LPC1311_10 [NXP]
32-bit ARM Cortex-M3 microcontroller; up to 32 kB flash and 8 kB SRAM; USB device; 32位ARM Cortex -M3微控制器;高达32 KB的闪存和8 KB的SRAM ; USB设备
| 型号： | LPC1311_10 |
| 厂家： | 
NXP |
| 描述： | 32-bit ARM Cortex-M3 microcontroller; up to 32 kB flash and 8 kB SRAM; USB device |
| 文件： | 总60页 (文件大小：432K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LPC1311/13/42/43
32-bit ARM Cortex-M3 microcontroller; up to 32 kB flash and
8 kB SRAM; USB device
Rev. 02 — 6 May 2010
Product data sheet
1. General description
The LPC1311/13/42/43 are ARM Cortex-M3 based microcontrollers for embedded
applications featuring a high level of integration and low power consumption. The ARM
Cortex-M3 is a next generation core that offers system enhancements such as enhanced
debug features and a higher level of support block integration.
The LPC1311/13/42/43 operate at CPU frequencies of up to 72 MHz. The ARM
Cortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture with
separate local instruction and data buses as well as a third bus for peripherals. The ARM
Cortex-M3 CPU also includes an internal prefetch unit that supports speculative
branching.
The peripheral complement of the LPC1311/13/42/43 includes up to 32 kB of flash
memory, up to 8 kB of data memory, USB Device (LPC1342/43 only), one Fast-mode Plus
I2C-bus interface, one UART, four general purpose timers, and up to 42 general purpose
I/O pins.
2. Features and benefits
ARM Cortex-M3 processor, running at frequencies of up to 72 MHz.
ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).
32 kB (LPC1343/13)/16 kB (LPC1342)/8 kB (LPC1311) on-chip flash programming
memory.
8 kB (LPC1343/13)/4 kB (LPC1342/11) SRAM.
In-System Programming (ISP) and In-Application Programming (IAP) via on-chip
bootloader software.
Selectable boot-up: UART or USB (USB on LPC134x only).
On LPC134x: USB MSC and HID on-chip drivers.
Serial interfaces:
USB 2.0 full-speed device controller with on-chip PHY for device (LPC1342/43
only).
UART with fractional baud rate generation, modem, internal FIFO, and
RS-485/EIA-485 support.
SSP controller with FIFO and multi-protocol capabilities.
I2C-bus interface supporting full I2C-bus specification and Fast-mode Plus with a
data rate of 1 Mbit/s with multiple address recognition and monitor mode.
LPC1311/13/42/43
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Other peripherals:
Up to 42 General Purpose I/O (GPIO) pins with configurable pull-up/pull-down
resistors.
Four general purpose counter/timers with a total of four capture inputs and 13
match outputs.
Programmable WatchDog Timer (WDT).
System tick timer.
Serial Wire Debug and Serial Wire Trace port.
High-current output driver (20 mA) on one pin.
High-current sink drivers (20 mA) on two I2C-bus pins in Fast-mode Plus.
Integrated PMU (Power Management Unit) to minimize power consumption during
Sleep, Deep-sleep, and Deep power-down modes.
Three reduced power modes: Sleep, Deep-sleep, and Deep power-down.
Single power supply (2.0 V to 3.6 V).
10-bit ADC with input multiplexing among 8 pins.
GPIO pins can be used as edge and level sensitive interrupt sources.
Clock output function with divider that can reflect the system oscillator clock, IRC
clock, CPU clock, or the watchdog clock.
Processor wake-up from Deep-sleep mode via a dedicated start logic using up to 40 of
the functional pins.
Brownout detect with four separate thresholds for interrupt and one threshold for
forced reset.
Power-On Reset (POR).
Integrated oscillator with an operating range of 1 MHz to 25 MHz.
12 MHz internal RC oscillator trimmed to 1 % accuracy over the entire temperature
and voltage range that can optionally be used as a system clock.
Programmable watchdog oscillator with a frequency range of 7.8 kHz to 1.8 MHz.
System PLL allows CPU operation up to the maximum CPU rate without the need for a
high-frequency crystal. May be run from the system oscillator or the internal RC
oscillator.
For USB (LPC1342/43), a second, dedicated PLL is provided.
Code Read Protection (CRP) with different security levels.
Unique device serial number for identification.
Available as 48-pin LQFP package and 33-pin HVQFN package.
3. Applications
eMetering
Lighting
Alarm systems
White goods
LPC1311_13_42_43_2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 6 May 2010
2 of 60
LPC1311/13/42/43
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
LPC1311FHN33 HVQFN33
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads; n/a
33 terminals; body 7 × 7 × 0.85 mm
LPC1313FBD48 LQFP48
LPC1313FHN33 HVQFN33
LQFP48: plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm SOT313-2
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads; n/a
33 terminals; body 7 × 7 × 0.85 mm
LPC1342FHN33 HVQFN33
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads; n/a
33 terminals; body 7 × 7 × 0.85 mm
LPC1343FBD48 LQFP48
LPC1343FHN33 HVQFN33
LQFP48: plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm SOT313-2
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads; n/a
33 terminals; body 7 × 7 × 0.85 mm
4.1 Ordering options
Table 2.
Ordering options for LPC1311/13/42/43
Type number
Flash
Total
SRAM
USB
UART
RS-485 Fast+
I2C/
SSP
ADC
channels
Pins
Package
LPC1311FHN33
LPC1313FBD48
LPC1313FHN33
LPC1342FHN33
LPC1343FBD48
LPC1343FHN33
8 kB
4 kB
8 kB
8 kB
4 kB
8 kB
8 kB
-
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
8
8
8
8
8
8
33
48
33
33
48
33
HVQFN33
LQFP48
32 kB
32 kB
16 kB
32 kB
32 kB
-
-
HVQFN33
HVQFN33
LQFP48
Device
Device
Device
HVQFN33
LPC1311_13_42_43_2
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 6 May 2010
3 of 60
LPC1311/13/42/43
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
5. Block diagram
XTALIN
USB pins
XTALOUT
SWD
RESET
LPC1311/13/42/43
(1)
USB PHY
TEST/DEBUG
INTERFACE
IRC
WDO
POR
CLOCK
GENERATION,
POWER CONTROL,
SYSTEM
CLKOUT
ARM
CORTEX-M3
USB DEVICE
CONTROLLER
FUNCTIONS
(1)
clocks and
controls
I-code
bus
D-code
bus
system
bus
slave
slave
ROM
AHB-LITE BUS
slave
SRAM
4/8 kB
slave
FLASH
slave
slave
AHB TO
HIGH-SPEED
GPIO
GPIO ports
PIO0/1/2/3
8/16/32 kB
APB
BRIDGE
RXD
TXD
UART
AD[7:0]
10-bit ADC
SSP
(2)
DTR, DSR , CTS,
DCD , RI , RTS
(2)
(2)
SCK
SSEL
MISO
MOSI
CT32B0_MAT[3:0]
CT32B0_CAP0
32-bit COUNTER/TIMER 0
32-bit COUNTER/TIMER 1
16-bit COUNTER/TIMER 0
16-bit COUNTER/TIMER 1
SCL
SDA
2
CT32B1_MAT[3:0]
CT32B1_CAP0
I C-BUS
CT16B0_MAT[2:0]
CT16B0_CAP0
WDT
CT16B1_MAT[1:0]
CT16B1_CAP0
IOCONFIG
SYSTEM CONTROL
002aae722
(1) LPC1342/43 only.
(2) LQFP48 package only.
Fig 1. Block diagram
LPC1311_13_42_43_2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 6 May 2010
4 of 60
LPC1311/13/42/43
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
6. Pinning information
6.1 Pinning
1
2
36
35
34
33
32
31
30
29
28
27
26
25
PIO2_6
PIO3_0
PIO2_0/DTR
RESET/PIO0_0
R/PIO1_2/AD3/CT32B1_MAT1
R/PIO1_1/AD2/CT32B1_MAT0
R/PIO1_0/AD1/CT32B1_CAP0
R/PIO0_11/AD0/CT32B0_MAT3
PIO2_11/SCK
3
4
PIO0_1/CLKOUT/CT32B0_MAT2/USB_FTOGGLE
5
V
SS
6
XTALIN
LPC1343FBD48
7
XTALOUT
PIO1_10/AD6/CT16B1_MAT1
SWCLK/PIO0_10/SCK/CT16B0_MAT2
PIO0_9/MOSI/CT16B0_MAT1/SWO
PIO0_8/MISO/CT16B0_MAT0
PIO2_2/DCD
8
V
DD
9
PIO1_8/CT16B1_CAP0
PIO0_2/SSEL/CT16B0_CAP0
PIO2_7
10
11
12
PIO2_8
PIO2_10
002aae505
Fig 2. LPC1343 LQFP48 package
LPC1311_13_42_43_2
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 6 May 2010
5 of 60
LPC1311/13/42/43
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
terminal 1
index area
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
PIO2_0/DTR
R/PIO1_2/AD3/CT32B1_MAT1
R/PIO1_1/AD2/CT32B1_MAT0
R/PIO1_0/AD1/CT32B1_CAP0
R/PIO0_11/AD0/CT32B0_MAT3
PIO1_10/AD6/CT16B1_MAT1
SWCLK/PIO0_10/SCK/CT16B0_MAT2
PIO0_9/MOSI/CT16B0_MAT1/SWO
PIO0_8/MISO/CT16B0_MAT0
RESET/PIO0_0
PIO0_1/CLKOUT/CT32B0_MAT2/USB_FTOGGLE
XTALIN
LPC1342FHN33
LPC1343FHN33
XTALOUT
V
DD
PIO1_8/CT16B1_CAP0
33 V
SS
PIO0_2/SSEL/CT16B0_CAP0
002aae516
Transparent top view
Fig 3. LPC1342/43 HVQFN33 package
LPC1311_13_42_43_2
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 6 May 2010
6 of 60
LPC1311/13/42/43
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
1
2
36
35
34
33
32
31
30
29
28
27
26
25
PIO2_6
PIO3_0
PIO2_0/DTR
RESET/PIO0_0
R/PIO1_2/AD3/CT32B1_MAT1
R/PIO1_1/AD2/CT32B1_MAT0
R/PIO1_0/AD1/CT32B1_CAP0
R/PIO0_11/AD0/CT32B0_MAT3
PIO2_11/SCK
3
4
PIO0_1/CLKOUT/CT32B0_MAT2
5
V
SS
6
XTALIN
LPC1313FBD48
7
XTALOUT
PIO1_10/AD6/CT16B1_MAT1
SWCLK/PIO0_10/SCK/CT16B0_MAT2
PIO0_9/MOSI/CT16B0_MAT1/SWO
PIO0_8/MISO/CT16B0_MAT0
PIO2_2/DCD
8
V
DD
9
PIO1_8/CT16B1_CAP0
PIO0_2/SSEL/CT16B0_CAP0
PIO2_7
10
11
12
PIO2_8
PIO2_10
002aae513
Fig 4. LPC1313 LQFP48 package
LPC1311_13_42_43_2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 6 May 2010
7 of 60
LPC1311/13/42/43
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
terminal 1
index area
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
PIO2_0/DTR
RESET/PIO0_0
R/PIO1_2/AD3/CT32B1_MAT1
R/PIO1_1/AD2/CT32B1_MAT0
R/PIO1_0/AD1/CT32B1_CAP0
R/PIO0_11/AD0/CT32B0_MAT3
PIO1_10/AD6/CT16B1_MAT1
SWCLK/PIO0_10/SCK/CT16B0_MAT2
PIO0_9/MOSI/CT16B0_MAT1/SWO
PIO0_8/MISO/CT16B0_MAT0
PIO0_1/CLKOUT/CT32B0_MAT2
XTALIN
LPC1311FHN33
LPC1313FHN33
XTALOUT
V
DD
PIO1_8/CT16B1_CAP0
33 V
SS
PIO0_2/SSEL/CT16B0_CAP0
002aae517
Transparent top view
Fig 5. LPC1311/13 HVQFN33 package
6.2 Pin description
Table 3.
LPC1313/43 LQFP48 pin description table
Symbol
Pin
Type
Description
RESET/PIO0_0
3[1]
I
RESET — External reset input: A LOW on this pin resets the device,
causing I/O ports and peripherals to take on their default states, and
processor execution to begin at address 0.
I/O
I/O
PIO0_0 — General purpose digital input/output pin.
