MC145423EGR2 [NXP]

DATACOM, DIGITAL SLIC, PDSO28, SOIC-28;
MC145423EGR2
型号: MC145423EGR2
厂家: NXP    NXP
描述:

DATACOM, DIGITAL SLIC, PDSO28, SOIC-28

电信 光电二极管 电信集成电路
文件: 总30页 (文件大小:483K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MOTOROLA  
Semiconductor Products Sector  
MC145423  
Errata  
Universal Digital Loop Transceiver (UDLT-3)  
Pin Selectable Master/Slave  
Limited Distance Modem  
This errata applies only to the following:  
• Preproduction silicon marked “XCSAMPLE”.  
• When setup to operate in UDLT1 mode triangle wave output.  
Do to differences in device geometries and process, the LO1 and LO2 output impedance of the MC145423 is  
higher during non-burst time than the MC145422 and MC145426 devices it replaces. To compensate for this  
difference, the line interface requires a slight modification to optimize transmission performance.  
The following partial schematic highlights these differences by placing the modifications inside dashed boxes.  
These changes are:  
• R19 changes from 110 to 75 .  
• R21 changes from 110 to 75 .  
• R23 is an added component with a value of 1400 .  
For all other device configurations, the original interface as found in the datasheet (page 25, BASIC DIGITAL  
TELSET) can be used.  
V
DD  
75 D1  
LO1  
R19  
D2  
1400 Ω  
R23  
V
DD  
75 D3  
110 Ω  
See Note  
LO2  
LI  
R22  
D4  
R21  
To  
Twisted  
Pair  
To  
Battery  
1 µF  
V
DD  
See Note  
V
DD  
V
REF  
NOTE: Battery feed limiting resistors;  
value up to user discretion.  
© Motorola, Inc., 2000. All rights reserved.  
Order Number: MC145423/D  
Rev. 0, 8/24/00  
MOTOROLA  
Semiconductor Products Sector  
MC145423  
Product Preview  
Universal Digital Loop  
Transceiver (UDLT-3)  
Pin Selectable Master/Slave  
Limited Distance Modem  
DW SUFFIX  
SOIC  
CASE 751F  
The MC145423 is a CMOS integrated circuit designed to be one  
of the major building blocks in digital subscriber voice/data  
telephone systems and remote data acquisition and control systems.  
The UDLT-3 incorporates into one device, all the functionality of  
the MC145421 (ISDN UDLT-2 master), MC145425 (ISDN UDLT-2  
slave), MC145422 (UDLT-1 master), and MC145426 (UDLT-1  
slave).  
DT SUFFIX  
TSSOP  
CASE 1168  
ORDERING INFORMATION  
Since these modes/functions are pin selectable, the MC145423  
can be used in telephone switch line cards, as well as remote digital  
telsets or data terminals.  
MC145423DW SOIC Package  
MC145423DT  
TSSOP Package  
V  
= 4.5 V to 5.5 V  
DD  
28-Pin SOIC and TSSOP Packages  
Protocol Independent  
Pin Controlled Power-Down  
LI Sensitivity Control in Master Mode  
2.048 MHz Output in Slave Mode  
UDLT-2 Features  
Synchronous Full Duplex 160 kbps Voice and Data  
Communications in a 2B+2D Format for ISDN Compatibility  
Provides CCITT Basic Access Data Transfer Rate (2B+D) for  
ISDNs on a Single Twisted Pair Up to 1 km on 26 AWG or  
Larger Cable  
UDLT-1 Features  
Pin Controlled Loopback  
Automatic Power-Up/Down (Slave)  
Full Duplex Synchronous 64 kbps Voice/Data Channel and Two  
8 kbps Signaling Data Channels Over One 26 AWG Wire Pair Up  
to 2 km  
This document contains information on a product under development. Motorola  
reserves the right to change or discontinue this product without notice.  
© Motorola, Inc., 2000. All rights reserved.  
MC145423  
PIN ASSIGNMENT  
V
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
V
DD  
MASTER/SLAVE  
SS  
V
2
ref  
LI  
3
LO1  
LB  
4
LO2  
VD  
5
Rx  
SDI1  
6
RE2/BCLK  
RE1/CLKOUT  
LI SENS/2.048 MHz  
SDI2  
7
FRAME 10/20  
SDCLK/8kHz  
SDO1  
8
9
TDC-RDC/XTAL  
out  
CCI/XTAL  
10  
11  
12  
13  
14  
in  
SDO2  
MSI/TONE  
EN1-TE1  
SE/(Mu/A)  
PD  
EN2-TE2/SIE/B1B2  
Tx  
MOD TRI/SQ  
28-PIN SOIC/TSSOP PACKAGES  
2
TELECOMMUNICATIONS  
MC145423  
BLOCK DIAGRAM  
SDCLK/8kHz  
LO1  
LO2  
B1  
B2  
D1 D2  
SDI2  
SDI1  
D2 BUFFER  
D1 BUFFER  
SE  
LATCH  
REGISTER  
LOGIC  
RE2/  
BCLK  
B2 BUFFER  
B1 BUFFER  
Rx  
CCI/XTAL  
In  
(TDC-RDC)/  
RE1/  
CLKOUT  
OSC  
XTAL  
out  
CLKOUT  
BCLK  
SE/  
(Mu/A)  
Mu/A  
LB  
SE  
LATCH  
MSI/TONE  
MOD TRI/SQ  
FRAME 10/20  
EN2-TE2  
EN1-TE1  
SEQUENCE  
AND  
CONTROL  
PD  
SE  
LATCH  
MASTER/  
SLAVE  
SE  
LATCH  
LI SENS/  
2.048 MHz  
TDC/RDC  
VD  
CONTROL  
VD  
LI  
SDO2  
SDO1  
D2 BUFFER  
D1 BUFFER  
D2  
D1  
REGISTER  
LOGIC  
B2  
B1  
B2 BUFFER  
B1 BUFFER  
Tx  
V
ref  
EN2-TE2/  
SIE  
EN1-TE1  
TELECOMMUNICATIONS  
3
MC145423  
ABSOLUTE MAXIMUM RATINGS (Voltage Referenced to V  
)
SS  
This device contains circuitry to protect  
the inputs against damage due to high static  
voltages or electric fields; however, it is  
advised that normal precautions be taken  
to avoid applications of any voltage higher  
than maximum rated voltages to this high-  
impedance circuit. For proper operation, it  
Rating  
DC Supply Voltage  
Voltage, Any Pin to V  
Symbol  
Value  
Unit  
V
– V  
–0.5 to 6  
V
V
DD  
SS  
V
I
–0.5 to V + 0.5  
DD  
SS  
DC Current, Any Pin (Excluding  
, V  
±10  
mA  
V
)
DD SS  
Operating Temperature  
Storage Temperature  
T
–40 to 85  
°C  
°C  
is recommended that V and V  
be  
A
in out  
constrained to the range V  
(V or V  
)
SS  
in out  
T
–85 to 150  
stg  
V . Reliability of operation is enhanced  
DD  
if unused inputs are tied to an appropriate  
logic level (e.g., either V  
or V ).  
SS  
DD  
RECOMMENDED OPERATING CONDITIONS (T = –40° to 85°C)  
A
Parameter  
Pins  
Min  
Typ  
Max  
5.5  
80  
Unit  
V
DC Supply Voltage  
V
V
V
4.5  
DD  
DD  
DD  
Power Dissipation (PD = V  
Power Dissipation (PD = V  
Frame Rate  
)
V
V
= 5 V  
= 5 V  
mW  
mW  
kHz  
MHz  
DD  
DD  
)
80  
SS  
DD  
MSI  
CCI  
7.9  
8.0  
8.1  
CCI CLK Frequency (MSI = 8 kHz)  
UDLT-1 (CCI = 256 x MSI)  
UDLT-2  
2.048  
8.192  
8.29  
Frame Rate Slip*  
0.25  
%
Data Clock Rate (Master Mode)  
TDC-RDC  
LO1, LO2  
kHz  
UDLT-1  
UDLT-2  
64  
128  
4100  
4100  
SDCLK (UDLT-2 Only)  
16  
4100  
kHz  
kHz  
Modulation Baud Rate  
UDLT-1  
256  
512  
UDLT-2  
* The slave’s crystal frequency divided by 512 (UDLT-1) or 1024 (UDLT-2), must equal the master’s MSI frequency ±0.25% for optimum  
operation.  
