LPC214X [NXP]

Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, USB 2.0 full-speed device, 10-bit ADC and DAC; 单芯片16位/ 32位微控制器;高达512 KB的闪存, ISP / IAP , USB 2.0全速设备, 10位ADC和DAC
LPC214X
型号: LPC214X
厂家: NXP    NXP
描述:

Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, USB 2.0 full-speed device, 10-bit ADC and DAC
单芯片16位/ 32位微控制器;高达512 KB的闪存, ISP / IAP , USB 2.0全速设备, 10位ADC和DAC

闪存 微控制器
文件: 总38页 (文件大小:185K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LPC2141/42/44/46/48  
Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash  
with ISP/IAP, USB 2.0 full-speed device, 10-bit ADC and DAC  
Rev. 01 — 3 October 2005  
Preliminary data sheet  
1. General description  
The LPC2141/42/44/46/48 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S  
CPU with real-time emulation and embedded trace support, that combine microcontroller  
with embedded high-speed flash memory ranging from 32 kB to 512 kB. A 128-bit wide  
memory interface and a unique accelerator architecture enable 32-bit code execution at  
the maximum clock rate. For critical code size applications, the alternative 16-bit Thumb  
mode reduces code by more than 30 % with minimal performance penalty.  
Due to their tiny size and low power consumption, LPC2141/42/44/46/48 are ideal for  
applications where miniaturization is a key requirement, such as access control and  
point-of-sale. Serial communications interfaces ranging from a USB 2.0 Full-speed device,  
multiple UARTs, SPI, SSP to I2C-bus and on-chip SRAM of 8 kB up to 40 kB, make these  
devices very well suited for communication gateways and protocol converters, soft  
modems, voice recognition and low end imaging, providing both large buffer size and high  
processing power. Various 32-bit timers, single or dual 10-bit ADC(s), 10-bit DAC, PWM  
channels and 45 fast GPIO lines with up to nine edge or level sensitive external interrupt  
pins make these microcontrollers suitable for industrial control and medical systems.  
2. Features  
2.1 Key features  
16-bit/32-bit ARM7TDMI-S microcontroller in a tiny LQFP64 package.  
8 kB to 40 kB of on-chip static RAM and 32 kB to 512 kB of on-chip flash memory.  
128-bit wide interface/accelerator enables high-speed 60 MHz operation.  
In-System Programming/In-Application Programming (ISP/IAP) via on-chip boot  
loader software. Single flash sector or full chip erase in 400 ms and programming of  
256 bytes in 1 ms.  
EmbeddedICE RT and Embedded Trace interfaces offer real-time debugging with the  
on-chip RealMonitor software and high-speed tracing of instruction execution.  
USB 2.0 Full-speed compliant device controller with 2 kB of endpoint RAM.  
In addition, the LPC2146/48 provides 8 kB of on-chip RAM accessible to USB by DMA.  
One or two (LPC2141/42 vs. LPC2144/46/48) 10-bit ADCs provide a total of 6/14  
analog inputs, with conversion times as low as 2.44 µs per channel.  
Single 10-bit DAC provides variable analog output (LPC2142/44/46/48 only).  
Two 32-bit timers/external event counters (with four capture and four compare  
channels each), PWM unit (six outputs) and watchdog.  
Low power Real-Time Clock (RTC) with independent power and 32 kHz clock input.  
LPC2141/42/44/46/48  
Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
Multiple serial interfaces including two UARTs (16C550), two Fast I2C-bus (400 kbit/s),  
SPI and SSP with buffering and variable data length capabilities.  
Vectored Interrupt Controller (VIC) with configurable priorities and vector addresses.  
Up to 45 of 5 V tolerant fast general purpose I/O pins in a tiny LQFP64 package.  
Up to 21 external interrupt pins available.  
60 MHz maximum CPU clock available from programmable on-chip PLL with settling  
time of 100 µs.  
On-chip integrated oscillator operates with an external crystal from 1 MHz to 25 MHz.  
Power saving modes include Idle and Power-down.  
Individual enable/disable of peripheral functions as well as peripheral clock scaling for  
additional power optimization.  
Processor wake-up from Power-down mode via external interrupt or BOD.  
Single power supply chip with POR and BOD circuits:  
CPU operating voltage range of 3.0 V to 3.6 V (3.3 V ± 10 %) with 5 V tolerant I/O  
pads.  
3. Ordering information  
Table 1:  
Ordering information  
Type number  
Package  
Name  
Description  
Version  
LPC2141FBD64 LQFP64  
LPC2142FBD64  
plastic low profile quad flat package; 64 leads; SOT314-2  
body 10 × 10 × 1.4 mm  
LPC2144FBD64  
LPC2146FBD64  
LPC2148FBD64  
3.1 Ordering options  
Table 2:  
Ordering options  
Type number  
Flash  
memory  
RAM  
Endpoint ADC (channels DAC  
USB RAM overall)  
Temperature  
range (°C)  
40 to +85  
40 to +85  
40 to +85  
40 to +85  
LPC2141FBD64 32 kB  
LPC2142FBD64 64 kB  
LPC2144FBD64 128 kB  
LPC2146FBD64 256 kB  
8 kB  
2 kB  
2 kB  
2 kB  
1 (6 channels)  
1 (6 channels)  
2 (14 channels)  
2 (14 channels)  
-
16 kB  
16 kB  
1
1
1
32 kB + 8 kB 2 kB  
shared with  
USB DMA[1]  
LPC2148FBD64 512 kB  
32 kB + 8 kB 2 kB  
shared with  
USB DMA[1]  
2 (14 channels)  
1
40 to +85  
[1] While the USB DMA is the primary user of the additional 8 kB RAM, this RAM is also accessible at any time  
by the CPU as a general purpose RAM for data and code storage.  
9397 750 14985  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Preliminary data sheet  
Rev. 01 — 3 October 2005  
2 of 38  
LPC2141/42/44/46/48  
Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
4. Block diagram  
(1)  
(1)  
TMS  
(1)  
TDI  
(1)  
XTAL2  
(1)  
TRST  
TCK  
TDO  
XTAL1  
RST  
LPC2141/42/44/46/48  
PLL0  
PLL1  
TEST/DEBUG  
INTERFACE  
P0[31:28] and  
P0[25:0]  
SYSTEM  
FUNCTIONS  
system  
clock  
FAST GENERAL  
PURPOSE I/O  
ARM7TDMI-S  
P1[31:16]  
AHB BRIDGE  
VECTORED  
INTERRUPT  
CONTROLLER  
USB  
clock  
ARM7 local bus  
AMBA AHB  
(Advanced High-performance Bus)  
INTERNAL  
SRAM  
CONTROLLER  
INTERNAL  
FLASH  
CONTROLLER  
AHB  
DECODER  
8 kB RAM  
8 kB/16 kB/  
32 kB  
SRAM  
32 kB/64 kB/128 kB/  
256 kB/512 kB  
FLASH  
AHB TO VPB  
BRIDGE  
VPB  
DIVIDER  
SHARED WITH  
(3)  
USB DMA  
VPB (VLSI  
peripheral bus)  
D+  
D  
UP_LED  
CONNECT  
VBUS  
USB 2.0 FULL-SPEED  
DEVICE CONTROLLER  
EXTERNAL  
INTERRUPTS  
EINT3 to EINT0  
(3)  
WITH DMA  
4 × CAP0  
4 × CAP1  
8 × MAT0  
SCL0, SCL1  
SDA0, SDA1  
CAPTURE/COMPARE  
(W/EXTERNAL CLOCK)  
TIMER 0/TIMER 1  
2
I C-BUS SERIAL  
INTERFACES 0 AND 1  
8 × MAT1  
AD0[7:6] and  
AD0[4:1]  
SCK0, SCK1  
A/D CONVERTERS  
SPI AND SSP  
SERIAL INTERFACES  
MOSI0, MOSI1  
MISO0, MISO1  
SSEL0, SSEL1  
(2)  
(2)  
0 AND 1  
AD1[7:0]  
TXD0, TXD1  
RXD0, RXD1  
(4)  
D/A CONVERTER  
UART0/UART1  
AOUT  
(2)  
(2)  
DSR1 ,CTS1  
,
(2)  
(2)  
RTS1 , DTR1  
(2)  
(2)  
DCD1 ,RI1  
P0[31:28] and  
P0[25:0]  
RTXC1  
RTXC2  
VBAT  
GENERAL  
PURPOSE I/O  
REAL-TIME CLOCK  
P1[31:16]  
WATCHDOG  
TIMER  
PWM6 to PWM0  
PWM0  
SYSTEM  
CONTROL  
002aab560  
(1) Pins shared with GPIO.  
(2) LPC2144/46/48 only.  
(3) USB DMA controller with 8 kB of RAM accessible as general purpose RAM and/or DMA is available in LPC2146/48 only.  
(4) LPC2142/44/46/48 only.  