PIO0_1/CLKOUT/
CT32B0_MAT2/
USB_FTOGGLE
4[2]
PIO0_1 — General purpose digital input/output pin. A LOW level on this pin
during reset starts the ISP command handler or the USB device
enumeration (USB on LPC1343 only, see description of PIO0_3).
O
O
O
I/O
O
I
CLKOUT — Clockout pin.
CT32B0_MAT2 — Match output 2 for 32-bit timer 0.
USB_FTOGGLE — USB 1 ms Start-of-Frame signal (LPC1343 only).
PIO0_2 — General purpose digital input/output pin.
SSEL — Slave select for SSP.
PIO0_2/SSEL/
CT16B0_CAP0
10[2]
CT16B0_CAP0 — Capture input 0 for 16-bit timer 0.
LPC1311_13_42_43_2
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 6 May 2010
8 of 60
LPC1311/13/42/43
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
LPC1313/43 LQFP48 pin description table …continued
Symbol
Pin
Type
Description
PIO0_3/USB_VBUS
14[2]
I/O
PIO0_3 — General purpose digital input/output pin. LPC1343 only: A LOW
level on this pin during reset starts the ISP command handler, a HIGH level
starts the USB device enumeration.
I
USB_VBUS — Monitors the presence of USB bus power (LPC1343 only).
PIO0_4 — General purpose digital input/output pin (open-drain).
SCL — I2C-bus clock input/output (open-drain). High-current sink only if I2C
PIO0_4/SCL
PIO0_5/SDA
15[3]
16[3]
I/O
I/O
Fast-mode Plus is selected in the I/O configuration register.
I/O
I/O
PIO0_5 — General purpose digital input/output pin (open-drain).
SDA — I2C-bus data input/output (open-drain). High-current sink only if I2C
Fast-mode Plus is selected in the I/O configuration register.
PIO0_6/USB_CONNECT/ 22[2]
SCK
I/O
O
PIO0_6 — General purpose digital input/output pin.
USB_CONNECT — Signal used to switch an external 1.5 kΩ resistor under
software control. Used with the SoftConnect USB feature (LPC1343 only).
I/O
I/O
SCK — Serial clock for SSP.
PIO0_7/CTS
23[2]
27[2]
PIO0_7 — General purpose digital input/output pin (high-current output
driver).
I
CTS — Clear To Send input for UART.
PIO0_8/MISO/
CT16B0_MAT0
I/O
I/O
O
I/O
I/O
O
O
I
PIO0_8 — General purpose digital input/output pin.
MISO — Master In Slave Out for SSP.
CT16B0_MAT0 — Match output 0 for 16-bit timer 0.
PIO0_9 — General purpose digital input/output pin.
MOSI — Master Out Slave In for SSP.
PIO0_9/MOSI/
CT16B0_MAT1/
SWO
28[2]
29[2]
32[4]
33[4]
34[4]
CT16B0_MAT1 — Match output 1 for 16-bit timer 0.
SWO — Serial wire trace output.
SWCLK/PIO0_10/
SCK/CT16B0_MAT2
SWCLK — Serial wire clock.
I/O
O
O
I
PIO0_10 — General purpose digital input/output pin.
SCK — Serial clock for SSP.
CT16B0_MAT2 — Match output 2 for 16-bit timer 0.
R — Reserved. Configure for an alternate function in the IOCONFIG block.
PIO0_11 — General purpose digital input/output pin.
AD0 — A/D converter, input 0.
R/PIO0_11/
AD0/CT32B0_MAT3
I/O
I
O
I
CT32B0_MAT3 — Match output 3 for 32-bit timer 0.
R — Reserved. Configure for an alternate function in the IOCONFIG block.
PIO1_0 — General purpose digital input/output pin.
AD1 — A/D converter, input 1.
R/PIO1_0/
AD1/CT32B1_CAP0
I/O
I
I
CT32B1_CAP0 — Capture input 0 for 32-bit timer 1.
R — Reserved. Configure for an alternate function in the IOCONFIG block.
PIO1_1 — General purpose digital input/output pin.
AD2 — A/D converter, input 2.
R/PIO1_1/
AD2/CT32B1_MAT0
O
I/O
I
O
CT32B1_MAT0 — Match output 0 for 32-bit timer 1.
LPC1311_13_42_43_2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 6 May 2010
9 of 60
LPC1311/13/42/43
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Symbol
LPC1313/43 LQFP48 pin description table …continued
Pin
Type
Description
R/PIO1_2/
AD3/CT32B1_MAT1
35[4]
I
R — Reserved. Configure for an alternate function in the IOCONFIG block.
PIO1_2 — General purpose digital input/output pin.
AD3 — A/D converter, input 3.
I/O
I
O
I/O
I/O
I
CT32B1_MAT1 — Match output 1 for 32-bit timer 1.
SWDIO — Serial wire debug input/output.
SWDIO/PIO1_3/AD4/
CT32B1_MAT2
39[4]
PIO1_3 — General purpose digital input/output pin.
AD4 — A/D converter, input 4.
O
I/O
I
CT32B1_MAT2 — Match output 2 for 32-bit timer 1.
PIO1_4 — General purpose digital input/output pin.
AD5 — A/D converter, input 5.
PIO1_4/AD5/
CT32B1_MAT3/WAKEUP
40[4]
O
I
CT32B1_MAT3 — Match output 3 for 32-bit timer 1.
WAKEUP — Deep power-down mode wake-up pin. This pin must be pulled
HIGH externally to enter Deep power-down mode and pulled LOW to exit
Deep power-down mode.
PIO1_5/RTS/
CT32B0_CAP0
45[2]
46[2]
47[2]
I/O
O
PIO1_5 — General purpose digital input/output pin.
RTS — Request To Send output for UART.
I
CT32B0_CAP0 — Capture input 0 for 32-bit timer 0.
PIO1_6 — General purpose digital input/output pin.
RXD — Receiver input for UART.
PIO1_6/RXD/
CT32B0_MAT0
I/O
I
O
CT32B0_MAT0 — Match output 0 for 32-bit timer 0.
PIO1_7 — General purpose digital input/output pin.
TXD — Transmitter output for UART.
PIO1_7/TXD/
CT32B0_MAT1
I/O
O
O
CT32B0_MAT1 — Match output 1 for 32-bit timer 0.
PIO1_8 — General purpose digital input/output pin.
CT16B1_CAP0 — Capture input 0 for 16-bit timer 1.
PIO1_9 — General purpose digital input/output pin.
CT16B1_MAT0 — Match output 0 for 16-bit timer 1.
PIO1_10 — General purpose digital input/output pin.
AD6 — A/D converter, input 6.
PIO1_8/CT16B1_CAP0
PIO1_9/CT16B1_MAT0
9[2]
I/O
I
17[2]
30[4]
I/O
O
PIO1_10/AD6/
CT16B1_MAT1
I/O
I
O
CT16B1_MAT1 — Match output 1 for 16-bit timer 1.
PIO1_11 — General purpose digital input/output pin.
AD7 — A/D converter, input 7.
PIO1_11/AD7
PIO2_0/DTR
PIO2_1/DSR
PIO2_2/DCD
PIO2_3/RI
42[4]
2[2]
I/O
I
I/O
O
PIO2_0 — General purpose digital input/output pin.
DTR — Data Terminal Ready output for UART.
PIO2_1 — General purpose digital input/output pin.
DSR — Data Set Ready input for UART.
13[2]
26[2]
38[2]
18[2]
I/O
I
I/O
I
PIO2_2 — General purpose digital input/output pin.
DCD — Data Carrier Detect input for UART.
PIO2_3 — General purpose digital input/output pin.
RI — Ring Indicator input for UART.
I/O
I
PIO2_4
I/O
PIO2_4 — General purpose digital input/output pin (LPC1343 only).
LPC1311_13_42_43_2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 6 May 2010
10 of 60
LPC1311/13/42/43
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Symbol
PIO2_4
LPC1313/43 LQFP48 pin description table …continued
Pin
Type
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
Description
19[2]
21[2]
20[2]
1[2]
11[2]
12[2]
24[2]
25[2]
31[2]
PIO2_4 — General purpose digital input/output pin (LPC1313 only).
PIO2_5 — General purpose digital input/output pin (LPC1343 only).
PIO2_5 — General purpose digital input/output pin (LPC1313 only).
PIO2_6 — General purpose digital input/output pin.
PIO2_7 — General purpose digital input/output pin.
PIO2_8 — General purpose digital input/output pin.
PIO2_9 — General purpose digital input/output pin.
PIO2_10 — General purpose digital input/output pin.
PIO2_11 — General purpose digital input/output pin.
SCK — Serial clock for SSP.
PIO2_5
PIO2_5
PIO2_6
PIO2_7
PIO2_8
PIO2_9
PIO2_10
PIO2_11/SCK
PIO3_0
PIO3_1
PIO3_2
PIO3_3
PIO3_4
PIO3_5
USB_DM
USB_DP
VDD
36[2]
37[2]
43[2]
48[2]
18[2]
21[2]
19[5]
20[5]
8; 44
PIO3_0 — General purpose digital input/output pin.
PIO3_1 — General purpose digital input/output pin.
PIO3_2 — General purpose digital input/output pin.
PIO3_3 — General purpose digital input/output pin.
PIO3_4 — General purpose digital input/output pin (LPC1313 only).
PIO3_5 — General purpose digital input/output pin (LPC1313 only).
USB_DM — USB bidirectional D− line (LPC1343 only).
USB_DP — USB bidirectional D+ line (LPC1343 only).
3.3 V supply voltage to the internal regulator, the external rail, and the ADC.
Also used as the ADC reference voltage.
XTALIN
6[6]
I
Input to the oscillator circuit and internal clock generator circuits. Input
voltage must not exceed 1.8 V.
XTALOUT
VSS
7[6]
O
I
Output from the oscillator amplifier.
Ground.
5; 41
[1] See Figure 31 for pad characteristics. RESET functionality is not available in Deep power-down mode. Use the WAKEUP pin to reset
the chip and wake up from Deep power-down mode.
[2] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors and configurable hysteresis (see Figure 30).
[3] I2C-bus pads compliant with the I2C-bus specification for I2C standard mode and I2C Fast-mode Plus.
[4] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors, configurable hysteresis, and analog input.
When configured as a ADC input, digital section of the pad is disabled and the pin is not 5 V tolerant (see Figure 30).
[5] Pad provides USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and Low-speed mode
only).
[6] When the system oscillator is not used, connect XTALIN and XTALOUT as follows: XTALIN can be left floating or can be grounded
(grounding is preferred to reduce susceptibility to noise). XTALOUT should be left floating.
Table 4.
LPC1311/13/42/43 HVQFN33 pin description table
Symbol
Pin
Type
Description
RESET/PIO0_0
2[1]
I
RESET — External reset input: A LOW on this pin resets the device,
causing I/O ports and peripherals to take on their default states, and
processor execution to begin at address 0.
I/O
PIO0_0 — General purpose digital input/output pin.
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Table 4.
Symbol
LPC1311/13/42/43 HVQFN33 pin description table …continued
Pin
Type
Description
PIO0_1/CLKOUT/
CT32B0_MAT2/
USB_FTOGGLE
3[2]
I/O
PIO0_1 — General purpose digital input/output pin. A LOW level on this pin
during reset starts the ISP command handler or the USB device
enumeration (USB on LPC1342/43 only, see description of PIO0_3).
O
CLKOUT — Clock out pin.
O
CT32B0_MAT2 — Match output 2 for 32-bit timer 0.
USB_FTOGGLE — USB 1 ms Start-of-Frame signal (LPC1342/43 only).
PIO0_2 — General purpose digital input/output pin.
SSEL — Slave select for SSP.
O
PIO0_2/SSEL/
CT16B0_CAP0
8[2]
I/O
O
I
CT16B0_CAP0 — Capture input 0 for 16-bit timer 0.
PIO0_3/USB_VBUS
9[2]
I/O
PIO0_3 — General purpose digital input/output pin. LPC1342/43 only: A
LOW level on this pin during reset starts the ISP command handler, a HIGH
level starts the USB device enumeration.
I
USB_VBUS — Monitors the presence of USB bus power (LPC1342/43
only).
PIO0_4/SCL
PIO0_5/SDA
10[3]
11[3]
I/O
I/O
PIO0_4 — General purpose digital input/output pin (open-drain).
SCL — I2C-bus clock input/output (open-drain). High-current sink only if I2C
Fast-mode Plus is selected in the I/O configuration register.
