NTS0102GT [NXP]
Dual supply translating transceiver; open drain; auto direction sensing; 双电源转换收发器;漏极开路;自动方向感应型号: | NTS0102GT |
厂家: | NXP |
描述: | Dual supply translating transceiver; open drain; auto direction sensing |
文件: | 总27页 (文件大小:394K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
NTS0102
Dual supply translating transceiver; open drain; auto
direction sensing
Rev. 3 — 17 November 2011
Product data sheet
1. General description
The NTS0102 is a 2-bit, dual supply translating transceiver with auto direction sensing,
that enables bidirectional voltage level translation. It features two 2-bit input-output ports
(An and Bn), one output enable input (OE) and two supply pins (VCC(A) and VCC(B)). VCC(A)
can be supplied at any voltage between 1.65 V and 3.6 V and VCC(B) can be supplied at
any voltage between 2.3 V and 5.5 V, making the device suitable for translating between
any of the voltage nodes (1.8 V, 2.5 V, 3.3 V and 5.0 V). Pins An and OE are referenced to
V
CC(A) and pins Bn are referenced to VCC(B). A LOW level at pin OE causes the outputs to
assume a high-impedance OFF-state. This device is fully specified for partial power-down
applications using IOFF. The IOFF circuitry disables the output, preventing the damaging
backflow current through the device when it is powered down.
2. Features and benefits
Wide supply voltage range:
VCC(A): 1.65 V to 3.6 V and VCC(B): 2.3 V to 5.5 V
Maximum data rates:
Push-pull: 50 Mbps
IOFF circuitry provides partial Power-down mode operation
Inputs accept voltages up to 5.5 V
ESD protection:
HBM JESD22-A114E Class 2 exceeds 2500 V for A port
HBM JESD22-A114E Class 3B exceeds 8000 V for B port
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101E exceeds 1500 V
Latch-up performance exceeds 100 mA per JESD 78B Class II
Multiple package options
Specified from 40 C to +85 C and 40 C to +125 C
3. Applications
I2C/SMBus
UART
GPIO
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
4. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
NTS0102DP
NTS0102GT
NTS0102GD
NTS0102GF
NTS0102GU
NTS0102GU8
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
TSSOP8 plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
SOT505-2
XSON8
plastic extremely thin small outline package;
SOT833-1
SOT996-2
SOT1089
SOT1160-1
no leads; 8 terminals; body 1 1.95 0.5 mm
XSON8U plastic extremely thin small outline package; no
leads; 8 terminals; UTLP based; body 3 2 0.5 mm
XSON8
extremely thin small outline package; no leads;
8 terminals; body 1.35 1 0.5 mm
XQFN10 plastic, extremely thin quad flat package; no leads;
10 terminals; body 1.40 1.80 0.50 mm
XQFN8
XQFN8: plastic, extremely thin quad flat package; no SOT1309-1
leads; 8 terminals; body 1.4 1.2 0.5 mm
5. Marking
Table 2.
Marking
Type number
NTS0102DP
NTS0102GT
NTS0102GD
NTS0102GF
NTS0102GU
NTS0102GU8
Marking code
s02
s02
s02
s2
s2
s2
NTS0102
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
2 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
6. Functional diagram
GATE BIAS
6
OE
A2
4
1
B2
5
A1
8
B1
V
V
CC(B)
CC(A)
GATE BIAS
001aal905
Fig 1. Logic symbol
7. Pinning information
7.1 Pinning
NTS0102
B2
1
8
B1
GND
2
3
4
7
6
5
V
CC(B)
NTS0102
V
OE
A1
CC(A)
1
2
3
4
8
7
6
5
B2
B1
GND
V
CC(B)
A2
V
OE
A1
CC(A)
A2
001aam489
Transparent top view
001aam488
Fig 2. Pin configuration SOT505-2 (TSSOP8)
Fig 3. Pin configuration SOT833-1 (XSON8) and
SOT1089 (XSON8)
NTS0102
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
3 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
NTS0102
terminal 1
index area
NTS0102
B2
1
2
3
4
8
7
6
5
B1
A2
1
2
7
6
n.c.
GND
V
CC(B)
V
V
CC(B)
CC(A)
V
OE
A1
CC(A)
A2
001aam559
001aam490
Transparent top view
Transparent top view
Fig 4. Pin configuration SOT996-2 (XSON8U)
Fig 5. Pin configuration SOT1160-1 (XQFN10)
NTS0102
terminal 1
index area
A1
A2
2
3
4
8
7
6
V
CC(B)
B1
B2
GND
aaa-001515
Transparent top view
Fig 6. Pin configuration SOT1309-1 (XQFN8)
NTS0102
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
4 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
7.2 Pin description
Table 3.
