MF2MOC1D80/D0XXYY [NXP]
IC SPECIALTY CONSUMER CIRCUIT, XMA8, SOT-507AA1, 8 PIN, Consumer IC:Other;
| 型号： | MF2MOC1D80/D0XXYY |
| 厂家： | 
NXP |
| 描述： | IC SPECIALTY CONSUMER CIRCUIT, XMA8, SOT-507AA1, 8 PIN, Consumer IC:Other 商用集成电路 |
| 文件： | 总9页 (文件大小：145K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
SHORT FORM SPECIFICATION
MF2 ICD8x
Dual Interface Smart Card IC
Short Form Specification
Revision 1.0
July 2000
Philips Semiconductors
Short Form Specification Revision 1.0 July 2000
Dual Interface Smart Card IC
MF2 ICD8x
CONTENTS
1
DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
1.1.1
1.1.2
Different Configurations of the MF2 ICD8x . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Configuration A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Configuration B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
BLOCK DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
FEATURES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
ORDERING INFORMATION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
PINNING INFORMATION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Smart Card contacts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3
4
5
5.1
Note:
Specification may be changed without further notice.
2
Philips Semiconductors
Short Form Specification Revision 1.0 July 2000
Dual Interface Smart Card IC
MF2 ICD8x
1
DESCRIPTION
The 80C51 micro-controller operates both in contact and
in contactless mode. Thus, in both interface modes users
define the final function of the card with their operating
system. This allows the same level of security and
flexibility for both the contact (ISO 7816) interface as well
as the contactless (MIFARE®; ISO 14443/Type A)
interface. For the development of the card operating
systems all necessary tools are available based on the
Ashling tool platform.
The MIFARE® PRO card IC is a microprocessor based
chip combining contactless smart card technology based
on the MIFARE® contactless system and standard contact
smart card technology on a single chip (dual interface).
This chip is compatible with the MIFARE® architecture
platform. Compatibility with existing MIFARE® reader
modules and the optional emulation modes of MIFARE® S
and MIFARE® PLUS enable fast system integration of
MIFARE® PRO based cards.
The Triple-DES co-processor together with the fast
MIFARE® interface offer high security and speed in
contactless and contact smart card applications. The field
proven MIFARE® modulation and communication
technique provides reliable communication and secure
processing, even in electro-magnetically harsh
environments like in buses or train stations.
Physical construction and dimensions of the MIFARE®
PRO IC allows the production of ISO cards (ISO 7816-1).
Compared to a contact only card an antenna has to be
added in the peripheral zone of the card (see Figure 1).
The antenna consists of a few turns of a printed, etched or
wired coil which is directly connected to the two
contactless interface pins of the MIFARE® PRO module.
antenna
dual interface module with
MIFARE® PRO
Fig.1 MIFARE® PRO card.
3
Philips Semiconductors
Short Form Specification Revision 1.0 July 2000
Dual Interface Smart Card IC
MF2 ICD8x
1.1
Different Configurations of the MF2 ICD8x
Depending on the application requirements the MIFARE® PRO can be configured in two different ways. The configuration
has impact on the memory organization of the ROM and on the access conditions for the EEPROM and influences the
user OS development. The selected configuration is part of the user ROM mask, that contains also the user OS code.
Three different configurations (A, B1, B4) are possible and shown in Table 1.
OS16
OS20
(user OS)
(user OS)
mifare 1 OS
CONFIGURATION A
CONFIGURATION B
Fig.2 ROM mapping in different configurations of MF2 ICD8x.
4
Philips Semiconductors
Short Form Specification Revision 1.0 July 2000
Dual Interface Smart Card IC
MF2 ICD8x
1.1.1
CONFIGURATION A
The remaining 16 Kbytes ROM are available for a dual
interface user operating system (OS16). For secure
separation of both operating systems the dedicated built in
hardware protection controls access to the EEPROM and
4 Kbytes MIFARE® ROM. For detailed explanation of
MIFARE® S and MIFARE® PLUS functionality please refer
also to the following documents:
In configuration A the full 20 Kbytes ROM memory is
available for a dual interface user operating system
(OS20). The EEPROM management and configuration is
fully up to the user OS (OS20). The MIFARE® PRO type
number MF2 ICD80...... defines configuration A.
