LPC1850_1112 [NXP]
32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller; 32位ARM Cortex-M3的MCU ;高达200 KB的SRAM ;以太网，两个高速USB ， LCD，外部存储器控制器
| 型号： | LPC1850_1112 |
| 厂家： | 
NXP |
| 描述： | 32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller |
| 文件： | 总157页 (文件大小：2783K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LPC1850/30/20/10
32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet,
two High-speed USB, LCD, and external memory controller
Rev. 3 — 6 December 2011
Preliminary data sheet
1. General description
The LPC1850/30/20/10 are ARM Cortex-M3 based microcontrollers for embedded
applications. The ARM Cortex-M3 is a next generation core that offers system
enhancements such as low power consumption, enhanced debug features, and a high
level of support block integration.
The LPC1850/30/20/10 operate at CPU frequencies of up to 180 MHz. The ARM
Cortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture with
separate local instruction and data buses as well as a third bus for peripherals. The ARM
Cortex-M3 CPU also includes an internal prefetch unit that supports speculative
branching.
The LPC1850/30/20/10 include up to 200 kB of on-chip SRAM, a quad SPI Flash
Interface (SPIFI), a State Configurable Timer (SCT) subsystem, two High-speed USB
controllers, Ethernet, LCD, an external memory controller, and multiple digital and analog
peripherals.
Remark: This data sheet describes the Rev ‘-’ and the Rev ‘A’ versions of parts
LPC1850/30/20/10.
2. Features and benefits
Processor core
ARM Cortex-M3 processor, running at frequencies of up to 180 MHz.
ARM Cortex-M3 built-in Memory Protection Unit (MPU) supporting eight regions.
ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).
Non-maskable Interrupt (NMI) input.
JTAG and Serial Wire Debug, serial trace, eight breakpoints, and four watch points.
Enhanced Trace Module (ETM) and Enhanced Trace Buffer (ETB) support.
System tick timer.
On-chip memory
200 kB SRAM for code and data use.
Multiple SRAM blocks with separate bus access.
64 kB ROM containing boot code and on-chip software drivers.
128 bit One-Time Programmable (OTP) memory for general-purpose use.
Clock generation unit
Crystal oscillator with an operating range of 1 MHz to 25 MHz.
12 MHz internal RC oscillator trimmed to 1 % accuracy over temperature and
voltage.
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Ultra-low power RTC crystal oscillator.
Three PLLs allow CPU operation up to the maximum CPU rate without the need for
a high-frequency crystal. The second PLL is dedicated to the High-speed USB, the
third PLL can be used as audio PLL.
Clock output.
Configurable digital peripherals:
State Configurable Timer (SCT) subsystem on AHB.
Global Input Multiplexer Array (GIMA) allows to cross-connect multiple inputs and
outputs to event driven peripherals like timers, SCT, and ADC0/1.
Serial interfaces:
Quad SPI Flash Interface (SPIFI) with 1-, 2-, or 4-bit data at rates of up to 40 MB
per second.
10/100T Ethernet MAC with RMII and MII interfaces and DMA support for high
throughput at low CPU load. Support for IEEE 1588 time stamping/advanced time
stamping (IEEE 1588-2008 v2).
One High-speed USB 2.0 Host/Device/OTG interface with DMA support and
on-chip PHY.
One High-speed USB 2.0 Host/Device interface with DMA support, on-chip
full-speed PHY and ULPI interface to external high-speed PHY. USB interface
electrical test software included in ROM USB stack.
Four 550 UARTs with DMA support: one UART with full modem interface; one
UART with IrDA interface; three USARTs support synchronous mode and a smart
card interface conforming to ISO7816 specification.
Two C_CAN 2.0B controllers with one channel each.
Two SSP controllers with FIFO and multi-protocol support. Both SSPs with DMA
support.
One Fast-mode Plus I2C-bus interface with monitor mode and with open-drain I/O
pins conforming to the full I2C-bus specification. Supports data rates of up to
1 Mbit/s.
One standard I2C-bus interface with monitor mode and standard I/O pins.
Two I2S interfaces with DMA support, each with one input and one output.
Digital peripherals:
External Memory Controller (EMC) supporting external SRAM, ROM, NOR flash,
and SDRAM devices.
LCD controller with DMA support and a programmable display resolution of up to
1024 H 768 V. Supports monochrome and color STN panels and TFT color
panels; supports 1/2/4/8 bpp Color Look-Up Table (CLUT) and 16/24-bit direct pixel
mapping.
SD/MMC card interface.
Eight-channel General-Purpose DMA (GPDMA) controller can access all memories
on the AHB and all DMA-capable AHB slaves.
Up to 164 General-Purpose Input/Output (GPIO) pins with configurable
pull-up/pull-down resistors and open-drain modes.
GPIO registers are located on the AHB for fast access. GPIO ports have DMA
support.
Up to 8 GPIO pins can be selected from all GPIO pins as edge and level sensitive
interrupt sources.
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
2 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Two GPIO group interrupt modules enable an interrupt based on a programmable
pattern of input states of a group of GPIO pins.
Four general-purpose timer/counters with capture and match capabilities.
One motor control PWM for three-phase motor control.
One Quadrature Encoder Interface (QEI).
Repetitive Interrupt timer (RI timer).
Windowed watchdog timer.
Ultra-low power Real-Time Clock (RTC) on separate power domain with 256 bytes
of battery powered backup registers.
Alarm timer; can be battery powered.
Analog peripherals:
One 10-bit DAC with DMA support and a data conversion rate of 400 kSamples/s.
Two 10-bit ADCs with DMA support and a data conversion rate of 400 kSamples/s.
Security:
Hardware-based AES security engine programmable through an on-chip API.
Two 128-bit secure OTP memories for AES key storage and customer use.
Unique ID for each device.
Power:
Single 3.3 V (2.2 V to 3.6 V) power supply with on-chip internal voltage regulator for
the core supply and the RTC power domain.
RTC power domain can be powered separately by a 3 V battery supply.
Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep
power-down.
Processor wake-up from Sleep mode via wake-up interrupts from various
peripherals.
Wake-up from Deep-sleep, Power-down, and Deep power-down modes via
external interrupts and interrupts generated by battery powered blocks in the RTC
power domain.
Brownout detect with four separate thresholds for interrupt and forced reset.
Power-On Reset (POR).
Available as 208-pin, 144-pin, and 100-pin LQFP packages and as 256-pin, 180-pin,
and 100-pin BGA packages.
3. Applications
Industrial
RFID readers
e-Metering
Consumer
White goods
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
3 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Plastic low profile ball grid array package; 256 balls; body 17 17 1 mm
LPC1850FET180 TFBGA180 Thin fine-pitch ball grid array package; 180 balls
Version
LPC1850FET256 LBGA256
SOT740-2
SOT570-3
SOT459-1
SOT740-2
SOT570-3
LPC1850FBD208 LQFP208
LPC1830FET256 LBGA256
Plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
Plastic low profile ball grid array package; 256 balls; body 17 17 1 mm
LPC1830FET180 TFBGA180 Thin fine-pitch ball grid array package; 180 balls
LPC1830FET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9 9 0.7 mm SOT926-1
LPC1830FBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm SOT486-1
LPC1820FET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9 9 0.7 mm SOT926-1
LPC1820FBD144 LQFP144
LPC1820FBD100 LQFP100
Plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm
Plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm
SOT486-1
SOT407-1
LPC1810FET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9 9 0.7 mm SOT926-1
LPC1810FBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm SOT486-1
4.1 Ordering options
Table 2.
Ordering options
Type number
Total
SRAM
LCD Ethernet USB0
(Host,
USB1
(Host,
ADC
channels
PWM
QEI
GPIO Package
Device, Device)/
OTG)
ULPI
interface
LPC1850FET256 200 kB yes yes
LPC1850FET180 200 kB yes yes
LPC1850FBD208 200 kB yes yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
no
yes/yes
yes/yes
yes/yes
yes/yes
yes/yes
yes/no
yes/no
no
8
8
8
8
8
4
8
4
8
5
4
8
yes
yes
yes
yes
yes
no
yes
yes
yes
yes
yes
no
164
118
142
164
118
49
LBGA256
TFBGA180
LQFP208
LBGA256
TFBGA180
TFBGA100
LQFP144
TFBGA100
LQFP144
LQFP100
TFBGA100
LQFP144
LPC1830FET256 200 kB no
LPC1830FET180 200 kB no
LPC1830FET100 200 kB no
LPC1830FBD144 200 kB no
LPC1820FET100 168 kB no
LPC1820FBD144 168 kB no
LPC1820FBD100 168 kB no
LPC1810FET100 136 kB no
LPC1810FBD144 136 kB no
yes
yes
yes
yes
no
yes
no
no
83
no
49
no
no
yes
no
no
83
no
no
no
49
no
no
no
no
49
no
no
no
yes
no
83
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
4 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
5. Block diagram
SWD/TRACE PORT/JTAG
LPC1850/30/20/10
HIGH-SPEED PHY
TEST/DEBUG
INTERFACE
HIGH-
(1)
ETHERNET
10/100
SPEED
(1)
USB1
GPDMA
(1)
USB0
(1)
MAC
LCD
SD/
MMC
HOST/
DEVICE
ARM
CORTEX-M3
HOST/
DEVICE/
OTG
IEEE 1588
masters
slaves
AHB MULTILAYER MATRIX
SPIFI
slaves
BRIDGE 0
BRIDGE 1
BRIDGE 2
BRIDGE 3
BRIDGE
BRIDGE
EMC
64 kB ROM
2
MOTOR
RI TIMER
USART2
USART3
TIMER2
TIMER3
SSP1
I C1
CGU
CCU1
CCU2
RGU
WWDT
ALARM TIMER
64/96 kB LOCAL SRAM
40 kB LOCAL SRAM
CONTROL
(1)
USART0
10-bit DAC
C_CAN0
BACKUP REGISTERS
PWM
2
16/32 kB AHB SRAM
16 kB +
I C0
POWER MODE CONTROL
UART1
SSP0
2
I S0
10-bit ADC0
10-bit ADC1
CONFIGURATION
REGISTERS
(1)
16 kB AHB SRAM
2
I S1
TIMER0
EVENT ROUTER
OTP MEMORY
AES
HS GPIO
SCT
C_CAN1
TIMER1
SCU
(1)
QEI
RTC
RTC OSC
12 MHz IRC
RTC POWER DOMAIN
GIMA
GPIO
interrupts
GPIO GROUP0
interrupt
GPIO GROUP1
interrupt
= connected to GPDMA
002aaf218
(1) Not available on all parts (see Table 2).
Fig 1. LPC1850/30/20/10 block diagram
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
5 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
6. Pinning information
6.1 Pinning
LPC1850/30FET180
LPC1850/30FET256
ball A1
index area
ball A1
index area
2
4
6
8
10
12
14
2
4
6
8
10 12 14 16
9 11 13 15
1
3
5
7
9
11
13
1
3
5
7
A
B
C
D
E
F
G
H
J
A
B
C
D
E
F
G
H
J
K
L
K
M
N
P
R
T
L
M
N
P
002aag365
002aaf230
Transparent top view
Transparent top view
Fig 2. Pin configuration LBGA256 package
Fig 3. Pin configuration TFBGA180 package
ball A1
index area
LPC1830/20/10FET100
1
2
3
4
5
6
7
8
9 10
A
B
C
D
E
F
G
H
J
K
002aag366
Transparent top view
Fig 4. Pin configuration TFBGA100 package
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
6 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
1
156
1
108
LPC1850FBD208
LPC1830/20/10FBD144
36
73
52
105
002aag367
002aag368
Fig 5. Pin configuration LQFP208 package
Fig 6. Pin configuration LQFP144 package
1
75
LPC1820FBD100
25
51
002aag369
Fig 7. Pin configuration LQFP100 package
6.2 Pin description
On the LPC1850/30/20/10, digital pins are grouped into 16 ports, named P0 to P9 and PA
to PF, with up to 20 pins used per port. Each digital pin can support up to eight different
digital functions, including General Purpose I/O (GPIO), selectable through the SCU
registers. The pin name is not indicative of the GPIO port assigned to it.
Not all functions listed in Table 3 are available on all packages. See Table 2 for availability
of USB0, USB1, Ethernet, and LCD functions.
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
7 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
Multiplexed digital pins
[3]
P0_0
L3
x
G2 47
32
22
I; PU I/O GPIO0[0] — General purpose digital input/output pin.
I/O SSP1_MISO — Master In Slave Out for SSP1.
I
ENET_RXD1 — Ethernet receive data 1 (RMII/MII
interface).
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
I/O I2S0_TX_WS — Transmit Word Select. It is driven by
the master and received by the slave. Corresponds
to the signal WS in the I2S-bus specification.
I/O I2S1_TX_WS — Transmit Word Select. It is driven by
the master and received by the slave. Corresponds
to the signal WS in the I2S-bus specification.
[3]
P0_1
M2
x
G1 50
34
23
I; PU I/O GPIO0[1] — General purpose digital input/output pin.
I/O SSP1_MOSI — Master Out Slave in for SSP1.
I
ENET_COL — Ethernet Collision detect (MII
interface).
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
ENET_TX_EN — Ethernet transmit enable (RMII/MII
interface).
I/O I2S1_TX_SDA — I2S1 transmit data. It is driven by
the transmitter and read by the receiver. Corresponds
to the signal SD in the I2S-bus specification.
[3]
P1_0
P2
x
H1 54
38
25
I; PU I/O GPIO0[4] — General purpose digital input/output pin.
I
CTIN_3 — SCT input 3. Capture input 1 of timer 1.
I/O EMC_A5 — External memory address line 5.
-
-
R — Function reserved.
R — Function reserved.
I/O SSP0_SSEL — Slave Select for SSP0.
-
-
R — Function reserved.
R — Function reserved.
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
8 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
[3]
[3]
P1_1
R2
R3
P5
x
x
x
K2
K1
J1
58
60
61
42
43
44
28
29
30
I; PU I/O GPIO0[8] — General purpose digital input/output pin.
Boot pin (see Table 5).
O
CTOUT_7 — SCT output 7. Match output 3 of
timer 1.
I/O EMC_A6 — External memory address line 6.
-
-
R — Function reserved.
R — Function reserved.
I/O SSP0_MISO — Master In Slave Out for SSP0.
-
-
R — Function reserved.
R — Function reserved.
P1_2
I; PU I/O GPIO0[9] — General purpose digital input/output pin.
Boot pin (see Table 5).
O
CTOUT_6 — SCT output 6. Match output 2 of
timer 1.
I/O EMC_A7 — External memory address line 7.
-
-
R — Function reserved.
R — Function reserved.
I/O SSP0_MOSI — Master Out Slave in for SSP0.
-
-
R — Function reserved.
R — Function reserved.
P1_3
I; PU I/O GPIO0[10] — General purpose digital input/output
pin.
O
CTOUT_8 — SCT output 8. Match output 0 of
timer 2.
-
R — Function reserved.
O
O
EMC_OE — LOW active Output Enable signal.
USB0_IND1 — USB0 port indicator LED control
output 1.
I/O SSP1_MISO — Master In Slave Out for SSP1.
-
R — Function reserved.
O
SD_RST — SD/MMC reset signal for MMC4.4 card.
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
9 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
[3]
[3]
P1_4
T3
R5
T4
x
x
x
J2
J4
K4
64
65
67
47
48
49
32
33
34
I; PU I/O GPIO0[11] — General purpose digital input/output
pin.
O
CTOUT_9 — SCT output 9. Match output 1 of
timer 2.
-
R — Function reserved.
O
EMC_BLS0 — LOW active Byte Lane select
signal 0.
O
USB0_IND0 — USB0 port indicator LED control
output 0.
I/O SSP1_MOSI — Master Out Slave in for SSP1.
-
R — Function reserved.
O
SD_VOLT1 — SD/MMC bus voltage select output 1.
P1_5
I; PU I/O GPIO1[8] — General purpose digital input/output pin.
O
CTOUT_10 — SCT output 10. Match output 2 of
timer 2.
-
R — Function reserved.
O
O
EMC_CS0 — LOW active Chip Select 0 signal.
USB0_PWR_FAULT — Port power fault signal
indicating overcurrent condition; this signal monitors
over-current on the USB bus (external circuitry
required to detect over-current condition).
I/O SSP1_SSEL — Slave Select for SSP1.
-
R — Function reserved.
O
SD_POW — SD/MMC card power monitor output.
P1_6
I; PU I/O GPIO1[9] — General purpose digital input/output pin.
I
CTIN_5 — SCT input 5. Capture input 2 of timer 2.
R — Function reserved.
-
O
-
EMC_WE — LOW active Write Enable signal.
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
I/O SD_CMD — SD/MMC command signal.
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
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32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
P1_7
T5
x
G4 69
50
35
I; PU I/O GPIO1[0] — General purpose digital input/output pin.
I
U1_DSR — Data Set Ready input for UART1.
O
CTOUT_13 — SCT output 13. Match output 1 of
timer 3.
I/O EMC_D0 — External memory data line 0.
O
USB0_PPWR — VBUS drive signal (towards
external charge pump or power management unit);
indicates that VBUS must be driven (active HIGH).
Add a pull-down resistor to disable the power switch
at reset. This signal has opposite polarity compared
to the USB_PPWR used on other NXP LPC parts.
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
[3]
P1_8
R7
x
H5 71
51
36
I; PU I/O GPIO1[1] — General purpose digital input/output pin.
O
O
U1_DTR — Data Terminal Ready output for UART1.
CTOUT_12 — SCT output 12. Match output 0 of
timer 3.
I/O EMC_D1 — External memory data line 1.
-
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
O
SD_VOLT0 — SD/MMC bus voltage select output 0.
[3]
P1_9
T7
x
J5
73
52
37
I; PU I/O GPIO1[2] — General purpose digital input/output pin.
O
O
U1_RTS — Request to Send output for UART1.
CTOUT_11 — SCT output 11. Match output 3 of
timer 2.
I/O EMC_D2 — External memory data line 2.
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
I/O SD_DAT0 — SD/MMC data bus line 0.
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
11 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
P1_10
R8
x
H6 75
53
38
I; PU I/O GPIO1[3] — General purpose digital input/output pin.
I
U1_RI — Ring Indicator input for UART1.
O
CTOUT_14 — SCT output 14. Match output 2 of
timer 3.
I/O EMC_D3 — External memory data line 3.
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
I/O SD_DAT1 — SD/MMC data bus line 1.
[3]
P1_11
T9
x
J7
77
55
39
I; PU I/O GPIO1[4] — General purpose digital input/output pin.
I
U1_CTS — Clear to Send input for UART1.
O
CTOUT_15 — SCT output 15. Match output 3 of
timer 3.
I/O EMC_D4 — External memory data line 4.
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
I/O SD_DAT2 — SD/MMC data bus line 2.
[3]
P1_12
R9
x
K7
78
56
40
I; PU I/O GPIO1[5] — General purpose digital input/output pin.
I
U1_DCD — Data Carrier Detect input for UART1.
R — Function reserved.
-
I/O EMC_D5 — External memory data line 5.
I
T0_CAP1 — Capture input 1 of timer 0.
R — Function reserved.
-
-
R — Function reserved.
I/O SD_DAT3 — SD/MMC data bus line 3.
[3]
P1_13
R10
x
H8 83
60
41
I; PU I/O GPIO1[6] — General purpose digital input/output pin.
O
-
U1_TXD — Transmitter output for UART1.
R — Function reserved.
I/O EMC_D6 — External memory data line 6.
I
-
-
I
T0_CAP0 — Capture input 0 of timer 0.
R — Function reserved.
R — Function reserved.
SD_CD — SD/MMC card detect input.
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32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
P1_14
R11
x
J8
85
61
42
I; PU I/O GPIO1[7] — General purpose digital input/output pin.
I
U1_RXD — Receiver input for UART1.
R — Function reserved.
-
I/O EMC_D7 — External memory data line 7.
O
-
T0_MAT2 — Match output 2 of timer 0.
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
[3]
P1_15
T12
x
K8
87
62
43
I; PU I/O GPIO0[2] — General purpose digital input/output pin.
O
-
U2_TXD — Transmitter output for USART2.
R — Function reserved.
I
ENET_RXD0 — Ethernet receive data 0 (RMII/MII
interface).
O
-
T0_MAT1 — Match output 1 of timer 0.
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
[3]
P1_16
M7
x
H9 90
64
44
I; PU I/O GPIO0[3] — General purpose digital input/output pin.
I
-
I
U2_RXD — Receiver input for USART2.
R — Function reserved.
ENET_CRS — Ethernet Carrier Sense (MII
interface).
O
-
T0_MAT0 — Match output 0 of timer 0.
R — Function reserved.
-
R — Function reserved.
I
ENET_RX_DV — Ethernet Receive Data Valid
(RMII/MII interface).
[4]
P1_17
M8
x
H10 93
66
45
I; PU I/O GPIO0[12] — General purpose digital input/output
pin.
I/O U2_UCLK — Serial clock input/output for USART2 in
synchronous mode.
-
R — Function reserved.
I/O ENET_MDIO — Ethernet MIIM data input and output.
I
T0_CAP3 — Capture input 3 of timer 0.
CAN1_TD — CAN1 transmitter output.
R — Function reserved.
O
-
-
R — Function reserved.
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Rev. 3 — 6 December 2011
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LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
P1_18
N12
x
J10 95
67
46
I; PU I/O GPIO0[13] — General purpose digital input/output
pin.
I/O U2_DIR — RS-485/EIA-485 output enable/direction
control for USART2.
-
R — Function reserved.
O
ENET_TXD0 — Ethernet transmit data 0 (RMII/MII
interface).
O
I
T0_MAT3 — Match output 3 of timer 0.
CAN1_RD — CAN1 receiver input.
R — Function reserved.
-
-
R — Function reserved.
[3]
P1_19
M11
x
K9
96
68
47
I; PU I
ENET_TX_CLK (ENET_REF_CLK) — Ethernet
Transmit Clock (MII interface) or Ethernet Reference
Clock (RMII interface).
I/O SSP1_SCK — Serial clock for SSP1.
-
R — Function reserved.
-
R — Function reserved.
O
-
CLKOUT — Clock output pin.
R — Function reserved.
O
I2S0_RX_MCLK — I2S receive master clock.
I/O I2S1_TX_SCK — Transmit Clock. It is driven by the
master and received by the slave. Corresponds to
the signal SCK in the I2S-bus specification.
[3]
P1_20
M10
x
K10 100 70
48
I; PU I/O GPIO0[15] — General purpose digital input/output
pin.
I/O SSP1_SSEL — Slave Select for SSP1.
-
R — Function reserved.
O
ENET_TXD1 — Ethernet transmit data 1 (RMII/MII
interface).
I
T0_CAP2 — Capture input 2 of timer 0.
R — Function reserved.
-
-
-
R — Function reserved.
R — Function reserved.
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Preliminary data sheet
Rev. 3 — 6 December 2011
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LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
P2_0
T16
x
G10 108 75
50
I; PU -
R — Function reserved.
O
U0_TXD — Transmitter output for USART0.
I/O EMC_A13 — External memory address line 13.
O
USB0_PPWR — VBUS drive signal (towards
external charge pump or power management unit);
indicates that VBUS must be driven (active high).
Add a pull-down resistor to disable the power switch
at reset. This signal has opposite polarity compared
to the USB_PPWR used on other NXP LPC parts.
I/O GPIO5[0] — General purpose digital input/output pin.
-
R — Function reserved.
I
T3_CAP0 — Capture input 0 of timer 3.
ENET_MDC — Ethernet MIIM clock.
R — Function reserved.
O
[3]
P2_1
N15
x
G7 116 81
54
I; PU -
I
U0_RXD — Receiver input for USART0.
I/O EMC_A12 — External memory address line 12.
O
USB0_PWR_FAULT — Port power fault signal
indicating overcurrent condition; this signal monitors
over-current on the USB bus (external circuitry
required to detect over-current condition).
I/O GPIO5[1] — General purpose digital input/output pin.
-
R — Function reserved.
I
-
T3_CAP1 — Capture input 1 of timer 3.
R — Function reserved.
[3]
P2_2
M15
x
F5
121 84
56
I; PU -
R — Function reserved.
I/O U0_UCLK — Serial clock input/output for USART0 in
synchronous mode.
I/O EMC_A11 — External memory address line 11.
O
USB0_IND1 — USB0 port indicator LED control
output 1.
I/O GPIO5[2] — General purpose digital input/output pin.
I
I
-
CTIN_6 — SCT input 6. Capture input 1 of timer 3.
T3_CAP2 — Capture input 2 of timer 3.
R — Function reserved.
LPC1850_30_20_10
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Rev. 3 — 6 December 2011
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LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[4]
P2_3
J12
x
D8 127 87
57
I; PU -
R — Function reserved.
I/O I2C1_SDA — I2C1 data input/output (this pin does
not use a specialized I2C pad).
O
I
U3_TXD — Transmitter output for USART3.
CTIN_1 — SCT input 1. Capture input 1 of timer 0.
Capture input 1 of timer 2.
I/O GPIO5[3] — General purpose digital input/output pin.
-
R — Function reserved.
O
O
T3_MAT0 — Match output 0 of timer 3.
USB0_PPWR — VBUS drive signal (towards
external charge pump or power management unit);
indicates that VBUS must be driven (active HIGH).
Add a pull-down resistor to disable the power switch
at reset. This signal has opposite polarity compared
to the USB_PPWR used on other NXP LPC parts.
[4]
P2_4
K11
x
D9 128 88
58
I; PU -
R — Function reserved.
I/O I2C1_SCL — I2C1 clock input/output (this pin does
not use a specialized I2C pad).
I
I
U3_RXD — Receiver input for USART3.
CTIN_0 — SCT input 0. Capture input 0 of timer 0, 1,
2, 3.
I/O GPIO5[4] — General purpose digital input/output pin.
-
R — Function reserved.
O
O
T3_MAT1 — Match output 1 of timer 3.
USB0_PWR_FAULT — Port power fault signal
indicating overcurrent condition; this signal monitors
over-current on the USB bus (external circuitry
required to detect over-current condition).
[4]
P2_5
K14
x
D10 131 91
61
I; PU -
R — Function reserved.
I
I
CTIN_2 — SCT input 2. Capture input 2 of timer 0.
USB1_VBUS — Monitors the presence of USB1 bus
power.
Note: This signal must be HIGH for USB reset to
occur.
I
ADCTRIG1 — ADC trigger input 1.
I/O GPIO5[5] — General purpose digital input/output pin.
-
R — Function reserved.
O
O
T3_MAT2 — Match output 2 of timer 3.
USB0_IND0 — USB0 port indicator LED control
output 0.
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Rev. 3 — 6 December 2011
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LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
P2_6
K16
x
G9 137 95
64
I; PU -
R — Function reserved.
I/O U0_DIR — RS-485/EIA-485 output enable/direction
control for USART0.
I/O EMC_A10 — External memory address line 10.
O
USB0_IND0 — USB0 port indicator LED control
output 0.
I/O GPIO5[6] — General purpose digital input/output pin.
I
I
-
CTIN_7 — SCT input 7.
T3_CAP3 — Capture input 3 of timer 3.
R — Function reserved.
[3]
P2_7
H14
x
C10 138 96
65
I; PU I/O GPIO0[7] — General purpose digital input/output pin.
ISP entry pin. If this pin is pulled LOW at reset, the
part enters ISP mode using USART0.
O
CTOUT_1 — SCT output 1. Match output 1 of
timer 0.
I/O U3_UCLK — Serial clock input/output for USART3 in
synchronous mode.
I/O EMC_A9 — External memory address line 9.
-
R — Function reserved.
-
R — Function reserved.
O
-
T3_MAT3 — Match output 3 of timer 3.
R — Function reserved.
[3]
P2_8
J16
x
C6 140 98
67
I; PU -
R — Function reserved. Boot pin (see Table 5)
O
CTOUT_0 — SCT output 0. Match output 0 of
timer 0.
I/O U3_DIR — RS-485/EIA-485 output enable/direction
control for USART3.
I/O EMC_A8 — External memory address line 8.
I/O GPIO5[7] — General purpose digital input/output pin.
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
LPC1850_30_20_10
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Rev. 3 — 6 December 2011
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LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
[3]
[3]
P2_9
H16
G16
F16
x
x
x
B10 144 102 70
I; PU I/O GPIO1[10] — General purpose digital input/output
pin. Boot pin (see Table 5).
O
CTOUT_3 — SCT output 3. Match output 3 of
timer 0.
I/O U3_BAUD — Baud pin for USART3.
I/O EMC_A0 — External memory address line 0.
-
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
P2_10
E8
146 104 71
I; PU I/O GPIO0[14] — General purpose digital input/output
pin.
O
CTOUT_2 — SCT output 2. Match output 2 of
timer 0.
O
U2_TXD — Transmitter output for USART2.
I/O EMC_A1 — External memory address line 1.
-
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
P2_11
A9
148 105 72
I; PU I/O GPIO1[11] — General purpose digital input/output
pin.
O
CTOUT_5 — SCT output 5. Match output 1 of
timer 1.
I
U2_RXD — Receiver input for USART2.
I/O EMC_A2 — External memory address line 2.
-
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
18 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
P2_12
E15
x
B9
153 106 73
I; PU I/O GPIO1[12] — General purpose digital input/output
pin.
O
-
CTOUT_4 — SCT output 4. Match output 0 of
timer 1.
R — Function reserved.
I/O EMC_A3 — External memory address line 3.
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
I/O U2_UCLK — Serial clock input/output for USART2 in
synchronous mode.
[3]
P2_13
C16
x
A10 156 108 75
I; PU I/O GPIO1[13] — General purpose digital input/output
pin.
I
CTIN_4 — SCT input 4. Capture input 2 of timer 1.
R — Function reserved.
-
I/O EMC_A4 — External memory address line 4.
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
I/O U2_DIR — RS-485/EIA-485 output enable/direction
control for USART2.
[3]
P3_0
F13
x
A8
161 112 78
I; PU I/O I2S0_RX_SCK — I2S receive clock. It is driven by
the master and received by the slave. Corresponds
to the signal SCK in the I2S-bus specification.
O
I2S0_RX_MCLK — I2S receive master clock.
I/O I2S0_TX_SCK — Transmit Clock. It is driven by the
master and received by the slave. Corresponds to
the signal SCK in the I2S-bus specification.
O
I2S0_TX_MCLK — I2S transmit master clock.
I/O SSP0_SCK — Serial clock for SSP0.
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
LPC1850_30_20_10
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Preliminary data sheet
Rev. 3 — 6 December 2011
19 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
[3]
[5]
P3_1
G11
F11
B14
x
x
x
F7
163 114 79
I; PU I/O I2S0_TX_WS — Transmit Word Select. It is driven by
the master and received by the slave. Corresponds
to the signal WS in the I2S-bus specification.
I/O I2S0_RX_WS — Receive Word Select. It is driven by
the master and received by the slave. Corresponds
to the signal WS in the I2S-bus specification.