4
TELECOMMUNICATIONS  
MC145423  
DIGITAL CHARACTERISTICS (V  
= 5 V ±10%, T = –40° to 85°C, Unless Otherwise Stated)  
A
DD  
Parameter  
Min  
x 0.7  
Max  
Unit  
Input High Level  
V
V
DD  
Input Low Level  
V
x 0.3  
V
DD  
Input Current (Digital Pins)  
Input Current LI  
±1.0  
±100  
7.5  
µA  
µA  
pF  
mA  
Input Capacitance  
Output High Current (Excluding Tx and PD)  
Output Current Low (Excluding Tx and PD)  
V
V
= V  
– 0.5 V  
= 0.4V  
–1.6  
OH  
DD  
V
OL  
1.6  
mA  
mA  
Tx Output High Current  
V
= V  
= 2.5 V  
– 0.5 V  
–3.4  
–2.5  
OH  
OH  
DD  
Tx Output Low Current  
V
V
= 0.4 V  
= 0.8 V  
2.5  
3.5  
mA  
µA  
µA  
OL  
OL  
PD Output High Current — Slave Mode*  
PD Output Low Current — Slave Mode*  
V
= 2.5 V  
– 0.5 V  
DD  
–90  
–10  
OH  
= V  
V
OH  
OH  
V
OL  
V
OL  
= 0.8 V  
= 0.4 V  
100  
60  
Tx, SDO1, SDO2, and VD Three-State Current  
XTAL Output High Current  
±10.0  
µA  
µA  
µA  
V
= V  
– 0.5 V  
= 0.4 V  
–450  
450  
DD  
XTAL Output Low Current  
V
OL  
* To overdrive PD from a low level to 3.5 V, or a high level to 1.5 V requires a minimum of ±800 µA drive capability.  
ANALOG CHARACTERISTICS (V  
= 5 V ±10%, T = –40° to 85°C)  
A
DD  
Parameter  
Modulation Differential Amplitude (RL = 440 )  
Modulation Differential Offset  
Min  
4.5  
0
Max  
6.0  
40  
Unit  
Vp-p  
mV  
LO1 to LO2  
V
Voltage, Typically 9/20 x (V  
– V  
)
2.0  
–22  
0.05  
50  
2.5  
–18  
2.5  
300  
V
ref  
DD SS  
PCM Tone Level  
dBm  
Vpeak  
kΩ  
Demodulator Input Amplitude*  
Demodulator Input Impedance (LI to V  
)
ref  
* The input level into the demodulator to reliably demodulate incoming bursts. Input referenced to V  
.
ref  
TELECOMMUNICATIONS  
5
MC145423  
MASTER SWITCHING CHARACTERISTICS (V  
= 5 V ±10%, T = –40° to 85°C, C = 50 pF)  
DD  
A
L
Figure  
No.  
Parameter  
Input Rise Time: All Digital Inputs  
Input Fall Time: All Digital Inputs  
Pulse Width:  
TDC, RDC, RE1, RE2, MSI, SDCLK (UDLT-2)  
CCI Duty Cycle  
Propagation Delay:  
Symbol  
Min  
Max  
2
Unit  
µs  
t
r
t
f
2
µs  
t
ns  
p
90  
45  
t
55  
%
w2(H,L)  
t
t
,
ns  
PLH  
MSI to SDO1, SDO2, VD (PD = V  
)
50  
50  
DD  
TDC to Tx  
PHL  
MSI, TE1, TE2, RE1, RE2 to TDC-RDC Setup Time  
TDC-RDC to MSI, TE1, TE2, RE1, RE2, Hold Time  
Rx to TDC-RDC Setup Time  
t
20  
50  
30  
30  
30  
30  
50  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
su3  
t
h5  
t
su5  
Rx to TDC-RDC Hold Time  
t
h1  
SDI1, SDI2 to MSI Setup Time  
t
su2  
SDI1, SDI2 to MSI Hold Time  
t
h2  
MSI Rising Edge to First SDCLK Falling Edge  
(UDLT-2 Only)  
t
P1LH  
TE Rising Edge to First Tx Data Bit Valid  
t
t
50  
50  
ns  
ns  
ns  
ns  
su6  
TDC-RDC Rising Edge to Tx Data Bits 2 – 8 Valid  
TE1,TE2 Falling Edge to Tx High Impedance  
su7  
t
70  
dly  
SDCLK Rising Edge to SDO1, SDO2 Bit Valid  
(UDLT-2 Only)  
t
135  
su8  
SDI1, SDI2 Data Setup (Data Valid Before SDCLK  
Falling Edge) (UDLT-2 Only)  
t
50  
20  
ns  
ns  
su9  
SDI1, SDI2 Data Hold (Data Valid After SDCLK  
Falling Edge) (UDLT-2 Only)  
t
h3  
PD, LB Setup (PD, LB Valid Before MSI Rising Edge)  
PD, LB Hold (PD, LB Valid After MSI Rising Edge)  
t
50  
20  
ns  
ns  
su10  
t
h4  
6
TELECOMMUNICATIONS  
MC145423  
SLAVE SWITCHING CHARACTERISTICS (V  
= 5 V ±10%, T = –40° to 85°C, C = 50 pF)  
DD  
A
L
Figure  
No.  
Parameter  
Input Rise Time: All Digital Inputs  
Input Fall Time: All Digital Inputs  
Clock Output Pulse Width: BCLK  
Crystal Frequency  
Symbol  
Min  
Max  
2
Unit  
µs  
t
r
t
f
2
µs  
t
3.66  
4.086  
4.15  
4.1  
µs  
w(H,L)  
f
MHz  
ns  
x1  
Propagation Delay Times:  
EN1, EN2, TE1 Rising to BCLK (TONE = V  
EN1, EN2, TE1 Rising to BCLK (TONE = V  
)
)
t
t
t
t
t
t
t
t
–50  
300  
175  
400  
20  
20  
50  
400  
50  
50  
DD  
SS  
p1  
p1  
p2  
p3  
p4  
p4  
p5  
p6  
BCLK to EN1, EN2, TE1 Falling  
RE1 Rising to BCLK (UDLT-1)  
RE1 Falling to BCLK (TONE = V ) (UDLT-1)  
–50  
300  
DD  
RE1 Falling to BCLK (TONE = V ) (UDLT-1)  
SS  
BCLK to Tx  
TE1,TE2 to SDO1, SDO2  
Rx to BCLK Setup Time  
t
30  
30  
30  
30  
31  
31  
10  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
µs  
µs  
ns  
ns  
su5  
Rx to BCLK Hold Time  
t
h1  
SDI1, SDI2 to TE Setup Time  
t
su6  
SDI1, SDI2 to TE Hold Time  
t
h2  
EN1, EN2 Rising Edge to DCLK Rising Edge (UDLT-2)  
EN1, EN2 Rising Edge to First Tx Data Bit Valid  
BCLK Rising Edge to Tx Data Bits 2 – 8 Valid  
DCLK Pulse Width High (UDLT-2)  
t
±30  
30  
PHL  
t
dly1  
t
–40  
31.5  
31.5  
30  
su7  
t
w(H)  
DCLK Pulse Width Low (UDLT-2)  
t
w(L)  
DCLK Rising Edge to SDO1, SDO2 (UDLT-2)  
t
dly2  
SDI1, SDI2 Setup (SDI1, SDI2 Valid Before DCLK  
Falling Edge) (UDLT-2)  
t
su9  
SDI1, SDI2 Hold (SDI1, SDI2 Valid After DCLK  
Falling Edge) (UDLT-2)  
t
30  
30  
ns  
ns  
h3  
EN1, TE1 Rising Edge to VD Valid  
t
dly3  
SE PIN TIMING  
Figure  
No.  
Parameter  
Symbol  
Min  
Max  
Unit  
LB, PD Hold  
(LB, PD Valid After SE Falling Edge)  
t
10  
ns  
h
SDO1, SDO2, VD High Impedance After SE Falling Edge  
SDO1, SDO2, VD Valid After SE Rising Edge  
t
30  
25  
40  
ns  
ns  
ns  
dly1  
t
dly2  
LB, PD Setup  
(LB, PD Valid Before SE Rising Edge)  
t
su  
TELECOMMUNICATIONS  
7
MC145423  
Figure 1. UDLT-1 Slave Timing Nonsynchronous  
8
TELECOMMUNICATIONS  
MC145423  
Figure 2. UDLT-1 Slave Timing Synchronous  
TELECOMMUNICATIONS  
9
MC145423  
Figure 3. UDLT-2 Slave Timing  
10  
TELECOMMUNICATIONS  
MC145423  
Figure 4. UDLT-1 Master Timing  
TELECOMMUNICATIONS  
11  
MC145423  
Figure 5. UDLT-2 Master Timing  
12  
TELECOMMUNICATIONS  
MC145423  
SE  
LB, PD  
t
t
su  
h
PREVIOUS STATE  
INTERNALLY LATCHED  
SDO1, SDO2, VD  
t
t
dly2  
dly1  
Figure 6. SE Pin Timing  
TELECOMMUNICATIONS  
13  
MC145423  
SOIC PACKAGE PINOUT COMPARISON  
UDLT-3 PINOUT VERSUS MC145421DW/22DW/25DW/26DW  
(UDLT-1/UDLT-2 MASTER/SLAVE) PINOUT  
UDLT-3  
MC145423  
UDLT-1 Master  
MC145422  
UDLT-1 Slave  
MC145426  
UDLT-2 Master  
MC145421  
UDLT-2 Slave  
MC145425  
Pin  
No.  