I/O
I/O
PIO0_5 — General purpose digital input/output pin (open-drain).
SDA — I2C-bus data input/output (open-drain). High-current sink only if I2C
Fast-mode Plus is selected in the I/O configuration register.
PIO0_6/USB_CONNECT/ 15[2]
SCK
I/O
O
PIO0_6 — General purpose digital input/output pin.
USB_CONNECT — Signal used to switch an external 1.5 kΩ resistor under
software control. Used with the SoftConnect USB feature (LPC1342/43
only).
I/O
I/O
SCK — Serial clock for SSP.
PIO0_7/CTS
16[2]
17[2]
PIO0_7 — General purpose digital input/output pin (high-current output
driver).
I
CTS — Clear To Send input for UART.
PIO0_8/MISO/
CT16B0_MAT0
I/O
I/O
O
PIO0_8 — General purpose digital input/output pin.
MISO — Master In Slave Out for SSP.
CT16B0_MAT0 — Match output 0 for 16-bit timer 0.
PIO0_9 — General purpose digital input/output pin.
MOSI — Master Out Slave In for SSP.
PIO0_9/MOSI/
CT16B0_MAT1/
SWO
18[2]
19[2]
21[4]
I/O
I/O
O
CT16B0_MAT1 — Match output 1 for 16-bit timer 0.
SWO — Serial wire trace output.
O
SWCLK/PIO0_10/SCK/
CT16B0_MAT2
I
SWCLK — Serial wire clock.
I/O
O
PIO0_10 — General purpose digital input/output pin.
SCK — Serial clock for SSP.
O
CT16B0_MAT2 — Match output 2 for 16-bit timer 0.
R — Reserved. Configure for an alternate function in the IOCONFIG block.
PIO0_11 — General purpose digital input/output pin.
AD0 — A/D converter, input 0.
R/PIO0_11/AD0/
CT32B0_MAT3
I
I/O
I
O
CT32B0_MAT3 — Match output 3 for 32-bit timer 0.
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Table 4.
Symbol
LPC1311/13/42/43 HVQFN33 pin description table …continued
Pin
Type
Description
R/PIO1_0/AD1/
CT32B1_CAP0
22[4]
I
R — Reserved. Configure for an alternate function in the IOCONFIG block.
PIO1_0 — General purpose digital input/output pin.
AD1 — A/D converter, input 1.
I/O
I
I
CT32B1_CAP0 — Capture input 0 for 32-bit timer 1.
R — Reserved. Configure for an alternate function in the IOCONFIG block.
PIO1_1 — General purpose digital input/output pin.
AD2 — A/D converter, input 2.
R/PIO1_1/AD2/
CT32B1_MAT0
23[4]
24[4]
25[4]
26[4]
O
I/O
I
O
I
CT32B1_MAT0 — Match output 0 for 32-bit timer 1.
R — Reserved. Configure for an alternate function in the IOCONFIG block.
PIO1_2 — General purpose digital input/output pin.
AD3 — A/D converter, input 3.
R/PIO1_2/AD3/
CT32B1_MAT1
I/O
I
O
I/O
I/O
I
CT32B1_MAT1 — Match output 1 for 32-bit timer 1.
SWDIO — Serial wire debug input/output.
SWDIO/PIO1_3/AD4/
CT32B1_MAT2
PIO1_3 — General purpose digital input/output pin.
AD4 — A/D converter, input 4.
O
I/O
I
CT32B1_MAT2 — Match output 2 for 32-bit timer 1.
PIO1_4 — General purpose digital input/output pin.
AD5 — A/D converter, input 5.
PIO1_4/AD5/
CT32B1_MAT3/WAKEUP
O
I
CT32B1_MAT3 — Match output 3 for 32-bit timer 1.
WAKEUP — Deep power-down mode wake-up pin. This pin must be pulled
HIGH externally to enter Deep power-down mode and pulled LOW to exit
Deep power-down mode.
PIO1_5/RTS/
CT32B0_CAP0
30[2]
31[2]
32[2]
I/O
O
I
PIO1_5 — General purpose digital input/output pin.
RTS — Request To Send output for UART.
CT32B0_CAP0 — Capture input 0 for 32-bit timer 0.
PIO1_6 — General purpose digital input/output pin.
RXD — Receiver input for UART.
PIO1_6/RXD/
CT32B0_MAT0
I/O
I
O
I/O
O
O
I/O
I
CT32B0_MAT0 — Match output 0 for 32-bit timer 0.
PIO1_7 — General purpose digital input/output pin.
TXD — Transmitter output for UART.
PIO1_7/TXD/
CT32B0_MAT1
CT32B0_MAT1 — Match output 1 for 32-bit timer 0.
PIO1_8 — General purpose digital input/output pin.
CT16B1_CAP0 — Capture input 0 for 16-bit timer 1.
PIO1_9 — General purpose digital input/output pin.
CT16B1_MAT0 — Match output 0 for 16-bit timer 1.
PIO1_10 — General purpose digital input/output pin.
AD6 — A/D converter, input 6.
PIO1_8/CT16B1_CAP0
PIO1_9/CT16B1_MAT0
7[2]
12[2]
20[4]
I/O
O
I/O
I
PIO1_10/AD6/
CT16B1_MAT1
O
I/O
I
CT16B1_MAT1 — Match output 1 for 16-bit timer 1.
PIO1_11 — General purpose digital input/output pin.
AD7 — A/D converter, input 7.
PIO1_11/AD7
27[4]
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Table 4.
LPC1311/13/42/43 HVQFN33 pin description table …continued
Symbol
Pin
1[2]
Type
I/O
O
Description
PIO2_0/DTR
PIO2_0 — General purpose digital input/output pin.
DTR — Data Terminal Ready output for UART.
PIO3_2
PIO3_4
PIO3_5
USB_DM
USB_DP
VDD
28[2]
13[2]
14[2]
13[5]
14[5]
6; 29
I/O
I/O
I/O
I/O
I/O
I
PIO3_2 — General purpose digital input/output pin.
PIO3_4 — General purpose digital input/output pin (LPC1311/13 only).
PIO3_5 — General purpose digital input/output pin (LPC1311/13 only).
USB_DM — USB bidirectional D− line (LPC1342/43 only).
USB_DP — USB bidirectional D+ line (LPC1342/43 only).
3.3 V supply voltage to the internal regulator, the external rail, and the ADC.
Also used as the ADC reference voltage.
XTALIN
4[6]
I
Input to the oscillator circuit and internal clock generator circuits. Input
voltage must not exceed 1.8 V.
XTALOUT
VSS
5[6]
33
O
-
Output from the oscillator amplifier.
Thermal pad. Connect to ground.
[1] See Figure 31 for pad characteristics. RESET functionality is not available in Deep power-down mode. Use the WAKEUP pin to reset
the chip and wake up from Deep power-down mode.
[2] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors and configurable hysteresis (see Figure 30).
[3] I2C-bus pads compliant with the I2C-bus specification for I2C standard mode and I2C Fast-mode Plus.
[4] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors, configurable hysteresis, and analog input.
When configured as a ADC input, digital section of the pad is disabled, and the pin is not 5 V tolerant (see Figure 30).
[5] Pad provides USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and Low-speed mode
only).
[6] When the system oscillator is not used, connect XTALIN and XTALOUT as follows: XTALIN can be left floating or can be grounded
(grounding is preferred to reduce susceptibility to noise). XTALOUT should be left floating.
7. Functional description
7.1 Architectural overview
The ARM Cortex-M3 includes three AHB-Lite buses: the system bus, the I-code bus, and
the D-code bus (see Figure 1). The I-code and D-code core buses are faster than the
system bus and are used similarly to TCM interfaces: one bus dedicated for instruction
fetch (I-code) and one bus for data access (D-code). The use of two core buses allows for
simultaneous operations if concurrent operations target different devices.
7.2 ARM Cortex-M3 processor
The ARM Cortex-M3 is a general purpose, 32-bit microprocessor, which offers high
performance and very low power consumption. The ARM Cortex-M3 offers many new
features, including a Thumb-2 instruction set, low interrupt latency, hardware divide,
interruptible/continuable multiple load and store instructions, automatic state save and
restore for interrupts, tightly integrated interrupt controller, and multiple core buses
capable of simultaneous accesses.
Pipeline techniques are employed so that all parts of the processing and memory systems
can operate continuously. Typically, while one instruction is being executed, its successor
is being decoded, and a third instruction is being fetched from memory.
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The ARM Cortex-M3 processor is described in detail in the Cortex-M3 Technical
Reference Manual which is available on the official ARM website.
7.3 On-chip flash program memory
The LPC1311/13/42/43 contain 32 kB (LPC1313 and LPC1343), 16 kB (LPC1342), or
8 kB (LPC1311) of on-chip flash memory.
7.4 On-chip SRAM
The LPC1311/13/42/43 contain a total of 8 kB (LPC1343 and LPC1313) or 4 kB (LPC1342
and LPC1311) on-chip static RAM memory.
7.5 Memory map
The LPC134x incorporates several distinct memory regions, shown in the following
figures. Figure 6 shows the overall map of the entire address space from the user
program viewpoint following reset. The interrupt vector area supports address remapping.
The AHB peripheral area is 2 MB in size and is divided to allow for up to 128 peripherals.
The APB peripheral area is 512 kB in size and is divided to allow for up to 32 peripherals.
Each peripheral of either type is allocated 16 kB of space. This allows simplifying the
address decoding for each peripheral.
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AHB peripherals
0x5020 0000
LPC1311/13/42/43
4 GB
0xFFFF FFFF
127- 4 reserved
0x5004 0000
reserved
GPIO PIO3
GPIO PIO2
GPIO PIO1
GPIO PIO0
3
2
1
0
0x5003 0000
0x5002 0000
0x5020 0000
0x5000 0000
AHB peripherals
reserved
0x5001 0000
0x5000 0000
APB peripherals
31 - 19 reserved
0x4008 0000
0x4008 0000
0x4000 0000
APB peripherals
reserved
1 GB
0x4004 C000
0x4004 8000
0x4004 4000
0x4004 0000
system control
IOCONFIG
18
17
0x2400 0000
0x2200 0000
AHB SRAM bit-band alias addressing
SSP
16
15
flash controller
0x4003 C000
0x4003 8000
reserved
14
PMU
0x2000 0000
0.5 GB
10 - 13 reserved
reserved
0x4002 8000
0x4002 4000
0x4002 0000
reserved
9
8
7
6
5
4
3
2
0x1FFF 4000
0x1FFF 0000
16 kB boot ROM
USB (LPC1342/43 only)
ADC
0x4001 C000
0x4001 8000
32-bit counter/timer 1
reserved
32-bit counter/timer 0
16-bit counter/timer 1
16-bit counter/timer 0
UART
0x4001 4000
0x4001 0000
0x4000 C000
0x4000 8000
0x1000 2000
0x1000 1000
0x1000 0000
8 kB SRAM (LPC1313/1343)
4 kB SRAM (LPC1311/1342)
I-code/D-code
memory space
WDT
1
0
0x4000 4000
0x4000 0000
reserved
2
I C-bus
0x0000 8000
32 kB on-chip flash (LPC1313/43)
16 kB on-chip flash (LPC1342)
8 kB on-chip flash (LPC1311)
0x0000 4000
0x0000 2000
+ 512 byte
active interrupt vectors
0x0000 0200
0x0000 0000
0x0000 0000
0 GB
002aae723
Fig 6. LPC1311/13/42/43 memory map
7.6 Nested Vectored Interrupt Controller (NVIC)
The Nested Vectored Interrupt Controller (NVIC) is an integral part of the Cortex-M3. The
tight coupling to the CPU allows for low interrupt latency and efficient processing of late
arriving interrupts.
7.6.1 Features
• Controls system exceptions and peripheral interrupts.
• On the LPC1311/13/42/43, the NVIC supports 16 vectored interrupts. In addition, up
to 40 of the individual GPIO inputs are NVIC-vector capable.
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• 8 programmable interrupt priority levels, with hardware priority level masking
• Relocatable vector table.
• Software interrupt generation.
7.6.2 Interrupt sources
Each peripheral device has one interrupt line connected to the NVIC but may have several
interrupt flags. Individual interrupt flags may also represent more than one interrupt
source.
Any GPIO pin (total of up to 42 pins) regardless of the selected function, can be
programmed to generate an interrupt on a level, or rising edge or falling edge, or both.