I
CAN0_RD — CAN receiver input.
O
USB1_IND1 — USB1 Port indicator LED control
output 1.
I/O GPIO5[8] — General purpose digital input/output pin.
-
R — Function reserved.
LCD_VD15 — LCD data.
R — Function reserved.
O
-
P3_2
G6 166 116 80
I; PU I/O I2S0_TX_SDA — I2S transmit data. It is driven by the
transmitter and read by the receiver. Corresponds to
the signal SD in the I2S-bus specification.
I/O I2S0_RX_SDA — I2S receive data. It is driven by the
transmitter and read by the receiver. Corresponds to
the signal SD in the I2S-bus specification.
O
O
CAN0_TD — CAN transmitter output.
USB1_IND0 — USB1 Port indicator LED control
output 0.
I/O GPIO5[9] — General purpose digital input/output pin.
-
R — Function reserved.
LCD_VD14 — LCD data.
R — Function reserved.
R — Function reserved.
R — Function reserved.
O
-
P3_3
A7
169 118 81
I; PU -
-
I/O SSP0_SCK — Serial clock for SSP0.
O
O
-
SPIFI_SCK — Serial clock for SPIFI.
CGU_OUT1 — CGU spare clock output 1.
R — Function reserved.
O
I2S0_TX_MCLK — I2S transmit master clock.
I/O I2S1_TX_SCK — Transmit Clock. It is driven by the
master and received by the slave. Corresponds to
the signal SCK in the I2S-bus specification.
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Preliminary data sheet
Rev. 3 — 6 December 2011
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LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
[3]
[3]
P3_4
A15
C12
B13
x
x
x
B8
171 119 82
I; PU I/O GPIO1[14] — General purpose digital input/output
pin.
-
-
R — Function reserved.
R — Function reserved.
I/O SPIFI_SIO3 — I/O lane 3 for SPIFI.
U1_TXD — Transmitter output for UART1.
O
I/O I2S0_TX_WS — Transmit Word Select. It is driven by
the master and received by the slave. Corresponds
to the signal WS in the I2S-bus specification.
I/O I2S1_RX_SDA — I2S1 receive data. It is driven by
the transmitter and read by the receiver. Corresponds
to the signal SD in the I2S-bus specification.
O
LCD_VD13 — LCD data.
P3_5
B7
173 121 84
I; PU I/O GPIO1[15] — General purpose digital input/output
pin.
-
-
R — Function reserved.
R — Function reserved.
I/O SPIFI_SIO2 — I/O lane 2 for SPIFI.
I
U1_RXD — Receiver input for UART1.
I/O I2S0_TX_SDA — I2S transmit data. It is driven by the
transmitter and read by the receiver. Corresponds to
the signal SD in the I2S-bus specification.
I/O I2S1_RX_WS — Receive Word Select. It is driven by
the master and received by the slave. Corresponds
to the signal WS in the I2S-bus specification.
O
LCD_VD12 — LCD data.
I; PU I/O GPIO0[6] — General purpose digital input/output pin.
R — Function reserved.
P3_6
C7 174 122 85
-
I/O SSP0_SSEL — Slave Select for SSP0.
I/O SPIFI_MISO — Input 1 in SPIFI quad mode; SPIFI
output IO1.
-
R — Function reserved.
I/O SSP0_MISO — Master In Slave Out for SSP0.
-
-
R — Function reserved.
R — Function reserved.
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
21 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
P3_7
C11
x
D7 176 123 86
I; PU -
-
R — Function reserved.
R — Function reserved.
I/O SSP0_MISO — Master In Slave Out for SSP0.
I/O SPIFI_MOSI — Input 0 in SPIFI quad mode; SPIFI
output IO0.
I/O GPIO5[10] — General purpose digital input/output
pin.
I/O SSP0_MOSI — Master Out Slave in for SSP0.
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
-
I; PU -
-
[3]
[3]
[6]
P3_8
P4_0
P4_1
C10
x
x
x
E7
179 124 87
I/O SSP0_MOSI — Master Out Slave in for SSP0.
I/O SPIFI_CS — SPIFI serial flash chip select.
I/O GPIO5[11] — General purpose digital input/output
pin.
I/O SSP0_SSEL — Slave Select for SSP0.
-
-
R — Function reserved.
R — Function reserved.
D5
-
1
1
-
I; PU I/O GPIO2[0] — General purpose digital input/output pin.
O
I
MCOA0 — Motor control PWM channel 0, output A.
NMI — External interrupt input to NMI.
R — Function reserved.
-
-
R — Function reserved.
O
LCD_VD13 — LCD data.
I/O U3_UCLK — Serial clock input/output for USART3 in
synchronous mode.
-
R — Function reserved.
A1
-
3
3
-
I; PU I/O GPIO2[1] — General purpose digital input/output pin.
O
CTOUT_1 — SCT output 1. Match output 1 of
timer 0.
O
-
LCD_VD0 — LCD data.
R — Function reserved.
-
R — Function reserved.
O
O
I
LCD_VD19 — LCD data.
U3_TXD — Transmitter output for USART3.
ENET_COL — Ethernet Collision detect (MII
interface).
I
ADC0_1 — ADC0, input channel 1.
LPC1850_30_20_10
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Rev. 3 — 6 December 2011
22 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
P4_2
D3
x
-
12
8
-
I; PU I/O GPIO2[2] — General purpose digital input/output pin.
O
CTOUT_0 — SCT output 0. Match output 0 of
timer 0.
O
-
LCD_VD3 — LCD data.
R — Function reserved.
-
R — Function reserved.
O
I
LCD_VD12 — LCD data.
U3_RXD — Receiver input for USART3.
R — Function reserved.
-
[6]
P4_3
C2
x
-
10
7
-
I; PU I/O GPIO2[3] — General purpose digital input/output pin.
O
CTOUT_3 — SCT output 3. Match output 3 of timer
0.
O
-
LCD_VD2 — LCD data.
R — Function reserved.
R — Function reserved.
LCD_VD21 — LCD data.
-
O
I/O U3_BAUD — Baud pin USART3.
-
I
R — Function reserved.
ADC0_0 — ADC0, input channel 0.
[6]
P4_4
B1
x
-
14
9
-
I; PU I/O GPIO2[4] — General purpose digital input/output pin.
O
CTOUT_2 — SCT output 2. Match output 2 of timer
0.
O
-
LCD_VD1 — LCD data.
R — Function reserved.
R — Function reserved.
LCD_VD20 — LCD data.
-
O
I/O U3_DIR — RS-485/EIA-485 output enable/direction
control for USART3.
-
R — Function reserved.
DAC — DAC output.
O
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Rev. 3 — 6 December 2011
23 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
[3]
[3]
P4_5
D2
C1
H4
x
x
x
-
-
-
15
17
21
10
11
14
-
-
-
I; PU I/O GPIO2[5] — General purpose digital input/output pin.
O
CTOUT_5 — SCT output 5. Match output 1 of
timer 1.
O
LCD_FP — Frame pulse (STN). Vertical
synchronization pulse (TFT).
-
-
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
P4_6
I; PU I/O GPIO2[6] — General purpose digital input/output pin.
O
CTOUT_4 — SCT output 4. Match output 0 of timer
1.
O
LCD_ENAB/LCDM — STN AC bias drive or TFT
data enable input.
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
LCD_DCLK — LCD panel clock.
-
-
-
-
P4_7
O;
PU
O
I
GP_CLKIN — General purpose clock input to the
CGU.
-
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
I/O I2S1_TX_SCK — Transmit Clock. It is driven by the
master and received by the slave. Corresponds to
the signal SCK in the I2S-bus specification.
I/O I2S0_TX_SCK — Transmit Clock. It is driven by the
master and received by the slave. Corresponds to
the signal SCK in the I2S-bus specification.
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Rev. 3 — 6 December 2011
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NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
[3]
[3]
[3]
P4_8
E2
x
x
x
x
-
-
-
-
23
48
51
53
15
33
35
37
-
-
-
-
I; PU -
I
R — Function reserved.
CTIN_5 — SCT input 5. Capture input 2 of timer 2.
LCD_VD9 — LCD data.
O
-
R — Function reserved.
I/O GPIO5[12] — General purpose digital input/output
pin.
O
O
-
LCD_VD22 — LCD data.
CAN1_TD — CAN1 transmitter output.
R — Function reserved.
P4_9
P4_10
P5_0
L2
I; PU -
R — Function reserved.
I
CTIN_6 — SCT input 6. Capture input 1 of timer 3.
LCD_VD11 — LCD data.
O
-
R — Function reserved.
I/O GPIO5[13] — General purpose digital input/output
pin.
O
I
LCD_VD15 — LCD data.
CAN1_RD — CAN1 receiver input.
R — Function reserved.
-
M3
I; PU -
R — Function reserved.
I
CTIN_2 — SCT input 2. Capture input 2 of timer 0.
LCD_VD10 — LCD data.
O
-
R — Function reserved.
I/O GPIO5[14] — General purpose digital input/output
pin.
O
-
LCD_VD14 — LCD data.
R — Function reserved.
R — Function reserved.
-
N3
I; PU I/O GPIO2[9] — General purpose digital input/output pin.
MCOB2 — Motor control PWM channel 2, output B.
I/O EMC_D12 — External memory data line 12.
O
-
I
R — Function reserved.
U1_DSR — Data Set Ready input for UART1.
T1_CAP0 — Capture input 0 of timer 1.
R — Function reserved.
I
-
-
R — Function reserved.
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Rev. 3 — 6 December 2011
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LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
[3]
[3]
P5_1
P3
R4
T8
x
x
x
-
-
-
55
63
76
39
46
54
-
-
-
I; PU I/O GPIO2[10] — General purpose digital input/output
pin.
I
MCI2 — Motor control PWM channel 2, input.
I/O EMC_D13 — External memory data line 13.
-
R — Function reserved.
O
U1_DTR — Data Terminal Ready output for UART1.
Can also be configured to be an RS-485/EIA-485
output enable signal for UART1.
I
T1_CAP1 — Capture input 1 of timer 1.
R — Function reserved.
-
-
R — Function reserved.
P5_2
I; PU I/O GPIO2[11] — General purpose digital input/output
pin.
I
MCI1 — Motor control PWM channel 1, input.
I/O EMC_D14 — External memory data line 14.
-
R — Function reserved.
O
U1_RTS — Request to Send output for UART1. Can
also be configured to be an RS-485/EIA-485 output
enable signal for UART1.
I
T1_CAP2 — Capture input 2 of timer 1.
R — Function reserved.
-
-
R — Function reserved.
P5_3
I; PU I/O GPIO2[12] — General purpose digital input/output
pin.
I
MCI0 — Motor control PWM channel 0, input.
I/O EMC_D15 — External memory data line 15.
-
I
R — Function reserved.
U1_RI — Ring Indicator input for UART1.
T1_CAP3 — Capture input 3 of timer 1.
R — Function reserved.
I
-
-
R — Function reserved.
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Preliminary data sheet
Rev. 3 — 6 December 2011
26 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
[3]
[3]
[3]
P5_4
P9
x
x
x
x
-
-
-
-
80
81
89
91
57
58
63
65
-
-
-
-
I; PU I/O GPIO2[13] — General purpose digital input/output
pin.
O
MCOB0 — Motor control PWM channel 0, output B.
I/O EMC_D8 — External memory data line 8.
-
R — Function reserved.
I
U1_CTS — Clear to Send input for UART1.
T1_MAT0 — Match output 0 of timer 1.
R — Function reserved.
O
-
-
R — Function reserved.
P5_5
P5_6
P5_7
P10
T13
R12
I; PU I/O GPIO2[14] — General purpose digital input/output
pin.
O
MCOA1 — Motor control PWM channel 1, output A.
I/O EMC_D9 — External memory data line 9.
-
R — Function reserved.
I
U1_DCD — Data Carrier Detect input for UART1.
T1_MAT1 — Match output 1 of timer 1.
R — Function reserved.
O
-
-
R — Function reserved.
I; PU I/O GPIO2[15] — General purpose digital input/output
pin.
O
MCOB1 — Motor control PWM channel 1, output B.
I/O EMC_D10 — External memory data line 10.
-
R — Function reserved.
O
O
-
U1_TXD — Transmitter output for UART1.
T1_MAT2 — Match output 2 of timer 1.
R — Function reserved.
-
R — Function reserved.
I; PU I/O GPIO2[7] — General purpose digital input/output pin.
MCOA2 — Motor control PWM channel 2, output A.
I/O EMC_D11 — External memory data line 11.
O
-
R — Function reserved.
I
U1_RXD — Receiver input for UART1.
T1_MAT3 — Match output 3 of timer 1.
R — Function reserved.
O
-
-
R — Function reserved.
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
27 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
P6_0
M12
x
H7 105 73
-
I; PU -
R — Function reserved.
O
I2S0_RX_MCLK — I2S receive master clock.
-
-
R — Function reserved.
R — Function reserved.
I/O I2S0_RX_SCK — Receive Clock. It is driven by the
master and received by the slave. Corresponds to
the signal SCK in the I2S-bus specification.
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
[3]
P6_1
R15
x
G5 107 74
-
I; PU I/O GPIO3[0] — General purpose digital input/output pin.
EMC_DYCS1 — SDRAM chip select 1.
O
I/O U0_UCLK — Serial clock input/output for USART0 in
synchronous mode.
I/O I2S0_RX_WS — Receive Word Select. It is driven by
the master and received by the slave. Corresponds
to the signal WS in the I2S-bus specification.
-
I
R — Function reserved.
T2_CAP0 — Capture input 2 of timer 2.
R — Function reserved.
-
-
R — Function reserved.
[3]
P6_2
L13
x
J9
111 78
-
I; PU I/O GPIO3[1] — General purpose digital input/output pin.
EMC_CKEOUT1 — SDRAM clock enable 1.
O
I/O U0_DIR — RS-485/EIA-485 output enable/direction
control for USART0.
I/O I2S0_RX_SDA — I2S Receive data. It is driven by
the transmitter and read by the receiver. Corresponds
to the signal SD in the I2S-bus specification.
-
I
R — Function reserved.
T2_CAP1 — Capture input 1 of timer 2.
R — Function reserved.
-
-
R — Function reserved.
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
28 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
P6_3
P15
x
-
113 79
-
I; PU I/O GPIO3[2] — General purpose digital input/output pin.
O
USB0_PPWR — VBUS drive signal (towards
external charge pump or power management unit);
indicates that the VBUS signal must be driven (active
HIGH).
Add a pull-down resistor to disable the power switch
at reset. This signal has opposite polarity compared
to the USB_PPWR used on other NXP LPC parts.
-
R — Function reserved.
O
-
EMC_CS1 — LOW active Chip Select 1 signal.
R — Function reserved.
I
T2_CAP2 — Capture input 2 of timer 2.
R — Function reserved.
-
-
R — Function reserved.
[3]
P6_4
R16
x
F6
114 80
53
I; PU I/O GPIO3[3] — General purpose digital input/output pin.
I
CTIN_6 — SCT input 6. Capture input 1 of timer 3.
U0_TXD — Transmitter output for USART0.
O
O
EMC_CAS — LOW active SDRAM Column Address
Strobe.
-
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
[3]
P6_5
P16
x
F9
117 82
55
I; PU I/O GPIO3[4] — General purpose digital input/output pin.
O
CTOUT_6 — SCT output 6. Match output 2 of timer
1.
I
U0_RXD — Receiver input for USART0.
O
EMC_RAS — LOW active SDRAM Row Address
Strobe.
-
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
29 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
P6_6
L14
x
-
119 83
-
I; PU I/O GPIO0[5] — General purpose digital input/output pin.
O
EMC_BLS1 — LOW active Byte Lane select signal
1.
-
R — Function reserved.
O
USB0_PWR_FAULT — Port power fault signal
indicating overcurrent condition; this signal monitors
over-current on the USB bus (external circuitry
required to detect over-current condition).
-
I
R — Function reserved.
T2_CAP3 — Capture input 3 of timer 2.
R — Function reserved.
-
-
R — Function reserved.
[3]
P6_7
J13
x
-
123 85
-
I; PU -
R — Function reserved.
I/O EMC_A15 — External memory address line 15.
-
R — Function reserved.
O
USB0_IND1 — USB0 port indicator LED control
output 1.
I/O GPIO5[15] — General purpose digital input/output
pin.
O
-
T2_MAT0 — Match output 0 of timer 2.
R — Function reserved.
-
R — Function reserved.
[3]
P6_8
H13
x
-
125 86
-
I; PU -
R — Function reserved.
I/O EMC_A14 — External memory address line 14.
-
R — Function reserved.
O
USB0_IND0 — USB0 port indicator LED control
output 0.
I/O GPIO5[16] — General purpose digital input/output
pin.
O
-
T2_MAT1 — Match output 1 of timer 2.
R — Function reserved.
-
R — Function reserved.
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
30 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
P6_9
J15
x
F8
139 97
66
I; PU I/O GPIO3[5] — General purpose digital input/output pin.
-
R — Function reserved.
-
R — Function reserved.
O
-
EMC_DYCS0 — SDRAM chip select 0.
R — Function reserved.
O
-
T2_MAT2 — Match output 2 of timer 2.
R — Function reserved.
-
R — Function reserved.
[3]
P6_10
H15
x
-
142 100
-
I; PU I/O GPIO3[6] — General purpose digital input/output pin.
O
MCABORT — Motor control PWM, LOW-active fast
abort.
-
R — Function reserved.
O
EMC_DQMOUT1 — Data mask 1 used with SDRAM
and static devices.
-
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
[3]
P6_11
H12
x
C9 143 101 69
I; PU I/O GPIO3[7] — General purpose digital input/output pin.
-
R — Function reserved.
-
R — Function reserved.
O
-
EMC_CKEOUT0 — SDRAM clock enable 0.
R — Function reserved.
O
-
T2_MAT3 — Match output 3 of timer 2.
R — Function reserved.
-
R — Function reserved.
[3]
P6_12
G15
x
-
145 103
-
I; PU I/O GPIO2[8] — General purpose digital input/output pin.
O
CTOUT_7 — SCT output 7. Match output 3 of
timer 1.
-
R — Function reserved.
O
EMC_DQMOUT0 — Data mask 0 used with SDRAM
and static devices.
-
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
31 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
P7_0
B16
x
-
158 110
-
I; PU I/O GPIO3[8] — General purpose digital input/output pin.
O
CTOUT_14 — SCT output 14. Match output 2 of
timer 3.
-
R — Function reserved.
LCD_LE — Line end signal.
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
O
-
-
-
-
[3]
P7_1
C14
x
-
162 113
-
I; PU I/O GPIO3[9] — General purpose digital input/output pin.
O
CTOUT_15 — SCT output 15. Match output 3 of
timer 3.
I/O I2S0_TX_WS — Transmit Word Select. It is driven by
the master and received by the slave. Corresponds
to the signal WS in the I2S-bus specification.
O
O
-
LCD_VD19 — LCD data.
LCD_VD7 — LCD data.
R — Function reserved.
O
-
U2_TXD — Transmitter output for USART2.
R — Function reserved.
[3]
P7_2
A16
x
-
165 115
-
I; PU I/O GPIO3[10] — General purpose digital input/output
pin.
I
CTIN_4 — SCT input 4. Capture input 2 of timer 1.
I/O I2S0_TX_SDA — I2S transmit data. It is driven by the
transmitter and read by the receiver. Corresponds to
the signal SD in the I2S-bus specification.
O
O
-
LCD_VD18 — LCD data.
LCD_VD6 — LCD data.
R — Function reserved.
I
U2_RXD — Receiver input for USART2.
R — Function reserved.
-
LPC1850_30_20_10
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Preliminary data sheet
Rev. 3 — 6 December 2011
32 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
P7_3
C13
x
-
167 117
-
I; PU I/O GPIO3[11] — General purpose digital input/output
pin.
I
CTIN_3 — SCT input 3. Capture input 1 of timer 1.
R — Function reserved.
-
O
O
-
LCD_VD17 — LCD data.
LCD_VD5 — LCD data.
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
[6]
P7_4
C8
x
-
189 132
-
I; PU I/O GPIO3[12] — General purpose digital input/output
pin.
O
CTOUT_13 — SCT output 13. Match output 1 of
timer 3.
-
R — Function reserved.
O
O
O
-
LCD_VD16 — LCD data.
LCD_VD4 — LCD data.
TRACEDATA[0] — Trace data, bit 0.
R — Function reserved.
-
R — Function reserved.
I
ADC0_4 — ADC0, input channel 4.
[6]
P7_5
A7
x
-
191 133
-
I; PU I/O GPIO3[13] — General purpose digital input/output
pin.
O
CTOUT_12 — SCT output 12. Match output 0 of
timer 3.
-
R — Function reserved.
O
O
O
-
LCD_VD8 — LCD data.
LCD_VD23 — LCD data.
TRACEDATA[1] — Trace data, bit 1.
R — Function reserved.
-
R — Function reserved.
I
ADC0_3 — ADC0, input channel 3.
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
33 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
P7_6
C7
x
-
194 134
-
I; PU I/O GPIO3[14] — General purpose digital input/output
pin.
O
CTOUT_11 — SCT output 1. Match output 3 of timer
2.
-
R — Function reserved.
O
LCD_LP — Line synchronization pulse (STN).
Horizontal synchronization pulse (TFT).
-
R — Function reserved.
O
-
TRACEDATA[2] — Trace data, bit 2.
R — Function reserved.
-
R — Function reserved.
[6]
P7_7
B6
x
-
201 140
-
I; PU I/O GPIO3[15] — General purpose digital input/output
pin.
O
CTOUT_8 — SCT output 8. Match output 0 of timer
2.
-
R — Function reserved.
O
-
LCD_PWR — LCD panel power enable.
R — Function reserved.
O
O
-
TRACEDATA[3] — Trace data, bit 3.
ENET_MDC — Ethernet MIIM clock.
R — Function reserved.
I
ADC1_6 — ADC1, input channel 6.
[4]
P8_0
E5
x
-
2
-
-
I; PU I/O GPIO4[0] — General purpose digital input/output pin.
O
USB0_PWR_FAULT — Port power fault signal
indicating overcurrent condition; this signal monitors
over-current on the USB bus (external circuitry
required to detect over-current condition).
-
R — Function reserved.
I
MCI2 — Motor control PWM channel 2, input.
R — Function reserved.
-
-
R — Function reserved.
-
R — Function reserved.
O
T0_MAT0 — Match output 0 of timer 0.
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
34 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[4]
[4]
[3]
[3]
P8_1
H5
K4
J3
J2
x
x
x
x
-
-
-
-
34
36
37
39
-
-
-
-
-
-
-
-
I; PU I/O GPIO4[1] — General purpose digital input/output pin.
O
USB0_IND1 — USB0 port indicator LED control
output 1.
-
R — Function reserved.
I
MCI1 — Motor control PWM channel 1, input.
R — Function reserved.
-
-
R — Function reserved.
-
R — Function reserved.
O
T0_MAT1 — Match output 1 of timer 0.
P8_2
P8_3
P8_4
I; PU I/O GPIO4[2] — General purpose digital input/output pin.
O
USB0_IND0 — USB0 port indicator LED control
output 0.
-
R — Function reserved.
I
MCI0 — Motor control PWM channel 0, input.
R — Function reserved.
-
-
R — Function reserved.
-
R — Function reserved.
O
T0_MAT2 — Match output 2 of timer 0.
I; PU I/O GPIO4[3] — General purpose digital input/output pin.
I/O USB1_ULPI_D2 — ULPI link bidirectional data line
2.
-
R — Function reserved.
O
O
-
LCD_VD12 — LCD data.
LCD_VD19 — LCD data.
R — Function reserved.
-
R — Function reserved.
O
T0_MAT3 — Match output 3 of timer 0.
I; PU I/O GPIO4[4] — General purpose digital input/output pin.
I/O USB1_ULPI_D1 — ULPI link bidirectional data line
1.
-
R — Function reserved.
O
O
-
LCD_VD7 — LCD data.
LCD_VD16 — LCD data.
R — Function reserved.
-
R — Function reserved.
I
T0_CAP0 — Capture input 0 of timer 0.
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
35 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
P8_5
J1
x
-
40
-
-
I; PU I/O GPIO4[5] — General purpose digital input/output pin.
I/O USB1_ULPI_D0 — ULPI link bidirectional data line
0.
-
R — Function reserved.
O
O
-
LCD_VD6 — LCD data.
LCD_VD8 — LCD data.
R — Function reserved.
-
R — Function reserved.
I
T0_CAP1 — Capture input 1 of timer 0.
[3]
P8_6
K3
x
-
43
-
-
I; PU I/O GPIO4[6] — General purpose digital input/output pin.
I
USB1_ULPI_NXT — ULPI link NXT signal. Data flow
control signal from the PHY.
-
R — Function reserved.
LCD_VD5 — LCD data.
O
O
LCD_LP — Line synchronization pulse (STN).
Horizontal synchronization pulse (TFT).
-
-
I
R — Function reserved.
R — Function reserved.
T0_CAP2 — Capture input 2 of timer 0.
[3]
P8_7
K1
x
-
45
-
-
I; PU I/O GPIO4[7] — General purpose digital input/output pin.
O
USB1_ULPI_STP — ULPI link STP signal. Asserted
to end or interrupt transfers to the PHY.
-
R — Function reserved.
O
O
-
LCD_VD4 — LCD data.
LCD_PWR — LCD panel power enable.
R — Function reserved.
-
R — Function reserved.
I
T0_CAP3 — Capture input 3 of timer 0.
R — Function reserved.
[3]
P8_8
L1
x
-
49
-
-
I; PU -
I
USB1_ULPI_CLK — ULPI link CLK signal. 60 MHz
clock generated by the PHY.
-
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
O
O
CGU_OUT0 — CGU spare clock output 0.
I2S1_TX_MCLK — I2S1 transmit master clock.
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Rev. 3 — 6 December 2011
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NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
P9_0
T1
x
-
59
-
-
I; PU I/O GPIO4[12] — General purpose digital input/output
pin.
O
MCABORT — Motor control PWM, LOW-active fast
abort.
-
-
-
I
R — Function reserved.
R — Function reserved.
R — Function reserved.
ENET_CRS — Ethernet Carrier Sense (MII
interface).
-
R — Function reserved.
I/O SSP0_SSEL — Slave Select for SSP0.
[3]
P9_1
N6
x
-
66
-
-
I; PU I/O GPIO4[13] — General purpose digital input/output
pin.
O
-
MCOA2 — Motor control PWM channel 2, output A.
R — Function reserved.
-
R — Function reserved.
I/O I2S0_TX_WS — Transmit Word Select. It is driven by
the master and received by the slave. Corresponds
to the signal WS in the I2S-bus specification.
I
ENET_RX_ER — Ethernet receive error (MII
interface).
-
R — Function reserved.
I/O SSP0_MISO — Master In Slave Out for SSP0.
[3]
P9_2
N8
x
-
70
-
-
I; PU I/O GPIO4[14] — General purpose digital input/output
pin.
O
-
MCOB2 — Motor control PWM channel 2, output B.
R — Function reserved.
-
R — Function reserved.
I/O I2S0_TX_SDA — I2S transmit data. It is driven by the
transmitter and read by the receiver. Corresponds to
the signal SD in the I2S-bus specification.
I
ENET_RXD3 — Ethernet receive data 3 (MII
interface).
-
R — Function reserved.
I/O SSP0_MOSI — Master Out Slave in for SSP0.
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Rev. 3 — 6 December 2011
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LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
[3]
[3]
P9_3
M6
x
x
x
-
-
-
79
92
98
-
-
-
-
I; PU I/O GPIO4[15] — General purpose digital input/output
pin.
O
O
MCOA0 — Motor control PWM channel 0, output A.
USB1_IND1 — USB1 Port indicator LED control
output 1.
-
-
I
R — Function reserved.
R — Function reserved.
ENET_RXD2 — Ethernet receive data 2 (MII
interface).
-
R — Function reserved.
O
U3_TXD — Transmitter output for USART3.
R — Function reserved.
P9_4
N10
-
I; PU -
O
O
MCOB0 — Motor control PWM channel 0, output B.
USB1_IND0 — USB1 Port indicator LED control
output 0.
-
R — Function reserved.
I/O GPIO5[17] — General purpose digital input/output
pin.
O
ENET_TXD2 — Ethernet transmit data 2 (MII
interface).
-
I
R — Function reserved.
U3_RXD — Receiver input for USART3.
R — Function reserved.
P9_5
M9
69
I; PU -
O
O
MCOA1 — Motor control PWM channel 1, output A.
USB1_PPWR — VBUS drive signal (towards
external charge pump or power management unit);
indicates that VBUS must be driven (active HIGH).
Add a pull-down resistor to disable the power switch
at reset. This signal has opposite polarity compared
to the USB_PPWR used on other NXP LPC parts.
-
R — Function reserved.
I/O GPIO5[18] — General purpose digital input/output
pin.
O
ENET_TXD3 — Ethernet transmit data 3 (MII
interface).
-
R — Function reserved.
O
U0_TXD — Transmitter output for USART0.
LPC1850_30_20_10
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Rev. 3 — 6 December 2011
38 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
P9_6
L11
x
-
103 72
-
I; PU I/O GPIO4[11] — General purpose digital input/output
pin.
O
O
MCOB1 — Motor control PWM channel 1, output B.
USB1_PWR_FAULT — USB1 Port power fault signal
indicating over-current condition; this signal monitors
over-current on the USB1 bus (external circuitry
required to detect over-current condition).
-
-
I
R — Function reserved.
R — Function reserved.
ENET_COL — Ethernet Collision detect (MII
interface).
-
I
R — Function reserved.
U0_RXD — Receiver input for USART0.
R — Function reserved.
[3]
PA_0
L12
x
-
126
-
-
I; PU -
-
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
O
O
-
I2S1_RX_MCLK — I2S1 receive master clock.
CGU_OUT1 — CGU spare clock output 1.
R — Function reserved.
[4]
PA_1
J14
x
-
134
-
-
I; PU I/O GPIO4[8] — General purpose digital input/output pin.
I
QEI_IDX — Quadrature Encoder Interface INDEX
input.
-
R — Function reserved.
O
-
U2_TXD — Transmitter output for USART2.
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
[4]
PA_2
K15
x
-
136
-
-
I; PU I/O GPIO4[9] — General purpose digital input/output pin.
I
QEI_PHB — Quadrature Encoder Interface PHB
input.
-
I
R — Function reserved.
U2_RXD — Receiver input for USART2.
R — Function reserved.
-
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
39 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[4]
[3]
[3]
PA_3
H11
G13
B15
x
x
x
-
-
-
147
151
164
-
-
-
-
-
-
I; PU I/O GPIO4[10] — General purpose digital input/output
pin.
I
QEI_PHA — Quadrature Encoder Interface PHA
input.
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
-
-
-
-
-
PA_4
I; PU -
O
CTOUT_9 — SCT output 9. Match output 1 of
timer 2.
-
R — Function reserved.
I/O EMC_A23 — External memory address line 23.
