N74F174D

更新时间:2024-10-29 02:19:14
品牌:NXP
描述:Hex D flip-flops

N74F174D 概述

Hex D flip-flops 十六进制D触发器 触发器 触发器/锁存器

N74F174D 规格参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:SOIC包装说明:SOP, SOP16,.25
针数:16Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.32
Is Samacsys:N系列:F/FAST
JESD-30 代码:R-PDSO-G16JESD-609代码:e4
负载电容(CL):50 pF逻辑集成电路类型:D FLIP-FLOP
最大频率@ Nom-Sup:80000000 Hz最大I(ol):0.02 A
湿度敏感等级:1位数:6
功能数量:1端子数量:16
最高工作温度:70 °C最低工作温度:
输出极性:TRUE封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP16,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260电源:5 V
最大电源电流(ICC):45 mA传播延迟(tpd):11 ns
认证状态:Not Qualified子类别:FF/Latches
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:TTL温度等级:COMMERCIAL
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:40触发器类型:POSITIVE EDGE
最小 fmax:80 MHzBase Number Matches:1

N74F174D 数据手册

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INTEGRATED CIRCUITS  
74F174  
Hex D flip-flops  
Product specification  
IC15 Data Handbook  
1988 Oct 07  
Philips  
Semiconductors  
Philips Semiconductors  
Product specification  
Hex D flip-flop  
74F174  
FEATURES  
PIN CONFIGURATION  
Six edge-triggered D-type flip-flops  
MR  
Q0  
D0  
D1  
Q1  
1
2
3
4
5
16  
V
CC  
Buffered common Clock  
15 Q5  
14 D5  
13 D4  
12 Q4  
11 D3  
10 Q3  
Buffered, asynchronous Master Reset  
DESCRIPTION  
The 74F174 has six edge-triggered D-type flip-flops with individual D  
inputs and Q outputs. The common buffered Clock (CP) and Master  
Reset (MR) inputs load and reset (clear) all flip-flops simultaneously.  
D2  
Q2  
6
7
8
The register is fully edge-triggered. The state of each D input, one  
setup time before the Low-to-High clock transition is transferred to  
the corresponding flip-flop’s Q output.  
GND  
9
CP  
SF00188  
All Q outputs will be forced Low independent of Clock or Data inputs  
by a Low voltage level on the MR input. The device is useful for  
applications where true outputs only are required, and the Clock and  
Master Reset are common to all storage elements.  
ORDERING INFORMATION  
COMMERCIAL RANGE  
= 5V ±10%,  
TYPICAL  
SUPPLY CURRENT  
(TOTAL)  
V
DESCRIPTION  
PKG DWG #  
CC  
TYPE  
TYPICAL f  
MAX  
T
amb  
= 0°C to +70°C  
16-pin plastic DIP  
16-pin plastic SO  
N74F174N  
SOT38-4  
74F174  
100MHz  
35mA  
N74F174D  
SOT109-1  
INPUT AND OUTPUT LOADING AND FAN-OUT TABLE  
PINS  
D0–D5  
CP  
DESCRIPTION  
74F (U.L.) HIGH/LOW  
LOAD VALUE HIGH/LOW  
20µA/0.6mA  
Data inputs  
1.0/1.0  
1.0/1.0  
1.0/1.0  
50/33  
Clock Pulse input (active rising edge)  
Master Reset input (active-Low)  
Outputs  
20µA/0.6mA  
MR  
20µA/0.6mA  
Q0–Q5  
1.0mA/20mA  
NOTE: One (1.0) FAST unit load is defined as: 20µA in the High state and 0.6mA in the Low state.  
LOGIC SYMBOL  
IEC/IEEE SYMBOL  
9
1
3
4
6
11  
13  
14  
C1  
R
3
2
5
D0 D1 D2 D3  
D4 D5  
1D  
9
1
CP  
MR  
4
6
7
Q0 Q1 Q2  
Q3  
Q4 Q5  
11  
13  
14  
10  
12  
15  
2
5
7
10 12  
15  
V
= Pin 16  
CC  
GND = Pin 8  
SF00190  
SF00189  
2
October 7, 1988  
853–0060 94766  
Philips Semiconductors  
Product specification  
