MC56F84550VLFR_技术文档

Document Number: MC56F8455X

Rev. 3, 06/2014

Freescale Semiconductor

Data Sheet: Technical Data

MC56F8455X

MC56F8455X / MC56F8454X

Supports the 56F84553VLH,

56F84550VLF, 56F84543VLH,

56F84540VLF

Features

Analog

•

This family of digital signal controllers (DSCs) is

based on the 32-bit 56800EX core. Each device

combines, on a single chip, the processing power of a

DSP and the functionality of an MCU with a flexible

set of peripherals to support many target applications:

– Industrial control

– Two high-speed, 8-channel, 12-bit ADCs with

dynamic x2, x4 programmable amplifier

– One 20-channel, 16-bit ADC

– Up to four analog comparators with integrated 6-bit

DAC references

•

– One 12-bit DAC

– Home appliances

– Smart sensors

– Fire and security systems

– Switched-mode power supply and power

management

– Uninterruptible Power Supply (UPS)

– Solar and wind power generator

– Power metering

– Motor control (ACIM, BLDC, PMSM, SR, stepper)

– Handheld power tools

PWMs and timers

– One eFlexPWM module with up to 9 PWM outputs,

including 8 channels with high resolution NanoEdge

placement

– Two 16-bit quad timer (2 x 4 16-bit timers)

– Two Periodic Interval Timers (PITs)

– Two Programmable Delay Blocks (PDBs)

Communication interfaces

– Two high-speed queued SCI (QSCI) modules with

LIN slave functionality

– Two queued SPI (QSPI) modules

– Two SMBus-compatible I2C ports

– One flexible controller area network (FlexCAN)

module

– Circuit breaker

– Medical device/equipment

– Instrumentation

– Lighting

DSC based on 32-bit 56800EX core

– Up to 80 MIPS at 80 MHz core frequency

– DSP and MCU functionality in a unified, C-efficient

architecture

•

Security and integrity

•

– Cyclic Redundancy Check (CRC) generator

– Computer operating properly (COP) watchdog

– External Watchdog Monitor (EWM)

On-chip memory

– Up to 128 KB (96 KB + 32 KB) flash memory,

including up to 32 KB FlexNVM

Clocks

– Two on-chip relaxation oscillators: 8 MHz (400 kHz

at standby mode) and 32 kHz

– Crystal / resonator oscillator

– Up to 16 KB RAM

– Up to 2 KB FlexRAM with EEE capability

– 80 MHz program execution from both internal flash

memory and RAM

– On-chip flash memory and RAM can be mapped

into both program and data memory spaces

System

– DMA controller

– Integrated power-on reset (POR) and low-voltage

interrupt (LVI) and brown-out reset module

– Inter-module crossbar connection

– JTAG/enhanced on-chip emulation (EOnCE) for

unobtrusive, real-time debugging

Freescale reserves the right to change the detail specifications as may be

required to permit improvements in the design of its products.

Operating characteristics

– Single supply: 3.0 V to 3.6 V

– 5 V–tolerant I/O (except RESETB pin)

•

LQFP packages:

– 48-pin

– 64-pin

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

2

Freescale Semiconductor, Inc.

Table of Contents

1

Overview.................................................................................4

7

Ratings....................................................................................33

1.1 MC56F844xx/5xx/7xx product family............................4

1.2 56800EX 32-bit Digital Signal Controller (DSC) core....5

1.3 Operation parameters...................................................6

1.4 On-chip memory and memory protection......................6

1.5 Interrupt Controller........................................................7

1.6 Peripheral highlights......................................................7

1.7 Block diagrams..............................................................13

MC56F8455x signal and pin descriptions...............................16

Signal groups..........................................................................26

Ordering parts.........................................................................27

4.1 Determining valid orderable parts.................................27

Part identification.....................................................................27

5.1 Description....................................................................27

5.2 Format...........................................................................27

5.3 Fields.............................................................................28

5.4 Example........................................................................28

Terminology and guidelines....................................................28

6.1 Definition: Operating requirement.................................28

6.2 Definition: Operating behavior.......................................29

6.3 Definition: Attribute........................................................29

6.4 Definition: Rating...........................................................30

6.5 Result of exceeding a rating..........................................30

6.6 Relationship between ratings and operating

7.1 Thermal handling ratings...............................................33

7.2 Moisture handling ratings..............................................33

7.3 ESD handling ratings.....................................................33

7.4 Voltage and current operating ratings...........................34

General...................................................................................35

8.1 General characteristics..................................................35

8.2 AC electrical characteristics..........................................35

8.3 Nonswitching electrical specifications...........................36

8.4 Switching specifications................................................42

8.5 Thermal specifications...................................................43

Peripheral operating requirements and behaviors..................44

9.1 Core modules................................................................44

9.2 System modules............................................................46

9.3 Clock modules...............................................................46

9.4 Memories and memory interfaces.................................49

9.5 Analog...........................................................................52

9.6 PWMs and timers..........................................................61

9.7 Communication interfaces.............................................62

8

2

3

4

9

5

6

10 Design Considerations............................................................68

10.1 Thermal design considerations.....................................68

10.2 Electrical design considerations....................................70

11 Obtaining package dimensions...............................................71

12 Pinout......................................................................................72

12.1 Signal Multiplexing and Pin Assignments......................72

12.2 Pinout diagrams............................................................74

13 Product documentation...........................................................77

14 Revision history.......................................................................77

requirements.................................................................30

6.7 Guidelines for ratings and operating requirements.......31

6.8 Definition: Typical value................................................31

6.9 Typical value conditions................................................32

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

3

Overview

1 Overview

1.1 MC56F844xx/5xx/7xx product family

The following table lists major features, including features that differ among members of

the family. Features not listed are shared by all members of the family.

Table 1. 56F844xx/5xx/7xx family

Part

MC56F84

Number

789 786 769 766 763 553 550 543 540 587 585 567 565 462 452 451 442 441

Core freq. 100 100 100 100 100 80

(MHz)

80

60

Flash

memory

(KB)

256 256 128 128 128 96

96

64

64 256 256 128 128 128 96

96

64

FlevNVM/ 32/2 32/2 32/2 32/2 32/2 32/2 32/2 32/2 32/2 32/2 32/2 32/2 32/2 32/2 32/2 32/2 32/2 32/2

FlexRAM

(KB)

Total flash 288 288 160 160 160 128 128 96

96 288 288 160 160 160 128 128 96

96

memory

(KB)¹

RAM (KB) 32

32

24

16

8

32

24

16

8

Memory

resource

protection

Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes

External

1

Watchdog

12-bit

2x8 2x8 2x8 2x8 2x8 2x8 2x5 2x8 2x5 2x8 2x8 2x8 2x8 2x8 2x8 2x5 2x8 2x5

Cyclic ADC

Channels

(ADCA and

ADCB)

12-bit

300 300 300 300 300 300 300 300 300 600 600 600 600 600 600 600 600 600

Cyclic ADC ns

Conversion

time

ns

(ADCA and

ADCB)

16-bit SAR 16

ADC (with

Temperatu

re Sensor)

channels

10

16

10

8

̶

8

̶

16

10

16

10

̶

8

̶

8

̶

(ADCC)

PWMA

High-res

channels

8

6

8

6

0

Table continues on the next page...

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

4

Freescale Semiconductor, Inc.

Overview

Table 1. 56F844xx/5xx/7xx family (continued)

Part

MC56F84

Number

789 786 769 766 763 553 550 543 540 587 585 567 565 462 452 451 442 441

PWMA Std

channels

4

1

4

1

0

1

0

12

9

6

9

6

PWMA

Input

12

9

12

9

6

9

6

12

9

6

9

6

capture

channels

PWMB Std 12

channels

9 ²

7

12

9 ²

7

̶

12

9 ²

7

12

9 ²

7

̶

PWMB

Input

12

capture

channels

12-bit DAC

1

̶

1

̶

Quad

1

Decoder

DMA

CMP

Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes

4

3

2

1

4

3

2

1

4

3

2

1

4

3

2

1

4

2

4

2

3

2

4

2

3

2

1

2

1

4

3

2

1

4

3

2

1

4

3

2

1

4

3

2

1

4

2

4

2

3

2

4

2

3

2

QSCI

QSPI

1

I2C/SMBus

FlexCAN

2

1

0

LQFP

100 80 100 80

64

48

64

48 100 80 100 80

64

48

64

48

package

pin count

1. This total includes FlexNVM and assumes no FlexNVM is used with FlexRAM for EEPROM.

2. The outputs of PWMB_3A and PWM_3B are available through the on-chip inter-module crossbar.

1.2 56800EX 32-bit Digital Signal Controller (DSC) core

• Efficient 32-bit 56800EX Digital Signal Processor (DSP) engine with modified dual

Harvard architecture:

• Three internal address buses

• Four internal data buses: two 32-bit primary buses, one 16-bit secondary data

bus, and one 16-bit instruction bus

• 32-bit data accesses

• Supports concurrent instruction fetches in the same cycle, and dual data accesses

in the same cycle

• 20 addressing modes

• As many as 80 million instructions per second (MIPS) at 80 MHz core frequency

• 162 basic instructions

• Instruction set supports both fractional arithmetic and integer arithmetic

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

5

Overview

• 32-bit internal primary data buses support 8-bit, 16-bit, and 32-bit data movement,

plus addition, subtraction, and logical operations

• Single-cycle 16 × 16-bit -> 32-bit and 32 x 32-bit -> 64-bit multiplier-accumulator

(MAC) with dual parallel moves

• 32-bit arithmetic and logic multi-bit shifter

• Four 36-bit accumulators, including extension bits

• Parallel instruction set with unique DSP addressing modes

• Hardware DO and REP loops

• Bit reverse address mode, which effectively supports DSP and Fast Fourier

Transform algorithms

• Full shadowing of the register stack for zero-overhead context saves and restores:

nine shadow registers correspond to nine address registers (R0, R1, R2, R3, R4, R5,

N, N3, M01)

• Instruction set supports both DSP and controller functions

• Controller-style addressing modes and instructions enable compact code

• Enhanced bit manipulation instruction set

• Efficient C compiler and local variable support

• Software subroutine and interrupt stack, with the stack's depth limited only by

memory

• Priority level setting for interrupt levels

• JTAG/Enhanced On-Chip Emulation (OnCE) for unobtrusive, real-time debugging

that is independent of processor speed

1.3 Operation parameters

• Up to 80 MHz operation at -40 °C to 105 °C ambient temperature

• Single 3.3 V power supply

• Supply range: V_DD- V_SS= 2.7 V to 3.6 V, V_DDA- V_SSA= 2.7 V to 3.6 V

1.4 On-chip memory and memory protection

• Modified dual Harvard architecture permits as many as three simultaneous accesses

to program and data memory

• Internal flash memory with security and protection to prevent unauthorized access

• Memory resource protection (MRP) unit to protect supervisor programs and

resources from user programs

• Programming code can reside in flash memory during flash programming

• The dual-ported RAM controller supports concurrent instruction fetches and data

accesses, or dual data accesses, by the DSC core.

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

6

Freescale Semiconductor, Inc.

Peripheral highlights

• Concurrent accesses provide increased performance.

• The data and instruction arrive at the core in the same cycle, reducing latency.

• On-chip memory

• Up to 144 KW program/data flash memory, including FlexNVM

• Up to 16 KW dual port data/program RAM

• Up to 16 KW FlexNVM, which can be used as additional program or data flash

memory

• Up to 1 KW FlexRAM, which can be configured as enhanced EEPROM (used in

conjunction with FlexNVM) or used as additional RAM

1.5 Interrupt Controller

• Five interrupt priority levels

• Three user-programmable priority levels for each interrupt source: level 0, level

1, level 2

• Unmaskable level 3 interrupts include illegal instruction, hardware stack

overflow, misaligned data access, SWI3 instruction

• Interrupt level 3 is highest priority and non-maskable. Its sources include:

• Illegal instructions

• Hardware stack overflow

• SWI instruction

• EOnce interrupts

• Misaligned data accesses

• Lowest-priority software interrupt: level LP

• Support for nested interrupts, so that a higher priority level interrupt request can

interrupt lower priority interrupt subroutine

• Masking of interrupt priority level is managed by the 56800EX core

• Two programmable fast interrupts that can be assigned to any interrupt source

• Notification to System Integration Module (SIM) to restart clock when in wait and

stop states

• Ability to relocate interrupt vector table

1.6 Peripheral highlights

1.6.1 Enhanced Flex Pulse Width Modulator (eFlexPWM)

• One PWM module contains 4 identical submodules, with up to 3 outputs per

submodule, and up to 80 MHz PWM operating clock

• 16 bits of resolution for center, edge-aligned, and asymmetrical PWMs

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

7

Peripheral highlights

• PWMA with NanoEdge high resolution

• Fractional delay for enhanced resolution of the PWM period and edge placement

• Arbitrary PWM edge placement

• 390 ps PWM frequency and duty-cycle resolution when NanoEdge functionality

is enabled.

• Fractional clock digital dithering: 5-bit digital fractional clock accumulation for

enhanced resolution of PWM period and edge placement, which is effectively

equivalent to 390 ps resolution in the overall accumulative period.

• PWM outputs can be configured as complementary output pairs or independent

outputs

• Dedicated time-base counter with period and frequency control per submodule

• Independent top and bottom deadtime insertion for each complementary pair

• Independent control of both edges of each PWM output

• Enhanced input capture and output compare functionality on each input:

• Channels not used for PWM generation can be used for buffered output compare

functions.

• Channels not used for PWM generation can be used for input capture functions.

• Enhanced dual edge capture functionality

• Synchronization of submodule to external hardware (or other PWM) is supported.

• Double-buffered PWM registers

• Integral reload rates from 1 to 16

• Half-cycle reload capability

• Multiple output trigger events can be generated per PWM cycle via hardware.

• Support for double-switching PWM outputs

• Up to eight fault inputs can be assigned to control multiple PWM outputs

• Programmable filters for fault inputs

• Independently programmable PWM output polarity

• Individual software control of each PWM output

• All outputs can be programmed to change simultaneously via a FORCE_OUT event.

• PWMX pin can optionally output a third PWM signal from each submodule

• Option to supply the source for each complementary PWM signal pair from any of

the following:

• Crossbar module outputs

• External ADC input, taking into account values set in ADC high and low limit

registers

1.6.2 12-bit Analog-to-Digital Converter (Cyclic type)

• Two independent 12-bit analog-to-digital converters (ADCs):

• 2 x 8-channel external inputs

• Built-in x1, x2, x4 programmable gain pre-amplifier

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

8

Freescale Semiconductor, Inc.

Peripheral highlights

• Maximum ADC clock frequency up to 20 MHz, having period as low as a 50-ns

• Single conversion time of 8.5 ADC clock cycles

• Additional conversion time of 6 ADC clock cycles

• Support of analog inputs for single-ended and differential conversions

• Sequential, parallel, and independent scan mode

• First 8 samples have offset, limit and zero-crossing calculation supported

• ADC conversions can be synchronized by any module connected to the internal

crossbar module, such as PWM, timer, GPIO, and comparator modules.

• Support for simultaneous triggering and software-triggering conversions

• Support for a multi-triggering mode with a programmable number of conversions on

each trigger

• Each ADC has ability to scan and store up to 8 conversion results.

• Current injection protection

1.6.3 Inter-Module Crossbar and AND-OR-INVERT logic

• Provides generalized connections between and among on-chip peripherals: ADCs,

12-bit DAC, comparators, quad-timers, eFlexPWMs, PDBs, EWM, and select I/O

pins

• User-defined input/output pins for all modules connected to the crossbar

• DMA request and interrupt generation from the crossbar

• Write-once protection for all registers

• AND-OR-INVERT function provides a universal Boolean function generator that

uses a four-term sum-of-products expression, with each product term containing true

or complement values of the four selected inputs (A, B, C, D).

1.6.4 Comparator

• Full rail-to-rail comparison range

• Support for high and low speed modes

• Selectable input source includes external pins and internal DACs

• Programmable output polarity

• 6-bit programmable DAC as a voltage reference per comparator

• Three programmable hysteresis levels

• Selectable interrupt on rising-edge, falling-edge, or toggle of a comparator output

1.6.5 12-bit Digital-to-Analog Converter

• 12-bit resolution

• Powerdown mode

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

9

Peripheral highlights

• Automatic mode allows the DAC to automatically generate pre-programmed output

waveforms, including square, triangle, and sawtooth waveforms (for applications like

slope compensation)

• Programmable period, update rate, and range

• Output can be routed to an internal comparator, ADC, or optionally to an off-chip

destination

1.6.6 Quad Timer

• Four 16-bit up/down counters, with a programmable prescaler for each counter

• Operation modes: edge count, gated count, signed count, capture, compare, PWM,

signal shot, single pulse, pulse string, cascaded, quadrature decode

• Programmable input filter

• Counting start can be synchronized across counters

1.6.7 Queued Serial Communications Interface (QSCI) modules

• Operating clock can be up to two times the CPU operating frequency

• Four-word-deep FIFOs available on both transmit and receive buffers

• Standard mark/space non-return-to-zero (NRZ) format

• 13-bit integer and 3-bit fractional baud rate selection

• Full-duplex or single-wire operation

• Programmable 8-bit or 9-bit data format

• Error detection capability

• Two receiver wakeup methods:

• Idle line

• Address mark

• 1/16 bit-time noise detection

1.6.8 Queued Serial Peripheral Interface (QSPI) modules

• Maximum 25 Mbit/s baud rate

• Selectable baud rate clock sources for low baud rate communication

• Baud rate as low as Baudrate_Freq_in / 8192

• Full-duplex operation

• Master and slave modes

• Double-buffered operation with separate transmit and receive registers

• Four-word-deep FIFOs available on transmit and receive buffers

• Programmable length transmissions (2 bits to 16 bits)

• Programmable transmit and receive shift order (MSB as first bit transmitted)

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

10

Freescale Semiconductor, Inc.