Fig 1. Block diagram  
9397 750 14985  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Preliminary data sheet  
Rev. 01 — 3 October 2005  
3 of 38  
LPC2141/42/44/46/48  
Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
5. Pinning information  
5.1 Pinning  
1
2
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
P0.21/PWM5/CAP1.3  
P0.22/CAP0.0/MAT0.0  
RTXC1  
P1.20/TRACESYNC  
P0.17/CAP1.2/SCK1/MAT1.2  
P0.16/EINT0/MAT0.2/CAP0.2  
P0.15/EINT2  
3
4
P1.19/TRACEPKT3  
RTXC2  
5
P1.21/PIPESTAT0  
6
V
V
V
SS  
DD  
SS  
7
V
DDA  
8
P1.18/TRACEPKT2  
P0.25/AD0.4  
P0.14/EINT1/SDA1  
P1.22/PIPESTAT1  
P0.13/MAT1.1  
LPC2141  
9
10  
11  
12  
13  
14  
15  
16  
D+  
D  
P0.12/MAT1.0  
P1.17/TRACEPKT1  
P0.28/AD0.1/CAP0.2/MAT0.2  
P0.29/AD0.2/CAP0.3/MAT0.3  
P0.30/AD0.3/EINT3/CAP0.0  
P1.16/TRACEPKT0  
P0.11/CAP1.1/SCL1  
P1.23/PIPESTAT2  
P0.10/CAP1.0  
P0.9/RXD1/PWM6/EINT3  
P0.8/TXD1/PWM4  
002aab733  
Fig 2. LPC2141 pinning  
9397 750 14985  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Preliminary data sheet  
Rev. 01 — 3 October 2005  
4 of 38  
LPC2141/42/44/46/48  
Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
1
2
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
P0.21/PWM5/CAP1.3  
P0.22/CAP0.0/MAT0.0  
RTXC1  
P1.20/TRACESYNC  
P0.17/CAP1.2/SCK1/MAT1.2  
P0.16/EINT0/MAT0.2/CAP0.2  
P0.15/EINT2  
3
4
P1.19/TRACEPKT3  
RTXC2  
5
P1.21/PIPESTAT0  
6
V
V
V
SS  
DD  
SS  
7
V
DDA  
8
P1.18/TRACEPKT2  
P0.25/AD0.4/AOUT  
D+  
P0.14/EINT1/SDA1  
P1.22/PIPESTAT1  
P0.13/MAT1.1  
LPC2142  
9
10  
11  
12  
13  
14  
15  
16  
D−  
P0.12/MAT1.0  
P1.17/TRACEPKT1  
P0.28/AD0.1/CAP0.2/MAT0.2  
P0.29/AD0.2/CAP0.3/MAT0.3  
P0.30/AD0.3/EINT3/CAP0.0  
P1.16/TRACEPKT0  
P0.11/CAP1.1/SCL1  
P1.23/PIPESTAT2  
P0.10/CAP1.0  
P0.9/RXD1/PWM6/EINT3  
P0.8/TXD1/PWM4  
002aab734  
Fig 3. LPC2142 pinning  
9397 750 14985  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Preliminary data sheet  
Rev. 01 — 3 October 2005  
5 of 38  
LPC2141/42/44/46/48  
Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
1
2
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
P0.21/PWM5/AD1.6/CAP1.3  
P0.22/AD1.7/CAP0.0/MAT0.0  
RTXC1  
P1.20/TRACESYNC  
P0.17/CAP1.2/SCK1/MAT1.2  
P0.16/EINT0/MAT0.2/CAP0.2  
P0.15/RI1/EINT2/AD1.5  
P1.21/PIPESTAT0  
3
4
P1.19/TRACEPKT3  
RTXC2  
5
6
V
V
V
SS  
DD  
SS  
7
V
DDA  
8
P1.18/TRACEPKT2  
P0.25/AD0.4/AOUT  
D+  
P0.14/DCD1/EINT1/SDA1  
P1.22/PIPESTAT1  
LPC2144/2146/2148  
9
10  
11  
12  
13  
14  
15  
16  
P0.13/DTR1/MAT1.1/AD1.4  
P0.12/DSR1/MAT1.0/AD1.3  
P0.11/CTS1/CAP1.1/SCL1  
P1.23/PIPESTAT2  
D−  
P1.17/TRACEPKT1  
P0.28/AD0.1/CAP0.2/MAT0.2  
P0.29/AD0.2/CAP0.3/MAT0.3  
P0.30/AD0.3/EINT3/CAP0.0  
P1.16/TRACEPKT0  
P0.10/RTS1/CAP1.0/AD1.2  
P0.9/RXD1/PWM6/EINT3  
P0.8/TXD1/PWM4/AD1.1  
002aab735  
Fig 4. LPC2144/2146/2148 pinning  
9397 750 14985  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Preliminary data sheet  
Rev. 01 — 3 October 2005  
6 of 38  
LPC2141/42/44/46/48  
Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
5.2 Pin description  
Table 3:  
Symbol  
Pin description  
Pin  
Type  
Description  
P0.0 to P0.31  
I/O  
Port 0: Port 0 is a 32-bit I/O port with individual direction controls for each bit.  
Total of 31 pins of the Port 0 can be used as a general purpose bidirectional  
digital I/Os while P0.31 is output only pin. The operation of port 0 pins  
depends upon the pin function selected via the pin connect block.  
Pins P0.24, P0.26 and P0.27 are not available.  
P0.0 — General purpose input/output digital pin (GPIO).  
TXD0 — Transmitter output for UART0.  
P0.0/TXD0/  
PWM1  
19[1]  
I/O  
O
O
PWM1 — Pulse Width Modulator output 1.  
P0.1/RXD0/  
PWM3/EINT0  
21[2]  
I/O  
I
P0.1 — General purpose input/output digital pin (GPIO).  
RXD0 — Receiver input for UART0.  
O
PWM3 — Pulse Width Modulator output 3.  
I
EINT0 — External interrupt 0 input  
P0.2/SCL0/  
CAP0.0  
22[3]  
I/O  
I/O  
I
P0.2 — General purpose input/output digital pin (GPIO).  
SCL0 — I2C0 clock input/output. Open-drain output (for I2C-bus compliance).  
CAP0.0 — Capture input for Timer 0, channel 0.  
P0.3 — General purpose input/output digital pin (GPIO).  
SDA0 — I2C0 data input/output. Open-drain output (for I2C-bus compliance).  
MAT0.0 — Match output for Timer 0, channel 0.  
EINT1 — External interrupt 1 input.  
P0.3/SDA0/  
MAT0.0/EINT1  
26[3]  
I/O  
I/O  
O
I
P0.4/SCK0/  
CAP0.1/AD0.6  
27[4]  
I/O  
I/O  
I
P0.4 — General purpose input/output digital pin (GPIO).  
SCK0 — Serial clock for SPI0. SPI clock output from master or input to slave.  
CAP0.1 — Capture input for Timer 0, channel 0.  
AD0.6 — ADC 0, input 6.  
I
P0.5/MISO0/  
MAT0.1/AD0.7  
29[4]  
I/O  
I/O  
P0.5 — General purpose input/output digital pin (GPIO).  
MISO0 — Master In Slave OUT for SPI0. Data input to SPI master or data  
output from SPI slave.  
O
MAT0.1 — Match output for Timer 0, channel 1.  
AD0.7 — ADC 0, input 7.  
I
P0.6/MOSI0/  
CAP0.2/AD1.0  
30[4]  
I/O  
I/O  
P0.6 — General purpose input/output digital pin (GPIO).  
MOSI0 — Master Out Slave In for SPI0. Data output from SPI master or data  
input to SPI slave.  
I
CAP0.2 — Capture input for Timer 0, channel 2.  
AD1.0 — ADC 1, input 0. Available in LPC2144/46/48 only.  
P0.7 — General purpose input/output digital pin (GPIO).  
SSEL0 — Slave Select for SPI0. Selects the SPI interface as a slave.  
PWM2 — Pulse Width Modulator output 2.  
I
P0.7/SSEL0/  
PWM2/EINT2  
31[2]  
I/O  
I
O
I
EINT2 — External interrupt 2 input.  
P0.8/TXD1/  
PWM4/AD1.1  
33[4]  
I/O  
O
O
I
P0.8 — General purpose input/output digital pin (GPIO).  
TXD1 — Transmitter output for UART1.  
PWM4 — Pulse Width Modulator output 4.  
AD1.1 — ADC 1, input 1. Available in LPC2144/46/48 only.  
9397 750 14985  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Preliminary data sheet  
Rev. 01 — 3 October 2005  
7 of 38  
LPC2141/42/44/46/48  
Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
Table 3:  
Symbol  
Pin description …continued  
Pin  
Type  
Description  
P0.9/RXD1/  
PWM6/EINT3  
34[2]  
I/O  
I
P0.9 — General purpose input/output digital pin (GPIO).  
RXD1 — Receiver input for UART1.  
O
I
PWM6 — Pulse Width Modulator output 6.  
EINT3 — External interrupt 3 input.  
P0.10/RTS1/  
CAP1.0/AD1.2  
35[4]  
37[3]  
38[4]  
39[4]  
41[3]  
I/O  
O
I
P0.10 — General purpose input/output digital pin (GPIO).  
RTS1 — Request to Send output for UART1. LPC2144/46/48 only.  
CAP1.0 — Capture input for Timer 1, channel 0.  
I
AD1.2 — ADC 1, input 2. Available in LPC2144/46/48 only.  
P0.11 — General purpose input/output digital pin (GPIO).  
CTS1 — Clear to Send input for UART1. Available in LPC2144/46/48 only.  
CAP1.1 — Capture input for Timer 1, channel 1.  
SCL1 — I2C1 clock input/output. Open-drain output (for I2C-bus compliance)  
P0.12 — General purpose input/output digital pin (GPIO).  
DSR1 — Data Set Ready input for UART1. Available in LPC2144/46/48 only.  
MAT1.0 — Match output for Timer 1, channel 0.  
P0.11/CTS1/  
CAP1.1/SCL1  
I/O  
I
I
I/O  
I/O  
I
P0.12/DSR1/  
MAT1.0/AD1.3  
O
I
AD1.3 — ADC input 3. Available in LPC2144/46/48 only.  
P0.13 — General purpose input/output digital pin (GPIO).  
DTR1 — Data Terminal Ready output for UART1. LPC2144/46/48 only.  
MAT1.1 — Match output for Timer 1, channel 1.  
P0.13/DTR1/  
MAT1.1/AD1.4  
I/O  
O
O
I
AD1.4 — ADC input 4. Available in LPC2144/46/48 only.  
P0.14 — General purpose input/output digital pin (GPIO).  
DCD1 — Data Carrier Detect input for UART1. LPC2144/46/48 only.  
EINT1 — External interrupt 1 input.  
P0.14/DCD1/  
EINT1/SDA1  
I/O  
I
I
I/O  
SDA1 — I2C1 data input/output. Open-drain output (for I2C-bus compliance)  
Note: LOW on this pin while RESET is LOW forces on-chip boot loader to  
take over control of the part after reset.  
P0.15/RI1/  
EINT2/AD1.5  
45[4]  
I/O  
P0.15 — General purpose input/output digital pin (GPIO).  
RI1 — Ring Indicator input for UART1. Available in LPC2144/46/48 only.  
EINT2 — External interrupt 2 input.  
I
I
I
AD1.5 — ADC 1, input 5. Available in LPC2144/46/48 only.  
P0.16 — General purpose input/output digital pin (GPIO).  
EINT0 — External interrupt 0 input.  
P0.16/EINT0/  
46[2]  
I/O  
I
MAT0.2/CAP0.2  
O
I
MAT0.2 — Match output for Timer 0, channel 2.  
CAP0.2 — Capture input for Timer 0, channel 2.  
P0.17/CAP1.2/ 47[1]  
SCK1/MAT1.2  
I/O  
I
P0.17 — General purpose input/output digital pin (GPIO).  
CAP1.2 — Capture input for Timer 1, channel 2.  
I/O  
O
SCK1 — Serial Clock for SSP. Clock output from master or input to slave.  
MAT1.2 — Match output for Timer 1, channel 2.  
9397 750 14985  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Preliminary data sheet  
Rev. 01 — 3 October 2005  
8 of 38  
LPC2141/42/44/46/48  
Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
Table 3:  
Symbol  
P0.18/CAP1.3/ 53[1]  
MISO1/MAT1.3  
Pin description …continued  
Pin  
Type  
I/O  
I
Description  
P0.18 — General purpose input/output digital pin (GPIO).  
CAP1.3 — Capture input for Timer 1, channel 3.  
I/O  
MISO1 — Master In Slave Out for SSP. Data input to SPI master or data  
output from SSP slave.  
O
MAT1.3 — Match output for Timer 1, channel 3.  
