N74F373N [NXP]

Octal transparent latch 3-State; 八路透明锁存器三态
N74F373N
型号: N74F373N
厂家: NXP    NXP
描述:

Octal transparent latch 3-State
八路透明锁存器三态

锁存器 逻辑集成电路 光电二极管 驱动
文件: 总12页 (文件大小:97K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
FAST PRODUCTS  
74F373  
Octal transparent latch (3-State)  
74F374  
Octal D flip-flop (3-State)  
Product specification  
IC15 Data Handbook  
1994 Dec 05  
Philip s Se m ic ond uc tors  
Philips Semiconductors  
Product specification  
Latch/flip-flop  
74F373/74F374  
74F373 Octal transparent latch (3-State)  
74F374 Octal D-type flip-flop (3-State)  
The 74F374 is an 8-bit edge triggered register coupled to eight  
3-State output buffers. The two sections of the device are controlled  
independently by clock (CP) and output enable (OE) control gates.  
FEATURES  
8-bit transparent latch — 74F373  
8-bit positive edge triggered register — 74F374  
3-State outputs glitch free during power-up and power-down  
Common 3-State output register  
The register is fully edge triggered. The state of the D input, one  
setup time before the low-to-high clock transition is transferred to the  
corresponding flip-flop’s Q output.  
The 3-State output buffers are designed to drive heavily loaded  
3-State buses, MOS memories, or MOS microprocessors.  
Independent register and 3-State buffer operation  
SSOP Type II Package  
The active low output enable (OE) controls all eight 3-State buffers  
independent of the register operation. When OE is low, the data in  
the register appears at the outputs. When OE is high, the outputs  
are in high impedance “off” state, which means they will neither drive  
nor load the bus.  
DESCRIPTION  
The 74F373 is an octal transparent latch coupled to eight 3-State  
output devices. The two sections of the device are controlled  
independently by enable (E) and output enable (OE) control gates.  
TYPICAL  
PROPAGATION  
DELAY  
TYPICAL SUPPLY  
CURRENT  
TYPE  
The data on the D inputs is transferred to the latch outputs when the  
enable (E) input is high. The latch remains transparent to the data  
input while E is high, and stores the data that is present one setup  
time before the high-to-low enable transition.  
(TOTAL)  
74F373  
4.5ns  
35mA  
The 3-State output buffers are designed to drive heavily loaded  
3-State buses, MOS memories, or MOS microprocessors.  
TYPICAL SUPPLY  
CURRENT  
TYPE  
TYPICAL f  
max  
(TOTAL)  
The active low output enable (OE) controls all eight 3-State buffers  
independent of the latch operation. When OE is low, latched or  
transparent data appears at the output.  
74F374  
165MHz  
55mA  
When OE is high, the outputs are in high impedance “off” state,  
which means they will neither drive nor load the bus.  
ORDERING INFORMATION  
ORDER CODE  
COMMERCIAL RANGE  
= 5V ±10%, T = 0°C to +70°C  
DESCRIPTION  
PKG DWG #  
V
CC  
amb  
20-pin plastic DIP  
20-pin plastic SOL  
N74F373N, N74F374N  
N74F373D, N74F374D  
N74F373DB, N74374DB  
SOT146-1  
SOT163-1  
SOT399-1  
20-pin plastic SSOP type II  
INPUT AND OUTPUT LOADING AND FAN OUT TABLE  
LOAD VALUE  
HIGH/LOW  
74F (U.L.)  
HIGH/LOW  
PINS  
DESCRIPTION  
20µA/0.6mA  
D0 - D7  
E (74F373)  
OE  
Data inputs  
1.0/1.0  
1.0/1.0  
1.0/1.0  
1.0/1.0  
150/40  
20µA/0.6mA  
20µA/0.6mA  
20µA/0.6mA  
3.0mA/24mA  
Enable input (active high)  
Output enable inputs (active low)  
Clock pulse input (active rising edge)  
3-State outputs  
CP (74F374)  
Q0 - Q7  
NOTE: One (1.0) FAST unit load is defined as: 20µA in the high state and 0.6mA in the low state.  
