JN5179-001-M10_技术文档

JN5179-001-M1x

ZigBee 3.0, ZigBee PRO, Thread and IEEE802.15.4 modules

Rev. 2.0 — 26 October 2016

Product data sheet

1. General description

The JN5179-001-M1x (with x = 0, 3 or 6) module family provides designers with a

ready-made component that provides a fully integrated solution for applications, using the

IEEE802.15.4 standard in the 2.4 GHz - 2.5 GHz ISM frequency band, including ZigBee

Smart Energy and Home Automation and can be quickly and easily included in product

designs. The modules integrate all of the RF components required, removing the need to

perform expensive RF design and test. Products can be designed by simply connecting

sensors and switches to the module IO pins. The modules use NXP’s single chip

IEEE802.15.4 wireless microcontroller, allowing designers to make use of the extensive

chip development support material. Hence, this range of modules allows designers to

bring wireless applications to market in the minimum time with significantly reduced

development effort and cost.

3 variants are available: JN5179-001-M10, JN5179-001-M13 and JN5179-001-M16. All

modules have FCC modular approval. The JN5179-001-M10 and JN5179-001-M13 are

also CE-compliant and subject to a Notified Body Opinion.

The variants available are described in the Table 1.

1.1 Regulatory Approvals

The JN5179-001-M10 and JN5179-001-M13 have been tested against the requirements

of the following European standards.

• Radio EN 300 328 v 1.9.1

• EMC, EN 301 489-17 v 2.2.1, EN 62479 2010, EN 301 489-1 v 1.9.2

• Basic Safety Assessment (BSA) EN 60950-1:2006

A Notified Body statement of opinion for this standard is available on request.

The High-power module with M16 suffix is not approved for use in Europe.

Additionally, both module types have received FCC “Modular Approval”, in compliance

with CFR 47 FCC part 15 regulations and in accordance to FCC public notice DA00-1407.

The modular approvals notice and test reports are available on request.

The JN5179-001-M16 module is subject to user proximity restrictions under FCC

regulations; more specific information is available in Section 13.1.2.

JN5179-001-M1x

NXP Semiconductors

ZigBee 3.0, ZigBee PRO, Thread and IEEE802.15.4 modules

2. Features and benefits

2.1 Benefits

 Microminiature module solutions

 Ready to use in products

 Minimizes product development time

 No RF test required for systems

 Compliant with:

 FCC 47CFR Part 15C

 ETSI EN 300 328 V1.9

 EN 301-489-17 V2.2.1

 EN60950-1-2006

 Temperature range: 40 C to +85 C

 Lead-free and RoHS compliant

2.2 Features: modules

 2.4 GHz IEEE 802.15.4, ZigBee Smart Energy and Home Automation compatible

 JN5179-001-M10

 Dimensions: 14.5 mm  20.5 mm

 Integrated printed antenna

 TX power 8.5 dBm/10 dBm

 Receiver sensitivity –96 dBm

 TX current 24 mA at 10 dBm

 TX current 21.2 mA at 8.5 dBm

 RX current 14.3 mA at maximum input level –2 dBm

 2.0 V/3.6 V operation

 JN5179-001-M13

 Dimensions: 14.5 mm  20.5 mm

 Fl connector

 TX power 8.5 dBm/10 dBm

 Receiver sensitivity –96 dBm

 TX current 24 mA at 10 dBm

 TX current 21.2 mA at 8.5 dBm

 RX current 14.3 mA at maximum input level –2 dBm

 2.0 V/3.6 V operation

 JN5179-001-M16

 Dimensions: 14.5 mm  20.5 mm

 Integrated printed antenna and Fl connector

 Antenna diversity

 TX power 21 dBm

 Receiver sensitivity –100 dBm

 TX current 114 mA at 21 dBm

 RX current 19 mA at maximum input level –11 dBm

JN5179-001-M1x

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Product data sheet

Rev. 2.0 — 26 October 2016

2 of 28

JN5179-001-M1x

NXP Semiconductors

ZigBee 3.0, ZigBee PRO, Thread and IEEE802.15.4 modules

 2.0 V/3.6 V operation

2.3 Features: microcontroller

 ARM Cortex-M3 CPU with debug support

 512 kB/32 kB/4 kB (Flash/RAM/EEPROM)

 OTA firmware upgrade capability

 32 MHz clock selectable down to 1 MHz for low-power operation

 Dual PAN ID support

 Fail-safe I²C-bus interface. operates as either master or slave

 8  Timers (6  PWM and 2 timer/counter)

 2 low-power sleep counters

 2  UART, one with flow control

 SPI-bus master and slave port, 2 simultaneous selects

 Variable instruction width for high coding efficiency

 Multi-stage instruction pipeline

 Data EEPROM with guaranteed 100 k write operations

 ZigBee PRO stack with Smart Home, Smart Lighting and Smart Energy profiles

 Supply voltage monitor with 8 programmable thresholds

 Battery voltage and temperature sensors

 6-input 10-bit ADC

 Analog comparator

 Digital monitor for ADC

 Watchdog timer and POR

 Standby power controller

 Up to 18 Digital IO (DIO) and 2 digital outputs pins

3. Applications

 Robust and secure low-power wireless applications

 ZigBee Home Automation networks

 Toys and gaming peripherals

 Energy harvesting - for example, self-powered light switch

4. Overview

The JN5179-001-M1x family is a range of ultra-low power, high performance surface

mount modules targeted at IEEE 802.15.4, ZigBee Home Automation networking

applications, enabling users to realize products with minimum time to market and at the

lowest cost. They remove the need for expensive and lengthy development of custom RF

board designs and test suites. The modules use NXP’s JN5179 wireless microcontroller to

provide a comprehensive solution with large memory, high CPU and radio performance

and all RF components included. All that is required to develop and manufacture wireless

control or sensing products is to connect a power supply and peripherals such as

switches, actuators and sensors, considerably simplifying product development.

