristics
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol
Reset
Parameter
Conditions
Min
Typ
Max
Unit
tW(RESET)
pulse width on input RESET
crystal oscillator running
crystal oscillator stopped
10
-
-
-
-
µs
2[1]
ms
Crystal oscillator
fXTAL
crystal frequency
-
6
-
MHz
[1] Dependent on the crystal oscillator start-up time.
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Table 31: Dynamic characteristics: overcurrent sense pins
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
[1]
ttrip
overcurrent trip response time see Figure 14
from OCn LOW to PSWn HIGH
-
-
15
ms
[1] Operating modes 0, 1, 4 and 5; see Table 4.
Table 32: Dynamic characteristics: analog I/O pins (D+, D−); full-speed mode[1]
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; CL = 50 pF; RPU = 1.5 kΩ on D+ to VTERM.; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Driver characteristics
tFR
rise time
CL = 50 pF;
10 to 90% of |VOH − VOL
4
-
-
-
-
20
ns
ns
%
V
|
tFF
fall time
CL = 50 pF;
10 to 90% of |VOH − VOL
4
20
|
[2]
FRFM
differential rise/fall time
matching (tFR/tFF
90
1.3
111.11
2.0
)
[2] [3]
VCRS
output signal crossover voltage
Data source timing
tDJ1 source differential jitter for
[2] [3]
[2] [3]
see Figure 15
see Figure 15
see Figure 16
−3.5
−4
-
-
+3.5
+4
ns
ns
consecutive transitions
tDJ2
source differential jitter for
paired transitions
[3]
[3]
tFEOPT
tFDEOP
source EOP width
160
-
-
175
ns
ns
source differential data-to-EOP see Figure 16
transition skew
−2
+5
Receiver timing
[3]
[3]
[3]
[3]
tJR1
receiver data jitter tolerance for see Figure 17
consecutive transitions
−18.5
−9
-
-
-
-
+18.5
+9
ns
ns
ns
ns
tJR2
receiver data jitter tolerance for see Figure 17
paired transitions
tFEOPR
tFST
receiver SE0 width
accepted as EOP;
see Figure 16
82
-
width of SE0 during differential rejected as EOP;
transition see Figure 18
Hub timing (downstream ports configured as full-speed)
-
14
[3]
[3]
tFHDD
hub differential data delay
(without cable)
see Figure 19;
CL = 0 pF
-
-
-
44
ns
ns
tFSOP
data bit width distortion after
SOP
see Figure 19
−5
+5
[3]
[3]
tFEOPD
tFHESK
hub EOP delay relative to tHDD see Figure 20
hub EOP output width skew see Figure 20
0
-
-
15
ns
ns
−15
+15
[1] Test circuit: see Figure 22.
[2] Excluding the first transition from Idle state.
[3] Characterized only, not tested. Limits guaranteed by design.
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33 of 48
ISP1122
USB stand-alone hub
Philips Semiconductors
Table 33: Dynamic characteristics: analog I/O pins (D+, D−); low-speed mode[1]
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = −40 to +85 °C; CL = 50 pF; RPU = 1.5 kΩ on D− to VTERM; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Driver characteristics
tLR
rise time
CL = 200 to 600 pF;
10 to 90% of |VOH − VOL
75
75
80
1.3
-
-
-
-
300
300
125
2.0
ns
ns
%
V
|
tLF
fall time
CL = 200 to 600 pF;
10 to 90% of |VOH − VOL
|
[2]
LRFM
differential rise/fall time
matching (tLR/tLF
)
[2] [3]
VCRS
output signal crossover voltage
Hub timing (downstream ports configured as low-speed)
tLHDD
tLSOP
hub differential data delay
see Figure 19
see Figure 19
-
-
-
300
ns
ns
[3]
data bit width distortion after
SOP
−60
+60
[3]
[3]
tLEOPD
tLHESK
hub EOP delay relative to tHDD see Figure 20
hub EOP output width skew see Figure 20
0
-
-
200
ns
ns
−300
+300
[1] Test circuit: see Figure 22.
[2] Excluding the first transition from Idle state.
[3] Characterized only, not tested. Limits guaranteed by design.
V
handbook, halfpage
CC
∆V
trip
overcurrent
input
0 V
t
trip
V
CC
power switch
output
MBL032
0 V
Overcurrent input: OCn; power switch output: PSWn.
Reference voltage for overcurrent sensing: VCC (bus-powered mode) or VSP/BP (self-powered mode).