I/O GPIO5[19] — General purpose digital input/output
pin.
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
-
-
PB_0
I; PU -
O
CTOUT_10 — SCT output 10. Match output 2 of
timer 2.
O
-
LCD_VD23 — LCD data.
R — Function reserved.
I/O GPIO5[20] — General purpose digital input/output
pin.
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
LPC1850_30_20_10
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Preliminary data sheet
Rev. 3 — 6 December 2011
40 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
[3]
[3]
PB_1
A14
B12
A13
x
x
x
-
-
-
175
177
178
-
-
-
-
-
-
I; PU -
I
R — Function reserved.
USB1_ULPI_DIR — ULPI link DIR signal. Controls
the ULP data line direction.
O
LCD_VD22 — LCD data.
R — Function reserved.
-
I/O GPIO5[21] — General purpose digital input/output
pin.
O
CTOUT_6 — SCT output 6. Match output 2 of timer
1.
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
PB_2
I; PU -
I/O USB1_ULPI_D7 — ULPI link bidirectional data line
7.
O
-
LCD_VD21 — LCD data.
R — Function reserved.
I/O GPIO5[22] — General purpose digital input/output
pin.
O
CTOUT_7 — SCT output 7. Match output 3 of
timer 1.
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
PB_3
I; PU -
I/O USB1_ULPI_D6 — ULPI link bidirectional data line
6.
O
-
LCD_VD20 — LCD data.
R — Function reserved.
I/O GPIO5[23] — General purpose digital input/output
pin.
O
CTOUT_8 — SCT output 8. Match output 0 of
timer 2.
-
-
R — Function reserved.
R — Function reserved.
LPC1850_30_20_10
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Preliminary data sheet
Rev. 3 — 6 December 2011
41 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
[3]
[6]
PB_4
B11
A12
A6
x
x
x
-
-
-
180
181
-
-
-
-
-
-
-
I; PU -
R — Function reserved.
I/O USB1_ULPI_D5 — ULPI link bidirectional data
line 5.
O
-
LCD_VD15 — LCD data.
R — Function reserved.
I/O GPIO5[24] — General purpose digital input/output
pin.
I
CTIN_5 — SCT input 5. Capture input 2 of timer 2.
R — Function reserved.
-
-
R — Function reserved.
PB_5
I; PU -
R — Function reserved.
I/O USB1_ULPI_D4 — ULPI link bidirectional data
line 4.
O
-
LCD_VD14 — LCD data.
R — Function reserved.
I/O GPIO5[25] — General purpose digital input/output
pin.
I
CTIN_7 — SCT input 7.
O
-
LCD_PWR — LCD panel power enable.
R — Function reserved.
PB_6
I; PU -
R — Function reserved.
I/O USB1_ULPI_D3 — ULPI link bidirectional data
line 3.
O
-
LCD_VD13 — LCD data.
R — Function reserved.
I/O GPIO5[26] — General purpose digital input/output
pin.
I
CTIN_6 — SCT input 6. Capture input 1 of timer 3.
LCD_VD19 — LCD data.
O
-
R — Function reserved.
I
ADC0_6 — ADC0, input channel 6.
LPC1850_30_20_10
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Preliminary data sheet
Rev. 3 — 6 December 2011
42 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[6]
PC_0
D4
x
-
7
-
-
I; PU -
I
R — Function reserved.
USB1_ULPI_CLK — ULPI link CLK signal. 60 MHz
clock generated by the PHY.
-
R — Function reserved.
I/O ENET_RX_CLK — Ethernet Receive Clock (MII
interface).
O
-
LCD_DCLK — LCD panel clock.
R — Function reserved.
-
R — Function reserved.
I/O SD_CLK — SD/MMC card clock.
ADC1_1 — ADC1, input channel 1.
I
[3]
PC_1
E4
-
-
9
-
-
I; PU I/O USB1_ULPI_D7 — ULPI link bidirectional data
line 7.
-
R — Function reserved.
I
U1_RI — Ring Indicator input for UART1.
ENET_MDC — Ethernet MIIM clock.
O
I/O GPIO6[0] — General purpose digital input/output pin.
-
R — Function reserved.
I
T3_CAP0 — Capture input 0 of timer 3.
SD_VOLT0 — SD/MMC bus voltage select output 0.
O
[3]
PC_2
F6
-
-
13
-
-
I; PU I/O USB1_ULPI_D6 — ULPI link bidirectional data
line 6.
-
R — Function reserved.
I
U1_CTS — Clear to Send input for UART1.
O
ENET_TXD2 — Ethernet transmit data 2 (MII
interface).
I/O GPIO6[1] — General purpose digital input/output pin.
-
R — Function reserved.
-
R — Function reserved.
O
SD_RST — SD/MMC reset signal for MMC4.4 card.
LPC1850_30_20_10
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Preliminary data sheet
Rev. 3 — 6 December 2011
43 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[6]
PC_3
F5
-
-
11
-
-
I; PU I/O USB1_ULPI_D5 — ULPI link bidirectional data
line 5.
-
R — Function reserved.
O
U1_RTS — Request to Send output for UART1. Can
also be configured to be an RS-485/EIA-485 output
enable signal for UART1.
O
ENET_TXD3 — Ethernet transmit data 3 (MII
interface).
I/O GPIO6[2] — General purpose digital input/output pin.
-
R — Function reserved.
-
R — Function reserved.
O
I
SD_VOLT1 — SD/MMC bus voltage select output 1.
ADC1_0 — ADC1, input channel 0.
R — Function reserved.
[3]
PC_4
F4
-
-
16
-
-
I; PU -
I/O USB1_ULPI_D4 — ULPI link bidirectional data
line 4.
-
R — Function reserved.
ENET_TX_EN — Ethernet transmit enable (RMII/MII
interface).
I/O GPIO6[3] — General purpose digital input/output pin.
-
I
R — Function reserved.
T3_CAP1 — Capture input 1 of timer 3.
I/O SD_DAT0 — SD/MMC data bus line 0.
[3]
PC_5
G4
-
-
20
-
-
I; PU -
R — Function reserved.
I/O USB1_ULPI_D3 — ULPI link bidirectional data
line 3.
-
R — Function reserved.
O
ENET_TX_ER — Ethernet Transmit Error (MII
interface).
I/O GPIO6[4] — General purpose digital input/output pin.
-
I
R — Function reserved.
T3_CAP2 — Capture input 2 of timer 3.
I/O SD_DAT1 — SD/MMC data bus line 1.
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
44 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
[3]
[3]
PC_6
H6
G5
N4
-
-
-
-
-
-
22
-
-
-
-
-
-
I; PU -
R — Function reserved.
I/O USB1_ULPI_D2 — ULPI link bidirectional data
line 2.
-
I
R — Function reserved.
ENET_RXD2 — Ethernet receive data 2 (MII
interface).
I/O GPIO6[5] — General purpose digital input/output pin.
-
I
R — Function reserved.
T3_CAP3 — Capture input 3 of timer 3.
I/O SD_DAT2 — SD/MMC data bus line 2.
PC_7
-
I; PU -
R — Function reserved.
I/O USB1_ULPI_D1 — ULPI link bidirectional data
line 1.
-
I
R — Function reserved.
ENET_RXD3 — Ethernet receive data 3 (MII
interface).
I/O GPIO6[6] — General purpose digital input/output pin.
-
R — Function reserved.
O
T3_MAT0 — Match output 0 of timer 3.
I/O SD_DAT3 — SD/MMC data bus line 3.
PC_8
-
I; PU -
R — Function reserved.
I/O USB1_ULPI_D0 — ULPI link bidirectional data
line 0.
-
I
R — Function reserved.
ENET_RX_DV — Ethernet Receive Data Valid
(RMII/MII interface).
I/O GPIO6[7] — General purpose digital input/output pin.
-
R — Function reserved.
O
I
T3_MAT1 — Match output 1 of timer 3.
SD_CD — SD/MMC card detect input.
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
45 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
PC_9
K2
-
-
-
-
-
I; PU -
I
R — Function reserved.
USB1_ULPI_NXT — ULPI link NXT signal. Data flow
control signal from the PHY.
-
I
R — Function reserved.
ENET_RX_ER — Ethernet receive error (MII
interface).
I/O GPIO6[8] — General purpose digital input/output pin.
-
R — Function reserved.
O
O
T3_MAT2 — Match output 2 of timer 3.
SD_POW — SD/MMC power monitor output.
R — Function reserved.
[3]
PC_10
M5
-
-
-
-
-
I; PU -
O
USB1_ULPI_STP — ULPI link STP signal. Asserted
to end or interrupt transfers to the PHY.
I
U1_DSR — Data Set Ready input for UART1.
R — Function reserved.
-
I/O GPIO6[9] — General purpose digital input/output pin.
-
R — Function reserved.
O
T3_MAT3 — Match output 3 of timer 3.
I/O SD_CMD — SD/MMC command signal.
[3]
PC_11
L5
-
-
-
-
-
I; PU -
R — Function reserved.
I
USB1_ULPI_DIR — ULPI link DIR signal. Controls
the ULP data line direction.
I
U1_DCD — Data Carrier Detect input for UART1.
R — Function reserved.
-
I/O GPIO6[10] — General purpose digital input/output
pin.
-
-
R — Function reserved.
R — Function reserved.
I/O SD_DAT4 — SD/MMC data bus line 4.
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
46 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
PC_12
L6
-
-
-
-
-
I; PU -
-
R — Function reserved.
R — Function reserved.
O
U1_DTR — Data Terminal Ready output for UART1.
Can also be configured to be an RS-485/EIA-485
output enable signal for UART1.
-
R — Function reserved.
I/O GPIO6[11] — General purpose digital input/output
pin.
-
R — Function reserved.
I/O I2S0_TX_SDA — I2S transmit data. It is driven by the
transmitter and read by the receiver. Corresponds to
the signal SD in the I2S-bus specification.
I/O SD_DAT5 — SD/MMC data bus line 5.
[3]
PC_13
M1
-
-
-
-
-
I; PU -
R — Function reserved.
-
R — Function reserved.
O
-
U1_TXD — Transmitter output for UART1.
R — Function reserved.
I/O GPIO6[12] — General purpose digital input/output
pin.
-
R — Function reserved.
I/O I2S0_TX_WS — Transmit Word Select. It is driven by
the master and received by the slave. Corresponds
to the signal WS in the I2S-bus specification.
I/O SD_DAT6 — SD/MMC data bus line 6.
[3]
PC_14
N1
-
-
-
-
-
I; PU -
R — Function reserved.
-
I
R — Function reserved.
U1_RXD — Receiver input for UART1.
R — Function reserved.
-
I/O GPIO6[13] — General purpose digital input/output
pin.
-
R — Function reserved.
O
ENET_TX_ER — Ethernet Transmit Error (MII
interface).
I/O SD_DAT7 — SD/MMC data bus line 7.
LPC1850_30_20_10
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
47 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
PD_0
N2
-
-
-
-
-
I; PU -
R — Function reserved.
O
CTOUT_15 — SCT output 15. Match output 3 of
timer 3.
O
-
EMC_DQMOUT2 — Data mask 2 used with SDRAM
and static devices.
R — Function reserved.
I/O GPIO6[14] — General purpose digital input/output
pin.
-
R — Function reserved.
-
R — Function reserved.
-
I; PU -
-
R — Function reserved.
[3]
PD_1
P1
-
-
-
-
-
R — Function reserved.
R — Function reserved.
O
EMC_CKEOUT2 — SDRAM clock enable 2.
R — Function reserved.
-
I/O GPIO6[15] — General purpose digital input/output
pin.
O
-
SD_POW — SD/MMC power monitor output.
R — Function reserved.
-
R — Function reserved.
[3]
PD_2
R1
-
-
-
-
-
I; PU -
R — Function reserved.
O
CTOUT_7 — SCT output 7. Match output 3 of
timer 1.
I/O EMC_D16 — External memory data line 16.
R — Function reserved.
-
I/O GPIO6[16] — General purpose digital input/output
pin.
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
48 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
[3]
[3]
PD_3
P4
T2
P6
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
I; PU -
R — Function reserved.
O
CTOUT_6 — SCT output 7. Match output 2 of
timer 1.
I/O EMC_D17 — External memory data line 17.
R — Function reserved.
-
I/O GPIO6[17] — General purpose digital input/output
pin.
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
-
-
PD_4
I; PU -
O
CTOUT_8 — SCT output 8. Match output 0 of
timer 2.
I/O EMC_D18 — External memory data line 18.
R — Function reserved.
-
I/O GPIO6[18] — General purpose digital input/output
pin.
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
-
-
PD_5
I; PU -
O
CTOUT_9 — SCT output 9. Match output 1 of
timer 2.
I/O EMC_D19 — External memory data line 19.
R — Function reserved.
-
I/O GPIO6[19] — General purpose digital input/output
pin.
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
LPC1850_30_20_10
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
49 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
PD_6
R6
-
-
68
-
-
I; PU -
R — Function reserved.
O
CTOUT_10 — SCT output 10. Match output 2 of
timer 2.
I/O EMC_D20 — External memory data line 20.
R — Function reserved.
-
I/O GPIO6[20] — General purpose digital input/output
pin.
-
R — Function reserved.
-
R — Function reserved.
-
I; PU -
I
R — Function reserved.
[3]
[3]
[3]
PD_7
PD_8
PD_9
T6
-
-
-
-
-
-
72
74
84
-
-
-
-
-
-
R — Function reserved.
CTIN_5 — SCT input 5. Capture input 2 of timer 2.
I/O EMC_D21 — External memory data line 21.
R — Function reserved.
-
I/O GPIO6[21] — General purpose digital input/output
pin.
-
R — Function reserved.
-
R — Function reserved.
-
I; PU -
I
R — Function reserved.
P8
R — Function reserved.
CTIN_6 — SCT input 6. Capture input 1 of timer 3.
I/O EMC_D22 — External memory data line 22.
R — Function reserved.
-
I/O GPIO6[22] — General purpose digital input/output
pin.
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
-
-
T11
I; PU -
O
CTOUT_13 — SCT output 13. Match output 1 of
timer 3.
I/O EMC_D23 — External memory data line 23.
R — Function reserved.
-
I/O GPIO6[23] — General purpose digital input/output
pin.
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
LPC1850_30_20_10
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
50 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
PD_10
P11
-
-
86
-
-
I; PU -
I
R — Function reserved.
CTIN_1 — SCT input 1. Capture input 1 of timer 0.
Capture input 1 of
timer 2.
O
EMC_BLS3 — LOW active Byte Lane select signal
3.
-
R — Function reserved.
I/O GPIO6[24] — General purpose digital input/output
pin.
-
R — Function reserved.
-
R — Function reserved.
-
I; PU -
-
R — Function reserved.
[3]
PD_11
N9
x
-
88
-
-
R — Function reserved.
R — Function reserved.
O
EMC_CS3 — LOW active Chip Select 3 signal.
R — Function reserved.
-
I/O GPIO6[25] — General purpose digital input/output
pin.
I/O USB1_ULPI_D0 — ULPI link bidirectional data line
0.
O
-
CTOUT_14 — SCT output 14. Match output 2 of
timer 3.
R — Function reserved.
[3]
PD_12
N11
x
-
94
-
-
I; PU -
R — Function reserved.
-
R — Function reserved.
O
-
EMC_CS2 — LOW active Chip Select 2 signal.
R — Function reserved.
I/O GPIO6[26] — General purpose digital input/output
pin.
-
R — Function reserved.
O
CTOUT_10 — SCT output 10. Match output 2 of
timer 2.
-
R — Function reserved.
LPC1850_30_20_10
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
51 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
PD_13
T14
x
-
97
-
-
I; PU -
I
R — Function reserved.
CTIN_0 — SCT input 0. Capture input 0 of timer 0, 1,
2, 3.
O
EMC_BLS2 — LOW active Byte Lane select signal
2.
-
R — Function reserved.
I/O GPIO6[27] — General purpose digital input/output
pin.
-
R — Function reserved.
O
CTOUT_13 — SCT output 13. Match output 1 of
timer 3.
-
R — Function reserved.
[3]
PD_14
R13
x
-
99
-
-
I; PU -
R — Function reserved.
-
R — Function reserved.
O
-
EMC_DYCS2 — SDRAM chip select 2.
R — Function reserved.
I/O GPIO6[28] — General purpose digital input/output
pin.
-
R — Function reserved.
O
CTOUT_11 — SCT output 11. Match output 3 of
timer 2.
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
[3]
PD_15
T15
x
-
101
-
-
I; PU -
-
I/O EMC_A17 — External memory address line 17.
R — Function reserved.
-
I/O GPIO6[29] — General purpose digital input/output
pin.
I
SD_WP — SD/MMC card write protect input.
O
CTOUT_8 — SCT output 8. Match output 0 of
timer 2.
-
R — Function reserved.
LPC1850_30_20_10
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
52 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
PD_16
R14
x
-
104
-
-
I; PU -
-
R — Function reserved.
R — Function reserved.
I/O EMC_A16 — External memory address line 16.
R — Function reserved.
-
I/O GPIO6[30] — General purpose digital input/output
pin.
O
O
SD_VOLT2 — SD/MMC bus voltage select output 2.
CTOUT_12 — SCT output 12. Match output 0 of
timer 3.
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
[3]
[3]
[3]
PE_0
PE_1
PE_2
P14
N14
M14
x
x
x
-
-
-
106
112
115
-
-
-
-
-
-
I; PU -
-
-
I/O EMC_A18 — External memory address line 18.
I/O GPIO7[0] — General purpose digital input/output pin.
O
-
CAN1_TD — CAN1 transmitter output.
R — Function reserved.
-
R — Function reserved.
I; PU -
R — Function reserved.
-
-
R — Function reserved.
R — Function reserved.
I/O EMC_A19 — External memory address line 19.
I/O GPIO7[1] — General purpose digital input/output pin.
I
CAN1_RD — CAN1 receiver input.
R — Function reserved.
-
-
R — Function reserved.
I; PU I
ADCTRIG0 — ADC trigger input 0.
CAN0_RD — CAN receiver input.
R — Function reserved.
I
-
I/O EMC_A20 — External memory address line 20.
I/O GPIO7[2] — General purpose digital input/output pin.
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
LPC1850_30_20_10
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
53 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
[3]
[3]
PE_3
K12
K13
N16
x
x
-
-
-
-
118
120
122
-
-
-
-
-
-
I; PU -
R — Function reserved.
O
CAN0_TD — CAN transmitter output.
ADCTRIG1 — ADC trigger input 1.
I
I/O EMC_A21 — External memory address line 21.
I/O GPIO7[3] — General purpose digital input/output pin.
-
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
PE_4
I; PU -
R — Function reserved.
I
NMI — External interrupt input to NMI.
R — Function reserved.
-
I/O EMC_A22 — External memory address line 22.
I/O GPIO7[4] — General purpose digital input/output pin.
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
-
-
PE_5
I; PU -
O
CTOUT_3 — SCT output 3. Match output 3 of
timer 0.
O
U1_RTS — Request to Send output for UART1. Can
also be configured to be an RS-485/EIA-485 output
enable signal for UART1.
I/O EMC_D24 — External memory data line 24.
I/O GPIO7[5] — General purpose digital input/output pin.
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
-
-
[3]
PE_6
M16
-
-
124
-
-
I; PU -
O
CTOUT_2 — SCT output 2. Match output 2 of
timer 0.
I
U1_RI — Ring Indicator input for UART1.
I/O EMC_D25 — External memory data line 25.
I/O GPIO7[6] — General purpose digital input/output pin.
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
LPC1850_30_20_10
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
54 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
PE_7
F15
-
-
149
-
-
I; PU -
R — Function reserved.
O
CTOUT_5 — SCT output 5. Match output 1 of
timer 1.
I
U1_CTS — Clear to Send input for UART1.
I/O EMC_D26 — External memory data line 26.
I/O GPIO7[7] — General purpose digital input/output pin.
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
-
-
[3]
PE_8
F14
-
-
150
-
-
I; PU -
O
CTOUT_4 — SCT output 4. Match output 0 of
timer 0.
I
U1_DSR — Data Set Ready input for UART1.
I/O EMC_D27 — External memory data line 27.
I/O GPIO7[8] — General purpose digital input/output pin.
-
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
[3]
PE_9
E16
-
-
152
-
-
I; PU -
R — Function reserved.
I
I
CTIN_4 — SCT input 4. Capture input 2 of timer 1.
U1_DCD — Data Carrier Detect input for UART1.
I/O EMC_D28 — External memory data line 28.
I/O GPIO7[9] — General purpose digital input/output pin.
-
R — Function reserved.
-
R — Function reserved.
-
I; PU -
I
R — Function reserved.
[3]
PE_10
E14
-
-
154
-
-
R — Function reserved.
CTIN_3 — SCT input 3. Capture input 1 of timer 1.
O
U1_DTR — Data Terminal Ready output for UART1.
Can also be configured to be an RS-485/EIA-485
output enable signal for UART1.
I/O EMC_D29 — External memory data line 29.
I/O GPIO7[10] — General purpose digital input/output
pin.
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
LPC1850_30_20_10
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
55 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
[3]
[3]
PE_11
D16
D15
G14
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
I; PU -
R — Function reserved.
O
CTOUT_12 — SCT output 12. Match output 0 of
timer 3.
O
U1_TXD — Transmitter output for UART1.
I/O EMC_D30 — External memory data line 30.
I/O GPIO7[11] — General purpose digital input/output
pin.
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
-
-
PE_12
I; PU -
O
CTOUT_11 — SCT output 11. Match output 3 of
timer 2.
I
U1_RXD — Receiver input for UART1.
I/O EMC_D31 — External memory data line 31.
I/O GPIO7[12] — General purpose digital input/output
pin.
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
-
-
PE_13
I; PU -
O
CTOUT_14 — SCT output 14. Match output 2 of
timer 3.
I/O I2C1_SDA — I2C1 data input/output (this pin does
not use a specialized I2C pad).
O
EMC_DQMOUT3 — Data mask 3 used with SDRAM
and static devices.
I/O GPIO7[13] — General purpose digital input/output
pin.
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
LPC1850_30_20_10
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
56 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
PE_14
C15
-
-
-
-
-
I; PU -
R — Function reserved.
-
-
R — Function reserved.
R — Function reserved.
O
EMC_DYCS3 — SDRAM chip select 3.
I/O GPIO7[14] — General purpose digital input/output
pin.
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
R — Function reserved.
-
-
[3]
PE_15
E13
-
-
-
-
-
I; PU -
O
CTOUT_0 — SCT output 0. Match output 0 of
timer 0.
I/O I2C1_SCL — I2C1 clock input/output (this pin does
not use a specialized I2C pad).
O
EMC_CKEOUT3 — SDRAM clock enable 3.
I/O GPIO7[15] — General purpose digital input/output
pin.
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
[3]
PF_0
D12
-
-
159
-
-
O;
I/O SSP0_SCK — Serial clock for SSP0.
PU
I
GP_CLKIN — General purpose clock input to the
CGU.
-
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
O
I2S1_TX_MCLK — I2S1 transmit master clock.
[3]
PF_1
E11
-
-
-
-
-
I; PU -
-
R — Function reserved.
R — Function reserved.
I/O SSP0_SSEL — Slave Select for SSP0.
R — Function reserved.
-
I/O GPIO7[16] — General purpose digital input/output
pin.
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
LPC1850_30_20_10
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
57 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[3]
[3]
[3]
PF_2
D11
E10
D10
-
-
168
-
-
I; PU -
R — Function reserved.
O
U3_TXD — Transmitter output for USART3.
I/O SSP0_MISO — Master In Slave Out for SSP0.
R — Function reserved.
-
I/O GPIO7[17] — General purpose digital input/output
pin.
-
R — Function reserved.
-
R — Function reserved.
-
I; PU -
I
R — Function reserved.
PF_3
-
-
170
-
-
R — Function reserved.
U3_RXD — Receiver input for USART3.
I/O SSP0_MOSI — Master Out Slave in for SSP0.
R — Function reserved.
-
I/O GPIO7[18] — General purpose digital input/output
pin.
-
-
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
PF_4
x
H4 172 120 83
O;
I/O SSP1_SCK — Serial clock for SSP1.
PU
I
GP_CLKIN — General purpose clock input to the
CGU.
O
-
TRACECLK — Trace clock.
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
O
I2S0_TX_MCLK — I2S transmit master clock.
I/O I2S0_RX_SCK — I2S receive clock. It is driven by
the master and received by the slave. Corresponds
to the signal SCK in the I2S-bus specification.
LPC1850_30_20_10
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
58 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[6]
PF_5
E9
-
-
190
-
-
I; PU -
R — Function reserved.
I/O U3_UCLK — Serial clock input/output for USART3 in
synchronous mode.
I/O SSP1_SSEL — Slave Select for SSP1.
O
TRACEDATA[0] — Trace data, bit 0.
I/O GPIO7[19] — General purpose digital input/output
pin.
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
ADC1_4 — ADC1, input channel 4.
R — Function reserved.
-
-
I
[6]
PF_6
E7
-
-
192
-
-
I; PU -
I/O U3_DIR — RS-485/EIA-485 output enable/direction
control for USART3.
I/O SSP1_MISO — Master In Slave Out for SSP1.
O
TRACEDATA[1] — Trace data, bit 1.
I/O GPIO7[20] — General purpose digital input/output
pin.
-
-
R — Function reserved.
R — Function reserved.
I/O I2S1_TX_SDA — I2S1 transmit data. It is driven by
the transmitter and read by the receiver. Corresponds
to the signal SD in the I2S-bus specification.
I
ADC1_3 — ADC1, input channel 3.
R — Function reserved.
[6]
PF_7
B7
-
-
193
-
-
I; PU -
I/O U3_BAUD — Baud pin USART3.
I/O SSP1_MOSI — Master Out Slave in for SSP1.
O
TRACEDATA[2] — Trace data, bit 2.
I/O GPIO7[21] — General purpose digital input/output
pin.
-
-
R — Function reserved.
R — Function reserved.
I/O I2S1_TX_WS — Transmit Word Select. It is driven by
the master and received by the slave. Corresponds
to the signal WS in the I2S-bus specification.
I/O ADC1_7 — ADC1, input channel 7 or band gap
output.
LPC1850_30_20_10
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
59 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[6]
PF_8
E6
-
-
-
-
-
I; PU -
R — Function reserved.
I/O U0_UCLK — Serial clock input/output for USART0 in
synchronous mode.
I
CTIN_2 — SCT input 2. Capture input 2 of timer 0.
TRACEDATA[3] — Trace data, bit 3.
O
I/O GPIO7[22] — General purpose digital input/output
pin.
-
R — Function reserved.
R — Function reserved.
R — Function reserved.
ADC0_2 — ADC0, input channel 2.
R — Function reserved.
-
-
I
[6]
PF_9
D6
-
-
203
-
-
I; PU -
I/O U0_DIR — RS-485/EIA-485 output enable/direction
control for USART0.
O
CTOUT_1 — SCT output 1. Match output 1 of
timer 0.
-
R — Function reserved.
I/O GPIO7[23] — General purpose digital input/output
pin.
-
R — Function reserved.
-
R — Function reserved.
-
I
R — Function reserved.
ADC1_2 — ADC1, input channel 2.
R — Function reserved.
[6]
PF_10
A3
-
-
205
-
98
I; PU -
O
U0_TXD — Transmitter output for USART0.
R — Function reserved.
-
-
R — Function reserved.
I/O GPIO7[24] — General purpose digital input/output
pin.
-
I
-
I
R — Function reserved.
SD_WP — SD/MMC card write protect input.
R — Function reserved.
ADC0_5 — ADC0, input channel 5.
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32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[6]
PF_11
A2
-
-
207
-
100
I; PU -
R — Function reserved.
I
U0_RXD — Receiver input for USART0.
R — Function reserved.
-
-
R — Function reserved.
I/O GPIO7[25] — General purpose digital input/output
pin.
-
R — Function reserved.
O
-
SD_VOLT2 — SD/MMC bus voltage select output 2.
R — Function reserved.
I
ADC1_5 — ADC1, input channel 5.
Clock pins
[5]
CLK0
N5
x
K3
62
45
31
O;
PU
O
O
-
EMC_CLK0 — SDRAM clock 0.
CLKOUT — Clock output pin.
R — Function reserved.
-
R — Function reserved.
I/O SD_CLK — SD/MMC card clock.
O
EMC_CLK01 — SDRAM clock 0 and clock 1
combined.
I/O SSP1_SCK — Serial clock for SSP1.
I
ENET_TX_CLK (ENET_REF_CLK) — Ethernet
Transmit Clock (MII interface) or Ethernet Reference
Clock (RMII interface).
[5]
CLK1
T10
x
-
-
-
-
O;
PU
O
O
-
EMC_CLK1 — SDRAM clock 1.
CLKOUT — Clock output pin.
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
O
-
CGU_OUT0 — CGU spare clock output 0.
R — Function reserved.
O
I2S1_TX_MCLK — I2S1 transmit master clock.
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32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[5]
CLK2
D14
x
K6
141 99
68
O;
PU
O
O
-
EMC_CLK3 — SDRAM clock 3.
CLKOUT — Clock output pin.
R — Function reserved.
-
R — Function reserved.
I/O SD_CLK — SD/MMC card clock.
O
EMC_CLK23 — SDRAM clock 2 and clock 3
combined.
O
I2S0_TX_MCLK — I2S transmit master clock.
I/O I2S1_RX_SCK — Receive Clock. It is driven by the
master and received by the slave. Corresponds to
the signal SCK in the I2S-bus specification.
[5]
CLK3
P12
x
-
-
-
-
O;
PU
O
O
-
EMC_CLK2 — SDRAM clock 2.
CLKOUT — Clock output pin.
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
O
-
CGU_OUT1 — CGU spare clock output 1.
R — Function reserved.
I/O I2S1_RX_SCK — Receive Clock. It is driven by the
master and received by the slave. Corresponds to
the signal SCK in the I2S-bus specification.
Debug pins
[3]
[3]
DBGEN
L4
x
x
A6
41
28
27
18
17
I
I
I
JTAG interface control signal. Also used for boundary
scan.
TCK/SWDCLK J5
H2 38
B4 42
I; F
Test Clock for JTAG interface (default) or Serial Wire
(SW) clock.
[3]
[3]
TRST
M4
K6
x
x
29
30
19
20
I; PU I
I; PU I
Test Reset for JTAG interface.
TMS/SWDIO
C4 44
H3 46
G3 35
Test Mode Select for JTAG interface (default) or SW
debug data input/output.
[3]
[3]
TDO/SWO
K5
J4
x
x
31
26
21
16
O
O
Test Data Out for JTAG interface (default) or SW
trace output.
TDI
I; PU I
Test Data In for JTAG interface.
USB0 pins
USB0_DP
USB0_DM
USB0_VBUS
[7]
[7]
F2
G2
F1
x
x
x
E1
E2
E3
26
28
29
18
20
21
9
-
-
-
I/O USB0 bidirectional D+ line.
11
12
I/O USB0 bidirectional D line.