Peripheral highlights

1.6.9 Inter-Integrated Circuit (I2C)/System Management Bus (SMBus)

modules

• Compatible with I2C bus standard

• Support for System Management Bus (SMBus) specification, version 2

• Multi-master operation

• General call recognition

• 10-bit address extension

• Start/Repeat and Stop indication flags

• Support for dual slave addresses or configuration of a range of slave addresses

• Programmable glitch input filter

1.6.10 Flex Controller Area Network (FlexCAN) module

• Clock source from PLL or XOSC/CLKIN

• Implementation of CAN protocol Version 2.0 A/B

• Standard and extended data frames

• Data length of 0 to 8 bytes

• Programmable bit rate up to 1 Mbps

• Support for remote frames

• Sixteen Message Buffers: each Message Buffer can be configured as receive or

transmit, and supports standard and extended messages

• Individual Rx Mask Registers per Message Buffer

• Internal timer for time-stamping of received and transmitted messages

• Listen-only mode capability

• Programmable loopback mode, supporting self-test operation

• Programmable transmission priority scheme: lowest ID, lowest buffer number, or

highest priority

• Global network time, synchronized by a specific message

• Low power modes, with programmable wakeup on bus activity

1.6.11 Computer Operating Properly (COP) watchdog

• Programmable timeout period

• Support for operation in all power modes: run mode, wait mode, stop mode

• Causes loss of reference reset 128 cycles after loss of reference clock to the PLL is

detected

• Selectable reference clock source in support of EN60730 and IEC61508

• Selectable clock sources:

• External crystal oscillator/external clock source

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

11

Clock sources

• On-chip low-power 32 kHz oscillator

• System bus (IPBus up to 80 MHz)

• 8 MHz / 400 kHz ROSC

• Support for interrupt triggered when the counter reaches the timeout value

1.6.12 Power supervisor

• Power-on reset (POR) to reset CPU, peripherals, and JTAG/EOnCE controllers (V_DD

> 2.1 V)

• Brownout reset (V_DD< 1.9 V)

• Critical warn low-voltage interrupt (LVI2.0)

• Peripheral low-voltage interrupt (LVI2.7)

1.6.13 Phase-locked loop

• Wide programmable output frequency: 240 MHz to 400 MHz

• Input reference clock frequency: 8 MHz to 16 MHz

• Detection of loss of lock and loss of reference clock

• Ability to power down

1.6.14 Clock sources

1.6.14.1 On-chip oscillators

• Tunable 8 MHz relaxation oscillator with 400 kHz at standby mode (divide-by-two

output)

• 32 kHz low frequency clock as secondary clock source for COP, EWM, PIT

1.6.14.2 Crystal oscillator

• Support for both high ESR crystal oscillator (ESR greater than 100 Ω) and ceramic

resonator

• Operating frequency: 4–16 MHz

1.6.15 Cyclic Redundancy Check (CRC) generator

• Hardware 16/32-bit CRC generator

• High-speed hardware CRC calculation

• Programmable initial seed value

• Programmable 16/32-bit polynomial

• Error detection for all single, double, odd, and most multi-bit errors

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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Freescale Semiconductor, Inc.

Clock sources

• Option to transpose input data or output data (CRC result) bitwise or bytewise,¹

which is required for certain CRC standards

• Option for inversion of final CRC result

1.6.16 General Purpose I/O (GPIO)

• 5 V tolerance (except RESETB pin)

• Individual control of peripheral mode or GPIO mode for each pin

• Programmable push-pull or open drain output

• Configurable pullup or pulldown on all input pins

• All pins (except JTAG and RESETB) default to be GPIO inputs

• 2 mA / 9 mA source/sink capability

• Controllable output slew rate

1.7 Block diagrams

The 56800EX core is based on a modified dual Harvard-style architecture, consisting of

three execution units operating in parallel, and allowing as many as six operations per

instruction cycle. The MCU-style programming model and optimized instruction set

enable straightforward generation of efficient and compact code for the DSP and control

functions. The instruction set is also efficient for C compilers, to enable rapid

development of optimized control applications.

The device's basic architecture appears in Figure 1 and Figure 2. Figure 1 shows how the

56800EX system buses communicate with internal memories, and the IPBus interface

and the internal connections among the units of the 56800EX core. Figure 2 shows the

peripherals and control blocks connected to the IPBus bridge. See the specific device’s

Reference Manual for details.

1. A bytewise transposition is not possible when accessing the CRC data register via 8-bit accesses. In this case, user

software must perform the bytewise transposition.

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

13

Clock sources

DSP56800EX Core

Program Control Unit

ALU1

ALU2

Address

Generation

Unit

PC

LA

LA2

HWS0

HWS1

FIRA

Instruction

Decoder

R0

R1

(AGU)

R2

Interrupt

Unit

Program

Memory

M01

N3

R3

OMR

R4

SR

LC

LC2

R5

Looping

Unit

N

SP

FISR

XAB1

XAB2

PAB

Data/

Program

RAM

PDB

CDBW

CDBR

XDB2

A2

B2

C2

D2

A1

B1

C1

D1

Y1

Y0

X0

A0

B0

C0

D0

Bit-

Manipulation

Unit

IPBus

Interface

Data

Y

Enhanced

OnCE™

Arithmetic

Logic Unit

(ALU)

JTAG TAP

MAC and ALU Multi-Bit Shifter

Figure 1. 56800EX basic block diagram

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

14

Freescale Semiconductor, Inc.

Clock sources

JTAG

Program Bus

Core Data Bus

EOnCE

Program/Data Flash

56800EX CPU

Up to 96KB

Program

Controller

(PC)

Address

Generation

Unit (AGU)

Data Flash

32KB

FlexRAM

4

Secondary Data Bus

Arithmetic

Logic Unit

(ALU)

Bit

Manipulation

Unit

2KB

Data/Program RAM

Up to 16KB

DMA Controller

Interrupt Controller

Crystal OSC

Power Management

Controller (PMC)

Internal 8 MHz

Watchdog (COP)

Internal 32 kHz

PLL

System Integration

Module (SIM)

Periodic Interrupt

Timer (PIT) 0, 1

CRC

Peripheral Bus

QSCI

0, 1

Quad Timer eFlexPWM A

I2C

0, 1

QSPI

0

FlexCAN

A & B

NanoEdge

Inter Module CIrnotsesrbMarodInupleutcsonnection

Inter Module Crossbar Outputs

Inter-Module

Crossbar B

AND-OR-INV

Logic

GPIO & Peripheral MUX

Inter-Module

Crossbar A

Inter Module Crossbar Outputs

Inter Module Crossbar Inputs

Package

Pins

ADC C

16-bit

Comparators With

6-bit DAC A,B,C,D

ADC B

12-bit

DAC

12-bit

ADC A

12-bit

PDB

0, 1

EWM

Peripheral Bus

Figure 2. System diagram

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

15

MC56F8455x signal and pin descriptions

2 MC56F8455x signal and pin descriptions

After reset, each pin is configured for its primary function (listed first). Any alternative

functionality, shown in parentheses, must be programmed through the GPIO module

peripheral enable registers (GPIO_x_PER) and the SIM module GPIO peripheral select

(GPSx) registers. All GPIO ports can be individually programmed as an input or output

(using bit manipulation).

• There are 2 PWM modules: PWMA, PWMB. Each PWM module has 4 submodules:

PWMA has PWMA_0, PWMA_1, PWMA_2, PWMA_3; PWMB has PWMB_0,

PWMB_1, PWMB_2, PWMB_3. Each PWM module's submodules have 3 pins (A,

B, X) each, with the syntax for the pins being PWMA_0A, PWMA_0B, PWMA_0X,

and PWMA_1A, PWMA_1B, PWMA_1X, and so on. Each submodule pin can be

configured as a PWM output or as a capture input.

• EWM_OUT_B is the output of the External Watchdog Module (EWM), and is active

low (denoted by the "_B" part of the syntax).

For the MC56F8455X products, which use 48-pin LQFP and 64-pin LQFP packages:

Table 2. Signal descriptions

Signal Name

64

LQFP

48

LQFP

Type

State

During

Reset¹

Signal Description

V_DD

V_SS

V_DDA

29

-

Supply

I/O Power — Supplies 3.3 V power to the chip I/

O interface.

44

60

30

43

61

22

32

44

22

31

45

15

Supply

I/O Ground — Provide ground for the device I/O

interface.

Supply

Analog Power — Supplies 3.3 V power to the

analog modules. It must be connected to a clean

analog power supply.

V_SSA

23

16

Analog Ground — Supplies an analog ground to

the analog modules. It must be connected to a

clean power supply.

V_CAP

26

57

19

43

On-chip

regulator

output

On-chip

regulator

output

Connect a 2.2uF or greater bypass capacitor

between this pin and V_SSto stabilize the core

voltage regulator output required for proper

device operation. V<sub>CAP</sub> is used to

observe core voltage.

voltage

Table continues on the next page...

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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Freescale Semiconductor, Inc.

MC56F8455x signal and pin descriptions

Table 2. Signal descriptions (continued)

Signal Name

64

LQFP

48

LQFP

Type

State

During

Reset¹

Signal Description

TDI

64

48

Input

Input,

internal

pullup

Test Data Input — Provides a serial input data

stream to the JTAG/EOnCE port. It is sampled

on the rising edge of TCK and has an internal

pullup resistor. After reset, the default state is

TDI.

enabled

(GPIOD0)

Input/Output Input,

internal

GPIO Port D0

pullup

enabled

TDO

62

46

Output

Test Data Output — This tri-stateable pin

provides a serial output data stream from the

JTAG/EOnCE port. It is driven in the shift-IR and

shift-DR controller states, and it changes on the

falling edge of TCK. After reset, the default state

is TDO.

(GPIOD1)

Input/Output Input,

internal

GPIO Port D1

pullup

enabled

TCK

1

Input

Input,

internal

pullup

Test Clock Input — This input pin provides a

gated clock to synchronize the test logic and

shift serial data to the JTAG/EOnCE port. The

pin is connected internally to a pullup resistor. A

Schmitt-trigger input is used for noise immunity.

After reset, the default state is TCK.

enabled

(GPIOD2)

Input/Output Input,

internal

GPIO Port D2

pullup

enabled

TMS

63

47

Input

Input,

internal

pullup

Test Mode Select Input — Used to sequence

the JTAG TAP controller state machine. It is

sampled on the rising edge of TCK and has an

internal pullup resistor. After reset, the default

state is TMS.

enabled

NOTE: Always tie the TMS pin to V_DDthrough

a 2.2K resistor, if needed to keep an

on-board debug capability. Otherwise,

tie the TMS pin directly to V_DD

.

(GPIOD3)

Input/Output Input,

internal

GPIO Port D2

pullup

enabled

Table continues on the next page...

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

17

MC56F8455x signal and pin descriptions

Table 2. Signal descriptions (continued)

Signal Name

64

LQFP

48

LQFP

Type

State

During

Reset¹

Signal Description

RESET or RESETB

2

Input

Input,

internal

pullup

Reset — A direct hardware reset on the

processor. When RESET is asserted low, the

device is initialized and placed in the reset state.

A Schmitt-trigger input is used for noise

enabled

(This pin is immunity. The internal reset signal is deasserted

3.3V only.)

synchronously with the internal clocks after a

fixed number of internal clocks. After reset, the

default state is RESET. To filter noise on the

RESETB pin, install a capacitor (up to 0.1 uF)

on it.

(GPIOD4)

Input/ Open- Input,

drain Output internal

pullup

GPIO Port D4 RESET functionality is disabled in

this mode and the device can be reset only

through Power-On Reset (POR), COP reset, or

software reset.

enabled

GPIOA0

13

9

Input/Output Input

GPIO Port A0: After reset, the default state is

GPIOA0.

(ANA0&CMPA_IN3)

Input

ANA0 is input to channel 0 of ADCA; CMPA_IN3

is input 3 of analog comparator A. When used

as an analog input, the signal goes to both

places (ANA0 and CMPA_IN3), but the glitch on

this pin during ADC sampling may interfere with

other analog inputs shared on this pin.

(CMPC_O)

Output

Analog comparator C output

GPIOA1

14

10

Input/Output Input

GPIO Port A1: After reset, the default state is

GPIOA1.

(ANA1&CMPA_IN0)

Input

ANA1 is input to channel 1 of ADCA; CMPA_IN0

is input 0 of analog comparator A. When used

as an analog input, the signal goes to both

places (ANA1 and CMPA_IN0), but the glitch on

this pin during ADC sampling may interfere with

other analog inputs shared on this pin.

GPIOA2

15

11

Input/Output Input

Input

GPIO Port A2: After reset, the default state is

GPIOA2.

(ANA2&VREFHA&

CMPA_IN1)

ANA2 is input to channel 2 of ADCA; VREFHA

is the reference high of ADCA; CMPA_IN1 is

input 1 of analog comparator A. When used as

an analog input, the signal goes to both places

(ANA2 and CMPA_IN1), but the glitch on this

pin during ADC sampling may interfere with

other analog inputs shared on this pin. This

input can be configured as either ANA2 or

VREFHA using the ADCA control register.

Table continues on the next page...

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

18

Freescale Semiconductor, Inc.

MC56F8455x signal and pin descriptions

Table 2. Signal descriptions (continued)

Signal Name

64

LQFP

48

LQFP

Type

State

During

Reset¹

Signal Description

GPIOA3

16

12

Input/Output Input

GPIO Port A3: After reset, the default state is

GPIOA3.

(ANA3&VREFLA&

CMPA_IN2)

Input

ANA3 is input to channel 3 of ADCA; VREFLA is

the reference low of ADCA; CMPA_IN2 is input

2 of analog comparator A. When used as an

analog input, the signal goes to both places

(ANA3 and CMPA_IN2), but the glitch on this

pin during ADC sampling may interfere with

other analog inputs shared on this pin. This

input can be configured as either ANA3 or

VREFLA using the ADCA control register.

GPIOA4

12

8

Input/Output Input

Input

GPIO Port A4: After reset, the default state is

GPIOA4.

(ANA4&ANC8&CMPD_IN0

)

ANA4 is input to channel 4 of ADCA; ANC8 is

input to channel 8 of ADCC; CMPD_IN0 is input

0 to comparator D. When used as an analog

input, the signal goes to all three places (ANA4

and ANC8 and CMPA_IN0), but the glitchon this

pin during ADC sampling may interfere with

other analog inputs shared on this pin.

GPIOA5

11

10

9

-

Input/Output Input

Input

GPIO Port A5: After reset, the default state is

GPIOA5.

(ANA5&ANC9)

ANA5 is input to channel 5 of ADCA; ANC9 is

input to channel 9 of ADCC. When used as an

analog input, the signal goes to both places

(ANA5 and ANC9), but the glitch on this pin

during ADC sampling may interfere with other

analog inputs shared on this pin.

GPIOA6

Input/ Output Input

Input

GPIO Port A6: After reset, the default state is

GPIOA6.

(ANA6&ANC10)

ANA6 is input to channel 5 of ADCA; ANC10 is

input to channel 10 of ADCC. When used as an

analog input, the signal goes to both places

(ANA6 and ANC10), but the glitch on this pin

during ADC sampling may interfere with other

analog inputs shared on this pin.

GPIOA7

Input/Output Input

Input

GPIO Port A7: After reset, the default state is

GPIOA7.

(ANA7&ANC11)

ANA7 is input to channel 7 of ADCA; ANC11 is

input to channel 11 of ADCC. When used as an

analog input, the signal goes to both places

(ANA7 and ANC11), but the glitch on this pin

during ADC sampling may interfere with other

analog inputs shared on this pin.

Table continues on the next page...

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

19

MC56F8455x signal and pin descriptions

Table 2. Signal descriptions (continued)

Signal Name

64

LQFP

48

LQFP

Type

State

During

Reset¹

Signal Description

GPIOB0

24

17

Input/Output Input

GPIO Port B0: After reset, the default state is

GPIOB0.