7.7 IOCONFIG block
The IOCONFIG block allows selected pins of the microcontroller to have more than one
function. Configuration registers control the multiplexers to allow connection between the
pin and the on-chip peripherals.
Peripherals should be connected to the appropriate pins prior to being activated and prior
to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is
not mapped to a related pin should be considered undefined.
7.8 Fast general purpose parallel I/O
Device pins that are not connected to a specific peripheral function are controlled by the
GPIO registers. Pins may be dynamically configured as inputs or outputs. Multiple outputs
can be set or cleared in one write operation.
LPC1311/13/42/43 use accelerated GPIO functions:
• GPIO block is a dedicated AHB peripheral so that the fastest possible I/O timing can
be achieved.
• Entire port value can be written in one instruction.
Additionally, any GPIO pin (total of up to 42 pins) providing a digital function can be
programmed to generate an interrupt on a level, a rising or falling edge, or both.
7.8.1 Features
• Bit level port registers allow a single instruction to set or clear any number of bits in
one write operation.
• Direction control of individual bits.
• All I/O default to inputs with pull-up resistors enabled after reset.
• Pull-up/pull-down resistor configuration can be programmed through the IOCONFIG
block for each GPIO pin.
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7.9 USB interface (LPC1342/43 only)
The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a
host and one or more (up to 127) peripherals. The host controller allocates the USB
bandwidth to attached devices through a token-based protocol. The bus supports
hot-plugging and dynamic configuration of the devices. All transactions are initiated by the
host controller.
The LPC1342/43 USB interface is a device controller with on-chip PHY for device
functions.
7.9.1 Full-speed USB device controller
The device controller enables 12 Mbit/s data exchange with a USB Host controller. It
consists of a register interface, serial interface engine, and endpoint buffer memory. The
serial interface engine decodes the USB data stream and writes data to the appropriate
endpoint buffer. The status of a completed USB transfer or error condition is indicated via
status registers. An interrupt is also generated if enabled.
7.9.1.1 Features
• Dedicated USB PLL available.
• Fully compliant with USB 2.0 specification (full speed).
• Supports 10 physical (5 logical) endpoints with up to 64 bytes buffer RAM per
endpoint (see Table 5).
• Supports Control, Bulk, Isochronous, and Interrupt endpoints.
• Supports SoftConnect feature.
• Double buffer implementation for Bulk and Isochronous endpoints.
Table 5.
Logical
endpoint endpoint
USB device endpoint configuration
Physical
Endpoint type
Direction Packet size
(byte)
Double buffer
0
0
1
1
2
2
3
3
4
4
0
1
2
3
4
5
6
7
8
9
Control
out
in
64
64
no
Control
no
Interrupt/Bulk
Interrupt/Bulk
Interrupt/Bulk
Interrupt/Bulk
Interrupt/Bulk
Interrupt/Bulk
Isochronous
Isochronous
out
in
64
no
64
no
out
in
64
no
64
no
out
in
64
yes
yes
yes
yes
64
out
in
512
512
7.10 UART
The LPC1311/13/42/43 contains one UART.
Support for RS-485/9-bit mode allows both software address detection and automatic
address detection using 9-bit mode.
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The UART includes a fractional baud rate generator. Standard baud rates such as
115200 Bd can be achieved with any crystal frequency above 2 MHz.
7.10.1 Features
• Maximum UART data bit rate of 4.5 MBit/s.
• 16-byte receive and transmit FIFOs.
• Register locations conform to 16C550 industry standard.
• Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B.
• Built-in fractional baud rate generator covering wide range of baud rates without a
need for external crystals of particular values.
• Fractional divider for baud rate control, auto baud capabilities and FIFO control
mechanism that enables software flow control implementation.
• Support for RS-485/9-bit mode.
• Support for modem control.
7.11 SSP serial I/O controller
The LPC1311/13/42/43 contain one SSP controller. The SSP controller is capable of
operation on a SSP, 4-wire SSI, or Microwire bus. It can interact with multiple masters and
slaves on the bus. Only a single master and a single slave can communicate on the bus
during a given data transfer. The SSP supports full duplex transfers, with frames of 4 bits
to 16 bits of data flowing from the master to the slave and from the slave to the master. In
practice, often only one of these data flows carries meaningful data.
7.11.1 Features
• Maximum SSP speed of 36 Mbit/s (master) or 6 Mbit/s (slave)
• Compatible with Motorola SPI, 4-wire Texas Instruments SSI, and National
Semiconductor Microwire buses
• Synchronous serial communication
• Master or slave operation
• 8-frame FIFOs for both transmit and receive
• 4-bit to 16-bit frame
7.12 I2C-bus serial I/O controller
The LPC1311/13/42/43 contain one I2C-bus controller.
The I2C-bus is bidirectional for inter-IC control using only two wires: a Serial Clock Line
(SCL) and a Serial DAta line (SDA). Each device is recognized by a unique address and
can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the
capability to both receive and send information (such as memory). Transmitters and/or
receivers can operate in either master or slave mode, depending on whether the chip has
to initiate a data transfer or is only addressed. The I2C is a multi-master bus and can be
controlled by more than one bus master connected to it.
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7.12.1 Features
• The I2C-bus interface is a standard I2C-bus compliant interface with open-drain pins.
The I2C-bus interface also supports Fast-mode Plus with bit rates up to 1 Mbit/s.
• Easy to configure as master, slave, or master/slave.
• Programmable clocks allow versatile rate control.
• Bidirectional data transfer between masters and slaves.
• Multi-master bus (no central master).
• Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus.
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus.
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
• The I2C-bus can be used for test and diagnostic purposes.
• The I2C-bus controller supports multiple address recognition and a bus monitor mode.
7.13 10-bit ADC
The LPC1311/13/42/43 contains one ADC. It is a single 10-bit successive approximation
ADC with eight channels.
7.13.1 Features
• 10-bit successive approximation ADC.
• Input multiplexing among 8 pins.
• Power-down mode.
• Measurement range 0 V to VDD
.
• 10-bit conversion time ≥ 2.44 μs (up to 400 kSamples/s).
• Burst conversion mode for single or multiple inputs.
• Optional conversion on transition of input pin or timer match signal.
• Individual result registers for each ADC channel to reduce interrupt overhead.
7.14 General purpose external event counter/timers
The LPC1311/13/42/43 includes two 32-bit counter/timers and two 16-bit counter/timers.
The counter/timer is designed to count cycles of the system derived clock. It can optionally
generate interrupts or perform other actions at specified timer values, based on four
match registers. Each counter/timer also includes one capture input to trap the timer value
when an input signal transitions, optionally generating an interrupt.
7.14.1 Features
• A 32-bit/16-bit counter/timer with a programmable 32-bit/16-bit prescaler.
• Counter or timer operation.
• One capture channel per timer, that can take a snapshot of the timer value when an
input signal transitions. A capture event may also generate an interrupt.
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• Four match registers per timer that allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Up to four external outputs corresponding to match registers, with the following
capabilities:
– Set LOW on match.
– Set HIGH on match.
– Toggle on match.
– Do nothing on match.
7.15 System tick timer
The ARM Cortex-M3 includes a system tick timer (SYSTICK) that is intended to generate
a dedicated SYSTICK exception at a fixed time interval, normally set to 10 ms.
7.16 Watchdog timer
The purpose of the watchdog is to reset the microcontroller within a selectable time
period. When enabled, the watchdog will generate a system reset if the user program fails
to ‘feed’ (or reload) the watchdog within a predetermined amount of time.
7.16.1 Features
• Internally resets chip if not periodically reloaded.
• Debug mode.
• Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be
disabled.
• Incorrect/incomplete feed sequence causes reset/interrupt if enabled.
• Flag to indicate watchdog reset.
• Programmable 32-bit timer with internal prescaler.
• Selectable time period from (Tcy(WDCLK) × 256 × 4) to (Tcy(WDCLK) × 232 × 4) in
multiples of Tcy(WDCLK) × 4.
• The Watchdog Clock (WDCLK) source can be selected from the Internal RC oscillator
(IRC), the watchdog oscillator, or the main clock. This gives a wide range of potential
timing choices of watchdog operation under different power reduction conditions. It
also provides the ability to run the WDT from an entirely internal source that is not
dependent on an external crystal and its associated components and wiring for
increased reliability.
7.17 Clocking and power control
7.17.1 Integrated oscillators
The LPC1311/13/42/43 include three independent oscillators. These are the system
oscillator, the Internal RC oscillator (IRC), and the watchdog oscillator. Each oscillator can
be used for more than one purpose as required in a particular application.
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Following reset, the LPC1311/13/42/43 will operate from the internal RC oscillator until
switched by software. This allows systems to operate without any external crystal and the
bootloader code to operate at a known frequency.
See Figure 7 for an overview of the LPC1311/13/42/43 clock generation.
AHB clock 0
(system)
system clock
SYSTEM CLOCK
AHB clock 1
(ROM)
DIVIDER
AHBCLKCTRL
(AHB clock enable)
AHB clocks
2 to 15
14
(memories
and peripherals)
AHBCLKCTRL
AHB clock 16
(IOCONFIG)
AHBCLKCTRL
SSP PERIPHERAL
CLOCK DIVIDER
SSP
IRC oscillator
main clock
UART PERIPHERAL
CLOCK DIVIDER
UART
watchdog oscillator
ARM TRACE
ARM
CLOCK DIVIDER
trace clock
MAINCLKSEL
(main clock select)
SYSTICK TIMER
CLOCK DIVIDER
SYSTICK
timer
IRC oscillator
SYSTEM PLL
system oscillator
IRC oscillator
WDT CLOCK
DIVIDER
WDT
USB
SYSPLLCLKSEL
(system PLL clock select)
watchdog oscillator
WDTUEN
(WDT clock update enable)
USB PLL
system oscillator
USB 48 MHz CLOCK
DIVIDER
USBPLLCLKSEL
(USB clock select)
USBUEN
(USB clock update enable)
IRC oscillator
system oscillator
watchdog oscillator
CLKOUT PIN CLOCK
DIVIDER
CLKOUT pin
CLKOUTUEN
(CLKOUT update enable)
002aae859
The USB clock is available on LPC1342/43 only.
Fig 7. LPC1311/13/42/43 clocking generation block diagram
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7.17.1.1 Internal RC oscillator
The IRC may be used as the clock source for the WDT, and/or as the clock that drives the
system PLL and subsequently the CPU. The nominal IRC frequency is 12 MHz. The IRC
is trimmed to 1 % accuracy over the entire voltage and temperature range.
Upon power-up, any chip reset, or wake-up from Deep power-down mode, the
LPC1311/13/42/43 use the IRC as the clock source. Software may later switch to one of
the other available clock sources.
7.17.1.2 System oscillator
The system oscillator can be used as the clock source for the CPU, with or without using
the PLL. On the LPC134x, the system oscillator must be used to provide the clock source
to USB.
The system oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can be
boosted to a higher frequency, up to the maximum CPU operating frequency, by the
system PLL.
7.17.1.3 Watchdog oscillator
The watchdog oscillator can be used as a clock source that directly drives the CPU, the
watchdog timer, or the CLKOUT pin. The watchdog oscillator nominal frequency is
programmable between 7.8 kHz and 1.7 MHz. The frequency spread over processing and
temperature is ±40 % (see also Table 14).
7.17.2 System PLL and USB PLL
The LPC134x contain a system PLL and a dedicated PLL for generating the 48 MHz USB
clock. The LPC131x contain the system PLL only. The system and USB PLLs are
identical.
The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input
frequency is multiplied up to a high frequency with a Current Controlled Oscillator (CCO).
The multiplier can be an integer value from 1 to 32. The CCO operates in the range of
156 MHz to 320 MHz, so there is an additional divider in the loop to keep the CCO within
its frequency range while the PLL is providing the desired output frequency. The output
divider may be set to divide by 2, 4, 8, or 16 to produce the output clock. Since the
minimum output divider value is 2, it is insured that the PLL output has a 50 % duty cycle.
The PLL is turned off and bypassed following a chip reset and may be enabled by
software. The program must configure and activate the PLL, wait for the PLL to lock, and
then connect to the PLL as a clock source. The PLL settling time is 100 μs.
7.17.3 Clock output
The LPC1311/13/42/43 features a clock output function that routes the IRC oscillator, the
system oscillator, the watchdog oscillator, or the main clock to an output pin.