[7]
[8]
I/O VBUS pin (power on USB cable). This pin includes
an internal pull-down resistor of 64 k (typical)
16 k.
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32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[9]
[9]
USB0_ID
H2
H1
x
x
F1
30
32
22
24
13
15
-
-
I
Indicates to the transceiver whether connected as an
A-device (USB0_ID LOW) or B-device (USB0_ID
HIGH). For OTG, this pin has an internal pull-up
resistor.
USB0_RREF
F3
E9
12.0 k (accuracy 1 %) on-board resistor to ground
for current reference.
USB1 pins
USB1_DP
USB1_DM
I2C-bus pins
I2C0_SCL
[10]
[10]
F12
G12
x
x
129 89
59
60
-
-
I/O USB1 bidirectional D+ line.
E10 130 90
I/O USB1 bidirectional D line.
[11]
[11]
L15
L16
x
x
D6 132 92
62
63
I; F I/O I2C clock input/output. Open-drain output (for I2C-bus
compliance).
I; F I/O I2C data input/output. Open-drain output (for I2C-bus
compliance).
I2C0_SDA
E6
B6
133 93
Reset and wake-up pins
[12]
RESET
D9
x
185 128 91
187 130 93
I; IA
I
External reset input: A LOW on this pin resets the
device, causing I/O ports and peripherals to take on
their default states, and processor execution to begin
at address 0.
[12]
[12]
[12]
[12]
WAKEUP0
WAKEUP1
WAKEUP2
WAKEUP3
ADC pins
A9
x
x
x
x
A4
I; IA
I; IA
I; IA
I; IA
I
I
I
I
External wake-up input; can raise an interrupt and
can cause wake-up from any of the low power
modes.
A10
C9
D8
-
-
-
-
-
-
-
-
-
-
-
-
External wake-up input; can raise an interrupt and
can cause wake-up from any of the low power
modes.
External wake-up input; can raise an interrupt and
can cause wake-up from any of the low power
modes.
External wake-up input; can raise an interrupt and
can cause wake-up from any of the low power
modes.
[9]
[9]
[9]
[9]
[9]
ADC0_0/
ADC1_0/DAC
E3
C3
A4
B5
C6
x
x
x
x
x
A2
A1
B3
A3
-
8
4
6
2
4
1
I; IA
I; IA
I; IA
I; IA
I; IA
I
I
I
I
I
ADC input channel 0. Shared between 10-bit ADC0/1
and DAC.
ADC0_1/
ADC1_1
ADC input channel 1. Shared between 10-bit
ADC0/1.
ADC0_2/
ADC1_2
206 143 99
200 139 96
ADC input channel 2. Shared between 10-bit
ADC0/1.
ADC0_3/
ADC1_3
ADC input channel 3. Shared between 10-bit
ADC0/1.
ADC0_4/
ADC1_4
199 138
-
ADC input channel 4. Shared between 10-bit
ADC0/1.
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32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[9]
[9]
[9]
ADC0_5/
ADC1_5
B3
A5
C5
x
x
x
-
-
-
208 144
204 142
197 136
-
-
-
I; IA
I; IA
I; IA
I
I
I
ADC input channel 5. Shared between 10-bit
ADC0/1.
ADC0_6/
ADC1_6
ADC input channel 6. Shared between 10-bit
ADC0/1.
ADC0_7/
ADC1_7
ADC input channel 7. Shared between 10-bit
ADC0/1.
RTC
[12]
[9]
RTC_ALARM
RTCX1
A11
A8
x
x
C3 186 129 92
-
-
O
I
RTC controlled output.
A5
182 125 88
Input to the RTC 32 kHz ultra-low power oscillator
circuit.
[9]
RTCX2
B8
x
B5
183 126 89
-
O
Output from the RTC 32 kHz ultra-low power
oscillator circuit.
Crystal oscillator pins
[9]
[9]
XTAL1
D1
x
x
B1
18
12
13
5
6
-
-
I
Input to the oscillator circuit and internal clock
generator circuits.
XTAL2
E1
C1 19
O
Output from the oscillator amplifier.
Power and ground pins
USB0_VDDA
3V3_DRIVER
F3
G3
H3
G1
x
x
x
x
D1 24
D2 25
D3 27
16
17
19
23
7
-
-
-
-
-
-
-
-
Separate analog 3.3 V power supply for driver.
USB 3.3 V separate power supply voltage.
USB0
_VDDA3V3
8
USB0_VSSA
_TERM
10
14
Dedicated analog ground for clean reference for
termination resistors.
USB0_VSSA
_REF
F2
B2
31
Dedicated clean analog ground for generation of
reference currents and voltages.
VDDA
VBAT
B4
x
x
198 137 95
-
-
-
-
Analog power supply and ADC reference voltage.
B10
C5 184 127 90
RTC power supply: 3.3 V on this pin supplies power
to the RTC.
VDDREG
VPP
F10,
F9,
L8,
L7
x
E4, 135, 94,
E5, 188, 131,
-
-
Main regulator power supply. Tie the VDDREG and
VDDIO pins to a common power supply to ensure the
same ramp-up time for both supply voltages.
F4
195, 59,
82, 25
33
[13]
E8
x
-
x
x
-
-
-
OTP programming voltage.
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32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2.
Symbol
Description
[13]
VDDIO
D7,
E12,
F7,
x
F10, 6,
K5
5,
-
-
-
I/O power supply. Tie the VDDREG and VDDIO pins
to a common power supply to ensure the same
ramp-up time for both supply voltages.
52, 36,
57, 41,
102, 71,
110, 77,
155, 107,
160, 111,
202 141
F8,
G10,
H10,
J6,
J7,
K7,
L9,
L10,
N7,
N13
VDD
-
-
-
-
-
3,
Power supply for main regulator, I/O, and OTP.
24,
27,
49,
52,
74,
77,
97
[14]
[15]
VSS
G9,
H7,
J10,
J11,
K8
x
x
C8,
D4,
D5,
G8,
J3,
J6
-
-
2,
-
-
-
-
Ground.
Ground.
26,
51,
76
[14]
[15]
VSSIO
C4,
D13,
G6,
G7,
G8,
H8,
H9,
J8,
-
5,
4,
-
56, 40,
109, 76,
157 109
J9,
K9,
K10,
M13,
P7,
P13
VSSA
B2
B9
x
-
C2 196 135 94
-
-
-
-
Analog ground.
n.c.
Not connected
-
-
-
-
-
[1] x = available; - = not pinned out.
[2] I = input, O = output, IA = inactive; PU = pull-up enabled (weak pull-up resistor pulls up pin to VDD(IO)); F = floating. Reset state reflects
the pin state at reset without boot code operation.
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32-bit ARM Cortex-M3 microcontroller
[3] 5 V tolerant pad with 15 ns glitch filter (5 V tolerant if VDD(IO) present; if VDD(IO) not present, do not exceed 3.3 V); provides digital I/O
functions with TTL levels and hysteresis; normal drive strength (see Figure 39).
[4] 5 V tolerant pad with 15 ns glitch filter (5 V tolerant if VDD(IO) present; if VDD(IO) not present, do not exceed 3.3 V); provides digital I/O
functions with TTL levels, and hysteresis; high drive strength (see Figure 39).
[5] 5 V tolerant pad with 15 ns glitch filter (5 V tolerant if VDD(IO) present; if VDD(IO) not present, do not exceed 3.3 V); provides high-speed
digital I/O functions with TTL levels and hysteresis (see Figure 39).
[6] 5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input or output (5 V tolerant if VDD(IO) present;
if VDD(IO) not present, do not exceed 3.3 V). When configured as a ADC input or DAC output, the pin is not 5 V tolerant and the digital
section of the pad must be disabled by setting the pin to an input function and disabling the pull-up resistor through the pin’s SFSP
register.
[7] 5 V tolerant transparent analog pad.
[8] For maximum load CL = 6.5 F and maximum pull-down resistance Rpd = 80 k, the VBUS signal takes about 2 s to fall from VBUS =
5 V to VBUS = 0.2 V when it is no longer driven.
[9] Transparent analog pad. Not 5 V tolerant.
[10] Pad provides USB functions. 5 V tolerant if VDD(IO) present; if VDD(IO) not present do not exceed 3.3 V. It is designed in accordance with
the USB specification, revision 2.0 (Full-speed and Low-speed mode only).
[11] Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus Fast Mode Plus specification. This pad requires an external pull-up to
provide output functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines.
[12] 5 V tolerant pad with 20 ns glitch filter; provides digital I/O functions with open-drain output with weak pull-up resistor and hysteresis
(see Figure 40).
[13] On the TFBGA100 and LQFP208 packages, VPP is internally connected to VDDIO.
[14] On the LQFP144/208 packages, VSSIO and VSS are connected to a common ground plane.
[15] On the TFBGA100 and LQFP100/208 packages, VSS is internally connected to VSSIO.
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32-bit ARM Cortex-M3 microcontroller
7. Functional description
7.1 Architectural overview
The ARM Cortex-M3 includes three AHB-Lite buses: the system bus, the I-CODE bus,
and the D-code bus. The I-CODE and D-code core buses allow for concurrent code and
data accesses from different slave ports.
The LPC1850/30/20/10 use a multi-layer AHB matrix to connect the ARM Cortex-M3
buses and other bus masters to peripherals in a flexible manner that optimizes
performance by allowing peripherals that are on different slave ports of the matrix to be
accessed simultaneously by different bus masters.
7.2 ARM Cortex-M3 processor
The ARM Cortex-M3 is a general purpose, 32-bit microprocessor, which offers high
performance and very low power consumption. The ARM Cortex-M3 offers many new
features, including a Thumb-2 instruction set, low interrupt latency, hardware multiply and
divide, interruptable/continuable multiple load and store instructions, automatic state save
and restore for interrupts, tightly integrated interrupt controller with wake-up interrupt
controller, and multiple core buses capable of simultaneous accesses.
Pipeline techniques are employed so that all parts of the processing and memory systems
can operate continuously. Typically, while one instruction is being executed, its successor
is being decoded, and a third instruction is being fetched from memory.
The ARM Cortex-M3 processor is described in detail in the Cortex-M3 Technical
Reference Manual.
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32-bit ARM Cortex-M3 microcontroller
7.3 AHB multilayer matrix
TEST/DEBUG
INTERFACE
ARM
CORTEX-M3
SD/
MMC
(1)
(1)
(1)
(1)
GPDMA
1
ETHERNET
USB0
USB1
LCD
masters
System
bus
I-code D-code
bus
0
bus
slaves
64 kB ROM
64/96 kB LOCAL SRAM
40 kB LOCAL SRAM
32 kB AHB SRAM
(1)
16 kB AHB SRAM
16 kB AHB SRAM
SPIFI
EXTERNAL
MEMORY
CONTROLLER
AHB REGISTER
INTERFACES,
APB, RTC DOMAIN
PERIPHERALS
AHB MULTILAYER MATRIX
= master-slave connection
002aag550
(1) Not available on all parts (see Table 2).
Fig 8. AHB multilayer matrix master and slave connections
7.4 Nested Vectored Interrupt Controller (NVIC)
The NVIC is an integral part of the Cortex-M3. The tight coupling to the CPU allows for low
interrupt latency and efficient processing of late arriving interrupts.
7.4.1 Features
• Controls system exceptions and peripheral interrupts.
• In the LPC1850/30/20/10, the NVIC supports 32 vectored interrupts.
• 8 programmable interrupt priority levels, with hardware priority level masking.
• Relocatable vector table.
• Non-Maskable Interrupt (NMI).
• Software interrupt generation.
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32-bit ARM Cortex-M3 microcontroller
7.4.2 Interrupt sources
Each peripheral device has one interrupt line connected to the NVIC but may have several
interrupt flags. Individual interrupt flags may also represent more than one interrupt
source.
7.5 Event router
The event router combines various internal signals, interrupts, and the external interrupt
pins (WAKEUP[3:0]) to create an interrupt in the NVIC if enabled and to create a wake-up
signal to the ARM core and the CCU for waking up from Sleep, Deep-sleep, Power-down,
and Deep power-down modes. Individual events can be configured as edge or level
sensitive and can be enabled or disabled in the event router. The event router can be
battery powered.
The following events if enabled in the event router can create a wake-up signal and/or an
interrupt:
• External pins WAKEUP0/1/2/3 and RESET
• Alarm timer, RTC, WWDT, BOD interrupts
• C_CAN and QEI interrupts
• Ethernet, USB0, USB1 signals
• Selected outputs of combined timers (SCT and timer0/1/3)
7.6 Global Input Multiplexer Array (GIMA)
The GIMA allows to route signals to event-driven peripheral targets like the SCT, timers,
event router, or the ADCs.
7.6.1 Features
• Single selection of a source.
• Signal inversion.
• Can capture a pulse if the input event source is faster than the target clock.
• Synchronization of input event and target clock.
• Single-cycle pulse generation for target.
7.7 System Tick timer (SysTick)
The ARM Cortex-M3 includes a system tick timer (SYSTICK) that is intended to generate
a dedicated SYSTICK exception at a 10 ms interval.
7.8 On-chip static RAM
The LPC1850/30/20/10 support up to 200 kB SRAM with separate bus master access for
higher throughput and individual power control for low power operation.
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32-bit ARM Cortex-M3 microcontroller
7.8.1 ISP (In-System Programming) mode
In-System Programming (ISP) is programming or reprogramming the on-chip SRAM
memory, using the boot loader software and the USART0 serial port. ISP can be used
when the part resides in the end-user board. ISP allows to load data into on-chip SRAM
and execute code from on-chip SRAM.
7.9 Boot ROM
The internal ROM memory is used to store the boot code of the LPC1850/30/20/10. After
a reset, the ARM processor will start its code execution from this memory.
The boot ROM memory includes the following features:
• ROM memory size is 64 kB.
• Supports booting from USART interfaces and external static memory such as NOR
flash, and SPI flash.
• Includes API for OTP programming.
• Includes a flexible USB device stack that supports Human Interface Device (HID),
Mass Storage Class (MSC), and Device Firmware Upgrade (DFU) drivers.
AES capable parts also support:
• CMAC authentication on the boot image.
• Secure booting from an encrypted image. In development mode booting from a plain
text image is possible. Development mode is terminated by programming the AES
key.
• API for AES programming.
Several boot modes are available depending on the values of the OTP bits BOOT_SRC. If
the OTP memory is not programmed or the BOOT_SRC bits are all zero, the boot mode is
determined by the states of the boot pins P2_9, P2_8, P1_2, and P1_1.
Table 4.
Boot mode when OTP BOOT_SRC bits are programmed
Boot mode BOOT_SRC BOOT_SRC BOOT_SRC BOOT_SRC Description
bit 3
bit 2
bit 1
bit 0
Pin state
USART0
EMC 8-bit
EMC 16-bit
EMC 32-bit
USB0
0
0
0
0
Boot source is defined by the reset state of P1_1,
P1_2, P2_8, and P2_9 pins. See Table 5.
0
0
0
0
0
0
0
1
1
1
0
1
0
0
1
1
1
0
1
0
Boot from device connected to USART0 using pins
P2_0 and P2_1.
Boot from external static memory (such as NOR
flash) using CS0 and an 8-bit data bus.
Boot from external static memory (such as NOR
flash) using CS0 and a 16-bit data bus.
Boot from external static memory (such as NOR
flash) using CS0 and a 32-bit data bus.
Boot from USB0.
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32-bit ARM Cortex-M3 microcontroller
Table 4.
Boot mode when OTP BOOT_SRC bits are programmed
Boot mode BOOT_SRC BOOT_SRC BOOT_SRC BOOT_SRC Description
bit 3
bit 2
bit 1
bit 0
USB1
0
1
1
0
1
0
1
0
Boot from USB1.
SPI (SSP)
Boot from SPI flash connected to the SSP0
interface on P3_3 (function SSP0_SCK), P3_6
(function SSP0_MISO), P3_7 (function
SSP0_MOSI), and P3_8 (function SSP0_SSEL)[1]
.
USART3
1
0
0
1
Boot from device connected to USART3 using pins
P2_3 and P2_4.
[1] The boot loader programs the appropriate pin function at reset to boot using either SSP0 or SPIFI.
Table 5.
Boot mode when OPT BOOT_SRC bits are zero
Boot mode
Pins
P2_9
LOW
Description
P2_8
P1_2
P1_1
USART0
LOW
LOW
LOW Boot from device connected to USART0
using pins P2_0 and P2_1.
EMC 8-bit
LOW
LOW
LOW
LOW
LOW
HIGH
HIGH
HIGH
LOW
LOW Boot from external static memory (such
as NOR flash) using CS0 and an 8-bit
data bus.
EMC 16-bit
EMC 32-bit
HIGH Boot from external static memory (such
as NOR flash) using CS0 and a 16-bit
data bus.
LOW Boot from external static memory (such
as NOR flash) using CS0 and a 32-bit
data bus.
USB0
LOW
LOW
LOW
HIGH
HIGH
HIGH
LOW
HIGH
HIGH
HIGH Boot from USB0
LOW Boot from USB1.
USB1
SPI (SSP)
HIGH Boot from SPI flash connected to the
SSP0 interface on P3_3 (function
SSP0_SCK), P3_6 (function
SSP0_MISO), P3_7 (function
SSP0_MOSI), and P3_8 (function
SSP0_SSEL)[1]
.
USART3
HIGH
LOW
LOW
LOW Boot from device connected to USART3
using pins P2_3 and P2_4.
[1] The boot loader programs the appropriate pin function at reset to boot using the SSP0.
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32-bit ARM Cortex-M3 microcontroller
7.10 Memory mapping
LPC1850/30/20/10
4 GB
0xFFFF FFFF
reserved
0xE010 0000
ARM private bus
0xE000 0000
reserved
0x8800 0000
SPIFI data
0x8000 0000
256 MB dynamic external memory DYCS3
0x7000 0000
0x6000 0000
256 MB dynamic external memory DYCS2
reserved
0x4400 0000
0x4200 0000
0x4010 2000
peripheral bit band alias region
reserved
reserved
reserved
0x4010 1000
0x4010 0000
reserved
0x400F 8000
0x400F 4000
high-speed GPIO
reserved
reserved
reserved
0x400F 2000
0x400F 1000
0x400F 0000
0x400E 0000
0x400D 0000
0x400C 0000
APB peripherals #3
reserved
APB peripherals #2
reserved
0x400B 0000
0x400A 0000
0x4009 0000
0x4008 0000
0x2000 0000
0x1F00 0000
0x1E00 0000
0x1D00 0000
0x1C00 0000
APB peripherals #1
16 MB static external memory CS3
reserved
16 MB static external memory CS2
16 MB static external memory CS1
APB peripherals #0
16 MB static external memory CS0
reserved
0x4006 0000
0x4005 0000
0x4004 0000
clocking/reset peripherals
RTC domain peripherals
reserved
reserved
0x1800 0000
0x1400 0000
64 MB SPIFI data
0x4001 2000
0x4000 0000
AHB peripherals
1 GB
256 MB dynamic external memory DYCS1
128 MB dynamic external memory DYCS0
reserved
0x3000 0000
0x2800 0000
0x1041 0000
reserved
64 kB ROM
reserved
0x1040 0000
0x1008 A000
0x2400 0000
32 MB AHB SRAM bit banding
reserved
0x2200 0000
0x2001 0000
32 kB + 8 kB local SRAM
(LPC1850/30/20/10)
0x1008 0000
0x1001 8000
0x1001 0000
16 kB AHB SRAM (LPC1850/30/20/10)
16 kB AHB SRAM (LPC1850/30)
16 kB AHB SRAM (LPC1850/30)
reserved
0x2000 C000
0x2000 8000
32 kB local SRAM (LPC1850/30/20)
0x2000 4000
0x2000 0000
64 kB local SRAM
(LPC1850/30/20/10)
16 kB AHB SRAM (LPC1850/30/20/10)
0x1000 0000
local SRAM/
external static memory banks
0x1000 0000
256 MB shadow area
0x0000 0000
0 GB
002aaf228
Fig 9. LPC1850/30/20/10 Memory mapping (overview)
LPC1850_30_20_10
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xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
LPC1850/30/20/10
0x400F 0000
reserved
ADC1
0x400E 5000
0x400E 4000
0x400E 3000
0x400E 2000
0x400E 1000
0xFFFF FFFF
APB3
external memories and
ARM private bus
peripherals
ADC0
0x6000 0000
0x4400 0000
0x4006 0000
0x4005 4000
C_CAN0
DAC
reserved
RGU
reserved
peripheral bit band alias region
reserved
0x4005 3000
0x4005 2000
0x4005 1000
0x4005 0000
clocking
reset control
peripherals
I2C1
0x4200 0000
0x4010 2000
0x4010 1000
0x4010 0000
0x400E 0000
0x400C 8000
CCU2
CCU1
CGU
reserved
reserved
GIMA
0x400C 7000
0x400C 6000
QEI
SSP1
APB2
peripherals
reserved
0x400C 5000
0x400C 4000
0x400C 3000
0x400C 2000
0x400C 1000
0x400F 8000
0x400F 4000
0x400F 2000
reserved
RTC
timer3
high-speed GPIO
reserved
0x4004 7000
0x4004 6000
timer2
OTP controller
event router
CREG
USART3
USART2
0x4004 5000
0x4004 4000
0x4004 3000
0x4004 2000
reserved
0x400F 1000
0x400F 0000
0x400E 0000
0x400D 0000
0x400C 0000
RTC domain
peripherals
reserved
APB3 peripherals
reserved
RI timer
0x400C 0000
0x400B 0000
power mode control
backup registers
alarm timer
reserved
C_CAN1
I2S1
I2S0
0x400A 5000
0x400A 4000
0x400A 3000
0x400A 2000
0x400A 1000
0x4004 1000
0x4004 0000
APB2 peripherals
reserved
APB1
peripherals
0x400B 0000
0x400A 0000
0x4009 0000
0x4008 0000
APB1 peripherals
0x4001 2000
0x4001 0000
ethernet
reserved
LCD
I2C0
reserved
motor control PWM
0x4000 9000
0x4000 8000
0x4000 7000
0x4000 6000
0x400A 0000
APB0 peripherals
0x4008 A000
0x4008 9000
0x4008 8000
0x4008 7000
GPIO GROUP1 interrupt
reserved
USB1
0x4006 0000
0x4005 0000
0x4004 0000
GPIO GROUP0 interrupt
GPIO interrupts
SCU
USB0
clocking/reset peripherals
RTC domain peripherals
reserved
EMC
SD/MMC
SPIFI
0x4000 5000
0x4000 4000
0x4000 3000
0x4000 2000
0x4000 1000
0x4000 0000
AHB
peripherals
0x4008 6000
0x4008 5000
0x4008 4000
0x4008 3000
0x4008 2000
APB0
peripherals
timer1
timer0
0x4001 2000
0x4000 0000
AHB peripherals
DMA
SSP0
reserved
SCT
SRAM memories
external memory banks
UART1 w/ modem
USART0
0x4008 1000
0x4008 0000
0x0000 0000
WWDT
002aaf229
Fig 10. LPC1850/30/20/10 Memory mapping (peripherals)
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
7.11 Security features
7.11.1 AES security engine
The hardware AES security engine can decode data using the AES algorithm in
conjunction with a 128-bit key.
7.11.1.1 Features
• Decoding of external flash data connected to the quad SPI Flash Interface (SPIFI).
• Secure storage of keys.
• Support for CMAC hash calculation to authenticate encrypted data.
• Data is processed in little endian mode. This means that the first byte read from flash
is integrated into the AES codeword as least significant byte. The 16th byte read from
flash is the most significant byte of the first AES codeword.
• AES engine performance of 1 byte/clock cycle.
• DMA transfers supported through the GPDMA.
7.11.2 One-Time Programmable (OTP) memory
The OTP provides 128 bit of memory for general purpose use and two 128-bit non-volatile
memory blocks to store AES keys or other customer data.
7.12 General Purpose I/O (GPIO)
The LPC1850/30/20/10 provides 8 GPIO ports with up to 31 GPIO pins each.
Device pins that are not connected to a specific peripheral function are controlled by the
GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate
registers allow setting or clearing any number of outputs simultaneously. The value of the
output register may be read back as well as the current state of the port pins.
All GPIO pins default to inputs with pull-up resistors enabled on reset.
7.12.1 Features
• Accelerated GPIO functions:
– GPIO registers are located on the AHB so that the fastest possible I/O timing can
be achieved.
– Mask registers allow treating sets of port bits as a group, leaving other bits
unchanged.
– All GPIO registers are byte and half-word addressable.
– Entire port value can be written in one instruction.
• Bit-level set and clear registers allow a single instruction set or clear of any number of
bits in one port.
• Direction control of individual bits.
• All I/O default to inputs after reset.
• Up to eight GPIO pins can be selected from all GPIO pins to create an edge- or
level-sensitive GPIO interrupt request.
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32-bit ARM Cortex-M3 microcontroller
• Two GPIO group interrupts can be triggered by any pin or pins in each port.
7.13 AHB peripherals
7.13.1 State Configurable Timer (SCT) subsystem
The SCT allows a wide variety of timing, counting, output modulation, and input capture
operations. The inputs and outputs of the SCT are shared with the capture and match
inputs/outputs of the 32-bit general purpose counter/timers.
The SCT can be configured as two 16-bit counters or a unified 32-bit counter. In the
two-counter case, in addition to the counter value the following operational elements are
independent for each half:
• State variable
• Limit, halt, stop, and start conditions
• Values of Match/Capture registers, plus reload or capture control values
In the two-counter case, the following operational elements are global to the SCT, but the
last three can use match conditions from either counter:
• Clock selection
• Inputs
• Events
• Outputs
• Interrupts
7.13.1.1 Features
• Two 16-bit counters or one 32-bit counter.
• Counter(s) clocked by bus clock or selected input.
• Up counter(s) or up-down counter(s).
• State variable allows sequencing across multiple counter cycles.
• Event combines input or output condition and/or counter match in a specified state.
• Events control outputs and interrupts.
• Selected event(s) can limit, halt, start, or stop a counter.
• Supports:
– up to 8 inputs (one input connected internally)
– up to 16 outputs
– 16 match/capture registers
– 16 events
– 32 states
7.13.2 General Purpose DMA (GPDMA)
The DMA controller allows peripheral-to memory, memory-to-peripheral,
peripheral-to-peripheral, and memory-to-memory transactions. Each DMA stream
provides unidirectional serial DMA transfers for a single source and destination. For
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32-bit ARM Cortex-M3 microcontroller
example, a bidirectional port requires one stream for transmit and one for receives. The
source and destination areas can each be either a memory region or a peripheral for
master 1, but only memory for master 0.
7.13.2.1 Features
• Eight DMA channels. Each channel can support an unidirectional transfer.
• 16 DMA request lines.
• Single DMA and burst DMA request signals. Each peripheral connected to the DMA
Controller can assert either a burst DMA request or a single DMA request. The DMA
burst size is set by programming the DMA Controller.
• Memory-to-memory, memory-to-peripheral, peripheral-to-memory, and
peripheral-to-peripheral transfers are supported.
• Scatter or gather DMA is supported through the use of linked lists. This means that
the source and destination areas do not have to occupy contiguous areas of memory.
• Hardware DMA channel priority.
• AHB slave DMA programming interface. The DMA Controller is programmed by
writing to the DMA control registers over the AHB slave interface.
• Two AHB bus masters for transferring data. These interfaces transfer data when a
DMA request goes active. Master 1 can access memories and peripherals, master 0
can access memories only.
• 32-bit AHB master bus width.
• Incrementing or non-incrementing addressing for source and destination.
• Programmable DMA burst size. The DMA burst size can be programmed to more
efficiently transfer data.
• Internal four-word FIFO per channel.
• Supports 8, 16, and 32-bit wide transactions.
• Big-endian and little-endian support. The DMA Controller defaults to little-endian
mode on reset.
• An interrupt to the processor can be generated on a DMA completion or when a DMA
error has occurred.
• Raw interrupt status. The DMA error and DMA count raw interrupt status can be read
prior to masking.
7.13.3 SPI Flash Interface (SPIFI)
The SPI Flash Interface (allows low-cost serial flash memories to be connected to the
ARM Cortex-M3 processor with little performance penalty compared to parallel flash
devices with higher pin count.
After a few commands configure the interface at startup, the entire flash content is
accessible as normal memory using byte, halfword, and word accesses by the processor
and/or DMA channels. Erasure and programming are handled by simple sequences of
commands.
Many serial flash devices use a half-duplex command-driven SPI protocol for device setup
and initialization and then move to a half-duplex, command-driven 4-bit protocol for
normal operation. Different serial flash vendors and devices accept or require different
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32-bit ARM Cortex-M3 microcontroller
commands and command formats. SPIFI provides sufficient flexibility to be compatible
with common flash devices and includes extensions to help insure compatibility with future
devices.
7.13.3.1 Features
• Interfaces to serial flash memory in the main memory map.
• Supports classic and 4-bit bidirectional serial protocols.
• Half-duplex protocol compatible with various vendors and devices.
• Quad SPI Flash Interface (SPIFI) with 1-, 2-, or 4-bit data at rates of up to 40 MB per
second.
• Supports DMA access.
7.13.4 SD/MMC card interface
The SD/MMC card interface supports the following modes:
• Secure Digital memory (SD version 3.0)
• Secure Digital I/O (SDIO version 2.0)
• Consumer Electronics Advanced Transport Architecture (CE-ATA version 1.1)
• Multimedia Cards (MMC version 4.4)
7.13.5 External Memory Controller (EMC)
The LPC1850/30/20/10 EMC is a Memory Controller peripheral offering support for
asynchronous static memory devices such as RAM, ROM, and NOR flash. In addition, it
can be used as an interface with off-chip memory-mapped devices and peripherals.
7.13.5.1 Features
• Dynamic memory interface support including single data rate SDRAM.
• Asynchronous static memory device support including RAM, ROM, and NOR flash,
with or without asynchronous page mode.
• Low transaction latency.
• Read and write buffers to reduce latency and to improve performance.
• 8/16/32 data and 24 address lines wide static memory support. On parts LPC1820/10
only 8/16 data lines are available.
• 16 bit and 32 bit wide chip select SDRAM memory support.
• Static memory features include:
– Asynchronous page mode read
– Programmable Wait States
– Bus turnaround delay
– Output enable and write enable delays
– Extended wait
• Four chip selects for synchronous memory and four chip selects for static memory
devices.
• Power-saving modes dynamically control CKE and CLKOUT to SDRAMs.
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• Dynamic memory self-refresh mode controlled by software.
• Controller supports 2048 (A0 to A10), 4096 (A0 to A11), and 8192 (A0 to A12) row
address synchronous memory parts. That is typical 512 MB, 256 MB, and 128 MB
parts, with 4, 8, 16, or 32 data bits per device.
• Separate reset domains allow the for auto-refresh through a chip reset if desired.
Note: Synchronous static memory devices (synchronous burst mode) are not supported.