P0.19 — General purpose input/output digital pin (GPIO).  
MAT1.2 — Match output for Timer 1, channel 2.  
P0.19/MAT1.2/ 54[1]  
MOSI1/CAP1.2  
I/O  
O
I/O  
MOSI1 — Master Out Slave In for SSP. Data output from SSP master or data  
input to SSP slave.  
I
CAP1.2 — Capture input for Timer 1, channel 2.  
P0.20 — General purpose input/output digital pin (GPIO).  
MAT1.3 — Match output for Timer 1, channel 3.  
SSEL1 — Slave Select for SSP. Selects the SSP interface as a slave.  
EINT3 — External interrupt 3 input.  
P0.20/MAT1.3/ 55[2]  
SSEL1/EINT3  
I/O  
O
I
I
P0.21/PWM5/  
AD1.6/CAP1.3  
1[4]  
I/O  
P0.21 — General purpose input/output digital pin (GPIO).  
PWM5 — Pulse Width Modulator output 5.  
O
I
AD1.6 — ADC 1, input 6. Available in LPC2144/46/48 only.  
CAP1.3 — Capture input for Timer 1, channel 3.  
P0.22 — General purpose input/output digital pin (GPIO).  
AD1.7 — ADC 1, input 7. Available in LPC2144/46/48 only.  
CAP0.0 — Capture input for Timer 0, channel 0.  
MAT0.0 — Match output for Timer 0, channel 0.  
P0.23 — General purpose input/output digital pin (GPIO).  
VBUS Indicates the presence of USB bus power.  
Note: This signal must be HIGH for USB reset to occur.  
P0.25 — General purpose input/output digital pin (GPIO).  
AD0.4 — ADC 0, input 4.  
I
P0.22/AD1.7/  
2[4]  
I/O  
CAP0.0/MAT0.0  
I
I
O
I/O  
I
P0.23/VBUS  
58[1]  
P0.25/AD0.4/  
AOUT  
9[5]  
I/O  
I
O
AOUT — DAC output. Available in LPC2142/44/46/48 only.  
P0.28 — General purpose input/output digital pin (GPIO).  
AD0.1 — ADC 0, input 1.  
P0.28/AD0.1/  
13[4]  
I/O  
CAP0.2/MAT0.2  
I
I
CAP0.2 — Capture input for Timer 0, channel 2.  
MAT0.2 — Match output for Timer 0, channel 2.  
P0.29 — General purpose input/output digital pin (GPIO).  
AD0.2 — ADC 0, input 2.  
O
P0.29/AD0.2/  
14[4]  
I/O  
CAP0.3/MAT0.3  
I
I
CAP0.3 — Capture input for Timer 0, Channel 3.  
MAT0.3 — Match output for Timer 0, channel 3.  
P0.30 — General purpose input/output digital pin (GPIO).  
AD0.3 — ADC 0, input 3.  
O
P0.30/AD0.3/  
15[4]  
I/O  
EINT3/CAP0.0  
I
I
I
EINT3 — External interrupt 3 input.  
CAP0.0 — Capture input for Timer 0, channel 0.  
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LPC2141/42/44/46/48  
Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
Table 3:  
Symbol  
P0.31/UP_LED/ 17[6]  
CONNECT  
Pin description …continued  
Pin  
Type  
O
Description  
P0.31 — General purpose output only digital pin (GPO).  
O
UP_LED — USB GoodLink LED indicator. It is LOW when device is  
configured (non-control endpoints enabled). It is HIGH when the device is not  
configured or during global suspend.  
O
CONNECT — Signal used to switch an external 1.5 kresistor under the  
software control. Used with the SoftConnect USB feature.  
Important: This is an digital output only pin. This pin MUST NOT be  
externally pulled LOW when RESET pin is LOW or the JTAG port will be  
disabled.  
P1.0 to P1.31  
I/O  
Port 1: Port 1 is a 32-bit bidirectional I/O port with individual direction controls  
for each bit. The operation of port 1 pins depends upon the pin function  
selected via the pin connect block. Pins 0 through 15 of port 1 are not  
available.  
P1.16/  
TRACEPKT0  
16[6]  
12[6]  
8[6]  
I/O  
O
P1.16 — General purpose input/output digital pin (GPIO).  
TRACEPKT0 — Trace Packet, bit 0. Standard I/O port with internal pull-up.  
P1.17 — General purpose input/output digital pin (GPIO).  
P1.17/  
TRACEPKT1  
I/O  
O
TRACEPKT1 — Trace Packet, bit 1. Standard I/O port with internal pull-up.  
P1.18 — General purpose input/output digital pin (GPIO).  
P1.18/  
TRACEPKT2  
I/O  
O
TRACEPKT2 — Trace Packet, bit 2. Standard I/O port with internal pull-up.  
P1.19 — General purpose input/output digital pin (GPIO).  
P1.19/  
TRACEPKT3  
4[6]  
I/O  
O
TRACEPKT3 — Trace Packet, bit 3. Standard I/O port with internal pull-up.  
P1.20 — General purpose input/output digital pin (GPIO).  
P1.20/  
TRACESYNC  
48[6]  
I/O  
O
TRACESYNC — Trace Synchronization. Standard I/O port with internal  
pull-up.  
Note: LOW on this pin while RESET is LOW enables pins P1.25:16 to  
operate as Trace port after reset.  
P1.21/  
PIPESTAT0  
44[6]  
40[6]  
36[6]  
32[6]  
I/O  
O
P1.21 — General purpose input/output digital pin (GPIO).  
PIPESTAT0 — Pipeline Status, bit 0. Standard I/O port with internal pull-up.  
P1.22 — General purpose input/output digital pin (GPIO).  
P1.22/  
PIPESTAT1  
I/O  
O
PIPESTAT1 — Pipeline Status, bit 1. Standard I/O port with internal pull-up.  
P1.23 — General purpose input/output digital pin (GPIO).  
P1.23/  
PIPESTAT2  
I/O  
O
PIPESTAT2 — Pipeline Status, bit 2. Standard I/O port with internal pull-up.  
P1.24 — General purpose input/output digital pin (GPIO).  
P1.24/  
TRACECLK  
I/O  
O
TRACECLK — Trace Clock. Standard I/O port with internal pull-up.  
P1.25 — General purpose input/output digital pin (GPIO).  
P1.25/EXTIN0 28[6]  
I/O  
I
EXTIN0 — External Trigger Input. Standard I/O with internal pull-up.  
P1.26 — General purpose input/output digital pin (GPIO).  
P1.26/RTCK  
24[6]  
I/O  
I/O  
RTCK — Returned Test Clock output. Extra signal added to the JTAG port.  
Assists debugger synchronization when processor frequency varies.  
Bidirectional pin with internal pull-up.  
Note: LOW on RTCK while RESET is LOW enables pins P1.31:26 to operate  
as Debug port after reset.  
P1.27/TDO  
64[6]  
I/O  
O
P1.27 — General purpose input/output digital pin (GPIO).  
TDO — Test Data out for JTAG interface.  
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Preliminary data sheet  
Rev. 01 — 3 October 2005  
10 of 38  
LPC2141/42/44/46/48  
Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
Table 3:  
Symbol  
P1.28/TDI  
Pin description …continued  
Pin  
Type  
Description  
60[6]  
I/O  
I
P1.28 — General purpose input/output digital pin (GPIO).  
TDI — Test Data in for JTAG interface.  
P1.29/TCK  
P1.30/TMS  
P1.31/TRST  
56[6]  
52[6]  
20[6]  
I/O  
I
P1.29 — General purpose input/output digital pin (GPIO).  
TCK — Test Clock for JTAG interface.  
I/O  
I
P1.30 — General purpose input/output digital pin (GPIO).  
TMS — Test Mode Select for JTAG interface.  
P1.31 — General purpose input/output digital pin (GPIO).  
TRST — Test Reset for JTAG interface.  
I/O  
I
D+  
10[7]  
11[7]  
57[8]  
I/O  
I/O  
I
USB bidirectional D+ line.  
D−  
USB bidirectional Dline.  
RESET  
External reset input: A LOW on this pin resets the device, causing I/O ports  
and peripherals to take on their default states, and processor execution to  
begin at address 0. TTL with hysteresis, 5 V tolerant.  
XTAL1  
XTAL2  
RTXC1  
RTXC2  
VSS  
62[9]  
61[9]  
3[9]  
I
Input to the oscillator circuit and internal clock generator circuits.  
Output from the oscillator amplifier.  
O
I
Input to the RTC oscillator circuit.  
5[9]  
O
I
Output from the RTC oscillator circuit.  
Ground: 0 V reference.  
6, 18, 25, 42,  
50  
VSSA  
VDD  
59  
I
I
I
Analog ground: 0 V reference. This should nominally be the same voltage  
as VSS, but should be isolated to minimize noise and error.  
23, 43, 51  
7
3.3 V power supply: This is the power supply voltage for the core and I/O  
ports.  
VDDA  
Analog 3.3 V power supply: This should be nominally the same voltage as  
VDD but should be isolated to minimize noise and error. This voltage is only  
used to power the on-chip ADC(s) and DAC.  
VREF  
VBAT  
63  
49  
I
I
A/D converter reference voltage: This should be nominally less than or  
equal to the VDD voltage but should be isolated to minimize noise and error.  
Level on this pin is used as a reference for ADC(s) and DAC.  
RTC power supply voltage: 3.3 V on this pin supplies the power to the RTC.  
[1] 5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control.  
[2] 5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control. If configured for an input  
function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns.  
[3] Open-drain 5 V tolerant digital I/O I2C-bus 400 kHz specification compatible pad. It requires external pull-up to provide an output  
functionality.  
[4] 5 V tolerant pad providing digital I/O (with TTL levels and hysteresis and 10 ns slew rate control) and analog input function. If configured  
for an input function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns. When configured as an ADC input, digital  
section of the pad is disabled.  
[5] 5 V tolerant pad providing digital I/O (with TTL levels and hysteresis and 10 ns slew rate control) and analog output function. When  
configured as the DAC output, digital section of the pad is disabled.  
[6] 5 V tolerant pad with built-in pull-up resistor providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control.  
The pull-up resistor’s value typically ranges from 60 kto 300 k.  
[7] Pad is designed in accordance with the Universal Serial Bus (USB) specification, revision 2.0 (Full-speed and Low-speed mode only).  
[8] 5 V tolerant pad providing digital input (with TTL levels and hysteresis) function only.  
[9] Pad provides special analog functionality.  
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11 of 38  
LPC2141/42/44/46/48  
Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
6. Functional description  
6.1 Architectural overview  
The ARM7TDMI-S is a general purpose 32-bit microprocessor, which offers high  
performance and very low power consumption. The ARM architecture is based on  
Reduced Instruction Set Computer (RISC) principles, and the instruction set and related  
decode mechanism are much simpler than those of microprogrammed Complex  
Instruction Set Computers (CISC). This simplicity results in a high instruction throughput  
and impressive real-time interrupt response from a small and cost-effective processor  
core.  