7.17.4 Wake-up process
The LPC1311/13/42/43 begin operation at power-up and when awakened from Deep
power-down mode by using the 12 MHz IRC oscillator as the clock source. This allows
chip operation to resume quickly. If the main oscillator or the PLL is needed by the
application, software will need to enable these features and wait for them to stabilize
before they are used as a clock source.
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7.17.5 Power control
The LPC1311/13/42/43 support a variety of power control features. There are three
special modes of processor power reduction: Sleep mode, Deep-sleep mode, and Deep
power-down mode. The CPU clock rate may also be controlled as needed by changing
clock sources, reconfiguring PLL values, and/or altering the CPU clock divider value. This
allows a trade-off of power versus processing speed based on application requirements.
In addition, a register is provided for shutting down the clocks to individual on-chip
peripherals, allowing fine tuning of power consumption by eliminating all dynamic power
use in any peripherals that are not required for the application. Selected peripherals have
their own clock divider which provides even better power control.
7.17.5.1 Sleep mode
When Sleep mode is entered, the clock to the core is stopped. Resumption from the Sleep
mode does not need any special sequence but re-enabling the clock to the ARM core.
In Sleep mode, execution of instructions is suspended until either a reset or interrupt
occurs. Peripheral functions continue operation during Sleep mode and may generate
interrupts to cause the processor to resume execution. Sleep mode eliminates dynamic
power used by the processor itself, memory systems and related controllers, and internal
buses.
7.17.5.2 Deep-sleep mode
In Deep-sleep mode, the chip is in Sleep mode, and in addition analog blocks can be shut
down for increased power savings. The user can configure the Deep-sleep mode to a
large extent, selecting any of the oscillators, any of the PLLs, the USB PHY (LPC134x
only), BOD, the ADC, and the flash to be shut down or remain powered during Deep-sleep
mode. The user can also select which of the oscillators and analog blocks will be powered
up after the chip exits from Deep-sleep mode.
The GPIO pins (up to 40 pins total) serve as external wake-up pins to a dedicated start
logic to wake up the chip from Deep-sleep mode.
The timing of the wake-up process from Deep-sleep mode depends on which blocks are
selected to be powered down during deep-sleep.
For lowest power consumption, the clock source should be switched to IRC before
entering Deep-sleep mode, all oscillators and PLLs should be turned off during
deep-sleep, and the IRC should be selected as clock source when the chip wakes up from
deep-sleep. The IRC can be switched on and off glitch-free and provides a clean clock
signal after start-up.
If power consumption is not a concern, any of the oscillators and/or PLLs can be left
running in Deep-sleep mode to obtain short wake-up times when waking up from
deep-sleep.
7.17.5.3 Deep power-down mode
In Deep power-down mode, power is shut off to the entire chip with the exception of the
WAKEUP pin. The LPC1311/13/42/43 can wake up from Deep power-down mode via the
WAKEUP pin.
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7.18 System control
7.18.1 Reset
Reset has four sources on the LPC1311/13/42/43: the RESET pin, the Watchdog reset,
power-on reset (POR), and the Brown-Out Detection (BOD) circuit. The RESET pin is a
Schmitt trigger input pin. Assertion of chip reset by any source, once the operating voltage
attains a usable level, starts the IRC and initializes the flash controller.
When the internal reset is removed, the processor begins executing at address 0, which is
initially the reset vector mapped from the boot block. At that point, all of the processor and
peripheral registers have been initialized to predetermined values.
7.18.2 Brownout detection
The LPC1311/13/42/43 includes four levels for monitoring the voltage on the VDD pin. If
this voltage falls below one of the four selected levels, the BOD asserts an interrupt signal
to the NVIC. This signal can be enabled for interrupt in the Interrupt Enable Register in the
NVIC in order to cause a CPU interrupt; if not, software can monitor the signal by reading
a dedicated status register. An additional threshold level can be selected to cause a
forced reset of the chip.
7.18.3 Code security (Code Read Protection - CRP)
This feature of the LPC1311/13/42/43 allows user to enable different levels of security in
the system so that access to the on-chip flash and use of the Serial Wire Debugger (SWD)
and In-System Programming (ISP) can be restricted. When needed, CRP is invoked by
programming a specific pattern into a dedicated flash location. In-Application
Programming (IAP) commands are not affected by the CRP.
In addition, ISP entry via the PIO0_1 pin can be disabled without enabling CRP (NO_ISP
mode). For details see the LPC13xx user manual.
There are three levels of Code Read Protection:
1. CRP1 disables access to chip via the SWD and allows partial flash update (excluding
flash sector 0) using a limited set of the ISP commands. This mode is useful when
CRP is required and flash field updates are needed but all sectors can not be erased.
2. CRP2 disables access to chip via the SWD and only allows full flash erase and
update using a reduced set of the ISP commands.
3. Running an application with level CRP3 selected fully disables any access to chip via
the SWD pins and the ISP. This mode effectively disables ISP override using PIO0_1
pin, too. It is up to the user’s application to provide (if needed) flash update
mechanism using IAP calls or call reinvoke ISP command to enable flash update via
UART0.
CAUTION
If level three Code Read Protection (CRP3) is selected, no future factory testing can be
performed on the device.
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7.18.4 Boot loader
The boot loader controls initial operation after reset and also provides the means to
program the flash memory. This could be initial programming of a blank device, erasure
and re-programming of a previously programmed device, or programming of the flash
memory by the application program in a running system.
The boot loader code is executed every time the part is reset or powered up. The loader
can either execute the ISP command handler or the user application code, or, on the
LPC134x, it can program the flash image via an attached MSC device through USB
(Windows operating system only). A LOW level during reset applied to the PIO0_1 pin is
considered as an external hardware request to start the ISP command handler or the USB
device enumeration. The state of PIO0_3 determines whether the UART or USB interface
will be used (LPC134x only).
7.18.5 APB interface
The APB peripherals are located on one APB bus.
7.18.6 AHB-Lite
The AHB-Lite connects the instruction (I-code) and data (D-code) CPU buses of the ARM
Cortex-M3 to the flash memory, the main static RAM, and the boot ROM.
7.18.7 External interrupt inputs
All GPIO pins can be level or edge sensitive interrupt inputs.
7.18.8 Memory mapping control
The Cortex-M3 incorporates a mechanism that allows remapping the interrupt vector table
to alternate locations in the memory map. This is controlled via the Vector Table Offset
Register contained in the NVIC.
The vector table may be located anywhere within the bottom 1 GB of Cortex-M3 address
space. The vector table must be located on a 128 word (512 byte) boundary because the
NVIC on the LPC1311/13/42/43 is configured for 128 total interrupts.
7.19 Emulation and debugging
Debug functions are integrated into the ARM Cortex-M3. Serial wire debug is supported.
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8. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
Min
Max
Unit
VDD
supply voltage (core and
external rail)
2.0
3.6
V
[2]
VI
input voltage
5 V tolerant I/O pins; only valid
when the VDD supply voltage is
present
−0.5
+5.5
V
[3]
[3]
IDD
supply current
per supply pin
-
-
-
100
100
100
mA
mA
mA
ISS
ground current
I/O latch-up current
per ground pin
Ilatch
−(0.5VDD) < VI < (1.5VDD);
Tj < 125 °C
[4]
[5]
Tstg
storage temperature
−65
+150
150
1.5
°C
°C
W
Tj(max)
Ptot(pack)
maximum junction temperature
-
-
total power dissipation (per
package)
based on package heat transfer, not
device power consumption
VESD
electrostatic discharge voltage human body model; all pins
−5000
+5000
V
[1] The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2] Including voltage on outputs in 3-state mode.
[3] The peak current is limited to 25 times the corresponding maximum current.
[4] Dependent on package type.
[5] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
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9. Static characteristics
Table 7.
Static characteristics
Tamb = −40 °C to +85 °C, unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ[1]
Max
Unit
VDD
supply voltage (core
and external rail)
2.0
3.3
3.6
V
IDD
supply current
Active mode; VDD = 3.3 V;
Tamb = 25 °C; code
while(1){}
executed from flash;
system clock = 12 MHz
[2][3][4]
[5][6]
-
-
-
4
-
-
-
mA
mA
mA
[3][4][5]
[7][6]
system clock = 72 MHz
17
2
[2][3][4]
[5][6]
Sleep mode;
VDD = 3.3 V; Tamb = 25 °C;
system clock = 12 MHz
[3][8][6]
[9]
Deep-sleep mode; VDD = 3.3 V;
Tamb = 25 °C
-
-
30
-
-
μA
Deep power-down mode;
220
nA
VDD = 3.3 V; Tamb = 25 °C
Standard port pins and RESET pin; see Figure 16, Figure 17, Figure 18, Figure 19
IIL
LOW-level input current VI = 0 V; on-chip pull-up resistor
disabled
-
0.5
0.5
0.5
-
10
10
10
5.0
nA
nA
nA
V
IIH
IOZ
VI
HIGH-level input
current
VI = VDD; on-chip pull-down resistor
disabled
-
OFF-state output
current
VO = 0 V; VO = VDD; on-chip
pull-up/down resistors disabled
-
[10][11]
[12]
input voltage
pin configured to provide a digital
function
0
VO
output voltage
output active
0
-
-
VDD
-
V
V
VIH
HIGH-level input
voltage
0.7VDD
VIL
LOW-level input voltage
hysteresis voltage
-
-
-
-
0.3VDD
V
V
V
Vhys
VOH
0.4
-
-
[13]
[13]
[13]
[13]
[14]
[14]
HIGH-level output
voltage
IOH = −4 mA
IOL = 4 mA
VDD − 0.4
VOL
IOH
LOW-level output
voltage
-
-
-
-
-
-
0.4
-
V
HIGH-level output
current
VOH = VDD − 0.4 V
VOL = 0.4 V
−4
4
-
mA
mA
mA
mA
IOL
LOW-level output
current
-
IOHS
IOLS
HIGH-level short-circuit VOH = 0 V
output current
−45
50
LOW-level short-circuit VOL = VDD
output current
-
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Table 7.
Static characteristics …continued
Tamb = −40 °C to +85 °C, unless otherwise specified.
Symbol Parameter
Conditions
VI = 5 V
Min
10
Typ[1]
50
Max
150
−85
0
Unit
μA
Ipd
Ipu
pull-down current
pull-up current
VI = 0 V
−15
0
−50
0
μA
VDD < VI < 5 V
μA
High-drive output pin (PIO0_7); see Figure 14 and Figure 16
IIL
LOW-level input current VI = 0 V; on-chip pull-up resistor
disabled
-
0.5
0.5
0.5
-
10
10
10
5.0
nA
nA
nA
V
IIH
IOZ
VI
HIGH-level input
current
VI = VDD; on-chip pull-down resistor
disabled
-
OFF-state output
current
VO = 0 V; VO = VDD; on-chip
pull-up/down resistors disabled
-
[10][11]
[12]
input voltage
pin configured to provide a digital
function
0
VO
output voltage
output active
0
-
-
VDD
-
V
V
VIH
HIGH-level input
voltage
0.7VDD
VIL
LOW-level input voltage
hysteresis voltage
-
-
-
-
0.3VDD
V
V
V
Vhys
VOH
0.4
-
-
[13]
[13]
[13]
[13]
HIGH-level output
voltage
IOH = −20 mA
VDD − 0.4
VOL
IOH
IOL
LOW-level output
voltage
IOL = 4 mA
-
-
-
-
0.4
V
HIGH-level output
current
VOH = VDD − 0.4 V;
VDD ≥ 2.5 V
20
4
-
-
mA
mA
LOW-level output
current
VOL = 0.4 V
Ipd
Ipu
pull-down current
pull-up current
VI = 5 V
10
−15
0
50
−50
0
150
−85
0
μA
μA
μA
VI = 0 V
VDD < VI < 5 V
I2C-bus pins (PIO0_4 and PIO0_5); see Figure 15
VIH
HIGH-level input
voltage
0.7VDD
-
-
V
VIL
LOW-level input voltage
hysteresis voltage
-
-
-
-
0.3VDD
V
V
V
Vhys
VOL
0.5VDD
-
-
[13]
[15]
LOW-level output
voltage
IOLS = 20 mA
0.4
ILI
input leakage current
VI = VDD
VI = 5 V
-
-
2
4
μA
μA
10
22
Oscillator pins
Vi(xtal) crystal input voltage
Vo(xtal) crystal output voltage
USB pins (LPC1342/43 only)
−0.5
−0.5
1.8
1.8
1.95
1.95
V
V
IOZ
OFF-state output
current
0 V < VI < 3.3 V
-
-
±10
μA
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Table 7.
