MPX100AP [NXP]
Peizoresistive Sensor;型号: | MPX100AP |
厂家: | NXP |
描述: | Peizoresistive Sensor 传感器 换能器 |
文件: | 总8页 (文件大小:329K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Freescale Semiconductor, Inc.
Order this document
by MPX100/D
EMICONDUCTOR TECHNICAL DATA
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
The MPX100 series device is a silicon piezoresistive pressure sensor providing a very
accurate and linear voltage output — directly proportional to the applied pressure. This
standard, low cost, uncompensated sensor permits manufacturers to design and add
their own external temperature compensating and signal conditioning networks.
Compensation techniques are simplified because of the predictability of Motorola’s single
element strain gauge design.
0 to 100 kPa (0–14.5 psi)
60 mV FULL SCALE SPAN
(TYPICAL)
Features
•
•
•
•
•
•
•
Low Cost
Patented, Silicon Shear Stress Strain Gauge Design
Easy to Use Chip Carrier Package Options
Ratiometric to Supply Voltage
60 mV Span (Typ)
BASIC CHIP
CARRIER ELEMENT
CASE 344–15, STYLE 1
Absolute, Differential and Gauge Options
±0.25% Linearity (Max)
Application Examples
•
•
•
•
•
•
•
Pump/Motor Controllers
Robotics
Level Indicators
Medical Diagnostics
Pressure Switching
Barometers
DIFFERENTIAL
PORT OPTION
Altimeters
CASE 344C–01, STYLE 1
Figure 1 illustrates a schematic of the internal circuitry on the stand–alone pressure
sensor chip.
NOTE: Pin 1 is the notched pin.
PIN 3 + V
S
PIN NUMBER
PIN 2
+ V
1
2
Gnd
+V
3
4
V
S
out
X–ducer
–V
out
out
PIN 4
– V
out
PIN 1
Figure 1. Uncompensated Pressure Sensor Schematic
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the X–ducer is directly proportional to the differential
pressure applied.
The absolute sensor has a built–in reference vacuum. The output voltage will decrease
as vacuum, relative to ambient, is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor increases with increasing
pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly,
output voltage increases as increasing vacuum is applied to the vacuum (P2) side
relative to the pressure (P1) side.
X–ducer is a trademark of Motorola, Inc.
REV 6
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MAXIMUM RATINGS
Rating
Symbol
Value
Unit
(8)
Overpressure (P1 > P2)
P
max
200
kPa
(8)
Burst Pressure (P1 > P2)
P
1000
kPa
°C
burst
Storage Temperature
Operating Temperature
T
–40 to +125
–40 to +125
stg
T
A
°C
OPERATING CHARACTERISTICS (V = 3.0 Vdc, T = 25°C unless otherwise noted, P1 > P2)
S
A
Characteristic
Symbol
Min
Typ
Max
Unit
(1)
Pressure Range
P
OP
0
—
100
kPa
(2)
Supply Voltage
Supply Current
Full Scale Span
V
—
—
3.0
6.0
60
6.0
—
Vdc
mAdc
mV
S
I
o
(3)
V
FSS
45
90
(4)
Offset
V
off
0
20
35
mV
Sensitivity
∆V/∆P
—
—
0.6
—
—
mV/kPa
(5)
Linearity
–0.25
—
0.25
—
%V
%V
%V
FSS
FSS
FSS
(5)
Pressure Hysteresis (0 to 100 kPa)
—
±0.1
±0.5
—
(5)
Temperature Hysteresis (–40°C to +125°C)
—
—
—
(6)
Temperature Coefficient of Full Scale Span
TCV
–0.22
—
–0.16
—
%V
/°C
FSS
FSS
(5)
Temperature Coefficient of Offset
TCV
±15
—
µV/°C
off
(5)
Temperature Coefficient of Resistance
TC
0.21
400
750
—
0.27
550
1875
—
%Z /°C
R
in
Input Impedance
Z
in
—
Ω
Ω
Output Impedance
Z
out
—
(6)
Response Time (10% to 90%)
t
R
1.0
20
ms
ms
Warm–Up
—
—
—
—
(9)
Offset Stability
—
±0.5
—
%V
FSS
MECHANICAL CHARACTERISTICS
Characteristic
Symbol
Min
Typ
Max
Unit
Weight (Basic Element Case 344–15)
—
—
2.0
—
Grams
kPa
(7)
Common Mode Line Pressure
—
—
—
690
NOTES:
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self–heating.