Pin  
Name  
Pin  
No.  
Pin  
Name  
Pin  
No.  
Pin  
Name  
Pin  
No.  
Pin  
Name  
Pin  
No.  
Pin  
Name  
1
2
V
1
V
1
2
3
5
6
7
9
V
1
V
1
2
3
4
5
6
7
V
SS  
SS  
SS  
SS  
SS  
V
2
V
V
2
V
V
ref  
ref  
ref  
ref  
ref  
3
LI  
LB  
3
LI  
LI  
3
LI  
LI  
4
5
LB  
LB  
4
LB  
LB  
5
VD  
6
VD  
SI1  
SI2  
VD  
SI1  
SI2  
5
VD  
D1I  
D2I  
VD  
DI1  
DI2  
6
SDI1  
7
6
7
SDI2  
9
7
8
FRAME 10/20  
SDCLK/8kHz  
SDO1  
Logic 0  
Logic 0  
SDCLK  
SO1  
Logic 1  
Logic 1  
9
High Impedance  
SO1  
8
DCLK  
D1O  
D2O  
SE  
8
DCLK  
D1O  
10  
11  
12  
13  
14  
15  
16  
8
8
9
9
SDO2  
10  
11  
12  
SO2  
SE  
10  
11  
12  
SO2  
Mu/A  
PD  
10  
11  
12  
10  
11  
12  
D2O  
SE/(Mu/A)  
PD  
(Mu/A)  
PD  
PD  
PD  
MOD TRI/SQ  
Tx  
Logic 0  
Logic 0  
Tx  
B1B2  
Logic 0  
TE1  
(Tone) TE  
(XTAL ) X1  
Logic 1  
Logic 1  
16  
14  
Tx  
15  
13  
14  
Tx  
13  
14  
Tx  
EN2-TE2/SIE/  
B1B2  
SIE  
TE2  
EN2  
17  
18  
19  
20  
EN1-TE1  
15  
13  
17  
18  
TE1  
MSI  
14  
13  
16  
17  
15  
16  
17  
18  
TE1  
MSI  
15  
16  
17  
18  
EN1  
MSI/TONE  
TONE  
CCI/XTAL  
CCI  
CCI  
(XTAL ) CCI  
in  
in  
TDC-RDC/  
XTAL  
in  
(XTAL ) X2  
TDC/RDC  
TDC/RDC  
(XTAL ) XTL  
out  
out  
out  
21  
LI SENS/  
2.048 MHz  
Logic 0  
LI SENS  
2.048 MHz Out  
Logic 0  
LI SENS  
2.048 MHz Out  
22  
23  
24  
25  
26  
27  
RE1/CLKOUT  
RE2/BCLK  
Rx  
20  
RE1  
20  
18  
19  
22  
23  
RE1  
(BCLK) CLK  
Rx  
19  
20  
21  
22  
23  
RE1  
19  
20  
21  
22  
23  
CLKOUT  
BCLK  
Rx  
High Impedance  
RE2  
Rx  
19  
Rx  
LO2  
22  
23  
LO2  
LO1  
LO2  
LO2  
LO1  
LO2  
LO1  
LO1  
LO1  
MASTER/  
SLAVE  
Logic 0  
Logic 1  
Logic 0  
Logic 1  
28  
V
24  
V
24  
V
24  
V
24  
V
DD  
DD  
DD  
DD  
DD  
14  
TELECOMMUNICATIONS  
MC145423  
MC145423 UDLT-3 PIN STATES FOR UDLT-1 SLAVE MODE  
UDLT-1 Slave Mode Powered-Down  
TONE = 0, Off TONE = 1, On  
No Valid Valid No Valid Valid  
Burst Rec’d Burst Rec’d Burst Rec’d Burst Rec’d  
Power Supply Power Supply Power Supply Power Supply Power Supply Power Supply  
UDLT-1 Slave Mode  
MC145423  
Powered-Up  
Pin  
No.  
Pin  
Name  
In/out  
Normal  
LB Low  
1
V
Power  
SS  
Gnd  
Gnd  
Gnd  
Gnd  
Gnd  
Gnd  
2
V
ref  
Analog  
Ref  
AGND  
AGND  
AGND  
AGND  
AGND  
AGND  
V
/2  
V
/2  
V
/2  
V
/2  
V
/2  
V
/2  
DD  
DD  
DD  
DD  
DD  
DD  
3
4
5
6
LI  
LB  
Input  
Input  
Analog In  
1
Analog In  
0
Analog In  
Don’t Care  
VD = 0  
Analog In  
Don’t Care  
VD = 1  
Analog In  
Don’t Care  
VD = 0  
Analog In  
Don’t Care  
VD = 1  
VD  
Output  
Input  
Digital Out  
Digital Out  
SDI1  
8 kbps  
Data In  
8 kbps  
Data In  
Don’t Care  
Don’t Care  
Don’t Care  
Don’t Care  
7
8
SDI2  
Input  
Input  
8 kbps  
Data In  
8 kbps  
Data In  
Don’t Care  
0
Don’t Care  
0
Don’t Care  
0
Don’t Care  
0
FRAME  
10/20  
0
0
9
SDCLK/  
8kHz  
Output  
Output  
Output  
Input  
SDCLK/8kHz SDCLK/8kHz  
High-Z,  
Not Used  
High-Z,  
Not Used  
High-Z,  
Not Used  
High-Z,  
Not Used  
10  
11  
SDO1  
8 kbps  
8 kbps  
Data Not  
Changed  
8 kbps  
Data Out  
Data Not  
Changed  
8 kbps  
Data Out  
Data Out  
Data Out  
SDO2  
8 kbps  
8 kbps  
Data Not  
Changed  
8 kbps  
Data Out  
Data Not  
Changed  
8 kbps  
Data Out  
Data Out  
Data Out  
12 SE/(Mu/A)  
1= Mu,  
0 = A  
1= Mu,  
0 = A  
1= Mu,  
0 = A  
1= Mu,  
0 = A  
1= Mu,  
0 = A  
1= Mu,  
0 = A  
13  
14  
PD  
I/O  
1
0
1
0
0
0
0
0
0
0
0
0
MOD  
Input  
TRI/SQ  
15  
16  
Tx  
Output  
Input  
64 kbps  
Data Out  
64 kbps  
Data Out  
High  
Impedance  
64 kbps  
Data Out  
64 kbps  
PCM Tone  
64 kbps  
PCM Tone  
EN2-TE2/  
SIE/B1B2  
1/0 B1B2  
1/0 B1B2  
1/0 B1B2  
1/0 B1B2  
1/0 B1B2  
1/0 B1B2  
17  
18  
EN1-TE1  
Output  
Input  
EN1 = 8 kHz EN1 = 8 kHz  
1/0 TONE 1/0 TONE  
EN1 = 0  
EN1 = 8 kHz EN1 = 8 kHz EN1 = 8 kHz  
TONE = 0 TONE = 1 TONE = 1  
MSI/  
TONE = 0  
TONE  
19  
CCI/  
XTAL  
Input  
XTAL  
XTAL  
XTAL  
XTAL  
in  
XTAL  
in  
XTAL  
in  
in  
4.096 MHz  
in  
4.096 MHz  
in  
4.096 MHz  
4.096 MHz  
4.096 MHz  
4.096 MHz  
in  
20 TDC-RDC/ Output  
XTAL  
XTAL  
out  
4.096 MHz  
XTAL  
out  
4.096 MHz  
XTAL  
out  
4.096 MHz  
XTAL  
XTAL  
XTAL  
out  
out  
out  
4.096 MHz  
4.096 MHz  
4.096 MHz  
out  
21  
LI SENS/  
Output  
2.048 MHz  
2.048 MHz  
2.048 MHz  
2.048 MHz  
2.048 MHz  
2.048 MHz  
2.048 MHz  
22  
RE1/  
Output  
RE1 = 8 kHz RE1 = 8 kHz  
RE1 = 1  
RE1 = 8 kHz RE1 = 8 kHz RE1 = 8 kHz  
CLKOUT  
TELECOMMUNICATIONS  
15  
MC145423  
MC145423 UDLT-3 PIN STATES FOR UDLT-1 SLAVE MODE (continued)  
UDLT-1 Slave Mode Powered-Down  
TONE = 0, Off TONE = 1, On  
No Valid Valid No Valid Valid  
Burst Rec’d Burst Rec’d Burst Rec’d Burst Rec’d  
UDLT-1 Slave Mode  
Powered-Up  
MC145423  
Pin  
No.  