JN5179-001-M1x

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Product data sheet

Rev. 2.0 — 26 October 2016

3 of 28

JN5179-001-M1x

NXP Semiconductors

ZigBee 3.0, ZigBee PRO, Thread and IEEE802.15.4 modules

3 module variants are available: JN5179-001-M10 with an integrated printed antenna,

JN5179-001-M13 with a FL antenna connector and JN5179-001-M16 with a power

amplifier, LNA for extended range and antenna diversity, thanks to the integrated antenna

and FL antenna connector.

The dimensions of the 3 module variants are: 14.5 x 20.5 mm.

5. Ordering information

Table 1.

Ordering information

Type number

Description

FCCID

JN5179-001-M10

JN5179-001-M13

JN5179-001-M16

standard power, integrated printed antenna

standard power, FL antenna connector

XXMJN5179M1X

XXMJN5179M16

high power, LNA, antenna diversity (integrated

printed antenna and FL antenna connector)

6. Marking

(1)

JN5179-001-M1x

NNNNN

ZbHYWW

(2)

FCCID: XXMJN5179M1x

IC: 8764A-JN5179M1x

aaa-025140

(1) With x = 0, 3 or 6.

(2) x = X for JN5179-001-M10 and JN5179-001-M13 and x = 6 for JN5179-001-M16.

Fig 1. JN5179-001-M1x package marking (top view)

Table 2.

Marking code

Line number

Line 1

Marking code

NXP Logo: B&W outline logo - 2D barcode (internal NXP usage)

Line 2

part ID: JN5179-001-M1x, with x the module type 0, 3 or 6

Line 3

serial number: NNNNN

Line 4

• Z: SSMC

• b: SPIL

• H: halogen free

• Y: year

• WW: week code

Line 5

Line 6

FFC ID = FCCID: XXMJN5179M1x, with x the module type 0, 3 or 6

IC ID = IC: 8764A-JN5179M1x, with x = X for JN5179-001-M10 and

JN5179-001-M13 and x = 6 for JN5179-001-M16

JN5179-001-M1x

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Product data sheet

Rev. 2.0 — 26 October 2016

4 of 28

JN5179-001-M1x

NXP Semiconductors

ZigBee 3.0, ZigBee PRO, Thread and IEEE802.15.4 modules

JN5179-001-M1x modules meet the requirements of Directive 2002/95/EC of the

European Parliament and of the Council on the Restriction of Hazardous Substance

(RoHS) and of the Chinese RoHS requirements SJ/T11363-2006 which came into force

on 1 March 2007.

7. Block diagram

WATCHDOG

TIMER

SPI-BUS

RAM

FLASH

MATCHING

M10 option

MASTER AND SLAVE

integrated

antenna

2.4 GHz

RADIO

2

I C-BUS

VOLTAGE

BROWNOUT

(MASTER/SLAVE)

ARM Cortex-M3

EEPROM

INCLUDING

DIVERSITY

6 X PWM

μFL

O-QPSK

MODEM

MATCHING

M13 option

PLUS TIMER

CONNECTOR

external

antenna

2 X UART

DIO

μFL

PA/LNA

MATCHING

CONNECTOR

IEEE802.15.4

MAC

ACCELERATOR

external

antenna

SLEEP

COUNTER

integrated

antenna

6 CHAN

M16 option

XTAL

10 BIT ADC

128-BIT AES

ENCRYPTION

ACCELERATOR

POWER

MANAGEMENT

SUPPLY AND

TEMP SENSORS

JN5179

POWER

aaa-023361

Fig 2. Block diagram

JN5179-001-M1x

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Product data sheet

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JN5179-001-M1x

NXP Semiconductors

ZigBee 3.0, ZigBee PRO, Thread and IEEE802.15.4 modules

8. Pinning information

8.1 Pinning

DIO2

1

2

3

4

5

6

7

8

9

27 ADC1

26 DIO18

25 DIO15

24 RESET_N

23 DIO14

22 DIO13

21 DIO12

20 n.c.

ADC0

(1)

DIO0

(2)

DIO1

DIO3

DIO4

DIO10/RXD0

DIO9/TXD0

DIO8

19 DIO5

Transparent top view

aaa-023363

(1) DIO0 pin of the JN5179-001-M16 is not connected to DIO0 pin of the JN5179. The DIO0 of the module is LNA_BYPASS.

(2) DIO1 pin of the JN5179-001-M16 is not connected to DIO1 pin of the JN5179. The DIO1 of the module is ANT_SEL.

Fig 3. Pin configuration

8.2 Pin description

Table 3.

Symbol

DIO2

Pin description

Pin Type^[1]

1 IO

Description

DIO2 — digital input/output 2

ADC5 — ADC input 5

SDA — I²C-bus master/slave SDA input/output (push-pull

output)

RXD1 — UART 1 receive data input

TIM0CAP — Timer0 capture input

RFRX — radios receiver control output

ADC0 — ADC input 0

ADC0

2

I

JN5179-001-M1x

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Product data sheet

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JN5179-001-M1x

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ZigBee 3.0, ZigBee PRO, Thread and IEEE802.15.4 modules

Table 3.