Hex D flip-flop  
74F174  
LOGIC DIAGRAM  
D0  
D1  
D2  
D3  
11  
D4  
D5  
3
4
6
13  
14  
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
CP  
R
CP  
R
CP  
R
CP  
R
CP  
R
CP  
R
D
D
D
D
D
D
9
CP  
1
MR  
2
5
7
10  
12  
15  
V
= Pin 16  
Q0  
Q1  
Q2  
Q3  
Q4  
Q5  
CC  
GND = Pin 8  
SF00192  
FUNCTION TABLE  
INPUTS  
OUTPUTS  
OPERATING MODE  
MR  
L
CP  
X
D
Qn  
L
X
h
l
Reset (clear)  
Load “1”  
H
H
H
L
Load “0”  
H = High voltage level  
L = Low voltage level  
X = Don’t care  
= Low-to-High Clock transition  
h = High voltage level one set-up time prior to the Low-to-High Clock transition.  
l = Low voltage level one set-up time prior to the Low-to-High Clock transition.  
ABSOLUTE MAXIMUM RATINGS  
(Operation beyond the limits set forth in this table may impair the useful life of the device.  
Unless otherwise noted these limits are over the operating free-air temperature range.)  
SYMBOL  
PARAMETER  
RATING  
–0.5 to +7.0  
–0.5 to +7.0  
–30 to +5  
UNIT  
V
V
Supply voltage  
Input voltage  
Input current  
CC  
IN  
V
V
I
mA  
V
IN  
V
OUT  
OUT  
Voltage applied to output in High output state  
Current applied to output in Low output state  
Operating free-air temperature range  
Storage temperature range  
–0.5 to V  
40  
CC  
I
mA  
°C  
°C  
T
amb  
0 to +70  
T
stg  
–65 to +150  
RECOMMENDED OPERATING CONDITIONS  
LIMITS  
NOM  
5.0  
SYMBOL  
PARAMETER  
UNIT  
MIN  
4.5  
MAX  
V
Supply voltage  
5.5  
V
V
CC  
IH  
IL  
V
V
High-level input voltage  
Low-level input voltage  
Input clamp current  
2.0  
0.8  
–18  
–1  
V
I
I
I
mA  
mA  
mA  
°C  
IK  
High-level output current  
Low-level output current  
OH  
OL  
20  
T
amb  
Operating free-air temperature range  
0
+70  
3
October 7, 1988  
Philips Semiconductors  
Product specification  
Hex D flip-flop  
74F174  
DC ELECTRICAL CHARACTERISTICS  
(Over recommended operating free-air temperature range unless otherwise noted.)  
LIMITS  
1
SYMBOL  
PARAMETER  
TEST CONDITIONS  
= MIN, V = MAX  
UNIT  
MAX  
2
MIN  
2.5  
TYP  
V
V
V
V
V
V
V
V
V
V
±10%V  
CC  
IL  
CC  
V
OH  
High-level output voltage  
V
= MIN, I = MAX  
±5%V  
2.7  
3.4  
0.30  
0.30  
–0.73  
IH  
OH  
CC  
= MIN, V = MAX  
±10%V  
0.50  
V
0.50  
CC  
IL  
CC  
CC  
V
V
Low-level output voltage  
OL  
= MIN, I = MAX  
±5%V  
IH  
OL  
Input clamp voltage  
= MIN, I = I  
IK  
–1.2  
100  
20  
V
IK  
CC  
CC  
CC  
CC  
CC  
CC  
I
I
I
I
I
I
Input current at maximum input voltage  
High-level input current  
= MAX, V = 7.0V  
µA  
µA  
mA  
mA  
mA  
I
I
= MAX, V = 2.7V  
IH  
I
Low-level input current  
= MAX, V = 0.5V  
–0.6  
–150  
45  
IL  
I
3
Short-circuit output current  
= MAX  
–60  
OS  
Supply current (total)  
= MAX, Dn = MR = 4.5V, CP = ↑  
35  
CC  
NOTES:  
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.  
2. All typical values are at V = 5V, T = 25°C.  
CC  
amb  
3. Not more than one output should be shorted at a time. For testing I , the use of high-speed test apparatus and/or sample-and-hold  
OS  
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting  