Pin  
Name  
In/out  
Normal  
LB Low  
23  
24  
25  
26  
27  
28  
RE2/  
BCLK  
Output  
BCLK =  
128 kHz  
BCLK = 0  
BCLK =  
128 kHz  
BCLK =  
128 kHz  
BCLK =  
128 kHz  
BCLK =  
128 kHz  
Rx  
Input  
Output  
Output  
Input  
64 kbps  
Data In  
Don’t Care  
Don’t Care  
LO2 = LO1  
LO1 = LO2  
1
Don’t Care  
LO2 = LO1  
LO1 = LO2  
1
Don’t Care  
LO2 = LO1  
LO1 = LO2  
1
Don’t Care  
LO2 = LO1  
LO1 = LO2  
1
LO2  
LO1  
Modulator  
Out  
Modulator  
Out  
Modulator  
Out  
Modulator  
Out  
MASTER/  
SLAVE  
1
1
V
Power  
+V  
+V  
+V  
+V  
+V  
+V  
DD  
MC145423 UDLT-3 PIN STATES FOR UDLT-1 MASTER MODE  
UDLT-1 Master Mode  
UDLT-1 Master Mode  
Powered-Down  
MC145423  
Powered-Up  
Pin  
No.  
Pin  
Name  
In/out  
Normal  
LB Low  
SE Low  
Normal  
SE Low  
1
V
Power  
Power Supply  
Gnd  
Power Supply  
Gnd  
Power Supply  
Gnd  
Power Supply  
Gnd  
Power Supply  
Gnd  
SS  
2
V
ref  
Analog  
Ref  
AGND V /2  
DD  
AGND V /2  
DD  
AGND V /2  
DD  
AGND V /2  
DD  
AGND V /2  
DD  
3
4
LI  
LB  
Input  
Input  
Output  
Input  
Input  
Input  
Analog In  
1
Don’t Care  
0
Analog In  
State Latched  
High Impedance  
State Latched  
State Latched  
0
Analog In  
Don’t Care  
Digital out  
8 kbps Data In  
8 kbps Data In  
0
Analog In  
Don’t Care  
High Impedance  
State Latched  
State Latched  
0
5
VD  
Digital out  
8 kbps Data In  
8 kbps Data In  
0
Digital out  
8 kbps Data In  
8 kbps Data In  
0
6
SDI1  
7
SDI2  
8
FRAME 10/20  
SDCLK  
SDO1  
SDO2  
SE/(Mu/A)  
PD  
9
Don’t Care High Impedance High Impedance High Impedance High Impedance High Impedance  
10  
11  
12  
13  
14  
Output  
Output  
Input  
8 kbps Data Out 8 kbps Data Out High Impedance 8 kbps Data Out High Impedance  
8 kbps Data Out 8 kbps Data Out High Impedance 8 kbps Data Out High Impedance  
1
1
0
1
1
0
0
1
0
0
0
Input  
State Latched  
0
State Latched  
0
MOD  
Input  
TRI/SQ  
15  
16  
Tx  
Output  
Input  
64 kbps  
Data Out  
64 kbps  
Data Out  
64 kbps  
Data Out  
64 kbps  
Data Out  
64 kbps  
Data Out  
EN2-TE2/  
SIE/B1B2  
SIE Digital In  
SIE Digital In  
SIE Digital In  
SIE Digital In  
SIE Digital In  
16  
TELECOMMUNICATIONS  
MC145423  
MC145423 UDLT-3 PIN STATES FOR UDLT-1 MASTER MODE (continued)  
UDLT-1 Master Mode  
UDLT-1 Master Mode  
Powered-Down  
MC145423  
Powered-Up  
Pin  
No.  
Pin  
Name  
In/out  
Input  
Input  
Input  
Normal  
TE1 8 kHz  
MSI 8 kHz  
LB Low  
TE1 8 kHz  
MSI 8 kHz  
SE Low  
TE1 8 kHz  
MSI 8 kHz  
Normal  
SE Low  
TE1 8 kHz  
MSI 8 kHz  
17  
18  
19  
EN1-TE1  
MSI/TONE  
CCI/  
TE1 8 kHs  
MSI 8 kHz  
CCI 2.048 MHz CCI 2.048 MHz CCI 2.048 MHz CCI 2.048 MHz CCI 2.048 MHz  
XTAL  
in  
TDC-RDC/  
XTAL  
20  
21  
22  
23  
Input  
Input  
Input  
TDC-RDC  
Data Clk  
TDC-RDC  
Data Clk  
TDC-RDC  
Data Clk  
TDC-RDC  
Data Clk  
TDC-RDC  
Data Clk  
out  
LI SENS/  
2.048 MHz  
Digital In  
LI Sensitivity  
Digital In  
LI Sensitivity  
Digital In  
LI Sensitivity  
Digital In  
LI Sensitivity  
Digital In  
LI Sensitivity  
RE1/  
CLKOUT  
RE1 8 kHz  
RE1 8 kHz  
RE1 8 kHz  
RE1 8 kHz  
RE1 8 kHz  
RE2/  
Don’t Care High Impedance High Impedance High Impedance High Impedance High Impedance  
BCLK  
24  
25  
26  
27  
Rx  
Input  
Output  
Output  
Input  
64 kbps Data In 64 kbps Data In 64 kbps Data In  
Don’t Care  
LO2 = LO1  
LO1 = LO2  
0
Don’t Care  
LO2 = LO1  
LO1 = LO2  
0
LO2  
LO1  
Modulator Out  
Modulator Out  
0
LO2 = LO1  
LO1 = LO2  
0
No Effect  
No Effect  
0
MASTER/  
SLAVE  
28  
V
Power  
+V  
+V  
+V  
+V  
+V  
DD  
MC145423 UDLT-3 PIN STATES FOR UDLT-2 SLAVE MODE  
UDLT-2 Slave Mode  
Powered-Down  
UDLT-2 Slave Mode  
MC145423  
Powered-Up  
TONE = 0, Off  
No Valid Valid  
Burst Rec’d Burst Rec’d Burst Rec’d Burst Rec’d  
Power Supply Power Supply Power Supply Power Supply Power Supply Power Supply  
TONE = 1, On  
Pin  
No.  
Pin  
Name  
No Valid Valid  
In/out  
Normal  
LB Low  
1
V
Power  
SS  
Gnd  
Gnd  
Gnd  
Gnd  
Gnd  
Gnd  
2
V
Analog  
Ref  
AGND  
AGND  
AGND  
AGND  
AGND  
AGND  
ref  
V
/2  
V
/2  
V
/2  
V
/2  
V
/2  
V
/2  
DD  
DD  
DD  
DD  
DD  
DD  
3
4
5
6
LI  
LB  
Input  
Input  
Analog In  
1
Analog In  
0
Analog In  
Don’t Care  
VD = 0  
Analog In  
Don’t Care  
VD = 1  
Analog In  
Don’t Care  
VD = 0  
Analog In  
Don’t Care  
VD = 1  
VD  
Output  
Input  
Digital Out  
Digital Out  
SDI1  
16 kbps  
Data In  
16 kbps  
Data In  
Don’t Care  
Don’t Care  
Don’t Care  
Don’t Care  
7
8
9
SDI2  
Input  
Input  
16 kbps  
Data In  
16 kbps  
Data In  
Don’t Care  
1
Don’t Care  
1
Don’t Care  
1
Don’t Care  
1
FRAME  
10/20  
1
1
SDCLK  
Output  
16 kHz  
16 kHz  
16 kHz  
16 kHz  
16 kHz  
16 kHz  
TELECOMMUNICATIONS  
17  
MC145423  
MC145423 UDLT-3 PIN STATES FOR UDLT-2 SLAVE MODE (continued)  
UDLT-2 Slave Mode  
Powered-Down  
UDLT-2 Slave Mode  
Powered-Up  
MC145423  
TONE = 0, Off  
TONE = 1, On  
Pin  
No.  