(ANB0&CMPB_IN3)

Input

ANB0 is input to channel 0 of ADCB; CMPB_IN3

is input 3 of analog comparator B. When used

as an analog input, the signal goes to both

places (ANB0 and CMPB_IN3), but the glitch on

this pin during ADC sampling may interfere with

other analog inputs shared on this pin.

GPIOB1

25

18

Input/ Output Input

Input

GPIO Port B1: After reset, the default state is

GPIOB1.

(ANB1&CMPB_IN0)

ANB1 is input to channel 1 of ADCB; CMPB_IN0

is input 0 of analog comparator B. When used

as an analog input, the signal goes to both

places (ANB1 and CMPB_IN0), but the glitch on

this pin during ADC sampling may interfere with

other analog inputs shared on this pin.

GPIOB2

27

20

Input/ Output Input

Input

GPIO Port B2: After reset, the default state is

GPIOB2.

(ANB2&VREFHB&CMPC_

IN3)

ANB2 is input to channel 2 of ADCB; VREFHB

is the reference high of ADCB; CMPC_IN3 is

input 3 of analog comparator C. When used as

an analog input, the signal goes to both places

(ANB2 and CMPC_IN3), but the glitch during

ADC sampling on this pin may interfere with

other analog inputs shared on this pin. This

input can be configured as either ANB2 or

VREFHB using the ADCB control register.

GPIOB3

28

21

Input/ Output Input

Input

GPIO Port B3: After reset, the default state is

GPIOB3.

(ANB3&VREFLB&CMPC_I

N0)

ANB3 is input to channel 3 of ADCB; VREFLB is

the reference low of ADCB; CMPC_IN0 is input

0 of analog comparator C. When used as an

analog input, the signal goes to both places

(ANB3 and CMPC_IN0), but the glitch during

ADC sampling on this pin may interfere with

other analog inputs shared on this pin. This

input can be configured as either ANB3 or

VREFLB using the ADCB control register.

GPIOB4

21

14

Input/ Output Input

Input

GPIO Port B4: After reset, the default state is

GPIOB4.

(ANB4&ANC12&CMPC_IN

1)

ANB4 is input to channel 4 of ADCB; ANC12 is

input to channel 12 of ADCC; CMPC_IN1 is

input 1 of analog comparator C. When used as

an analog input, the signal goes to all three

places (ANB4 and ANC12 and CMPC_IN1), but

the glitch during ADC sampling on this pin may

interfere with other analog inputs shared on this

pin.

Table continues on the next page...

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

20

Freescale Semiconductor, Inc.

MC56F8455x signal and pin descriptions

Table 2. Signal descriptions (continued)

Signal Name

64

LQFP

48

LQFP

Type

State

During

Reset¹

Signal Description

GPIOB5

20

-

Input/ Output Input

GPIO Port B5: After reset, the default state is

GPIOB5.

(ANB5&ANC13&CMPC_IN

2)

Input

ANB5 is input to channel 5 of ADCB; ANC13 is

input to channel 13 of ADCC; CMPC_IN2 is

input 2 of analog comparator C. When used as

an analog input, the signal goes to all three

places (ANB5 and ANC13 and CMPC_IN2), but

the glitch during ADC sampling on this pin may

interfere with other analog inputs shared on this

pin.

GPIOB6

19

Input/ Output Input

Input

GPIO Port B6: After reset, the default state is

GPIOB6.

(ANB6&ANC14&CMPB_IN

1)

ANB6 is input to channel 6 of ADCB; ANC14 is

input to channel 14 of ADCC; CMPB_IN1 is

input 1 of analog comparator B. When used as

an analog input, the signal goes to all three

places (ANB6 and ANC14 and CMPB_IN1), but

the glitch during ADC sampling on this pin may

interfere with other analog inputs shared on this

pin.

GPIOB7

17

Input/ Output Input

Input

GPIO Port B7: After reset, the default state is

GPIOB7.

(ANB7&ANC15&CMPB_IN

2)

ANB7 is input to channel 7 of ADCB; ANC15 is

input to channel 15 of ADCC; CMPB_IN2 is

input 2 of analog comparator B. When used as

an analog input, the signal goes to all three

places (ANB7 and ANC15 and CMPB_IN2), but

the glitch during ADC sampling on this pin may

interfere with other analog inputs shared on this

pin.

GPIOC0

3

4

3

4

Input/Output Input

Analog Input

GPIO Port C0: After reset, the default state is

GPIOC0.

EXTAL

The external crystal oscillator input (EXTAL)

connects the internal crystal oscillator input to

an external crystal or ceramic resonator.

External clock input 0.²

CLKIN0

Input

GPIOC1

Input/Output Input

GPIO Port C1: After reset, the default state is

GPIOC1.

(XTAL)

Analog

Output

The external crystal oscillator output (XTAL)

connects the internal crystal oscillator output to

an external crystal or ceramic resonator.

Table continues on the next page...

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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21

MC56F8455x signal and pin descriptions

Table 2. Signal descriptions (continued)

Signal Name

64

LQFP

48

LQFP

Type

State

During

Reset¹

Signal Description

GPIOC2

5

Input/Output Input

GPIO Port C2: After reset, the default state is

GPIOC2.

(TXD0)

Output

SCI0 transmit data output or transmit/receive in

single-wire operation

(TB0)

Input/Output

Input

Quad timer module B channel 0 input/output

Crossbar module input 2

(XB_IN2)

(CLKO0)

Output

Buffered clock output 0: the clock source is

selected by clockout select (CLKOSEL) bits in

the clock output select register (CLKOUT) of the

SIM.

GPIOC3

7

8

6

7

Input/ Output Input

GPIO Port C3: After reset, the default state is

GPIOC3.

(TA0)

Input/ Output

Output

Quad timer module A channel 0 input/output

Analog comparator A output

SCI0 receive data input

(CMPA_O)

(RXD0)

Input

(CLKIN1)

GPIOC4

Input

External clock input 1

Input/ Output Input

GPIO Port C4: After reset, the default state is

GPIOC4.

(TA1)

Input/ Output

Output

Quad timer module A channel 1 input/output

Analog comparator B output

(CMPB_O)

(XB_IN8)

(EWM_OUT_B)

GPIOC5

Input

Crossbar module input 8

Output

External Watchdog Module output

18

31

13

23

Input/ Output Input

GPIO Port C5: After reset, the default state is

GPIOC5.

(DACO)

Analog

Output

12-bit digital-to-analog output

(XB_IN7)

Input

Crossbar module input 7

GPIOC6

Input/ Output Input,

GPIO Port C6: After reset, the default state is

GPIOC6.

(TA2)

Input/ Output

Input

Quad timer module A channel 2 input/output

Crossbar module input 3

(XB_IN3)

(CMP_REF)

Analog Input

Positive input 5 of analog comparator A and B

and C and D. Note: MC56F84550 and

MC56F84540 do not have CMPD.

GPIOC7

32

24

Input/ Output Input

Input/ Output

GPIO Port C7: After reset, the default state is

GPIOC7.

(SS0_B)

In slave mode, SS0_B indicates to the SPI

module 0 that the current transfer is to be

received.

(TXD0)

Output

SCI0 transmit data output or transmit/receive in

single-wire operation

Table continues on the next page...

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

22

Freescale Semiconductor, Inc.

MC56F8455x signal and pin descriptions

Table 2. Signal descriptions (continued)

Signal Name

64

LQFP

48

LQFP

Type

State

During

Reset¹

Signal Description

GPIOC8

33

25

Input/Output Input

GPIO Port C8: After reset, the default state is

GPIOC8.

(MISO0)

Input/Output

Master in/slave out for SPI0 —In master mode,

MISO0 pin is the data input. In slave mode,

MISO0 pin is the data output. The MISO line of

a slave device is placed in the high-impedance

state if the slave device is not selected.

(RXD0)

Input

SCI0 receive data input

Crossbar module input 9

(XB_IN9)

GPIOC9

Input

34

35

26

27

Input/ Output Input

GPIO Port C9: After reset, the default state is

GPIOC9.

(SCK0)

Input/ Output

SPI0 serial clock. In master mode, SCK0 pin is

an output, clocking slaved listeners. In slave

mode, SCK0 pin is the data clock input.

(XB_IN4)

Input

Crossbar module input 4

GPIOC10

Input/ Output Input

GPIO Port C10: After reset, the default state is

GPIOC10.

(MOSI0)

Input/ Output

Master out/slave in for SPI0 — In master mode,

MOSI0 pin is the data output. In slave mode,

MOSI0 pin is the data input.

(XB_IN5)

(MISO0)

Input

Crossbar module input 5

Input/ Output

Master in/slave out for SPI0 — In master mode,

MISO0 pin is the data input. In slave mode,

MISO0 pin is the data output. The MISO line of

a slave device is placed in the high-impedance

state if the slave device is not selected.

GPIOC11

(CANTX)

(SCL1)

37

29

Input/Output Input

GPIO Port C11: After reset, the default state is

GPIOC11.

Open-drain

Output

CAN transmit data output

Input/ Open-

drain Output

I²C1 serial clock

(TXD1)

Output

SCI1 transmit data output or transmit/receive in

single wire operation

GPIOC12

38

30

Input/ Output Input

GPIO Port C12: After reset, the default state is

GPIOC12.

(CANRX)

(SDA1)

Input

CAN receive data input

I²C1 serial data line

Input/ Open-

drain Output

(RXD1)

Input

SCI1 receive data input

Table continues on the next page...

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

23

MC56F8455x signal and pin descriptions

Table 2. Signal descriptions (continued)

Signal Name

64

LQFP

48

LQFP

Type

State

During

Reset¹

Signal Description

GPIOC13

49

37

Input/ Output Input,

GPIO Port C13: After reset, the default state is

GPIOC13.

(TA3)

Input/ Output

Input

Quad timer module A channel 3 input/output

Crossbar module input 6

(XB_IN6)

(EWM_OUT_B)

GPIOC14

Output

External Watchdog Module output

55

56

41

42

Input/ Output Input

GPIO Port C14: After reset, the default state is

GPIOC14.

I²C0 serial data line

(SDA0)

Input/ Open-

drain Output

(XB_OUT4)

Input

Crossbar module output 4

GPIOC15

Input/ Output Input

GPIO Port C15: After reset, the default state is

GPIOC15.

(SCL0)

Input/ Open-

drain Output

I²C0 serial clock

(XB_OUT5)

Input

Crossbar module output 5

GPIOE0

45

46

47

48

51

33

34

35

38

39

Input/ Output Input

GPIO Port E0: After reset, the default state is

GPIOE0.

PWMA_0B

GPIOE1

Input/ Output

PWM module A (NanoEdge), submodule 0,

output B or input capture B

Input/ Output Input

Input/ Output

GPIO Port E1: After reset, the default state is

GPIOE1.

(PWMA_0A)

GPIOE2

PWM module A (NanoEdge), submodule 0,

output A or input capture A

Input/ Output Input

Input/ Output

GPIO Port E2: After reset, the default state is

GPIOE2.

(PWMA_1B)

GPIOE3

PWM module A (NanoEdge), submodule 1,

output B or input capture B

Input/ Output Input

Input/ Output

GPIO Port E3: After reset, the default state is

GPIOE3.

(PWMA_1A)

GPIOE4

PWM module A (NanoEdge), submodule 1,

output A or input capture A

Input/ Output Input

Input/ Output

GPIO Port E4: After reset, the default state is

GPIOE4.

(PWMA_2B)

PWM module A (NanoEdge), submodule 2,

output B or input capture B

(XB_IN2)

Input

Crossbar module input 2

GPIOE5

52

40

Input/ Output Input

GPIO Port E5: After reset, the default state is

GPIOE5.

(PWMA_2A)

(XB_IN3)

Input/ Output

Input

PWM module A (NanoEdge), submodule 2,

output A or input capture A

Crossbar module input 3

Table continues on the next page...

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

24

Freescale Semiconductor, Inc.

MC56F8455x signal and pin descriptions

Table 2. Signal descriptions (continued)

Signal Name

64

LQFP

48

LQFP

Type

State

During

Reset¹

Signal Description

GPIOE6

53

-

Input/ Output Input

GPIO Port E6: After reset, the default state is

GPIOE6.

(PWMA_3B)

Input/ Output

PWM module A (NanoEdge), submodule 3,

output B or input capture B

(XB_IN4)

Input

Crossbar module input 4

(PWMB_2B)

Input/ Output

PWM module B, submodule 2, output B or input

capture B

GPIOE7

54

-

Input/ Output Input

Input/ Output

GPIO Port E7: After reset, the default state is

GPIOE7.

(PWMA_3A)

PWM module A, submodule 3, output A or input

capture A

(XB_IN5)

Input

Crossbar module input 5

(PWMB_2A)

Input/ Output

PWM module B, submodule 2, output A or input

capture A

GPIOF0

36

50

28

38

Input/ Output Input

GPIO Port F0: After reset, the default state is

GPIOF0.

(XB_IN6)

(TB2)

Input

Crossbar module input 6

Input/ Output

Input/ Output Input

Quad timer module B Channel 2 input/output

GPIOF1

GPIO Port F1: After reset, the default state is

GPIOF1.

(CLKO1)

Output

Buffered clock output 1: the clock source is

selected by clockout select (CLKOSEL) bits in

the clock output select register (CLKOUT) of the

SIM.

(XB_IN7)

(CMPD_O)

GPIOF2

Input

Crossbar module input 7

Output

Analog comparator D output

39

40

41

-

Input/ Output Input

GPIO Port F2: After reset, the default state is

GPIOF2.

I²C1 serial clock

(SCL1)

Input/ Open-

drain Output

(XB_OUT6)

Output

Crossbar module output 6

GPIOF3

Input/ Output Input

GPIO Port F3: After reset, the default state is

GPIOF3.

I²C1 serial data line

(SDA1)

Input/ Open-

drain Output

(XB_OUT7)

Output

Crossbar module output 7

GPIOF4

Input/ Output Input

GPIO Port F4: After reset, the default state is

GPIOF4.

(TXD1)

Output

SCI1 transmit data output or transmit/receive in

single wire operation

(XB_OUT8)

Crossbar module output 8

Table continues on the next page...

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

25

Signal groups

Table 2. Signal descriptions (continued)

Signal Name

64

LQFP

48

LQFP

Type

State

During

Reset¹

Signal Description

GPIOF5

42

-

Input/ Output Input

GPIO Port F5: After reset, the default state is

GPIOF5.

(RXD1)

Output

SCI1 receive data input

(XB_OUT9)

GPIOF6

Output

Crossbar module output 9

58

Input/ Output Input

GPIO Port F6: After reset, the default state is

GPIOF6.

(TB2)

Input/ Output

Quad timer module B Channel 2 input/output

(PWMA_3X)

PWM module A, submodule 3, output X or input

capture X

(PWMB_3X)

Input/ Output

PWM module B, submodule 3, output X or input

capture X

(XB_IN2)

Input

Crossbar module input 2

GPIOF7

59

-

Input/ Output Input

GPIO Port F7: After reset, the default state is

GPIOF7.

(TB3)

Input/ Output

Output

Quad timer module B Channel 3 input/output

Analog comparator C output

(CMPC_O)

(XB_IN3)

GPIOF8

Input

Crossbar module input 3

6

Input/ Output

GPIO Port F8: After reset, the default state is

GPIOF8.

(RXD0)

(TB1)

Input

SCI0 receive data input

Input/ Output

Output

Quad timer module B Channel 1 input/output

Analog comparator D output

(CMPD_O)

1. For all GPIO except GPIOD0 - GPIOD4, input only after reset (internal pullup and pull-down are disabled).

2. If CLKIN is selected as the device’s external clock input, then both the GPS_C0 bit (in GPS1) and the EXT_SEL bit (in

OCCS oscillator control register (OSCTL)) must be set. Also, the crystal oscillator should be powered down.

3 Signal groups

The input and output signals of the MC56F84xxx are organized into functional groups, as

listed in Table 3. Note that some package sizes may not be available for your specific

product. See MC56F844xx/5xx/7xx product family.

Table 3. Functional Group Pin Allocations

Functional Group

Number of Pins

64 LQFP 80 LQFP 100 LQFP

48 LQFP

Power Inputs (V_DD, V_DDA), Power Outputs (V_CAP

)

5

4

1

6

5

1

6

1

Ground (V_SS, V_SSA

Reset

)

4

1

Table continues on the next page...

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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Freescale Semiconductor, Inc.