Fig 14. Overcurrent trip response timing.
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ISP1122
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T
PERIOD
+3.3 V
crossover point
crossover point
crossover point
differential
data lines
0 V
MGR870
consecutive
transitions
+ t
N × T
PERIOD DJ1
paired
transitions
N × T
+ t
PERIOD DJ2
TPERIOD is the bit duration corresponding with the USB data rate.
Fig 15. Source differential data jitter.
T
h
PERIOD
+3.3 V
crossover point
extended
crossover point
differential
data lines
0 V
differential data to
SE0/EOP skew
N × T + t
source EOP width: t
EOPT
receiver EOP width: t
EOPR
PERIOD DEOP
MGR776
TPERIOD is the bit duration corresponding with the USB data rate.
Full-speed timing symbols have a subscript prefix ‘F’, low-speed timings a prefix ‘L’.
Fig 16. Source differential data-to-EOP transition skew and EOP width.
T
PERIOD
+3.3 V
differential
data lines
0 V
MGR871
t
t
t
JR
JR1
JR2
consecutive
transitions
N × T
+ t
PERIOD JR1
paired
transitions
N × T
+ t
PERIOD JR2
TPERIOD is the bit duration corresponding with the USB data rate.
Fig 17. Receiver differential data jitter.
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handbook, halfpage
t
FST
+3.3 V
V
differential
data lines
IH(min)
0 V
MGR872
Fig 18. Receiver SE0 width tolerance.
+3.3 V
h
crossover
point
crossover
point
upstream
differential
data lines
downstream
differential
data
0 V
hub delay
downstream
hub delay
upstream
t
t
HDD
HDD
+3.3 V
crossover
point
crossover
point
downstream
differential
data lines
upstream
differential
data
0 V
MGR777
(A) downstream hub delay
(B) upstream hub delay
SOP distortion:
= t
t
− t
SOP HDD (next J) HDD(SOP)
Full-speed timing symbols have a subscript prefix ‘F’, low-speed timings a prefix ‘L’.
Fig 19. Hub differential data delay and SOP distortion.
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Product specification
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+3.3 V
h
crossover
point
extended
crossover
point
extended
upstream
differential
data lines
downstream
port
0 V
t
t
t
t
EOP+
EOP−
EOP+
EOP−
+3.3 V
crossover
point
extended
crossover
point
extended
downstream
differential
data lines
upstream
end of cable
0 V
MGR778
(A) downstream EOP delay
(B) upstream EOP delay
EOP delay:
t
= max (t
, t )
EOP− EOP+
EOP
EOP delay relative to t
:
HDD
t
= t
− t
EOPD EOP HDD
EOP skew:
= t
t
− t
HESK EOP+ EOP−
Full-speed timing symbols have a subscript prefix ‘F’, low-speed timings a prefix ‘L’.
Fig 20. Hub EOP delay and EOP skew.
Table 34: Dynamic characteristics: I2C-bus pins (SDA, SCL)
VCC and Tamb within recommended operating range; VDD = +5 V; VSS = VGND ; VIL and VIH between VSS and VDD
.
Symbol
fSCL
Parameter
Conditions
Min
0
Typ
93.75[1]
Max
Unit
kHz
µs
SCL clock frequency
bus free time
fXTAL = 6 MHz
100
tBUF
4.7
250
4.0
4.7
4.0
-
-
-
-
-
-
-
-
-
-
-
-
tSU;STA
tHD;STA
tLOW
START condition set-up time
hold time START condition
SCL LOW time
-
ns
-
µs
-
µs
tHIGH
tr
SCL HIGH time
-
µs
[2]
SCL and SDA rise time
SCL and SDA fall time
data set-up time
1000
300
-
ns
tf
-
ns
tSU;DAT
tHD;DAT
tVD;DAT
250
0
ns
data hold time
-
µs
SCL LOW to data out valid
time
-
0.4
µs
tSU;STO
Cb
STOP condition set-up time
4.0
-
-
-
-
µs
capacitive load for each bus
line
400
pF
[1] fSCL = 1⁄64 XTAL
.
f
[2] Rise time is determined by Cb and pull-up resistor value Rp (typ. 4.7 kΩ).
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h
SDA
t
t
t
t
t
HD;STA
BUF
LOW
r
f
SCL
P
P
S
S
t
t
t
t
t
t
HD;STA
HD;STA
HIGH
SU;DAT
SU;STA
SU;STO
MGR779
Fig 21. I2C-bus timing.