Pin  
Name  
No Valid Valid  
Burst Rec’d Burst Rec’d Burst Rec’d Burst Rec’d  
No Valid Valid  
In/out  
Normal  
LB Low  
10  
11  
12  
SDO1  
SDO2  
Output  
16 kbps  
Data Out  
16 kbps  
Data Out  
Data Not  
Changed  
16 kbps  
Data Out  
Data Not  
Changed  
16 kbps  
Data Out  
Output  
Input  
16 kbps  
Data Out  
16 kbps  
Data Out  
Data Not  
Changed  
16 kbps  
Data Out  
Data Not  
Changed  
16 kbps  
Data Out  
SE/  
1/0  
1/0  
1/0  
1/0  
1/0  
1/0  
(Mu/A)  
Mu/A  
Mu/A  
Mu/A  
Mu/A  
Mu/A  
Mu/A  
13  
14  
PD  
I/O  
1
1
1
1
0
1
0
1
0
1
0
1
MOD  
Input  
TRI/SQ  
15  
16  
Tx  
Output  
Output  
128 kbps  
Data Out*  
128 kbps  
Data Out*  
High  
Impedance  
64 kbps  
Data Out  
500 Hz  
Tone Out  
500 Hz  
Tone Out  
EN2-TE2/  
SIE/B1B2  
EN2 8 kHz  
EN2 8 kHz  
EN2 = 0  
EN2 = 0  
EN2 8 kHz  
EN2 8 kHz  
17  
18  
EN1-TE1  
Output  
Input  
EN1 8 kHz  
1/0 Tone  
EN1 8 kHz  
1/0 Tone  
EN1 = 0  
EN1 = 0  
EN1 8 kHz  
1 No Tone  
EN1 8 kHz  
1 Tone  
MSI/  
0 No Tone  
0 No Tone  
TONE  
19  
CCI/  
Input  
XTAL  
XTAL  
XTAL  
XTAL  
XTAL  
XTAL  
XTAL  
8.192 MHz  
8.192 MHz  
8.192 MHz  
8.192 MHz  
8.192 MHz  
8.192 MHz  
in  
20 TDC-RDC/ Output  
XTAL  
XTAL  
8.192 MHz  
XTAL  
8.192 MHz  
XTAL  
8.192 MHz  
XTAL  
8.192 MHz  
XTAL  
8.192 MHz  
XTAL  
8.192 MHz  
out  
21  
22  
23  
24  
25  
26  
27  
28  
LI SENS/  
2.048 MHz  
Output  
Output  
Output  
Input  
2.048 MHz  
RE1 8 kHz  
2.048 MHz  
RE1 8 kHz  
BCLK = 0  
Don’t Care  
2.048 MHz  
RE1 0  
2.048 MHz  
RE1 0  
2.048 MHz  
RE1 8 kHz  
2.048 MHz  
RE1 8 kHz  
RE1/  
CLKOUT  
RE2/  
BCLK  
BCLK  
128 kHz  
BCLK  
128 kHz  
BCLK  
128 kHz  
BCLK  
128 kHz  
BCLK  
128 kHz  
Rx  
128 kbps  
Data In  
Don’t Care  
LO2 = LO1  
LO2 = LO1  
1
Don’t Care  
LO2 = LO1  
LO2 = LO1  
1
128 kbps  
Data In  
128 kbps  
Data In  
LO2  
LO1  
Output  
Output  
Input  
Modulator  
Out  
Modulator  
Out  
LO2 = LO1  
LO2 = LO1  
Modulator  
Out  
Modulator  
Out  
LO1 = LO2  
LO1 = LO2  
MASTER/  
SLAVE  
1
1
1
1
V
DD  
Power  
+V  
+V  
+V  
+V  
+V  
+V  
* Tx is high impedance when TE1 and TE2 are both low, simultaneously.  
Tx is undefined when TE1 and TE2 are both high, simultaneously.  
18  
TELECOMMUNICATIONS  
MC145423  
MC145423 UDLT-3 PIN STATES FOR UDLT-2 MASTER MODE  
MC145423  
UDLT-2 Master Powered-Up  
UDLT-2 Master Powered-Down  
Pin  
No.  
Pin  
Name  
In/out  
Normal  
LB Low  
SE Low  
Normal  
SE Low  
1
V
Power  
Power Supply  
Gnd  
Power Supply  
Gnd  
Power Supply  
Gnd  
Power Supply  
Gnd  
Power Supply  
Gnd  
SS  
2
3
4
5
6
7
8
V
Analog Ref AGND V /2  
DD  
AGND V /2  
DD  
AGND V /2  
DD  
AGND V /2  
DD  
AGND V /2  
DD  
ref  
LI  
Input  
Input  
Output  
Input  
Input  
Input  
Analog In  
1
Don’t Care  
0
Analog In  
Analog In  
Don’t Care  
Digital Out  
Analog In  
Don’t Care  
LB  
State Latched  
High Impedance  
VD  
Digital Out  
Digital Out  
High Impedance  
SDI1  
SDI2  
16 kbps Data In 16 kbps Data In State Latched 16 kbps Data In State Latched  
16 kbps Data In 16 kbps Data In State Latched 16 kbps Data In State Latched  
FRAME 10/  
20  
1
1
1
1
1
9
SDCLK  
SDO1  
Input  
16 kHz  
16 kHz  
16 kHz  
16 kHz  
16 kHz  
10  
Output  
16 kbps Data  
Out  
16 kbps Data High Impedance 16 kbps Data High Impedance  
Out Out  
11  
SDO2  
Output  
16 kbps Data  
Out  
16 kbps Data High Impedance 16 kbps Data High Impedance  
Out  
Out  
12  
13  
SE/(Mu/A)  
PD  
Input  
Input  
1
1
1
1
0
1
0
1
State Latched  
1
0
State Latched  
1
14 MOD TRI/SQ  
Input  
1
1
15  
Tx  
Output  
128 kbps*  
Data Out  
128 kbps*  
Data Out  
128 kbps*  
Data Out  
128 kbps*  
Data Out  
128 kbps*  
Data Out  
16  
EN2-TE2/  
SIE/B1B2  
Input  
TE2 8 kHz  
TE2 8 kHz  
TE2 8 kHz  
TE2 8 kHz  
TE2 8 kHz  
17  
18  
19  
EN1-TE1  
Input  
Input  
Input  
TE1 8 kHz  
8 kHz  
TE1 8 kHz  
8 kHz  
TE1 8 kHz  
8 kHz  
TE1 8 kHz  
8 kHz  
TE1 8 kHz  
8 kHz  
MSI/TONE  
CCI/XTAL  
CCI  
4.096 MHz  
CCI  
4.096 MHz  
CCI  
4.096 MHz  
CCI  
4.096 MHz  
CCI  
4.096 MHz  
in  
20  
21  
22  
TDC-RDC/  
XTAL  
Input  
Input  
Input  
TDC-RDC  
Data Clk  
TDC-RDC  
Data Clk  
TDC-RDC  
Data Clk  
TDC-RDC  
Data Clk  
TDC-RDC  
Data Clk  
out  
LI SENS/  
2.048 MHz  
Digital In  
Sensitivity  
Digital In  
Sensitivity  
Digital In  
Sensitivity  
Digital In  
Sensitivity  
Digital In  
Sensitivity  
RE1/  
RE1 8 kHz  
RE1 8 kHz  
RE1 8 kHz  
RE1 8 kHz  
RE1 8 kHz  
CLKOUT  
23  
24  
25  
26  
27  
RE2/BCLK  
Rx  
Input  
Input  
RE2 8 kHz  
RE2 8 kHz  
RE2 8 kHz  
RE2 8 kHz  
Don’t Care  
LO2 = LO1  
LO1 = LO2  
0
RE2 8 kHz  
Don’t Care  
LO2 = LO1  
LO1 = LO2  
0
128 kbps Data In 128 kbps Data In 128 kbps Data In  
LO2  
Output  
Output  
Input  
Modulator Out  
Modulator Out  
0
LO2 = LO1  
LO1 = LO2  
0
No Effect  
No Effect  
0
LO1  
MASTER/  
SLAVE  
28  
V
Power  
+V  
+V  
+V  
+V  
+V  
DD  
* Tx is high impedance when TE1 and TE2 are both low, simultaneously.  
Tx is undefined when TE1 and TE2 are both high, simultaneously.  
TELECOMMUNICATIONS  
19  
MC145423  
PIN DESCRIPTIONS  
synchronization and the absence of detected bit errors.  
VD is a CMOS output and is high impedance when SE  
is low.  
V
SS  
Negative Supply (Pin 1)  
Master Mode: VD changes state on the rising  
edge of MSI, when PD is high. When PD is low, VD  
changes state at the end of demodulation of a  
transmission burst and does not change again until  
three MSI rising edges have occurred, at which time it  
goes low, or until the next demodulation of a burst.  