Symbol
Pin description
Pin
Description
SOT505-2, SOT833-1,
SOT1160-1 SOT1309
SOT1089 and SOT996-2
B2, B1
GND
1, 8
2
5, 8
9
6, 7
4
data input or output (referenced to VCC(B)
ground (0 V)
)
)
VCC(A)
A2, A1
OE
3
2
1
supply voltage A
4, 5
6
1, 10
4
3, 2
5
data input or output (referenced to VCC(A)
output enable input (active HIGH; referenced to
VCC(A)
)
VCC(B)
n.c.
7
-
6
8
-
supply voltage B
not connected
3, 7
8. Functional description
Table 4.
Function table[1]
Supply voltage
VCC(A)
Input
OE
L
Input/output
VCC(B)
An
Bn
1.65 V to VCC(B)
1.65 V to VCC(B)
GND[2]
2.3 V to 5.5 V
2.3 V to 5.5 V
GND[2]
Z
Z
H
input or output
Z
output or input
Z
X
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
[2] When either VCC(A) or VCC(B) is at GND level, the device goes into power-down mode.
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
VCC(A)
VCC(B)
VI
Parameter
Conditions
Min
Max
+6.5
+6.5
+6.5
+6.5
Unit
V
supply voltage A
supply voltage B
input voltage
0.5
0.5
0.5
0.5
V
[1][2]
[1][2]
[1][2]
A port and OE input
B port
V
V
VO
output voltage
Active mode
A or B port
0.5
VCCO + 0.5
V
[1]
Power-down or 3-state mode
A port
0.5
0.5
50
50
-
+4.6
+6.5
-
V
B port
V
IIK
input clamping current
output clamping current
output current
VI < 0 V
mA
mA
mA
mA
IOK
IO
VO < 0 V
-
[2]
VO = 0 V to VCCO
ICC(A) or ICC(B)
50
100
ICC
supply current
-
NTS0102
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
5 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
Table 5.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
IGND
Parameter
Conditions
Min
100
65
-
Max
-
Unit
mA
C
ground current
Tstg
storage temperature
total power dissipation
+150
250
[3]
Ptot
Tamb = 40 C to +125 C
mW
[1] The minimum input and minimum output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] VCCO is the supply voltage associated with the output.
[3] For TSSOP8 package: above 55 C the value of Ptot derates linearly with 2.5 mW/K.
For XSON8 and XSON8U packages: above 118 C the value of Ptot derates linearly with 7.8 mW/K.
For XQFN10 package: above 128 C the value of Ptot derates linearly with 11.5 mW/K.
For XQFN8 package: above 105.5 C the value of Ptot derates linearly with 5.6 mW/K.
10. Recommended operating conditions
Table 6.
Symbol
VCC(A)
VCC(B)
Tamb
Recommended operating conditions[1][2]
Parameter
Conditions
Min
1.65
2.3
Max
3.6
Unit
V
supply voltage A
supply voltage B
5.5
V
ambient temperature
40
+125
C
t/V
input transition rise and fall rate A or B port; push-pull driving
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
-
-
10
10
ns/V
ns/V
OE input
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
[1] The A and B sides of an unused I/O pair must be held in the same state, both at VCCI or both at GND.
[2] CC(A) must be less than or equal to VCC(B)
V
.
11. Static characteristics
Table 7.
Typical static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 C.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
II
input leakage
current
OE input; VI = 0 V to 3.6 V; VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
-
-
1
A
A
A
A
pF
[1]
IOZ
IOFF
OFF-stateoutput A or B port; VO = 0 V or VCCO; VCC(A) = 1.65 V to 3.6 V;
current
-
-
-
-
-
1
1
1
-
VCC(B) = 2.3 V to 5.5 V
power-off
A port; VI or VO = 0 V to 3.6 V;
-
leakage current VCC(A) = 0 V; VCC(B) = 0 V to 5.5 V
B port; VI or VO = 0 V to 5.5 V;
VCC(B) = 0 V; VCC(A) = 0 V to 3.6 V
-
CI
input
OE input; VCC(A) = 3.3 V; VCC(B) = 3.3 V
1
capacitance
NTS0102
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
6 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
Table 7.
Typical static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 C.