16. Test information
The dynamic characteristics of the analog I/O ports (D+ and D−) as listed in Table 32
and Table 33, were determined using the circuit shown in Figure 22.
V
handbook, halfpage
D.U.T.
reg(3.3)
test point
R
PU
1.5 kΩ
S1
20 Ω
test
S1
C
15 kΩ
L
D−/LS closed
D+/LS open
D−/FS open
closed
D+/FS
MGR775
Load capacitance:
CL = 50 pF (full-speed mode)
CL = 200 pF or 600 pF (low-speed mode, minimum or maximum timing).
Speed selection:
full-speed mode (FS): 1.5 kΩ pull-up resistor on D+
low-speed mode (LS): 1.5 kΩ pull-up resistor on D−.
Fig 22. Load impedance for D+ and D- pins.
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17. Package outline
SO32: plastic small outline package; 32 leads; body width 7.5 mm
SOT287-1
D
E
A
X
c
y
H
v
M
A
E
Z
17
32
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
16
1
w
M
detail X
b
p
e
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
E
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
max.
0.3
0.1
2.45
2.25
0.49
0.36
0.27 20.7
0.18 20.3
7.6
7.4
10.65
10.00
1.1
0.4
1.2
1.0
0.95
0.55
mm
2.65
0.25
0.01
1.27
0.050
1.4
0.25
0.01
0.25
0.01
0.1
8o
0o
0.012 0.096
0.004 0.086
0.02 0.011 0.81
0.01 0.007 0.80
0.30
0.29
0.419
0.394
0.043 0.047
0.016 0.039
0.037
0.022
inches 0.10
0.004
0.055
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
97-05-22
99-12-27
SOT287-1
MO-119
Fig 23. SO32 package outline.
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SDIP32: plastic shrink dual in-line package; 32 leads (400 mil)
SOT232-1
D
M
E
A
2
A
A
L
1
c
(e )
w M
e
Z
1
b
1
M
H
b
32
17
pin 1 index
E
1
16
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
max.
A
A
2
max.
(1)
(1)
Z
1
w
UNIT
b
b
c
D
E
e
e
L
M
M
H
1
1
E
min.
max.
1.3
0.8
0.53
0.40
0.32
0.23
29.4
28.5
9.1
8.7
3.2
2.8
10.7
10.2
12.2
10.5
mm
4.7
0.51
3.8
1.778
10.16
0.18
1.6
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-04
SOT232-1
Fig 24. SDIP32 package outline.
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LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm
SOT358-1
c
y
X
A
24
17
25
16
Z
E
e
H
E
A
E
(A )
3
2
A
A
1
w M
p
θ
b
L
p
pin 1 index
L
32
9
detail X
1
8
e
Z
D
v M
A
w M
b
p
D
B
H
v M
B
D
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.
7o
0o
0.20 1.45
0.05 1.35
0.4 0.18 7.1
0.3 0.12 6.9
7.1
6.9
9.15 9.15
8.85 8.85
0.75
0.45
0.9
0.5
0.9
0.5
mm
1.60
0.25
0.8
1.0
0.2 0.25 0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
99-12-27
00-01-19
SOT358 -1
136E03
MS-026
Fig 25. LQFP32 package outline.
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18. Soldering
18.1 Introduction
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering is often
preferred when through-hole and surface mount components are mixed on one
printed-circuit board. However, wave soldering is not always suitable for surface
mount ICs, or for printed-circuit boards with high population densities. In these
situations reflow soldering is often used.
18.2 Surface mount packages
18.2.1 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, infrared/convection heating in a
conveyor type oven. Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 250 °C. The top-surface
temperature of the packages should preferable be kept below 230 °C.
18.2.2 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
•
•
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45° angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
•
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During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.
18.2.3 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320 °C.
18.3 Through-hole mount packages
18.3.1 Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is 260 °C; solder at this
temperature must not be in contact with the joints for more than 5 seconds. The total
contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (Tstg(max)).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
18.3.2 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400 °C, contact may be up to 5 seconds.
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18.4 Package related soldering information
Table 35: Suitability of IC packages for wave, reflow and dipping soldering methods
Mounting
Package
Soldering method
Wave
Reflow[1] Dipping
Through-hole
mount
DBS, DIP, HDIP, SDIP, SIL suitable[2]
−
suitable
Surface mount
BGA, LFBGA, SQFP,
TFBGA
not suitable
suitable
suitable
−
−
HBCC, HLQFP, HSQFP,
HSOP, HTQFP, HTSSOP,
SMS
not suitable[3]
PLCC[4], SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
suitable
−
−
−
not recommended[4] [5] suitable
not recommended[6]
suitable
[1] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods.