3. Full Scale Span (V
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
FSS
minimum rated pressure.
4. Offset (V ) is defined as the output voltage at the minimum rated pressure.
off
5. Accuracy (error budget) consists of the following:
•
•
Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
•
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
•
•
TcSpan:
TcOffset:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
to 25°C.
•
TCR:
Z deviation with minimum rated pressure applied, over the temperature range of –40°C to +125°C,
in
relative to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Common mode pressures beyond specified may result in leakage at the case–to–lead interface.
8. Exposure beyond these limits may cause permanent damage or degradation to the device.
9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
2
Motorola Sensor Device Data
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LINEARITY
proportional to the pressure applied to the device. This de-
vice uses a unique transverse voltage diffused semiconduc-
tor strain gauge which is sensitive to stresses produced in a
thin silicon diaphragm by the applied pressure.
Linearity refers to how well a transducer’s output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range (see Figure 2). There are two basic methods
for calculating nonlinearity: (1) end point straight line fit or (2)
a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worse case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola’s
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to differ-
ences in the thermal expansion of the strain gauge and the
diaphragm, as are often encountered in bonded strain gauge
pressure sensors. However, the properties of the strain
gauge itself are temperature dependent, requiring that the
device be temperature compensated if it is to be used over
an extensive temperature range.
Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components
or by designing your system using the MPX2100 series
sensors.
TEMPERATURE COMPENSATION
Figure 3 shows the typical output characteristics of the
MPX100 series over temperature.
Several approaches to external temperature compensa-
tion over both –40 to +125°C and 0 to +80°C ranges are
presented in Motorola Applications Note AN840.
The X–ducer piezoresistive pressure sensor element is a
semiconductor device which gives an electrical output signal
70
LINEARITY
60
70
–40°C
V = 3.0 Vdc
S
60
50
40
30
20
10
0
+25°C
SPAN
RANGE
(TYP)
P1 > P2
50
ACTUAL
+125°C
40
SPAN
(V
FSS
)
30
20
THEORETICAL
OFFSET
(TYP)
10
0
OFFSET
(V
)
OFF
0
2.0 4.0
6.0 8.0 10
12 14
16
PSI
kPa
10 20 30 40 50 60 70 80 90 100
0
MAX
P
OP
PRESSURE (kPA)
PRESSURE DIFFERENTIAL
Figure 2. Linearity Specification Comparison
Figure 3. Output versus Pressure Differential
SILICONE GEL DIFFERENTIAL/GAUGE
SILICONE GEL
DIE COAT
ABSOLUTE
STAINLESS STEEL
METAL COVER
STAINLESS STEEL
METAL COVER
DIE COAT
DIE
DIE
P1
P1
EPOXY
CASE
EPOXY
CASE
WIRE BOND
LEAD FRAME
WIRE BOND
DIE
BOND
LEAD FRAME
DIE
BOND
DIFFERENTIAL/GAUGE ELEMENT
P2
ABSOLUTE ELEMENT
P2
Figure 4. Cross–Sectional Diagrams (Not to Scale)
Figure 4 illustrates the absolute sensing configuration
(right) and the differential or gauge configuration in the basic
chip carrier (Case 344–15). A silicone gel helps protect the
die surface and wire bond from the environment, while allow-
ing the pressure signal to be transmitted to the silicon dia-
phragm.