Pin description …continued

Symbol

Pin Type^[1]

Description

DIO0^[2]

3

IO

DIO0 — digital input/output 0

ADC4 — ADC input 4

SPISEL0 — SPI-bus master select output 0

RFRX — radio receiver control output

FLICK_CTRL — flicker control output

ADO — antenna diversity odd output

LNA-BYPASS — LNA bypass on JN5179-001-M16

DIO1 — digital input/output 1

DIO1^[2]

4

5

IO

ADC3 — ADC input 3

RFTX — radio transmitter control input

PC0 — pulse counter 0 input

ADE — antenna diversity even output

ANT_SELECT — antenna select on JN5179-001-M16

DIO3 — digital input/output 3

DIO3

ADC2 — ADC input 2

PWM4 — PWM4 output

SCL — I²C-bus master/slave SCL input/output (push-pull

output)

TXD1 — UART 1 transmit data output

TIM0OUT — Timer0 output

RFTX — radio transmit control input

FLICK_CTRL — flicker control output

DIO4 — digital input/output 4

DIO4^[5]

6

IO

SCL — I²C-bus master/slave SCL input/output (open-drain)

RXD0 — UART 0 receive data input

TIM0CK_GT — Timer0 clock/gate input

ADO — antenna diversity odd output

DIO10 — digital input/output 10

DIO10/RXD0

DIO9/TXD0

7

8

IO

JTAG_TDI — JTAG TDI data input

RXD0 — UART 0 receive data input

DIO9 — digital input/output 9

JTAG_TDO — JTAG TDO data output

TXD0 — UART 0 transmit data output

TRACESWV — ARM trace serial wire viewer output

DIO8 — digital input/output 8

DIO8

9

IO

PWM5 — PWM5 output

TIM0OUT — Timer0 output

TRACECLK — trace clock output

32KXTALIN — 32 kHz clock input

JN5179-001-M1x

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Product data sheet

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JN5179-001-M1x

NXP Semiconductors

ZigBee 3.0, ZigBee PRO, Thread and IEEE802.15.4 modules

Table 3.

Pin description …continued

Symbol

Pin Type^[1]

Description

DIO7/SPIMOSI

10 IO

DIO7 — digital input/output 7

SPIMOSI — SPI-bus master data output

JTAG_TDI — JTAG TDI data input

SPISEL2 — SPI-bus master select output 2

SPISSEL — SPI-bus slave select input

CMP_OUT — comparator output

32KIN — 32 kHz External clock input

32KXTALOUT — 32 kHz clock output

DIO6 — digital input/output 6

DIO6/SPISEL0

11

IO

SPISEL0 — SPI-bus master select output 0

CTS0 — UART 0 clear to send input

RXD1 — UART 1 receive data input

JTAG_TCK — JTAG TCK input

SWCK — Serial Wire Debugger Clock input

SPISCLK — SPI-bus slave clock input

TIM1CAP — Timer1 capture input

DO1 — digital output 1

DO1/SPIMISO^[3]

12 IO

SPIMISO — SPI-bus master data input

SPISMISO — SPI-bus slave data output

ADO — antenna diversity odd output

DO0 — digital output 0

DO0/SPICLK^[4]

DIO17

13

O

SPICLK — SPI-bus master clock output

ADE — antenna diversity even output

DIO17 — digital input/output 17

14 IO

JTAG_TCK — JTAG TCK input

SWCK — Serial Wire Debugger Clock input

SPISEL0 — SPI-bus master select output 0

TIM1CAP — Timer1 capture input

COMP1P — comparator plus input

SPISMISO — SPI-bus slave data output

DIO11 — digital input/output 11

DIO11

15 IO

JTAG_TMS — JTAG TMS input

SWD — serial wire debugger input

RTS0 — UART 0 request to send output

TXD1 — UART 1 transmit data output

SPICLK — SPI-bus master clock output

SPISMOSI — SPI-bus slave data input

TIM1OUT — Timer1 output

TRACED0 — ARM trace data0 output

not connected; keep floating or ground

V_SS— ground

n.c.

V_SS

16

17

-

G

JN5179-001-M1x

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JN5179-001-M1x

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Table 3.

Pin description …continued

Symbol

Pin Type^[1]

18

19 IO

Description

V_DD

DIO5^[5]

P

V_DD— digital and analog supply voltage

DIO5 — digital input/output 5

SDA — I²C-bus master/slave SDA input/output

(open-drain)

TXD0 — UART 0 transmit data output

PC1 — pulse counter 1 input

TIM0CAP — Timer0 capture input

ADE — antenna diversity even output

not connected; keep floating or ground

DIO12 — digital input/output 12

PWM1 — PWM1 output

n.c.

20

-

DIO12

21 IO

TXD0 — UART 0 transmit data output

TRACED3 — ARM trace data3 output

DIO13 — digital input/output 13

PWM2 — PWM2 output

DIO13

DIO14

22 IO

RXD0 — UART 0 receive data input

PC0 — pulse counter 0 input

TRACED2 — ARM trace data2 output

DIO14 — digital input/output 14

PWM3 — PWM3 output

23 IO

PC1 — pulse counter 1 input

CMP_OUT — comparator output

TRACED1 — ARM trace data1 output

SPISMOSI — SPI-bus slave data input

RESET_N — reset input

RESET_N

DIO15

24

I

25 IO

DIO15 — digital input/output 15

PWM6 — PWM6 output

JTAG_TDO — JTAG TDO data output

SPIMOSI — SPI-bus master data output

SPISEL1 — SPI-bus master select output 1

TIM0CK_GT — Timer0 - clock gate input

TRACESWV — ARM trace Serial Wire Viewer output

SPISSEL — SPI-bus slave select input

JN5179-001-M1x

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Product data sheet

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JN5179-001-M1x

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Table 3.