7.13.6 High-speed USB Host/Device/OTG interface (USB0)
Remark: USB0 is available on parts LPC1850/30/20 (see Table 2).
The USB OTG module allows the part to connect directly to a USB host such as a PC (in
device mode) or to a USB device in host mode.
7.13.6.1 Features
• Contains UTMI+ compliant transceiver (PHY).
• Complies with Universal Serial Bus specification 2.0.
• Complies with USB On-The-Go supplement.
• Complies with Enhanced Host Controller Interface Specification.
• Supports auto USB 2.0 mode discovery.
• Supports all high-speed USB-compliant peripherals.
• Supports all full-speed USB-compliant peripherals.
• Supports software Host Negotiation Protocol (HNP) and Session Request Protocol
(SRP) for OTG peripherals.
• Supports interrupts.
• This module has its own, integrated DMA engine.
7.13.7 High-speed USB Host/Device interface with ULPI (USB1)
Remark: USB1 is available on parts LPC1850/30 (see Table 2).
The USB1 interface can operate as a full-speed USB host/device interface or can connect
to an external ULPI PHY for High-speed operation.
7.13.7.1 Features
• Complies with Universal Serial Bus specification 2.0.
• Complies with Enhanced Host Controller Interface Specification.
• Supports auto USB 2.0 mode discovery.
• Supports all high-speed USB-compliant peripherals if connected to external ULPI
PHY.
• Supports all full-speed USB-compliant peripherals.
• Supports interrupts.
• This module has its own, integrated DMA engine.
7.13.8 LCD controller
Remark: The LCD controller is available on the part LPC1850 only.
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32-bit ARM Cortex-M3 microcontroller
The LCD controller provides all of the necessary control signals to interface directly to a
variety of color and monochrome LCD panels. Both STN (single and dual panel) and TFT
panels can be operated. The display resolution is selectable and can be up to 1024 768
pixels. Several color modes are provided, up to a 24-bit true-color non-palettized mode.
An on-chip 512-byte color palette allows reducing bus utilization (i.e. memory size of the
displayed data) while still supporting a large number of colors.
The LCD interface includes its own DMA controller to allow it to operate independently of
the CPU and other system functions. A built-in FIFO acts as a buffer for display data,
providing flexibility for system timing. Hardware cursor support can further reduce the
amount of CPU time needed to operate the display.
7.13.8.1 Features
• AHB master interface to access frame buffer.
• Setup and control via a separate AHB slave interface.
• Dual 16-deep programmable 64-bit wide FIFOs for buffering incoming display data.
• Supports single and dual-panel monochrome Super Twisted Nematic (STN) displays
with 4-bit or 8-bit interfaces.
• Supports single and dual-panel color STN displays.
• Supports Thin Film Transistor (TFT) color displays.
• Programmable display resolution including, but not limited to: 320 200, 320 240,
640 200, 640 240, 640 480, 800 600, and 1024 768.
• Hardware cursor support for single-panel displays.
• 15 gray-level monochrome, 3375 color STN, and 32 K color palettized TFT support.
• 1, 2, or 4 bits-per-pixel (bpp) palettized displays for monochrome STN.
• 1, 2, 4, or 8 bpp palettized color displays for color STN and TFT.
• 16 bpp true-color non-palettized for color STN and TFT.
• 24 bpp true-color non-palettized for color TFT.
• Programmable timing for different display panels.
• 256 entry, 16-bit palette RAM, arranged as a 128 32-bit RAM.
• Frame, line, and pixel clock signals.
• AC bias signal for STN, data enable signal for TFT panels.
• Supports little and big-endian, and Windows CE data formats.
• LCD panel clock may be generated from the peripheral clock, or from a clock input
pin.
7.13.9 Ethernet
Remark: Ethernet is available on parts LPC1850/30 (see Table 2).
7.13.9.1 Features
• 10/100 Mbit/s
• TCP/IP hardware checksum
• IP checksum
• DMA support
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32-bit ARM Cortex-M3 microcontroller
• Power management remote wake-up frame and magic packet detection
• Supports both full-duplex and half-duplex operation
– Supports CSMA/CD Protocol for half-duplex operation.
– Supports IEEE 802.3x flow control for full-duplex operation.
– Optional forwarding of received pause control frames to the user application in
full-duplex operation.
– Back-pressure support for half-duplex operation.
– Automatic transmission of zero-quanta pause frame on deassertion of flow control
input in full-duplex operation.
• Support for IEEE 1588 time stamping and IEEE 1588 advanced time stamping (IEEE
1588-2008 v2).
7.14 Digital serial peripherals
7.14.1 UART
Remark: The LPC1850/30/20/10 contain one UART with standard transmit and receive
data lines.
UART1 also provides a full modem control handshake interface and support for
RS-485/9-bit mode allowing both software address detection and automatic address
detection using 9-bit mode.
UART1 includes a fractional baud rate generator. Standard baud rates such as 115200 Bd
can be achieved with any crystal frequency above 2 MHz.
7.14.1.1 Features
• Maximum UART data bit rate of 8 MBit/s.
• 16 B Receive and Transmit FIFOs.
• Register locations conform to 16C550 industry standard.
• Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B.
• Built-in fractional baud rate generator covering wide range of baud rates without a
need for external crystals of particular values.
• Auto baud capabilities and FIFO control mechanism that enables software flow
control implementation.
• Equipped with standard modem interface signals. This module also provides full
support for hardware flow control (auto-CTS/RTS).
• Support for RS-485/9-bit/EIA-485 mode (UART1).
• DMA support.
7.14.2 USART
Remark: The LPC1850/30/20/10 contain three USARTs. In addition to standard transmit
and receive data lines, the USARTs support a synchronous mode and a smart card mode.
The USARTs include a fractional baud rate generator. Standard baud rates such as
115200 Bd can be achieved with any crystal frequency above 2 MHz.
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7.14.2.1 Features
• Maximum UART data bit rate of 8 MBit/s.
• 16 B Receive and Transmit FIFOs.
• Register locations conform to 16C550 industry standard.
• Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B.
• Built-in fractional baud rate generator covering wide range of baud rates without a
need for external crystals of particular values.
• Auto baud capabilities and FIFO control mechanism that enables software flow
control implementation.
• Support for RS-485/9-bit/EIA-485 mode.
• USART3 includes an IrDA mode to support infrared communication.
• All USARTs have DMA support.
• Support for synchronous mode at a data bit rate of up to 8 Mbit/s.
• Smart card mode conforming to ISO7816 specification
7.14.3 SSP serial I/O controller
Remark: The LPC1850/30/20/10 contain two SSP controllers.
The SSP controller is capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can
interact with multiple masters and slaves on the bus. Only a single master and a single
slave can communicate on the bus during a given data transfer. The SSP supports full
duplex transfers, with frames of 4 bits to 16 bits of data flowing from the master to the
slave and from the slave to the master. In practice, often only one of these data flows
carries meaningful data.
7.14.3.1 Features
• Maximum SSP speed of <tbd> Mbit/s (master) or <tbd> Mbit/s (slave)
• Compatible with Motorola SPI, 4-wire Texas Instruments SSI, and National
Semiconductor Microwire buses
• Synchronous serial communication
• Master or slave operation
• 8-frame FIFOs for both transmit and receive
• 4-bit to 16-bit frame
• DMA transfers supported by GPDMA
7.14.4 I2C-bus interface
Remark: The LPC1850/30/20/10 each contain two I2C-bus controllers.
The I2C-bus is bidirectional for inter-IC control using only two wires: a Serial Clock line
(SCL) and a Serial Data line (SDA). Each device is recognized by a unique address and
can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the
capability to both receive and send information (such as memory). Transmitters and/or
receivers can operate in either master or slave mode, depending on whether the chip has
to initiate a data transfer or is only addressed. The I2C is a multi-master bus and can be
controlled by more than one bus master connected to it.
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32-bit ARM Cortex-M3 microcontroller
7.14.4.1 Features
• I2C0 is a standard I2C compliant bus interface with open-drain pins. I2C0 also
supports Fast mode plus with bit rates up to 1 Mbit/s.
• I2C1 uses standard I/O pins with bit rates of up to 400 kbit/s (Fast I2C-bus).
• Easy to configure as master, slave, or master/slave.
• Programmable clocks allow versatile rate control.
• Bidirectional data transfer between masters and slaves.
• Multi-master bus (no central master).
• Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus.
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus.
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
• The I2C-bus can be used for test and diagnostic purposes.
• All I2C-bus controllers support multiple address recognition and a bus monitor mode.
7.14.5 I2S interface
Remark: The LPC1850/30/20/10 contain two I2S interfaces.
The I2S-bus provides a standard communication interface for digital audio applications.
The I2S-bus specification defines a 3-wire serial bus using one data line, one clock line,
and one word select signal. The basic I2S-bus connection has one master, which is
always the master, and one slave. The I2S-bus interface provides a separate transmit and
receive channel, each of which can operate as either a master or a slave.
7.14.5.1 Features
• The interface has separate input/output channels each of which can operate in master
or slave mode.
• Capable of handling 8-bit, 16-bit, and 32-bit word sizes.
• Mono and stereo audio data supported.
• The sampling frequency can range from 16 kHz to 192 kHz (16, 22.05, 32, 44.1, 48,
96, 192) kHz.
• Support for an audio master clock.
• Configurable word select period in master mode (separately for I2S-bus input and
output).
• Two 8-word FIFO data buffers are provided, one for transmit and one for receive.
• Generates interrupt requests when buffer levels cross a programmable boundary.
• Two DMA requests, controlled by programmable buffer levels. These are connected
to the GPDMA block.
• Controls include reset, stop and mute options separately for I2S-bus input and I2S-bus
output.
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7.14.6 C_CAN
32-bit ARM Cortex-M3 microcontroller
Remark: The LPC1850/30/20/10 contain two C_CAN controllers.
Controller Area Network (CAN) is the definition of a high performance communication
protocol for serial data communication. The C_CAN controller is designed to provide a full
implementation of the CAN protocol according to the CAN Specification Version 2.0B. The
C_CAN controller allows to build powerful local networks with low-cost multiplex wiring by
supporting distributed real-time control with a very high level of reliability.
7.14.6.1 Features
• Conforms to protocol version 2.0 parts A and B.
• Supports bit rate of up to 1 Mbit/s.
• Supports 32 Message Objects.
• Each Message Object has its own identifier mask.
• Provides programmable FIFO mode (concatenation of Message Objects).
• Provides maskable interrupts.
• Supports Disabled Automatic Retransmission (DAR) mode for time-triggered CAN
applications.
• Provides programmable loop-back mode for self-test operation.
7.15 Counter/timers and motor control
7.15.1 General purpose 32-bit timers/external event counter
Remark: The LPC1850/30/20/10 include four 32-bit timer/counters.
The timer/counter is designed to count cycles of the system derived clock or an
externally-supplied clock. It can optionally generate interrupts, generate timed DMA
requests, or perform other actions at specified timer values, based on four match
registers. Each timer/counter also includes two capture inputs to trap the timer value when
an input signal transitions, optionally generating an interrupt.
7.15.1.1 Features
• A 32-bit timer/counter with a programmable 32-bit prescaler.
• Counter or timer operation.
• Two 32-bit capture channels per timer, that can take a snapshot of the timer value
when an input signal transitions. A capture event may also generate an interrupt.
• Four 32-bit match registers that allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Up to four external outputs corresponding to match registers, with the following
capabilities:
– Set LOW on match.
– Set HIGH on match.
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– Toggle on match.
– Do nothing on match.
• Up to two match registers can be used to generate timed DMA requests.
7.15.2 Motor control PWM
The motor control PWM is a specialized PWM supporting 3-phase motors and other
combinations. Feedback inputs are provided to automatically sense rotor position and use
that information to ramp speed up or down. An abort input is also provided that causes the
PWM to immediately release all motor drive outputs. At the same time, the motor control
PWM is highly configurable for other generalized timing, counting, capture, and compare
applications.
7.15.3 Quadrature Encoder Interface (QEI)
A quadrature encoder, also known as a 2-channel incremental encoder, converts angular
displacement into two pulse signals. By monitoring both the number of pulses and the
relative phase of the two signals, the user can track the position, direction of rotation, and
velocity. In addition, a third channel, or index signal, can be used to reset the position
counter. The quadrature encoder interface decodes the digital pulses from a quadrature
encoder wheel to integrate position over time and determine direction of rotation. In
addition, the QEI can capture the velocity of the encoder wheel.
7.15.3.1 Features
• Tracks encoder position.
• Increments/decrements depending on direction.
• Programmable for 2 or 4 position counting.
• Velocity capture using built-in timer.
• Velocity compare function with “less than” interrupt.
• Uses 32-bit registers for position and velocity.
• Three position compare registers with interrupts.
• Index counter for revolution counting.
• Index compare register with interrupts.
• Can combine index and position interrupts to produce an interrupt for whole and
partial revolution displacement.
• Digital filter with programmable delays for encoder input signals.
• Can accept decoded signal inputs (clk and direction).
7.15.4 Repetitive Interrupt (RI) timer
The repetitive interrupt timer provides a free-running 32-bit counter which is compared to
a selectable value, generating an interrupt when a match occurs. Any bits of the
timer/compare can be masked such that they do not contribute to the match detection.
The repetitive interrupt timer can be used to create an interrupt that repeats at
predetermined intervals.
7.15.4.1 Features
• 32-bit counter. Counter can be free-running or be reset by a generated interrupt.
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32-bit ARM Cortex-M3 microcontroller
• 32-bit compare value.
• 32-bit compare mask. An interrupt is generated when the counter value equals the
compare value, after masking. This allows for combinations not possible with a simple
compare.
7.15.5 Windowed WatchDog Timer (WWDT)
The purpose of the watchdog is to reset the controller if software fails to periodically
service it within a programmable time window.
7.15.5.1 Features
• Internally resets chip if not periodically reloaded during the programmable time-out
period.
• Optional windowed operation requires reload to occur between a minimum and
maximum time period, both programmable.
• Optional warning interrupt can be generated at a programmable time prior to
watchdog time-out.
• Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be
disabled.
• Incorrect feed sequence causes reset or interrupt if enabled.
• Flag to indicate watchdog reset.
• Programmable 24-bit timer with internal prescaler.
• Selectable time period from (Tcy(WDCLK) 256 4) to (Tcy(WDCLK) 224 4) in
multiples of Tcy(WDCLK) 4.
• The Watchdog Clock (WDCLK) uses the IRC as the clock source.
7.16 Analog peripherals
7.16.1 Analog-to-Digital Converter
Remark: The LPC1850/30/20/10 contain two 10-bit ADCs.
7.16.1.1 Features
• 10-bit successive approximation analog to digital converter.
• Input multiplexing among 8 pins.
• Power-down mode.
• Measurement range 0 to VDDA.
• Sampling frequency up to 400 kSamples/s.
• Burst conversion mode for single or multiple inputs.
• Optional conversion on transition on ADCTRIG0 or ADCTRIG1 pins, combined timer
outputs 8 or 15, or the PWM output MCOA2.
• Individual result registers for each A/D channel to reduce interrupt overhead.
• DMA support.
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7.16.2 Digital-to-Analog Converter (DAC)
7.16.2.1 Features
• 10-bit resolution
• Monotonic by design (resistor string architecture)
• Controllable conversion speed
• Low power consumption
7.17 Peripherals in the RTC power domain
7.17.1 RTC
The Real Time Clock (RTC) is a set of counters for measuring time when system power is
on, and optionally when it is off. It uses very little power when its registers are not being
accessed by the CPU, especially reduced power modes. The RTC is clocked by a
separate 32 kHz oscillator that produces a 1 Hz internal time reference and is powered by
its own power supply pin, VBAT.
7.17.1.1 Features
• Measures the passage of time to maintain a calendar and clock. Provides seconds,
minutes, hours, day of month, month, year, day of week, and day of year.
• Ultra-low power design to support battery powered systems. Uses power from the
CPU power supply when it is present.
• Dedicated battery power supply pin.
• RTC power supply is isolated from the rest of the chip.
• Calibration counter allows adjustment to better than 1 sec/day with 1 sec resolution.
• Periodic interrupts can be generated from increments of any field of the time registers.
• Alarm interrupt can be generated for a specific date/time.
7.17.2 Alarm timer
The alarm timer is a 16-bit timer and counts down at 1 kHz from a preset value generating
alarms in intervals of up to 1 min. The counter triggers a status bit when it reaches 0x00
and asserts an interrupt if enabled.
The alarm timer is part of the RTC power domain and can be battery powered.
7.18 System control
7.18.1 Configuration registers (CREG)
The following settings are controlled in the configuration register block:
• BOD trip settings
• Oscillator output
• DMA-to-peripheral muxing
• Ethernet mode
• Memory mapping
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• Timer/USART inputs
• Enabling the USB controllers
In addition, the CREG block contains the part identification and part configuration
information.
7.18.2 System Control Unit (SCU)
The system control unit determines the function and electrical mode of the digital pins. By
default function 0 is selected for all pins with pull-up enabled.
Analog I/Os for the ADCs and the DAC as well as most USB pins are on separate pads
and are not controlled through the SCU.
7.18.3 Clock Generation Unit (CGU)
The Clock Generator Unit (CGU) generates several base clocks. The base clocks can be
unrelated in frequency and phase and can have different clock sources within the CGU.
One CGU base clock is routed to the CLKOUT pins. The base clock that generates the
CPU clock is referred to as CCLK.
Multiple branch clocks are derived from each base clock. The branch clocks offer very
flexible control for power-management purposes. All branch clocks are outputs of one of
two Clock Control Units (CCUs) and can be controlled independently. Branch clocks
derived from the same base clock are synchronous in frequency and phase.
7.18.4 Internal RC oscillator (IRC)
The IRC is used as the clock source for the WWDT and/or as the clock that drives the
PLLs and subsequently the CPU. The nominal IRC frequency is 12 MHz. The IRC is
trimmed to 1 % accuracy over the entire voltage and temperature range.
Upon power-up or any chip reset, the LPC1850/30/20/10 use the IRC as the clock source.
Software may later switch to one of the other available clock sources.
7.18.5 PLL0USB (for USB0)
PLL0 is a dedicated PLL for the USB0 High-speed controller.
PLL0 accepts an input clock frequency from an external oscillator in the range of 14 kHz
to 25 MHz. The input frequency is multiplied up to a high frequency with a Current
Controlled Oscillator (CCO). The CCO operates in the range of 4.3 MHz to 550 MHz.
7.18.6 PLL0AUDIO (for audio)
The audio PLL PLL0AUDIO is a general purpose PLL with a very small step size. This
PLL accepts an input clock frequency derived from an external oscillator or internal IRC.
The input frequency is multiplied up to a high frequency with a Current Controlled
Oscillator (CCO). A sigma-delta converter modulates the PLL divider ratios to obtain the
desired output frequency. The output frequency can be set as a multiple of the sampling
frequency fs to 32fs, 64fs, 128 fs, 256 fs, 384 fs, 512 fs and the sampling
frequency fs can range from 16 kHz to 192 kHz (16, 22.05, 32, 44.1, 48, 96,192) kHz.
Many other frequencies are possible as well.
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7.18.7 System PLL1
The PLL1 accepts an input clock frequency from an external oscillator in the range of
10 MHz to 25 MHz. The input frequency is multiplied up to a high frequency with a Current
Controlled Oscillator (CCO). The multiplier can be an integer value from 1 to 32. The CCO
operates in the range of 156 MHz to 320 MHz, so there is an additional divider in the loop
to keep the CCO within its frequency range while the PLL is providing the desired output
frequency. The output divider may be set to divide by 2, 4, 8, or 16 to produce the output
clock. Since the minimum output divider value is 2, it is insured that the PLL output has a
50 % duty cycle. The PLL is turned off and bypassed following a chip reset and may be
enabled by software. The program must configure and activate the PLL, wait for the PLL
to lock, and then connect to the PLL as a clock source. The PLL settling time is 100 s.
7.18.8 Reset Generation Unit (RGU)
The RGU allows generation of independent reset signals for individual blocks and
peripherals.
7.18.9 Power control
The LPC1850/30/20/10 feature several independent power domains to control power to
the core and the peripherals (see Figure 11). The RTC and its associated peripherals (the
alarm timer, the CREG block, the OTP controller, the back-up registers, and the event
router) are located in the RTC power-domain which can be powered by a battery supply or
the main regulator. A power selector switch ensures that the RTC block is always powered
on.
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32-bit ARM Cortex-M3 microcontroller
LPC18xx
VDDIO
VSS
to I/O pads
to core
REGULATOR
to memories,
peripherals,
oscillators,
PLLs
VDDREG
MAIN POWER DOMAIN
to RTC
ULTRA LOW-POWER
REGULATOR
POWER
SELECTOR
domain
VBAT
peripherals
RESET
WAKEUP0/1/2/3
RESET/WAKE-UP
to RTC I/O
pads (V
CONTROL
)
ps
BACKUP REGISTERS
REAL-TIME CLOCK
RTCX1
RTCX2
32 kHz
OSCILLATOR
ALARM
ALWAYS-ON/RTC POWER DOMAIN
DAC
VDDA
VSSA
ADC
ADC POWER DOMAIN
OTP
VPP
OTP POWER DOMAIN
USB0_VDDA3V3_DRIVER
USB0_VDDA3V3
USB0
USB0 POWER DOMAIN
002aag305
Fig 11. LPC1850/30/20/10 Power domains
The LPC1850/30/20/10 support four reduced power modes: Sleep, Deep-sleep,
Power-down, and Deep power-down.
The LPC1850/30/20/10 can wake up from Deep-sleep, Power-down, and Deep
power-down modes via the WAKEUP[3:0] pins and interrupts generated by battery
powered blocks in the RTC power domain.
7.19 Emulation and debugging
Debug and trace functions are integrated into the ARM Cortex-M3. Serial wire debug and
trace functions are supported in addition to a standard JTAG debug and parallel trace
functions. The ARM Cortex-M3 is configured to support up to eight breakpoints and four
watch points.
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8. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol Parameter Conditions
Min
Max
Unit
VDD(REG)(3V3) regulator supply voltage on pin VDDREG
(3.3 V)
2.2
3.6
V
VDD(IO)
input/output supply
voltage
on pin VDDIO
on pin VDDA
on pin VBAT
2.2
2.2
3.6
3.6
V
V
VDDA(3V3)
analog supply voltage
(3.3 V)
VBAT
battery supply voltage
supply voltage (3.3 V)
2.2
2.2
3.6
3.6
V
V
VDD(3V3)
on pin VDD; LQFP100 package
only
Vprog(pf)
VI
polyfuse programming
voltage
on pin VPP
2.7
3.6
5.5
V
V
[2]
input voltage
only valid when the VDD(IO) supply
voltage is present
0.5
5 V tolerant I/O pins (see
Table 3)
ADC/DAC pins and digital I/O
pins configured for an analog
function (see Table 3)
0.5
VDDA(3V3)
V
USB0 pins (see Table 3)
0
0
5.2
5.2
V
V
USB1 pins USB1_DP and
USB1_DM (see Table 3)
[3]
[3]
IDD
supply current
per supply pin
-
-
-
100
100
100
mA
mA
mA
ISS
ground current
I/O latch-up current
per ground pin
Ilatch
(0.5VDD(IO)) < VI < (1.5VDD(IO));
Tj < 125 C
[4]
[5]
Tstg
storage temperature
65
+150
1.5
C
Ptot(pack)
total power dissipation
(per package)
based on package heat transfer,
not device power consumption
-
W
VESD
electrostatic discharge
voltage
human body model; all pins
2000
+2000
V
[1] The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2] Including voltage on outputs in 3-state mode; at 2.0 V the speed will be reduced.
[3] The peak current is limited to 25 times the corresponding maximum current.
[4] Dependent on package type.
[5] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
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9. Thermal characteristics
The average chip junction temperature, Tj (C), can be calculated using the following
equation:
Tj = Tamb + PD Rthj – a
(1)
• Tamb = ambient temperature (C),
• Rth(j-a) = the package junction-to-ambient thermal resistance (C/W)
• PD = sum of internal and I/O power dissipation
The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
Table 7.
Thermal characteristics
VDD = 2.2 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified;
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Tj(max)
maximum junction
temperature
-
-
125
C
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10. Static characteristics
Table 8.
Static characteristics
T
amb = 40 C to +85 C, unless otherwise specified. Applies to parts LPC1850/30/20/10 Rev ‘A’ only.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
Supply pins
VDD(IO)
input/output supply
voltage
2.2
2.2
2.2
-
-
-
3.6
3.6
3.6
V
V
V
VDD(REG)(3V3)
VDDA(3V3)
regulator supply voltage
(3.3 V)
analog supply voltage
(3.3 V)
on pin VDDA
VBAT
battery supply voltage
supply voltage (3.3 V)
2.2
2.2
-
-
3.6
3.6
V
V
VDD(3V3)
on pin VDD; LQFP100
package only
IDD(REG)(3V3)
regulator supply current Regulator supply active
(3.3 V) mode; code
while(1){}
executed from RAM; all
peripherals disabled
[2][3]
[2][4]
CCLK = 12 MHz; PLL1
disabled
-
-
6.5
-
mA
CCLK = 12 MHz; PLL1
enabled
7.5
25
30
-
-
-
mA
mA
mA
[2][4]
[2][4]
CCLK = 120 MHz
CCLK = 156 MHz
-
-
IDD(REG)(3V3)
regulator supply current Regulator supply low
(3.3 V)
power mode; after
WFE/WFI instruction
executed from RAM; all
peripherals disabled
[2][3]
[2]
sleep mode
-
-
-
-
-
-
-
-
-
-
-
-
-
5.5
75
-
-
-
-
mA
A
A
A
A
A
A
A
A
A
A
A
A
deep-sleep mode
[2]
power-down mode
deep power-down mode
deep-sleep mode
16
[2]
0.02
15
[2][5]
[2][5]
[2][5]
IBAT
battery supply current
I/O supply current
power-down mode
deep power-down mode
deep sleep mode
15
-
-
-
-
-
-
-
-
3
IDD(IO)
1
power-down mode
deep power-down mode
deep sleep mode
1
0.03
0.4
0.4
0.007
[7]
[7]
[7]
IDD(ADC)
ADC supply current
power-down mode
deep power-down mode
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Table 8.
Static characteristics …continued
Tamb = 40 C to +85 C, unless otherwise specified. Applies to parts LPC1850/30/20/10 Rev ‘A’ only.
Symbol
RESET pin
VIH
Parameter
Conditions
Min
Typ[1]
Max
Unit
[6]
[6]
[6]
HIGH-level input
voltage
0.8 (Vps
0.35)
-
-
-
5.5
V
V
V
VIL
LOW-level input voltage
0.5
0.3 (Vps
0.1)
Vhys
hysteresis voltage
0.05 (Vps
0.35)
-
Standard I/O pins - normal drive strength
CI
IIL
input capacitance
-
-
-
2
-
pF
nA
LOW-level input current VI = 0 V; on-chip pull-up
resistor disabled
3
IIH
HIGH-level input
current
VI = VDD(IO); on-chip
pull-down resistor
disabled
-
-
3
-
-
nA
nA
IOZ
OFF-state output
current
VO = 0 V to VDD(IO)
;
3
on-chip pull-up/down
resistors disabled;
absolute value
[8]
VI
input voltage
pin configured to provide
a digital function;
0
-
5.5
V
VDD(IO) 2.2 V
VDD(IO) = 0 V
0
0
-
-
-
3.6
V
V
V
VO
output voltage
output active
VDD(IO)
5.5
VIH
HIGH-level input
voltage
0.7
VDD(IO)
VIL
LOW-level input voltage
0.5
-
0.3
V
VDD(IO)
Vhys
VOH
VOL
IOH
hysteresis voltage
0.1
VDD(IO)
-
-
V
HIGH-level output
voltage
IOH = 6 mA
VDD(IO)
0.4
-
-
V
LOW-level output
voltage
IOL = 6 mA
-
-
0.4
V
HIGH-level output
current
VOH = VDD(IO) 0.4 V
VOL = 0.4 V
6
6
-
-
-
mA
mA
mA
mA
A
IOL
LOW-level output
current
-
-
[9]
[9]
IOHS
IOLS
Ipd
HIGH-level short-circuit drive HIGH; connected to
output current ground
-
86.5
76.5
-
LOW-level short-circuit drive LOW; connected to
output current
-
-
VDD(IO)
[11]
[12]
[13]
pull-down current
VI = 5 V
-
93
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Table 8.
Static characteristics …continued
Tamb = 40 C to +85 C, unless otherwise specified. Applies to parts LPC1850/30/20/10 Rev ‘A’ only.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
[11]
[12]
[13]
Ipu
pull-up current
VI = 0 V
-
62
-
A
VDD(IO) < VI 5 V
-
10
-
A
Rs
series resistance
on I/O pins with analog
function; analog function
enabled
200
I/O pins - high drive strength
CI
IIL
input capacitance
-
-
-
2
-
pF
nA
LOW-level input current VI = 0 V; on-chip pull-up
resistor disabled
3
IIH
HIGH-level input
current
VI = VDD(IO); on-chip
pull-down resistor
disabled
-
-
3
-
-
nA
nA
IOZ
OFF-state output
current
VO = 0 V to VDD(IO)
;
3
on-chip pull-up/down
resistors disabled;
absolute value
[8]
VI
input voltage
pin configured to provide
a digital function;
VDD(IO) 2.2 V
VDD(IO) = 0 V
0
0
0
-
-
-
-
5.5
V
V
V
V
3.6
VO
output voltage
output active
VDD(IO)
5.5
VIH
HIGH-level input
voltage
0.7
VDD(IO)
VIL
Vhys
Ipd
LOW-level input voltage
hysteresis voltage
pull-down current
0.5
-
0.3
VDD(IO)
V
0.1
VDD(IO)
-
-
-
V
[11]
[12]
[13]
VI = VDD(IO)
-
-
-
62
A
[11]
[12]
[13]
Ipu
pull-up current
VI = 0 V
62
-
-
A
A
VDD(IO) < VI 5 V
10
I/O pins - high drive strength: standard drive mode
IOH
HIGH-level output
current
VOH = VDD(IO) 0.4 V
4
4
-
-
-
-
-
-
mA
mA
mA
mA
IOL
LOW-level output
current
VOL = 0.4 V
-
[9]
IOHS
IOLS
HIGH-level short-circuit drive HIGH; connected to
output current ground
32
32
[12]
[9]
LOW-level short-circuit drive LOW; connected to
output current VDD(IO)
-
[12]
I/O pins - high drive strength: medium drive mode
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Table 8.