Slave Mode: If no transmissions from the master  
have been received within the last 250 µs, as  
determined by an internal oscillator, VD will go low.  
This is the most negative power pin, and should be  
tied to system ground (0 V).  
V
ref  
Voltage Reference Output (Pin 2)  
This is the output from the internal reference supply  
(mid-supply) and should be bypassed to both V and  
SS  
V
with 0.1 µF capacitors. This pin usually serves  
DD  
as an analog ground reference for transformer  
coupling of the device’s incoming bursts from the line.  
No external load should be placed on this pin.  
SDI1 and SDI2  
D Channel Signaling Data Bit Inputs 1 and 2  
(Pins 6 and 7)  
LI  
Master Mode (UDLT-1): These inputs are the  
8 kbps serial data inputs in UDLT-1 mode. Data on  
these pins is loaded on the rising edge of MSI for  
transmission to the slave. The state of these pins is  
latched if SE is held low.  
Line Input (Pin 3)  
This pin is the input to the demodulator for the  
incoming bursts. This input has an internal 240 kΩ  
resistor tied to the V pin, so an external capacitor or  
line transformer may be used to couple the input signal  
to the device with no dc offset.  
ref  
Slave Mode (UDLT-1): These inputs are the  
8 kbps serial data inputs in UDLT-1 mode. Data on  
these pins is loaded on the rising edge of TE1 for  
transmission to the master. If no transmissions from  
the master are being received and PD is high, data on  
these pins will be loaded into the part on an internal  
signal. Therefore, data on these pins should be steady  
until synchronous communication with the master has  
been established, as indicated by the high on VD.  
Master Mode (UDLT-2): These inputs are the  
16 kbps serial data inputs in UDLT-2 mode. Two bits  
should be clocked into each of these inputs between  
the rising edges of the MSI frame reference clock. The  
first bit of each D channel is clocked into an  
intermediate buffer on the first falling edge of the  
SDCLK following the rising edge of MSI. The second  
bit of each D channel is clocked in on the next  
negative transition of the SDCLK. If further SDCLK  
negative edges occur, new information is serially  
clocked into the buffer replacing the previous data,  
one bit at a time. Buffered D channel bits are burst to  
the slave on the next rising edge of the MSI frame  
reference clock. The state of these pins is latched if SE  
is held low.  
LB  
Loopback Low Input (Pin 4)  
Master Mode: A low on this pin ties the internal  
modulator output to the internal demodulator input,  
which loops the entire burst for testing purposes.  
During the loopback operation, the LI input is ignored,  
and the LO1 and LO2 outputs are driven to equal  
voltages. The state of the LB pin is internally latched if  
the SE pin is held low. This feature is only active when  
the PD input is high.  
Slave Mode: When this pin is low and PD is high,  
the incoming B channels from the master are burst  
back to the master, instead of the Rx B channel input  
data. The SDI1 and SDI2 functions operate normally  
in this mode, and the BCLK (pin 23) is held low.  
Additionally, for both the UDLT-1 and UDLT-2 mode,  
when the TONE (pin 18) and loopback functions are  
active simultaneously, the loopback function overrides  
the TONE function.  
VD  
Slave Mode (UDLT-2): These inputs are the  
16 kbps serial data inputs in UDLT-2 mode. The D  
channel data bits are clocked in serially on the  
negative edge of the 16 kbps SDCLK output pin.  
Valid Data Output (Pin 5)  
A high level on this pin indicates that a valid line  
transmission has been demodulated. A valid line  
transmission burst is determined by proper  
20  
TELECOMMUNICATIONS  
MC145423  
FRAME 10/20  
(Pin 8)  
tells the D channel data shift register to produce the  
second D channel bit on the next rising edge of the  
SDCLK. Further rising edges of the SDCLK  
recirculate the D channel output buffer information.  
Master Mode (UDLT-1): These outputs are  
received signaling bits from the slave UDLT and  
change state on the rising edge of MSI, if PD is high;  
or at the end of demodulation, if PD is low.  
Slave Mode (UDLT-2): These two pins are the  
outputs for the 16 kbps D channels. These pins are  
updated on the rising edges of the slave SDCLK  
output pin.  
The UDLT series of transceivers are designed to  
operate using a ping-pong transmission scheme with  
an 8 kHz burst rate. Each frame the master device  
“pings” a burst of data to the slave, which responds  
with a “pong” burst of data. This pin selects whether  
this 8 kHz frame will have a 10-bit data burst for  
UDLT-1 compatibility or a 20-bit data burst for  
UDLT-2 compatibility.  
A logic low (0 V) selects the UDLT-1 (MC145422/  
MC145426) mode. This sets the device to operate with  
one 64 kbps voice/data channel and two 8 kbps  
Slave Mode (UDLT-1): These outputs are  
received signaling bits from the master UDLT and  
change state on the rising edge of TE1.  
signaling channels. A logic high (V ) on this pin  
DD  
selects the UDLT-2 (MC145421/MC145425) mode.  
This sets the device to operate with two 64 kbps  
channels and two 16 kbps channels (2B+2D).  
SE/(Mu/A)  
Signaling Enable Input or Tone Format Input  
(Pin 12)  
SDCLK  
D Channel Signaling Data Clock Input (Pin 9)  
Master Mode (SE): A low on this pin causes the  
state of LB, PD, SDI1, and SDI2 to be stored.  
Additionally, output pins VD, SDO1, and SDO2 will  
be high impedance. This allows the device to be  
bussed with other UDLTs using a common control bus.  
A high on this pin returns the device to normal  
operation.  
Slave Mode (Mu/A): This pin allows the user to  
select the PCM code format for the pacifier tone. A  
high on this pin selects Mu-Law. A low on this pin  
selects A-Law. The state of this pin determines the  
PCM code sequence for the 500 Hz square wave tone  
generated when the TONE pin input is high.  
Master Mode (UDLT-2): This is the transmit and  
receive data clock input for both D channels. See  
SDO1 and SDO2 pin descriptions for more  
information.  
Master Mode (UDLT-1): High impedance.  
Slave Mode (UDLT-2): This is the transmit and  
receive data clock output for both D channels. It starts  
on demodulation of a burst from the master device.  
This signal is rising-edge aligned with the EN1 and  
BCLK signals. After the demodulation of a burst, the  
SDCLK line completes two cycles and then remains  
low until the next burst from the master is  
demodulated. In this manner, synchronization with the  
master is established and any clock slip between  
master and slave is absorbed each frame.  
PD  
Power Down Low (Pin 13)  
Master Mode: When this pin is held low, the  
device powers down, except for the circuitry necessary  
to demodulate an incoming burst and to output VD  
and the B and D channel data bits. When this pin is  
brought high, the device waits for three positive MSI  
edges or until the end of an incoming transmission  
from the slave and then begins transmitting every MSI  
period to the slave UDLT on the next rising edge of  
MSI.  
Slave Mode: This is a bidirectional pin with a  
weak output driver that can be externally overdriven.  
When this pin is floating and a burst from the master is  
demodulated, the weak output drivers will try to force  
PD high. The drivers will try to force PD low, if  
Slave Mode (UDLT-1): This pin outputs 8 kHz  
equivalent to TE1.  
SDO1 and SDO2  
D Channel Signaling Data Outputs 1 and 2  
(Pins 10 and 11)  
Master Mode (UDLT-2): These serial outputs  
provide the 16 kbps D channel signaling information  
from the incoming burst. Two data bits should be  
clocked out of each of these two outputs between the  
rising edges of the MSI frame reference clock. The  
rising edge of MSI produces the first bit of each  
D channel on its respective pin. Circuitry then  
searches for a negative D channel clock edge. This  
TELECOMMUNICATIONS  
21  
MC145423  
250 µs have elapsed without a burst from the master  
being successfully demodulated. This allows the slave  
device to self power-up and power-down in demand  
powered loop systems. When held low, the device  
powers down and the only active circuitry, is that  
which is necessary for the demodulation of data. When  
held high, the device is powered up and transmits  
normally in response to received bursts from the  
master.  
of the incoming word at the Rx pin will be transmitted  
to the slave. The PCM word to the slave will have LSB  
forced low in this mode. In this manner, signal bit 2 to/  
from the slave UDLT is inserted into the PCM words  
the master sends and receives from the backplane, for  
routing through the PABX for simultaneous voice/data  
communication. The state of this pin is internally  
latched if the SE pin is brought and held low.  
Slave Mode (UDLT-1): In this mode, this pin is  
an input and selects the timeslot used for transferring  
the receive data word. When this pin is low, the device  
uses the RE1 pin timing the same as the MC145426  
UDLT-1 slave. When this pin is a logic 1, the receive  
word is latched in during the TE1 timeslot,  
simultaneously with the transmit word transfer. The  
RE1 pin timing is not affected by this selection.  