2
December 5, 1994  
853-0369 14383  
Philips Semiconductors  
Product specification  
Latch/flip-flop  
74F373/74F374  
PIN CONFIGURATION – 74F373  
PIN CONFIGURATION – 74F374  
OE  
Q0  
V
CC  
1
2
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
OE  
Q0  
D0  
D1  
Q1  
Q2  
D2  
D3  
Q3  
1
2
3
4
5
6
7
8
9
20  
V
CC  
Q7  
D7  
D6  
Q6  
Q5  
D5  
D4  
Q4  
CP  
19 Q7  
18 D7  
17 D6  
16 Q6  
15 Q5  
14 D5  
13 D4  
12 Q4  
D0  
3
D1  
4
Q1  
5
Q2  
6
D2  
7
D3  
8
Q3  
9
GND  
10  
GND 10  
11 E  
SF00250  
SF00253  
LOGIC SYMBOL – 74F373  
IEC/IEE SYMBOL – 74F374  
3
4
7
8
13 14 17 18  
3
4
7
8
13 14 17 18  
D0 D1 D2 D3 D4 D5 D6 D7  
D0 D1 D2 D3 D4 D5 D6 D7  
11  
E
11  
CP  
OE  
OE  
1
1
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7  
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7  
2
5
6
9 12 15 16 19  
2
5
6
9 12 15 16 19  
V
= Pin 20  
CC  
V
= Pin 20  
CC  
GND = Pin 10  
GND = Pin 10  
SF00251  
SF00254  
IEC/IEEE SYMBOL – 74F374  
IEC/IEEE SYMBOL – 74F373  
1
EN1  
11  
1
C2  
EN1  
11  
EN2  
2
3
2D  
1
5
6
4
7
3
2
2D  
1
5
6
9
4
9
8
7
12  
15  
16  
19  
13  
8
14  
13  
12  
15  
16  
19  
17  
18  
14  
17  
18  
SF00255  
SF00252  
3
December 5, 1994  
Philips Semiconductors  
Product specification  
Latch/flip-flop  
74F373/74F374  
LOGIC DIAGRAM FOR 74F373  
D0  
D1  
4
D2  
D3  
D4  
13  
D5  
14  
D6  
17  
D7  
18  
3
7
8
D
E
D
E
D
E
D
E
D
E
D
E
D
E
D
E
Q
Q
Q
Q
Q
Q
Q
Q
11  
1
E
OE  
2
5
6
9
12  
Q4  
15  
Q5  
16  
Q6  
19  
Q7  
SF00256  
Q0  
Q1  
Q2  
Q3  
V
= Pin 20  
CC  
GND = Pin 10  
LOGIC DIAGRAM FOR 74F374  
D0  
D1  
4
D2  
D3  
D4  
13  
D5  
14  
D6  
17  
D7  
18  
3
7
8
D
CP  
D
CP  
D
CP  
D
CP  
D
CP  
D
CP  
D
CP  
D
CP  
Q
Q
Q
Q
Q
Q
Q
Q
11  
1
CP  
OE  
2
5
6
9
12  
Q4  
15  
Q5  
16  
Q6  
19  
Q7  
V
= Pin 20  
CC  
GND = Pin 10  
Q0  
Q1  
Q2  
Q3  
SF00257  
FUNCTION TABLE FOR 74F373  
INPUTS  
OUTPUTS  
Q0 - Q7  
INTERNAL  
REGISTER  
OPERATING MODE  
OE  
L
E
H
H
Dn  
L
L
H
L
H
Enable and read register  
L
H
l
L
L
L
Latch and read register  
Hold  
L
h
H
H
L
L
X
NC  
NC  
Dn  
NC  
Z
H
L
X
Disable outputs  
H
H
Dn  
Z
NOTES:  
H
h
L
l
=
=
=
=
High-voltage level  
High state must be present one setup time before the high-to-low enable transition  
Low-voltage level  
Low state must be present one setup time before the high-to-low enable transition  
No change  
NC=  
X
Z
=
=
=
Don’t care  
High impedance “off” state  
High-to-low enable transition  
4
December 5, 1994  
Philips Semiconductors  
Product specification  
Latch/flip-flop  
74F373/74F374  
FUNCTION TABLE FOR 74F374  
INPUTS  
INTERNAL  
REGISTER  
OUTPUTS  
Q0 - Q7  
OPERATING MODE  
OE  
L
CP  
Dn  
l
L
L
H
Load and read register  
L
h
H
L
X
NC  
NC  
Dn  
NC  
Z
Hold  
H
X
Disable outputs  
H
Dn  
Z
NOTES:  
H
h
L
l
=
=
=
=
High-voltage level  
High state must be present one setup time before the low-to-high clock transition  
Low-voltage level  
Low state must be present one setup time before the low-to-high clock transition  
NC=  
No change  
Don’t care  
High impedance “off” state  
Low-to-high clock transition  
Not low-to-high clock transition  
X
Z
=
=
=
=
ABSOLUTE MAXIMUM RATINGS  
(Operation beyond the limit set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the  
operating free air temperature range.)  