Ordering parts

Table 3. Functional Group Pin Allocations

(continued)

Functional Group

Number of Pins

48 LQFP

64 LQFP

80 LQFP 100 LQFP

eFlexPWM with NanoEdge ports, not including fault pins

6

5

8

5

N/A

8

N/A

15

6

Queued Serial Peripheral Interface (QSPI) ports

Queued Serial Communications Interface (QSCI) ports

Inter-Integrated Circuit (I²C) interface ports

12-bit Analog-to-Digital Converter (Cyclic ADC) inputs

16-bit Analog-to-Digital Converter (SAR ADC) inputs

Analog Comparator inputs/outputs

6

9

4

6

10

2

16

8

16

10

13/6

1

16

16/6

1

10/4

1

13/6

1

12-bit Digital-to-Analog output

Quad Timer Module (TMR) ports

6

9

11

2

13

2

Controller Area Network (FlexCAN)

2

Inter-Module Crossbar inputs/outputs

12/2

2/2

4

16/6

2/2

4

19/17

2/3

4

25/19

2/3

4

Clock inputs/outputs

JTAG / Enhanced On-Chip Emulation (EOnCE)

4 Ordering parts

4.1 Determining valid orderable parts

Valid orderable part numbers are provided on the web. To determine the orderable part

numbers for this device, go to freescale.com and perform a part number search for the

following device numbers: MC56F84

5 Part identification

5.1 Description

Part numbers for the chip have fields that identify the specific part. You can use the

values of these fields to determine the specific part you have received.

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

27

Terminology and guidelines

5.2 Format

Part numbers for this device have the following format: Q 56F8 4 C F P T PP N

5.3 Fields

This table lists the possible values for each field in the part number (not all combinations

are valid):

Field

Description

Values

Q

Qualification status

• MC = Fully qualified, general market flow

• PC = Prequalification

56F8

DSC family with flash memory and DSP56800/

DSP56800E/DSP56800EX core

• 56F8

4

DSC subfamily

• 4

C

Maximum CPU frequency (MHz)

• 4 = 60 MHz

• 5 = 80 MHz

• 7 = 100 MHz

F

P

Primary program flash memory size

Pin count

• 4 = 64 KB

• 5 = 96 KB

• 6 = 128 KB

• 8 = 256 KB

• 0 and 1 = 48

• 2 and 3 = 64

• 4, 5, and 6 = 80

• 7, 8, and 9 = 100

T

Temperature range (°C)

Package identifier

• V = –40 to 105

PP

• LF = 48LQFP

• LH = 64LQFP

• LK = 80LQFP

• LL = 100LQFP

N

Packaging type

• R = Tape and reel

• (Blank) = Trays

5.4 Example

This is an example part number: MC56F84789VLL

6 Terminology and guidelines

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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Freescale Semiconductor, Inc.

Terminology and guidelines

6.1 Definition: Operating requirement

An operating requirement is a specified value or range of values for a technical

characteristic that you must guarantee during operation to avoid incorrect operation and

possibly decreasing the useful life of the chip.

6.1.1 Example

This is an example of an operating requirement:

Symbol

Description

Min.

Max.

Unit

V_DD

1.0 V core supply

voltage

0.9

1.1

V

6.2 Definition: Operating behavior

An operating behavior is a specified value or range of values for a technical

characteristic that are guaranteed during operation if you meet the operating requirements

and any other specified conditions.

6.2.1 Example

This is an example of an operating behavior:

Symbol

Description

Min.

Max.

Unit

I_WP

Digital I/O weak pullup/ 10

pulldown current

130

µA

6.3 Definition: Attribute

An attribute is a specified value or range of values for a technical characteristic that are

guaranteed, regardless of whether you meet the operating requirements.

6.3.1 Example

This is an example of an attribute:

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

29

Terminology and guidelines

Symbol

Description

Min.

Max.

Unit

CIN_D

Input capacitance:

digital pins

—

7

pF

6.4 Definition: Rating

A rating is a minimum or maximum value of a technical characteristic that, if exceeded,

may cause permanent chip failure:

• Operating ratings apply during operation of the chip.

• Handling ratings apply when the chip is not powered.

6.4.1 Example

This is an example of an operating rating:

Symbol

Description

Min.

Max.

Unit

V_DD

1.0 V core supply

voltage

–0.3

1.2

V

6.5 Result of exceeding a rating

40

30

The likelihood of permanent chip failure increases rapidly as

soon as a characteristic begins to exceed one of its operating ratings.

20

10

0

Operating rating

Measured characteristic

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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Freescale Semiconductor, Inc.

Terminology and guidelines

6.6 Relationship between ratings and operating requirements

Fatal range

Degraded operating range

Normal operating range

Degraded operating range

Fatal range

Expected permanent failure

- No permanent failure

- Possible decreased life

- Possible incorrect operation

- No permanent failure

- Correct operation

- No permanent failure

- Possible decreased life

- Possible incorrect operation

Expected permanent failure

–∞

∞

Operating (power on)

Fatal range

Handling range

Fatal range

Expected permanent failure

No permanent failure

Expected permanent failure

–∞

∞

Handling (power off)

6.7 Guidelines for ratings and operating requirements

Follow these guidelines for ratings and operating requirements:

• Never exceed any of the chip’s ratings.

• During normal operation, don’t exceed any of the chip’s operating requirements.

• If you must exceed an operating requirement at times other than during normal

operation (for example, during power sequencing), limit the duration as much as

possible.

6.8 Definition: Typical value

A typical value is a specified value for a technical characteristic that:

• Lies within the range of values specified by the operating behavior

• Given the typical manufacturing process, is representative of that characteristic

during operation when you meet the typical-value conditions or other specified

conditions

Typical values are provided as design guidelines and are neither tested nor guaranteed.

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

31

Terminology and guidelines

6.8.1 Example 1

This is an example of an operating behavior that includes a typical value:

Symbol

Description

Min.

Typ.

Max.

Unit

I_WP

Digital I/O weak

pullup/pulldown

current

10

70

130

µA

6.8.2 Example 2

This is an example of a chart that shows typical values for various voltage and

temperature conditions:

5000

4500

4000

T_J

3500

150 °C

3000

105 °C

2500

25 °C

2000

–40 °C

1500

1000

500

0

0.90

0.95

1.00

1.05

1.10

V_DD(V)

6.9 Typical value conditions

Typical values assume you meet the following conditions (or other conditions as

specified):

Symbol

Description

Ambient temperature

3.3 V supply voltage

Value

Unit

T_A

25

°C

V

V_DD

3.3

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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Freescale Semiconductor, Inc.

Ratings

7 Ratings

7.1 Thermal handling ratings

Symbol

T_STG

Description

Min.

–55

—

Max.

150

Unit

°C

Notes

Storage temperature

Solder temperature, lead-free

1

2

T_SDR

260

°C

1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life.

2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic

Solid State Surface Mount Devices.

7.2 Moisture handling ratings

Symbol

Description

Min.

Max.

Unit

Notes

MSL

Moisture sensitivity level

—

3

—

1

1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic

Solid State Surface Mount Devices.

7.3 ESD handling ratings

Although damage from electrostatic discharge (ESD) is much less common on these

devices than on early CMOS circuits, use normal handling precautions to avoid exposure

to static discharge. Qualification tests are performed to ensure that these devices can

withstand exposure to reasonable levels of static without suffering any permanent

damage.

All ESD testing is in conformity with AEC-Q100 Stress Test Qualification. During the

device qualification ESD stresses were performed for the human body model (HBM), the

machine model (MM), and the charge device model (CDM).

All latch-up testing is in conformity with AEC-Q100 Stress Test Qualification.

A device is defined as a failure if after exposure to ESD pulses, the device no longer

meets the device specification. Complete DC parametric and functional testing is

performed as per the applicable device specification at room temperature followed by hot

temperature, unless specified otherwise in the device specification.

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

33

Ratings

Table 4. ESD/Latch-up Protection

Characteristic¹

Min

–2000

–200

–500

–100

Max

+2000

+200

+500

+100

Unit

V

ESD for Human Body Model (HBM)

ESD for Machine Model (MM)

V

ESD for Charge Device Model (CDM)

V

Latch-up current at TA= 85°C (I_LAT

)

mA

1. Parameter is achieved by design characterization on a small sample size from typical devices under typical conditions

unless otherwise noted.

7.4 Voltage and current operating ratings

Absolute maximum ratings are stress ratings only, and functional operation at the

maxima is not guaranteed. Stress beyond the limits specified in Table 5 may affect device

reliability or cause permanent damage to the device.

Table 5. Absolute Maximum Ratings (V_SS= 0 V, V_SSA= 0 V)

Characteristic

Supply Voltage Range

Symbol

V_DD

Notes¹

Min

-0.3

-0.4

-0.3

—

Max

4.0

0.3

5.5

4.0

-5.0

20.0

25

Unit

V

Analog Supply Voltage Range

ADC High Voltage Reference

Voltage difference V_DDto V_DDA

Voltage difference V_SSto V_SSA

Digital Input Voltage Range

V_DDA

V_REFHx

ΔV_DD

ΔV_SS

V_IN

V

Pin Group 1

Pin Group 2

Pin Group 4

Pin Group 3

V

RESET Input Voltage Range

Oscillator Input Voltage Range

Analog Input Voltage Range

Input clamp current, per pin (V_IN< V_SS- 0.3 V)², ³

Output clamp current, per pin⁴

V_{IN_RESET}

V_OSC

V_INA

V

V_IC

mA

V_OC

—

Contiguous pin DC injection current—regional limit sum

of 16 contiguous pins

I_ICont

-25

Output Voltage Range (normal push-pull mode)

Output Voltage Range (open drain mode)

RESET Output Voltage Range

V_OUT

Pin Group 1, 2

Pin Group 1

Pin Group 2

-0.3

4.0

5.5

4.0

V

V_OUTOD

V_{OUTOD_RE}

SET

DAC Output Voltage Range

V_{OUT_DAC}

Pin Group 5

-0.3

-40

-55

4.0

105

125

150

V

Ambient Temperature Industrial

Junction Temperature

T_A

T_j

°C

Storage Temperature Range (Extended Industrial)

T_STG

1. Default Mode

• Pin Group 1: GPIO, TDI, TDO, TMS, TCK

• Pin Group 2: RESET

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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Freescale Semiconductor, Inc.

General

• Pin Group 3: ADC and Comparator Analog Inputs

• Pin Group 4: XTAL, EXTAL

• Pin Group 5: DAC analog output

2. Continuous clamp current

3. All 5 volt tolerant digital I/O pins are internally clamped to V_SSthrough a ESD protection diode. There is no diode

connection to V_DD. If V_INgreater than VDIO_MIN (= V_SS–0.3 V) is observed, then there is no need to provide current

limiting resistors at the pads. If this limit cannot be observed, then a current limiting resistor is required.

4. I/O is configured as push-pull mode.

8 General

8.1 General characteristics

The device is fabricated in high-density, low-power CMOS with 5 V–tolerant TTL-

compatible digital inputs, except for the RESET pin which is 3.3V only. The term “5 V–

tolerant” refers to the capability of an I/O pin, built on a 3.3 V–compatible process

technology, to withstand a voltage up to 5.5 V without damaging the device.

5 V–tolerant I/O is desirable because many systems have a mixture of devices designed

for 3.3 V and 5 V power supplies. In such systems, a bus may carry both 3.3 V– and 5 V–

compatible I/O voltage levels (a standard 3.3 V I/O is designed to receive a maximum

voltage of 3.3 V 10ꢀ during normal operation without causing damage). This 5 V–

tolerant capability therefore offers the power savings of 3.3 V I/O levels combined with

the ability to receive 5 V levels without damage.

Absolute maximum ratings in Table 5 are stress ratings only, and functional operation at

the maximum is not guaranteed. Stress beyond these ratings may affect device reliability

or cause permanent damage to the device.

Unless otherwise stated, all specifications within this chapter apply over the temperature

range of -40°C to 105°C ambient temperature over the following supply ranges:

V_SS=V_SSA=0V, V_DD=V_DDA=3.0V to 3.6V, CL≤50 pF, f_OP=80MHz.

CAUTION

This device contains protective circuitry to guard against

damage due to high static voltage or electrical fields. However,

normal precautions are advised to avoid application of any

voltages higher than maximum-rated voltages to this high-

impedance circuit. Reliability of operation is enhanced if

unused inputs are tied to an appropriate voltage level.

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

35

General

8.2 AC electrical characteristics

Tests are conducted using the input levels specified in Table 8. Unless otherwise

specified, propagation delays are measured from the 50ꢀ to the 50ꢀ point, and rise and

fall times are measured between the 10ꢀ and 90ꢀ points, as shown in Figure 3.

Low

High

V

IH

90%

50%

10%

Midpoint1

Fall Time

Input Signal

V

IL

Rise Time

The midpoint is V + (V – V )/2.

IL

IH

IL

Figure 3. Input signal measurement references

Figure 4 shows the definitions of the following signal states:

• Active state, when a bus or signal is driven, and enters a low impedance state

• Tri-stated, when a bus or signal is placed in a high impedance state

• Data Valid state, when a signal level has reached V_OLor V_OH

• Data Invalid state, when a signal level is in transition between V_OLand V_OH

Data1 Valid

Data1

Data2 Valid

Data2

Data3 Valid

Data3

Data

Data Invalid State

Tri-stated

Data Active

Figure 4. Signal states

8.3 Nonswitching electrical specifications

8.3.1 Voltage and current operating requirements

This section includes information about recommended operating conditions.

NOTE

Recommended V_DDramp rate is between 1 ms and 200 ms.

Table 6. Recommended Operating Conditions (V_REFLx=0V, V_SSA=0V, V_SS=0V)

Characteristic

Symbol

Notes¹

Min

Typ

Max

Unit

Supply voltage²

V_DD, V_DDA

2.7

3.3

3.6

V

Table continues on the next page...

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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Freescale Semiconductor, Inc.

General

Table 6. Recommended Operating Conditions (V_REFLx=0V, V_SSA=0V, V_SS=0V) (continued)

Characteristic

Symbol

V_REFHA

V_REFHB

V_REFHC

ΔVDD

ΔVSS

V_IH

Notes¹

Min

Typ

Max

Unit

ADC (Cyclic) Reference Voltage High

3.0

V_DDA

V

ADC (SAR) Reference Voltage High

Voltage difference V_DDto V_DDA

Voltage difference V_SSto V_SSA

Input Voltage High (digital inputs)

RESET Voltage High

2.0

-0.1

V_DDA

0.1

V

0

-0.1

0.1

Pin Group 1

Pin Group 2

0.7 x V_DD

5.5

V_{IH_RESET}

V_IL

—

V_DD

Input Voltage Low (digital inputs)

Oscillator Input Voltage High

XTAL driven by an external clock source

Oscillator Input Voltage Low

Output Source Current High (at V_OHmin.)^{3, 4}

• Programmed for low drive strength

Pin Groups 1, 2

Pin Group 4

0.35 x V_DD

V_DD+ 0.3

V_IHOSC

2.0

V_ILOSC

I_OH

Pin Group 4

-0.3

0.8

V

Pin Group 1

—

-2

-9

mA

• Programmed for high drive strength

Output Source Current Low (at V_OLmax.)^{3, 4}

• Programmed for low drive strength

I_OL

Pin Groups 1, 2

—

2

9

mA

• Programmed for high drive strength

1. Default Mode

• Pin Group 1: GPIO, TDI, TDO, TMS, TCK

• Pin Group 2: RESET

• Pin Group 3: ADC and Comparator Analog Inputs

• Pin Group 4: XTAL, EXTAL

• Pin Group 5: DAC analog output

2. ADC (Cyclic) specifications are not guaranteed when V_DDAis below 3.0 V.

3.

4. Contiguous pin DC injection current of regional limit—including sum of negative injection currents or sum of positive

injection currents of 16 contiguous pins—is 25 mA.

8.3.2 LVD and POR operating requirements

Table 7. PMC Low-Voltage Detection (LVD) and Power-On Reset (POR)

Parameters

Characteristic

Symbol

POR

Min

Typ

2.0

Max

Unit

POR Assert Voltage¹

POR Release Voltage²

LVI_2p7 Threshold Voltage

LVI_2p2 Threshold Voltage

V

POR

2.7

2.73

2.23

1. During 3.3-volt V_DDpower supply ramp down

2. During 3.3-volt V_DDpower supply ramp up (gated by LVI_2p7)

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

37

General

8.3.3 Voltage and current operating behaviors

The following table provides information about power supply requirements and I/O pin

characteristics.

Table 8. DC Electrical Characteristics at Recommended Operating

Conditions

Characteristic

Output Voltage High

Output Voltage Low

Symbol

V_OH

Notes¹

Min

V_DD- 0.5

—

Typ

—

Max

—

Unit

V

Test Conditions

I_OH= I_OHmax

Pin Group 1

V_OL

Pin Groups

1, 2

—

0.5

V

I_OL= I_OLmax

Digital Input Current High

I_IH

Pin Group 1

Pin Group 2

—

0

+/- 2.5

µA

V_IN= 2.4 V to 5.5 V

V_IN= 2.4 V to V_DD

pull-up enabled or

disabled

Comparator Input Current

High

I_IHC

I_IHOSC

R_Pull-Up

R_Pull-Down

I_ILC

Pin Group 3

—

0

+/- 2

50

µA

kΩ

µA

V

V_IN= V_DDA

Oscillator Input Current

High

V_IN= V_DDA

Internal Pull-Up

Resistance

20

—

0

—

Internal Pull-Down

Resistance

20

50

—

V_IN= 0V

Comparator Input Current

Low

Pin Group 3

Pin Group 5

—

+/- 2

Typically

Oscillator Input Current

Low

I_ILOSC

V_DAC

—

0

V_IN= 0V

DAC Output Voltage

Range

Typically

V_SSA

—

R_LD= 3 kΩ || C_LD= 400 pF

+

V_DDA-

40mV

Output Current¹

I_OZ

Pin Groups

1, 2

—

0

+/- 1

µA

V

—

High Impedance State

Schmitt Trigger Input

Hysteresis

V_HYS

Pin Groups 0.06 x V_DD

1, 2

—

1. Default Mode

• Pin Group 1: GPIO, TDI, TDO, TMS, TCK

• Pin Group 2: RESET

• Pin Group 3: ADC and Comparator Analog Inputs

• Pin Group 4: XTAL, EXTAL

• Pin Group 5: DAC

8.3.4 Power mode operating behaviors

Parameters listed are guaranteed by design.