Pin description …continued

Symbol

Pin Type^[1]

Description

DIO18

26 IO

DIO18 — digital input/output 18

JTAG_TMS — JTAG TMS input

SWD — Serial Wire Debugger input

SPIMISO — SPI-bus master data input

TIM1OUT — Timer1 output

COMP1M — comparator minus input

SPISCLK — SPI-bus slave clock input

VREF — analog peripheral reference voltage

ADC1 — ADC input 1

ADC1

27

I

[1] P = power supply; G = ground; I = input, O = output; IO = input/output.

[2] Not available on the JN5179-001-M16 since they are used to control the front-end module. DIO0 of the

module is LNA_BYPASS and the DIO1 of the module is ANT_SEL.

[3] UART programming mode: leave pin floating high during reset to avoid entering UART programming mode

or hold it low to program.

[4] JTAG programming mode: must be left floating high during reset to avoid entering JTAG programming

mode.

[5] Open-drain.

9. Functional description

9.1 JN5179 single chip wireless microcontroller

The JN5179-001-M1x series is constructed around the JN5179-001 single chip wireless

microcontroller, which includes the radio system, an ARM Cortex-M3 CPU, Flash, RAM

and EEPROM memory and a range of analog and digital peripherals.

The chip is described fully in JN5179 Wireless Microcontroller Datasheet (see Ref. 2).

9.2 Peripherals

Table 4.

Peripherals description

Peripherals

JN5179-001-M10

JN5179-001-M13

JN5179-001-M16

Notes

Master SPI-bus port

Slave SPI-bus port

UART

3 selects

125 kHz - 16 MHz

125 kHz - 4 MHz

16550 compatible

Up to 400 kHz

1

2

1

2

1

2

1

Two-wire serial I/F (compatible with

SMbus and I²C-bus)

PWM

16 MHz clock

timer

6

timer/counter

2

Programmable Sleep Timers

2

32 kHz clock

Digital IO lines (multiplexed with

UARTs, timers and SPI-bus selects)

20

18

DIO2 and DIO3 are

not available on

JN5179-001-M16

modules

JN5179-001-M1x

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Table 4.

Peripherals description …continued

Peripherals

JN5179-001-M10

JN5179-001-M13

JN5179-001-M16

Notes

Analog-to-Digital converter

6

10 bit, up to

100 ks/s

Programmable analog comparator

1

ultra low-power

mode for sleep

Internal temperature sensor

Internal battery sensor

1

The performance of all peripherals is defined in the JN5179 Wireless Microcontroller

Datasheet (see Ref. 2).

NXP supplies all the development tools and networking stacks needed to enable

end-product development to occur quickly and efficiently. These are all freely available

from the NXP Wireless Connectivity TechZone (see Ref. 3). A range of

evaluation/developer kits is also available, allowing products to be quickly bread boarded.

Efficient development of software applications is enabled by the provision of a complete,

unlimited, software developer kit. Together with the available libraries for the

IEEE802.15.4 MAC and ZigBee PRO network stacks, this package provides everything

required to develop application code and to trial it with hardware representative of the final

module.

The modules can be user programmed both in development and in production using

software supplied by NXP. Access to the on-chip peripherals, MAC and network stack

software is provided through specific APIs. This information is available on the NXP

support website, together with many example applications, user guides, reference

manuals and application notes.

9.3 JN5179-001-M16 Antenna diversity

ANT_SEL is used to select between the two antennas on the M16 module. Leaving

ANT_SEL unconnected or connecting to V_CCselects the printed antenna. Tying ANT_SEL

to ground selects the FL connector. The module can also be used in antenna diversity

solutions where the module will automatically swap between the two antennas in order to

achieve the best radio performance. This can be done connecting ANT_SEL to DIO4,

DIO5, DO0 or DO1 depend upon your application. The antenna diversity functionality can

be enabled by calling vAHI_AntennaDiversityEnable. The DIO can be selected using

vAHI_SetDIOpinMultiplexValue. Please see

JN-UG-3118-JN517x-Integrated-Peripherals-API for more details.

The LNA bypass signal can be used to switch off the LNA in the frontend. This can be

useful when in the presence of strong Wifi signals that can overload the frontend. If the pin

is left unconnected or tied to V_CCthen the LNA is enabled. If the signal is tied to ground

then the LNA will be bypassed during RX. The signal can be connected to a DIO to give

software control over the LNA if required.

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10. Limiting values

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions

Min

Max

Unit

V

V_DD

supply voltage

0.3 +3.6

V_ADC0

V_ADC1

V_IO(dig)

voltage on pin ADC0

voltage on pin ADC1

digital input/output voltage

0.3 V_DD+ 0.3 V

V

11. Recommended operating conditions

Table 6.

Symbol

V_DD

Operating conditions

Parameter

Conditions

Min

Max

3.6

Unit

[1]

supply voltage

2

V

T_amb

ambient temperature

standard range

40

+85

C

[1] To reach the maximum TX power, 2.8 V is the minimum.

12. Characteristics

12.1 DC current

Table 7.

Active processing

V_DD= 2 V to 3.6 V; T_amb= 40 C to +85 C; CPU running at 16 MHZ; unless otherwise specified.

Symbol

Parameter

supply current M10

radio in receive mode; maximum input level at 10 dBm

Conditions

Min

Typ

Max Unit

I_DD

-

16.4

14.3

24

-

mA

radio in receive mode; maximum input level at –2 dBm

radio in transmit mode 10 dBm

[1]

radio in transmit mode 8.5 dBm

21.2

M13

radio in receive mode; maximum input level at 10 dBm

radio in receive mode; maximum input level at –2 dBm

radio in transmit mode 10 dBm

-

16.4

14.3

24

-

mA

[1]

radio in transmit mode 8.5 dBm

21.2

M16

radio in receive mode for Fl and PCB antenna

radio in transmit mode for Fl

-

19

-

mA

[1]

114

78

radio in transmit mode for PCB antenna

[1] To reach the maximum TX power, 2.8 V is the minimum.