Symbol Parameter
Conditions
Min
Typ
5
Max
Unit
pF
CI/O
input/output
capacitance
A port
-
-
-
-
-
-
B port
8.5
11
pF
A or B port; VCC(A) = 3.3 V; VCC(B) = 3.3 V
pF
[1] VCCO is the supply voltage associated with the output.
Table 8.
Typical supply current
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 C.
VCC(A)
VCC(B)
2.5 V
ICC(A)
0.1
Unit
3.3 V
ICC(A)
0.1
5.0 V
ICC(A)
0.1
ICC(B)
0.5
ICC(B)
1.5
ICC(B)
4.6
1.8 V
2.5 V
3.3 V
A
A
A
0.1
0.1
0.1
0.8
0.1
3.8
-
-
0.1
0.1
0.1
2.8
Table 9.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
40 C to +85 C
40 C to +125 C
Unit
Min
Max
Min
Max
VIH
HIGH-level
A port
input voltage
[1]
[1]
VCC(A) = 1.65 V to 1.95 V;
VCC(B) = 2.3 V to 5.5 V
VCCI 0.2
VCCI 0.4
-
-
VCCI 0.2
VCCI 0.4
-
-
V
V
VCC(A) = 2.3 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
B port
[1]
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
VCCI 0.4
-
VCCI 0.4
-
V
V
V
V
V
V
OE input
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
0.65VCC(A)
-
0.65VCC(A)
-
VIL
LOW-level
A or B port
input voltage
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
-
0.15
-
0.15
OE input
VCC(A) = 1.65 V to 3.6 V;
-
0.35VCC(A)
-
0.35VCC(A)
V
CC(B) = 2.3 V to 5.5 V
VOH
HIGH-level
IO = 20 A
output voltage
[2]
[2]
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
0.67VCCO
-
0.67VCCO
-
VOL
LOW-level
A or B port; IO = 1 mA
output voltage
VI 0.15 V;
-
0.4
-
0.4
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
NTS0102
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
7 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
Table 9.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 40 C to +85 C
40 C to +125 C
Unit
Min
Max
Min
Max
II
input leakage OE input; VI = 0 V to 3.6 V;
-
2
-
12
A
current
VCC(A) = 1.65 V to 3.6 V;
CC(B) = 2.3 V to 5.5 V
V
[2]
IOZ
OFF-state
A or B port; VO = 0 V or VCCO
;
-
2
-
12
A
output current VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
IOFF
power-off
leakage
current
A port; VI or VO = 0 V to 3.6 V;
CC(A) = 0 V; VCC(B) = 0 V to 5.5 V
-
-
2
2
-
-
12
12
A
A
V
B port; VI or VO = 0 V to 3.6 V;
VCC(B) = 0 V; VCC(A) = 0 V to 3.6 V
[1]
ICC
supply current VI = 0 V or VCCI; IO = 0 A
ICC(A)
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
-
2.4
-
15
A
VCC(A) = 3.6 V; VCC(B) = 0 V
VCC(A) = 0 V; VCC(B) = 5.5 V
ICC(B)
-
-
2.2
-
-
15
A
A
1
8
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
-
12
-
30
A
V
CC(A) = 3.6 V; VCC(B) = 0 V
-
-
1
-
-
5
A
A
VCC(A) = 0 V; VCC(B) = 5.5 V
ICC(A) + ICC(B)
1
6
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
-
14.4
-
30
A
[1] VCCI is the supply voltage associated with the input.
[2] VCCO is the supply voltage associated with the output.
12. Dynamic characteristics
Table 10. Dynamic characteristics for temperature range 40 C to +85 C[1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 9; for wave forms see Figure 7 and Figure 8.
Symbol Parameter
Conditions
VCC(B)
Unit
2.5 V 0.2 V
3.3 V 0.3 V
5.0 V 0.5 V
Min
Max
Min
Max
Min
Max
VCC(A) = 1.8 V 0.15 V
tPHL
tPLH
tPHL
tPLH
HIGH to LOW
propagation delay
A to B
A to B
B to A
B to A
-
-
-
-
4.6
6.8
4.4
5.3
-
-
-
-
4.7
6.8
4.5
4.5
-
-
-
-
5.8
7.0
4.7
0.5
ns
ns
ns
ns
LOW to HIGH
propagation delay
HIGH to LOW
propagation delay
LOW to HIGH
propagation delay
NTS0102
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
8 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
Table 10. Dynamic characteristics for temperature range 40 C to +85 C[1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 9; for wave forms see Figure 7 and Figure 8.