Static characteristics …continued
Tamb = 40 C to +85 C, unless otherwise specified. Applies to parts LPC1850/30/20/10 Rev ‘A’ only.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
IOH
HIGH-level output
current
VOH = VDD(IO) 0.4 V
8
-
-
mA
IOL
LOW-level output
current
VOL = 0.4 V
8
-
-
-
-
-
mA
mA
mA
[9]
IOHS
IOLS
HIGH-level short-circuit drive HIGH; connected to
output current ground
65
63
[12]
[9]
LOW-level short-circuit drive LOW; connected to
output current VDD(IO)
-
[12]
I/O pins - high drive strength: high drive mode
IOH
HIGH-level output
current
VOH = VDD(IO) 0.4 V
14
-
-
-
-
-
mA
mA
mA
mA
IOL
LOW-level output
current
VOL = 0.4 V
14
-
-
[9]
IOHS
IOLS
HIGH-level short-circuit drive HIGH; connected to
output current ground
113
110
[12]
[9]
LOW-level short-circuit drive LOW; connected to
output current VDD(IO)
-
[12]
I/O pins - high drive strength: ultra-high drive mode
IOH
HIGH-level output
current
VOH = VDD(IO) 0.4 V
20
-
-
-
-
-
mA
mA
mA
mA
IOL
LOW-level output
current
VOL = 0.4 V
20
-
-
[9]
IOHS
HIGH-level short-circuit drive HIGH; connected to
output current ground
165
156
[12]
[9]
IOLS
LOW-level short-circuit drive LOW; connected to
output current
-
[12]
VDD(IO)
I/O pins - high-speed
CI
IIL
input capacitance
-
-
-
2
-
pF
nA
LOW-level input current VI = 0 V; on-chip pull-up
resistor disabled
3
IIH
HIGH-level input
current
VI = VDD(IO); on-chip
pull-down resistor
disabled
-
-
3
-
-
nA
nA
IOZ
OFF-state output
current
VO = 0 V to VDD(IO)
;
3
on-chip pull-up/down
resistors disabled;
absolute value
[8]
VI
input voltage
pin configured to provide
a digital function;
VDD(IO) 2.2 V
VDD(IO) = 0 V
0
0
0
-
-
-
-
5.5
V
V
V
V
3.6
VO
output voltage
output active
VDD(IO)
5.5
VIH
HIGH-level input
voltage
0.7
VDD(IO)
VIL
LOW-level input voltage
0.5
-
0.3
V
VDD(IO)
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Table 8.
Static characteristics …continued
Tamb = 40 C to +85 C, unless otherwise specified. Applies to parts LPC1850/30/20/10 Rev ‘A’ only.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
Vhys
hysteresis voltage
0.1
-
-
V
VDD(IO)
VOH
VOL
IOH
HIGH-level output
voltage
IOH = 8 mA
VDD(IO)
0.4
-
-
V
LOW-level output
voltage
IOL = 8 mA
-
-
0.4
-
V
HIGH-level output
current
VOH = VDD(IO) 0.4 V
VOL = 0.4 V
8
8
-
-
mA
mA
mA
mA
A
IOL
LOW-level output
current
-
-
[9]
[9]
IOHS
IOLS
Ipd
HIGH-level short-circuit drive HIGH; connected to
output current ground
-
86
76
-
LOW-level short-circuit drive LOW; connected to
output current
-
-
VDD(IO)
[11]
[12]
[13]
pull-down current
VI = VDD(IO)
-
62
[11]
[12]
[13]
Ipu
pull-up current
VI = 0 V
-
-
62
-
A
A
VDD(IO) < VI 5 V
0
-
-
Open-drain I2C0-bus pins
VIH
VIL
Vhys
VOL
ILI
HIGH-level input
voltage
0.7
VDD(IO)
-
V
V
V
V
LOW-level input voltage
0.5
0.14
0.3
VDD(IO)
hysteresis voltage
0.1
VDD(IO)
-
-
-
LOW-level output
voltage
IOLS = 3 mA
-
0.4
[10]
input leakage current
VI = VDD(IO)
VI = 5 V
-
-
4.5
-
-
A
A
10
Oscillator pins
Vi(XTAL1)
input voltage on pin
XTAL1
0.5
0.5
-
-
-
-
1.2
1.2
0.8
V
Vo(XTAL2)
Cio
output voltage on pin
XTAL2
V
[14]
input/output
capacitance
pF
USB0 pins[15]
Rpd
VIC
pull-down resistance
on pin USB0_VBUS
high-speed mode
48
64
200
-
80
k
common-mode input
voltage
50
800
500
2500
mV
mV
full-speed/low-speed
mode
chirp mode
50
-
600
mV
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32-bit ARM Cortex-M3 microcontroller
Table 8.
Static characteristics …continued
Tamb = 40 C to +85 C, unless otherwise specified. Applies to parts LPC1850/30/20/10 Rev ‘A’ only.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
Vi(dif)
differential input voltage
100
400
1100
mV
USB1 pins (USB1_DP/USB1_DM)[15]
[15]
IOZ
OFF-state output
current
0 V < VI < 3.3 V
-
-
10
A
VBUS
VDI
bus supply voltage
-
-
-
5.25
-
V
V
differential input
(D+) (D)
0.2
sensitivity voltage
VCM
differential common
mode voltage range
includes VDI range
0.8
0.8
-
-
2.5
2.0
V
V
Vth(rs)se
single-ended receiver
switching threshold
voltage
VOL
LOW-level output
voltage for
low-/full-speed
RL of 1.5 k to 3.6 V
RL of 15 k to GND
-
-
-
0.18
3.5
V
V
VOH
HIGH-level output
voltage (driven) for
low-/full-speed
2.8
Ctrans
ZDRV
transceiver capacitance pin to GND
-
-
-
20
pF
[16]
driver output
with 33 series resistor;
steady state drive
36
44.1
impedance for driver
which is not high-speed
capable
[1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
[2] VDD(REG)(3V3) = VDD(IO)= VDDA(3V3) = 3.3 V; Tamb = 25 C for all power consumption measurements.
[3] PLL1 disabled. Normal power mode.
[4] PLL1 enabled. Normal power mode.
[5] On pin VBAT; Tamb = 25 C. VDD(REG)(3V3) not present.
[6] Vps corresponds to the output of the power switch (see Figure 11) which is determined by the greater of VBAT and VDD(Reg)(3V3)
[7] DDA(3V3) = 3.3 V; Tamb = 25 C.
.
V
[8] VDD(IO) supply voltage must be present.
[9] Allowed as long as the current limit does not exceed the maximum current allowed by the device.
[10] To VSS
.
[11] The values specified are simulated and absolute values.
[12] The weak pull-up resistor is connected to the VDD(IO) rail and pulls up the I/O pin to the VDD(IO) level.
[13] The input cell disables the weak pull-up resistor when the applied input voltage exceeds VDD(IO)
[14] The parameter value specified is a simulated value excluding bond capacitance.
[15] For USB operation 3.0 V VDD((IO) 3.6 V. Guaranteed by design.
.
[16] Includes external resistors of 33 1 % on D+ and D.
10.1 Power consumption
Remark: All power consumption data in this section apply to Rev ‘A’ of the
LPC1850/30/20/10 parts only.
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32-bit ARM Cortex-M3 microcontroller
001aac984
X
X
X
X
X
X
X
(X)
<tbd>
X
X
X
X
X
X (X)
Conditions: Tamb = 25 C; normal mode entered executing code while(1){} from SRAM; internal
pull-up resistors disabled; system PLL enabled; IRC enabled, BOD disabled; all peripherals
disabled; all peripheral clocks disabled.
Fig 12. Typical supply current versus regulator supply voltage VDD(REEG)(3V3) in active
mode
001aac984
X
X
(X)
X
X
<tbd>
X
X
X
X
X
X
X
X
X (X)
Conditions: VDD(REG)(3V3) = 3.0 V, normal mode entered executing code while(1){} from SRAM;
internal pull-up resistors disabled; system PLL enabled; IRC enabled, BOD disabled; all
peripherals disabled; all peripheral clocks disabled.
Fig 13. Typical supply current versus temperature in active mode
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001aac984
X
X
X
X
X
X
X
(X)
<tbd>
X
X
X
X
X
X (X)
Conditions: VDD(REG)(3V3) = 3.0 V; internal pull-up resistors disabled; system PLL enabled; IRC
enabled, BOD disabled; all peripherals disabled; all peripheral clocks disabled.
Fig 14. Typical supply current versus temperature in sleep mode
001aac984
X
X
(X)
X
X
<tbd>
X
X
X
X
X
X
X
X
X (X)
Conditions: VBAT = 0 V; VDD(IO) = 0 V.
Fig 15. Typical supply current versus temperature in Deep-sleep mode
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32-bit ARM Cortex-M3 microcontroller
001aac984
X
X
X
X
X
X
X
(X)
<tbd>
X
X
X
X
X
X (X)
Conditions: VBAT = 0 V; VDD(IO) = 0 V.
Fig 16. Typical supply current versus temperature in Power-down mode
001aac984
X
X
X
X
X
X
X
(X)
<tbd>
X
X
X
X
X
X (X)
Conditions: VBAT = 0 V; VDD(IO) = 0 V.
Fig 17. Typical supply current versus temperature in Deep power-down mode
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10.2 Electrical pin characteristics
001aab173
001aab173
X
X
X
X
X
X
X
X
X
X
X
X
X
(X)
X
(X)
<tbd>
<tbd>
X
X
X
X
X
X
X
X
X
X
X
X
X (X)
X (X)
Conditions: VDD(REG)(3V3) = VDD(IO) = 3.3 V; standard
port pins.
Conditions: VDD(REG)(3V3) = VDD(IO) = 3.3 V; standard
port pins.
Fig 18. Typical HIGH-level output voltage VOH versus
HIGH-level output source current IOH
Fig 19. Typical LOW-level output current IOL versus
LOW-level output voltage VOL
002aag625
+20
I
pu
(μA)
0
-20
-40
-60
-80
T = 25 °C
-40 °C
0
1
2
3
4
5
V (V)
I
Conditions: VDD(IO)) = 3.3 V. Simulated values. Values at T = 25 C are typical values. Values at
T = 40 C correspond to minimum values.
Fig 20. Typical pull-up current Ipu versus input voltage VI
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32-bit ARM Cortex-M3 microcontroller
002aag626
120
I
pd
(μA)
90
60
30
0
T =25 °C
-40 °C
0
1
2
3
4
5
V (V)
I
Conditions: VDD(IO)) = 3.3 V. Simulated values. Values at T = 25 C are typical values. Values at
T = 40 C correspond to maximum values.
Fig 21. Typical pull-down current Ipd versus input voltage VI
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11. Dynamic characteristics
11.1 Wake-up times
Table 9.
Dynamic characteristic: Wake-up from Deep-sleep, Power-down, and Deep
power-down modes
Tamb = 40 C to +85 C
Symbol Parameter
Conditions
Min
Typ[1]
Max Unit
[2]
twake
wake-up time from Sleep mode
3
5 Tcy(clk)
-
ns
Tcy(clk)
from Deep-sleep and
Power-down mode
12
51
-
s
from Deep power-down mode
after reset
-
-
250
250
-
-
s
s
[1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply
voltages.
[2] Tcy(clk) = 1/CCLK with CCLK = CPU clock frequency.
11.2 External clock
Table 10. Dynamic characteristic: external clock
Tamb = 40 C to +85 C; VDD(IO) over specified ranges.[1]
Symbol Parameter
Conditions
Min
Typ[2] Max
Unit
MHz
ns
fosc
oscillator frequency
1
-
-
-
-
25
Tcy(clk)
tCHCX
tCLCX
clock cycle time
clock HIGH time
clock LOW time
40
1000
Tcy(clk) 0.4
Tcy(clk) 0.4
Tcy(clk) 0.6 ns
Tcy(clk) 0.6 ns
[1] Parameters are valid over operating temperature range unless otherwise specified.
[2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply
voltages.
t
CHCX
t
CLCX
T
cy(clk)
002aag698
Fig 22. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)
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32-bit ARM Cortex-M3 microcontroller
11.3 Crystal oscillator
Table 11. Dynamic characteristic: oscillator
Tamb = 40 C to +85 C; VDD(IO), VDD(REG)(3V3) over specified ranges.[1]
Symbol
Parameter
Conditions
Min
Typ[2]
Max
Unit
Low-frequency mode (1 MHz - 20 MHz)[5]
[3][4]
[3][4]
tjit(per)
period jitter time
5 MHz crystal
10 MHz crystal
15 MHz crystal
-
-
-
13.2
6.6
-
-
-
ps
ps
ps
4.8
High-frequency mode (20 MHZ - 25 MHz)[6]
tjit(per)
period jitter time
20 MHz crystal
25 MHz crystal
-
-
4.3
3.7
-
-
ps
ps
[1] Parameters are valid over operating temperature range unless otherwise specified.
[2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply
voltages.
[3] Indicates RMS period jitter.
[4] PLL-induced jitter is not included.
[5] Select HF = 0 in the XTAL_OSC_CTRL register.
[6] Select HF = 1 in the XTAL_OSC_CTRL register.
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11.4 IRC and RTC oscillators
Table 12. Dynamic characteristic: IRC and RTC oscillators
Tamb = 40 C to +85 C; 2.2 V VDD(REG)(3V3) 3.6 V.[1]
Symbol Parameter
Conditions
Min
Typ[2]
Max
Unit
fosc(RC) internal RC oscillator
-
11.88
12
12.12
MHz
frequency
fi(RTC)
RTC input frequency
-
-
32.768
-
kHz
[1] Parameters are valid over operating temperature range unless otherwise specified.
[2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply
voltages.
001aab173
X
X
(X)
X
X
<tbd>
X
X
X
X
X
X
X
X
X
X (X)
Conditions: Frequency values are typical values.
Fig 23. Internal RC oscillator frequency versus temperature
11.5 I2C-bus
Table 13. Dynamic characteristic: I2C-bus pins
Tamb = 40 C to +85 C; 2.2 V VDD(REG)(3V3) 3.6 V.[1]
Symbol
Parameter
Conditions
Min
Max
100
400
1
Unit
kHz
kHz
MHz
ns
fSCL
SCL clock frequency
Standard-mode
Fast-mode
0
0
0
-
Fast-mode Plus
[3][4][5][6]
tf
fall time
of both SDA and
SCL signals
300
Standard-mode
Fast-mode
20 + 0.1 Cb
300
ns
ns
s
s
s
Fast-mode Plus
Standard-mode
Fast-mode
-
120
tLOW
LOW period of the SCL clock
4.7
1.3
0.5
-
-
-
Fast-mode Plus
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Table 13. Dynamic characteristic: I2C-bus pins
Tamb = 40 C to +85 C; 2.2 V VDD(REG)(3V3) 3.6 V.[1]
Symbol
Parameter
Conditions
Min
4.0
0.6
0.26
0
Max
Unit
s
s
s
s
s
s
ns
ns
ns
tHIGH
HIGH period of the SCL clock
Standard-mode
Fast-mode
-
-
-
-
-
-
-
-
-
Fast-mode Plus
Standard-mode
Fast-mode
[2][3][7]
[8][9]
tHD;DAT
data hold time
0
Fast-mode Plus
Standard-mode
Fast-mode
0
tSU;DAT
data set-up time
250
100
50
Fast-mode Plus
[1] Parameters are valid over operating temperature range unless otherwise specified.
[2] tHD;DAT is the data hold time that is measured from the falling edge of SCL; applies to data in transmission and the acknowledge.
[3] A device must internally provide a hold time of at least 300 ns for the SDA signal (with respect to the VIH(min) of the SCL signal) to
bridge the undefined region of the falling edge of SCL.
[4] Cb = total capacitance of one bus line in pF. If mixed with Hs-mode devices, faster fall times are allowed.
[5] The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage tf is specified at
250 ns. This allows series protection resistors to be connected in between the SDA and the SCL pins and the SDA/SCL bus lines
without exceeding the maximum specified tf.
[6] In Fast-mode Plus, fall time is specified the same for both output stage and bus timing. If series resistors are used, designers should
allow for this when considering bus timing.
[7] The maximum tHD;DAT could be 3.45 s and 0.9 s for Standard-mode and Fast-mode but must be less than the maximum of tVD;DAT or
tVD;ACK by a transition time. This maximum must only be met if the device does not stretch the LOW period (tLOW) of the SCL signal. If
the clock stretches the SCL, the data must be valid by the set-up time before it releases the clock.
[8] tSU;DAT is the data set-up time that is measured with respect to the rising edge of SCL; applies to data in transmission and the
acknowledge.
[9] A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system but the requirement tSU;DAT = 250 ns must then be met.
This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the
LOW period of the SCL signal, it must output the next data bit to the SDA line tr(max) + tSU;DAT = 1000 + 250 = 1250 ns (according to the
Standard-mode I2C-bus specification) before the SCL line is released. Also the acknowledge timing must meet this set-up time.
t
t
SU;DAT
f
70 %
30 %
70 %
30 %
SDA
SCL
t
t
HD;DAT
VD;DAT
t
f
t
HIGH
70 %
30 %
70 %
30 %
70 %
30 %
70 %
30 %
t
LOW
1 / f
S
SCL
002aaf425
Fig 24. I2C-bus pins clock timing
LPC1850_30_20_10
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11.6 I2S-bus interface
Table 14. Dynamic characteristics: I2S-bus interface pins
Tamb = 25 C; 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V; CL = 20 pF. Conditions and data
refer to I2S0 and I2S1 pins. Simulated values.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
common to input and output
tr
rise time
-
4
4
-
-
-
-
ns
ns
-
tf
fall time
-
tWH
pulse width HIGH
on pins I2Sx_TX_SCK
and I2Sx_RX_SCK
<tbd>
tWL
pulse width LOW
on pins I2Sx_TX_SCK
and I2Sx_RX_SCK
-
-
<tbd> ns
output
[1]
tv(Q)
data output valid time on pin I2Sx_TX_SDA
on pin I2Sx_TX_WS
-
-
4.4
4.3
-
-
ns
ns
input
[1]
[1]
tsu(D)
data input set-up time on pin I2Sx_RX_SDA
on pin I2Sx_RX_WS
-
0
-
ns
ns
ns
ns
0.20
3.7
3.9
th(D)
data input hold time
on pin I2Sx_RX_SDA
on pin I2Sx_RX_WS
-
-
-
-
[1] Clock to the I2S-bus interface BASE_APB1_CLK = 150 MHz; peripheral clock to the I2S-bus interface
PCLK = BASE_APB1_CLK / 12. I2S clock cycle time Tcy(clk) = 79.2 ns; corresponds to the SCK signal in the
I2S-bus specification.
T
t
f
t
r
cy(clk)
I2Sx_TX_SCK
I2Sx_TX_SDA
t
t
WL
WH
t
v(Q)
I2Sx_TX_WS
002aag497
t
v(Q)
Fig 25. I2S-bus timing (transmit)
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T
t
f
t
r
cy(clk)
I2Sx_RX_SCK
t
t
WL
WH
I2Sx_RX_SDA
I2Sx_RX_WS
t
t
h(D)
su(D)
002aag498
t
t
su(D)
su(D)
Fig 26. I2S-bus timing (receive)
11.7 USART interface
Table 15. Dynamic characteristics: USART interface
Tamb = 25 C; 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V; CL = 20 pF. Simulated values.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Tcy(clk)
clock cycle time
on pins Ux_UCLK
-
0.1
-
s
output
tv(Q)
data output valid time on pin Ux_TXD
-
6.5
-
ns
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11.8 SSP interface
Table 16. Dynamic characteristics: SSP pins in SPI mode
Tamb = 25 C; 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V. Simulated values.
Symbol Parameter
Conditions
Min
Typ
40
Max
Unit
ns
[1]
Tcy(clk)
clock cycle time
full-duplex mode
-
-
-
-
when only
20
ns
transmitting
SSP master
tDS
data set-up time
data hold time
in SPI mode
in SPI mode
-
-
-
-
8.8
5.0
3.9
-
-
-
-
ns
ns
ns
ns
tDH
tv(Q)
data output valid time in SPI mode
data output hold time in SPI mode
th(Q)
0.4
SSP slave
Tcy(PCLK) PCLK cycle time
10
ns
ns
ns
ns
ns
ns
[2]
Tcy(clk)
tDS
clock cycle time
data set-up time
data hold time
120
-
-
-
-
-
-
in SPI mode
in SPI mode
-
-
-
-
10.5
1
tDH
tv(Q)
th(Q)
data output valid time in SPI mode
data output hold time in SPI mode
4.0
0.2
[1] Tcy(clk) = (SSPCLKDIV (1 + SCR) CPSDVSR) / fmain. The clock cycle time derived from the SPI bit rate Tcy(clk) is a function of the
main clock frequency fmain, the SSP peripheral clock divider (SSPCLKDIV), the SSP SCR parameter (specified in the SSP0CR0
register), and the SSP CPSDVSR parameter (specified in the SSP clock prescale register).
[2] Tcy(clk) = 12 Tcy(PCLK)
.
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T
t
t
clk(L)
cy(clk)
clk(H)
SCK (CPOL = 0)
SCK (CPOL = 1)
MOSI
t
t
h(Q)
v(Q)
DATA VALID
DATA VALID
CPHA = 1
t
t
DH
DS
DATA VALID
DATA VALID
MISO
t
t
h(Q)
v(Q)
DATA VALID
DATA VALID
t
MOSI
MISO
t
CPHA = 0
DS
DH
DATA VALID
DATA VALID
002aae829
Fig 27. SSP master timing in SPI mode
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T
t
t
clk(L)
cy(clk)
clk(H)
SCK (CPOL = 0)
SCK (CPOL = 1)
t
t
DH
DS
MOSI
MISO
DATA VALID
DATA VALID
t
t
h(Q)
v(Q)
CPHA = 1
DATA VALID
DATA VALID
t
t
DH
DS
MOSI
MISO
DATA VALID
DATA VALID
DATA VALID
t
t
h(Q)
CPHA = 0
v(Q)
DATA VALID
002aae830
Fig 28. SSP slave timing in SPI mode
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11.9 External memory interface
Table 17. Dynamic characteristics: Static external memory interface
CL = 22 pF for EMC_Dn CL = 20 pF for all others; Tamb = 40 C to 85 C; 2.2 V VDD(REG)(3V3) 3.6 V;
2.7 V VDD(IO) 3.6 V; values guaranteed by design.
Symbol
Read cycle parameters
Parameter[1]
Conditions
Min
Typ
Max
Unit
tCSLAV
CS LOW to address valid
time
3.1
-
-
1.6
ns
ns
[2]
[2]
tCSLOEL
CS LOW to OE LOW time
0.6 + Tcy(clk)
WAITOEN
1.3 + Tcy(clk)
WAITOEN
tCSLBLSL
tOELOEH
CS LOW to BLS LOW time PB = 1
OE LOW to OE HIGH time
0.7
-
-
1.8
ns
ns
0.6 +
0.4 +
(WAITRD
(WAITRD
WAITOEN + 1)
Tcy(clk)
WAITOEN + 1)
Tcy(clk)
tam
memory access time
data input hold time
-
-
16 +
ns
(WAITRD
WAITOEN +1)
Tcy(clk)
th(D)
16
-
-
-
-
-
-
ns
ns
ns
ns
ns
tCSHBLSH CS HIGH to BLS HIGH time PB = 1
0.4
0.4
2.0
2.0
1.9
1.4
2.6
0
tCSHOEH
tOEHANV
tCSHEOR
CS HIGH to OE HIGH time
OE HIGH to address invalid PB = 1
[3]
[4]
CS HIGH to end of read
time
tCSLSOR
CS LOW to start of read
time
0
-
-
1.8
1.6
ns
ns
Write cycle parameters
tCSLAV
CS LOW to address valid
3.1
time
tCSLDV
CS LOW to data valid time
CS LOW to WE LOW time
3.1
1.5
0.7
-
-
-
-
1.5
0.2
1.8
ns
ns
ns
ns
tCSLWEL
tCSLBLSL
tWELWEH
PB = 1
CS LOW to BLS LOW time PB = 1
WE LOW to WE HIGH time PB = 1
[2]
[2]
0.6 +
0.4 +
(WAITWR
WAITWEN + 1)
Tcy(clk)
(WAITWR
WAITWEN + 1)
Tcy(clk)
tWEHDNV
WE HIGH to data invalid
time
PB = 1
PB = 1
PB = 0
0.9 + Tcy(clk)
0.4 + Tcy(clk)
0.7
-
-
2.3 + Tcy(clk)
0.3 + Tcy(clk)
1.8
ns
ns
[2]
[5]
tWEHEOW WE HIGH to end of write
time
tCSLBLSL
CS LOW to BLS LOW
-
-
ns
ns
[2]
tBLSLBLSH BLS LOW to BLS HIGH time PB = 0
0.9 +
0.1 +
(WAITWR
WAITWEN + 1)
Tcy(clk)
(WAITWR
WAITWEN + 1)
Tcy(clk)
[2]
[5]
tBLSHEOW BLS HIGH to end of write
time
PB = 0
1.9 + Tcy(clk)
-
0.5 + Tcy(clk)
ns
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Table 17. Dynamic characteristics: Static external memory interface …continued
CL = 22 pF for EMC_Dn CL = 20 pF for all others; Tamb = 40 C to 85 C; 2.2 V VDD(REG)(3V3) 3.6 V;
2.7 V VDD(IO) 3.6 V; values guaranteed by design.
Symbol
Parameter[1]
Conditions
Min
Typ
Max
Unit
[2]
[5]
tBLSHDNV BLS HIGH to data invalid
time
PB = 0
2.5 + Tcy(clk)
-
1.4 + Tcy(clk)
ns
tCSHEOW
CS HIGH to end of write
time
2.0
-
-
-
0
ns
ns
ns
tBLSHDNV BLS HIGH to data invalid
time
PB = 1
2.5
1.4
tWEHANV
WE HIGH to address invalid PB = 1
time
0.9 + Tcy(clk)
2.4 + Tcy(clk)
[1] Parameters specified for 40 % of VDD(IO) for rising edges and 60 % of VDD(IO) for falling edges.
[2] cy(clk) = 1/CCLK (see LPC18xx User manual).
[3] End Of Read (EOR): longest of tCSHOEH, tOEHANV, tCSHBLSH
[4] Start Of Read (SOR): longest of tCSLAV, tCSLOEL, tCSLBLSL
T
.
.
[5] End Of Write (EOW): earliest of address not valid or EMC_BLSn HIGH.
EMC_An
t
CSLAV
t
CSHEOW
t
t
t
CSLAV
OEHANV
EMC_CSn
EMC_OE
t
CSLOEL
t
t
OELOEH
t
BLSHEOW
CSHOEH
t
t
CSLBLSL BLSLBLSH
EMC_BLSn
EMC_WE
t
CSLDV
am
t
t
CSHEOR
BLSHDNV
t
CSLSOR
t
h(D)
EMC_Dn
EOW
SOR
EOR
002aag699
Fig 29. External static memory read/write access (PB = 0)
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EMC_An
t
CSLAV
t
t
t
CSLAV
OEHANV
t
CSHEOW
EMC_CSn
EMC_OE
t
CSLOEL
t
OELOEH
t
CSLBLSL
CSHOEH
t
CSLBLSL
EMC_BLSn
EMC_WE
t
CSHBLSH
t
t
CSLWEL WELWEH
t
WEHEOW
t
t
BLSHDNV
am
t
CSHEOR
t
CSLDV
t
t
h(D)
WEHDNV
t
CSLSOR
EMC_Dn
EOR
SOR
EOW
002aag700
Fig 30. External static memory read/write access (PB = 1)
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Table 18. Dynamic characteristics: Dynamic external memory interface
Simulated data over temperature and process range; CL = 10 pF for EMC_DYCSn, EMC_RAS, EMC_CAS, EMC_WE,
EMC_An; CL = 9 pF for EMC_Dn; CL = 5 pF for EMC_DQMOUTn, EMC_CLKn, EMC_CKEOUTn; Tamb = 40 C to 85 C;
2.2 V VDD(REG)(3V3) 3.6 V; VDD(IO) =3.3 V 10 %; RD = 1 (see LPC18xx User manual); EMC_CLKn delays CLK0_DELAY
= CLK1_DELAY = CLK2_DELAY = CLK3_DELAY = 0.
Symbol
Parameter
Min
Typ
Max
Unit
Tcy(clk)
clock cycle time
8.4
-
-
ns
Common to read and write cycles
td(DYCSV)
th(DYCS)
td(RASV)
th(RAS)
dynamic chip select valid delay time
-
3.1 + 0.5 Tcy(clk)
5.1 + 0.5 Tcy(clk) ns
ns
4.9 + 0.5 Tcy(clk) ns
ns
4.6 + 0.5 Tcy(clk) ns
ns
5.9 + 0.5 Tcy(clk) ns
ns
5.0 + 0.5 Tcy(clk) ns
ns
6.3 + 0.5 Tcy(clk) ns
ns
5.1 + 0.5 Tcy(clk) ns
dynamic chip select hold time
row address strobe valid delay time
row address strobe hold time
column address strobe valid delay time
column address strobe hold time
write enable valid delay time
write enable hold time
0.3 + 0.5 Tcy(clk) 0.9 + 0.5 Tcy(clk)
3.1 + 0.5 Tcy(clk)
0.5 + 0.5 Tcy(clk) 1.1 + 0.5 Tcy(clk)
2.9 + 0.5 Tcy(clk)
0.3 + 0.5 Tcy(clk) 0.9 + 0.5 Tcy(clk)
3.2 + 0.5 Tcy(clk)
1.3 + 0.5 Tcy(clk) 1.4 + 0.5 Tcy(clk)
3.1 + 0.5 Tcy(clk)
0.2 + 0.5 Tcy(clk) 0.8 + 0.5 Tcy(clk)
3.8 + 0.5 Tcy(clk)
0.3 + 0.5 Tcy(clk) 0.9 + 0.5 Tcy(clk)
-
-
-
td(CASV)
th(CAS)
td(WEV)
th(WE)
-
-
-
-
td(DQMOUTV) DQMOUT valid delay time
-
th(DQMOUT)
td(AV)
DQMOUT hold time
address valid delay time
address hold time
-
-
th(A)
-
td(CKEOUTV) CKEOUT valid delay time
th(CKEOUT) CKEOUT hold time
Read cycle parameters
tsu(D) data input set-up time
th(D) data input hold time
Write cycle parameters
td(QV) data output valid delay time
th(Q) data output hold time
-
3.1 + 0.5 Tcy(clk)
0.7 + 0.5 Tcy(clk)
0.5 Tcy(clk)
-
ns
1.5
0.5
-
ns
ns
-
0.8
2.2
-
3.8 + 0.5 Tcy(clk)
0.7 + 0.5 Tcy(clk)
6.2 + 0.5 Tcy(clk) ns
- ns
0.5 Tcy(clk)
Table 19. Dynamic characteristics: Dynamic external memory interface; EMC_CLK[3:0]
delay values
Tamb = 40 C to 85 C; VDD(IO) =3.3 V 10 %; 2.2 V VDD(REG)(3V3) 3.6 V.