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Table 8.

Sleep mode

V_DD= 2 V to 3.6 V; T_amb= 40 C to +85 C; unless otherwise specified.

Symbol Parameter Conditions

input/output supply current M10 and M13

with I/O and RC oscillator timer wake-up;

typical values measured at T_amb= 25 C

M16

Min

Typ

Max

Unit

I_DD(IO)

-

0.61

-

A

with I/O and RC oscillator timer wake-up;

-

0.64

-

A

typical values measured at T_amb= 25 C

Table 9.

Deep sleep mode

V_DD= 2 V to 3.6 V; T_amb= 40 C to +85 C; unless otherwise specified.

Symbol

I_DD

Parameter

Conditions

Min

Typ

Max

Unit

[1]

supply current

typical values measured at T_amb= 25 C

-

100

-

nA

and V_DD= 3.3 V

[1] Waiting on chip RESET or I/O event.

12.2 AC characteristics

12.2.1 Radio transceiver

These modules meet all the requirements of the IEEE802.15.4 standard over 2.0 V

to 3.6 V and offers the improved RF characteristics shown in Table 10. All RF

characteristics are measured single ended.

Table 10. RF port characteristics

Single-ended; Impedance = 50 ^[1]; V_DD= 2 V to 3.6 V; T_amb= 40C to +85C; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

f_range

frequency range

2.4

-

2.485 GHz

[1] With external matching inductors and assuming PCB layout.

Table 11. Radio transceiver characteristics: +25 C

V_DD= 2 V to 3.6 V; unless otherwise specified.

Symbol

Receiver

M10

Parameter

Conditions

Min

Typ

Max

Unit

S_RX

receiver sensitivity

nominal for 1 % PER, as per 802.15.4

-

96

2

93.5 dBm

P_i(RX)(max)maximum receiver input 1 % PER, measured as sensitivity; supply

-

dBm

power

current at 14.3 mA

_RSSI

RSSI variation

95 dBm to 10 dBm; available through

JN5179-001-M1x Integrated Peripherals API

4

-

+4

dB

M13

S_RX

receiver sensitivity

nominal for 1 % PER, as per 802.15.4

-

96

2

93.5 dBm

P_i(RX)(max)maximum receiver input 1 % PER, measured as sensitivity; supply

-

dBm

power

current at 14.3 mA

_RSSI

RSSI variation

95 dBm to 10 dBm; available through

4

-

+4

dB

JN5179-001-M1x Integrated Peripherals API

JN5179-001-M1x

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Table 11. Radio transceiver characteristics: +25 C …continued

V_DD= 2 V to 3.6 V; unless otherwise specified.

Symbol

M16

Parameter

Conditions

Min

Typ

Max

Unit

S_RX

receiver sensitivity

nominal for 1 % PER, as per 802.15.4

-

100 98.5 dBm

P_i(RX)(max)maximum receiver input 1 % PER, measured as sensitivity

power

11

-

dBm

_RSSI

RSSI variation

100 dBm to 25 dBm; available through

JN5179-001-M1x Integrated Peripherals API

4

-

+4

dB

Transmitter

M10

P_o

[1]

[2]

output power

I_DD= 24 mA

-

10

-

dBm

dB

I_DD= 21.2 mA

8.5

42

P_o(cr)

control range output

power

in 6 major steps and then 4 fine steps

M13

P_o

[1]

[2]

output power

I_DD= 24 mA

-

10

-

dBm

dB

I_DD= 21.2 mA

8.5

42

P_o(cr)

control range output

power

in 6 major steps and then 4 fine steps

M16

P_o

[1]

output power

I_DD= 114 mA

-

21

-

dBm

[1] To reach the maximum TX power, 2.8 V is the minimum on V_DD

.

[2] Up to an extra 2.5 dB of attenuation is available if required.

13. Application information

13.1 Federal Communication Commission Interference Statement

This equipment has been tested and found to comply with the limits for a Class B digital

device, according to Part 15 of the FCC Rules, see Ref. 4. These limits are designed to

provide reasonable protection against harmful interference in a residential installation.

This equipment generates, uses, and can radiate radio frequency energy and, if not

installed and used in accordance with the instructions, may cause harmful interference to

radio communications. However, there is no guarantee that interference will not occur in a

particular installation. If this equipment does cause harmful interference to radio or

television reception, which can be determined by turning the equipment off and on, the

user is encouraged to try to correct the interference by one of the following measures:

• Reorient or relocate the receiving antenna

• Increase the separation between the equipment and receiver

• Connect the equipment into an outlet on a circuit different from that to which the

receiver is connected

• Consult the dealer or an experienced radio/TV technician for help

This device complies with Part 15 of the FCC Rules, see Ref. 4. Operation is subject to

the following two conditions:

JN5179-001-M1x

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1. This device may not cause harmful interference

2. this device must accept any interference received, including interference that may

cause undesired operation

FCC Caution: Any changes or modifications not expressly approved by the party

responsible for compliance could void the user's authority to operate this equipment.

Remark: FCC Radiation Exposure Statement:

This portable equipment with its antenna complies with FCC’s RF radiation exposure

limits set forth for an uncontrolled environment. To maintain compliance, follow the

instructions below;

1. This transmitter must not be co-located or operating in conjunction with any other

antenna or transmitter.

2. Avoid direct contact to the antenna, or keep it to a minimum while using this

equipment.