Static characteristics …continued
Tamb = −40 °C to +85 °C, unless otherwise specified.
Symbol Parameter
Conditions
Min
-
Typ[1]
Max
5.25
-
Unit
V
VBUS
VDI
bus supply voltage
-
-
differential input
|(D+) − (D−)|
0.2
V
sensitivity voltage
VCM
differential common
mode voltage range
includes VDI range
0.8
0.8
-
-
2.5
2.0
V
V
Vth(rs)se single-ended receiver
switching threshold
voltage
VOL
LOW-level output
voltage
for low-/full-speed;
RL of 1.5 kΩ to 3.6 V
-
-
-
0.18
3.5
V
V
VOH
HIGH-level output
voltage
driven; for low-/full-speed;
RL of 15 kΩ to GND
2.8
Ctrans
ZDRV
transceiver capacitance pin to GND
-
-
-
20
pF
[16]
driver output
with 33 Ω series resistor; steady state
drive
36
44.1
Ω
impedance for driver
which is not high-speed
capable
[1] Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
[2] IRC enabled; system oscillator disabled; system PLL disabled.
[3] IDD measurements were performed with all pins configured as GPIO outputs driven LOW and pull-up resistors disabled.
[4] BOD disabled.
[5] All peripherals disabled in the AHBCLKCTRL register. Peripheral clocks to UART, SSP, trace clock, and SysTick timer disabled in the
syscon block.
[6] For LPC134x: USB_DP and USB_DM pulled LOW externally.
[7] IRC disabled; system oscillator enabled; system PLL enabled.
[8] All oscillators and analog blocks turned off in the PDSLEEPCFG register; PDSLEEPCFG = 0xFFFF FFFF
[9] WAKEUP pin pulled HIGH externally.
[10] Including voltage on outputs in 3-state mode.
[11] VDD supply voltage must be present.
[12] 3-state outputs go into 3-state mode in Deep power-down mode.
[13] Accounts for 100 mV voltage drop in all supply lines.
[14] Allowed as long as the current limit does not exceed the maximum current allowed by the device.
[15] To VSS
.
[16] Includes external resistors of 33 Ω ± 1 % on USB_DP and USB_DM.
Table 8.
ADC static characteristics
Tamb = −40 °C to +85 °C unless otherwise specified; ADC frequency 4.5 MHz, VDD = 2.5 V to 3.6 V.
Symbol
VIA
Parameter
Conditions
Min
Typ
Max
VDD
1
Unit
V
analog input voltage
analog input capacitance
differential linearity error
integral non-linearity
offset error
0
-
-
-
-
-
-
-
Cia
pF
[1][2]
[3]
ED
-
±1
LSB
LSB
LSB
%
EL(adj)
EO
-
±1.5
±3.5
0.6
[4]
-
[5]
EG
gain error
-
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32-bit ARM Cortex-M3 microcontroller
Table 8.
ADC static characteristics …continued
Tamb = −40 °C to +85 °C unless otherwise specified; ADC frequency 4.5 MHz, VDD = 2.5 V to 3.6 V.
Symbol
ET
Parameter
Conditions
Min
Typ
Max
±4
Unit
LSB
kΩ
[6]
absolute error
-
-
-
-
Rvsi
voltage source interface
resistance
40
[7][8]
Ri
input resistance
-
-
2.5
MΩ
[1] The ADC is monotonic, there are no missing codes.
[2] The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 8.
[3] The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after
appropriate adjustment of gain and offset errors. See Figure 8.
[4] The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the
ideal curve. See Figure 8.
[5] The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset
error, and the straight line which fits the ideal transfer curve. See Figure 8.
[6] The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated
ADC and the ideal transfer curve. See Figure 8.
[7] Tamb = 25 °C; maximum sampling frequency fs = 4.5 MHz and analog input capacitance Cia = 1 pF.
[8] Input resistance Ri depends on the sampling frequency fs: Ri = 1 / (fs × Cia).
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offset
error
gain
error
E
E
O
G
1023
1022
1021
1020
1019
1018
(2)
7
code
out
(1)
6
5
4
3
2
1
0
(5)
(4)
(3)
1 LSB
(ideal)
1018 1019 1020 1021 1022 1023 1024
1
2
3
4
5
6
7
V
(LSB
)
ideal
IA
offset error
E
O
V
− V
DD SS
1024
1 LSB =
002aaf426
(1) Example of an actual transfer curve.
(2) The ideal transfer curve.
(3) Differential linearity error (ED).
(4) Integral non-linearity (EL(adj)).
(5) Center of a step of the actual transfer curve.
Fig 8. ADC characteristics
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9.1 BOD static characteristics
Table 9.
BOD static characteristics[1]
Tamb = 25 °C.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Vth
threshold voltage interrupt level 0
assertion
-
-
1.69
1.84
-
-
V
V
de-assertion
interrupt level 1
assertion
-
-
2.29
2.44
-
-
V
V
de-assertion
interrupt level 2
assertion
-
-
2.59
2.74
-
-
V
V
de-assertion
interrupt level 3
assertion
-
-
2.87
2.98
-
-
V
V
de-assertion
reset level 0
assertion
-
-
1.49
1.64
-
-
V
V
de-assertion
[1] Interrupt levels are selected by writing the level value to the BOD control register BODCTRL, see LPC13xx
user manual.
9.2 Power consumption
Power measurements in Active, Sleep, and Deep-sleep modes were performed under the
following conditions (see LPC13xx user manual):
• Configure all pins as GPIO with pull-up resistor disabled in the IOCONFIG block.
• Configure GPIO pins as outputs using the GPIOnDIR registers.
• Write 0 to all GPIOnDATA registers to drive the outputs LOW.
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002aae993
18
I
72 MHz
DD
(mA)
15
12
9
48 MHz
36 MHz
24 MHz
12 MHz
6
3
2.0
2.4
2.8
3.2
3.6
V
DD
(V)
Conditions: Tamb = 25 °C; active mode entered executing code while(1){} from flash;
internal pull-up resistors disabled; system oscillator and system PLL enabled; IRC, BOD disabled;
all peripherals disabled in the AHBCLKCTRL register (AHBCLKCTRL = 0x1F); all peripheral clocks
disabled; USB_DP and USB_DM pulled LOW externally (LPC134x).
Fig 9. Typical supply current versus regulator supply voltage VDD in active mode
002aae994
18
I
DD
72 MHz
(mA)
15
48 MHz
36 MHz
24 MHz
12
9
6
12 MHz
3
−40
−15
10
35
60
85
temperature (°C)
Conditions: VDD = 3.3 V; Active mode entered executing code while(1){} from flash; internal
pull-up resistors disabled; system oscillator and system PLL enabled; IRC, BOD disabled; all
peripherals disabled in the AHBCLKCTRL register (AHBCLKCTRL = 0x1F); all peripheral clocks
disabled; USB_DP and USB_DM pulled LOW externally (LPC134x).
Fig 10. Typical supply current versus temperature in Active mode
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002aae995
10
72 MHz
I
DD
(mA)
8
6
4
2
0
48 MHz
36 MHz
24 MHz
12 MHz
−40
−15
10
35
60
85
temperature (°C)
Conditions: VDD = 3.3 V; Sleep mode entered from flash; internal pull-up resistors disabled; system
oscillator and system PLL enabled; IRC, BOD disabled; all peripherals disabled in the
AHBCLKCTRL register (AHBCLKCTRL = 0x1F); all peripheral clocks disabled; USB_DP and
USB_DM pulled LOW externally (LPC134x).
Fig 11. Typical supply current versus temperature in Sleep mode
002aae998
80
I
DD
(μA)
60
V
DD
= 3.6 V
3.3 V
2.0 V
40
20
0
−40
−15
10
35
60
85
temperature (°C)
Conditions: BOD disabled; all oscillators and analog blocks turned off in the PDSLEEPCFG
register; PDSLEEPCFG = 0xFFFF FFFF; USB_DP and USB_DM pulled LOW externally
(LPC134x).
Fig 12. Typical supply current versus temperature in Deep-sleep mode (analog blocks
disabled)
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002aae996
1.2
I
DD
(μA)
0.6
VDD = 3.6 V
3.3 V
2.0 V
0.4
0
−40
−15
10
35
60
85
temperature (°C)
Fig 13. Typical supply current versus temperature in Deep power-down mode
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Table 10. Power consumption in Deep-sleep mode for individual analog blocks
Tamb = 25 °C; VDD = 3.3 V.
[1]
Analog block enabled in PDSLEEPCFG register
Conditions
Typical IDD
39 μA
[2]
USB PLL
System PLL
System oscillator
BOD
[2]
[2]
[2]
[2]
[2]
39 μA
197 μA
74 μA
IRC
36 μA
IRC output
27 μA
[1] Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply
voltages.
[2] All other blocks disabled in the PDSLEEPCFG register.
9.3 Electrical pin characteristics
002aae990
3.6
V
(V)
OH
T = 85 °C
25 °C
−40 °C
3.2
2.8
2.4
2
0
10
20
30
40
50
60
I
(mA)
OH
Conditions: VDD = 3.3 V; on pin PIO0_7.
Fig 14. High-drive output: Typical HIGH-level output voltage VOH versus HIGH-level
output current IOH
.
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002aaf019
60
I
T = 85 °C
25 °C
−40 °C
OL
(mA)
40
20
0
0
0.2
0.4
0.6
V
OL
(V)
Conditions: VDD = 3.3 V; on pins PIO0_4 and PIO0_5.
Fig 15. I2C-bus pins (high current sink): Typical LOW-level output current IOL versus
LOW-level output voltage VOL
002aae991
15
I
OL
T = 85 °C
25 °C
−40 °C
(mA)
10
5
0
0
0.2
0.4
0.6
V
OL
(V)
Conditions: VDD = 3.3 V; standard port pins and PIO0_7.
Fig 16. Typical LOW-level output current IOL versus LOW-level output voltage VOL
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002aae992
3.6
V
OH
(V)
T = 85 °C
25 °C
−40 °C
3.2
2.8
2.4
2
0
8
16
24
I
(mA)
OH
Conditions: VDD = 3.3 V; standard port pins.
Fig 17. Typical HIGH-level output voltage VOH versus HIGH-level output source current
IOH
002aae988
10
I
pu
(μA)
−10
−30
−50
−70
T = 85 °C
25 °C
−40 °C
0
1
2
3
4
5
V (V)
I
Conditions: VDD = 3.3 V; standard port pins.
Fig 18. Typical pull-up current Ipu versus input voltage Vi
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002aae989
80
T = 85 °C
25 °C
−40 °C
I
pd
(μA)
60
40
20
0
0
1
2
3
4
5
V (V)
I
Conditions: VDD = 3.3 V; standard port pins.
Fig 19. Typical pull-down current Ipd versus input voltage Vi
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10. Dynamic characteristics
10.1 Flash memory
Table 11. Flash characteristics
Tamb = −40 °C to +85 °C, unless otherwise specified.
Symbol
Nendu
tret
Parameter
endurance
Conditions
Min
10000
10
Typ
Max
Unit
[1]
-
-
cycles
years
years
ms
retention time
powered
-
-
unpowered
20
-
-
ter
erase time
sector or multiple
95
100
105
consecutive sectors
[2]
tprog
programming time
0.95
1
1.05
ms
[1] Number of program/erase cycles.
[2] Programming times are given for writing 256 bytes from RAM to the flash. Data must be written to the flash in blocks of 256 bytes.
10.2 External clock
Table 12. Dynamic characteristic: external clock
Tamb = −40 °C to +85 °C; VDD over specified ranges.[1]
Symbol
fosc
Parameter
Conditions
Min
Typ[2]
Max
Unit
MHz
ns
oscillator frequency
clock cycle time
clock HIGH time
clock LOW time
clock rise time
clock fall time
1
-
-
-
-
-
-
25
Tcy(clk)
tCHCX
tCLCX
tCLCH
tCHCL
40
1000
Tcy(clk) × 0.4
-
ns
Tcy(clk) × 0.4
-
ns
-
-
5
5
ns
ns
[1] Parameters are valid over operating temperature range unless otherwise specified.
[2] Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
t
CHCX
t
t
t
CHCL
CLCX
CLCH
T
cy(clk)
002aaa907
Fig 20. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)
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10.3 Internal oscillators
Table 13. Dynamic characteristics: IRC
Tamb = −40 °C to +85 °C; 2.7 V ≤ VDD ≤ 3.6 V[1]
.