The MPX100 series pressure sensor operating character-
istics and internal reliability and qualification tests are based
on use of dry air as the pressure media. Media other than dry
air may have adverse effects on sensor performance and
long term reliability. Contact the factory for information re-
garding media compatibility in your application.
Motorola Sensor Device Data
3
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PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
pressure applied, P1 > P2. The absolute sensor is designed
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The differential or
gauge sensor is designed to operate with positive differential
for vacuum applied to P1 side.
The Pressure (P1) side may be identified by using the
table below:
Part Number
MPX100A, MPX100D
Case Type
Pressure (P1) Side Identifier
Stainless Steel Cap
344–15C
344C–01
344B–01
344E–01
344F–01
MPX100DP
Side with Part Marking
MPX100AP, MPX100GP
MPX100AS
Side with Port Attached
Side with Port Attached
Side with Port Attached
MPX100ASX
ORDERING INFORMATION
MPX100 series pressure sensors are available in absolute, differential and gauge configurations. Devices are available in the
basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pres-
sure connections.
Device Type
Options
Case Type
Case 344–15
MPX Series
MPX100A
Device Marking
MPX100A
Basic Element
Absolute, Differential
MPX100D
MPX100D
Ported Elements
Differential
Case 344C–01
Case 344B–01
MPX100DP
MPX100DP
Absolute, Gauge
MPX100AP
MPX100GP
MPX100AP
MPX100GP
Absolute, Gauge Stove Pipe
Absolute, Gauge Axial
Case 344E–01
Case 344F–01
MPX100AS
MPX100GS
MPX100A
MPX100D
MPX100ASX
MPX100GSX
MPX100A
MPX100D
4
Motorola Sensor Device Data
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PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
C
R
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION –A– IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
M
Z
1
4
2
3
INCHES
DIM MIN MAX
0.630
MILLIMETERS
B
–A–
MIN
MAX
16.00
13.56
5.59
A
B
C
D
F
0.595
0.514
0.200
0.016
0.048
15.11
N
0.534 13.06
L
1
2
3
4
0.220
0.020
0.064
5.08
0.41
1.22
PIN 1
0.51
1.63
–T–
SEATING
PLANE
G
J
0.100 BSC
2.54 BSC
F
0.014
0.695
0.016
0.725 17.65
0.36
0.40
G
J
L
M
N
R
Y
Z
18.42
30 NOM
F
Y
30 NOM
D 4 PL
0.475
0.430
0.048
0.106
0.495 12.07
0.450 10.92
0.052
0.118
12.57
11.43
1.32
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. “F” 8 PL
M
M
0.136 (0.005)
T A
1.22
2.68
3.00
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. – OUTPUT
CASE 344–15
ISSUE Z
NOTES:
–A–
U
SEATING
PLANE
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5, 1982.