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any  
sequence of parameter tests, I tests should be performed last.  
OS  
AC ELECTRICAL CHARACTERISTICS  
LIMITS  
V
= +5.0V  
= +25°C  
V
= +5.0V ± 10%  
= 0°C to +70°C  
CC  
CC  
TEST  
CONDITION  
T
amb  
T
amb  
SYMBOL  
PARAMETER  
UNIT  
C = 50pF, R = 500Ω  
C = 50pF, R = 500Ω  
L L  
L
L
MIN  
TYP  
MAX  
MIN  
MAX  
f
Maximum clock frequency  
Waveform 1  
Waveform 1  
Waveform 2  
80  
100  
80  
MHz  
ns  
MAX  
t
t
Propagation delay  
CP to Qn  
3.5  
4.5  
5.5  
6.0  
8.0  
10.0  
3.5  
4.5  
9.0  
11.0  
PLH  
PHL  
t
Propagation delay MR to Qn  
5.0  
8.5  
14.0  
5.0  
15.0  
ns  
PHL  
AC SETUP REQUIREMENTS  
LIMITS  
V
= +5.0V  
= +25°C  
V
= +5.0V ± 10%  
= 0°C to +70°C  
CC  
CC  
TEST  
CONDITION  
T
amb  
T
amb  
SYMBOL  
PARAMETER  
UNIT  
C = 50pF, R = 500Ω  
C = 50pF, R = 500Ω  
L L  
L
L
MIN  
TYP  
MAX  
MIN  
MAX  
t (H)  
t (L)  
S
Setup time, High or Low  
Dn to CP  
4.0  
4.0  
4.0  
4.0  
S
Waveform 3  
Waveform 3  
Waveform 1  
ns  
ns  
ns  
t (H)  
Hold time, High or Low  
Dn to CP  
0.0  
0.0  
0.0  
0.0  
h
t (L)  
h
t (H)  
CP Pulse width,  
High or Low  
4.0  
6.0  
4.0  
6.0  
w
t (L)  
w
t (L)  
MR Pulse width, Low  
Waveform 2  
Waveform 2  
5.0  
5.0  
5.0  
5.0  
ns  
ns  
w
t
Recovery time, MR to CP  
REC  
4
October 7, 1988  
Philips Semiconductors  
Product specification  
Hex D flip-flop  
74F174  
AC WAVEFORMS  
For all waveforms, V = 1.5V.  
M
The shaded areas indicate when the input is permitted to change for predictable output performance.  
1/f  
MAX  
Dn  
V
V
t
V
V
t
(L)  
M
M
M
M
w
CP  
Qn  
V
V
M
t
M
t
t (H)  
(H)  
t (L)  
t (L)  
h
s
h
s
(H)  
w
PLH  
t
PHL  
CP  
V
V
M
M
V
V
M
M
SF00191  
SF00166  
Waveform 3. Data Setup and Hold Times  
Waveform 1. Propagation Delay, Clock Input to Output,  
Clock Pulse Width, and Maximum Clock Frequency  
MR  
CP  
V
V
M
M
t
w
(L)  
t
REC  
V
M
t
PHL  
Qn  
V
M
SF00158  
Waveform 2. Master Reset Pulse Width, Master Reset to  
Output Delay and Master Reset to Clock recovery Time  
TEST CIRCUIT AND WAVEFORMS  
t
AMP (V)  
V
w
CC  
90%  
90%  
NEGATIVE  
PULSE  
V
V
M
M
10%  
10%  
V
V
OUT  
IN  
0V  
PULSE  
GENERATOR  
D.U.T.  
t
t )  
t
t )  
THL ( f  
TLH ( r  
R
C
R
L
t
t )  
T
L
t
t )  
TLH ( r  
THL ( f  
AMP (V)  
0V  
90%  
M
90%  
POSITIVE  
PULSE  
V
V
M
10%  
10%  
Test Circuit for Totem-Pole Outputs  
DEFINITIONS:  
t
w
Input Pulse Definition  
INPUT PULSE REQUIREMENTS  
R
L
C
L
R
T
=
=
=
Load resistor;  
see AC ELECTRICAL CHARACTERISTICS for value.  
Load capacitance includes jig and probe capacitance;  
see AC ELECTRICAL CHARACTERISTICS for value.  
family  
74F  
V
rep. rate  
t
w
t
t
THL  
amplitude  
M
TLH  
Termination resistance should be equal to Z  
pulse generators.  
of  
OUT  
2.5ns 2.5ns  
3.0V  
1.5V  
1MHz  
500ns  
SF00006  
5
October 7, 1988  
Philips Semiconductors  
Product specification  
Hex D flip-flops  
74F174  
DIP16: plastic dual in-line package; 16 leads (300 mil)  
SOT38-4  
6
1988 Oct 07  
Philips Semiconductors  
Product specification  
Hex D flip-flops  
