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MPXV5050GC6U [NXP]

Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated;
MPXV5050GC6U
型号： MPXV5050GC6U
厂家： NXP    NXP
描述：

Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

传感器 换能器
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Pressure  
MPX5050  
Rev 11, 03/2010  
Freescale Semiconductor  
Integrated Silicon Pressure Sensor  
On-Chip Signal Conditioned,  
Temperature Compensated and  
Calibrated  
The MPXx5050 series piezoresistive transducer is a state-of-the-art  
monolithic silicon pressure sensor designed for a wide range of applications,  
but particularly those employing a microcontroller or microprocessor with A/D  
inputs. This patented, single element transducer combines advanced  
micromachining techniques, thin-film metallization, and bipolar processing to  
provide an accurate, high level analog output signal that is proportional to the  
applied pressure.  
MPX5050  
MPXV5050  
MPVZ5050  
Series  
0 to 50 kPa (0 to 7.25 psi)  
0.2 to 4.7 V Output  
Features  
• 2.5% Maximum Error over 0° to 85°C  
• Ideally suited for Microprocessor or Microcontroller-Based Systems  
• Temperature Compensated Over -40° to +125°C  
• Patented Silicon Shear Stress Strain Gauge  
• Durable Epoxy Unibody Element  
• Easy-to-Use Chip Carrier Option  
ORDERING INFORMATION  
# of Ports  
Single  
Pressure Type  
Differential  
Case  
No.  
Device  
Marking  
Device Name  
None  
Dual  
Gauge  
Absolute  
Unibody Package (MPX5050 Series)  
MPX5050D  
867  
•
•
•
MPX5050D  
MPX5050DP  
MPX5050GP  
MPX5050GP  
MPX5050DP  
MPX5050GP  
MPX5050GP1  
867C  
867B  
867B  
•
•
•
•
•
Small Outline Package (MPXV5050 Series)  
MPXV5050GP  
1369  
1351  
482A  
482A  
•
•
MPXV5050GP  
MPXV5050DP  
MPXV5050G  
MPXV5050G  
MPXV5050DP  
•
•
MPXV5050GC6U  
MPXV5050GC6T1  
•
•
•
•
Small Outline Package (Media Resistant Gel) (MPVZ5050 Series)  
MPVZ5050GW7U  
1560  
•
•
MZ5050GW  
© Freescale Semiconductor, Inc., 2007-2010. All rights reserved.  
Pressure  
UNIBODY PACKAGES  
MPX5050D  
MPX5050GP  
MPX5050DP  
CASE 867-08  
CASE 867B-04  
CASE 857C-05  
SMALL OUTLINE PACKAGES  
MPVZ5050GW7U  
CASE 1560-03  
MPXV5100GC6U  
CASE 482A-01  
MPXV5050DP  
CASE 1351-01  
MPXV5050GP  
CASE 1369-01  
MPX5050  
Sensors  
Freescale Semiconductor  
2
Pressure  
Operating Characteristics  
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in  
Figure 4 required to meet electrical specifications.)  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
Pressure Range(1)  
POP  
0
—
50  
kPa  
Supply Voltage(2)  
Supply Current  
VS  
Io  
4.75  
—
5.0  
7.0  
0.2  
5.25  
10  
Vdc  
mAdc  
Vdc  
Minimum Pressure Offset(3)  
@ VS = 5.0 Volts  
(0 to 85°C)  
(0 to 85°C)  
(0 to 85°C)  
(0 to 85°C)  
Voff  
0.088  
0.313  
Full Scale Output(4)  
@ VS = 5.0 Volts  
VFSO  
VFSS  
—
4.587  
—
4.7  
4.5  
—
4.813  
—
Vdc  
Vdc  
Full Scale Span(5)  
@ VS = 5.0 Volts  
Accuracy(6)  
Sensitivity  
—
2.5  
%VFSS  
V/P  
tR  
—
—
90  
—
—
mV/kPa  
ms  
Response Time(7)  
1.0  
Output Source Current at Full Scale Output  
Io+  
—
—
—
—
—
0.1  
20  
—
—
—
mAdc  
ms  
Warm-Up Time(8)  
Offset Stability(9)  
0.5  
%VFSS  
1.1.0 kPa (kiloPascal) equals 0.145 psi.  
2.Device is ratiometric within this specified excitation range.  
3.Offset (Voff) is defined as the output voltage at the minimum rated pressure.  
4.Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.  