This transmitter module is authorized to be used in other devices only by OEM integrators

under the following condition:

The transmitter module must not be co-located with any other antenna or transmitter.

As long as the above condition is met, further transmitter testing will not be required.

However, the OEM integrator is still responsible for testing their end product for any

additional compliance requirements required with this module installed (for example,

digital device emissions, PC peripheral requirements, etc.).

This applies to the JN5179-001-M10 and JN5179-001-M13 devices, the JN5179-001-M16

is a mobile device (see Section 13.1.2).

13.1.1 Antennas approved by FCC for use with JN5179-M01-M0x-2

Table 12. Antennas description (FCC)

Brand

Model Number

E-0005-AC

E-2411-GC

E-2410-CA

E-2410-HA

E-2410-GC

E-2820-CA

E-2820-GC

Description

Gain (dBi) Connector type

1

2

3

4

5

6

7

8

9

Aveslink Technology, Inc

vertical- flying lead

2

RP-SMA

FL

vertical - swivel

2

vertical - bulkhead- flying lead

vertical- flying lead

2

FL

vertical - swivel

2

RP-SMA

FL

vertical - bulkhead- flying lead

vertical - swivel

2

RP-SMA

FL

Embedded Antenna Design FBKR35068-RS-KR

vertical - knuckle antenna

vertical - knuckle-flying lead

Vertical - right angle

2

Nearson

S131CL-L-PX-2450S

WRR2400-IP04

WRR2400-RPSMA

E-6170-DA

2

10 Laird Technologies

11 Laird Technologies

12 Aveslink Technology, Inc

13 Laird Technologies

1.5

1.3

1

FL

RP-SMA

FL

WCR2400-SMRP

Vertical - knuckle antenna

1

RP-SMA

JN5179-001-M1x

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Product data sheet

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This device has been designed to operate with the antennas listed above, and having a

maximum gain of 2 dBi. Alternative vertical antennas may be used provided that the gain

does not exceed 2 dBi. Antennas having a gain greater than 2 dBi are strictly prohibited

for use with this device.

The required antenna impedance is 50 .

13.1.2 High-power module usage limitation

The high-power module variants are classified as ‘mobile’ device pursuant with FCC

2.1091 and must not be used at a distance of < 20 cm (8”) from any people. This applies

to the JN5179-001-M16 module type (XXMJN5179M16).

Remark: In the event that these conditions cannot be met (for certain configurations or

co-location with another transmitter), then the FCC authorization is no longer considered

valid and the FCC ID cannot be used on the final product. In these circumstances, the

OEM integrator will be responsible for re-evaluating the end product (including the

transmitter) and obtaining a separate FCC authorization.

The OEM integrator has to be aware not to provide information to the end user regarding

how to install or remove this RF module in the user manual of the end product.

The user manual for the end product must include the following information in a prominent

location;

To comply with FCC’s RF radiation exposure requirements, the antenna(s) used for this

transmitter must not be co-located or operating in conjunction with any other antenna or

transmitter.

13.1.3 FCC end product labeling

The final ‘end product’ should be labeled in a visible area with the following:

Contains TX FCC ID: XXMJN5179M1X for the modules JN5179-001-M10 and

JN5179-001-M13, XXMJN5179M16 for the module JN5179-001-M16.

13.2 European R&TTE Directive 1999/5/EC statement

JN5179-001-M10 and JN5179-001-M13 are compliant with ETSI EN 300 328 V1.9, EMC,

EN 301 489-17 v2.1.1 (2009-02) and the Basic Safety Assessment (BSA) EN

60950-1:2006 (2006-06) and are subject to a Notified Body Opinion.

These modules are approved for use with the antennas listed in the following table. The

JN5179-001-M16 module is not approved for use in Europe.

Alternative vertical antennas may be used provided that the gain does not exceed 2 dBi.

Table 13. Antennas description (R&TTE)

Brand

Model Number

E-0005-AC

E-2411-GC

E-2410-CA

E-2410-HA

E-2410-GC

Description

Gain (dBi) Connector type

1

2

3

4

5

Aveslink Technology, Inc

vertical- flying lead

vertical - swivel

2

RP-SMA

FL

vertical - bulkhead- flying lead

vertical- flying lead

vertical - swivel

FL

RP-SMA

JN5179-001-M1x

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Product data sheet

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Table 13. Antennas description (R&TTE) …continued

Brand

Model Number

E-2820-CA

Description

Gain (dBi) Connector type

6

7

8

9

Aveslink Technology, Inc

vertical - bulkhead- flying lead

vertical - swivel

2

FL

E-2820-GC

2

RP-SMA

FL

Embedded Antenna Design FBKR35068-RS-KR

vertical - knuckle antenna

vertical - knuckle-flying lead

Vertical - right angle

2

Nearson

S131CL-L-PX-2450S

WRR2400-IP04

WRR2400-RPSMA

E-6170-DA

2

10 Laird Technologies

11 Laird Technologies

12 Aveslink Technology, Inc

13 Laird Technologies

1.5

1.3

1

FL

RP-SMA

FL

WCR2400-SMRP

Vertical - knuckle antenna

1

RP-SMA

JN5179-001-M1x

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Product data sheet

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14. Footprint and PCB placement

14.1 Footprint information for reflow soldering

14.50

1.27

Ø1.00

2.63

1.50

2.17

1.00

aaa-023943

All modules have the same footprint.

Fig 4. Footprint information for reflow soldering of modules

14.2 Optimal PCB placement of JN5179-001-M10 and JN5179-001-M16

modules

The JN5179-001-M10 and JN5179-001-M16 modules feature an optimised, low-cost,

integrated, inverted F, printed PCB antenna. For size reduction no ground plane has been

added between the antenna and the JN5179 chip. So an additional ground plane must be

added on the main PCB beneath the module in order to ensure a good antenna efficiency.