Master Mode (EN2-TE2 UDLT-2): In this mode,  
this pin functions as EN2-TE2. This pin, along with  
TE1 pin-17 control the output of data for their  
respective B-channel on the Tx output pin. When both  
TE1 and TE2 are low, the Tx pin is high impedance.  
The rising edge of the respective enable produces the  
first bit of the selected B-channel data on the Tx pin.  
Internal circuitry then scans for the next negative  
transition of the TDC-RDC clock. Following this  
event, the next seven bits of the selected B-channel  
data are output on the next seven rising edges of the  
TDC-RDC data clock. When TE1 and TE2 are high  
simultaneously, data on the Tx pin is undefined. TE1  
and TE2 should be approximately leading-edge  
aligned with the TDC-RDC data clock. To keep the Tx  
pin out of the high impedance state, these enable lines  
should be high while the respective B channel data is  
being output.  
MOD TRI/SQ  
Modulation Select (Pin 14)  
A logic low (0 V) on this pin selects the MDPSK  
modulation which has a slew controlled voltage output  
for reduced EMI/RFI. This output looks like a triangle  
waveform that is modulated with different angles for  
the peaks. A logic high (V ) on this pin, selects  
DD  
square wave output for maximum power to the line.  
Tx  
Transmit Data Output (Pin 15)  
Master Mode (UDLT-1): This pin is high  
impedance when TE1 is low. When TE1 is high, this  
pin presents new 8-bit B channel data on rising edges  
of TDC-RDC.  
Slave Mode (UDLT-1): B channel data is output  
on this pin on the rising edge of BCLK, while TE1 is  
high. This pin is high impedance when TE1 is low.  
Master Mode (UDLT-2): This pin is high  
impedance when both TE1 and TE2 are low. This pin  
serves as an output for B channel information received  
from the slave device. The B channel data is under  
control of TE1 and TE2 and TDC-RDC.  
Slave Mode (UDLT-2): This pin is an output for  
the B channel data received from the master.  
B channel 1 data is output on the first eight cycles of  
the BCLK output when EN1 is high. B channel 2 data  
is output on the next eight cycles of the BCLK, when  
EN2 is high. B channel data bits are clocked out on the  
rising edge of the BCLK output pin.  
Slave Mode (EN2-TE2 UDLT-2): Functioning as  
EN2-TE2, this pin is an output and serves as an 8 kHz  
enable signal for the input and output of the B channel  
2 data. While EN2 is high, B channel 2 data is clocked  
out on the Tx pin on the eight rising edges of the  
BCLK. During this same time, B channel 2 input data  
is clocked in on the Rx pin, on the eight falling edges  
of the BCLK.  
EN2-TE2/SIE/B1B2  
B Channel 2 Enable Output or  
Signal Insert Enable (Pin 16)  
EN1-TE1  
B Channel 1 Enable Output (Pin 17)  
Master Mode (SIE UDLT-1): In this mode, this  
pin functions as SIE. When held high, this pin causes  
signal bit 2, as received from the slave, to be inserted  
into the LSB of the outgoing PCM word at the Tx pin.  
The SDI2 pin will be ignored, and in its place, the LSB  
This pin is the logical inverse of EN2-TE2, and  
serves to control B channel 1 data. See the above pin  
description for more information. EN1 serves as the  
slave device’s 8 kHz frame reference signal. The VD  
22  
TELECOMMUNICATIONS  
MC145423  
pin is also updated on the rising edge of the EN1  
signal.  
desired. XTAL should be left open if an external  
out  
signal is used on this input.  
MSI/TONE  
Master Sync Input or Tone Enable Input  
(Pin 18)  
TDC-RDC/Xtal  
Transmit and Receive Data Clock or Crystal  
Output (Pin 20)  
out  
Master Mode (MSI): This pin is the master 8 kHz  
frame reference input. The rising edge of MSI loads  
B and D channel data, which had been input during the  
previous frame, into the modulator section of the  
device, and initiates the outbound burst onto the  
twisted pair cable. The rising edge of MSI also  
initiates the buffering of the B and D channel data  
demodulated during the previous frame. MSI should  
be approximately leading edge aligned with the TDC-  
RDC data clock input signal.  
Master Mode (TDC-RDC): This input is the  
transmit and receive data clock for the B channel data.  
Output data changes state on the rising edge of this  
signal, and input data is read on the falling edges of  
this signal. TDC-RDC should be roughly leading edge  
aligned with MSI.  
Slave Mode (XTAL  
out pin. It is capable of driving one external CMOS  
input and 15 pF of additional capacitance. See pin  
): This pin is the crystal  
out  
description for XTAL (pin 19).  
in  
Slave Mode (TONE): A high on this pin causes a  
500 Hz square wave PCM tone to be inserted in place  
of the demodulated data. This feature allows the  
designer to provide audio feedback for telset keyboard  
depressions.  
LI SENS/2.048 MHz  
Line Input Sensitivity or 2.048 MHz Output  
(Pin 21)  
Master Mode: By applying a logic 1 on this pin,  
the sensitivity of LI is reduced by 15 dB. This reduces  
the effects of crosstalk, and false detects that would be  
picked up and demodulated when the LI pin is  
connected to an open loop.  
Slave Mode: This pin outputs a 2.048 MHz signal  
for use with a PCM codec-filter. All other device  
clocks are generated from the rising edge of this clock.  
The 8 kHz enables are derived by dividing this  
2.048 MHz clock by a nominal ratio of 256. Phase  
synchronization to the master UDLT’s burst is  
achieved by dividing this clock by the ratios of either  
255, 256, or 257.  
CCI/XTAL  
in  
Convert Clock Input or Crystal Input (Pin 19)  
Master Mode (CCI UDLT-1): A 2.048 MHz  
clock signal should be applied to this pin. This signal  
is used for internal sequencing and control. This signal  
should be frequency and phase coherent with MSI for  
optimum performance.  
Slave Mode (XTAL UDLT-1): A 4.096 MHz  
in  
crystal is tied between this pin and XTAL  
(pin 20).  
and  
to V  
out  
A 10 Mresistor across this pin and XTAL  
out  
25 pF capacitors from this pin and XTAL  
out  
are required for stability and to ensure start-up. This  
pin may be driven from an external source. XTAL  
SS  
RE1/CLKOUT  
Receive Data Enable 1 Input or Clock Output  
(Pin 22)  
out  
should be left open if an external signal is used on this  
input.  
Master Mode (CCI UDLT-2): An 8.192 MHz  
clock should be supplied to this input. The 8.192 MHz  
input should be 50% duty cycle. This signal may free  
run with respect to all other clocks without  
performance degradation.  
Master Mode (RE1 UDLT-1): A rising edge on  
this pin will enable data on the Rx pin to be loaded  
into the receive data register on the next eight falling  
edges of the TDC-RDC data clock. RE1 and TDC-  
RDC should be approximately leading edge aligned.  
Slave Mode (RE1 UDLT-1): This B series  
CMOS output is the inverse of TE1 (see TE1 pin  
description).  
Master Mode (RE1 UDLT-2): This input along  
with RE2 (pin 23) control the input of B channel data  
on the Rx pin. The rising edge of the respective enable  
signal causes the device to load the selected receive  
Slave Mode (XTAL UDLT-2): Normally, an  
in  
8.192 MHz crystal is tied between this pin and the  
XTAL  
XTAL and XTAL  
XTAL and XTAL  
stability and start-up. XTAL may also be driven with  
in  
an external 8.192 MHz signal if a crystal is not  
(pin 20). A 10 Mresistor between  
out  
in  
in  
and 25 pF capacitors from  
out  
out  
to V are required to ensure  
SS  
TELECOMMUNICATIONS  
23  
MC145423  
data buffer with data from the Rx pin on the next eight  
falling edges of the TDC-RDC clock. The RE1 and  
RE2 enables should be roughly leading edge aligned  
with the TDC-RDC data clock. These enables are  
rising edge sensitive and need not be high for the  
entire B channel input period.  
which is simultaneous with the transfer of the transmit  
word. See the pin descriptions for EN2-TE2/SIE/  
B1B2 and EN1-TE2 for more information.  
Master Mode (UDLT-2): B channel data is input  
on this pin and controlled by the RE1, RE2, and TDC-  
RDC pins.  
Slave Mode (CLKOUT UDLT-2): This pin  
serves as a buffered output of the crystal frequency  
divided by two.  
Slave Mode (UDLT-2): This pin is an input for  
the B channel data. B channel 1 data is clocked in on  
the first eight falling edges of the BCLK output  
following the rising edge of the EN1 output. B channel  
2 data is clocked in on the next eight falling edges of  
the BCLK following the rising edge of the EN2  
output.  