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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Freescale Semiconductor, Inc.

General

NOTE

To filter noise on the RESETB pin, install a capacitor (up to 0.1

uF) on it.

Table 9. Reset, stop, wait, and interrupt timing

Characteristic

Symbol

Typical Min

Typical

Max

Unit

See

Figure

Minimum RESET Assertion Duration

t_RA

t_RDA

t_IF

16¹

865 x T_OSC+ 8 x T

361.3

—

ns

—

RESET deassertion to First Address Fetch

Delay from Interrupt Assertion to Fetch of first

instruction (exiting Stop)

570.9

1. If the RESET pin filter is enabled by setting the RST_FLT bit in the SIM_CTRL register to 1, the minimum pulse assertion

must be greater than 21 ns.

NOTE

In the Table 9, T = system clock cycle and T_OSC= oscillator

clock cycle. For an operating frequency of 80MHz, T=12.5ns.

At 4MHz (used coming out of reset and stop modes), T=250ns.

Table 10. Power-On-Reset mode transition times

Symbol

Description

Min

Max

Unit

Notes

T_POR

After a POR event, the amount of delay from when VDD

reaches 2.7V to when the first instruction executes (over the

operating temperature range).

199

225

us

LPS mode to LPRUN mode

VLPS mode to VLPRUN mode

STOP mode to RUN mode

240

1424

6.79

551

1500

7.29

0.650

1500

554

us

4

5

3

2

5

4

WAIT mode to RUN mode

0.570

1413

237.2

VLPWAIT mode to VLPRUN mode

LPWAIT mode to LPRUN mode

1. Normal boot (FTFL_OPT[LPBOOT]=1)

2. Clock configuration: CPU clock = 80 MHz, bus clock = 80 MHz, flash clock = 20

MHz

3. Clock configuration: CPU clock = 4 MHz, system clock source is 8 MHz IRC

4. CPU Clock = 200 kHz and 8 Mhz IRC in standby mode

5. Clock configuration: Using 64 kHz external clock source, CPU Clock = 32 kHz

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

39

General

8.3.5 Power consumption operating behaviors

Table 11. Current Consumption

Mode

Maximum Conditions

Frequency

Typical at 3.3 V, Maximum at 3.6

25°C

V, 105°C

1

I_DD

I_DDA

I_DD

I_DDA

RUN

80 MHz

• 80 MHz Device Clock

36.9 mA 16.2 mA 63.8 mA 26 mA

• Regulators are in full regulation

• Relaxation Oscillator on

• PLL powered on

• Continuous MAC instructions with fetches from

Program Flash

• All peripheral modules enabled.

• TMRs and SCIs using 1X Clock

• NanoEdge within PWMA using 1X clock

• ADC/DAC powered on and clocked at 5 MHz²

• Comparator powered on

WAIT

80 MHz

• 80 MHz Device Clock

32.8 mA 13.52 μA 57.3 mA 45 μA

• Regulators are in full regulation

• Relaxation Oscillator on

• PLL powered on

• Processor Core in WAIT state

• All Peripheral modules enabled.

• TMRs and SCIs using 1X Clock

• NanoEdge within PWMA using 2X clock

• ADC/DAC/Comparator powered off

STOP

4 MHz

2 MHz

• 4 MHz Device Clock

• Regulators are in full regulation

• Relaxation Oscillator on

9.09 mA 13.14 μA 28.70 43.20 μA

mA

• PLL powered off

• Processor Core in STOP state

• All peripheral module and core clocks are off

• ADC/DAC/Comparator powered off

LPRUN

(LsRUN)

• 200 kHz Device Clock from Relaxation Oscillator

(ROSC)

1.85 mA 3 mA

15.76 5.15 mA

mA

• ROSC in standby mode

• Regulators are in standby

• PLL disabled

• Repeat NOP instructions

• All peripheral modules enabled, except NanoEdge

and cyclic ADCs³

• Simple loop with running from platform instruction

buffer

LPWAIT

(LsWAIT)

2 MHz

• 200 kHz Device Clock from Relaxation Oscillator

(ROSC)

1.81 mA 2.67 mA 15.58 5.15 mA

mA

• ROSC in standby mode

• Regulators are in standby

• PLL disabled

• All peripheral modules enabled, except NanoEdge

and cyclic ADCs³

• Processor core in wait mode

Table continues on the next page...

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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Freescale Semiconductor, Inc.

General

Table 11. Current Consumption (continued)

Mode

Maximum Conditions

Frequency

Typical at 3.3 V, Maximum at 3.6

25°C

V, 105°C

1

I_DD

I_DDA

I_DD

I_DDA

LPSTOP

2 MHz

• 200 kHz Device Clock from Relaxation Oscillator

1.06 mA 13.10 μA 14.74

43.2 μA

(LsSTOP)

(ROSC)

mA

• ROSC in standby mode

• Regulators are in standby

• PLL disabled

• Only PITs and COP enabled; other peripheral

modules disabled and clocks gated off³

• Processor core in stop mode

VLPRUN

200 kHz

• 32 kHz Device Clock

0.57 mA 12.20 μA 8.39 mA 17.40 μA

• Clocked by a 32 kHz external clock source

• Oscillator in power down

• All ROSCs disabled

• Large regulator is in standby

• Small regulator is disabled

• PLL disabled

• Repeat NOP instructions

• All peripheral modules, except COP and EWM,

disabled and clocks gated off

• Simple loop running from platform instruction

buffer

VLPWAIT

200 kHz

• 32 kHz Device Clock

0.56 mA 11.44 μA 8.30 mA 15.00 μA

• Clocked by a 32 kHz external clock source

• Oscillator in power down

• All ROSCs disabled

• Large regulator is in standby

• Small regulator is disabled

• PLL disabled

• All peripheral modules, except COP, disabled and

clocks gated off

• Processor core in wait mode

VLPSTOP

200 kHz

• 32 kHz Device Clock

0.56 mA 10.44 μA 8.21 mA 13.14 μA

• Clocked by a 32 kHz external clock source

• Oscillator in power down

• All ROSCs disabled

• Large regulator is in standby

• Small regulator is disabled

• PLL disabled

• All peripheral modules, except COP, disabled and

clocks gated off

• Processor core in stop mode

1. No output switching, all ports configured as inputs, all inputs low, no DC loads

2. ADC power consumption at higher frequency can be found in Table 28

3. In all chip LP modes and flash memory VLP modes, the maximum frequency for flash memory operation is 250 kHz,

because of the fixed frequency ratio of 1:4 between the CPU clock and the flash clock (when using a 2 MHz external input

clock and the CPU is operating at 1 MHz).

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

41

General

8.3.6 Designing with radiated emissions in mind

To find application notes that provide guidance on designing your system to minimize

interference from radiated emissions:

1. Go to www.freescale.com.

2. Perform a keyword search for “EMC design.”

8.3.7 Capacitance attributes

Table 12. Capacitance attributes

Description

Symbol

C_IN

Min.

—

Typ.

10

Max.

—

Unit

pF

Input capacitance

Output capacitance

C_OUT

—

10

—

pF

8.4 Switching specifications

8.4.1 Device clock specifications

Table 13. Device clock specifications

Symbol

Description

Min.

Max.

Unit

Notes

Normal run mode

f_SYSCLK

Device (system and core) clock frequency

• using relaxation oscillator

0.001

0

80

MHz

• using external clock source

f_IPBUS

IP bus clock

—

8.4.2 General switching timing

Table 14. Switching timing

Symbol Description

GPIO pin interrupt pulse width¹

Min

Max

Unit

Notes

1.5

IP Bus

Clock

Cycles

2

Synchronous path

Port rise and fall time (high drive strength), Slew disabled 2.7

≤ V_DD≤ 3.6V.

5.5

1.5

15.1

6.8

ns

3

Port rise and fall time (high drive strength), Slew enabled 2.7

≤ V_DD≤ 3.6V.

ns

Table continues on the next page...

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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Freescale Semiconductor, Inc.

General

Table 14. Switching timing (continued)

Symbol Description

Min

Max

Unit

Notes

Port rise and fall time (low drive strength). Slew disabled . 2.7

8.2

17.8

ns

4

≤ V_DD≤ 3.6V

Port rise and fall time (low drive strength). Slew enabled . 2.7

≤ V_DD≤ 3.6V

3.2

9.2

ns

4

1. Applies to a pin only when it is configured as GPIO and configured to cause an interrupt by appropriately programming

GPIOn_IPOLR and GPIOn_IENR.

2. The greater synchronous and asynchronous timing must be met.

3. 75 pF load

4. 15 pF load

8.5 Thermal specifications

8.5.1 Thermal operating requirements

Table 15. Thermal operating requirements

Symbol

T_J

Description

Min.

–40

Max.

Unit

°C

Die junction temperature

Ambient temperature (extended industrial)

T_A

°C

8.5.2 Thermal attributes

This section provides information about operating temperature range, power dissipation,

and package thermal resistance. Power dissipation on I/O pins is usually small compared

to the power dissipation in on-chip logic and voltage regulator circuits, and it is user-

determined rather than being controlled by the MCU design. To account for P_I/Oin power

calculations, determine the difference between actual pin voltage and V_SSor V_DDand

multiply by the pin current for each I/O pin. Except in cases of unusually high pin current

(heavy loads), the difference between pin voltage and V_SSor V_DDis very small.

See Thermal design considerations for more detail on thermal design considerations.

Board type

Symbol

Description

48 LQFP

64 LQFP

Unit

Notes

Single-layer

(1s)

R_θJA

Thermal

resistance,

junction to

70

64

°C/W

1, 2

ambient (natural

convection)

Table continues on the next page...

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

43

Peripheral operating requirements and behaviors

Board type

Symbol

Description

48 LQFP

64 LQFP

Unit

Notes

Four-layer

(2s2p)

R_θJA

Thermal

resistance,

junction to

46

°C/W

1, 3

ambient (natural

convection)

Single-layer

(1s)

R_θJMA

R_θJB

Thermal

resistance,

junction to

ambient (200 ft./

min. air speed)

57

39

23

52

39

28

°C/W

1,3

4

Four-layer

(2s2p)

Thermal

resistance,

junction to

ambient (200 ft./

min. air speed)

—

Thermal

resistance,

junction to

board

—

R_θJC

Thermal

resistance,

junction to case

17

3

15

3

°C/W

5

6

Ψ_JT

Thermal

characterization

parameter,

junction to

package top

outside center

(natural

convection)

1.

2.

Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board

thermal resistance.

Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental

Conditions—Natural Convection (Still Air) with the single layer board horizontal. For the LQFP, the board meets the

JESD51-3 specification.

3.

4.

5.

Determined according to JEDEC Standard JESD51-6, Integrated Circuits Thermal Test Method Environmental

Conditions—Forced Convection (Moving Air) with the board horizontal.

Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental

Conditions—Junction-to-Board. Board temperature is measured on the top surface of the board near the package.

Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate

temperature used for the case temperature. The value includes the thermal resistance of the interface material

between the top of the package and the cold plate.

6.

Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental

Conditions—Natural Convection (Still Air).

9 Peripheral operating requirements and behaviors

9.1 Core modules

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

44

Freescale Semiconductor, Inc.

Peripheral operating requirements and behaviors

9.1.1 JTAG timing

Table 16. JTAG timing

Characteristic

Symbol

Min

Max

Unit

See

Figure

TCK frequency of operation

TCK clock pulse width

f_OP

t_PW

t_DS

t_DH

t_DV

t_TS

DC

50

5

SYS_CLK/ 16

MHz

ns

Figure 5

Figure 6

—

30

TMS, TDI data set-up time

TMS, TDI data hold time

TCK low to TDO data valid

TCK low to TDO tri-state

ns

5

ns

—

ns

1/f

OP

t

PW

V

IH

V

M

TCK

(Input)

IL

V

= V + (V – V )/2

IL IH IL

M

Figure 5. Test clock input timing diagram

TCK

(Input)

t

DH

DS

TDI

TMS

Input Data Valid

(Input)

t

DV

TDO

(Output)

Output Data Valid

t

TS

TDO

(Output)

Figure 6. Test access port timing diagram

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

45

System modules

9.2 System modules

9.2.1 Voltage regulator specifications

The voltage regulator supplies approximately 1.2 V to the MC56F84xxx’s core logic. For

proper operations, the voltage regulator requires an external 2.2 µF capacitor on each

V_CAPpin. Ceramic and tantalum capacitors tend to provide better performance

tolerances. The output voltage can be measured directly on the V_CAPpin. The

specifications for this regulator are shown in Table 17.

Table 17. Regulator 1.2 V parameters

Characteristic

Output Voltage¹

Short Circuit Current²

Symbol

V_CAP

I_SS

Min

—

Typ

1.22

600

—

Max

—

Unit

V

—

mA

Short Circuit Tolerance (V_CAPshorted to ground)

T_RSC

—

30

Minutes

1. Value is after trim

2. Guaranteed by design

Table 18. Bandgap electrical specifications

Characteristic

Reference Voltage (after trim)

Symbol

Min

Typ

Max

Unit

V_REF

—

1.21

—

V

9.3 Clock modules

9.3.1 External clock operation timing

Parameters listed are guaranteed by design.

Table 19. External clock operation timing requirements

Characteristic

Symbol

f_osc

Min

Typ

Max

Unit

MHz

ns

Frequency of operation (external clock driver)¹

Clock pulse width²

External clock input rise time³

—

50

t_PW

8

—

t_rise

—

1

ns

External clock input fall time⁴

t_fall

—

ns

Input high voltage overdrive by an external clock

Input low voltage overdrive by an external clock

V_ih

0.85V_DD

—

V

V_il

0.3V_DD

V

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

46

Freescale Semiconductor, Inc.

System modules

1. See Figure 7 for detail on using the recommended connection of an external clock driver.

2. The chip may not function if the high or low pulse width is smaller than 6.25 ns.

3. External clock input rise time is measured from 10% to 90%.

4. External clock input fall time is measured from 90% to 10%.

V

IH

External

Clock

90%

50%

10%

90%

50%

10%

t

V

IL

t

fall

rise

t

PW

Note: The midpoint is V + (V – V )/2.

IL

IH

IL

Figure 7. External clock timing

9.3.2 Phase-Locked Loop timing

Table 20. Phase-Locked Loop timing

Characteristic

PLL input reference frequency¹

PLL output frequency²

Symbol

f_ref

Min

Typ

8

Max

Unit

MHz

µs

8

16

400

73.2

60

f_op

—

PLL lock time³

t_plls

35.5

40

Allowed Duty Cycle of input reference

t_dc

50

%

1. An externally supplied reference clock should be as free as possible from any phase jitter for the PLL to work correctly.

The PLL is optimized for 8 MHz input.

2. The frequency of the core system clock cannot exceed 80 MHz. If the NanoEdge PWM is available, the PLL output must

be set to above 320 MHz.

3. This is the time required after the PLL is enabled to ensure reliable operation.

9.3.3 External crystal or resonator requirement

Table 21. Crystal or resonator requirement

Characteristic

Symbol

Min

Typ

Max

Unit

Frequency of operation

f_XOSC

4

8

16

MHz

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

47

System modules

9.3.4 Relaxation oscillator timing

Table 22. Relaxation oscillator electrical specifications

Characteristic

Symbol

Min

Typ

Max

Unit

MHz

kHz

8 MHz Output Frequency¹

7.84

7.76

8

8.16

8.24

RUN Mode

• 0°C to 105°C

• -40°C to 105°C

266.8

402

554.3

Standby Mode (IRC trimmed @ 8 MHz)

• -40°C to 105°C

8 MHz Frequency Variation

RUN Mode

+/- 1.5

+/-2

+/-3

%

Due to temperature

• 0°C to 105°C

• -40°C to 105°C

32 kHz Output Frequency²

30.1

32

33.9

+/-4

kHz

%

RUN Mode

• -40°C to 105°C

32 kHz Output Frequency Variation

RUN Mode

+/-2.5

Due to temperature

• -40°C to 105°C

Stabilization Time

• 8 MHz output³

• 32 kHz output⁴

tstab

0.12

14.4

50

0.4

16.2

52

µs

%

Output Duty Cycle

48

1. Frequency after application of 8 MHz trim

2. Frequency after application of 32 kHz trim

3. Standby to run mode transition

4. Power down to run mode transition

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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Freescale Semiconductor, Inc.