This ground plane can be a rectangle or a square with respect to 2 conditions: it must be

as wide as the module (14.5 mm) and the area must be equal or greater than 610 mm².

See Figure 5 below for correct placement of the module.

The antenna has a vertically polarised near omnidirectional radiation pattern and up to

1.8 dBi of peak gain. On the antenna side the ground plane of the module must be

vertically aligned with the ground plane of the main PCB. The area around the antenna

must be kept clear of conductors or other metal objects by a minimum distance of 20 mm

except the mandatory ground plane as indicated above. This is true for all layers of the

PCB and not just the top layer. Any conductive objects close to the antenna could

severely disrupt the antenna pattern resulting in deep nulls and high directivity in some

directions.

JN5179-001-M1x

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Product data sheet

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JN5179-001-M1x

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The Figure 9 show various possible scenarios. The top 3 scenarios are correct - the

ground plane must be placed beneath the JN5179-001-M10 or M16 module but it does

not protrude beyond the edge of the top layer ground plane on the module PCB.

The bottom fours scenarios are incorrect – in the left-hand side there is ground plane

underneath the antenna, in the middle-left example the ground planes of the main PCB

and the module are not vertically aligned, in the middle-right there is insufficient clearance

around the antenna, and in the right-hand example a battery’s metal casing is in the

recommended ‘keep out’ area.

These recommendations do not apply to the JN5179-001-M13 module neither to the

JN5179-001-M16 applications that use a single external antenna connected to the Fl

connector.

KEEPOUT - no groundplane, metal objects or conductors in this area

● mandatory ground plane on top or second layer

2

● minimum size = 610 mm (rectangle or square)

● don’t place components in this area

Components are allowed in this area but must be placed as far as possible from the antenna

in order to avoid the radiation pattern to be disrupted.

aaa-024729

Fig 5. PCB placement of the JN5179-001-M10 and JN5179-001-M16 modules

14.3 Reflow Profile

For reflow soldering, it is recommended to follow the reflow profile in Figure 6 as a guide,

as well as the paste manufacturer’s guidelines on peak flow temperature, soak times, time

above liquid and ramp rates.

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Product data sheet

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aaa-024461

250

Temperature

(°C)

200

150

100

50

0

20

40

60

80

100 120 140 160 180 200 220 240 260 280

Time (seconds)

Fig 6. Guide for reflow profile of JN5179-001-M1x

Table 14. Recommended solder reflow profile

Temperature range (°C)

from 25 to ~160

Target time range (s)

between 90 and ~130

between 30 and ~60

between 20 and ~50

between 10 and ~20

between 150 and ~260

from 160 to ~220

from 220 to ~230

from 230 to ~peak

from 25 to ~peak

14.4 Soldering paste and cleaning

NXP does not recommend use of a solder paste that requires the module and PCB

assembly to be cleaned (rinsed in water) for the following reasons:

• Solder flux residues and water can be trapped by the PCB, can or components and

result in short circuits

NXP recommends use of a 'no clean' solder paste for all its module products.

JN5179-001-M1x

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Product data sheet

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15. Package outline

(14.5)

(20.50)

(10.16)

(1.27)

(2.17)

aaa-023972

(10.16)

(14.5)

Fig 7. Package outline JN5179-001-M10

(2.27)

(1.71)

(20.50)

(10.16)

(1.27)

(2.17)

aaa-023973

(10.16)

Fig 8. Package outline JN5179-001-M13

JN5179-001-M1x

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JN5179-001-M1x

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(14.5)

(2.27)

(1.71)

(20.50)

(10.16)

(1.27)

(2.17)

aaa-023974

(10.16)

Fig 9. Package outline JN5179-001-M16

16. Abbreviations

Table 15. Abbreviations

Acronym

AC

Description

Alternating Current

ADC

API

Analog-to-Digital Converter

Application Program Interface

Conformity European

Central Processing Unit

Direct Current

CE

CPU

DC

DIO

Digital Input Output

EEPROM

FCC

ID

Electrically-Erasable Programmable Read-Only Memory

Federal Communication Commission

IDentification

IO

Input Output

ISM

Industrial, Scientific and Medical radio bands

Joint Test Action Group

JTAG

LNA

MAC

OEM

PC

Low Noise Amplifier

Media Access Control

Original Equipment Manufacturer

Pulse Counter

PCB

PER

Printed-Circuit Board

Packet Error Rate

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Table 15. Abbreviations …continued

Acronym Description

PRO

PWM

TX

PROtocol

Pulse-Width Modulation

Transmit

R&TTE

RAM

RC

Radio And Terminal Telecommunication Equipment

Random Access Memory

Resistance-Capacitance

Radio Frequency

RF

RISC

RoHS

RSSI

RX

Reduced Instruction Set Computing

Restriction of Hazardous Substance

Received Signal Strength Indicator

Receive

UART

Universal Asynchronous Receiver Transmitter

17. References

[1] IEEE Std 802.15.4-2011 IEEE Standard for Information Technology Part 15.4 —

Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications

for Low-Rate Wireless Personal Area Networks (LR-WPANs).

[2] JN517x — JN517x wireless microcontroller data sheet.

[3] Wireless Connectivity —

http://www.nxp.com/products/interface-and-connectivity/wireless-connectivity:WIRE

LESS-CONNECTIVITY

[4] Part 15 of the FCC Rules —

http://www.ecfr.gov/cgi-bin/text-idx?SID=d01e00935bfcb0d53b914e7c8e63f383&no

de=47:1.0.1.1.16&rgn=div5

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18. Revision history

Table 16. Revision history

Document ID

Release date

20161026

Data sheet status

Change notice

Supersedes

JN5179-001-M1x v2.0

Modifications:

Product data sheet

-

JN5179-001-M1x v1.1

• Alternative title: updated.