2. CONTROLLING DIMENSION: INCH.
–T–
L
R
INCHES
DIM MIN MAX
MILLIMETERS
H
MIN
1.175 29.08
0.715 17.40
MAX
29.85
18.16
8.26
0.51
1.63
A
B
C
D
F
1.145
0.685
0.305
0.016
0.048
N
B
PORT #1
0.325
0.020
0.064
7.75
0.41
1.22
–Q–
POSITIVE
PRESSURE
(P1)
G
H
J
0.100 BSC
2.54 BSC
0.182
0.014
0.695
0.290
0.420
0.153
0.153
0.230
0.220
0.194
0.016
4.62
0.36
0.725 17.65
0.300 7.37
0.440 10.67
4.93
0.41
18.42
7.62
11.18
4.04
4.04
6.35
6.10
K
L
N
P
1
2
3 4
PIN 1
K
0.159
0.159
0.250
0.240
3.89
3.89
5.84
5.59
–P–
Q
R
S
S
M
S
0.25 (0.010)
T Q
J
F
U
0.910 BSC
23.11 BSC
G
C
D 4 PL
M
S
S
0.13 (0.005)
T S
Q
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. – OUTPUT
CASE 344B–01
ISSUE B
Motorola Sensor Device Data
5
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PACKAGE DIMENSIONS — CONTINUED
NOTES:
–A–
U
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
V
PORT #1
W
L
R
H
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
PORT #2
PORT #1
POSITIVE PRESSURE
(P1)
PORT #2
VACUUM
(P2)
A
B
C
D
F
G
H
J
1.145 1.175 29.08 29.85
0.685 0.715 17.40 18.16
0.405 0.435 10.29
0.016 0.020
0.048 0.064
0.100 BSC
0.182 0.194
0.014 0.016
N
11.05
0.51
1.63
–Q–
0.41
1.22
2.54 BSC
SEATING
PLANE
SEATING
PLANE
B
4.62
0.36
4.93
0.41
1
2 3 4
K
L
0.695 0.725 17.65 18.42
0.290 0.300
PIN 1
K
7.37
7.62
11.18
4.04
4.04
2.11
–P–
N
P
Q
R
S
U
V
W
0.420 0.440 10.67
M
S
0.25 (0.010)
T Q
0.153 0.159
0.153 0.159
0.063 0.083
0.220 0.240
0.910 BSC
3.89
3.89
1.60
5.59
–T–
–T–
S
F
J
6.10
G
C
23.11 BSC
D 4 PL
0.248 0.278
0.310 0.330
6.30
7.87
7.06
8.38
M
S
S
0.13 (0.005)
T S
Q
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. – OUTPUT
CASE 344C–01
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
PORT #1
C
A
POSITIVE
PRESSURE
(P1)
BACK SIDE
VACUUM
(P2)
INCHES
DIM MIN MAX
0.720 17.53
0.255 6.22
0.820 19.81
MILLIMETERS
MIN
MAX
18.28
6.48
A
B
C
D
F
0.690
0.245
0.780
0.016
0.048
–B–
V
20.82
0.51
1.63
3
2
1
0.020
0.064
0.41
1.22
4
PIN 1
G
J
K
N
R
S
0.100 BSC
2.54 BSC
0.014
0.345
0.300
0.178
0.220
0.182
0.016
0.375
0.310
0.186
0.240
0.194
0.36
8.76
7.62
4.52
5.59
4.62
0.41
9.53
7.87
4.72
6.10
4.93
K
S
V
J
N
G
STYLE 1:
F
R
–T–
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. – OUTPUT
D 4 PL
SEATING
PLANE
M
M
0.13 (0.005)
T B
CASE 344E–01
ISSUE B
6
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PACKAGE DIMENSIONS — CONTINUED
NOTES:
–T–
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
C
A
U
–Q–
E
INCHES
DIM MIN MAX
MILLIMETERS
MIN
MAX
28.45
19.30
16.51
0.51
A
B
C
D
E
F
1.080
0.740
0.630
0.016
0.160
0.048
1.120 27.43
0.760 18.80
0.650 16.00
0.020
0.180
0.064
0.41
4.06
1.22
N
S
B
R
4.57
V
1.63
G
J
K
N
P
Q
R
S
U
V
0.100 BSC
2.54 BSC
0.014
0.220
0.070
0.150
0.150
0.440
0.695
0.840
0.182
0.016
0.240
0.080
0.160
0.160
0.460
0.725 17.65
0.860 21.34
0.194
0.36
5.59
1.78
3.81
3.81
11.18
0.41
6.10
2.03
4.06
4.06
11.68
18.42
21.84
4.92
PORT #1
POSITIVE
PRESSURE
(P1)
PIN 1
–P–
M
M
0.25 (0.010)
T Q
4
3
2
1
K
4.62
F
J
G
STYLE 1:
D 4 PL
PIN 1. GROUND
2. V (+) OUT
3. V SUPPLY
4. V (–) OUT
M
S
S
0.13 (0.005)
T P
Q
CASE 344F–01
ISSUE B
Motorola Sensor Device Data
7
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