[2] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
[3] These packages are not suitable for wave soldering as a solder joint between the printed-circuit board
and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top
version).
[4] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[5] Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger
than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[6] Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
9397 750 07002
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19. Revision history
Table 36: Revision history
Rev Date
CPCN
Description
03 20000329
Product specification, third version; supersedes ISP1122-02 of 4 October 1999
(9397 750 06389). Modifications:
Table 1 “Ordering information”: table note on LQFP32 availability removed
•
Table 23 “Configuration bits”: values of bits C7 and C6 exchanged
•
Section 12.4 “Reference circuits”: resistor value for soft turn-on RC-circuit changed from
10 kΩ to 47 kΩ; see also Figure 10 to 13.
•
02 19991004
Product specification, second version; supersedes initial version ISP1122-01 of
3 June 1999 (9397 750 05154). Modifications:
Terminology made consistent: ganged power switching, global overcurrent detection
•
Added note on availability of LQFP32 to Table 1 “Ordering information”
•
Updated reference circuits in Section 12.4 “Reference circuits”: pull-up resistors changed
to 330 kΩ, soft turn-on RC network: capacitor moved and changed to 0.1 µF
•
Updated Figure 22 “Load impedance for D+ and D- pins.”: VCC -> Vreg(3.3)
.
•
01 19990603
Product specification; initial version.
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20. Data sheet status
Datasheet status
Product status Definition[1]
Objective specification
Development
This data sheet contains the design target or goal specifications for product development. Specification may
change in any manner without notice.
Preliminary specification Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any
time without notice in order to improve design and supply the best possible product.
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
21. Definitions
Short-form specification — The data in
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
a short-form specification is
Right to make changes — Philips Semiconductors reserves the right to
make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve
design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products
are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
23. Licenses
Purchase of Philips I2C components
Purchase of Philips I2C components conveys a license
under the Philips’ I2C patent to use the components in the
I2C system provided the system conforms to the I2C
specification defined by Philips. This specification can be
ordered using the code 9398 393 40011.
22. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
24. Trademarks
ACPI — is an open industry specification for PC power management,
co-developed by Intel Corp., Microsoft Corp. and Toshiba
SMBus — is a bus specification for PC power management, developed by
Intel Corp. based on the I2C-bus from Royal Philips Electronics
GoodLink — is a trademark of Royal Philips Electronics
OnNow — is a trademark of Microsoft Corp.
SoftConnect — is a trademark of Royal Philips Electronics
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Philips Semiconductors - a worldwide company
Argentina: see South America
Netherlands: Tel. +31 40 278 2785, Fax. +31 40 278 8399
Australia: Tel. +61 2 9704 8141, Fax. +61 2 9704 8139
Austria: Tel. +43 160 101, Fax. +43 160 101 1210
Belarus: Tel. +375 17 220 0733, Fax. +375 17 220 0773
Belgium: see The Netherlands
New Zealand: Tel. +64 98 49 4160, Fax. +64 98 49 7811
Norway: Tel. +47 22 74 8000, Fax. +47 22 74 8341
Philippines: Tel. +63 28 16 6380, Fax. +63 28 17 3474
Poland: Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
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Bulgaria: Tel. +359 268 9211, Fax. +359 268 9102
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Denmark: Tel. +45 3 288 2636, Fax. +45 3 157 0044
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Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: Tel. +381 11 3341 299, Fax. +381 11 3342 553
Middle East: see Italy
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications,
Building BE, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 272 4825
Internet: http://www.semiconductors.philips.com
(SCA69)
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Contents
1
2
3
4
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
11
11.1
11.1.1
11.1.2
Hub power modes . . . . . . . . . . . . . . . . . . . . . . 22