Pipeline techniques are employed so that all parts of the processing and memory systems  
can operate continuously. Typically, while one instruction is being executed, its successor  
is being decoded, and a third instruction is being fetched from memory.  
The ARM7TDMI-S processor also employs a unique architectural strategy known as  
Thumb, which makes it ideally suited to high-volume applications with memory  
restrictions, or applications where code density is an issue.  
The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the  
ARM7TDMI-S processor has two instruction sets:  
The standard 32-bit ARM set.  
A 16-bit Thumb set.  
The Thumb set’s 16-bit instruction length allows it to approach twice the density of  
standard ARM code while retaining most of the ARM’s performance advantage over a  
traditional 16-bit processor using 16-bit registers. This is possible because Thumb code  
operates on the same 32-bit register set as ARM code.  
Thumb code is able to provide up to 65 % of the code size of ARM, and 160 % of the  
performance of an equivalent ARM processor connected to a 16-bit memory system.  
The particular flash implementation in the LPC2141/42/44/46/48 allows for full speed  
execution also in ARM mode. It is recommended to program performance critical and  
short code sections (such as interrupt service routines and DSP algorithms) in ARM  
mode. The impact on the overall code size will be minimal but the speed can be increased  
by 30 % over Thumb mode.  
6.2 On-chip flash program memory  
The LPC2141/42/44/46/48 incorporate a 32 kB, 64 kB, 128 kB, 256 kB and 512 kB flash  
memory system respectively. This memory may be used for both code and data storage.  
Programming of the flash memory may be accomplished in several ways. It may be  
programmed In System via the serial port. The application program may also erase and/or  
program the flash while the application is running, allowing a great degree of flexibility for  
data storage field firmware upgrades, etc. Due to the architectural solution chosen for an  
on-chip boot loader, flash memory available for user’s code on LPC2141/42/44/46/48 is  
32 kB, 64 kB, 128 kB, 256 kB and 500 kB respectively.  
The LPC2141/42/44/46/48 flash memory provides a minimum of 100,000 erase/write  
cycles and 20 years of data-retention.  
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Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
6.3 On-chip static RAM  
On-chip static RAM may be used for code and/or data storage. The SRAM may be  
accessed as 8-bit, 16-bit, and 32-bit. The LPC2141, LPC2142/44 and LPC2146/48  
provide 8 kB, 16 kB and 32 kB of static RAM respectively.  
In case of LPC2146/48 only, an 8 kB SRAM block intended to be utilized mainly by the  
USB can also be used as a general purpose RAM for data storage and code storage and  
execution.  
6.4 Memory map  
The LPC2141/42/44/46/48 memory map incorporates several distinct regions, as shown  
in Figure 5.  
In addition, the CPU interrupt vectors may be remapped to allow them to reside in either  
flash memory (the default) or on-chip static RAM. This is described in Section 6.19  
“System control”.  
4.0 GB  
0xFFFF FFFF  
AHB PERIPHERALS  
0xF000 0000  
0xE000 0000  
3.75 GB  
3.5 GB  
VPB PERIPHERALS  
3.0 GB  
2.0 GB  
RESERVED ADDRESS SPACE  
0xC000 0000  
0x8000 0000  
0x7FFF FFFF  
BOOT BLOCK (12 kB REMAPPED FROM  
ON-CHIP FLASH MEMORY  
0x7FFF D000  
0x7FFF CFFF  
RESERVED ADDRESS SPACE  
0x7FD0 2000  
0x7FD0 1FFF  
8 kB ON-CHIP USB DMA RAM (LPC2146/2148)  
RESERVED ADDRESS SPACE  
0x7FD0 0000  
0x7FCF FFFF  
0x4000 8000  
0x4000 7FFF  
32 kB ON-CHIP STATIC RAM (LPC2146/2148)  
16 kB ON-CHIP STATIC RAM (LPC2142/2144)  
8 kB ON-CHIP STATIC RAM (LPC2141)  
RESERVED ADDRESS SPACE  
0x4000 4000  
0x4000 3FFF  
0x4000 2000  
0x4000 1FFF  
0x4000 0000  
0x3FFF FFFF  
1.0 GB  
0x0008 0000  
0x0007 FFFF  
TOTAL OF 512 kB ON-CHIP NON-VOLATILE MEMORY  
(LPC2148)  
0x0004 0000  
0x0003 FFFF  
TOTAL OF 256 kB ON-CHIP NON-VOLATILE MEMORY  
(LPC2146)  
0x0002 0000  
0x0001 FFFF  
TOTAL OF 128 kB ON-CHIP NON-VOLATILE MEMORY  
(LPC2144)  
0x0001 0000  
0x0000 FFFF  
TOTAL OF 64 kB ON-CHIP NON-VOLATILE MEMORY  
(LPC2142)  
0x0000 8000  
0x0000 7FFF  
TOTAL OF 32 kB ON-CHIP NON-VOLATILE MEMORY  
(LPC2141)  
0x0000 0000  
0.0 GB  
002aab558  
Fig 5. LPC2141/42/44/46/48 memory map  
Rev. 01 — 3 October 2005  
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Preliminary data sheet  
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Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
6.5 Interrupt controller  
The Vectored Interrupt Controller (VIC) accepts all of the interrupt request inputs and  
categorizes them as Fast Interrupt Request (FIQ), vectored Interrupt Request (IRQ), and  
non-vectored IRQ as defined by programmable settings. The programmable assignment  
scheme means that priorities of interrupts from the various peripherals can be dynamically  
assigned and adjusted.  
Fast interrupt request (FIQ) has the highest priority. If more than one request is assigned  
to FIQ, the VIC combines the requests to produce the FIQ signal to the ARM processor.  
The fastest possible FIQ latency is achieved when only one request is classified as FIQ,  
because then the FIQ service routine does not need to branch into the interrupt service  
routine but can run from the interrupt vector location. If more than one request is assigned  
to the FIQ class, the FIQ service routine will read a word from the VIC that identifies which  
FIQ source(s) is (are) requesting an interrupt.  
Vectored IRQs have the middle priority. Sixteen of the interrupt requests can be assigned  
to this category. Any of the interrupt requests can be assigned to any of the 16 vectored  
IRQ slots, among which slot 0 has the highest priority and slot 15 has the lowest.  
Non-vectored IRQs have the lowest priority.  
The VIC combines the requests from all the vectored and non-vectored IRQs to produce  
the IRQ signal to the ARM processor. The IRQ service routine can start by reading a  
register from the VIC and jumping there. If any of the vectored IRQs are pending, the VIC  
provides the address of the highest-priority requesting IRQs service routine, otherwise it  
provides the address of a default routine that is shared by all the non-vectored IRQs. The  
default routine can read another VIC register to see what IRQs are active.  
6.5.1 Interrupt sources  
Each peripheral device has one interrupt line connected to the Vectored Interrupt  
Controller, but may have several internal interrupt flags. Individual interrupt flags may also  
represent more than one interrupt source.  
6.6 Pin connect block  
The pin connect block allows selected pins of the microcontroller to have more than one  
function. Configuration registers control the multiplexers to allow connection between the  
pin and the on chip peripherals. Peripherals should be connected to the appropriate pins  
prior to being activated, and prior to any related interrupt(s) being enabled. Activity of any  
enabled peripheral function that is not mapped to a related pin should be considered  
undefined.  
The Pin Control Module with its pin select registers defines the functionality of the  
microcontroller in a given hardware environment.  
After reset all pins of Port 0 and Port 1 are configured as input with the following  
exceptions: If debug is enabled, the JTAG pins will assume their JTAG functionality; if  
trace is enabled, the Trace pins will assume their trace functionality. The pins associated  
with the I2C0 and I2C1 interface are open drain.  
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LPC2141/42/44/46/48  
Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
6.7 Fast general purpose parallel I/O  
Device pins that are not connected to a specific peripheral function are controlled by the  
GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate  
registers allow setting or clearing any number of outputs simultaneously. The value of the  
output register may be read back, as well as the current state of the port pins.  
LPC2141/42/44/46/48 introduce accelerated GPIO functions over prior LPC2000 devices:  
GPIO registers are relocated to the ARM local bus for the fastest possible I/O timing.  
Mask registers allow treating sets of port bits as a group, leaving other bits  
unchanged.  
All GPIO registers are byte addressable.  
Entire port value can be written in one instruction.  
6.7.1 Features  
Bit-level set and clear registers allow a single instruction set or clear of any number of  
bits in one port.  
Direction control of individual bits.  
Separate control of output set and clear.  
All I/O default to inputs after reset.  
6.8 10-bit ADC  
The LPC2141/42 contain one and the LPC2144/46/48 contain two analog to digital  
converters. These converters are single 10-bit successive approximation analog to digital  
converters. While ADC0 has six channels, ADC1 has eight channels. Therefore, total  
number of available ADC inputs for LPC2141/42 is 6 and for LPC2144/46/48 is 14.  
6.8.1 Features  
10 bit successive approximation analog to digital converter.  
Measurement range of 0 V to VREF (2.0 V VREF VDDA).  
Each converter capable of performing more than 400,000 10-bit samples per second.  
Every analog input has a dedicated result register to reduce interrupt overhead.  
Burst conversion mode for single or multiple inputs.  
Optional conversion on transition on input pin or timer match signal.  
Global Start command for both converters (LPC2142/44/46/48 only).  
6.9 10-bit DAC  
The DAC enables the LPC2141/42/44/46/48 to generate a variable analog output. The  
maximum DAC output voltage is the VREF voltage.  
6.9.1 Features  
10-bit DAC.  
Buffered output.  
Power-down mode available.  
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Preliminary data sheet  
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15 of 38  
LPC2141/42/44/46/48  
Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
Selectable speed versus power.  
6.10 USB 2.0 device controller  
The USB is a 4-wire serial bus that supports communication between a host and a  
number (127 max) of peripherals. The host controller allocates the USB bandwidth to  
attached devices through a token based protocol. The bus supports hot plugging,  
unplugging, and dynamic configuration of the devices. All transactions are initiated by the  
host controller.  
The LPC2141/42/44/46/48 is equipped with a USB device controller that enables  
12 Mbit/s data exchange with a USB host controller. It consists of a register interface,  
serial interface engine, endpoint buffer memory and DMA controller. The serial interface  
engine decodes the USB data stream and writes data to the appropriate end point buffer  
memory. The status of a completed USB transfer or error condition is indicated via status  
registers. An interrupt is also generated if enabled.  
A DMA controller (available in LPC2146/48 only) can transfer data between an endpoint  
buffer and the USB RAM.  
6.10.1 Features  
Fully compliant with USB 2.0 Full-speed specification.  
Supports 32 physical (16 logical) endpoints.  