System modules

Figure 8. Relaxation oscillator temperature variation (typical) after trim (preliminary)

9.4 Memories and memory interfaces

9.4.1 Flash electrical specifications

This section describes the electrical characteristics of the flash memory module.

9.4.1.1 Flash timing specifications — program and erase

The following specifications represent the amount of time the internal charge pumps are

active and do not include command overhead.

Table 23. NVM program/erase timing specifications

Symbol Description

Min.

Typ.

Max.

Unit

Notes

t_hvpgm4

Longword Program high-voltage time

—

7.5

18

μs

—

Table continues on the next page...

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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49

System modules

Table 23. NVM program/erase timing specifications (continued)

Symbol Description

Min.

—

Typ.

13

Max.

113

452

904

Unit

ms

Notes

t_hversscrSector Erase high-voltage time

t_hversblk32kErase Block high-voltage time for 32 KB

t_hversblk256kErase Block high-voltage time for 256 KB

1

—

52

ms

—

104

ms

1. Maximum time based on expectations at cycling end-of-life.

9.4.1.2 Flash timing specifications — commands

Table 24. Flash command timing specifications

Symbol Description

Read 1s Block execution time

Min.

Typ.

Max.

Unit

Notes

—

t_rd1blk32k

• 32 KB data flash

—

0.5

1.7

ms

t_rd1blk256k

• 256 KB program flash

t_rd1sec1kRead 1s Section execution time (data flash

sector)

—

60

μs

1

t_rd1sec2kRead 1s Section execution time (program flash

sector)

t_pgmchk

t_rdrsrc

Program Check execution time

Read Resource execution time

Program Longword execution time

Erase Flash Block execution time

• 32 KB data flash

—

65

45

30

μs

1

t_pgm4

145

—

2

t_ersblk32k

—

55

465

985

ms

t_ersblk256k

• 256 KB program flash

122

t_ersscr

Erase Flash Sector execution time

Program Section execution time

• 512 B program flash

• 512 B data flash

—

14

114

ms

2

—

t_pgmsec512p

t_pgmsec512d

t_pgmsec1kp

t_pgmsec1kd

—

2.4

4.7

9.3

—

ms

• 1 KB program flash

• 1 KB data flash

t_rd1all

Read 1s All Blocks execution time

Read Once execution time

—

1.8

25

ms

μs

ms

μs

—

1

t_rdonce

t_pgmonceProgram Once execution time

65

175

—

2

t_ersall

Erase All Blocks execution time

1500

30

t_vfykey

Verify Backdoor Access Key execution time

Program Partition for EEPROM execution time

• 32 KB FlexNVM

1

—

t_pgmpart32k

—

70

—

ms

Table continues on the next page...

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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Freescale Semiconductor, Inc.

System modules

Table 24. Flash command timing specifications (continued)

Symbol Description

Set FlexRAM Function execution time:

Min.

Typ.

Max.

Unit

Notes

—

t_setramff

t_setram8k

t_setram32k

• Control Code 0xFF

—

50

0.3

0.7

—

μs

ms

• 8 KB EEPROM backup

• 32 KB EEPROM backup

0.5

1.0

Byte-write to FlexRAM for EEPROM operation

t_eewr8bersByte-write to erased FlexRAM location execution

time

—

175

260

μs

3

Byte-write to FlexRAM execution time:

—

t_eewr8b8k

t_eewr8b16k

t_eewr8b32k

• 8 KB EEPROM backup

• 16 KB EEPROM backup

• 32 KB EEPROM backup

—

340

385

475

1700

1800

2000

μs

Word-write to FlexRAM for EEPROM operation

t_eewr16bersWord-write to erased FlexRAM location

execution time

—

175

260

μs

—

Word-write to FlexRAM execution time:

t_eewr16b8k

t_eewr16b16k

t_eewr16b32k

• 8 KB EEPROM backup

• 16 KB EEPROM backup

• 32 KB EEPROM backup

—

340

385

475

1700

1800

2000

μs

Longword-write to FlexRAM for EEPROM operation

t_eewr32bersLongword-write to erased FlexRAM location

execution time

—

360

540

μs

—

Longword-write to FlexRAM execution time:

t_eewr32b8k

t_eewr32b16k

t_eewr32b32k

• 8 KB EEPROM backup

• 16 KB EEPROM backup

• 32 KB EEPROM backup

—

545

630

810

1950

2050

2250

μs

1. Assumes 25 MHz flash clock frequency.

2. Maximum times for erase parameters based on expectations at cycling end-of-life.

3. For byte-writes to an erased FlexRAM location, the aligned word containing the byte must be erased.

9.4.1.3 Flash high voltage current behaviors

Table 25. Flash high voltage current behaviors

Symbol

Description

Min.

Typ.

Max.

Unit

I_{DD_PGM}

Average current adder during high voltage

flash programming operation

—

2.5

6.0

mA

I_{DD_ERS}

Average current adder during high voltage

flash erase operation

—

1.5

4.0

mA

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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51

System modules

9.4.1.4 Reliability specifications

Table 26. NVM reliability specifications

Symbol Description

Min.

Program Flash

Typ.¹

Max.

Unit

Notes

t_nvmretp10kData retention after up to 10 K cycles

t_nvmretp1kData retention after up to 1 K cycles

n_nvmcycpCycling endurance

5

50

—

years

cycles

—

2

20

100

50 K

10 K

Data Flash

t_nvmretd10kData retention after up to 10 K cycles

t_nvmretd1kData retention after up to 1 K cycles

n_nvmcycdCycling endurance

5

50

—

years

cycles

—

2

20

10 K

100

50 K

FlexRAM as EEPROM

t_nvmretee100Data retention up to 100% of write endurance

t_nvmretee10Data retention up to 10% of write endurance

Write endurance

5

50

—

years

—

3

20

100

n_nvmwree16

n_nvmwree128

n_nvmwree512

n_nvmwree4k

n_nvmwree8k

• EEPROM backup to FlexRAM ratio = 16

• EEPROM backup to FlexRAM ratio = 128

• EEPROM backup to FlexRAM ratio = 512

• EEPROM backup to FlexRAM ratio = 4096

• EEPROM backup to FlexRAM ratio = 8192

35 K

315 K

1.27 M

10 M

175 K

1.6 M

6.4 M

50 M

—

writes

20 M

100 M

1. Typical data retention values are based on measured response accelerated at high temperature and derated to a constant

25 °C use profile. Engineering Bulletin EB618 does not apply to this technology. Typical endurance defined in Engineering

Bulletin EB619.

2. Cycling endurance represents number of program/erase cycles at -40 °C ≤ T_j≤ 125 °C.

3. Write endurance represents the number of writes to each FlexRAM location at -40 °C ≤Tj ≤ 125 °C influenced by the

cycling endurance of the FlexNVM (same value as data flash) and the allocated EEPROM backup. Minimum and typical

values assume all byte-writes to FlexRAM.

9.5 Analog

9.5.1 12-bit cyclic Analog-to-Digital Converter (ADC) parameters

Table 27. 12-bit ADC electrical specifications

Characteristic

Symbol

Min

Typ

Max

Unit

Recommended Operating Conditions

Supply Voltage¹

Vrefh Supply Voltage²

ADC Conversion Clock³

Conversion Range

V_DDA

Vrefhx

f_ADCCLK

R_AD

2.7

3.0

3.3

3.6

V_DDA

20

V

0.6

MHz

V

V_REFL

V_REFH

Table continues on the next page...

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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System modules

Table 27. 12-bit ADC electrical specifications (continued)

Characteristic

Symbol

Min

Typ

Max

Unit

Input Voltage Range

V_ADIN

V

V_REFL

V_SSA

V_REFH

V_DDA

External Reference

Internal Reference

Timing and Power

Conversion Time

t_ADC

t_ADS

t_ADPU

I_ADRUN

6

ADC Clock Cycles

mA

Sample Time

1

5

ADC Power-Up Time (from adc_pdn)

ADC RUN Current (per ADC block)

• at 600 kHz ADC Clock, LP mode

• ≤ 8.33 MHz ADC Clock, 00 mode

• ≤ 12.5 MHz ADC Clock, 01 mode

• ≤ 16.67 MHz ADC Clock, 10 mode

• ≤ 20 MHz ADC Clock, 11 mode

13

1

5.7

10.5

17.7

22.6

ADC Powerdown Current (adc_pdn enabled)

V_REFHCurrent

I_ADPWRDWN

I_VREFH

0.02

µA

0.001

Accuracy (DC or Absolute)

Integral non-Linearity⁴

Differential non-Linearity⁴

Monotonicity

I_NL

+/- 3

+/- 5

LSB⁵

DNL

+/- 0.6

+/- 0.9

Offset⁶

V_OFFSET

LSB ⁴

+/- 17

+/- 20

+/- 25

• 1x gain mode

• 2x gain mode

• 4x gain mode

Gain Error (normalized)

E_GAIN

0.994 to

1.004

0.990 to

1.010

AC Specifications⁷

Signal to Noise Ratio

Total Harmonic Distortion

Spurious Free Dynamic Range

Signal to Noise plus Distortion

Effective Number of Bits

ADC Inputs

SNR

THD

59

64

65

59

dB

bits

SFDR

SINAD

ENOB

Input Leakage Current

Input Injection Current ⁸

Input Capacitance

I_IN

I_INJ

0

+/-2

+/-3

µA

mA

pF

C_ADI

-

Sampling Capacitor

• 1x mode

-

1.4

2.8

5.6

• 2x mode

• 4x mode

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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53

System modules

1. If the ADC’s reference is from V_DDA: When V_DDAis below 3.0 V, then the ADC functions, but the ADC specifications are

not guaranteed.

2. When the input is at the V_refllevel, then the resulting output will be all zeros (hex 000), plus any error contribution due to

offset and gain error. When the input is at the V_refhlevel, then the output will be all ones (hex FFF), minus any error

contribution due to offset and gain error.

3. ADC clock duty cycle min/max is 45/55%

4. I_NLmeasured from V_IN= V_REFLto V_IN= V

.

5. LSB = Least Significant Bit = 0.806 mV at^R3^EF.^H3 V VDDA, x1 Gain Setting

6. Offset over the conversion range of 0025 to 4080, with internal/external reference.

7. Measured when converting a 1 kHz input Full Scale sine wave.

8. The current that can be injected into or sourced from an unselected ADC input, without affecting the performance of the

ADC.

9.5.1.1 Equivalent circuit for ADC inputs

The following figure shows the ADC input circuit during sample and hold. S1 and S2 are

always opened/closed at non-overlapping phases, and both S1 and S2 operate at the ADC

clock frequency. The following equation gives equivalent input impedance when the

input is selected.

1

100ohm + 125ohm

+

-12

(ADC ClockRate) x 1.4x10

C1: Single Ended Mode

2XC1: Differential Mode

Channel Mux

equivalent resistance

100Ohms

S1

125 ESD

Resistor

Analog Input

C1

S1

S/H

3

1

2

S1

S2

(V_REFHx- V_REFLx) / 2

C1: Single Ended Mode

2XC1: Differential Mode

1. Parasitic capacitance due to package, pin-to-pin and pin-to-package base coupling =

1.8pF

2. Parasitic capacitance due to the chip bond pad, ESD protection devices and signal

routing = 2.04pF

3. 8 pF noise damping capacitor

4. Sampling capacitor at the sample and hold circuit. Capacitor C1 (4.8pF) is normally

disconnected from the input, and is only connected to the input at sampling time.

5. S1 and S2 switch phases are non-overlapping and operate at the ADC clock

frequency

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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Freescale Semiconductor, Inc.

System modules

S1

S2

Figure 9. Equivalent circuit for A/D loading

9.5.2 16-bit SAR ADC electrical specifications

9.5.2.1 16-bit ADC operating conditions

Table 28. 16-bit ADC operating conditions

Symbol Description

Conditions

Min.

2.7

Typ.¹

Max.

3.6

Unit

Notes

V_DDA

ΔV_DDA

ΔV_SSA

V_REFH

Supply voltage

Ground voltage

Absolute

—

V

mV

V

—

2

Delta to V_DD(V_DD– V_DDA

)

-100

V_DDA

0

+100

V_DDA

Delta to V_SS(V_SS– V_SSA

Absolute

)

0

2

ADC reference

voltage high

V_DDA

3

V_REFL

ADC reference

voltage low

Absolute

V_SSA

V

4

V_ADIN

C_ADIN

Input voltage

V_SSA

—

8

V_DDA

10

V

—

Input capacitance

• 16-bit mode

pF

• 8-bit / 10-bit / 12-bit

modes

—

4

5

R_ADIN

R_AS

Input series

resistance

—

2

5

kΩ

—

5

Analog source

resistance

(external)

12-bit modes

f_ADCK< 4 MHz

—

f_ADCK

C_rate

ADC conversion ≤ 12-bit mode

clock frequency

1.0

2.0

—

18.0

12.0

MHz

6

7

ADC conversion 16-bit mode

clock frequency

ADC conversion ≤ 12-bit modes

rate

No ADC hardware averaging

20.000

37.037

—

818.330

461.467

Ksps

Continuous conversions

enabled, subsequent

conversion time

C_rate

ADC conversion 16-bit mode

7

rate

No ADC hardware averaging

Continuous conversions

enabled, subsequent

conversion time

1. Typical values assume V_DDA= 3.0 V, Temp = 25 °C, f_ADCK= 1.0 MHz, unless otherwise stated. Typical values are for

reference only, and are not tested in production.

2. DC potential difference.

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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System modules

3. V_REFHis internally tied to V_DDA

.

4. V_REFLis internally tied to V_SSA

.

5. This resistance is external to MCU. To achieve the best results, the analog source resistance must be kept as low as

possible. The results in this data sheet were derived from a system that had < 8 Ω analog source resistance. The R_AS/C_AS

time constant should be kept to < 1 ns.

6. To use the maximum ADC conversion clock frequency, CFG2[ADHSC] must be set and CFG1[ADLPC] must be clear.

7. For guidelines and examples of conversion rate calculation, download the ADC calculator tool.

SIMPLIFIED

INPUT PIN EQUIVALENT

ZADIN

CIRCUIT

SIMPLIFIED

CHANNEL SELECT

CIRCUIT

Pad

ZAS

leakage

due to

input

ADC SAR

ENGINE

RAS

RADIN

protection

VADIN

CAS

VAS

RADIN

INPUT PIN

CADIN

Figure 10. ADC input impedance equivalency diagram

9.5.2.2 16-bit ADC electrical characteristics

Table 29. 16-bit ADC characteristics (V_REFH= V_DDA, V_REFL= V_SSA

)

Symbol Description

Conditions¹

Min.

Typ.²

Max.

1.7

3.9

7.3

6.1

9.5

Unit

Notes

I_{DDA_ADC}Supply current

—

mA

3

ADC

asynchronous

• ADLPC=1, ADHSC=0

• ADLPC=1, ADHSC=1

• ADLPC=0, ADHSC=0

• ADLPC=0, ADHSC=1

1.2

3.0

2.4

4.4

2.4

4.0

5.2

6.2

t_ADACK= 1/

f_ADACK

MHz

clock source

f_ADACK

Sample Time

See Reference Manual chapter for sample times

TUE

DNL

Total unadjusted

error

• 12-bit modes

• <12-bit modes

—

4

6.8

2.1

LSB⁴

5

1.4

Differential non-

linearity

• 16-bit modes

• 12-bit modes

• <12-bit modes

—

-1 to +4

0.7

—

0.2

-0.3 to 0.5

Table continues on the next page...

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System modules

Table 29. 16-bit ADC characteristics (V_REFH= V_DDA, V_REFL= V_SSA) (continued)

Symbol Description

Conditions¹

Min.

—

Typ.²

Max.

—

Unit

Notes

INL

Integral non-

linearity

• 16-bit modes

• 12-bit modes

• <12-bit modes

• 12-bit modes

• <12-bit modes

7.0

LSB⁴

5

—

1.0

-2.7 to +1.9

-0.7 to +0.5

-5.4

—

0.5

E_FS

Full-scale error

—

-4

LSB⁴

V_ADIN

=

V_DDA

—

-1.4

-1.8

5

6

E_Q

Quantization

error

• 16-bit modes

• 12-bit modes

—

-1 to 0

—

0.5

ENOB

Effective number 16-bit single-ended mode

of bits

• Avg=32

12.2

11.4

13.9

13.1

—

bits

• Avg=4

12-bit single-ended mode

• Avg=32

10.8

10.2

—

bits

• Avg=1

Signal-to-noise

plus distortion

See ENOB

SINAD

THD

6.02 × ENOB + 1.76

dB

Total harmonic

distortion

16-bit single-ended mode

• Avg=32

7

—

-85

—

dB

12-bit single-ended mode

• Avg=32

—

-74

90

—

dB

SFDR

Spurious free

dynamic range

16-bit single-ended mode

• Avg=32

78

12-bit single-ended mode

• Avg=32

78

—

dB

E_IL

Input leakage

error

I_In× R_AS

mV

I_In=

leakage

current

(refer to

the

device's

voltage

and current

operating

ratings)

Temp sensor

slope

–40°C to 105°C

25°C

—

1.715

722

—

mV/°C

mV

V_TEMP25Temp sensor

voltage

8

1. All accuracy numbers assume the ADC is calibrated with V_REFH= V_DDA

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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System modules

2. Typical values assume V_DDA= 3.0 V, Temp = 25°C, f_ADCK= 2.0 MHz, unless otherwise stated. Typical values are for

reference only, and are not tested in production.