Voltage drop requirements . . . . . . . . . . . . . . . 22
Self-powered hubs . . . . . . . . . . . . . . . . . . . . . 22
Bus-powered hubs . . . . . . . . . . . . . . . . . . . . . 23
12
Overcurrent detection . . . . . . . . . . . . . . . . . . . 24
Overcurrent circuit description . . . . . . . . . . . . 24
Power switch selection . . . . . . . . . . . . . . . . . . 24
Tuning the overcurrent trip voltage . . . . . . . . . 25
Reference circuits . . . . . . . . . . . . . . . . . . . . . . 25
5
5.1
5.1.1
5.1.2
5.2
5.2.1
5.2.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
ISP1122D (SO32) and ISP1122NB (SDIP32) . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
ISP1122BD (LQFP32) . . . . . . . . . . . . . . . . . . . 6
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
12.1
12.2
12.3
12.4
13
14
15
16
17
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 30
Static characteristics. . . . . . . . . . . . . . . . . . . . 31
Dynamic characteristics . . . . . . . . . . . . . . . . . 32
Test information. . . . . . . . . . . . . . . . . . . . . . . . 38
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 39
6
Functional description . . . . . . . . . . . . . . . . . . . 8
Analog transceivers . . . . . . . . . . . . . . . . . . . . . 8
Philips Serial Interface Engine (SIE). . . . . . . . . 9
Hub repeater. . . . . . . . . . . . . . . . . . . . . . . . . . . 9
End-of-frame timers . . . . . . . . . . . . . . . . . . . . . 9
General and individual port controller. . . . . . . . 9
GoodLink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Bit clock recovery . . . . . . . . . . . . . . . . . . . . . . . 9
Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . 9
PLL clock multiplier. . . . . . . . . . . . . . . . . . . . . 10
Overcurrent detection . . . . . . . . . . . . . . . . . . . 10
I2C-bus interface. . . . . . . . . . . . . . . . . . . . . . . 10
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
6.11
18
18.1
18.2
18.2.1
18.2.2
18.2.3
18.3
18.3.1
18.3.2
18.4
Soldering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Surface mount packages . . . . . . . . . . . . . . . . 42
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 42
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 42
Manual soldering. . . . . . . . . . . . . . . . . . . . . . . 43
Through-hole mount packages . . . . . . . . . . . . 43
Soldering by dipping or by solder wave . . . . . 43
Manual soldering. . . . . . . . . . . . . . . . . . . . . . . 43
Package related soldering information . . . . . . 44
7
Modes of operation . . . . . . . . . . . . . . . . . . . . . 10
8
8.1
8.2
Endpoint descriptions. . . . . . . . . . . . . . . . . . . 11
Hub endpoint 0 (control) . . . . . . . . . . . . . . . . . 11
Hub endpoint 1 (interrupt). . . . . . . . . . . . . . . . 11
19
20
21
22
23
24
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 45
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 46
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
9
9.1
9.2
9.3
Host requests. . . . . . . . . . . . . . . . . . . . . . . . . . 12
Standard requests . . . . . . . . . . . . . . . . . . . . . 12
Hub specific requests . . . . . . . . . . . . . . . . . . . 13
Descriptors . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Hub responses . . . . . . . . . . . . . . . . . . . . . . . . 18
Get device status . . . . . . . . . . . . . . . . . . . . . . 18
Get configuration . . . . . . . . . . . . . . . . . . . . . . 18
Get interface status. . . . . . . . . . . . . . . . . . . . . 18
Get hub status . . . . . . . . . . . . . . . . . . . . . . . . 18
Get port status . . . . . . . . . . . . . . . . . . . . . . . . 19
Get configuration descriptor . . . . . . . . . . . . . . 20
Get device descriptor . . . . . . . . . . . . . . . . . . . 20
Get hub descriptor . . . . . . . . . . . . . . . . . . . . . 20
Get string descriptor (0) . . . . . . . . . . . . . . . . . 20
Get string descriptor (1) . . . . . . . . . . . . . . . . . 20
Get string descriptor (2) . . . . . . . . . . . . . . . . . 20
9.4
9.4.1
9.4.2
9.4.3
9.4.4
9.4.5
9.4.6
9.4.7
9.4.8
9.4.9
9.4.10
9.4.11
10
I2C-bus interface . . . . . . . . . . . . . . . . . . . . . . . 20
Protocol. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Hardware connections . . . . . . . . . . . . . . . . . . 21
Data transfer. . . . . . . . . . . . . . . . . . . . . . . . . . 21
10.1
10.2
10.3
© Philips Electronics N.V. 2000.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 29 March 2000
Document order number: 9397 750 07002
相关型号：
ISP1132DL
IC SPECIALTY MICROPROCESSOR CIRCUIT, PDSO56, PLASTIC, SSOP-56, Microprocessor IC:Other
NXP
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