Supports control, bulk, interrupt and isochronous endpoints.  
Scalable realization of endpoints at run time.  
Endpoint maximum packet size selection (up to USB maximum specification) by  
software at run time.  
RAM message buffer size based on endpoint realization and maximum packet size.  
Supports SoftConnect and GoodLink LED indicator. These two functions are sharing  
one pin.  
Supports bus-powered capability with low suspend current.  
Supports DMA transfer on all non-control endpoints (LPC2146/48 only).  
One duplex DMA channel serves all endpoints (LPC2146/48 only).  
Allows dynamic switching between CPU controlled and DMA modes (only in  
LPC2146/48).  
Double buffer implementation for bulk and isochronous endpoints.  
6.11 UARTs  
The LPC2141/42/44/46/48 each contain two UARTs. In addition to standard transmit and  
receive data lines, the LPC2144/46/48 UART1 also provides a full modem control  
handshake interface.  
Compared to previous LPC2000 microcontrollers, UARTs in LPC2141/42/44/46/48  
introduce a fractional baud rate generator for both UARTs, enabling these microcontrollers  
to achieve standard baud rates such as 115200 with any crystal frequency above 2 MHz.  
In addition, auto-CTS/RTS flow-control functions are fully implemented in hardware  
(UART1 in LPC2144/46/48 only).  
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Philips Semiconductors  
6.11.1 Features  
Single-chip 16-bit/32-bit microcontrollers  
16 byte Receive and Transmit FIFOs.  
Register locations conform to ‘550 industry standard.  
Receiver FIFO trigger points at 1, 4, 8, and 14 bytes  
Built-in fractional baud rate generator covering wide range of baud rates without a  
need for external crystals of particular values.  
Transmission FIFO control enables implementation of software (XON/XOFF) flow  
control on both UARTs.  
LPC2144/46/48 UART1 equipped with standard modem interface signals. This  
module also provides full support for hardware flow control (auto-CTS/RTS).  
6.12 I2C-bus serial I/O controller  
The LPC2141/42/44/46/48 each contain two I2C-bus controllers.  
The I2C-bus is bidirectional, for inter-IC control using only two wires: a serial clock line  
(SCL), and a serial data line (SDA). Each device is recognized by a unique address and  
can operate as either a receiver-only device (e.g., an LCD driver or a transmitter with the  
capability to both receive and send information (such as memory)). Transmitters and/or  
receivers can operate in either master or slave mode, depending on whether the chip has  
to initiate a data transfer or is only addressed. The I2C-bus is a multi-master bus, it can be  
controlled by more than one bus master connected to it.  
The I2C-bus implemented in LPC2141/42/44/46/48 supports bit rates up to 400 kbit/s  
(Fast I2C-bus).  
6.12.1 Features  
Compliant with standard I2C-bus interface.  
Easy to configure as master, slave, or master/slave.  
Programmable clocks allow versatile rate control.  
Bidirectional data transfer between masters and slaves.  
Multi-master bus (no central master).  
Arbitration between simultaneously transmitting masters without corruption of serial  
data on the bus.  
Serial clock synchronization allows devices with different bit rates to communicate via  
one serial bus.  
Serial clock synchronization can be used as a handshake mechanism to suspend and  
resume serial transfer.  
The I2C-bus can be used for test and diagnostic purposes.  
6.13 SPI serial I/O controller  
The LPC2141/42/44/46/48 each contain one SPI controller. The SPI is a full duplex serial  
interface, designed to handle multiple masters and slaves connected to a given bus. Only  
a single master and a single slave can communicate on the interface during a given data  
transfer. During a data transfer the master always sends a byte of data to the slave, and  
the slave always sends a byte of data to the master.  
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6.13.1 Features  
Single-chip 16-bit/32-bit microcontrollers  
Compliant with SPI specification.  
Synchronous, Serial, Full Duplex, Communication.  
Combined SPI master and slave.  
Maximum data bit rate of one eighth of the input clock rate.  
6.14 SSP serial I/O controller  
The LPC2141/42/44/46/48 each contain one SSP. The SSP controller is capable of  
operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and  
slaves on the bus. However, only a single master and a single slave can communicate on  
the bus during a given data transfer. The SSP supports full duplex transfers, with data  
frames of 4 bits to 16 bits of data flowing from the master to the slave and from the slave  
to the master. Often only one of these data flows carries meaningful data.  
6.14.1 Features  
Compatible with Motorola’s SPI, TI’s 4-wire SSI and National Semiconductor’s  
Microwire buses.  
Synchronous serial communication.  
Master or slave operation.  
8-frame FIFOs for both transmit and receive.  
Four bits to 16 bits per frame.  
6.15 General purpose timers/external event counters  
The Timer/Counter is designed to count cycles of the peripheral clock (PCLK) or an  
externally supplied clock and optionally generate interrupts or perform other actions at  
specified timer values, based on four match registers. It also includes four capture inputs  
to trap the timer value when an input signal transitions, optionally generating an interrupt.  
Multiple pins can be selected to perform a single capture or match function, providing an  
application with ‘or’ and ‘and’, as well as ‘broadcast’ functions among them.  
The LPC2141/42/44/46/48 can count external events on one of the capture inputs if the  
minimum external pulse is equal or longer than a period of the PCLK. In this configuration,  
unused capture lines can be selected as regular timer capture inputs, or used as external  
interrupts.  
6.15.1 Features  
A 32-bit timer/counter with a programmable 32-bit prescaler.  
External event counter or timer operation.  
Four 32-bit capture channels per timer/counter that can take a snapshot of the timer  
value when an input signal transitions. A capture event may also optionally generate  
an interrupt.  
Four 32-bit match registers that allow:  
Continuous operation with optional interrupt generation on match.  
Stop timer on match with optional interrupt generation.  
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Reset timer on match with optional interrupt generation.  
Four external outputs per timer/counter corresponding to match registers, with the  
following capabilities:  
Set LOW on match.  
Set HIGH on match.  
Toggle on match.  
Do nothing on match.  
6.16 Watchdog timer  
The purpose of the watchdog is to reset the microcontroller within a reasonable amount of  
time if it enters an erroneous state. When enabled, the watchdog will generate a system  
reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined  
amount of time.  
6.16.1 Features  
Internally resets chip if not periodically reloaded.  
Debug mode.  
Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be  
disabled.  
Incorrect/Incomplete feed sequence causes reset/interrupt if enabled.  
Flag to indicate watchdog reset.  
Programmable 32-bit timer with internal pre-scaler.  
Selectable time period from (TPCLK × 256 × 4) to (TPCLK × 232 × 4) in multiples of  
T
PCLK × 4.  
6.17 Real-time clock  
The RTC is designed to provide a set of counters to measure time when normal or idle  
operating mode is selected. The RTC has been designed to use little power, making it  
suitable for battery powered systems where the CPU is not running continuously (Idle  
mode).  
6.17.1 Features  
Measures the passage of time to maintain a calendar and clock.  
Ultra-low power design to support battery powered systems.  
Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and Day  
of Year.  
Can use either the RTC dedicated 32 kHz oscillator input or clock derived from the  
external crystal/oscillator input at XTAL1. Programmable reference clock divider  
allows fine adjustment of the RTC.  
Dedicated power supply pin can be connected to a battery or the main 3.3 V.  
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6.18 Pulse width modulator  
The PWM is based on the standard timer block and inherits all of its features, although  
only the PWM function is pinned out on the LPC2141/42/44/46/48. The timer is designed  
to count cycles of the peripheral clock (PCLK) and optionally generate interrupts or  
perform other actions when specified timer values occur, based on seven match registers.  
The PWM function is also based on match register events.  
The ability to separately control rising and falling edge locations allows the PWM to be  
used for more applications. For instance, multi-phase motor control typically requires three  
non-overlapping PWM outputs with individual control of all three pulse widths and  
positions.  
Two match registers can be used to provide a single edge controlled PWM output. One  
match register (MR0) controls the PWM cycle rate, by resetting the count upon match.  
The other match register controls the PWM edge position. Additional single edge  
controlled PWM outputs require only one match register each, since the repetition rate is  
the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a  
rising edge at the beginning of each PWM cycle, when an MR0 match occurs.  
Three match registers can be used to provide a PWM output with both edges controlled.  
Again, the MR0 match register controls the PWM cycle rate. The other match registers  
control the two PWM edge positions. Additional double edge controlled PWM outputs  
require only two match registers each, since the repetition rate is the same for all PWM  
outputs.  
With double edge controlled PWM outputs, specific match registers control the rising and  
falling edge of the output. This allows both positive going PWM pulses (when the rising  
edge occurs prior to the falling edge), and negative going PWM pulses (when the falling  
edge occurs prior to the rising edge).  
6.18.1 Features  
Seven match registers allow up to six single edge controlled or three double edge  
controlled PWM outputs, or a mix of both types.  
The match registers also allow:  
Continuous operation with optional interrupt generation on match.  
Stop timer on match with optional interrupt generation.  
Reset timer on match with optional interrupt generation.  
Supports single edge controlled and/or double edge controlled PWM outputs. Single  
edge controlled PWM outputs all go HIGH at the beginning of each cycle unless the  
output is a constant LOW. Double edge controlled PWM outputs can have either edge  
occur at any position within a cycle. This allows for both positive going and negative  
going pulses.  
Pulse period and width can be any number of timer counts. This allows complete  
flexibility in the trade-off between resolution and repetition rate. All PWM outputs will  
occur at the same repetition rate.  
Double edge controlled PWM outputs can be programmed to be either positive going  
or negative going pulses.  
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Match register updates are synchronized with pulse outputs to prevent generation of  
erroneous pulses. Software must ‘release’ new match values before they can become  
effective.  
May be used as a standard timer if the PWM mode is not enabled.  
A 32-bit Timer/Counter with a programmable 32-bit Prescaler.  
6.19 System control  
6.19.1 Crystal oscillator  
On-chip integrated oscillator operates with external crystal in range of 1 MHz to 25 MHz.  
The oscillator output frequency is called fosc and the ARM processor clock frequency is  
referred to as CCLK for purposes of rate equations, etc. fosc and CCLK are the same value  
unless the PLL is running and connected. Refer to Section 6.19.2 “PLLfor additional  
information.  
6.19.2 PLL  
The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input  
frequency is multiplied up into the range of 10 MHz to 60 MHz with a Current Controlled  
Oscillator (CCO). The multiplier can be an integer value from 1 to 32 (in practice, the  
multiplier value cannot be higher than 6 on this family of microcontrollers due to the upper  
frequency limit of the CPU). The CCO operates in the range of 156 MHz to 320 MHz, so  
there is an additional divider in the loop to keep the CCO within its frequency range while  
the PLL is providing the desired output frequency. The output divider may be set to divide  
by 2, 4, 8, or 16 to produce the output clock. Since the minimum output divider value is 2,  
it is insured that the PLL output has a 50 % duty cycle. The PLL is turned off and  
bypassed following a chip reset and may be enabled by software. The program must  
configure and activate the PLL, wait for the PLL to Lock, then connect to the PLL as a  
clock source. The PLL settling time is 100 µs.  