• MIFARE® MF CM500 Product Specification
1.1.2
CONFIGURATION B
• MIFARE® Standard IC MF1 ICS50 Functional
Specification
• MIFARE® PLUS, MF1 P60 General Description, Smart
Card IC for Contact and Contactless Operation.
In configuration B the lower 4 Kbytes of the user ROM
memory are used for the contactless MIFARE® 1
operating system provided by Philips. With this MIFARE®
1 OS the MIFARE® S and MIFARE® PLUS functionality
may be emulated on the MIFARE® PRO. Here different
hardware secured configurations of the EEPROM memory
are supported. This flexibility allows to combine the new
features of MIFARE® PRO with the requirements of
existing applications and infrastructure.
The MIFARE® PRO type number MF2 ICD81...... defines
configuration B1 with emulation of MIFARE® S and
1 Kbyte EEPROM with MIFARE® mapping.
The MIFARE® PRO type number MF2 ICD84...... defines
configuration B4 with emulation of MIFARE® PLUS and
4 Kbytes EEPROM with MIFARE® mapping.
Table 1
CONFIGURATION PART NUMBER
ROM
EEPROM
RAM
A
MF2 ICD80...
MF2 ICD81...
20 Kbytes for user OS
16 Kbytes for user OS
8 Kbytes for access with user OS
7 Kbytes for access with user OS
256 bytes
B1
4 Kbytes for MIFARE1 OS 1 Kbyte for access with MIFARE1 OS
and user OS, configurable
B4
MF2 ICD84...
16 Kbytes for user OS
4 Kbytes for access with user OS
4 Kbytes for MIFARE1 OS 4 Kbytes for access with user OS and
MIFARE OS, configurable
5
Philips Semiconductors
Short Form Specification Revision 1.0 July 2000
Dual Interface Smart Card IC
MF2 ICD8x
2
BLOCK DIAGRAM
ROM
SECURITY LOGIC
AND SENSORS
INTERFACE
CONTACT
INTERFACE
(ISO7816)
TEST ROM
ISO
CONTACTS
4 KBYTES ROM1
16 KBYTES ROM2
MANAGEMENT
EEPROM
8 KBYTES
RF INTERFACE
(MIFARE®,
MIFARE®
COIL
80C51 CPU
ISO 14443)
(ISO 14443)
DATA &
PROGRAM
MEMORY
RAM
256 BYTES
CONTACTLESS
INTERFACE
UNIT
TRIPLE-DES
CO-PROCESSOR
DATA
MEMORY
Fig.3 Block diagram of MF2 ICD8x.