74F174  
SO16: plastic small outline package; 16 leads; body width 3.9 mm  
SOT109-1  
7
1988 Oct 07  
Philips Semiconductors  
Product specification  
Hex D flip-flops  
74F174  
Data sheet status  
[1]  
Data sheet  
status  
Product  
status  
Definition  
Objective  
specification  
Development  
This data sheet contains the design target or goal specifications for product development.  
Specification may change in any manner without notice.  
Preliminary  
specification  
Qualification  
This data sheet contains preliminary data, and supplementary data will be published at a later date.  
Philips Semiconductors reserves the right to make chages at any time without notice in order to  
improve design and supply the best possible product.  
Product  
specification  
Production  
This data sheet contains final specifications. Philips Semiconductors reserves the right to make  
changes at any time without notice in order to improve design and supply the best possible product.  
[1] Please consult the most recently issued datasheet before initiating or completing a design.  
Definitions  
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For  
detailed information see the relevant data sheet or data handbook.  
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one  
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or  
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended  
periods may affect device reliability.  
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips  
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or  
modification.  
Disclaimers  
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications  
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.  
RighttomakechangesPhilipsSemiconductorsreservestherighttomakechanges, withoutnotice, intheproducts, includingcircuits,standard  
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no  
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless  
otherwise specified.  
Philips Semiconductors  
811 East Arques Avenue  
P.O. Box 3409  
Copyright Philips Electronics North America Corporation 1998  
All rights reserved. Printed in U.S.A.  
Sunnyvale, California 94088–3409  
Telephone 800-234-7381  
print code  
Date of release: 10-98  
9397-750-05089  
Document order number:  
Philips  
Semiconductors  

N74F174D 替代型号

型号 制造商 描述 替代类型 文档
N74F174N,602 NXP N74F174N 类似代替
74F174SC FAIRCHILD Hex D-Type Flip-Flop with Master Reset 功能相似
SN74F174ADR TI 暂无描述 功能相似

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N74F175AD NXP IC F/FAST SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16, PLASTIC, SOT-109, SO-16, FF/Latch 获取价格
N74F175AD,602 NXP IC F/FAST SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16, PLASTIC, SOT-109, SO-16, FF/Latch 获取价格
N74F175AD,623 NXP IC F/FAST SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16, PLASTIC, SOT-109, SO-16, FF/Latch 获取价格
N74F175AD-T NXP IC F/FAST SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16, PLASTIC, SOT-109, SO-16, FF/Latch 获取价格

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