5.Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the  
minimum rated pressure.  
6.Accuracy (error budget) consists of the following:  
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.  
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and  
from the minimum or maximum operating temperature points, with zero differential pressure applied.  
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or  
maximum rated pressure at 25°C.  
TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.  
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.  
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C.  
7.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a  
specified step change in pressure.  
8.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.  
9.Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.  
MPX5050  
Sensors  
Freescale Semiconductor  
3
Pressure  
Maximum Ratings  
Table 2. Maximum Ratings(1)  
Rating  
Symbol  
Value  
Unit  
Maximum Pressure (P1 > P2)  
Storage Temperature  
Pmax  
200  
kPa  
Tstg  
TA  
-40° to +125°  
-40° to +125°  
°C  
°C  
Operating Temperature  
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.  
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.  
VS  
Gain Stage #2  
and  
Ground  
Reference  
Shift Circuitry  
Thin Film  
Temperature  
Compensation  
and  
Sensing  
Element  
Vout  
Gain Stage #1  
Pins 4, 5, and 6 are NO CONNECTS  
for Unibody Device  
GND  
Pins 1, 5, 6, 7, and 8 are NO CONNECTS  
for Small Outline Package Device  
Figure 1. Fully Integrated Pressure Sensor Schematic  
MPX5050  
Sensors  
Freescale Semiconductor  
4
Pressure  
On-chip Temperature Compensation and Calibration  
Figure 3 illustrates the Differential/Gauge Sensing Chip in  
the basic chip carrier (Case 867). A fluorosilicone gel isolates  
the die surface and wire bonds from the environment, while  
allowing the pressure signal to be transmitted to the sensor  
diaphragm.  
The MPX5050/MPXV5050G series pressure sensor  
operating characteristics, and internal reliability and  
qualification tests are based on use of dry air as the pressure  
media. Media, other than dry air, may have adverse effects on  
sensor performance and long-term reliability. Contact the  
factory for information regarding media compatibility in your  
application.  
Figure 2 shows the sensor output signal relative to  
pressure input. Typical, minimum, and maximum output  
curves are shown for operation over a temperature range of  
0° to 85°C using the decoupling circuit shown in Figure 4. The  
output will saturate outside of the specified pressure range.  
Figure 4 shows the recommended decoupling circuit for  
interfacing the output of the integrated sensor to the A/D input  
of a microprocessor or microcontroller. Proper decoupling of  
the power supply is recommended.  
5.0  
Transfer Function:  
4.5  
V
out = VS*(0.018*P+0.04) ± ERROR  
4.0  
3.5  
3.0  
VS = 5.0 Vdc  
TEMP = 0 to 85°C  
TYPICAL  
2.5  
MAX  
2.0  
1.5  
1.0  
0.5  
0
MIN  
0
5
10 15 20  
25  
30 35 40  
45  
50  
55  
Differential Pressure (kPa)  
Figure 2. Output vs. Pressure Differential  
Stainless Steel  
Fluorosilicone  
Metal Cover  
Gel Die Coat  
Epoxy  
Plastic  
Case  
Die  
P1  
Wire Bond  
Die  
Bond  
Lead Frame  
Differential/Gauge Element  
P2  
Figure 3. Cross-Sectional Diagram (not to scale)  
+5 V  
OUTPUT  
Vout  
Vs  
IPS  
1.0 μF  