SYMBOL  
PARAMETER  
RATING  
-0.5 to +7.0  
-0.5 to +7.0  
-30 to +5  
UNIT  
V
V
Supply voltage  
Input voltage  
Input current  
CC  
IN  
V
V
I
IN  
mA  
V
I
Voltage applied to output in high output state  
Current applied to output in low output state  
-0.5 to V  
V
OUT  
CC  
48  
mA  
OUT  
T
Operating free air temperature range  
Storage temperature range  
0 to +70  
°C  
°C  
amb  
T
stg  
-65 to +150  
RECOMMENDED OPERATING CONDITIONS  
LIMITS  
SYMBOL  
PARAMETER  
UNIT  
MIN  
4.5  
NOM  
MAX  
V
5.0  
5.5  
V
V
Supply voltage  
CC  
IH  
IL  
V
V
High-level input voltage  
Low-level input voltage  
Input clamp current  
2.0  
0.8  
-18  
-3  
V
I
I
I
mA  
mA  
mA  
Ik  
High-level output current  
Low-level output current  
OH  
OL  
24  
T
amb  
Operating free air temperature range  
0
+70  
°C  
5
December 5, 1994  
Philips Semiconductors  
Product specification  
Latch/flip-flop  
74F373/74F374  
DC ELECTRICAL CHARACTERISTICS  
(Over recommended operating free-air temperature range unless otherwise noted.)  
LIMITS  
TEST  
CONDITIONS  
SYMBOL  
PARAMETER  
UNIT  
1
2
MIN TYP  
MAX  
±10%V  
±5%V  
V
V
= MIN, V = MAX,  
2.4  
V
V
CC  
CC  
IL  
V
OH  
High-level output voltage  
= MIN, I = MAX  
2.7  
3.4  
CC  
IH  
OH  
V
V
= MIN, V = MAX,  
±10%V  
0.35  
0.35  
0.50  
0.50  
V
V
CC  
IL  
CC  
V
V
Low-level output voltage  
OL  
= MIN, I = MAX  
±5%V  
IH  
OL  
CC  
Input clamp voltage  
V
CC  
V
CC  
V
CC  
V
CC  
= MIN, I = I  
IK  
-0.73 -1.2  
V
IK  
I
I
I
I
Input current at maximum input voltage  
High-level input current  
= MAX, V = 7.0V  
100  
20  
µA  
µA  
mA  
I
I
= MAX, V = 2.7V  
IH  
IL  
I
Low-level input current  
= MAX, V = 0.5V  
-0.6  
I
µA  
µA  
I
I
I
Off-state output current, high-level voltage applied  
Off-state output current, low-level voltage applied  
V
V
V
= MAX, V = 2.7V  
50  
-50  
OZH  
OZL  
OS  
CC  
CC  
CC  
O
= MAX, V = 0.5V  
O
3
Short-circuit output current  
= MAX  
= MAX  
-60  
-150  
mA  
74F373  
74F374  
35  
57  
60  
86  
mA  
mA  
I
Supply current (total)  
V
CC  
CC  
NOTES:  
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.  
2. All typical values are at V = 5V, T  
= 25°C.  
amb  
CC  
3. Not more than one output should be shorted at a time. For testing I , the use of high-speed test apparatus and/or sample-and-hold  
OS  
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting  
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any  
sequence of parameter tests, I tests should be performed last.  