Symbol Parameter
td delay time
Conditions
delay value
Min
Typ
Max
Unit
[1]
CLKn_DELAY = 0
CLKn_DELAY = 1
CLKn_DELAY = 2
CLKn_DELAY = 3
CLKn_DELAY = 4
CLKn_DELAY = 5
CLKn_DELAY = 6
CLKn_DELAY = 7
0.0
0.4
0.7
1.1
1.4
1.7
2.1
2.5
0.0
0.5
1.0
1.6
2.0
2.6
3.1
3.6
0.0
0.8
1.7
2.5
3.3
4.1
4.9
5.8
ns
ns
ns
ns
ns
ns
ns
ns
[1]
[1]
[1]
[1]
[1]
[1]
[1]
[1] Program the EMC_CLKn delay values in the EMCDELAYCLK register (see the LPC18xx User manual).
The delay values must be the same for all SDRAM clocks EMC_CLKn: CLK0_DELAY = CLK1_DELAY =
CLK2_DELAY = CLK3_DELAY.
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EMC_CLKn
delay > 0
EMC_CLKn delay t ; programmable CLKn_DELAY
d
T
cy(clk)
EMC_CLKn
delay = 0
t
- t
d
t
- t
d
d(xV)
h(x)
t
t
EMC_DYCSn,
EMC_RAS,
d(xV)
h(x)
EMC_CAS,
EMC_WE,
EMC_CKEOUTn,
EMC_A[22:0],
EMC_DQMOUTn
t
- t
d
t
- t
d
d(QV)
h(Q)
t
d(QV)
t
h(Q)
EMC_D[31:0]
write
t
t
su(D)
h(D)
EMC_D[31:0]
read; delay > 0
t
t
su(D)
h(D)
EMC_D[31:0]
read; delay = 0
002aag703
For the programmable EMC_CLK[3:0] clock delays CLKn_DELAY, see Table 19 .
Remark: For SDRAM operation, set CLK0_DELAY = CLK1_DELAY = CLK2_DELAY = CLK3_DELAY in the EMCDELAYCLK
register.
Fig 31. SDRAM timing
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11.10 USB interface
Table 20. Dynamic characteristics: USB0 and USB1 pins (full-speed)
CL = 50 pF; Rpu = 1.5 k on D+ to VDD(IO); 3.0 V VDD(IO) 3.6 V.
Symbol
Parameter
rise time
fall time
Conditions
10 % to 90 %
10 % to 90 %
tr / tf
Min
8.5
7.7
-
Typ
Max
13.8
13.7
109
Unit
ns
tr
-
-
-
tf
ns
tFRFM
differential rise and fall time
matching
%
VCRS
output signal crossover voltage
source SE0 interval of EOP
1.3
160
2
-
-
-
2.0
175
+5
V
tFEOPT
tFDEOP
see Figure 32
ns
ns
source jitter for differential transition see Figure 32
to SE0 transition
tJR1
receiver jitter to next transition
18.5
9
-
-
-
+18.5
ns
ns
ns
tJR2
receiver jitter for paired transitions
EOP width at receiver
10 % to 90 %
+9
-
[1]
[1]
tEOPR1
must reject as
EOP; see
Figure 32
40
tEOPR2
EOP width at receiver
must accept as
EOP; see
82
-
-
ns
Figure 32
[1] Characterized but not implemented as production test. Guaranteed by design.
T
PERIOD
crossover point
extended
crossover point
differential
data lines
source EOP width: t
FEOPT
differential data to
SE0/EOP skew
n × T
+ t
PERIOD
FDEOP
receiver EOP width: t
, t
EOPR1 EOPR2
002aab561
Fig 32. Differential data-to-EOP transition skew and EOP width
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Table 21. Static characteristics: USB0 PHY pins[1]
Symbol Parameter
High-speed mode
Conditions
Min
Typ
Max
Unit
[2]
[3]
Pcons
power consumption
-
68
-
mW
IDDA(3V3) analog supply current (3.3 V) on pin USB0_VDDA3V3_DRIVER;
total supply current
during transmit
-
-
-
-
-
18
31
14
14
7
-
-
-
-
-
mA
mA
mA
mA
mA
during receive
with driver tri-stated
IDDD
Full-speed/low-speed mode
Pcons power consumption
digital supply current
[2]
-
15
-
mW
IDDA(3V3) analog supply current (3.3 V) on pin USB0_VDDA3V3_DRIVER;
total supply current
during transmit
-
-
-
-
-
3.5
5
-
-
-
-
-
mA
mA
mA
mA
mA
during receive
3
with driver tri-stated
3
IDDD
digital supply current
3
Suspend mode
IDDA(3V3) analog supply current (3.3 V)
-
-
-
-
24
24
3
-
-
-
-
A
A
mA
A
with driver tri-stated
with OTG functionality enabled
IDDD
digital supply current
30
VBUS detector outputs
Vth
threshold voltage
for VBUS valid
for session end
for A valid
4.4
0.2
0.8
2
-
-
V
-
0.8
2
V
-
V
for B valid
-
4
V
Vhys
hysteresis voltage
for session end
A valid
-
150
200
200
10
10
10
mV
mV
mV
-
B valid
-
[1] Characterized but not implemented as production test.
[2] Total average power consumption.
[3] The driver is active only 20 % of the time.
11.11 Ethernet
Table 22. Dynamic characteristics: Ethernet
Tamb = 40 C to 85 C; 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V. Values guaranteed by
design.
Symbol Parameter
RMII mode
Conditions
Min
Max
Unit
[1]
[1]
fclk
clock frequency for ENET_RX_CLK
clock duty cycle
-
50
50
MHz
%
clk
50
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Table 22. Dynamic characteristics: Ethernet
Tamb = 40 C to 85 C; 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V. Values guaranteed by
design.
Symbol Parameter
Conditions
Min
Max
Unit
[1][2]
[1][2]
tsu
set-up time
for ENET_TXDn, ENET_TX_EN,
ENET_RXDn, ENET_RX_ER,
ENET_RX_DV
4
-
ns
th
hold time
for ENET_TXDn, ENET_TX_EN,
ENET_RXDn, ENET_RX_ER,
ENET_RX_DV
2
-
ns
MII mode
[1]
fclk
clk
tsu
clock frequency for ENET_TX_CLK
clock duty cycle
-
25
50
-
MHz
%
[1]
50
4
[1][2]
set-up time
for ENET_TXDn, ENET_TX_EN,
ns
ENET_TX_ER
[1][2]
th
hold time
for ENET_TXDn, ENET_TX_EN,
ENET_TX_ER
2
-
ns
[1]
fclk
clk
tsu
clock frequency for ENET_RX_CLK
clock duty cycle
-
25
50
-
MHz
%
[1]
50
4
[1][2]
set-up time
for ENET_RXDn, ENET_RX_ER,
ns
ENET_RX_DV
[1][2]
th
hold time
for ENET_RXDn, ENET_RX_ER,
ENET_RX_DV
2
-
ns
[1] Output drivers can drive a load 25 pF accommodating over 12 inch of PCB trace and the input
capacitance of the receiving device.
[2] Timing values are given from the point at which the clock signal waveform crosses 1.4 V to the valid input or
output level.
ENET_RX_CLK
ENET_TX_CLK
t
su
t
h
ENET_RXD[n]
ENET_RX_DV
ENET_RX_ER
ENET_TXD[n]
ENET_TX_EN
ENET_TX_ER
002aag210
Fig 33. Ethernet timing
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32-bit ARM Cortex-M3 microcontroller
11.12 SD/MMC
Table 23. Dynamic characteristics: SD/MMC
Tamb = 25 C, 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V, CL = 20 pF. Simulated values.
Symbol Parameter
Conditions
Min
Typ
Max Unit
fclk
clock frequency
on pin SD_CLK; data
transfer mode
-
40
<tbd> MHz
on pin SD_CLK;
<tbd> MHz
identification mode
tsu(D)
th(D)
td(QV)
th(Q)
data input set-up
time
on pins SD_CMD, SD_DATn <tbd> 9.9
as inputs
-
-
ns
ns
data input hold time on pins SD_CMD, SD_DATn <tbd> 0.3
as inputs
data output valid
delay time
on pins SD_CMD, SD_DATn
as outputs
-
6.9
<tbd> ns
ns
data output hold time on pins SD_CMD, SD_DATn <tbd> 0.3
as outputs
-
T
cy(clk)
SD_CLK
t
t
h(Q)
d(QV)
SD_CMD (O)
SD_DATn (O)
t
t
su(D)
h(D)
SD_CMD (I)
SD_DATn (I)
002aag204
Fig 34. SD/MMC timing
11.13 LCD
Table 24. Dynamic characteristics: LCD
Tamb = 25 C; 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V; CL = 20 pF. Simulated values.
Symbol Parameter
Conditions
Min
-
Typ
Max Unit
fclk
clock frequency
on pin LCD_DCLK
50
<tbd> MHz
tsu(D)
data input set-up
time
<tbd>
-
ns
th(D)
data input hold time
<tbd> <tbd>
14.1
-
ns
td(QV)
data output valid
delay time
-
<tbd> ns
- ns
th(Q)
data output hold time
<tbd> <tbd>
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12. ADC/DAC electrical characteristics
Table 25. ADC characteristics
VDDA(3V3) over specified ranges; Tamb = 40 C to +85 C; ADC frequency 4.5 MHz; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
-
Max
Unit
V
VIA
Cia
ED
analog input voltage
0
-
-
-
-
-
-
-
-
-
-
-
-
VDDA(3V3)
analog input capacitance
differential linearity error
-
2
-
-
-
-
-
-
-
-
-
-
pF
[1][2]
[3]
2.7 V VDDA(3V3) 3.6 V
2.2 V VDDA(3V3) < 2.7 V
2.7 V VDDA(3V3) 3.6 V
2.2 V VDDA(3V3) < 2.7 V
2.7 V VDDA(3V3) 3.6 V
2.2 V VDDA(3V3) < 2.7 V
2.7 V VDDA(3V3) 3.6 V
2.2 V VDDA(3V3) < 2.7 V
2.7 V VDDA(3V3) 3.6 V
2.2 V VDDA(3V3) < 2.7 V
see Figure 36
0.8
1.0
0.8
1.5
0.15
0.15
0.3
0.35
3
LSB
LSB
LSB
LSB
LSB
LSB
%
EL(adj)
integral non-linearity
offset error
[4]
EO
[5]
EG
gain error
%
[6]
ET
absolute error
LSB
LSB
4
Rvsi
Ri
voltage source interface
resistance
-
1/(7 fclk(ADC) k
Cia)
[7][8]
input resistance
-
-
-
-
-
-
1.2
4.5
400
M
fclk(ADC) ADC clock frequency
MHz
fc(ADC)
ADC conversion frequency 10-bit resolution; 11 clock
cycles
kSamples/s
2-bit resolution; 3 clock
cycles
1.5
MSamples/s
[1] The ADC is monotonic, there are no missing codes.
[2] The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 35.
[3] The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after
appropriate adjustment of gain and offset errors. See Figure 35.
[4] The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the
ideal curve. See Figure 35.
[5] The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset
error, and the straight line which fits the ideal transfer curve. See Figure 35.
[6] The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated
ADC and the ideal transfer curve. See Figure 35.
[7] Tamb = 25 C; maximum sampling frequency fs = 4.5 MHz and analog input capacitance Cia = 2 pF.
[8] Input resistance Ri depends on the sampling frequency fs: Ri = 2 k + 1 / (fs Cia).
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offset
error
gain
error
E
E
O
G
1023
1022
1021
1020
1019
1018
(2)
7
code
out
(1)
6
5
4
3
2
1
0
(5)
(4)
(3)
1 LSB
(ideal)
1018 1019 1020 1021 1022 1023 1024
1
2
3
4
5
6
7
V
(LSB
)
ideal
IA
offset error
E
O
V
− V
SSA
DDA(3V3)
1 LSB =
1024
002aaf959
(1) Example of an actual transfer curve.
(2) The ideal transfer curve.
(3) Differential linearity error (ED).
(4) Integral non-linearity (EL(adj)).
(5) Center of a step of the actual transfer curve.
Fig 35. 10-bit ADC characteristics
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R
vsi
LPC18xx
2 kΩ (analog pin)
2.2 kΩ (multiplexed pin)
ADC0_n/ADC1_n
R
s
ADC
COMPARATOR
C
= 2 pF
ia
V
EXT
V
SS
002aag697
Rs < 1/((7 fclk(ADC) Cia) 2 k
Fig 36. ADC interface to pins
Table 26. DAC characteristics
VDDA(3V3) over specified ranges; Tamb = 40 C to +85 C; unless otherwise specified
Symbol Parameter
Conditions
Min
Typ
0.8
1.0
1.0
1.5
0.8
1.0
0.3
1.0
-
Max
Unit
LSB
LSB
LSB
LSB
LSB
LSB
%
[1]
[1]
[1]
[1]
ED
differential linearity error 2.7 V VDDA(3V3) 3.6 V
2.2 V VDDA(3V3) < 2.7 V
-
-
-
-
-
-
-
-
-
1
-
-
EL(adj)
integral non-linearity
2.7 V VDDA(3V3) 3.6 V
2.2 V VDDA(3V3) < 2.7 V
2.7 V VDDA(3V3) 3.6 V
2.2 V VDDA(3V3) < 2.7 V
2.7 V VDDA(3V3) 3.6 V
2.2 V VDDA(3V3) < 2.7 V
-
-
EO
offset error
-
-
EG
gain error
-
-
%
CL
RL
ts
load capacitance
load resistance
settling time
200
-
pF
-
k
[1]
0.4
s
[1] In the DAC CR register, bit BIAS = 0 (see the LPC18xx user manual).
[2] Settling time is calculated within 1/2 LSB of the final value.
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13. Application information
13.1 LCD panel signal usage
Table 27. LCD panel connections for STN single panel mode
External pin
4-bit mono STN single panel
8-bit mono STN single panel
Color STN single panel
LPC18xx pin
used
LCD function LPC18xx pin
LCD function
LPC18xx pin
used
LCD function
used
LCD_VD[23:8]
LCD_VD7
LCD_VD6
LCD_VD5
LCD_VD4
LCD_VD3
LCD_VD2
LCD_VD1
LCD_VD0
LCD_LP
-
-
-
-
-
-
-
-
P8_4
P8_5
P8_6
P8_7
P4_2
P4_3
P4_4
P4_1
P7_6
P4_6
UD[7]
UD[6]
UD[5]
UD[4]
UD[3]
UD[2]
UD[1]
UD[0]
LCDLP
P8_4
P8_5
P8_6
P8_7
P4_2
P4_3
P4_4
P4_1
P7_6
P4_6
UD[7]
UD[6]
UD[5]
UD[4]
UD[3]
UD[2]
UD[1]
UD[0]
LCDLP
-
-
-
-
-
-
P4_2
P4_3
P4_4
P4_1
P7_6
P4_6
UD[3]
UD[2]
UD[1]
UD[0]
LCDLP
LCD_ENAB/
LCDM
LCDENAB/
LCDM
LCDENAB/
LCDM
LCDENAB/
LCDM
LCD_FP
P4_5
P4_7
P7_0
P7_7
PF_4
LCDFP
P4_5
P4_7
P7_0
P7_7
PF_4
LCDFP
P4_5
P4_7
P7_0
P7_7
PF_4
LCDFP
LCD_DCLK
LCD_LE
LCDDCLK
LCDLE
LCDDCLK
LCDLE
LCDDCLK
LCDLE
LCD_PWR
GP_CLKIN
CDPWR
LCDCLKIN
LCDPWR
LCDCLKIN
LCDPWR
LCDCLKIN
Table 28. LCD panel connections for STN dual panel mode
External pin
4-bit mono STN dual panel
8-bit mono STN dual panel
Color STN dual panel
LPC18xx pin
used
LCD function LPC18xx pin
LCD function
LPC18xx pin
used
LCD function
used
LCD_VD[23:16]
LCD_VD15
LCD_VD14
LCD_VD13
LCD_VD12
LCD_VD11
LCD_VD10
LCD_VD9
LCD_VD8
LCD_VD7
LCD_VD6
LCD_VD5
LCD_VD4
LCD_VD3
-
-
-
-
-
-
-
-
PB_4
PB_5
PB_6
P8_3
P4_9
P4_10
P4_8
P7_5
LD[7]
LD[6]
LD[5]
LD[4]
LD[3]
LD[2]
LD[1]
LD[0]
UD[7]
UD[6]
UD[5]
UD[4]
UD[3]
PB_4
PB_5
PB_6
P8_3
P4_9
P4_10
P4_8
P7_5
P8_4
P8_5
P8_6
P8_7
P4_2
LD[7]
LD[6]
LD[5]
LD[4]
LD[3]
LD[2]
LD[1]
LD[0]
UD[7]
UD[6]
UD[5]
UD[4]
UD[3]
-
-
-
-
-
-
P4_9
LD[3]
P4_10
LD[2]
P4_8
LD[1]
P7_5
LD[0]
-
-
-
-
P8_5
P8_6
P8_7
P4_2
-
-
-
-
P4_2
UD[3]
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32-bit ARM Cortex-M3 microcontroller
Table 28. LCD panel connections for STN dual panel mode
External pin
4-bit mono STN dual panel
8-bit mono STN dual panel
Color STN dual panel
LPC18xx pin
used
LCD function LPC18xx pin LCD function
LPC18xx pin
used
LCD function
used
P4_3
P4_4
P4_1
P7_6
P4_6
LCD_VD2
LCD_VD1
LCD_VD0
LCD_LP
P4_3
P4_4
P4_1
P7_6
P4_6
UD[2]
UD[1]
UD[0]
LCDLP
UD[2]
UD[1]
UD[0]
LCDLP
P4_3
P4_4
P4_1
P7_6
P4_6
UD[2]
UD[1]
UD[0]
LCDLP
LCD_ENAB/
LCDM
LCDENAB/
LCDM
LCDENAB/
LCDM
LCDENAB/
LCDM
LCD_FP
P4_5
P4_7
P7_0
P7_7
PF_4
LCDFP
P4_5
P4_7
P7_0
P7_7
PF_4
LCDFP
P4_5
P4_7
P7_0
P7_7
PF_4
LCDFP
LCD_DCLK
LCD_LE
LCDDCLK
LCDLE
LCDDCLK
LCDLE
LCDDCLK
LCDLE
LCD_PWR
GP_CLKIN
LCDPWR
LCDCLKIN
LCDPWR
LCDCLKIN
LCDPWR
LCDCLKIN
Table 29. LCD panel connections for TFT panels
External
pin
TFT 12 bit (4:4:4
mode)
TFT 16 bit (5:6:5 mode)
TFT 16 bit (1:5:5:5 mode) TFT 24 bit
LPC18xx LCD
LPC18xx
pin used
LCD
function
LPC18xxpin LCD
LPC18xx
pin used
LCD
function
pin used
function
used
PB_0
PB_1
PB_2
PB_3
P7_1
P7_2
-
function
LCD_VD23 PB_0
LCD_VD22 PB_1
LCD_VD21 PB_2
LCD_VD20 PB_3
BLUE3
PB_0
PB_1
PB_2
PB_3
P7_1
-
BLUE4
BLUE3
BLUE2
BLUE1
BLUE0
-
BLUE4
BLUE3
BLUE2
BLUE1
BLUE0
intensity
-
BLUE7
BLUE6
BLUE5
BLUE4
BLUE3
BLUE2
BLUE1
BLUE0
GREEN7
GREEN6
GREEN5
GREEN4
GREEN3
GREEN2
GREEN1
GREEN0
RED7
BLUE2
BLUE1
BLUE0
LCD_VD19
LCD_VD18
LCD_VD17
LCD_VD16
-
-
-
-
-
-
-
-
-
P7_3
P7_4
PB_4
PB_5
PB_6
P8_3
P4_9
P4_10
P4_8
P7_5
P8_4
P8_5
P8_6
P8_7
P4_2
P4_3
P4_4
-
-
-
-
-
LCD_VD15 PB_4
LCD_VD14 PB_5
LCD_VD13 PB_6
LCD_VD12 P8_3
GREEN3
PB_4
PB_5
PB_6
P8_3
P4_9
P4_10
-
GREEN5
GREEN4
GREEN3
GREEN2
GREEN1
GREEN0
-
PB_4
PB_5
PB_6
P8_3
P4_9
P4_10
-
GREEN4
GREEN3
GREEN2
GREEN1
GREEN0
intensity
-
GREEN2
GREEN1
GREEN0
LCD_VD11
LCD_VD10
LCD_VD9
LCD_VD8
LCD_VD7
LCD_VD6
LCD_VD5
LCD_VD4
LCD_VD3
LCD_VD2
LCD_VD1
-
-
-
-
-
-
-
-
-
-
-
-
P8_4
RED3
P8_4
P8_5
P8_6
P8_7
P4_2
-
RED4
RED3
RED2
RED1
RED0
-
P8_4
P8_5
P8_6
P8_7
P4_2
P4_3
-
RED4
RED3
RED2
RED1
RED0
intensity
-
P8_5
RED2
RED6
P8_6
RED1
RED5
P8_7
RED0
RED4
-
-
-
-
-
-
RED3
RED2
-
-
RED1
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NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 29. LCD panel connections for TFT panels
External
pin
TFT 12 bit (4:4:4
mode)
TFT 16 bit (5:6:5 mode)
TFT 16 bit (1:5:5:5 mode) TFT 24 bit
LPC18xx LCD
LPC18xx
pin used
LCD
function
LPC18xxpin LCD
LPC18xx
pin used
LCD
function
pin used
function
used
function
LCD_VD0
LCD_LP
-
-
-
-
-
-
P4_1
P7_6
RED0
P7_6
LCDLP
P7_6
LCDLP
P7_6
LCDLP
LCDLP
LCD_ENAB P4_6
/LCDM
LCDENAB/ P4_6
LCDM
LCDENAB/ P4_6
LCDM
LCDENAB/ P4_6
LCDM
LCDENAB/
LCDM
LCD_FP
LCD_DCLK P4_7
LCD_LE P7_0
P4_5
LCDFP
LCDDCLK P4_7
LCDLE P7_0
P4_5
LCDFP
P4_5
P4_7
P7_0
P7_7
LCDFP
LCDDCLK P4_7
LCDLE P7_0
P4_5
LCDFP
LCDDCLK
LCDLE
LCDDCLK
LCDLE
LCD_PWR P7_7
GP_CLKIN PF_4
LCDPWR P7_7
LCDCLKIN PF_4
LCDPWR
LCDPWR P7_7
LCDCLKIN PF_4
LCDPWR
LCDCLKIN
LCDCLKIN PF_4
13.2 Crystal oscillator
The crystal oscillator is controlled by the XTAL_OSC_CTRL register in the CGU (see
LPC18xx user manual).
The crystal oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can be
boosted to a higher frequency, up to the maximum CPU operating frequency, by the PLL.
The oscillator can operate in one of two modes: slave mode and oscillation mode.
• In slave mode the input clock signal should be coupled by means of a capacitor of
100 pF (CC in Figure 37), with an amplitude of at least 200 mV (RMS). The XTAL2 pin
in this configuration can be left unconnected.
• External components and models used in oscillation mode are shown in Figure 38,
and in Table 30 and Table 31. Since the feedback resistance is integrated on chip,
only a crystal and the capacitances CX1 and CX2 need to be connected externally in
case of fundamental mode oscillation (the fundamental frequency is represented by L,
CL and RS). Capacitance CP in Figure 38 represents the parallel package capacitance
and should not be larger than 7 pF. Parameters FC, CL, RS and CP are supplied by the
crystal manufacturer.
Table 30. Recommended values for CX1/X2 in oscillation mode (crystal and external
components parameters) low frequency mode
Fundamental oscillation
frequency
Maximum crystal series
resistance RS
External load capacitors
CX1, CX2
2 MHz
4 MHz
8 MHz
< 200
< 200
< 200
< 200
< 200
< 200
< 200
< 200
33 pF, 33 pF
39 pF, 39 pF
56 pF, 56 pF
18 pF, 18 pF
39 pF, 39 pF
56 pF, 56 pF
18 pF, 18 pF
39 pF, 39 pF
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Rev. 3 — 6 December 2011
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NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 30. Recommended values for CX1/X2 in oscillation mode (crystal and external
components parameters) low frequency mode
Fundamental oscillation
frequency
Maximum crystal series
resistance RS
External load capacitors
CX1, CX2
12 MHz
16 MHz
20 MHz
< 160
< 160
< 120
< 80
18 pF, 18 pF
39 pF, 39 pF
18 pF, 18 pF
33 pF, 33 pF
18 pF, 18 pF
33 pF, 33 pF
< 100
< 80
Table 31. Recommended values for CX1/X2 in oscillation mode (crystal and external
components parameters) high frequency mode
Fundamental oscillation
frequency
Maximum crystal series
resistance RS
External load capacitors CX1
Cx2
,
15 MHz
20 MHz
< 80
< 80
< 100
18 pF, 18 pF
39 pF, 39 pF
47 pF, 47 pF
LPC1xxx
XTAL1
C
i
C
g
100 pF
002aae835
Fig 37. Slave mode operation of the on-chip oscillator
LPC18xx
L
XTAL1
XTAL2
C
L
C
P
=
XTAL
R
S
C
X2
C
X1
002aag031
Fig 38. Oscillator modes with external crystal model used for CX1/CX2 evaluation
LPC1850_30_20_10
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Rev. 3 — 6 December 2011
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NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
13.3 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
Connect the crystal on the PCB as close as possible to the oscillator input and output pins
of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of third overtone
crystal usage have a common ground plane. Also connect the external components to the
ground plain. To keep the noise coupled in via the PCB as small as possible, make loops
and parasitics as small as possible. Choose smaller values of Cx1 and Cx2 if parasitics
increase in the PCB layout.
13.4 Standard I/O pin configuration
Figure 39 shows the possible pin modes for standard I/O pins with analog input function:
• Digital output driver: Open-drain mode enabled/disabled
• Digital input: Pull-up enabled/disabled
• Digital input: Pull-down enabled/disabled
• Digital input: Repeater mode enabled/disabled
• Analog input
The default configuration for standard I/O pins is input with pull-up enabled. The weak
MOS devices provide a drive capability equivalent to pull-up and pull-down resistors.
V
V
DD(IO)
DD(IO)
open-drain enable
output enable
data output
strong
pull-up
ESD
pin configured
as digital output
driver
PIN
strong
pull-down
ESD
V
SS
V
DD(IO)
weak
pull-up
pull-up enable
weak
pull-down
repeater mode
enable
pin configured
as digital input
pull-down enable
data input
select analog input
pin configured
as analog input
analog input
002aag701
Fig 39. Standard I/O pin configuration with analog input
LPC1850_30_20_10
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Preliminary data sheet
Rev. 3 — 6 December 2011
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LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
13.5 Reset pin configuration
V
DD(IO)
V
DD(IO)
V
DD(IO)
R
pu
ESD
20 ns RC
GLITCH FILTER
reset
PIN
ESD
V
SS
002aag702
Fig 40. Reset pin configuration
LPC1850_30_20_10
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Preliminary data sheet
Rev. 3 — 6 December 2011
129 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
14. Package outline
LBGA256: plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1 mm
SOT740-2
B
A
D
ball A1
index area
A
2
A
E
A
1
detail X
C
e
1
y
1 C
y
∅ v M
∅ w M
b
C
C
A
B
e
1/2 e
T
R
N
L
P
M
K
H
F
e
J
e
2
G
E
C
A
1/2 e
D
B
ball A1
index area
1
3
5
7
9
11
13
15
2
4
6
8
10
12
14
16
X
5
scale
10 mm
0
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
1
A
2
b
D
E
e
e
1
e
2
v
w
y
y
1
max
0.45
0.35
1.1
0.9
0.55 17.2 17.2
0.45 16.8 16.8
mm
1.55
1
15
15
0.25
0.1
0.12 0.35
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
- - -
JEDEC
JEITA
05-06-16
05-08-04
SOT740-2
MO-192
- - -
Fig 41. Package outline of the LBGA256 package
LPC1850_30_20_10
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Preliminary data sheet
Rev. 3 — 6 December 2011
130 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
TFBGA180: thin fine-pitch ball grid array package; 180 balls
SOT570-3
D
B
A
ball A1
index area
A
2
E
A
A
1
detail X
e
1
C
M
M
∅ v
∅ w
C A
C
B
e
1/2 e
b
y
y
C
1
P
N
M
K
H
L
J
e
e
2
G
E
F
1/2 e
D
B
C
A
ball A1
index area
1
3
5
7
9
11
13
2
4
6
8
10
12
14
X
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A
1
A
2
b
D
E
e
e
1
e
2
v
w
y
y
1
max 1.20 0.40 0.80 0.50 12.1 12.1
nom 1.06 0.35 0.71 0.45 12.0 12.0
mm
0.8
10.4 10.4 0.15 0.05 0.12
0.1
min
0.95 0.30 0.65 0.40 11.9 11.9
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
08-07-09
10-04-15
SOT570-3
Fig 42. Package outline of the TFBGA180 package
LPC1850_30_20_10
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Preliminary data sheet
Rev. 3 — 6 December 2011
131 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
LQFP208; plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm
SOT459-1
y
X
A
105
104
156
157
Z
E
e
H
E
E
(A )
3
A
2
A
A
1
w M
p
θ
L
L
b
p
detail X
pin 1 index
53
208
1
52
v
M
B
A
Z
w M
D
b
p
e
D
B
H
v
M
D
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.
7o
0o
0.15 1.45
0.05 1.35
0.27 0.20 28.1 28.1
0.17 0.09 27.9 27.9
30.15 30.15
29.85 29.85
0.75
0.45
1.43 1.43
1.08 1.08
mm
1.6
0.25
1
0.12 0.08 0.08
0.5
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
00-02-06
03-02-20
SOT459-1
136E30
MS-026
Fig 43. Package outline of the LQFP208 package
LPC1850_30_20_10
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Preliminary data sheet
Rev. 3 — 6 December 2011
132 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
SOT926-1
D
B
A
ball A1
index area
A
2
E
A
A
1
detail X
e
1
C
M
∅ v
∅ w
C A
C
B
b
e
1/2 e
y
y
M
C
1
K
J
H
G
F
e
e
2
E
D
C
B
A
1/2 e
ball A1
index area
1
2
3
4
5
6
7
8
9
10
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
1
A
2
b
D
E
e
e
1
e
2
v
w
y
y
1
max
0.4
0.3
0.8
0.65
0.5
0.4
9.1
8.9
9.1
8.9
mm
1.2
0.8
7.2
7.2
0.15 0.05 0.08
0.1
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
- - -
JEDEC
JEITA
05-12-09
05-12-22
SOT926-1
- - -
- - -
Fig 44. Package outline of the TFBGA100 package
LPC1850_30_20_10
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Preliminary data sheet
Rev. 3 — 6 December 2011
133 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm
SOT486-1
y
X
A
108
109
73
72
Z
E
e
H
A
E
2
A
E
(A )
3
A
1
θ
w M
p
L
p
b
L
pin 1 index
detail X
37
144
1
36
v
M
A
Z
w M
D
b
p
e
D
B
H
v
M
B
D
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
E
L
L
p
v
w
y
Z
Z
E
θ
1
2
3
p
D
max.