3. The ADC supply current depends on the ADC conversion clock speed, conversion rate and the ADLPC bit (low power).

For lowest power operations: the ADLPC bit should be set, the HSC bit should be clear, with 1MHz ADC conversion clock

speed.

4. 1 LSB = (V_REFH- V_REFL)/2^N

5. ADC conversion clock <16MHz, Max hardware averaging (AVGE = %1, AVGS = %11)

6. Input data is 100 Hz sine wave. ADC conversion clock <12MHz. When running 12-bit Cyclic ADC and 12-bit DAC, some

degradation of ENOB (of 16-bit SAR ADC) may occur.

7. Input data is 1 kHz sine wave. ADC conversion clock <12MHz.

8. System Clock = 4 MHz, ADC Clock = 2 MHz, AVG = Max, Long Sampling = Max

Typical ADC 16-bit Single-Ended ENOB vs ADC Clock

100Hz, 90% FS Sine Input

14.00

13.75

13.50

13.25

13.00

12.75

12.50

12.25

12.00

11.75

11.50

11.25

Averaging of 4 samples

Averaging of 32 samples

11.00

1

2

3

4

5

6

7

8

9

10 11

12

ADC Clock Frequency (MHz)

Figure 11. Typical ENOB vs. ADC_CLK for 16-bit single-ended mode

9.5.3 12-bit Digital-to-Analog Converter (DAC) parameters

Table 30. DAC parameters

Parameter

Conditions/Comments

Symbol

Min

Typ

Max

Unit

DC Specifications

Resolution

Settling time¹

12

—

12

1

12

bits

µs

At output load

RLD = 3 kΩ

CLD = 400 pF

Power-up time

Time from release of PWRDWN

signal until DACOUT signal is valid

t_DAPU

—

11

µs

Accuracy

INL

Integral non-linearity²

Range of input digital words:

410 to 3891 ($19A - $F33)

+/- 3

+/- 4

LSB³

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System modules

Table 30. DAC parameters (continued)

Parameter

Conditions/Comments

Range of input digital words:

410 to 3891 ($19A - $F33)

> 6 sigma monotonicity,

Symbol

Min

Typ

Max

Unit

Differential non-

linearity²

DNL

—

+/- 0.8

+/- 0.9

LSB³

Monotonicity

Offset error²

Gain error²

guaranteed

+/- 25

—

mV

%

< 3.4 ppm non-monotonicity

Range of input digital words:

410 to 3891 ($19A - $F33)

V_OFFSET

—

+/- 43

Range of input digital words: 410 to

3891 ($19A - $F33)

E_GAIN

+/- 0.5

+/- 1.5

DAC Output

Output voltage range Within 40 mV of either V_SSAor V_DDA

V_OUT

V_SSA

0.04 V

+

—

V_DDA- 0.04

V

AC Specifications

SNR

Signal-to-noise ratio

—

85

—

dB

Spurious free dynamic

range

SFDR

-72

Effective number of bits

ENOB

—

11

—

bits

1. Settling time is swing range from V_SSAto V_DDA

2. No guaranteed specification within 5% of V_DDAor V_SSA

3. LSB = 0.806 mV

9.5.4 CMP and 6-bit DAC electrical specifications

Table 31. Comparator and 6-bit DAC electrical specifications

Symbol

V_DD

Description

Min.

2.7

Typ.

—

Max.

3.6

Unit

V

Supply voltage

I_DDHS

I_DDLS

V_AIN

Supply current, high-speed mode (EN=1, PMODE=1)

Supply current, low-speed mode (EN=1, PMODE=0)

Analog input voltage

—

200

20

μA

V

—

V_SS– 0.3

—

V_DD

20

V_AIO

Analog input offset voltage

Analog comparator hysteresis¹

• CR0[HYSTCTR] = 00

—

mV

V_H

—

5

13

48

mV

• CR0[HYSTCTR] = 01

10

20

30

• CR0[HYSTCTR] = 10

105

148

• CR0[HYSTCTR] = 11

V_CMPOh

V_CMPOl

t_DHS

Output high

Output low

V_DD– 0.5

—

50

—

V

0.5

Propagation delay, high-speed mode (EN=1,

PMODE=1)²

ns

Table continues on the next page...

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System modules

Table 31. Comparator and 6-bit DAC electrical specifications (continued)

Symbol

Description

Min.

Typ.

Max.

Unit

t_DLS

Propagation delay, low-speed mode (EN=1,

PMODE=0)

250

ns

Analog comparator initialization delay³

6-bit DAC current adder (enabled)

6-bit DAC reference inputs: Vin1,Vin2

—

7

40

—

μs

μA

V

I_DAC6b

V_DDA

—

V_DD

There are two reference input options selectable (via

VRSEL control bit). The reference options must fall

within this range.

INL

6-bit DAC integral non-linearity

6-bit DAC differential non-linearity

–0.5

–0.3

—

0.5

0.3

LSB⁴

LSB

DNL

1. Typical hysteresis is measured with input voltage range limited to 0.6 to V_DD-0.6V.

2. Signal swing is 100 mV

3. Comparator initialization delay is defined as the time between software writes (to DACEN, VRSEL, PSEL, MSEL, VOSEL),

to change the control inputs and for the comparator output to settle to a stable level.

4. 1 LSB = V_reference/64

0.08

0.07

0.06

HYSTCTR

Setting

0.05

00

0.04

01

10

11

0.03

0.02

0.01

0

0.1

0.4

0.7

1

1.3

1.6

1.9

2.2

2.5

2.8

3.1

Vin level (V)

Figure 12. Typical hysteresis vs. Vin level (V_DD= 3.3 V, PMODE = 0)

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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Freescale Semiconductor, Inc.

PWMs and timers

0.18

0.16

0.14

0.12

HYSTCTR

Setting

0.1

00

01

10

11

0.08

0.06

0.04

0.02

0

0.1

0.4

0.7

1

1.3

1.6

1.9

2.2

2.5

2.8

3.1

Vin level (V)

Figure 13. Typical hysteresis vs. Vin level (V_DD= 3.3 V, PMODE = 1)

9.6 PWMs and timers

9.6.1 Enhanced NanoEdge PWM characteristics

Table 32. NanoEdge PWM timing parameters

Characteristic

Symbol

pwmp

t_pu

Min

Typ

80

Max

Unit

MHz

ps

PWM clock frequency

77.5

82.5

NanoEdge Placement (NEP) Step Size^{1, 2}

Delay for fault input activating to PWM output deactivated

Power-up Time³

390

1

ns

25

µs

1. Reference IPbus clock of 80 MHz in NanoEdge Placement mode.

2. Temperature and voltage variations do not affect NanoEdge Placement step size.

3. Powerdown to NanoEdge mode transition.

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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61

PWMs and timers

9.6.2 Quad Timer timing

Parameters listed are guaranteed by design.

Table 33. Timer timing

Characteristic

Timer input period

Symbol

P_IN

Min¹

2T + 6

1T + 3

25

Max

—

Unit

ns

See Figure

Figure 14

Timer input high/low period

Timer output period

P_INHL

P_OUT

—

ns

—

ns

Timer output high/low period

P_OUTHL

12.5

—

ns

1. T = clock cycle. For 80 MHz operation, T = 12.5 ns.

Timer Inputs

P

INHL

P

IN

Timer Outputs

P

OUTHL

P

OUT

Figure 14. Timer timing

9.7 Communication interfaces

9.7.1 Queued Serial Peripheral Interface (SPI) timing

Parameters listed are guaranteed by design.

Table 34. SPI timing

Characteristic

Cycle time

Master

Symbol

Min

Max

Unit

See Figure

Figure 15

Figure 16

Figure 17

Figure 18

t_C

45

—

ns

Slave

Table continues on the next page...

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Freescale Semiconductor, Inc.

PWMs and timers

Table 34. SPI timing (continued)

Characteristic

Enable lead time

Master

Symbol

Min

Max

Unit

See Figure

t_ELD

Figure 18

—

ns

Slave

Enable lag time

Master

t_ELG

Figure 18

—

ns

Slave

Clock (SCK) high time

Master

t_CH

Figure 15

Figure 16

Figure 17

Figure 18

20

—

ns

Slave

Clock (SCK) low time

t_CL

20

—

ns

Master

Slave

Data set-up time required for inputs

t_DS

Figure 15

Figure 16

Figure 17

Figure 18

Figure 15

Figure 16

Figure 17

Figure 18

20

1

—

ns

Master

Slave

Data hold time required for inputs

t_DH

1

3

—

ns

Master

Slave

Access time (time to data active

from high-impedance state)

t_A

5

—

ns

Slave

Disable time (hold time to high-

impedance state)

t_D

Figure 18

Slave

Data valid for outputs

Master

t_DV

Figure 15

Figure 16

Figure 17

Figure 18

Figure 15

Figure 16

Figure 17

Figure 18

—

6.25

18.7

ns

Slave (after enable edge)

Data invalid

Master

t_DI

0

—

ns

Slave

Table continues on the next page...

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63

PWMs and timers

Table 34. SPI timing (continued)

Characteristic

Symbol

Min

Max

Unit

See Figure

Figure 15

Figure 16

Figure 17

Figure 18

Figure 15

Figure 16

Figure 17

Figure 18

Rise time

Master

Slave

t_R

—

1

ns

Fall time

Master

Slave

t_F

—

1

ns

SS

(Input)

SS is held high on master

t

C

t

R

t

F

t

CL

SCLK (CPOL = 0)

(Output)

t

CH

t

F

t

R

t

CL

SCLK (CPOL = 1)

(Output)

t

DH

CH

t

DS

MISO

(Input)

MSB in

t

Bits 14–1

LSB in

t (ref)

DI

t

DI

DV

MOSI

(Output)

Master MSB out

Bits 14–1

Master LSB out

t

R

F

Figure 15. SPI master timing (CPHA = 0)

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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Freescale Semiconductor, Inc.

PWMs and timers

SS

(Input)

SS is held High on master

t

C

t

F

t

R

t

CL

SCLK (CPOL = 0)

(Output)

t

CH

t

F

t

CL

SCLK (CPOL = 1)

(Output)

t

CH

t

DS

t

R

t

DH

MISO

(Input)

MSB in

t

Bits 14–1

LSB in

t

(ref)

DI

t

DV

t (ref)

DV

DI

MOSI

(Output)

Master MSB out

Bits 14– 1

Master LSB out

t

R

F

Figure 16. SPI master timing (CPHA = 1)

SS

(Input)

t

C

t

F

t

ELG

t

CL

t

R

SCLK (CPOL = 0)

(Input)

t

CH

t

ELD

t

CL

SCLK (CPOL = 1)

(Input)

t

CH

t

F

t

A

R

t

D

MISO

(Output)

Slave MSB out

Bits 14–1

Slave LSB out

t

DS

DV

t

DI

t

DH

MOSI

(Input)

MSB in

Bits 14–1

LSB in

Figure 17. SPI slave timing (CPHA = 0)

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

65

PWMs and timers

SS

(Input)

t

F

t

C

t

R

t

CL

SCLK (CPOL = 0)

(Input)

t

CH

t

ELG

t

ELD

t

CL

SCLK (CPOL = 1)

(Input)

t

DV

CH

t

R

t

D

t

A

F

MISO

(Output)

Slave MSB out

Bits 14–1

Slave LSB out

t

DV

DS

t

DI

t

DH

MOSI

(Input)

MSB in

Bits 14–1

LSB in

Figure 18. SPI slave timing (CPHA = 1)

9.7.2 Queued Serial Communication Interface (SCI) timing

Parameters listed are guaranteed by design.

Table 35. SCI timing

Characteristic

Baud rate¹

Symbol

BR

Min

—

Max

Unit

Mbit/s

ns

See Figure

—

(f_MAX/16)

1.04/BR

RXD pulse width

TXD pulse width

RXD_PW

TXD_PW

0.965/BR

Figure 19

Figure 20

ns

LIN Slave Mode

Deviation of slave node clock from nominal F_{TOL_UNSYNCH}

clock rate before synchronization

-14

14

2

%

—

Deviation of slave node clock relative to

the master node clock after

synchronization

F_{TOL_SYNCH}

-2

Minimum break character length

T_BREAK

13

11

—

Master

node bit

periods

—

Slave node

bit periods

1. f_MAXis the frequency of operation of the SCI clock in MHz, which can be selected as the bus clock (max.160 MHz

depending on part number) or 2x bus clock (max. MHz) for the devices.

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

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Freescale Semiconductor, Inc.

PWMs and timers

RXD

SCI receive

data pin

RXD

PW

(Input)

Figure 19. RXD pulse width

TXD

SCI transmit

data pin

TXD

PW

(output)

Figure 20. TXD pulse width

9.7.3 Freescale’s Scalable Controller Area Network (FlexCAN)

Table 36. FlexCAN Timing Parameters

Characteristic

Baud Rate

Symbol

BR_CAN

Min

—

5

Max

1

Unit

Mbps

µs

CAN Wakeup dominant pulse filtered

CAN Wakeup dominant pulse pass

T_WAKEUP

2

—

µs

CAN_RX

CAN receive

data pin

T

WAKEUP

(Input)

Figure 21. Bus Wake-up Detection

9.7.4 Inter-Integrated Circuit Interface (I²C) timing

Table 37. I ²C timing

Characteristic

Symbol

Standard Mode

Minimum Maximum

100

Fast Mode

Unit

Minimum

Maximum

400

SCL Clock Frequency

f_SCL

0

kHz

µs

Hold time (repeated) START condition.

After this period, the first clock pulse is

generated.

t_HD; STA

4

—

0.6

—

LOW period of the SCL clock

HIGH period of the SCL clock

t_LOW

t_HIGH

4.7

4

—

1.3

0.6

—

µs

Set-up time for a repeated START

condition

t_SU; STA

4.7

Data hold time for I²C bus devices

t_HD; DAT

t_SU; DAT

t_r

0¹

250⁴

—

3.45²

—

0³

100², ⁵

0.9¹

—

µs

ns

Data set-up time

6

Rise time of SDA and SCL signals

1000

20 +0.1C_b

300

Table continues on the next page...

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67

Design Considerations

Table 37. I ²C timing (continued)

Characteristic

Symbol

Standard Mode

Minimum Maximum

300

Fast Mode

Unit

Minimum Maximum

5

Fall time of SDA and SCL signals

Set-up time for STOP condition

t_f

—

20 +0.1C_b

0.6

300

—

ns

µs

t_SU; STO

t_BUF

4

—

Bus free time between STOP and

START condition

4.7

1.3

—

Pulse width of spikes that must be

suppressed by the input filter

t_SP

N/A

0

50

ns

1. The master mode I²C deasserts ACK of an address byte simultaneously with the falling edge of SCL. If no slaves

acknowledge this address byte, then a negative hold time can result, depending on the edge rates of the SDA and SCL

lines.

2. The maximum tHD; DAT must be met only if the device does not stretch the LOW period (tLOW) of the SCL signal.

3. Input signal Slew = 10 ns and Output Load = 50 pF

4. Set-up time in slave-transmitter mode is 1 IPBus clock period, if the TX FIFO is empty.

5. A Fast mode I²C bus device can be used in a Standard mode I2C bus system, but the requirement t_{SU; DAT}≥ 250 ns must

then be met. This is automatically the case if the device does not stretch the LOW period of the SCL signal. If such a

device does stretch the LOW period of the SCL signal, then it must output the next data bit to the SDA line t_rmax+ t_{SU; DAT}

= 1000 + 250 = 1250 ns (according to the Standard mode I²C bus specification) before the SCL line is released.

6. C_b= total capacitance of the one bus line in pF.

SDA

t_{SU; DAT}

t_f

t_r

t_BUF

t_f

t_r

t_{HD; STA}

t_SP

t_LOW

SCL

t_{SU; STA}

t_{HD; STA}

t_{SU; STO}

S

SR

P

S

t_{HD; DAT}

t_HIGH

Figure 22. Timing definition for fast and standard mode devices on the I²C bus

10 Design Considerations

10.1 Thermal design considerations

An estimate of the chip junction temperature (TJ) can be obtained from the equation:

T_J= T_A+ (R_ΘJAx P_D)

Where,

T_A= Ambient temperature for the package (°C)

R_ΘJA= Junction-to-ambient thermal resistance (°C/W)

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

68

Freescale Semiconductor, Inc.