Symbol
Parameter
internal RC oscillator frequency
Conditions
Min
Typ[2]
Max
Unit
fosc(RC)
-
11.88
12
12.12
MHz
[1] Parameters are valid over operating temperature range unless otherwise specified.
[2] Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
002aae987
12.15
V
DD
= 3.6 V
3.3 V
3.0 V
2.7 V
2.4 V
2.0 V
f
(MHz)
12.05
11.95
11.85
−40
−15
10
35
60
85
temperature (°C)
Conditions: Frequency values are typical values. 12 MHz ± 1 % accuracy is guaranteed for
2.7 V ≤ VDD ≤ 3.6 V and Tamb = −40 °C to +85 °C. Variations between parts may cause the IRC to
fall outside the 12 MHz ± 1 % accuracy specification for voltages below 2.7 V.
Fig 21. Internal RC oscillator frequency f versus temperature
Table 14. Dynamic characteristics: Watchdog oscillator
Symbol Parameter
fosc internal oscillator frequency
Conditions
Min Typ[1]
Max Unit
[2][3]
[2][3]
DIVSEL = 0x1F, FREQSEL = 0x1 in the
WDTOSCCTRL register;
-
7.8
-
kHz
DIVSEL = 0x00, FREQSEL = 0xF in the
WDTOSCCTRL register
-
1700
-
kHz
[1] Typical ratings are not guaranteed. The values listed are at nominal supply voltages.
[2] The typical frequency spread over processing and temperature (Tamb = −40 °C to +85 °C) is ±40 %.
[3] See the LPC13xx user manual.
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10.4 I/O pins
Table 15. Dynamic characteristics: I/O pins[1]
Tamb = −40 °C to +85 °C; 2.0 V ≤ VDD ≤ 3.6 V.
Symbol
Parameter
rise time
fall time
Conditions
Min
3.0
2.5
Typ
Max
5.0
Unit
ns
tr
tf
pin configured as output
pin configured as output
-
-
5.0
ns
[1] Applies to standard port pins and RESET pin.
10.5 I2C-bus
Table 16. Dynamic characteristic: I2C-bus pins[1]
Tamb = −40 °C to +85 °C.[2]
Symbol
Parameter
Conditions
Min
Max
100
400
1
Unit
fSCL
SCL clock
frequency
Standard-mode
Fast-mode
0
0
0
-
kHz
kHz
MHz
ns
Fast-mode Plus
[4][5][6][7]
tf
fall time
of both SDA and SCL
signals
300
Standard-mode
Fast-mode
20 + 0.1 × Cb
300
ns
ns
μs
μs
μs
μs
μs
μs
μs
μs
μs
ns
ns
ns
Fast-mode Plus
Standard-mode
Fast-mode
-
120
tLOW
LOW period of the
SCL clock
4.7
1.3
0.5
4.0
0.6
0.26
0
-
-
-
-
-
-
-
-
-
-
-
-
Fast-mode Plus
Standard-mode
Fast-mode
tHIGH
HIGH period of the
SCL clock
Fast-mode Plus
Standard-mode
Fast-mode
[3][4][8]
[9][10]
tHD;DAT
data hold time
0
Fast-mode Plus
Standard-mode
Fast-mode
0
tSU;DAT
data set-up time
250
100
50
Fast-mode Plus
[1] See the I2C-bus specification UM10204 for details.
[2] Parameters are valid over operating temperature range unless otherwise specified.
[3] tHD;DAT is the data hold time that is measured from the falling edge of SCL; applies to data in transmission and the acknowledge.
[4] A device must internally provide a hold time of at least 300 ns for the SDA signal (with respect to the VIH(min) of the SCL signal) to
bridge the undefined region of the falling edge of SCL.
[5] Cb = total capacitance of one bus line in pF.
[6] The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage tf is specified at
250 ns. This allows series protection resistors to be connected in between the SDA and the SCL pins and the SDA/SCL bus lines
without exceeding the maximum specified tf.
[7] In Fast-mode Plus, fall time is specified the same for both output stage and bus timing. If series resistors are used, designers should
allow for this when considering bus timing.
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[8] The maximum tHD;DAT could be 3.45 μs and 0.9 μs for Standard-mode and Fast-mode but must be less than the maximum of tVD;DAT or
VD;ACK by a transition time (see UM10204). This maximum must only be met if the device does not stretch the LOW period (tLOW) of the
t
SCL signal. If the clock stretches the SCL, the data must be valid by the set-up time before it releases the clock.
[9] tSU;DAT is the data set-up time that is measured with respect to the rising edge of SCL; applies to data in transmission and the
acknowledge.
[10] A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system but the requirement tSU;DAT = 250 ns must then be met.
This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the
LOW period of the SCL signal, it must output the next data bit to the SDA line tr(max) + tSU;DAT = 1000 + 250 = 1250 ns (according to the
Standard-mode I2C-bus specification) before the SCL line is released. Also the acknowledge timing must meet this set-up time.
t
t
SU;DAT
f
70 %
30 %
70 %
30 %
SDA
SCL
t
t
HD;DAT
VD;DAT
t
f
t
HIGH
70 %
30 %
70 %
30 %
70 %
30 %
70 %
30 %
t
LOW
1 / f
S
SCL
002aaf425
Fig 22. I2C-bus pins clock timing
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10.6 SSP interface
Table 17. Dynamic characteristics: SSP pins in SPI mode
Symbol
Tcy(PCLK)
Tcy(clk)
Parameter
Conditions
Min
13.9
27.8
Max
Unit
ns
PCLK cycle time
clock cycle time
-
-
[1]
[2]
ns
SSP master
tDS
data set-up time
in SPI mode;
15
-
ns
2.4 V ≤ VDD ≤ 3.6 V
2.0 V ≤ VDD < 2.4 V
in SPI mode
[2]
[2]
[2]
[2]
20
0
-
ns
ns
ns
ns
tDH
data hold time
-
tv(Q)
data output valid time
data output hold time
in SPI mode
-
10
-
th(Q)
in SPI mode
0
SSP slave
tDS
[3][4]
[3][4]
[3][4]
[3][4]
data set-up time
in SPI mode
in SPI mode
in SPI mode
in SPI mode
0
-
ns
ns
ns
ns
tDH
data hold time
3 × Tcy(PCLK) + 4
-
tv(Q)
data output valid time
data output hold time
-
-
3 × Tcy(PCLK) + 11
2 × Tcy(PCLK) + 5
th(Q)
[1] Tcy(clk) = (SSPCLKDIV × (1 + SCR) × CPSDVSR) / fmain. The clock cycle time derived from the SPI bit rate Tcy(clk) is a function of the
main clock frequency fmain, the SSP peripheral clock divider (SSPCLKDIV), the SSP SCR parameter (specified in the SSP0CR0
register), and the SSP CPSDVSR parameter (specified in the SSP clock prescale register).
[2]
Tamb = −40 °C to 85 °C.
[3] Tcy(clk) = 12 × Tcy(PCLK)
.
[4] Tamb = 25 °C; VDD = 3.3 V.
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T
t
t
clk(L)
cy(clk)
clk(H)
SCK (CPOL = 0)
SCK (CPOL = 1)
MOSI
t
t
h(Q)
v(Q)
DATA VALID
DATA VALID
CPHA = 1
t
t
DH
DS
DATA VALID
DATA VALID
MISO
t
t
h(Q)
v(Q)
DATA VALID
DATA VALID
t
MOSI
MISO
t
CPHA = 0
DS
DH
DATA VALID
DATA VALID
002aae829
Fig 23. SSP master timing in SPI mode
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T
t
t
clk(L)
cy(clk)
clk(H)
SCK (CPOL = 0)
SCK (CPOL = 1)
t
t
DH
DS
MOSI
MISO
DATA VALID
DATA VALID
t
t
h(Q)
v(Q)
CPHA = 1
DATA VALID
DATA VALID
t
t
DH
DS
MOSI
MISO
DATA VALID
DATA VALID
DATA VALID
t
t
h(Q)
CPHA = 0
v(Q)
DATA VALID
002aae830
Fig 24. SSP slave timing in SPI mode
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10.7 USB interface (LPC1342/43 only)
Table 18. Dynamic characteristics: USB pins (full-speed)
CL = 50 pF; Rpu = 1.5 kΩ on D+ to VDD, unless otherwise specified.
Symbol
Parameter
rise time
fall time
Conditions
10 % to 90 %
10 % to 90 %
tr / tf
Min
8.5
7.7
-
Typ
Max
13.8
13.7
109
Unit
ns
tr
-
-
-
tf
ns
tFRFM
differential rise and fall time
matching
%
VCRS
output signal crossover voltage
source SE0 interval of EOP
1.3
160
−2
-
-
-
2.0
175
+5
V
tFEOPT
tFDEOP
see Figure 25
ns
ns
source jitter for differential transition see Figure 25
to SE0 transition
tJR1
receiver jitter to next transition
−18.5
−9
-
-
-
+18.5
ns
ns
ns
tJR2
receiver jitter for paired transitions
EOP width at receiver
10 % to 90 %
+9
-
[1]
[1]
tEOPR1
must reject as
EOP; see
Figure 25
40
tEOPR2
EOP width at receiver
must accept as
EOP; see
82
-
-
ns
Figure 25
[1] Characterized but not implemented as production test. Guaranteed by design.
T
PERIOD
crossover point
extended
crossover point
differential
data lines
source EOP width: t
FEOPT
differential data to
SE0/EOP skew
n × T
+ t
FDEOP
PERIOD
receiver EOP width: t
, t
EOPR1 EOPR2
002aab561
Fig 25. Differential data-to-EOP transition skew and EOP width
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11. Application information
11.1 Suggested USB interface solutions (LPC1342/43 only)
V
DD
USB_CONNECT
LPC134x
soft-connect switch
R1
1.5 kΩ
USB_VBUS
R
= 33 Ω
= 33 Ω
S
S
USB-B
connector
USB_DP
USB_DM
R
V
SS
002aae608
Fig 26. LPC1342/43 USB interface on a self-powered device
V
DD
LPC134x
R1
1.5 kΩ
USB_VBUS
USB-B
connector
R
= 33 Ω
= 33 Ω
S
S
USB_DP
R
USB_DM
V
SS
002aae609
Fig 27. LPC1342/43 USB interface on a bus-powered device
11.2 XTAL input
The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a
clock in slave mode, it is recommended that the input be coupled through a capacitor with
Ci = 100 pF. To limit the input voltage to the specified range, choose an additional
capacitor to ground Cg which attenuates the input voltage by a factor Ci/(Ci + Cg). In slave
mode, a minimum of 200 mV(RMS) is needed.
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LPC1xxx
XTALIN
C
i
C
g
100 pF
002aae788
Fig 28. Slave mode operation of the on-chip oscillator
In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF
(Figure 28), with an amplitude between 200 mV(RMS) and 1000 mV(RMS). This
corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V.
The XTALOUT pin in this configuration can be left unconnected.
External components and models used in oscillation mode are shown in Figure 29 and in
Table 19 and Table 20. Since the feedback resistance is integrated on chip, only a crystal
and the capacitances CX1 and CX2 need to be connected externally in case of
fundamental mode oscillation (the fundamental frequency is represented by L, CL and
RS). Capacitance CP in Figure 29 represents the parallel package capacitance and should
not be larger than 7 pF. Parameters FOSC, CL, RS and CP are supplied by the crystal
manufacturer.