OS  
AC ELECTRICAL CHARACTERISTICS  
LIMITS  
T
T
= +25°C  
= +5.0V  
= 0°C to +70°C  
= +5.0V ± 10%  
amb  
amb  
V
SYMBOL  
PARAMETER  
TEST  
V
UNIT  
CC  
CC  
CONDITION  
C = 50pF, R = 500Ω  
C = 50pF, R = 500Ω  
L L  
L
L
MIN  
TYP  
MAX  
MIN  
MAX  
t
t
Propagation delay  
Dn to Qn  
3.0  
2.0  
5.3  
3.7  
7.0  
5.0  
3.0  
2.0  
8.0  
6.0  
PLH  
PHL  
Waveform 3  
Waveform 2  
ns  
ns  
ns  
t
t
Propagation delay  
E to Qn  
5.0  
3.0  
9.0  
4.0  
11.5  
7.0  
5.0  
3.0  
12.0  
8.0  
PLH  
PHL  
74F373  
t
t
Output enable time  
to high or low level  
Waveform 6  
Waveform 7  
2.0  
2.0  
5.0  
5.6  
11.0  
7.5  
2.0  
2.0  
11.5  
8.5  
PZH  
PZL  
t
t
Output disable time  
from high or low level  
Waveform 6  
Waveform 7  
2.0  
2.0  
4.5  
3.8  
6.5  
5.0  
2.0  
2.0  
7.0  
6.0  
PHZ  
PLZ  
ns  
ns  
ns  
f
Maximum clock frequency  
Waveform 1  
Waveform 1  
150  
165  
140  
max  
t
t
Propagation delay  
CP to Qn  
3.5  
3.5  
5.0  
5.0  
7.5  
7.5  
3.0  
3.0  
8.5  
8.5  
PLH  
PHL  
74F374  
t
t
Output enable time  
to high or low level  
Waveform 6  
Waveform 7  
2.0  
2.0  
9.0  
5.3  
11.0  
7.5  
2.0  
2.0  
12.0  
8.5  
PZH  
PZL  
ns  
ns  
t
t
Output disable time  
from high or low level  
Waveform 6  
Waveform 7  
2.0  
2.0  
5.3  
4.3  
6.0  
5.5  
2.0  
2.0  
7.0  
6.5  
PHZ  
PLZ  
6
December 5, 1994  
Philips Semiconductors  
Product specification  
Latch/flip-flop  
74F373/74F374  
AC SETUP REQUIREMENTS  
LIMITS  
T
T
amb  
= +25°C  
= 0°C to +70°C  
amb  
V
CC  
= +5.0V ± 10%  
SYMBOL  
PARAMETER  
TEST  
V
CC  
= +5.0V  
UNIT  
CONDITION  
C = 50pF, R = 500Ω  
C = 50pF, R = 500Ω  
L L  
L
L
MIN  
TYP  
MAX  
MIN  
MAX  
t
su  
t
su  
(H)  
(L)  
Setup time, high or low level  
Dn to E  
0
1.0  
0
1.0  
Waveform 4  
ns  
t (H)  
Hold time, high or low level  
Dn to E  
74F373  
74F374  
3.0  
3.0  
3.0  
3.0  
h
Waveform 4  
Waveform 1  
Waveform 5  
ns  
ns  
ns  
t
h
(L)  
t
w
(H)  
E Pulse width, high  
3.5  
4.0  
t
su  
t
su  
(H)  
(L)  
Setup time, high or low level  
Dn to CP  
2.0  
2.0  
2.0  
2.0  
t (H)  
Hold time, high or low level  
Dn to CP  
0
0
0
0
h
Waveform 5  
Waveform 5  
ns  
ns  
t
h
(L)  
t
w
t
w
(H)  
(L)  
CP Pulse width,  
high or low  
3.5  
4.0  
3.5  
4.0  
AC WAVEFORMS  
For all waveforms, V = 1.5V.  
M
The shaded areas indicate when the input is permitted to change for  
predictable output performance.  
Dn  
V
V
t
M
1/f  
M
max  
CP  
V
V
M
V
M
t
M
PHL  
PLH  
t
(H)  
w
t
t
(L)  
t
PHL  
PLH  
w
Qn  
V
V
M
M
V
V
Qn  
M
M
SF00260  
SF00258  
Waveform 3. Propagation delay for data to output  
Waveform 1. Propagation delay for clock input to output,  
clock pulse widths, and maximum clock frequency  
Dn  
E
V
V
V
V
M
M
M
M
t
(L)  
t (L)  
h
t
(H)  
t
(H)  
t (H)  
h
su  
w
su  
E
V
M
V
V
t
M
M
V
V
M
M
t
PHL  
PLH  
V
SF00261  
Qn  
V
M
M
Waveform 4. Data setup time and hold times  
SF00259  
Waveform 2. Propagation delay for enable to output  
and enable pulse width  
7
December 5, 1994  
Philips Semiconductors  
Product specification  
Latch/flip-flop  
74F373/74F374  
AC WAVEFORMS (Continued)  
For all waveforms, V = 1.5V.  