7o
0o
0.15 1.45
0.05 1.35
0.27 0.20 20.1 20.1
0.17 0.09 19.9 19.9
22.15 22.15
21.85 21.85
0.75
0.45
1.4
1.1
1.4
1.1
mm
1.6
0.25
1
0.2 0.08 0.08
0.5
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
00-03-14
03-02-20
SOT486-1
136E23
MS-026
Fig 45. Package outline for the LQFP144 package
LPC1850_30_20_10
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Preliminary data sheet
Rev. 3 — 6 December 2011
134 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
SOT407-1
y
X
A
51
75
50
26
(1)
76
Z
E
e
H
A
E
2
E
A
(A )
3
A
1
w M
p
θ
b
L
p
pin 1 index
L
detail X
100
1
25
Z
D
v
M
A
B
e
w M
b
p
D
B
H
v
M
5
D
0
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
p
v
w
y
Z
Z
θ
1
2
3
p
E
D
E
max.
7o
0o
0.15 1.45
0.05 1.35
0.27 0.20 14.1 14.1
0.17 0.09 13.9 13.9
16.25 16.25
15.75 15.75
0.75
0.45
1.15 1.15
0.85 0.85
mm
1.6
0.25
0.5
1
0.2 0.08 0.08
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
00-02-01
03-02-20
SOT407-1
136E20
MS-026
Fig 46. Package outline for the LQFP100 package
LPC1850_30_20_10
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Preliminary data sheet
Rev. 3 — 6 December 2011
135 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
15. Soldering
Footprint information for reflow soldering of LBGA256 package
SOT740-2
Hx
P
P
Hy
see detail X
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
SL
SP
SR
occupied area
solder resist
detail X
DIMENSIONS in mm
P
SL
SP
SR
Hx
Hy
1.00
0.450 0.450 0.600 17.500 17.500
sot740-2_fr
Fig 47. Reflow soldering of the LBGA256 package
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
136 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Footprint information for reflow soldering of TFBGA180 package
SOT570-3
Hx
P
P
Hy
see detail X
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
SL
SP
SR
occupied area
solder resist
detail X
DIMENSIONS in mm
P
SL
SP
SR
Hx
Hy
0.80
0.400 0.400 0.550 12.575 12.575
sot570-3_fr
Fig 48. Reflow soldering of the TFBGA180 package
LPC1850_30_20_10
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Preliminary data sheet
Rev. 3 — 6 December 2011
137 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Footprint information for reflow soldering of LQFP208 package
SOT459-1
Hx
Gx
(0.125)
P2
P1
Hy Gy
By
Ay
C
D2 (8×)
D1
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1 P2 Ax
Ay
Bx
By
C
D1
D2
Gx
Gy
Hx
Hy
0.500 0.560 31.300 31.300 28.300 28.300 1.500 0.280 0.400 28.500 28.500 31.550 31.550
sot459-1_fr
Fig 49. Reflow soldering of the LQFP208 package
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
138 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Footprint information for reflow soldering of LQFP144 package
SOT486-1
Hx
Gx
(0.125)
P2
P1
Hy Gy
By
Ay
C
D2 (8×)
D1
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1 P2 Ax
Ay
Bx
By
C
D1
D2
Gx
Gy
Hx
Hy
0.500 0.560 23.300 23.300 20.300 20.300 1.500 0.280 0.400 20.500 20.500 23.550 23.550
sot486-1_fr
Fig 50. Reflow soldering of the LQFP144 package
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
139 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Footprint information for reflow soldering of TFBGA100 package
SOT926-1
Hx
P
P
Hy
see detail X
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
SL
SP
SR
occupied area
solder resist
detail X
DIMENSIONS in mm
P
SL
SP
SR
Hx
Hy
0.80
0.330 0.400 0.480 9.400 9.400
sot926-1_fr
Fig 51. Reflow soldering of the TFBGA100 package
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
140 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Footprint information for reflow soldering of LQFP100 package
SOT407-1
Hx
Gx
(0.125)
P2
P1
Hy Gy
By
Ay
C
D2 (8×)
D1
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1 P2 Ax
Ay
Bx
By
C
D1
D2
Gx
Gy
Hx
Hy
0.500 0.560 17.300 17.300 14.300 14.300 1.500 0.280 0.400 14.500 14.500 17.550 17.550
sot407-1
Fig 52. Reflow soldering of the LQFP100 package
LPC1850_30_20_10
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© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
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LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
16. Appendix
16.1 Static characteristics for LPC1850/30/20/10 Rev’-’ parts
Table 32. Static characteristics
amb = 40 C to +85 C, unless otherwise specified. Applies to LPC1850/30/20/10 Rev ‘-’ only.
T
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
Supply pins
VDD(IO)
input/output supply
voltage
2.2
2.2
2.0
-
-
-
3.6
3.6
3.6
V
V
V
VDD(REG)(3V3)
VDDA(3V3)
regulator supply voltage
(3.3 V)
analog supply voltage
(3.3 V)
[2]
VBAT
battery supply voltage
supply voltage (3.3 V)
2.2
2.2
-
-
3.6
3.6
V
V
VDD(3V3)
on pin VDD; LQFP100
package only
IDD(REG)(3V3)
regulator supply current active mode; code
(3.3 V)
while(1){}
executed from <tbd>; all
peripherals disabled
[3]
[3]
[3]
CCLK = 12 MHz; PLL
disabled
-
-
-
10
40
55
-
-
-
mA
mA
mA
CCLK = 100 MHz; PLL
enabled
CCLK = 150 MHz; PLL
enabled
[3]
[3][4]
[3][4]
[3]
sleep mode
-
-
-
-
<tbd>
60
-
-
-
-
mA
A
A
A
deep sleep mode
power-down mode
30
deep power-down mode;
RTC <tbd>
4
IBAT
battery supply current
deep power-down mode;
RTC running
[5]
[6]
VDD(REG)(3V3) present
-
-
<tbd>
-
nA
VDD(REG)(3V3) not
present
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
-
-
-
-
-
-
-
nA
nA
nA
nA
nA
nA
nA
[7]
[7]
[7]
[9]
[9]
[9]
IDD(IO)
I/O supply current
ADC supply current
deep sleep mode
-
-
-
-
-
-
power-down mode
deep power-down mode
deep sleep mode
IDD(ADC)
power-down mode
deep power-down mode
LPC1850_30_20_10
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Preliminary data sheet
Rev. 3 — 6 December 2011
142 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 32. Static characteristics …continued
Tamb = 40 C to +85 C, unless otherwise specified. Applies to LPC1850/30/20/10 Rev ‘-’ only.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
Digital pins - RESET pin
[8]
[8]
[8]
VIH
VIL
HIGH-level input
voltage
0.8 (Vps
0.35)
-
-
-
5.5
V
V
V
LOW-level input voltage
0.5
0.3 (Vps
0.1)
Vhys
hysteresis voltage
0.05 (Vps
0.35)
-
Digital pins
IIL
LOW-level input current VI = 0 V; on-chip pull-up
resistor disabled
-
-
-
-
<tbd>
<tbd>
A
A
IIH
IOZ
VI
HIGH-level input
current
VI = VDD(IO); on-chip
pull-down resistor
disabled
OFF-state output
current
VO = 0 V; VO = VDD(IO)
on-chip pull-up/down
resistors disabled
;
-
-
-
<tbd>
<tbd>
A
[10]
input voltage
pin configured to provide
a digital function
0.5
V
VO
output voltage
output active
<tbd>
2.0
-
-
VDD(IO)
5.5
V
V
VIH
HIGH-level input
voltage
VIL
LOW-level input voltage
hysteresis voltage
0.5
-
-
-
0.8
V
V
V
Vhys
VOH
0.1VDD(IO)
-
-
HIGH-level output
voltage
IOH = 6 mA
VDD(IO)
0.4
VOL
IOH
LOW-level output
voltage
IOL = 6 mA
-
-
-
-
-
-
0.4
-
V
HIGH-level output
current
VOH = VDD(IO) 0.4 V
VOL = 0.4 V
6
6
-
mA
mA
mA
mA
IOL
LOW-level output
current
-
[11]
[11]
IOHS
IOLS
HIGH-level short-circuit drive HIGH; connected to
output current ground
35
30
LOW-level short-circuit drive LOW; connected to
-
output current
pull-down current
pull-up current
VDD(IO)
Ipd
Ipu
VI = VDD(IO)
VI = 0 V
<tbd>
<tbd>
<tbd>
45
<tbd>
<tbd>
<tbd>
50
<tbd>
<tbd>
<tbd>
65
A
A
A
k
k
VDD(IO) < VI < 3.6 V
Rpu(weak)
Rpd(weak)
weak pull-up resistance VI = 0 V
weak pull-down
resistance
VI = VDD(IO)
45
50
65
Open-drain I2C0-bus pins
VIH
HIGH-level input
voltage
<tbd>
-
-
-
-
V
V
VIL
LOW-level input voltage
<tbd>
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Table 32. Static characteristics …continued
Tamb = 40 C to +85 C, unless otherwise specified. Applies to LPC1850/30/20/10 Rev ‘-’ only.
Symbol
Vhys
Parameter
Conditions
Min
Typ[1]
<tbd>
-
Max
-
Unit
V
hysteresis voltage
-
-
VOL
LOW-level output
voltage
IOLS = <tbd> mA
<tbd>
V
[12]
ILI
input leakage current
VI = VDD(IO)
VI = 5 V
-
-
<tbd>
<tbd>
<tbd>
<tbd>
A
A
Oscillator pins
Vi(XTAL1)
input voltage on pin
XTAL1
0.5
0.5
-
-
1.2
1.2
V
V
Vo(XTAL2)
output voltage on pin
XTAL2
USB pins
VIC
common-mode input
voltage
high-speed mode
<tbd>
<tbd>
<tbd>
-
<tbd>
<tbd>
mV
mV
full-speed/low-speed
mode
chirp mode
<tbd>
<tbd>
-
<tbd>
<tbd>
mV
mV
Vi(dif)
differential input voltage
<tbd>
[1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
[2] The RTC typically fails when VBAT drops below 2.2 V and VDD(REG)(3V3) is less than 2.2 V.
[3]
VDD(REG)(3V3) = 3.3 V; Tamb = 25 C for all power consumption measurements. Applies to parts LPC1850/30/20/10 Rev ‘-’ only.
[4] Conditions <tbd>.
[5] On pin VBAT; IDD(REG)(3V3) = <tbd> nA; VDD(REG)(3V3) = 3.3 V; VBAT < VDD(REG)(3V3); Tamb = 25 C.
[6] On pin VBAT; VBAT = 3.3 V; Tamb = 25 C.
[7] All internal pull-ups disabled. All pins configured as output and driven LOW. VDD(3V3) = 3.3 V; Tamb = 25 C.
[8] Vps corresponds to the output of the power switch (see Figure 11) which is determined by the greater of VBAT and VDD(Reg)(3V3)
.
[9]
VDDA(3V3) = 3.3 V; Tamb = 25 C.
[10] VDD(IO) supply voltage must be present.
[11] Allowed as long as the current limit does not exceed the maximum current allowed by the device.
[12] To VSS
.
16.2 Power consumption
Remark: All power consumption data in this section apply to Rev ‘-’ of the
LPC1850/30/20/10 parts only.
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002aag121
60
144 MHz
I
DD(REG)(3V3)
(mA)
132 MHz
108 MHz
84 MHz
40
60 MHz
20
0
36 MHz
12 MHz
2.0
2.4
2.8
3.2
3.6
V
(V)
DD(REG)(3V3)
Conditions: Tamb = 25 C; normal mode entered executing code while(1){} from ROM; internal
pull-up resistors disabled; system PLL enabled; IRC enabled, BOD disabled; all peripherals
disabled; all peripheral clocks disabled.
Fig 53. Typical supply current versus regulator supply voltage VDD(REG)(3V3) in active
mode
002aag122
60
144 MHz
I
DD(REG)(3V3)
(mA)
132 MHz
108 MHz
40
20
84 MHz
60 MHz
36 MHz
12 MHz
0
-40
-15
10
35
60
85
temperature (°C)
Conditions: VDD(REG)(3V3) = 3.0 V, normal mode entered executing code while(1){} from ROM;
internal pull-up resistors disabled; system PLL enabled; IRC enabled, BOD disabled; all
peripherals disabled; all peripheral clocks disabled.
Fig 54. Typical supply current versus temperature in active mode
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001aac984
X
X
X
X
X
X
X
(X)
<tbd>
X
X
X
X
X
X (X)
Conditions: VDD(REG)(3V3) = 3.0 V; internal pull-up resistors disabled; system PLL enabled; IRC
enabled, BOD disabled; all peripherals disabled; all peripheral clocks disabled.
Fig 55. Typical supply current versus temperature in sleep mode
002aag123
400
V
DD(REG)(3V3) = 3.6 V
I
DD(REG)(3V3)
(μA)
3.4 V
3.0 V
2.6 V
2.2 V
300
200
100
0
-40
-15
10
35
60
85
temperature (°C)
Conditions: VBAT = 0 V; VDD(IO) = 0 V; PD0_SLEEP0_MODE = 0x003F 00AA.
Fig 56. Typical supply current versus temperature in Deep-sleep mode
LPC1850_30_20_10
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002aag124
60
I
DD(REG)(3V3)
(μA)
V
DD(REG)(3V3) = 3.6 V
3.0 V
2.6 V
2.2 V
40
20
0
-40
-15
10
35
60
85
temperature (°C)
Conditions: VBAT = 0 V; VDD(IO) = 0 V; PD0_SLEEP0_MODE = 0x003F FCBA.
Fig 57. Typical supply current versus temperature in Power-down mode
002aag125
10.0
I
DD(REG)(3V3)
(μA)
8.0
6.0
4.0
2.0
V
DD(REG)(3V3) = 3.6 V
2.2 V
0
-40
-15
10
35
60
85
temperature (°C)
Conditions: VBAT = 0 V; VDD(IO) = 0 V; PD0_SLEEP0_MODE = 0x003F FF7F.
Fig 58. Typical supply current versus temperature in Deep power-down mode
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Table 33. Power consumption for individual peripherals
Tamb = 25 C; VDD(REG)(3V3) = 3.3 V.
Peripheral
Conditions
Typical
IDD(REG)(3V3)
[1]
IRC
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
ADC
DAC
I2C0
I2C1
I2S
SSP0
SSP1
USART0
UART1
USART2
USART3
USB0
USB1
Ethernet
[1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply
voltages.
17. Abbreviations
Table 34. Abbreviations
Acronym
ADC
Description
Analog-to-Digital Converter
Advanced Encryption Standard
Advanced High-performance Bus
Advanced Peripheral Bus
Application Programming Interface
BrownOut Detection
AES
AHB
APB
API
BOD
BGA
Ball Grid Array
CAN
Controller Area Network
CMAC
CSMA/CD
DAC
Cipher-based Message Authentication Code
Carrier Sense Multiple Access with Collision Detection
Digital-to-Analog Converter
Direct Memory Access
DMA
EOP
End Of Packet
ETB
Embedded Trace Buffer
ETM
Embedded Trace Macrocell
General Purpose Input/Output
Internal RC
GPIO
IRC
IrDA
Infrared Data Association
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Table 34. Abbreviations …continued
Acronym
Description
JTAG
LCD
Joint Test Action Group
Liquid Crystal Display
Least Significant Bit
Low Quad Flat Package
Media Access Control
MicroController Unit
LSB
LQFP
MAC
MCU
MIIM
n.c.
Media Independent Interface Management
not connected
OTG
PHY
On-The-Go
PHYsical layer
PLL
Phase-Locked Loop
PWM
RMII
SDRAM
SPI
Pulse Width Modulator
Reduced Media Independent Interface
Synchronous Dynamic Random Access Memory
Serial Peripheral Interface
SSI
Serial Synchronous Interface
Synchronous Serial Port
SSP
TCP/IP
TTL
Transmission Control Protocol/Internet Protocol
Transistor-Transistor Logic
UART
ULPI
USART
USB
Universal Asynchronous Receiver/Transmitter
UTMI+ Low Pin Interface
Universal Synchronous Asynchronous Receiver/Transmitter
Universal Serial Bus
UTMI
USB 2.0 Transceiver Macrocell Interface
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18. Revision history
Table 35. Revision history
Document ID
Release date Data sheet status
20111206 Preliminary data sheet
• VDDA(3V3) minimum value changed to 2.2 V.
Change notice Supersedes
LPC1850_30_20_10 v.3
Modifications:
-
LPC1850_30_20_10 v.2.2
• VDD(IO) and VDD(REG)(3V3) ranges added to static and dynamic characteristics tables.
• Figure 29 and Figure 30 updated.
• UART and USART maximum bit rates specified in Section 11.7.
• Defined 5 V tolerant pins for VDD(IO) present only in Table 3.
• Added pin characteristics for USB1 pins in Table 8.
• Added explanation of parameter Rvsi (Figure 36).
• SPIFI driver removed from ROM (Table 4 and Table 5).
• Multiple <tbd> replaced in Section 8, Section 9, Section 10, Section 11.
• Parameter Cia = 2 pF updated in Table 25.
• ESD parameter added in Table 6.
• AES removed from memory maps.
• SD/MMC timing parameters added in Table 23.
• LCD timing parameters added in Table 24.
• EMC SDRAM timing parameters updated in Table 19.
• SSP timing parameters added in Table 16.
• USART timing parameters added in Table 15.
• DAC characterization data added in Table 26.
• DBGEN pin reset state: PD removed (Table 3).
• TDO pin reset state: PU removed (Table 3).
• USB0_ID pin: pin description updated (Table 3).
• USB0_VBUS pin: pin description updated (Table 3).
• Static characteristics for LPC1850/30/20/10 Rev ‘-’ moved to Section 16.
• Dynamic characteristics added for the crystal oscillator (Section 11.3).
• Pin function USB0_PWR_EN changed to USB0_PPWR and description updated in
Table 3.
• Pin function USB1_VBUS_EN changed to USB1_PPWR and description updated in
Table 3.
• Updates related to the Rev ‘A’ version of parts LPC1850/30/20/10:
–
–
–
–
–
–
–
–
–
–
LQFP208 pin configuration added.
SRAM connections in Figure 8 updated and SPIFI added.
EMC static and dynamic SRAM characterization data added.
Number of GPIOs corrected in the LQFP208 package (Table 2).
Table 8 updated for parts LPC1850/30/20/10 Rev ‘A’.
ADC characteristics added (Table 25.
DAC characteristics added (Table 26).
Reset state updated for pin PF_0 and PF_4 in Table 3.
Power consumption data added in Table 8.
Pin electrical characteristics added in Table 8, Figure 20 and Figure 21.
LPC1850_30_20_10 v.2.2
Modifications:
20110909
Preliminary data sheet
-
LPC1850_30_20_10 v.2.1
• Pin P7_2, column LQFP144: replaced 113 by 115 in Table 3.
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Table 35. Revision history …continued
Document ID
Release date Data sheet status
20110822 Preliminary data sheet
• LQFP100 pin package added in Table 3.
Change notice Supersedes
LPC1850_30_20_10 v.2.1
Modifications:
-
LPC1850_30_20_10 v.2
• Number of ADC channels, QEI, and Motor control PWM added in Table 2.
• Pin P2_7 designated as ISP entry pin.
• Description of ISP mode added (see Section 7.8.1).
• Updates related to the Rev ‘A’ version of parts LPC1850/30/20/10:
–
VI updated for I/O pins in Table 6.
–
Boot pins corrected in Table 3 and Table 5: Pin P2_7 replaced by pin P2_9 as boot
pin. Pin level corrected for 4th boot pin (P2_9) in Table 5.
–
–
–
USART3 boot mode added in Table 5.
Memory map updated: SPIFI data added at address 0x1400 000 in Figure 9.
Boot ROM size increased to 64 kB in Section 2 and Figure 9.
• Updated pin P2_2, CTOUT_6 changed to CTIN_6 in Table 3.
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Table 35. Revision history …continued
Document ID
Release date Data sheet status
20110713 Objective data sheet
• Power consumption data added (Figure 12 to Figure 17).
Change notice Supersedes
LPC1850_30_20_10 v.2
Modifications:
-
LPC1850_30_20_10 v.1.2
• Pin PC_0 in Table 3: function ENET_RX_CLK changed to n.c. and function
SDIO_CLK changed to function ENET_RX_CLK.
• Pin PC_8 in Table 3: ENET_RX_DV applies to RMII/MII interfaces.
• Rename pins CAN1_RD and CAN1_TD to CAN0_RD and CAN0_TD in Table 3.
• Rename all I2S pins to I2S0 pins.
• Condition for RTC operation updated in Table 8, Table note 2.
• Figure 11 “LPC1850/30/20/10 Power domains” added.
• “n.c.” changed to “Reserved” in Table 3.
• Section 11.6: characterization parameters and timing diagrams updated.
• Prefix for all SD/MMC pins changed to “SD” in Table 3.
• Prefix for all EMC pins changed to “EMC” in Table 3.
• Section 11.4 added.
• Section 11.8 added.
• Section 11.9 added.
• LQFP144 pinout added in Table 3.
• Updates related to the Rev ‘A’ version of parts LPC1850/30/20/10:
–
–
–
–
–
–
–
–
–
–
–
–
–
Pin P6_0 in Table 3: function I2S_RX_SCK moved to function level 5.
Pin PF_0 in Table 3: function GP_CLKIN added.
Pin PA_1 in Table 3: function U2_TXD added.
Pin PA_2 in Table 3: function U2_RXD added.
Pin PC_0 in Table 3: reset state changed to I; PU.
Pin P1_16 in Table 3: ENET_CRS_DV moved to function level 7.
Pad descriptions updated in Table 3, Table note 3 to Table note 11.
Added function levels four to seven/eight for each pin in Table 3.
Second C_CAN interface (C_CAN1) added.
Second I2S interface (I2S1) added.
Audio PLL added (Section 2 and Section 7.18.6).
All SDIO functions moved to the function levels four to seven in Table 3.
High-speed GPIO block moved to address 0x400F 4000 in Figure 9 and
Figure 10.
–
GPIO interrupts and GPIO group0 and group1 interrupt added in Figure 1,
Figure 9, Figure 10, Section 2, and Section 7.12.
–
–
–
–
–
Number of GPIO ports increased to eight.
Total number of GPIO pins increased to 164.
GIMA block added (Section 7.6).
Band gap output added to pin PF_7.
Package outline and soldering information added for all packages.
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Table 35. Revision history …continued
Document ID
Release date Data sheet status
20110217 Objective data sheet
Change notice Supersedes
LPC1850_30_20_10 v.1.2
Modifications:
-
LPC1850_30_20_10 v.1
• RMII removed from description of pin functions ENET_RXD2, ENET_RXD3,
ENET_ER. ENET_REF_CLK removed from pin function ENET_RX_CLK (Table 3).
• Support for IEEE 1588 time stamping/advanced time stamping (IEEE 1588-2008 v2)
added (Section 2 and Section 7.12.9).
• All pins with default state n.c. are inputs with pull-ups enabled on reset (Table 3).
• SPIFI functions removed from pins PA_0, PA_3, PC_4, PC_5, PC_8, PE_2 in Table 3.
• Reset states added for multiple pins in Table 3.
• Editorial updates.
• Section 13.2 “Crystal oscillator” added.
• Pin P2_7 designated as boot pin 3 in Table 3.
• USB0 and USB1 added to boot sources in Table 4 and Table 5.
LPC1850_30_20_10 v.1
20110103
Objective data sheet
-
-
LPC1850_30_20_10
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19. Legal information
19.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
19.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
19.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
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Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
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Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
non-automotive qualified products in automotive equipment or applications.
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
I2C-bus — logo is a trademark of NXP B.V.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
LPC1850_30_20_10
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
155 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
21. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
7.13.8.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
7.13.9
Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering information. . . . . . . . . . . . . . . . . . . . . 4
Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 4
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5
7.13.9.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
7.14
7.14.1
3
Digital serial peripherals. . . . . . . . . . . . . . . . . 80
UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
4
4.1
5
7.14.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
7.14.2 USART. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
7.14.2.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
7.14.3 SSP serial I/O controller. . . . . . . . . . . . . . . . . 81
7.14.3.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
7.14.4
I2C-bus interface . . . . . . . . . . . . . . . . . . . . . . 81
7.14.4.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
7.14.5
I2S interface . . . . . . . . . . . . . . . . . . . . . . . . . . 82
7.14.5.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
7.14.6 C_CAN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
7.14.6.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 6
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7
7
7.1
7.2
7.3
Functional description . . . . . . . . . . . . . . . . . . 67
Architectural overview . . . . . . . . . . . . . . . . . . 67
ARM Cortex-M3 processor . . . . . . . . . . . . . . . 67
AHB multilayer matrix . . . . . . . . . . . . . . . . . . . 68
Nested Vectored Interrupt Controller (NVIC) . 68
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 69
Event router . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Global Input Multiplexer Array (GIMA) . . . . . . 69
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
System Tick timer (SysTick) . . . . . . . . . . . . . . 69
On-chip static RAM. . . . . . . . . . . . . . . . . . . . . 69
ISP (In-System Programming) mode . . . . . . . 70
Boot ROM. . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Memory mapping . . . . . . . . . . . . . . . . . . . . . . 72
Security features. . . . . . . . . . . . . . . . . . . . . . . 74
AES security engine . . . . . . . . . . . . . . . . . . . . 74
7.4
7.4.1
7.4.2
7.5
7.6
7.6.1
7.7
7.8
7.8.1
7.9
7.10
7.11
7.11.1
7.15
7.15.1
Counter/timers and motor control . . . . . . . . . 83
General purpose 32-bit timers/external event
counter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
7.15.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
7.15.2
7.15.3
7.15.3.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
7.15.4 Repetitive Interrupt (RI) timer. . . . . . . . . . . . . 84
7.15.4.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
7.15.5 Windowed WatchDog Timer (WWDT) . . . . . . 85
7.15.5.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Motor control PWM . . . . . . . . . . . . . . . . . . . . 84
Quadrature Encoder Interface (QEI) . . . . . . . 84
7.16
7.16.1
Analog peripherals. . . . . . . . . . . . . . . . . . . . . 85
Analog-to-Digital Converter . . . . . . . . . . . . . . 85
7.11.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
7.11.2
7.12
7.12.1
7.13
7.13.1
7.13.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
7.13.2 General Purpose DMA (GPDMA). . . . . . . . . . 75
7.13.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
7.13.3 SPI Flash Interface (SPIFI). . . . . . . . . . . . . . . 76
7.13.3.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
One-Time Programmable (OTP) memory . . . 74
General Purpose I/O (GPIO) . . . . . . . . . . . . . 74
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
AHB peripherals . . . . . . . . . . . . . . . . . . . . . . . 75
State Configurable Timer (SCT) subsystem . . 75
7.16.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
7.16.2 Digital-to-Analog Converter (DAC). . . . . . . . . 86
7.16.2.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
7.17
7.17.1
7.17.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
7.17.2
7.18
7.18.1
7.18.2
7.18.3
7.18.4
7.18.5
7.18.6
7.18.7
7.18.8
7.18.9
7.19
Peripherals in the RTC power domain. . . . . . 86
RTC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Alarm timer. . . . . . . . . . . . . . . . . . . . . . . . . . . 86
System control . . . . . . . . . . . . . . . . . . . . . . . . 86
Configuration registers (CREG). . . . . . . . . . . 86
System Control Unit (SCU) . . . . . . . . . . . . . . 87
Clock Generation Unit (CGU) . . . . . . . . . . . . 87
Internal RC oscillator (IRC) . . . . . . . . . . . . . . 87
PLL0USB (for USB0) . . . . . . . . . . . . . . . . . . . 87
PLL0AUDIO (for audio) . . . . . . . . . . . . . . . . . 87
System PLL1 . . . . . . . . . . . . . . . . . . . . . . . . . 88
Reset Generation Unit (RGU) . . . . . . . . . . . . 88
Power control. . . . . . . . . . . . . . . . . . . . . . . . . 88
Emulation and debugging . . . . . . . . . . . . . . . 89
7.13.4
7.13.5
SD/MMC card interface . . . . . . . . . . . . . . . . . 77
External Memory Controller (EMC). . . . . . . . . 77
7.13.5.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
7.13.6
High-speed USB Host/Device/OTG interface
(USB0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
7.13.6.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
7.13.7
High-speed USB Host/Device interface
with ULPI (USB1) . . . . . . . . . . . . . . . . . . . . . . 78
7.13.7.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
7.13.8
8
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 90
LCD controller. . . . . . . . . . . . . . . . . . . . . . . . . 78
continued >>
LPC1850_30_20_10
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
156 of 157
LPC1850/30/20/10
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
9
Thermal characteristics . . . . . . . . . . . . . . . . . 91
10
10.1
10.2
Static characteristics. . . . . . . . . . . . . . . . . . . . 92
Power consumption . . . . . . . . . . . . . . . . . . . . 97
Electrical pin characteristics . . . . . . . . . . . . . 101
11
Dynamic characteristics . . . . . . . . . . . . . . . . 103
Wake-up times . . . . . . . . . . . . . . . . . . . . . . . 103
External clock . . . . . . . . . . . . . . . . . . . . . . . . 103
Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . 104
IRC and RTC oscillators . . . . . . . . . . . . . . . . 105
I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
I2S-bus interface. . . . . . . . . . . . . . . . . . . . . . 107
USART interface. . . . . . . . . . . . . . . . . . . . . . 108
SSP interface . . . . . . . . . . . . . . . . . . . . . . . . 109
External memory interface . . . . . . . . . . . . . . 112
USB interface . . . . . . . . . . . . . . . . . . . . . . . 117
Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
SD/MMC. . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
LCD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.9
11.10
11.11
11.12
11.13
12
ADC/DAC electrical characteristics . . . . . . . 121
13
Application information. . . . . . . . . . . . . . . . . 124
LCD panel signal usage . . . . . . . . . . . . . . . . 124
Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . 126
XTAL and RTCX Printed Circuit Board
13.1
13.2
13.3
(PCB) layout guidelines . . . . . . . . . . . . . . . . 128
Standard I/O pin configuration . . . . . . . . . . . 128
Reset pin configuration. . . . . . . . . . . . . . . . . 129
13.4
13.5
14
Package outline . . . . . . . . . . . . . . . . . . . . . . . 130
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
15
16
16.1
Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
Static characteristics for
LPC1850/30/20/10 Rev’-’ parts. . . . . . . . . . . 142
Power consumption . . . . . . . . . . . . . . . . . . . 144
16.2
17
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . 148
Revision history. . . . . . . . . . . . . . . . . . . . . . . 150
18
19
Legal information. . . . . . . . . . . . . . . . . . . . . . 154
Data sheet status . . . . . . . . . . . . . . . . . . . . . 154
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . 154
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . 154
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . 155
19.1
19.2
19.3
19.4
20
21
Contact information. . . . . . . . . . . . . . . . . . . . 155
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 6 December 2011
Document identifier: LPC1850_30_20_10
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