LPC1xxx
L
XTALIN
XTALOUT
C
R
C
P
=
L
XTAL
S
C
X2
C
X1
002aaf424
Fig 29. Oscillator modes and models: oscillation mode of operation and external crystal
model used for CX1/CX2 evaluation
Table 19. Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters) low frequency mode
Fundamental oscillation Crystal load
Maximum crystal
External load
frequency FOSC
capacitance CL
series resistance RS
capacitors CX1, CX2
1 MHz - 5 MHz
10 pF
< 300 Ω
< 300 Ω
< 300 Ω
18 pF, 18 pF
39 pF, 39 pF
57 pF, 57 pF
20 pF
30 pF
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Table 19. Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters) low frequency mode
Fundamental oscillation Crystal load
Maximum crystal
External load
frequency FOSC
capacitance CL
series resistance RS
capacitors CX1, CX2
5 MHz - 10 MHz
10 pF
< 300 Ω
< 200 Ω
< 100 Ω
< 160 Ω
< 60 Ω
18 pF, 18 pF
39 pF, 39 pF
57 pF, 57 pF
18 pF, 18 pF
39 pF, 39 pF
18 pF, 18 pF
20 pF
30 pF
10 MHz - 15 MHz
15 MHz - 20 MHz
10 pF
20 pF
10 pF
< 80 Ω
Table 20. Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters) high frequency mode
Fundamental oscillation Crystal load
Maximum crystal
External load
frequency FOSC
capacitance CL
series resistance RS
capacitors CX1, CX2
15 MHz - 20 MHz
10 pF
< 180 Ω
< 100 Ω
< 160 Ω
< 80 Ω
18 pF, 18 pF
39 pF, 39 pF
18 pF, 18 pF
39 pF, 39 pF
20 pF
20 MHz - 25 MHz
10 pF
20 pF
11.3 XTAL Printed-Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of Cx1 and Cx2 should be chosen smaller
accordingly to the increase in parasitics of the PCB layout.
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11.4 Standard I/O pad configuration
Figure 30 shows the possible pin modes for standard I/O pins with analog input function:
• Digital output driver
• Digital input: Pull-up enabled/disabled
• Digital input: Pull-down enabled/disabled
• Digital input: Repeater mode enabled/disabled
• Analog input
V
DD
output enable
ESD
pin configured
as digital output
driver
output
PIN
ESD
V
DD
V
SS
weak
pull-up
pull-up enable
weak
pull-down
repeater mode
enable
pin configured
as digital input
pull-down enable
data input
select analog input
pin configured
as analog input
analog input
002aaf304
Fig 30. Standard I/O pad configuration
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32-bit ARM Cortex-M3 microcontroller
11.5 Reset pad configuration
V
DD
V
DD
V
DD
R
pu
ESD
20 ns RC
GLITCH FILTER
reset
PIN
ESD
V
SS
002aaf274
Fig 31. Reset pad configuration
11.6 ADC usage notes
The following guidelines show how to increase the performance of the ADC in a noisy
environment beyond the ADC specifications listed in Table 8:
• The ADC input trace must be short and as close as possible to the LPC1311/13/42/43
chip.
• The ADC input traces must be shielded from fast switching digital signals and noisy
power supply lines.
• Because the ADC and the digital core share the same power supply, the power supply
line must be adequately filtered.
• To improve the ADC performance in a very noisy environment, put the device in Sleep
mode during the ADC conversion.
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12. Package outline
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
SOT313-2
c
y
X
36
25
A
E
37
24
Z
E
e
H
E
A
2
A
(A )
3
A
1
w M
p
θ
pin 1 index
b
L
p
L
13
48
detail X
1
12
Z
v M
D
A
e
w M
b
p
D
B
H
v
M
B
D
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.
7o
0o
0.20 1.45
0.05 1.35
0.27 0.18 7.1
0.17 0.12 6.9
7.1
6.9
9.15 9.15
8.85 8.85
0.75
0.45
0.95 0.95
0.55 0.55
1.6
mm
0.25
0.5
1
0.2 0.12 0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
00-01-19
03-02-25
SOT313-2
136E05
MS-026
Fig 32. Package outline SOT313-2 (LQFP48)
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NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
33 terminals; body 7 x 7 x 0.85 mm
D
B
A
terminal 1
index area
E
A
A
1
c
detail X
e
1
C
v
w
C
C
A
B
e
b
y
1
y
C
9
16
L
8
17
e
E
h
e
2
33
1
24
X
terminal 1
index area
32
25
0
D
h
2.5
scale
5 mm
v
Dimensions
Unit
(1)
(1)
(1)
A
A
1
b
c
D
D
E
E
h
e
e
1
e
2
L
w
y
y
1
h
max 1.00 0.05 0.35
mm nom 0.85 0.02 0.28 0.2 7.0 4.70 7.0 4.70 0.65 4.55 4.55 0.60 0.1 0.05 0.08 0.1
min 0.80 0.00 0.23 6.9 4.55 6.9 4.55 0.45
7.1 4.85 7.1 4.85
0.75
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
hvqfn33_po
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
- - -
09-03-17
09-03-23
Fig 33. Package outline (HVQFN33)
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13. Abbreviations
Table 21. Abbreviations
Acronym
A/D
Description
Analog-to-Digital
ADC
AHB
AMBA
APB
BOD
EOP
ETM
FIFO
GPIO
HID
Analog-to-Digital Converter
Advanced High-performance Bus
Advanced Microcontroller Bus Architecture
Advanced Peripheral Bus
BrownOut Detection
End Of Packet
Embedded Trace Macrocell
First-In, First-Out
General Purpose Input/Output
Human Interface Device
Input/Output
I/O
LSB
Least Significant Bit
MSC
PHY
PLL
Mass Storage Class
Physical Layer
Phase-Locked Loop
SE0
Single Ended Zero
SPI
Serial Peripheral Interface
Serial Synchronous Interface
Synchronous Serial Port
Start-of-Frame
SSI
SSP
SoF
TCM
TTL
Tightly-Coupled Memory
Transistor-Transistor Logic
Universal Asynchronous Receiver/Transmitter
Universal Serial Bus
UART
USB
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14. Revision history
Table 22. Revision history
Document ID
Release date
Data sheet status
Change notice Supersedes
LPC1311_13_42_43_2
Modifications:
20100506
Product data sheet
LPC1311_13_42_43_1
• Pin functions TRST, TDO, TMS, TDI replaced by R (Reserved).
• In Section 7.18.3, description of CRP modes updated: JTAG replaced by SWD.
• Description of standard I/O pads and RESET pad improved (Figure 30 and Figure 31).
• SSP dynamic characteristics: maximum value for parameter tDS removed and values
for tDH and th(Q) moved to minimum.
• Maximum data bit rates for SSP (Section 7.11.1) and UART (Section 7.10.1)
peripherals added.
• Details for external oscillator component selection added (Section 11.2).
• WDT oscillator frequency specification added (Section 7.17.1.3 and Table 14).
• VDD(3V3) and VDD(IO) supply voltages combined to VDD throughout the document. Pins
VDD(3V3) and VDD(IO) renamed to VDD in Table 3 and Table 4.
• Parameters ter and tprog added to Table 11.
• Parameters IOH, IOL, IOz changed to 0.5 nA (typ) and 10 nA (max) in Table 7.
• Parameters VIH changed to 0.7VDD and VOL changed to 0.3VDD throughout Table 7.
• Boot loader description via USB updated in Section 7.18.4.
• Feature list updated with items “Unique device serial number” and “Bootloader drivers
for MSC and HID” (Section 2).
• Section 11.6 “ADC usage notes” added.
• GPIO functional description updated (Section 7.8).
• Inputs to the system PLL changed (watchdog oscillator removed), see Figure 7.
• Description of disabling ISP entry mode clarified in Section 7.18.3.
• Description of the RESET pin functionality in Deep power-down mode added (Table
note 1 in Table 3 and Table 4.
• “Industrial networking” removed from Section 3.
• Table note 12 in Table 7 updated.
• Table 15 added for parameters tr and tf.
• Parameters Rvsi and Ri added to Table 8.
• Use of open-drain pins clarified for pins PIO0_4 and PIO0_5 in Table 3 and Table 4.
• Parameters Vi(xtal) and Vo(xtal) minimum value changed to −0.5 V in Table 7.
LPC1311_13_42_43_1
20091211
Product data sheet
-
-
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15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
15.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
15.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
15.4 Trademarks
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
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17. Contents
1
General description. . . . . . . . . . . . . . . . . . . . . . 1
7.17.5.1 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 24
7.17.5.2 Deep-sleep mode. . . . . . . . . . . . . . . . . . . . . . 24
7.17.5.3 Deep power-down mode . . . . . . . . . . . . . . . . 24
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 3
Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
7.18
System control . . . . . . . . . . . . . . . . . . . . . . . . 25
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Brownout detection . . . . . . . . . . . . . . . . . . . . 25
Code security (Code Read Protection - CRP) 25
Boot loader. . . . . . . . . . . . . . . . . . . . . . . . . . . 26
APB interface. . . . . . . . . . . . . . . . . . . . . . . . . 26
AHB-Lite . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
External interrupt inputs. . . . . . . . . . . . . . . . . 26
Memory mapping control . . . . . . . . . . . . . . . . 26
Emulation and debugging . . . . . . . . . . . . . . . 26
4
4.1
5
7.18.1
7.18.2
7.18.3
7.18.4
7.18.5
7.18.6
7.18.7
7.18.8
7.19
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 8
7
7.1
7.2
7.3
7.4
7.5
7.6
7.6.1
7.6.2
7.7
7.8
7.8.1
7.9
7.9.1
7.9.1.1
7.10
7.10.1
7.11
7.11.1
7.12
7.12.1
7.13
7.13.1
7.14
Functional description . . . . . . . . . . . . . . . . . . 14
Architectural overview . . . . . . . . . . . . . . . . . . 14
ARM Cortex-M3 processor . . . . . . . . . . . . . . . 14
On-chip flash program memory . . . . . . . . . . . 15
On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 15
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 15
Nested Vectored Interrupt Controller (NVIC) . 16
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 17
IOCONFIG block . . . . . . . . . . . . . . . . . . . . . . 17
Fast general purpose parallel I/O . . . . . . . . . . 17
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
USB interface (LPC1342/43 only) . . . . . . . . . 18
Full-speed USB device controller . . . . . . . . . . 18
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
SSP serial I/O controller . . . . . . . . . . . . . . . . . 19
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
I2C-bus serial I/O controller . . . . . . . . . . . . . . 19
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
General purpose external event
8
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 27
9
Static characteristics . . . . . . . . . . . . . . . . . . . 28
BOD static characteristics . . . . . . . . . . . . . . . 33
Power consumption . . . . . . . . . . . . . . . . . . . 33
Electrical pin characteristics. . . . . . . . . . . . . . 37
9.1
9.2
9.3
10
Dynamic characteristics. . . . . . . . . . . . . . . . . 41
Flash memory . . . . . . . . . . . . . . . . . . . . . . . . 41
External clock. . . . . . . . . . . . . . . . . . . . . . . . . 41
Internal oscillators . . . . . . . . . . . . . . . . . . . . . 42
I/O pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
I2C-bus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
SSP interface. . . . . . . . . . . . . . . . . . . . . . . . . 45
USB interface (LPC1342/43 only) . . . . . . . . . 48
10.1
10.2
10.3
10.4
10.5
10.6
10.7
11
11.1
Application information . . . . . . . . . . . . . . . . . 49
Suggested USB interface solutions
(LPC1342/43 only). . . . . . . . . . . . . . . . . . . . . 49
XTAL input . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
XTAL Printed-Circuit Board (PCB) layout
11.2
11.3
guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Standard I/O pad configuration . . . . . . . . . . . 52
Reset pad configuration. . . . . . . . . . . . . . . . . 53
ADC usage notes. . . . . . . . . . . . . . . . . . . . . . 53
11.4
11.5
11.6
counter/timers. . . . . . . . . . . . . . . . . . . . . . . . . 20
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
System tick timer . . . . . . . . . . . . . . . . . . . . . . 21
Watchdog timer. . . . . . . . . . . . . . . . . . . . . . . . 21
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Clocking and power control . . . . . . . . . . . . . . 21
Integrated oscillators . . . . . . . . . . . . . . . . . . . 21
7.14.1
7.15
7.16
7.16.1
7.17
7.17.1
12
13
14
Package outline. . . . . . . . . . . . . . . . . . . . . . . . 54
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 56
Revision history . . . . . . . . . . . . . . . . . . . . . . . 57
15
Legal information . . . . . . . . . . . . . . . . . . . . . . 58
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 58
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 59
15.1
15.2
15.3
15.4
7.17.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 23
7.17.1.2 System oscillator . . . . . . . . . . . . . . . . . . . . . . 23
7.17.1.3 Watchdog oscillator . . . . . . . . . . . . . . . . . . . . 23
7.17.2
7.17.3
7.17.4
7.17.5
System PLL and USB PLL . . . . . . . . . . . . . . . 23
Clock output . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Wake-up process . . . . . . . . . . . . . . . . . . . . . . 23
Power control . . . . . . . . . . . . . . . . . . . . . . . . . 24
16
17
Contact information . . . . . . . . . . . . . . . . . . . . 59
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 6 May 2010
Document identifier: LPC1311_13_42_43_2
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