M
The shaded areas indicate when the input is permitted to change for  
predictable output performance.  
Dn  
V
V
V
V
M
M
M
M
OEn  
V
t
V
M
M
t
(L)  
t (L)  
h
t
(H)  
t (H)  
h
su  
su  
t
PZL  
PLZ  
CP  
V
M
V
M
V
M
Qn, Qn  
V
+0.3V  
OL  
SF00262  
Waveform 5. Data setup time and hold times  
SF00264  
Waveform 7. 3-State output enable time to low level  
and output disable time from low level  
OEn  
V
V
M
M
V
-0.3V  
OH  
t
t
PHZ  
PZH  
Qn, Qn  
V
M
0V  
SF00263  
Waveform 6. 3-State output enable time to high level  
and output disable time from high level  
TEST CIRCUIT AND WAVEFORMS  
SWITCH POSITION  
t
w
AMP (V)  
0V  
TEST  
SWITCH  
closed  
open  
90%  
90%  
7.0V  
V
CC  
NEGATIVE  
PULSE  
t
, t  
PLZ PZL  
V
V
M
M
All other  
10%  
10%  
R
L
V
V
OUT  
IN  
t
t )  
t
t )  
THL ( f  
TLH ( r  
PULSE  
GENERATOR  
D.U.T.  
t
t )  
t
t )  
TLH ( r  
THL ( f  
R
C
R
L
AMP (V)  
0V  
T
L
90%  
M
90%  
POSITIVE  
PULSE  
V
V
M
Test circuit for 3-state outputs  
DEFINITIONS:  
10%  
10%  
t
w
Input pulse definition  
R
C
Load resistor; see AC electrical characteristics for value.  
L =  
L =  
INPUT PULSE REQUIREMENTS  
V
Load capacitance includes jig and probe capacitance;  
see AC electrical characteristics for value.  
family  
rep. rate  
t
t
t
THL  
amplitude  
M
w
TLH  
R
T =  
Termination resistance should be equal to Z  
generators.  
of pulse  
OUT  
74F  
3.0V  
1.5V  
1MHz  
500ns 2.5ns  
2.5ns  
SF00265  
8
December 5, 1994  
Philips Semiconductors  
Product specification  
Latch/flip-flop  
74F373, 74F374  
DIP20: plastic dual in-line package; 20 leads (300 mil)  
SOT146-1  
9
1994 Dec 05  
Philips Semiconductors  
Product specification  
Latch/flip-flop  
74F373, 74F374  
SO20: plastic small outline package; 20 leads; body width 7.5 mm  
SOT163-1  
10  
1994 Dec 05  
Philips Semiconductors  
Product specification  
Latch/flip-flop  
74F373, 74F374  
NOTES  
11  
1994 Dec 05  
Philips Semiconductors FAST Products  
Product specification  
Latch/flip-flop  
74F373, 74F374  
DEFINITIONS  
Data Sheet Identification  
Product Status  
Definition  
This data sheet contains the design target or goal specifications for product development. Specifications  
may change in any manner without notice.  
Objective Specification  
Formative or in Design  
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to make changes at any time without notice in order to improve design  
and supply the best possible product.  
Preliminary Specification  
Product Specification  
Preproduction Product  
Full Production  
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes  
at any time without notice, in order to improve design and supply the best possible product.  
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,  
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips  
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,  
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask  
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes  
only. PhilipsSemiconductorsmakesnorepresentationorwarrantythatsuchapplicationswillbesuitableforthespecifiedusewithoutfurthertesting  
or modification.  
LIFE SUPPORT APPLICATIONS  
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,  
orsystemswheremalfunctionofaPhilipsSemiconductorsandPhilipsElectronicsNorthAmericaCorporationProductcanreasonablybeexpected  
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips  
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully  
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.  
Philips Semiconductors  
811 East Arques Avenue  
P.O. Box 3409  
Sunnyvale, California 94088–3409  
Telephone 800-234-7381  
Philips Semiconductors and Philips Electronics North America Corporation  
register eligible circuits under the Semiconductor Chip Protection Act.  
Copyright Philips Electronics North America Corporation 1994  
All rights reserved. Printed in U.S.A.  
(print code)  
Date of release: July 1994  
9397-750-05119  
Document order number:  

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