6.19.3 Reset and wake-up timer  
Reset has two sources on the LPC2141/42/44/46/48: the RESET pin and watchdog reset.  
The RESET pin is a Schmitt trigger input pin with an additional glitch filter. Assertion of  
chip reset by any source starts the Wake-up Timer (see Wake-up Timer description  
below), causing the internal chip reset to remain asserted until the external reset is  
de-asserted, the oscillator is running, a fixed number of clocks have passed, and the  
on-chip flash controller has completed its initialization.  
When the internal reset is removed, the processor begins executing at address 0, which is  
the reset vector. At that point, all of the processor and peripheral registers have been  
initialized to predetermined values.  
The Wake-up Timer ensures that the oscillator and other analog functions required for  
chip operation are fully functional before the processor is allowed to execute instructions.  
This is important at power on, all types of reset, and whenever any of the aforementioned  
functions are turned off for any reason. Since the oscillator and other functions are turned  
off during Power-down mode, any wake-up of the processor from Power-down mode  
makes use of the Wake-up Timer.  
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The Wake-up Timer monitors the crystal oscillator as the means of checking whether it is  
safe to begin code execution. When power is applied to the chip, or some event caused  
the chip to exit Power-down mode, some time is required for the oscillator to produce a  
signal of sufficient amplitude to drive the clock logic. The amount of time depends on  
many factors, including the rate of VDD ramp (in the case of power on), the type of crystal  
and its electrical characteristics (if a quartz crystal is used), as well as any other external  
circuitry (e.g. capacitors), and the characteristics of the oscillator itself under the existing  
ambient conditions.  
6.19.4 Brownout detector  
The LPC2141/42/44/46/48 include 2-stage monitoring of the voltage on the VDD pins. If  
this voltage falls below 2.9 V, the BOD asserts an interrupt signal to the VIC. This signal  
can be enabled for interrupt; if not, software can monitor the signal by reading dedicated  
register.  
The second stage of low voltage detection asserts reset to inactivate the  
LPC2141/42/44/46/48 when the voltage on the VDD pins falls below 2.6 V. This reset  
prevents alteration of the flash as operation of the various elements of the chip would  
otherwise become unreliable due to low voltage. The BOD circuit maintains this reset  
down below 1 V, at which point the POR circuitry maintains the overall reset.  
Both the 2.9 V and 2.6 V thresholds include some hysteresis. In normal operation, this  
hysteresis allows the 2.9 V detection to reliably interrupt, or a regularly-executed event  
loop to sense the condition.  
6.19.5 Code security  
This feature of the LPC2141/42/44/46/48 allow an application to control whether it can be  
debugged or protected from observation.  
If after reset on-chip boot loader detects a valid checksum in flash and reads 0x8765 4321  
from address 0x1FC in flash, debugging will be disabled and thus the code in flash will be  
protected from observation. Once debugging is disabled, it can be enabled only by  
performing a full chip erase using the ISP.  
6.19.6 External interrupt inputs  
The LPC2141/42/44/46/48 include up to nine edge or level sensitive External Interrupt  
Inputs as selectable pin functions. When the pins are combined, external events can be  
processed as four independent interrupt signals. The External Interrupt Inputs can  
optionally be used to wake-up the processor from Power-down mode.  
Additionally capture input pins can also be used as external interrupts without the option  
to wake the device up from Power-down mode.  
6.19.7 Memory mapping control  
The Memory Mapping Control alters the mapping of the interrupt vectors that appear  
beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the on-chip  
flash memory, or to the on-chip static RAM. This allows code running in different memory  
spaces to have control of the interrupts.  
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6.19.8 Power control  
The LPC2141/42/44/46/48 supports two reduced power modes: Idle mode and  
Power-down mode.  
In Idle mode, execution of instructions is suspended until either a reset or interrupt occurs.  
Peripheral functions continue operation during Idle mode and may generate interrupts to  
cause the processor to resume execution. Idle mode eliminates power used by the  
processor itself, memory systems and related controllers, and internal buses.  
In Power-down mode, the oscillator is shut down and the chip receives no internal clocks.  
The processor state and registers, peripheral registers, and internal SRAM values are  
preserved throughout Power-down mode and the logic levels of chip output pins remain  
static. The Power-down mode can be terminated and normal operation resumed by either  
a reset or certain specific interrupts that are able to function without clocks. Since all  
dynamic operation of the chip is suspended, Power-down mode reduces chip power  
consumption to nearly zero.  
Selecting an external 32 kHz clock instead of the PCLK as a clock-source for the on-chip  
RTC will enable the microcontroller to have the RTC active during Power-down mode.  
Power-down current is increased with RTC active. However, it is significantly lower than in  
Idle mode.  
A Power Control for Peripherals feature allows individual peripherals to be turned off if  
they are not needed in the application, resulting in additional power savings during active  
and Idle mode.  
6.19.9 VPB bus  
The VPB divider determines the relationship between the processor clock (CCLK) and the  
clock used by peripheral devices (PCLK). The VPB divider serves two purposes. The first  
is to provide peripherals with the desired PCLK via VPB bus so that they can operate at  
the speed chosen for the ARM processor. In order to achieve this, the VPB bus may be  
slowed down to 12 to 14 of the processor clock rate. Because the VPB bus must work  
properly at power-up (and its timing cannot be altered if it does not work since the VPB  
divider control registers reside on the VPB bus), the default condition at reset is for the  
VPB bus to run at 14 of the processor clock rate. The second purpose of the VPB divider  
is to allow power savings when an application does not require any peripherals to run at  
the full processor rate. Because the VPB divider is connected to the PLL output, the PLL  
remains active (if it was running) during Idle mode.  
6.20 Emulation and debugging  
The LPC2141/42/44/46/48 support emulation and debugging via a JTAG serial port. A  
trace port allows tracing program execution. Debugging and trace functions are  
multiplexed only with GPIOs on Port 1. This means that all communication, timer and  
interface peripherals residing on Port 0 are available during the development and  
debugging phase as they are when the application is run in the embedded system itself.  
6.20.1 EmbeddedICE  
Standard ARM EmbeddedICE logic provides on-chip debug support. The debugging of  
the target system requires a host computer running the debugger software and an  
EmbeddedICE protocol convertor. EmbeddedICE protocol convertor converts the remote  
debug protocol commands to the JTAG data needed to access the ARM core.  
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The ARM core has a Debug Communication Channel (DCC) function built-in. The DCC  
allows a program running on the target to communicate with the host debugger or another  
separate host without stopping the program flow or even entering the debug state. The  
DCC is accessed as a co-processor 14 by the program running on the ARM7TDMI-S  
core. The DCC allows the JTAG port to be used for sending and receiving data without  
affecting the normal program flow. The DCC data and control registers are mapped in to  
addresses in the EmbeddedICE logic.  
6.20.2 Embedded trace  
Since the LPC2141/42/44/46/48 have significant amounts of on-chip memory, it is not  
possible to determine how the processor core is operating simply by observing the  
external pins. The Embedded Trace Macrocell (ETM) provides real-time trace capability  
for deeply embedded processor cores. It outputs information about processor execution to  
the trace port.  
The ETM is connected directly to the ARM core and not to the main AMBA system bus. It  
compresses the trace information and exports it through a narrow trace port. An external  
trace port analyzer must capture the trace information under software debugger control.  
Instruction trace (or PC trace) shows the flow of execution of the processor and provides a  
list of all the instructions that were executed. Instruction trace is significantly compressed  
by only broadcasting branch addresses as well as a set of status signals that indicate the  
pipeline status on a cycle by cycle basis. Trace information generation can be controlled  
by selecting the trigger resource. Trigger resources include address comparators,  
counters and sequencers. Since trace information is compressed the software debugger  
requires a static image of the code being executed. Self-modifying code can not be traced  
because of this restriction.  
6.20.3 RealMonitor  
RealMonitor is a configurable software module, developed by ARM Inc., which enables  
real-time debug. It is a lightweight debug monitor that runs in the background while users  
debug their foreground application. It communicates with the host using the DCC, which is  
present in the EmbeddedICE logic. The LPC2141/42/44/46/48 contain a specific  
configuration of RealMonitor software programmed into the on-chip flash memory.  
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7. Limiting values  
Table 4:  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). [1]  
Symbol  
VDD  
Parameter  
supply voltage[2]  
Conditions  
Min  
Max  
+3.6  
4.6  
Unit  
V
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
VDDA  
Vi(VBAT)  
Vi(VREF)  
Via  
analog supply voltage[3]  
input voltage on pin VBAT  
input voltage on pin VREF  
analog input voltage[4]  
input voltage  
V
for the RTC  
4.6  
V
4.6  
V
5.1  
V
[5] [6]  
[5]  
VI  
5 V tolerant I/O  
pins  
6.0  
V
other I/O pins  
0.5  
VDD + 0.5[7]  
100[9]  
100[9]  
125  
V
IDD  
DC supply current[8]  
DC ground current[10]  
storage temperature[11]  
-
mA  
mA  
°C  
W
ISS  
-
Tstg  
40  
Ptot(pack)  
package total power dissipation  
based on package  
heat transfer, not  
device power  
-
1.5  
consumption  
[1] The following applies to the Limiting values:  
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive  
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.  
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless  
otherwise noted.  
[2] Core and external rail.  
[3] 3.3 V pad.  
[4] On ADC related pins.  
[5] Including voltage on outputs in 3-state mode.  
[6] Only valid when the VDD supply voltage is present.  
[7] Not to exceed 4.6 V.  
[8] Per supply pin.  
[9] The peak current is limited to 25 times the corresponding maximum current.  
[10] Per ground pin.  
[11] Dependent on package type.  
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8. Static characteristics  
Table 5:  
Static characteristics  
Ta = 40 °C to +85 °C for commercial applications, unless otherwise specified.  