6
Philips Semiconductors
Short Form Specification Revision 1.0 July 2000
Dual Interface Smart Card IC
MF2 ICD8x
3
FEATURES
• Advanced security features
– ROM code not visible due to implantation
– Low supply voltage sensor (LVS)
– High supply voltage sensor (HVS)
– Low clock frequency sensor (LFS)
– High clock frequency sensor (HFS)
– High temperature sensor (HTS)
– Unique serial number (hardware protected)
– FabKey per individual die
• 80C51 8-bit micro-controller core operating in contact
and contactless mode on a single chip
• Low power, high speed Triple-DES co-processor for
contactless and contact operation
– Triple-DES calculation speed (with keys loaded):
175 µs in contactless mode
– Single DES calculation speed (with keys loaded):
125 µs in contactless mode
• Low power / low voltage design
• 20 (16) Kbytes user ROM
• 256 bytes RAM
• Custom specific EEPROM initialisation
• Supply voltage: 2.7 V - 5.5 V
• Operating temperature: -25 to + 70 °C
• 8 Kbytes EEPROM
• 3.5 kV ESD protection on ISO pads according to MIL
Standard 883-C, method 3015
– Stores data or program code
– 32 byte pages
– 8 bytes security area (write once memory)
– Minimum of 100.000 write/erase cycles
– Data retention for minimum of 10 years
– EEPROM programming voltage generated on chip
• Power saving modes
– Power-down and Idle mode
• 2 vectorised interrupt sources from
– EEPROM
– IO transition
• Clock frequency range 1 to 5 MHz
• Contact configuration and serial interface according to
ISO 7816
• MIFARE® RF contactless interface as suggested by
ISO/IEC 14443 Type A
– 13.56 MHz operating frequency
– Reliable communication
– High speed (106 kBaud, efficient frame support)
– True anticollision
– High speed CRC co-processor according to CCITT
• MIFARE® reader module compatibility
• MIFARE® S and MIFARE® PLUS emulation modes
7
Philips Semiconductors
Short Form Specification Revision 1.0 July 2000
Dual Interface Smart Card IC
MF2 ICD8x
4
ORDERING INFORMATION
TYPE NUMBER(1)
PACKAGE
TEMPERATURE
RANGE (°C)
NAME
DESCRIPTION
VERSION
MF2 MOC1 D80/D0xxyy
MF2 MOC1 D81/DMxxyy
MF2 MOC1 D84/DMxxyy
MF2ICD8000W/P5Dxxyy
MF2ICD8101W/P5Dxxyy
MF2ICD8401W/P5Dxxyy
Dual Interface Modules on super 35 mm
film (8-contact)
Module
FFC
SOT507AA1
-25 to +70
sawn wafer on film frame carrier
−
5
PINNING INFORMATION
Smart Card contacts
5.1
VCC
C1
C5
GND
RST
CLK
N.C.
I/O
C2
C3
C6
C7
*
LB
*
LA
N.C.
N.C.
C4
C8
*
Antenna contacts are placed on module backside
Fig.4 ISO contact assignments for SOT507AA1
Table 2 Pin description
ISO 7816
MF2 ICD8x
CONTACTS
SYMBOL
SYMBOL
DESCRIPTION
C1
C2
C3
C4
C5
C6
C7
C8
−
VCC
RST
VDD
RST
CLK
N.C.
VSS
N.C.
I/O
Power supply voltage input
Reset input, active LOW
Clock input
CLK
reserved
GND
reserved
I/O
not connected
Ground (reference voltage) input
not connected
Input/Output for serial data
not connected
reserved
−
N.C.
LA
antenna coil connection
antenna coil connection
−
−
LB
8
Philips Semiconductors – a worldwide company
Argentina: see South America
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,
Fax. +43 160 101 1210
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Belgium: see The Netherlands
Brazil: see South America
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Portugal: see Spain
Romania: see Italy
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Colombia: see South America
Czech Republic: see Austria
Slovakia: see Austria
Slovenia: see Italy
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 0044
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920
South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Uruguay: see South America
Vietnam: see Singapore
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Internet: http://www.semiconductors.philips.com
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1997
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
相关型号：
MF2WS1011BTR
Fixed Resistor, Metal Film, 2W, 1010ohm, 500V, 0.1% +/-Tol, 50ppm/Cel, Through Hole Mount, AXIAL LEADED, ROHS COMPLIANT
MERITEK
MF2WS1020DTR
Fixed Resistor, Metal Film, 2W, 102ohm, 500V, 0.5% +/-Tol, 50ppm/Cel, Through Hole Mount, AXIAL LEADED, ROHS COMPLIANT
MERITEK
MF2WS1021BTR
Fixed Resistor, Metal Film, 2W, 1020ohm, 500V, 0.1% +/-Tol, 50ppm/Cel, Through Hole Mount, AXIAL LEADED, ROHS COMPLIANT
MERITEK
MF2WS1021FTR
Fixed Resistor, Metal Film, 2W, 1020ohm, 500V, 1% +/-Tol, 50ppm/Cel, Through Hole Mount, AXIAL LEADED, ROHS COMPLIANT
MERITEK
©2020 ICPDF网 联系我们和版权申明