RE2/BCLK  
Receive Data Enable Input 2 or B Channel  
Data Clock Output (Pin 23)  
Master Mode (UDLT-1): This pin is high  
impedance.  
LO2  
Line Drive Output (Pin 25)  
Master Mode (RE2 UDLT-2): See pin  
description for RE1 (pin 22).  
The LO2 pin, along with LO1 (pin 26) form a push-  
pull output, to drive the twisted pair transmission line.  
The UDLT-1 drives the twisted pair with a 10-bit,  
256 kHz modified DPSK (MDPSK) burst, or a square  
wave (set by pin 14 MOD TRI/SQ) burst, each 125 µs.  
The UDLT-2 drives the twisted pair with a 20-bit  
512 kHz modulated burst. When these pins are idle  
and set for square wave modulation, they rest at the  
positive power supply voltage. When these pins are  
Slave Mode (BCLK UDLT-1 and UDLT-2):  
This output provides the data clock for the telset  
codec-filter. This clock signal is 128 kHz and begins  
operating upon the successful demodulation of a burst  
from the master. At this time, EN1-TE1 goes high and  
BCLK starts toggling. BCLK remains active for  
16 periods, at the end of which time it remains low  
until another burst is received from the master. In this  
manner, synchronization between the master and slave  
is established and any clock slippage is absorbed each  
frame. If TONE (pin 18) is brought high, then EN1-  
TE1/RE1 are generated from an internal oscillator  
until TONE is brought low, or an incoming burst from  
the master is received. BCLK is disabled when LB is  
held low.  
idle and set for MDPSK, they rest at V . For power  
ref  
supply voltages less than 4.5 V, squarewave  
modulation must be used.  
LO1  
Line Driver Output (Pin 26)  
See the pin description for LO2 (pin 25).  
Rx  
MASTER/SLAVE  
Master/Slave Mode (Pin 27)  
Receive Data Input (Pin 24)  
Master Mode (UDLT-1): The 8-bit B channel  
data is clocked into the device on this pin, on the  
falling edges of TDC-RDC, under the control of RE1.  
Slave Mode (UDLT-1): The 8-bit B channel data  
from the telset PCM codec-filter is input on this pin on  
the eight falling edges of BCLK after RE1 goes high,  
when EN2-TE2/SIE/B1B2, pin 16 is low. When EN2-  
TE2/SIE/B1B2, pin16 is high, the receive data word is  
latched in during the high period of EN1-TE1, pin 17  
A logic low (0 V) on this pin selects master and a  
logic high (V ) selects slave.  
DD  
V
DD  
Positive Supply (Pin 28)  
This is the most positive power supply pin.  
Acceptable operating voltages are from 4.5 V to 5.5 V.  
24  
TELECOMMUNICATIONS  
MC145423  
TELECOMMUNICATIONS  
25  
MC145423  
MULTICHANNEL DIGITAL LINE CARD  
POWER  
SUPPLY  
V
MSI/TONE  
8 kHz FRAME SYNC  
TRANSMIT DATA BUS  
RECEIVE DATA BUS  
DD  
LO1  
TO  
BACK-  
PLANE  
Tx  
TIP  
V
Rx  
ref  
TDC/RDC/XTAL  
2.048 MHz DATA CLOCK  
LO2  
out  
CCI/XTAL  
in  
LI  
PD  
SDI1 UDLT-3  
MASTER  
MODE  
SDO1  
RE1/CLKOUT  
EN1-TE1 (I/O)  
EN2-TE2(I/O)/SIE  
SE/(Mu/A)  
SDI2  
SDO2  
SDCLK  
MASTER/SLAVE  
MOD SELECT  
FRAME 10/20  
RE2/BCLK  
LI SENS/2.048 MHz  
LB  
V
SS  
VD  
RING  
TO  
BACK-  
PLANE  
POWER  
SUPPLY  
TIMING  
AND  
CONTROL  
V
MSI/TONE  
Tx  
DD  
LO1  
TIP  
V
Rx  
ref  
TDC/RDC/XTAL  
LO2  
LI  
out  
CCI/XTAL  
in  
PD  
SDI1 UDLT-3  
MASTER  
MODE  
RE1/CLKOUT  
EN1-TE1 (I/O)  
SDI2  
SDO1  
EN2-TE2(I/O)/SIE  
SDO2  
SDCLK  
SE/(Mu/A)  
MASTER/SLAVE  
MOD SELECT  
FRAME 10/20  
RE2/BCLK  
LI SENS/2.048 MHz  
LB  
V
VD  
SS  
RING  
26  
TELECOMMUNICATIONS  
MC145423  
PACKAGE DIMENSIONS  
DW SUFFIX  
SOIC PACKAGE  
CASE 751F-05  
D
NOTES:  
A
1. DIMENSIONS ARE IN MILLIMETERS.  
2. INTERPRET DIMENSIONS AND TOLERANCES PER  
ASME Y14.5M, 1994.  
28  
15  
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
PROTRUSIONS.  
4. MAXIMUM MOLD PROTRUSION 0.015 PER SIDE.  
5. DIMENSION B DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION  
SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
1
14  
MILLIMETERS  
B
PIN 1 IDENT  
DIM MIN  
MAX  
2.65  
0.29  
0.49  
0.32  
A
A1  
B
C
D
E
e
H
L
2.35  
0.13  
0.35  
0.23  
17.80 18.05  
7.40 7.60  
1.27 BSC  
10.05 10.55  
L
0.10  
e
0.41  
0.90  
C
θ
0
8
°
°
SEATING  
B
C
θ
PLANE  
M
S
S
B
0.025  
C A  
TELECOMMUNICATIONS  
27  
MC145423  
DT SUFFIX  
TSSOP PACKAGE  
CASE 1168-01  
B
D
A
A
b1  
C
28  
15  
c
c1  
E/2  
E
(b)  
E1  
SECTION A-A  
1
14  
0.2  
A
B
C
NOTES:  
PIN 1  
INDEX  
1. DIMENSIONS AND TOLERANCING PER ASME  
Y14.5M, 1994.  
2. DIMENSIONS IN MILLIMETERS.  
2X e/2  
END  
VIEW  
2X 14 TIPS  
26X  
e
VIEW A  
TOP VIEW  
3. DIMENSION D DOES NOT INCLUDE MOLD  
PROTRUSION. ALLOWABLE MOLD PROTRUSION IS  
0.15 PER SIDE.  
4. DIMENSION E1 DOES NOT INCLUDE INTERLEAD  
FLASH OR MOLD PROTRUSION. INTERLEAD FLASH  
OR PROTRUSION SHALL NOT EXCEED 0.25 PER  
SIDE.  
0.05  
5. DIMENSION b DOES NOT INCLUDE DAMBAR  
PROTRUSIONS. DAMBAR PROTRUSION SHALL NOT  
CAUSE THE LEAD WIDTH TO EXCEED 0.38.  
(D)  
28X  
0.2  
A
MILLIMETERS  
SEATING PLANE  
DIM MIN  
MAX  
1.20  
0.15  
1.05  
0.30  
0.25  
0.20  
0.16  
9.80  
A
A1  
A2  
b
b1  
c
---  
0.05  
0.80  
0.19  
0.19  
0.09  
0.09  
9.60  
A
28X  
b
A
(θ 1°)  
M
0.1  
A
B C  
GAGE  
PLANE  
SIDE VIEW  
A1 A2  
c1  
D
e
E
0.65 BSC  
6.40 BSC  
0.25  
E1  
L
4.30  
0.50  
4.50  
0.70  
θ°  
L
θ
θ 1  
0
8
°
°
VIEW A  
14 REF  
°
28  
TELECOMMUNICATIONS  
MC145423  
Digital DNA is a trademark of Motorola, Inc.  
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or  
guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the  
application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or  
incidental damages. “Typical” parameters can and do vary in different applications and actual performance may vary over time. All operating  
parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Motorola does not  
convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as  
components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other  
application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer  
purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its  
officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable  
attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use,  
even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and  
trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.  
are registered  
How to reach us:  
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution: P.O. Box 5405, Denver, Colorado 80217.  
1-303-675-2140 or 1-800-441-2447  
JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3-20-1 Minami-Azabu. Minato-ku, Tokyo 106-8573 Japan.  
81-3-3440-3569  
ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tao Po, N.T.,  
Hong Kong. 852-26668334  
TECHNICAL INFORMATION CENTER: 1-800-521-6274  
HOME PAGE: http://motorola.com/semiconductors/  
MC145423/D  

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