GND  
470 pF  
0.01 μF  
Figure 4. Recommended Power Supply Decoupling and Output Filtering  
(For additional output filtering, please refer to Application Note AN1646)  
MPX5050  
Sensors  
Freescale Semiconductor  
5
Pressure  
Transfer Function  
Nominal Transfer Value: Vout = VS (P x 0.018 + 0.04)  
(Pressure Error x Temp. Factor x 0.018 x VS)  
V
S = 5.0 V 0.25 Vdc  
Temperature Error Band  
4.0  
Temp  
Multiplier  
3.0  
–40  
0 to 85  
+125  
3
1
3
Temperature  
Error  
Factor  
2.0  
1.0  
0.0  
–40  
–20  
0
20  
40  
60  
80  
100  
120  
140  
Temperature in °C  
NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.  
Pressure Error Band  
Error Limits for Pressure  
3.0  
2.0  
1.0  
Pressure (in kPa)  
0.0  
0
10  
20  
30  
40  
50  
60  
–1.0  
–2.0  
–3.0  
Pressure  
Error (Max)  
0 to 50 (kPa)  
±1.25 (kPa)  
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE  
Freescale designates the two sides of the pressure sensor  
as the Pressure (P1) side and the Vacuum (P2) side. The  
Pressure (P1) side is the side containing fluorosilicone gel  
which protects the die from harsh media. The MPX pressure  
sensor is designed to operate with positive differential  
pressure applied, P1 > P2.  
The Pressure (P1) side may be identified by using the  
table below:  
Part Number  
MPX5050D  
Case Type  
Pressure (P1) Side Identifier  
Stainless Steel Cap  
867  
MPX5050DP  
867C  
867B  
1369  
1351  
482A  
Side with Part Marking  
Side with Port Attached  
Side with Port Attached  
Side with Part Marking  
Vertical Port Attached  
MPX5050GP  
MPXV5050GP  
MPXV5050DP  
MPXV5050GC6U/T1  
MPX5050  
Sensors  
6
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
–A–  
D 8 PL  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.  
4
M
S
S
0.25 (0.010)  
T
B
A
5
8
N
–B–  
G
INCHES  
MILLIMETERS  
1
DIM  
A
B
C
D
MIN  
MAX  
0.425  
0.425  
0.520  
0.042  
MIN  
10.54  
10.54  
12.70  
0.96  
MAX  
10.79  
10.79  
13.21  
1.07  
0.415  
0.415  
0.500  
0.038  
S
W
G
H
J
K
M
N
S
V
W
0.100 BSC  
2.54 BSC  
0.002  
0.009  
0.061  
0
0.010  
0.011  
0.071  
7
0.05  
0.23  
1.55  
0
0.25  
0.28  
1.80  
7
V
0.444  
0.709  
0.245  
0.115  
0.448  
0.725  
0.255  
0.125  
11.28  
18.01  
6.22  
2.92  
11.38  
18.41  
6.48  
3.17  
C
H
J
–T–  
SEATING  
PLANE  
PIN 1 IDENTIFIER  
M
K
CASE 482A-01  
ISSUE A  
UNIBODY PACKAGE  
C
NOTES:  
R
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD  
STOP RING. MOLD STOP RING NOT TO EXCEED  
16.00 (0.630).  
POSITIVE PRESSURE  
(P1)  
M
B
-A-  
INCHES  
DIM MIN MAX MIN  
MILLIMETERS  
N
L
MAX  
16.00  
13.56  
5.59  
A
B
C
D
F
0.595  
0.630 15.11  
0.534 13.06  
PIN 1  
1
2
3
4
5
6
0.514  
0.200  
0.027  
0.048  
SEATING  
PLANE  
-T-  
0.220  
0.033  
0.064  
5.08  
0.68  
1.22  
0.84  
1.63  
G
J
S
G
J
L
M
N
R
S
0.100 BSC  
2.54 BSC  
F
0.014  
0.695  
0.016 0.36  
0.725 17.65  
0.40  
18.42  
D
6 PL  
30˚ NOM  
30˚ NOM  
M
M
0.136 (0.005)  
T A  
0.475  
0.430  
0.090  
0.495 12.07  
0.450 10.92  
12.57  
11.43  
2.66  
0.105  
2.29  
STYLE 1:  
PIN 1. VOUT  
2. GROUND  
STYLE 2:  
PIN 1. OPEN  
2. GROUND  
STYLE 3:  
PIN 1. OPEN  
2. GROUND  
3. VCC  
4. V1  
5. V2  
3. -VOUT  
4. VSUPPLY  
5. +VOUT  
6. OPEN  
3. +VOUT  
4. +VSUPPLY  
5. -VOUT  
6. VEX  
6. OPEN  
CASE 867-08  
ISSUE N  
UNIBODY PACKAGE  
MPX5050  
Sensors  
Freescale Semiconductor  
7
Pressure  
PACKAGE DIMENSIONS  
PAGE 1 OF 2  
CASE 867B-04  