Symbol  
VDD  
Parameter  
supply voltage[2]  
Conditions  
Min  
3.0  
Typ [1]  
3.3  
Max  
3.6  
Unit  
V
VDDA  
analog supply voltage  
input voltage on pin VBAT  
input voltage on pin VREF  
3.3 V pad  
3.0  
2.0[3]  
3.3  
3.6  
V
Vi(VBAT)  
Vi(VREF)  
3.3  
3.6  
V
2.5  
3.3  
VDDA  
V
Standard port pins, RESET, RTCK  
IIL  
LOW-state input current  
HIGH-state input current  
OFF-state output current  
VI = 0 V; no pull-up  
-
-
-
-
-
-
3
3
3
µA  
µA  
µA  
IIH  
IOZ  
VI = VDD; no pull-down  
VO = 0 V, VO = VDD; no  
pull-up/down  
Ilatch  
I/O latch-up current  
input voltage  
(0.5VDD) < V < (1.5VDD  
Tj < 125 °C  
)
-
-
-
100  
5.5  
mA  
V
[4] [5]  
[6]  
VI  
pin configured to provide a  
digital function  
0
VO  
output voltage  
output active  
0
-
VDD  
V
V
V
V
V
VIH  
VIL  
HIGH-state input voltage  
LOW-state input voltage  
hysteresis voltage  
2.0  
-
-
-
-
-
0.8  
Vhys  
VOH  
0.4  
-
-
-
HIGH-state output  
voltage[7]  
IOH = 4 mA  
IOL = 4 mA  
VOH = VDD 0.4 V  
VOL = 0.4 V  
VOH = 0 V  
V
DD 0.4  
VOL  
IOH  
LOW-state output  
voltage[7]  
-
-
-
-
-
-
0.4  
-
V
HIGH-state output  
current[7]  
4  
4
-
mA  
mA  
mA  
mA  
IOL  
LOW-state output  
current[7]  
-
IOHS  
IOLS  
HIGH-state short-circuit  
current[8]  
45  
50  
LOW-state short-circuit  
current[8]  
VOL = VDDA  
-
Ipd  
Ipu  
pull-down current  
pull-up current[10]  
VI = 5 V[9]  
10  
50  
150  
85  
0
µA  
µA  
µA  
mA  
VI = 0 V  
VDD < VI < 5 V[9]  
15  
0
50  
0
IDD(act)  
active mode supply current VDD = 3.3 V, Ta = 25 °C, code  
<tbd>  
<tbd>  
<tbd>  
while(1){}  
executed from flash, no active  
peripherals  
CCLK = 10 MHz  
CCLK = 60 MHz  
<tbd>  
<tbd>  
<tbd>  
mA  
(other parameters as above)  
IDD(pd)  
Power-down mode supply VDD = 3.3 V, Ta = +25 °C  
<tbd>  
<tbd>  
<tbd>  
<tbd>  
<tbd>  
<tbd>  
µA  
µA  
current  
VDD = 3.3 V, Ta = +85 °C  
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Table 5:  
Static characteristics …continued  
Ta = 40 °C to +85 °C for commercial applications, unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ [1]  
<tbd>  
Max  
Unit  
IBATpd  
Power-down mode battery RTC clock = 32 kHz  
supply current[11]  
<tbd>  
<tbd>  
µA  
(from RTXC pins),  
Ta = +25 °C  
VDD = 3.0 V, Vi(VBAT) = 2.5 V  
VDD = 3.0 V, Vi(VBAT) = 3.0 V  
<tbd>  
<tbd>  
<tbd>  
<tbd>  
<tbd>  
<tbd>  
µA  
µA  
IBATact  
active mode battery supply CCLK = 60 MHz,  
current[11]  
PCLK = 15 MHz,  
PCLK enabled to RTCK,  
RTC clock = 32 kHz  
(from RTXC pins),  
Ta = +25 °C  
VDD = 3.0 V, Vi(VBAT) = 3.0 V  
IBATact(opt) optimized active mode  
battery supply  
PCLK disabled to RTCK in  
the PCONP register,  
RTC clock = 32 kHz  
(from RTXC pins),  
Ta = +25 °C, Vi(VBAT) = 3.3 V  
<tbd>  
<tbd>  
<tbd>  
<tbd>  
<tbd>  
<tbd>  
µA  
µA  
current[11] [12]  
CCLK = 10 MHz  
CCLK = 60 MHz  
I2C-bus pins  
VIH  
VIL  
HIGH-state input voltage  
LOW-state input voltage  
hysteresis voltage  
0.7VDD(3V3)  
-
-
V
V
V
V
-
-
-
-
0.3VDD(3V3)  
Vhys  
VOL  
0.5VDD(3V3)  
-
-
LOW-state output  
voltage[7]  
IOLS = 3 mA  
0.4  
ILI  
input leakage current[13]  
VI = VDD  
VI = 5 V  
-
-
2
4
µA  
µA  
10  
22  
Oscillator pins  
Vi(XTAL1) input voltage on pin XTAL1  
Vo(XTAL2)  
0
0
-
-
1.8  
1.8  
V
V
output voltage on pin  
XTAL2  
Vi(RTXC1)  
input voltage on pin  
RTXC1  
0
0
-
-
1.8  
1.8  
V
V
Vo(RTXC2) output voltage on pin  
RTXC2  
USB pins  
IOZ  
OFF-state output current  
0 V < VI < 3.3 V  
-
-
-
-
±10  
µA  
VBUS  
VBUS line input voltage on  
the USB connector  
5.25  
V
VDI  
differential input sensitivity |(D+) (D)|  
0.2  
0.8  
-
-
-
V
V
VCM  
differential common-mode includes VDI range  
range  
2.5  
Vth(rs)se  
single-ended receiver  
switching threshold  
voltage  
0.8  
-
2.0  
V
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Single-chip 16-bit/32-bit microcontrollers  
Table 5:  
Static characteristics …continued  
Ta = 40 °C to +85 °C for commercial applications, unless otherwise specified.  
Symbol  
VOL  
Parameter  
Conditions  
Min  
-
Typ [1]  
Max  
0.3  
3.6  
20  
Unit  
V
LOW output level  
HIGH output level  
transceiver capacitance  
RL of 1.5 kto 3.6 V  
RL of 15 kto GND  
pin to GND  
-
-
-
-
VOH  
2.8  
-
V
Ctrans  
ZDRV  
pF  
[14]  
driver output impedance  
for driver which is not  
high-speed capable  
steady state drive  
29  
44  
Rpu  
pull-up resistance  
SoftConnect = ON  
1.1  
-
1.9  
kΩ  
[1] Typical ratings are not guaranteed. The values listed are at room temperature (+25 ˚C), nominal supply voltages.  
[2] Core and external rail.  
[3] The RTC typically fails when Vi(VBAT) drops below 1.6 V.  
[4] Including voltage on outputs in 3-state mode.  
[5] VDD supply voltages must be present.  
[6] 3-state outputs go into 3-state mode when VDD is grounded.  
[7] Accounts for 100 mV voltage drop in all supply lines.  
[8] Only allowed for a short time period.  
[9] Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V.  
[10] Applies to P1.16 to P1.31.  
[11] On pin VBAT.  
[12] Optimized for low battery consumption.  
[13] To VSS  
.
[14] Includes external resistors of 18 1 % on D+ and D.  
Table 6:  
ADC static characteristics  
VDDA = 2.5 V to 3.6 V; Ta = 40 °C to +85 °C unless otherwise specified. ADC frequency 4.5 MHz.  
Symbol  
Via  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
analog input voltage  
analog input capacitance  
differential linearity error  
integral non-linearity  
offset error  
0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
VDDA  
1
V
Cia  
pF  
[1] [2] [3]  
[1] [4]  
[1] [5]  
[1] [6]  
[1] [7]  
[8]  
ED  
±1  
LSB  
LSB  
LSB  
%
EL(adj)  
EO  
±2  
±3  
EG  
gain error  
±0.5  
±4  
ET  
absolute error  
LSB  
kΩ  
Rvsi  
voltage source interface  
resistance  
40  
[1] Conditions: VSSA = 0 V, VDDA = 3.3 V.  
[2] The ADC is monotonic, there are no missing codes.  
[3] The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 6.  
[4] The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after  
appropriate adjustment of gain and offset errors. See Figure 6.  
[5] The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the  
ideal curve. See Figure 6.  
[6] The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset  
error, and the straight line which fits the ideal transfer curve. See Figure 6.  
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Preliminary data sheet  
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Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
[7] The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated ADC  
and the ideal transfer curve. See Figure 6.  
[8] See Figure 7.  
offset  
error  
gain  
error  
E
E
O
G
1023  
1022  
1021  
1020  
1019  
1018  
(2)  
7
code  
out  
(1)  
6
5
4
3
2
1
0
(5)  
(4)  
(3)  
1 LSB  
(ideal)  
1018 1019 1020 1021 1022 1023 1024  
1
2
3
4
5
6
7
V
ia  
(LSB  
)
ideal  
offset error  
E
O
V
V  
DDA SSA  
1 LSB =  
1024  
002aab136  
(1) Example of an actual transfer curve.  
(2) The ideal transfer curve.  
(3) Differential linearity error (ED).  
(4) Integral non-linearity (EL(adj)).  
(5) Center of a step of the actual transfer curve.  
Fig 6. ADC characteristics  
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Preliminary data sheet  
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Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
LPC2141/42/44/46/48  
R
vsi  
20 k  
ADx.y  
ADx.y  
SAMPLE  
3 pF  
5 pF  
V
EXT  
V
SS  
002aab834  
Fig 7. Suggested ADC interface - LPC2141/42/44/46/48 ADx.y pin  
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Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
9. Dynamic characteristics  
Table 7:  
Dynamic characteristics of USB pins (full-speed)  
CL = 50 pF; Rpu = 1.5 kon D+ to VDD,unless otherwise specified  
Symbol  
Parameter  
rise time  
fall time  
Conditions  
10 % to 90 %  
10 % to 90 %  
(tr/tf)  
Min  
4
Typ  
Max  
20  
Unit  
ns  
tr  
-
-
-
tf  
4
20  
ns  
tFRFM  
differential rise and fall time  
matching  
90  
110  
%
VCRS  
output signal crossover voltage  
source SE0 interval of EOP  
1.3  
160  
2  
-
-
-
2.0  
175  
+5  
V
tFEOPT  
tFDEOP  
see Figure 9  
ns  
ns  
source jitter for differential transition see Figure 9  
to SE0 transition  
tJR1  
receiver jitter to next transition  
18.5  
9  
-
-
-
+18.5  
ns  
ns  
ns  
tJR2  
receiver jitter for paired transitions  
EOP width at receiver[1]  
10 % to 90 %  
+9  
-
tEOPR1  
must reject as  
EOP; see  
40  
Figure 9  
tEOPR2  
EOP width at receiver[1]  
must accept as  
EOP; see  
82  
-
-
ns  
Figure 9  
[1] Characterized but not implemented as production test. Guaranteed by design.  
