J175 [NXP]
P-channel silicon field-effect transistors; P沟道硅音响场效晶体管型号: | J175 |
厂家: | NXP |
描述: | P-channel silicon field-effect transistors |
文件: | 总6页 (文件大小:37K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
J174; J175;
J176; J177
P-channel silicon field-effect
transistors
April 1995
Product specification
File under Discrete Semiconductors, SC07
Philips Semiconductors
Product specification
J174; J175;
J176; J177
P-channel silicon field-effect transistors
DESCRIPTION
Silicon symmetrical p-channel
junction FETs in a plastic TO-92
envelope and intended for application
with analog switches, choppers,
commutators etc.
A special feature is the
interchangeability of the drain and
source connections.
1
handbook, halfpage
2
3
d
s
g
MAM388
PINNING
1 = source
2 = gate
3 = drain
Note: Drain and source are
interchangeable.
Fig.1 Simplified outline and symbol, TO-92.
QUICK REFERENCE DATA
Drain-source voltage
Gate-source voltage
Gate current
± VDS
VGSO
−IG
max.
max.
max.
30
30
50
V
V
mA
Total power dissipation
up to Tamb = 50 °C
Ptot
max.
400
mW
J174
J175
J176
J177
Drain current
min.
max.
20
135
7
70
2
35
1.5
20
mA
mA
−VDS = 15 V; VGS = 0
−IDSS
Drain-source ON-resistance
−VDS = 0.1 V; VGS = 0
RDS on
max.
85
125
250
300
Ω
April 1995
2
Philips Semiconductors
Product specification
J174; J175;
J176; J177
P-channel silicon field-effect transistors
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Drain-source voltage
Gate-source voltage
Gate-drain voltage
± VDS
VGSO
VGDO
−IG
max.
max.
max.
max.
30
30
30
50
V
V
V
Gate current (DC)
mA
Total power dissipation
up to Tamb = 50 °C
Ptot
Tstg
Tj
max.
max.
400
−65 to +150
150
mW
°C
Storage temperature range
Junction temperature
°C
THERMAL RESISTANCE
From junction to ambient in free air
Rth j-a
=
250
K/W
STATIC CHARACTERISTICS
Tj = 25 °C unless otherwise specified
J174 J175 J176 J177
Gate cut-off current
V
GS = 20 V; VDS = 0
IGSS
max.
max.
1
1
1
1
1
1
1 nA
1 nA
Drain cut-off current
−VDS = 15 V; VGS = 10 V
Drain current
−IDSX
min.
20
7
2
1.5 mA
20 mA
−VDS = 15 V; VGS = 10 V
−IDSS
max.
135
70
35
Gate-source breakdown voltage
IG = 1 µA; VDS = 0
V(BR)GSS
VGS off
RDSon
min.
30
30
30
30 V
Gate-source cut-off voltage
min.
5
3
6
1
4
0.8 V
−ID = 10 nA; VDS = −15 V
max.
10
2.25 V
Drain-source ON-resistance
−VDS = 0.1 V; VGS = 0
max.
85
125
250 300 Ω
April 1995
3
Philips Semiconductors
Product specification
J174; J175;
J176; J177
P-channel silicon field-effect transistors
DYNAMIC CHARACTERISTICS
Tj = 25 °C unless otherwise specified
Input capacitance, f = 1 MHz
V
GS = 10 V; VDS = 0 V
Cis
Cis
typ.
typ.
8
pF
pF
VGS = VDS = 0
30
Feedback capacitance, f = 1 MHz
VGS = 10 V; VDS = 0 V
Crs
typ.
4
pF
Switching times (see Fig.2 + 3)
Delay time
J174 J175 J176 J177
td
tr
typ.
typ.
typ.
typ.
typ.
typ.
2
5
5
10
15
10
20
30
15
20
35
15
20
35
20 ns
25 ns
45 ns
20 ns
25 ns
45 ns
Rise time
Turn-on time
Storage time
Fall time
ton
ts
tf
7
5
10
15
Turn-off time
toff
Test conditions:
−VDD
VGS off
RL
10
12
6
8
6
6
6 V
3 V
560 1200 2000 2900 Ω
VGS on
0
0
0
0 V
V
−V
GSoff
handbook, halfpage
DD
50 Ω
90%
INPUT
10%
V
out
R
L
10%
10%
V
OUTPUT
D.U.T
in
90%
90%
50 Ω
t
t
r
f
t
t
d
MBK293
MBK292
s
Fig.2 Switching times test circuit.
Fig.3 Input and output waveforms;
td + tr = ton ; ts + tf = toff.
April 1995
4
Philips Semiconductors
Product specification
J174; J175;
J176; J177
P-channel silicon field-effect transistors
PACKAGE OUTLINE
Plastic single-ended leaded (through hole) package; 3 leads
SOT54
c
E
d
A
L
b
1
2
e
1
e
D
3
b
1
L
1
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
UNIT
A
b
b
c
D
d
E
e
e
L
L
1
1
1
5.2
5.0
0.48
0.40
0.66
0.56
0.45
0.40
4.8
4.4
1.7
1.4
4.2
3.6
14.5
12.7
mm
2.54
1.27
2.5
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
97-02-28
SOT54
TO-92
SC-43
April 1995
5
Philips Semiconductors
Product specification
J174; J175;
J176; J177
P-channel silicon field-effect transistors
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
Short-form specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
The data in this specification is extracted from a full data sheet with the same type
number and title. For detailed information see the relevant data sheet or data handbook.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
April 1995
6
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