ISSUE G  
UNIBODY PACKAGE  
MPX5050  
Sensors  
Freescale Semiconductor  
8
Pressure  
PACKAGE DIMENSIONS  
PAGE 2 OF 2  
CASE 867B-04  
ISSUE G  
UNIBODY PACKAGE  
MPX5050  
Sensors  
Freescale Semiconductor  
9
Pressure  
PACKAGE DIMENSIONS  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
P
–A–  
U
M
M
0.25 (0.010)  
T Q  
INCHES  
MILLIMETERS  
DIM  
A
B
C
D
F
MIN  
MAX  
1.175  
0.715  
0.435  
0.033  
0.064  
MIN  
29.08  
17.40  
10.29  
0.68  
MAX  
29.85  
18.16  
11.05  
0.84  
X
1.145  
0.685  
0.405  
0.027  
0.048  
L
W
R
V
PORT #1  
POSITIVE  
PRESSURE  
(P1)  
PORT #2 VACUUM (P2)  
1.22  
1.63  
PORT #1 POSITIVE  
PRESSURE (P1)  
G
J
K
L
N
P
Q
R
S
0.100 BSC  
2.54 BSC  
N
0.014  
0.695  
0.290  
0.420  
0.153  
0.153  
0.063  
0.220  
0.016  
0.725  
0.300  
0.440  
0.159  
0.159  
0.083  
0.240  
0.36  
17.65  
7.37  
10.67  
3.89  
0.41  
18.42  
7.62  
11.18  
4.04  
4.04  
2.11  
–Q–  
PORT #2  
VACUUM  
(P2)  
B
3.89  
1.60  
PIN 1  
5.59  
6.10  
U
V
W
X
0.910 BSC  
23.11 BSC  
K
1
2
3
4
5
6
0.182  
0.310  
0.248  
0.194  
0.330  
0.278  
4.62  
7.87  
6.30  
4.93  
8.38  
7.06  
C
S
SEATING  
–T–  
SEATING  
PLANE  
–T–  
PLANE  
STYLE 1:  
PIN 1.  
6 PL  
D
G
V
OUT  
J
F
M
M
2. GROUND  
3.  
4. V1  
5. V2  
0.13 (0.005)  
A
V
CC  
6.  
V
EX  
CASE 867C-05  
ISSUE F  
UNIBODY PACKAGE  
MPX5050  
10  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
PAGE 1 OF 2  
CASE 1351-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
MPX5050  
11  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
PAGE 2 OF 2  
CASE 1351-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
MPX5050  
12  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
PAGE 1 OF 2  
CASE 1369-01  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPX5050  
13  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
PAGE 2 OF 2  
CASE 1369-01  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPX5050  
14  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
PAGE 1 OF 3  
CASE 1560-03  
ISSUE D  
SMALL OUTLINE PACKAGE  
MPX5050  
15  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
PAGE 2 OF 3  
CASE 1560-03  
ISSUE D  
SMALL OUTLINE PACKAGE  
MPX5050  
16  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
PAGE 3 OF 3  
CASE 1560-03  
ISSUE D  
SMALL OUTLINE PACKAGE  
MPX5050  
17  
Sensors  
Freescale Semiconductor  
How to Reach Us:  
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Web Support:  
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www.freescale.com/support  
Information in this document is provided solely to enable system and software  
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circuits or integrated circuits based on the information in this document.  
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MPX5050  
Rev. 11  
03/2010  

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SI9130LG-T1-E3

 Pin-Programmable Dual Controller - Portable PCs

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SI9130_11

 Pin-Programmable Dual Controller - Portable PCs

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SI9137

 Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9137DB

 Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9137LG

 Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9122E

 500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification Drivers

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