Table 8:  
Dynamic characteristics  
Ta = 40 °C to +85 °C for commercial applications, VDD over specified ranges[1]  
Symbol  
External clock  
fosc  
Parameter  
Conditions  
Min  
Typ [2]  
Max  
Unit  
oscillator frequency  
clock cycle time  
clock HIGH time  
clock LOW time  
clock rise time  
10  
40  
-
-
-
-
-
-
25  
100  
-
MHz  
ns  
Tcy(CLK)  
tCHCX  
T
T
-
cy(CLK) × 0.4  
ns  
tCLCX  
cy(CLK) × 0.4  
-
ns  
tCLCH  
5
ns  
tCHCL  
clock fall time  
-
5
ns  
Port pins (P0.2, P0.3, P0.11, and P0.14)  
tr(o)  
tf(o)  
output rise time  
-
-
10  
10  
-
-
ns  
ns  
output fall time  
I2C-bus pins (P0.2, P0.3, P0.11, and P0.14)  
[3]  
tf(o) output fall time  
VIH to VIL  
20 + 0.1 × Cb  
-
-
ns  
[1] Parameters are valid over operating temperature range unless otherwise specified.  
[2] Typical ratings are not guaranteed. The values listed are at room temperature (+25 ˚C), nominal supply voltages.  
[3] Bus capacitance Cb in pF, from 10 pF to 400 pF.  
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Philips Semiconductors  
9.1 Timing  
Single-chip 16-bit/32-bit microcontrollers  
V
0.5 V  
DD  
0.2V  
+ 0.9 V  
DD  
0.2V  
0.1 V  
DD  
0.45 V  
t
CHCX  
t
t
CLCX  
t
CHCL  
CLCH  
T
cy(CLK)  
002aaa907  
Fig 8. External clock timing  
t
PERIOD  
crossover point  
extended  
crossover point  
differential  
data lines  
source EOP width: t  
FEOPT  
differential data to  
SEO/EOP skew  
n * t  
+ t  
PERIOD  
FDEOP  
receiver EOP width: t  
, t  
EOPR1 EOPR2  
002aab561  
Fig 9. Differential data-to-EOP transition skew and EOP width  
10. Application information  
10.1 Suggested USB interface solutions  
V
DD  
CONNECT  
soft-connect switch  
R1  
1.5 kΩ  
LPC2142/2148  
VBUS  
R
= 33 Ω  
= 33 Ω  
USB-B  
connector  
S
D+  
R
S
D−  
V
SS  
002aab563  
Fig 10. LPC2141/42/44/46/48 USB interface using the CONNECT function on pin 17  
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Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
V
DD  
R2  
LPC2141/42/  
44/46/48  
R1  
1.5 kΩ  
UP_LED  
VBUS  
USB-B  
connector  
R
= 33 Ω  
= 33 Ω  
S
D+  
R
S
D−  
V
SS  
002aab562  
Fig 11. LPC2141/42/44/46/48 USB interface using the UP_LED function on pin 17  
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Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
11. Package outline  
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm  
SOT314-2  
y
X
A
48  
33  
Z
49  
32  
E
e
H
A
E
2
E
A
(A )  
3
A
1
w M  
p
θ
b
L
p
pin 1 index  
L
64  
17  
detail X  
1
16  
Z
v
M
A
D
e
w M  
b
p
D
B
H
v
M
B
D
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
H
L
L
v
w
y
Z
Z
E
θ
1
2
3
p
D
E
p
D
max.  
7o  
0o  
0.20 1.45  
0.05 1.35  
0.27 0.18 10.1 10.1  
0.17 0.12 9.9 9.9  
12.15 12.15  
11.85 11.85  
0.75  
0.45  
1.45 1.45  
1.05 1.05  
1.6  
mm  
0.25  
0.5  
1
0.2 0.12 0.1  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
00-01-19  
03-02-25  
SOT314-2  
136E10  
MS-026  
Fig 12. Package outline SOT314-2 (LQFP64)  
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Preliminary data sheet  
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Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
12. Abbreviations  
Table 9:  
Acronym  
ADC  
Acronym list  
Description  
Analog-to-Digital Converter  
Brown-Out Detection  
BOD  
CPU  
Central Processing Unit  
Digital-to-Analog Converter  
DAC  
DCC  
DMA  
FIFO  
GPIO  
PLL  
Debug Communications Channel  
Direct Memory Access  
First In, First Out  
General Purpose Input/Output  
Phase-Locked Loop  
POR  
PWM  
RAM  
SPI  
Power-On Reset  
Pulse Width Modulator  
Random Access Memory  
Serial Peripheral Interface  
Static Random Access Memory  
Synchronous Serial Port  
Universal Asynchronous Receiver/Transmitter  
Universal Serial Bus  
SRAM  
SSP  
UART  
USB  
VPB  
VLSI Peripheral Bus  
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Single-chip 16-bit/32-bit microcontrollers  
13. Revision history  
Table 10: Revision history  
Document ID  
Release  
date  
Data sheet status Change Doc. number  
Supersedes  
notice  
LPC2141_42_44_46_48_1  
20051003  
Preliminary data  
sheet  
-
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Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
14. Data sheet status  
Level Data sheet status[1] Product status[2] [3]  
Definition  
I
Objective data  
Development  
This data sheet contains data from the objective specification for product development. Philips  
Semiconductors reserves the right to change the specification in any manner without notice.  
II  
Preliminary data  
Qualification  
This data sheet contains data from the preliminary specification. Supplementary data will be published  
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in  
order to improve the design and supply the best possible product.  
III  
Product data  
Production  
This data sheet contains data from the product specification. Philips Semiconductors reserves the  
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant  
changes will be communicated via a Customer Product/Process Change Notification (CPCN).  
[1]  
[2]  
Please consult the most recently issued data sheet before initiating or completing a design.  
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at  
URL http://www.semiconductors.philips.com.  
[3]  
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
customers using or selling these products for use in such applications do so  
at their own risk and agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
15. Definitions  
Short-form specification The data in a short-form specification is  
extracted from a full data sheet with the same type number and title. For  
detailed information see the relevant data sheet or data handbook.  
Right to make changes — Philips Semiconductors reserves the right to  
make changes in the products - including circuits, standard cells, and/or  
software - described or contained herein in order to improve design and/or  
performance. When the product is in full production (status ‘Production’),  
relevant changes will be communicated via a Customer Product/Process  
Change Notification (CPCN). Philips Semiconductors assumes no  
responsibility or liability for the use of any of these products, conveys no  
license or title under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that these products are  
free from patent, copyright, or mask work right infringement, unless otherwise  
specified.  
Limiting values definition Limiting values given are in accordance with  
the Absolute Maximum Rating System (IEC 60134). Stress above one or  
more of the limiting values may cause permanent damage to the device.  
These are stress ratings only and operation of the device at these or at any  
other conditions above those given in the Characteristics sections of the  
specification is not implied. Exposure to limiting values for extended periods  
may affect device reliability.  
Application information Applications that are described herein for any  
of these products are for illustrative purposes only. Philips Semiconductors  
make no representation or warranty that such applications will be suitable for  
the specified use without further testing or modification.  
17. Trademarks  
Notice — All referenced brands, product names, service names and  
trademarks are the property of their respective owners.  
I2C-bus — wordmark and logo are trademarks of Koninklijke Philips  
Electronics N.V.  
16. Disclaimers  
Life support — These products are not designed for use in life support  
appliances, devices, or systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips Semiconductors  
SoftConnect — is a trademark of Koninklijke Philips Electronics N.V.  
18. Contact information  
For additional information, please visit: http://www.semiconductors.philips.com  
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com  
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Preliminary data sheet  
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Philips Semiconductors  
Single-chip 16-bit/32-bit microcontrollers  
19. Contents  
1
General description . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
6.19.5  
6.19.6  
6.19.7  
6.19.8  
6.19.9  
6.20  
6.20.1  
6.20.2  
6.20.3  
Code security . . . . . . . . . . . . . . . . . . . . . . . . . 22  
External interrupt inputs. . . . . . . . . . . . . . . . . 22  
Memory mapping control . . . . . . . . . . . . . . . . 22  
Power control . . . . . . . . . . . . . . . . . . . . . . . . . 23  
VPB bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
Emulation and debugging. . . . . . . . . . . . . . . . 23  
EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . . 23  
Embedded trace. . . . . . . . . . . . . . . . . . . . . . . 24  
RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
2
2.1  
3
3.1  
4
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7  
7
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 25  
Static characteristics . . . . . . . . . . . . . . . . . . . 26  
Dynamic characteristics. . . . . . . . . . . . . . . . . 31  
Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
Application information . . . . . . . . . . . . . . . . . 32  
Suggested USB interface solutions . . . . . . . . 32  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 34  
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 35  
Revision history . . . . . . . . . . . . . . . . . . . . . . . 36  
Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 37  
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 37  
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 37  
Contact information . . . . . . . . . . . . . . . . . . . . 37  
6
6.1  
6.2  
6.3  
6.4  
6.5  
6.5.1  
6.6  
6.7  
6.7.1  
6.8  
6.8.1  
6.9  
6.9.1  
6.10  
6.10.1  
6.11  
6.11.1  
6.12  
6.12.1  
6.13  
6.13.1  
6.14  
6.14.1  
6.15  
Functional description . . . . . . . . . . . . . . . . . . 12  
Architectural overview. . . . . . . . . . . . . . . . . . . 12  
On-chip flash program memory . . . . . . . . . . . 12  
On-chip static RAM. . . . . . . . . . . . . . . . . . . . . 13  
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Interrupt controller . . . . . . . . . . . . . . . . . . . . . 14  
Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 14  
Pin connect block . . . . . . . . . . . . . . . . . . . . . . 14  
Fast general purpose parallel I/O . . . . . . . . . . 15  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
10-bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
USB 2.0 device controller . . . . . . . . . . . . . . . . 16  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
UARTs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
I2C-bus serial I/O controller . . . . . . . . . . . . . . 17  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
SPI serial I/O controller. . . . . . . . . . . . . . . . . . 17  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
SSP serial I/O controller . . . . . . . . . . . . . . . . . 18  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
General purpose timers/external event  
8
9
9.1  
10  
10.1  
11  
12  
13  
14  
15  
16  
17  
18  
counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Watchdog timer. . . . . . . . . . . . . . . . . . . . . . . . 19  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Real-time clock . . . . . . . . . . . . . . . . . . . . . . . . 19  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Pulse width modulator . . . . . . . . . . . . . . . . . . 20  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
System control . . . . . . . . . . . . . . . . . . . . . . . . 21  
Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . . 21  
PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
Reset and wake-up timer . . . . . . . . . . . . . . . . 21  
Brownout detector. . . . . . . . . . . . . . . . . . . . . . 22  
6.15.1  
6.16  
6.16.1  
6.17  
6.17.1  
6.18  
6.18.1  
6.19  
6.19.1  
6.19.2  
6.19.3  
6.19.4  
© Koninklijke Philips Electronics N.V. 2005  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior  
written consent of the copyright owner. The information presented in this document does  
not form part of any quotation or contract, is believed to be accurate and reliable and may  
be changed without notice. No liability will be accepted by the publisher for any  
consequence of its use. Publication thereof does not convey nor imply any license under  
patent- or other industrial or intellectual property rights.  
Date of release: 3 October 2005  
Document number: 9397 750 14985  
Published in the Netherlands  

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