Design Considerations

P_D= Power dissipation in the package (W)

The junction-to-ambient thermal resistance is an industry-standard value that provides a

quick and easy estimation of thermal performance. Unfortunately, there are two values in

common usage: the value determined on a single-layer board and the value obtained on a

board with two planes. For packages such as the PBGA, these values can be different by

a factor of two. Which TJ value is closer to the application depends on the power

dissipated by other components on the board.

• The TJ value obtained on a single layer board is appropriate for a tightly packed

printed circuit board.

• The TJ value obtained on a board with the internal planes is usually appropriate if the

board has low-power dissipation and if the components are well separated.

When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-

case thermal resistance and a case-to-ambient thermal resistance:

R_ΘJA= R_ΘJC+ R_ΘCA

Where,

R_ΘJA= Package junction-to-ambient thermal resistance (°C/W)

R_ΘJC= Package junction-to-case thermal resistance (°C/W)

R_ΘCA= Package case-to-ambient thermal resistance (°C/W)

R_ΘJCis device related and cannot be adjusted. You control the thermal environment to

change the case to ambient thermal resistance, R_ΘCA. For instance, you can change the

size of the heat sink, the air flow around the device, the interface material, the mounting

arrangement on printed circuit board, or change the thermal dissipation on the printed

circuit board surrounding the device.

To determine the junction temperature of the device in the application when heat

sinks are not used, the thermal characterization parameter (YJT) can be used to

determine the junction temperature with a measurement of the temperature at the top

center of the package case using the following equation:

T_J= T_T+ (Ψ_JTx P_D)

Where,

T_T= Thermocouple temperature on top of package (°C/W)

Ψ_JT= hermal characterization parameter (°C/W)

P_D= Power dissipation in package (W)

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

69

Design Considerations

The thermal characterization parameter is measured per JESD51–2 specification using a

40-gauge type T thermocouple epoxied to the top center of the package case. The

thermocouple should be positioned so that the thermocouple junction rests on the

package. A small amount of epoxy is placed over the thermocouple junction and over

about 1 mm of wire extending from the junction. The thermocouple wire is placed flat

against the package case to avoid measurement errors caused by cooling effects of the

thermocouple wire.

To determine the junction temperature of the device in the application when heat

sinks are used, the junction temperature is determined from a thermocouple inserted at

the interface between the case of the package and the interface material. A clearance slot

or hole is normally required in the heat sink. Minimizing the size of the clearance is

important to minimize the change in thermal performance caused by removing part of the

thermal interface to the heat sink. Because of the experimental difficulties with this

technique, many engineers measure the heat sink temperature and then back-calculate the

case temperature using a separate measurement of the thermal resistance of the interface.

From this case temperature, the junction temperature is determined from the junction-to-

case thermal resistance.

10.2 Electrical design considerations

CAUTION

This device contains protective circuitry to guard against

damage due to high static voltage or electrical fields. However,

take normal precautions to avoid application of any voltages

higher than maximum-rated voltages to this high-impedance

circuit. Reliability of operation is enhanced if unused inputs are

tied to an appropriate voltage level.

Use the following list of considerations to assure correct operation of the device:

• Provide a low-impedance path from the board power supply to each V_DDpin on the

device and from the board ground to each V_SS(GND) pin.

• The minimum bypass requirement is to place 0.01–0.1 µF capacitors positioned as

near as possible to the package supply pins. The recommended bypass configuration

is to place one bypass capacitor on each of the V_DD/V_SSpairs, including V_DDA/V_SSA

Ceramic and tantalum capacitors tend to provide better tolerances.

• Ensure that capacitor leads and associated printed circuit traces that connect to the

chip V_DDand V_SS(GND) pins are as short as possible.

.

• Bypass the V_DDand V_SSwith approximately 100 µF, plus the number of 0.1 µF

ceramic capacitors.

• PCB trace lengths should be minimal for high-frequency signals.

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

70

Freescale Semiconductor, Inc.

Obtaining package dimensions

• Consider all device loads as well as parasitic capacitance due to PCB traces when

calculating capacitance. This is especially critical in systems with higher capacitive

loads that could create higher transient currents in the V_DDand V_SScircuits.

• Take special care to minimize noise levels on the V_REF, V_DDA, and V_SSApins.

• Using separate power planes for V_DDand V_DDAand separate ground planes for V_SS

and V_SSAare recommended. Connect the separate analog and digital power and

ground planes as near as possible to power supply outputs. If an analog circuit and

digital circuit are powered by the same power supply, then connect a small inductor

or ferrite bead in serial with V_DDA. Traces of V_SSand V_SSAshould be shorted

together.

• Physically separate analog components from noisy digital components by ground

planes. Do not place an analog trace in parallel with digital traces. Place an analog

ground trace around an analog signal trace to isolate it from digital traces.

• Because the flash memory is programmed through the JTAG/EOnCE port, SPI, SCI,

or I²C, the designer should provide an interface to this port if in-circuit flash

programming is desired.

• If desired, connect an external RC circuit to the RESET pin. The resistor value

should be in the range of 4.7 kΩ–10 kΩ; the capacitor value should be in the range of

0.22 µF–4.7 µF.

• Configuring the RESET pin to GPIO output in normal operation in a high-noise

environment may help to improve the performance of noise transient immunity.

• Add a 2.2 kΩ external pullup on the TMS pin of the JTAG port to keep EOnCE in a

restate during normal operation if JTAG converter is not present.

• During reset and after reset but before I/O initialization, all I/O pins are at tri-state.

• To eliminate PCB trace impedance effect, each ADC input should have a no less than

33 pF 10Ω RC filter.

11 Obtaining package dimensions

Package dimensions are provided in package drawings.

To find a package drawing, go to freescale.com and perform a keyword search for the

drawing’s document number:

Drawing for package

48-pin LQFP

Document number to be used

98ASH00962A

64-pin LQFP

98ASS23234W

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

71

Pinout

12 Pinout

12.1 Signal Multiplexing and Pin Assignments

This section shows the signals available on each package pin and the locations of these

pins on the devices supported by this document. The SIM's GPS registers are responsible

for selecting which ALT functionality is available on most pins.

NOTE

The RESETB pin is a 3.3 V pin only.

NOTE

If the GPIOC1 pin is used as GPIO, the XOSC should be

powered down.

NOTE

PWMB signals—including PWMB_2A, PWMB_2B, and

PWMB_3X—are not available on the 64 LQFP package or the

48 LQFP package.

64

48

Pin Name

Default

ALT0

ALT1

ALT2

ALT3

LQFP LQFP

1

2

1

2

TCK

GPIOD2

GPIOD4

EXTAL

XTAL

RESETB

GPIOC0

GPIOC1

GPIOC2

GPIOF8

GPIOC3

GPIOC4

GPIOA7

GPIOA6

GPIOA5

GPIOA4

GPIOA0

GPIOA1

GPIOA2

GPIOA3

GPIOB7

GPIOC5

GPIOB6

GPIOB5

RESETB

GPIOC0

GPIOC1

GPIOC2

GPIOF8

GPIOC3

GPIOC4

GPIOA7

GPIOA6

GPIOA5

GPIOA4

GPIOA0

GPIOA1

GPIOA2

GPIOA3

GPIOB7

GPIOC5

GPIOB6

GPIOB5

3

CLKIN0

4

5

TXD0

RXD0

TA0

TB0

XB_IN2

CMPD_O

RXD0

CLKO0

CLKIN1

6

—

6

TB1

7

CMPA_O

CMPB_O

8

7

TA1

XB_IN8

EWM_OUT_B

9

—

8

ANA7&ANC11

10

11

12

13

14

15

16

17

18

19

20

ANA6&ANC10

ANA5&ANC9

ANA4&ANC8&CMPD_IN0

ANA0&CMPA_IN3

9

CMPC_O

XB_IN7

10

11

12

—

13

—

ANA1&CMPA_IN0

ANA2&VREFHA&CMPA_IN1

ANA3&VREFLA&CMPA_IN2

ANB7&ANC15&CMPB_IN2

DACO

ANB6&ANC14&CMPB_IN1

ANB5&ANC13&CMPC_IN2

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

72

Freescale Semiconductor, Inc.

Pinout

64

48

Pin Name

Default

ALT0

ALT1

ALT2

ALT3

LQFP LQFP

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

14

15

16

17

18

19

20

21

—

22

23

24

25

26

27

28

29

30

—

31

32

33

34

35

36

37

38

39

40

—

41

42

43

—

44

45

GPIOB4

VDDA

GPIOB4

VDDA

ANB4&ANC12&CMPC_IN1

VSSA

GPIOB0

GPIOB1

VCAP

GPIOB0

GPIOB1

VCAP

ANB0&CMPB_IN3

ANB1&CMPB_IN0

GPIOB2

GPIOB3

VDD

GPIOB2

GPIOB3

VDD

ANB2&VREFHB&CMPC_IN3

ANB3&VREFLB&CMPC_IN0

VSS

GPIOC6

GPIOC7

GPIOC8

GPIOC9

GPIOC10

GPIOF0

GPIOC11

GPIOC12

GPIOF2

GPIOF3

GPIOF4

GPIOF5

VSS

GPIOC6

GPIOC7

GPIOC8

GPIOC9

GPIOC10

GPIOF0

GPIOC11

GPIOC12

GPIOF2

GPIOF3

GPIOF4

GPIOF5

VSS

TA2

XB_IN3

TXD0

CMP_REF

XB_IN9

SS0_B

MISO0

SCLK0

MOSI0

XB_IN6

CANTX

CANRX

SCL1

RXD0

XB_IN4

XB_IN5

TB2

MISO0

SCLK1

TXD1

SCL1

SDA1

RXD1

XB_OUT6

XB_OUT7

XB_OUT8

XB_OUT9

SDA1

TXD1

RXD1

VDD

GPIOE0

GPIOE1

GPIOE2

GPIOE3

GPIOC13

GPIOF1

GPIOE4

GPIOE5

GPIOE6

GPIOE7

GPIOC14

GPIOC15

VCAP

GPIOE0

GPIOE1

GPIOE2

GPIOE3

GPIOC13

GPIOF1

GPIOE4

GPIOE5

GPIOE6

GPIOE7

GPIOC14

GPIOC15

VCAP

PWMA_0B

PWMA_0A

PWMA_1B

PWMA_1A

TA3

XB_IN6

XB_IN7

XB_IN2

XB_IN3

XB_IN4

XB_IN5

XB_OUT4

XB_OUT5

EWM_OUT_B

CMPD_O

CLKO1

PWMA_2B

PWMA_2A

PWMA_3B

PWMA_3A

SDA0

SCL0

GPIOF6

GPIOF7

VDD

GPIOF6

GPIOF7

VDD

TB2

TB3

PWMA_3X

CMPC_O

XB_IN2

XB_IN3

SS1_B

VSS

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

73

Pinout

64

48

Pin Name

Default

ALT0

ALT1

ALT2

ALT3

LQFP LQFP

62

63

64

46

47

48

TDO

TMS

TDI

TDO

TMS

TDI

GPIOD1

GPIOD3

GPIOD0

12.2 Pinout diagrams

The following diagrams show pinouts for the packages. For each pin, the diagrams show

the default function. However, many signals may be multiplexed onto a single pin.

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

74

Freescale Semiconductor, Inc.

Pinout

TCK

RESETB

GPIOC0

GPIOC1

GPIOC2

GPIOF8

GPIOC3

GPIOC4

GPIOA7

GPIOA6

GPIOA5

GPIOA4

GPIOA0

GPIOA1

GPIOA2

GPIOA3

1

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

GPIOE3

GPIOE2

GPIOE1

GPIOE0

VDD

2

3

4

5

6

VSS

7

GPIOF5

GPIOF4

GPIOF3

GPIOF2

GPIOC12

GPIOC11

GPIOF0

GPIOC10

GPIOC9

GPIOC8

8

9

10

11

12

13

14

15

16

Figure 23. 64-pin LQFP

NOTE

The RESETB pin is a 3.3 V pin only.

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

75

Pinout

GPIOE3

GPIOE2

GPIOE1

GPIOE0

VDD

36

35

34

33

32

31

30

29

28

27

26

25

TCK

RESETB

GPIOC0

GPIOC1

GPIOC2

GPIOC3

GPIOC4

GPIOA4

GPIOA0

GPIOA1

GPIOA2

GPIOA3

1

2

3

4

5

VSS

6

GPIOC12

GPIOC11

GPIOF0

GPIOC10

GPIOC9

GPIOC8

7

8

9

10

11

12

Figure 24. 48-pin LQFP

NOTE

The RESETB pin is a 3.3 V pin only.

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

76

Freescale Semiconductor, Inc.

Product documentation

13 Product documentation

The documents listed in Table 38 are required for a complete description and proper

design with the device. Documentation is available from local Freescale distributors,

Freescale Semiconductor sales offices, or online at freescale.com.

Table 38. Device documentation

Topic

Description

Document Number

DSP56800E/DSP56800EX

Reference Manual

Detailed description of the 56800EX family architecture, 32-bit

digital signal controller core processor, and the instruction set

DSP56800ERM

MC56F8455x Reference Manual Detailed functional description and programming model

MC56F8455XRM

MC56F8455X

MC56F8455x Data Sheet

Electrical and timing specifications, pin descriptions, and

package information (this document)

MC56F84xxx Errata

Details any chip issues that might be present

MC56F84XXX_0N27E

14 Revision history

The following table summarizes changes to this document since the release of the

previous version.

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

Freescale Semiconductor, Inc.

77

Revision history

Table 39. Revision history

Rev.

Date

06/2014 Changes include:

• Correction to "PWMs and timers" feature group on page 1

Substantial Changes

3

• Updates and corrections to "56F844xx/5xx/7xx family" table.

• In "Interrupt Controller" section, added info about Interrupt level 3.

• In "Enhanced Flex Pulse Width Modulator (eFlexPWM)" section,

• Upated PWM frequencies based on device frequency, plus updated resolution of

fractional clock digital dithering.

• Updated feature list.

• Added new section "MC56F844xx signal and pin descriptions".

• In "Signal groups" section, in "Functional Group Pin Allocations" table, made corrections to

"Functional Group Pin Allocations" table.

• In "Voltage and current operating requirements" section, added RESET voltage high to

"Recommended Operating Conditions" table.

• In "Voltage and current operating behaviors" section, in "DC Electrical Characteristics" table,

updated Digital Input Current High for Pin Group 2.

• For "Power mode transition operating behaviors" section,

• Changed the name to "Power mode operating behaviors".

• In "Reset, Stop, Wait, and Interrupt Timing" table, updated "RESET deassertion to First

Address Fetch" parameters.

• Added new table "Power-On-Reset mode transition times".

• In "Power consumption operating behaviors" section, updated mode currrent values in

"Current Consumption" table.

• In "JTAG Timing" section, changed "TCK frequency of operation" to SYS_CLK/16 from

SYS_CLK/8.

• In "System modules" section, in "Voltage regulator specifications" section, in "Regulator 1.2 V

parameters" table, updated "Short Circuit Current" parameter.

• In "Relaxation Oscillator Timing" section, updates in "Relaxation Oscillator Electrical

Specifications" table.

• In "Memories and memory interfaces" section,

• "Flash Memory Characteristics" section is now called "Flash electrical specifications"

section.

• Added new section "Flash timing specifications — program and erase", where the

"Flash Timing Parameters" table (now called "NVM program/erase timing specifications"

table, and table was updated.

• Added new section "Flash high voltage current behaviors".

• In "Analog" section, in "12-bit cyclic Analog-to-Digital Converter (ADC) parameters" section,

updated "12-bit ADC electrical specifications" table.

• In "Pinout" section, in "Signal Multiplexing and Pin Assignments" section,

• Added 3 notes.

• In pin mux table, changed SCK0 to SCLK0, SCK1 to SCLK1, updates to 64LQFP[62-64]

and 48LQFP[46-48].

• In "64-pin LQFP" figure, made updates to pins 62-64, and added a note.

• In "48-pin LQFP" figure, made updates to pins 46-48, and added a note.

• In "Product Documentation" section, in "Device Documentation" table, removed Serial

Bootloader User Guide, because it is not used for these devices.

MC56F8455X / MC56F8454X Data Sheet, Rev. 3, 06/2014.

78

Freescale Semiconductor, Inc.

Information in this document is provided solely to enable system and software

implementers to use Freescale Semiconductors products. There are no express or implied

copyright licenses granted hereunder to design or fabricate any integrated circuits or

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Document Number: MC56F8455X

Rev. 3, 06/2014


型号：	MC56F84550VLFR
厂家：	NXP
描述：	32-bit DSC, 56800EX core, 96KB Flash, 80MHz, QFP 48 时钟微控制器外围集成电路
文件：	总79页 (文件大小：1263K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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