• Section 2.1: updated.

• Section 2.2: updated.

• Section 2.3: updated.

• Table 2: updated.

• Figure 3: updated.

• Table 3: updated.

• Table 4: updated.

• Section 14.2: added.

• Table 7: updated.

• Table 8: updated.

• Table 9: updated.

• Table 11: updated.

JN5179-001-M1x v1.1

JN5179-001-M1x v1.0

Modifications:

20160707

Objective data sheet

-

JN5179-001-M1x v1.0

-

20160707

Objective data sheet

• initial version.

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19. Legal information

19.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

Suitability for use — NXP Semiconductors products are not designed,

19.2 Definitions

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

19.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

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Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

non-automotive qualified products in automotive equipment or applications.

19.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

I²C-bus — logo is a trademark of NXP B.V.

20. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

JN5179-001-M1x

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2.0 — 26 October 2016

26 of 28

JN5179-001-M1x

NXP Semiconductors

ZigBee 3.0, ZigBee PRO, Thread and IEEE802.15.4 modules

21. Tables

Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . .4

Table 2. Marking code . . . . . . . . . . . . . . . . . . . . . . . . . . .4

Table 3. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .6

Table 4. Peripherals description . . . . . . . . . . . . . . . . . .10

Table 5. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .12

Table 6. Operating conditions . . . . . . . . . . . . . . . . . . . .12

Table 7. Active processing . . . . . . . . . . . . . . . . . . . . . .12

Table 8. Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . .13

Table 9. Deep sleep mode . . . . . . . . . . . . . . . . . . . . . . 13

Table 10. RF port characteristics . . . . . . . . . . . . . . . . . . 13

Table 11. Radio transceiver characteristics: +25 °C . . . . 13

Table 12. Antennas description (FCC) . . . . . . . . . . . . . . 15

Table 13. Antennas description (R&TTE) . . . . . . . . . . . . 16

Table 14. Recommended solder reflow profile . . . . . . . . 20

Table 15. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 22

Table 16. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 24

22. Figures

Fig 1. JN5179-001-M1x package marking (top view) . . .4

Fig 2. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

Fig 3. Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . .6

Fig 4. Footprint information for reflow soldering of

modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

Fig 5. PCB placement of the JN5179-001-M10 and

JN5179-001-M16 modules . . . . . . . . . . . . . . . . .19

Fig 6. Guide for reflow profile of JN5179-001-M1x . . . .20

Fig 7. Package outline JN5179-001-M10 . . . . . . . . . . .21

Fig 8. Package outline JN5179-001-M13 . . . . . . . . . . .21

Fig 9. Package outline JN5179-001-M16 . . . . . . . . . . .22

JN5179-001-M1x

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2.0 — 26 October 2016

27 of 28

JN5179-001-M1x

NXP Semiconductors

ZigBee 3.0, ZigBee PRO, Thread and IEEE802.15.4 modules

23. Contents

1

1.1

General description. . . . . . . . . . . . . . . . . . . . . . 1

Regulatory Approvals . . . . . . . . . . . . . . . . . . . . 1

19.1

19.2

19.3

19.4

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 26

2

Features and benefits . . . . . . . . . . . . . . . . . . . . 2

Benefits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Features: modules . . . . . . . . . . . . . . . . . . . . . . 2

Features: microcontroller . . . . . . . . . . . . . . . . . 3

2.1

2.2

2.3

20

21

22

23

Contact information . . . . . . . . . . . . . . . . . . . . 26

Tables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

3

4

5

6

7

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Ordering information. . . . . . . . . . . . . . . . . . . . . 4

Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5

8

8.1

8.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 6

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6

9

Functional description . . . . . . . . . . . . . . . . . . 10

JN5179 single chip wireless microcontroller. . 10

Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

JN5179-001-M16 Antenna diversity . . . . . . . . 11

9.1

9.2

9.3

10

11

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12

Recommended operating conditions. . . . . . . 12

12

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 12

DC current . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

AC characteristics. . . . . . . . . . . . . . . . . . . . . . 13

Radio transceiver . . . . . . . . . . . . . . . . . . . . . . 13

12.1

12.2

12.2.1

13

13.1

Application information. . . . . . . . . . . . . . . . . . 14

Federal Communication Commission Interference

Statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Antennas approved by FCC for use with

13.1.1

JN5179-M01-M0x-2 . . . . . . . . . . . . . . . . . . . . 15

High-power module usage limitation. . . . . . . . 16

FCC end product labeling. . . . . . . . . . . . . . . . 16

European R&TTE Directive 1999/5/EC

13.1.2

13.1.3

13.2

statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

14

14.1

14.2

Footprint and PCB placement . . . . . . . . . . . . 18

Footprint information for reflow soldering . . . . 18

Optimal PCB placement of JN5179-001-M10

and JN5179-001-M16 modules . . . . . . . . . . . 18

Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . 19

Soldering paste and cleaning . . . . . . . . . . . . . 20

14.3

14.4

15

16

17

18

19

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 21

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 22

References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 24

Legal information. . . . . . . . . . . . . . . . . . . . . . . 25

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 26 October 2016

Document identifier: JN5179-001-M1x


型号：	JN5179-001-M10
厂家：	NXP
描述：	ZigBee 3.0, ZigBee PRO, Thread and IEEE802.15.4 modules
文件：	总28页 (文件大小：788K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

JN5179-001-M10 [NXP]

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