Symbol Parameter
Conditions
VCC(B)
Unit
2.5 V 0.2 V
3.3 V 0.3 V
5.0 V 0.5 V
Min
Max
200
25
Min
Max
200
25
Min
Max
200
25
ten
enable time
disable time
OE to A; B
-
-
-
ns
ns
ns
ns
ns
ns
ns
[2]
[2]
tdis
OE to A; no external load
OE to B; no external load
OE to A
-
-
-
-
-
-
25
25
25
-
230
200
9.5
-
230
200
9.3
9.1
-
230
200
7.6
7.6
OE to B
-
-
-
tTLH
LOW to HIGH
output transition
time
A port
3.2
3.3
2.3
2.7
1.8
2.7
B port
10.8
tTHL
HIGH to LOW
output transition
time
A port
B port
2.0
2.9
5.9
7.6
1.9
2.8
6.0
7.5
1.7
2.8
13.3 ns
10.0 ns
[3]
tsk(o)
tW
output skew time
pulse width
data rate
between channels
data inputs
-
20
-
0.7
-
-
20
-
0.7
-
-
20
-
0.7
-
ns
ns
fdata
50
50
50
Mbps
VCC(A) = 2.5 V 0.2 V
tPHL
tPLH
tPHL
tPLH
HIGH to LOW
propagation delay
A to B
A to B
B to A
B to A
-
-
-
-
3.2
3.5
3.0
2.5
-
-
-
-
3.3
4.1
3.6
1.6
-
-
-
-
3.4
4.4
4.3
0.7
ns
ns
ns
ns
LOW to HIGH
propagation delay
HIGH to LOW
propagation delay
LOW to HIGH
propagation delay
ten
enable time
disable time
OE to A; B
-
200
20
-
200
20
-
200
20
ns
ns
ns
ns
ns
ns
ns
[2]
[2]
tdis
OE to A; no external load
OE to B; no external load
OE to A
-
-
-
-
-
-
20
20
20
-
200
200
7.4
8.3
-
200
200
6.6
7.9
-
200
200
6.2
6.8
OE to B
-
-
-
tTLH
LOW to HIGH
output transition
time
A port
2.8
3.2
2.6
2.9
1.8
2.4
B port
tTHL
HIGH to LOW
output transition
time
A port
B port
1.9
2.2
5.7
7.8
1.9
2.4
5.5
6.7
1.8
2.6
5.3
6.6
ns
ns
[3]
tsk(o)
tW
output skew time
pulse width
data rate
between channels
data inputs
-
20
-
0.7
-
-
20
-
0.7
-
-
20
-
0.7
-
ns
ns
fdata
50
50
50
Mbps
VCC(A) = 3.3 V 0.3 V
tPHL
HIGH to LOW
propagation delay
A to B
A to B
-
-
-
-
-
-
2.4
4.2
-
-
3.1
4.4
ns
ns
tPLH
LOW to HIGH
propagation delay
NTS0102
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
9 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
Table 10. Dynamic characteristics for temperature range 40 C to +85 C[1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 9; for wave forms see Figure 7 and Figure 8.
Symbol Parameter
Conditions
VCC(B)
Unit
2.5 V 0.2 V
3.3 V 0.3 V
5.0 V 0.5 V
Min
Max
Min
Max
Min
Max
tPHL
tPLH
HIGH to LOW
propagation delay
B to A
B to A
-
-
-
2.5
-
3.3
ns
ns
LOW to HIGH
-
-
-
2.5
-
2.6
propagation delay
ten
enable time
disable time
OE to A; B
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
200
15
-
200
15
ns
ns
ns
ns
ns
ns
ns
[2]
[2]
tdis
OE to A; no external load
OE to B; no external load
OE to A
-
-
-
-
15
15
-
260
200
5.6
6.4
-
260
200
5.9
7.4
OE to B
-
-
tTLH
LOW to HIGH
output transition
time
A port
2.3
2.5
1.9
2.1
B port
tTHL
HIGH to LOW
output transition
time
A port
B port
-
-
-
-
2.0
2.3
5.4
7.4
1.9
2.4
5.0
7.6
ns
ns
[3]
tsk(o)
tW
output skew time
pulse width
data rate
between channels
data inputs
-
-
-
-
-
-
-
20
-
0.7
-
-
20
-
0.7
-
ns
ns
fdata
50
50
Mbps
[1] ten is the same as tPZL and tPZH
tdis is the same as tPLZ and tPHZ
[2] Delay between OE going LOW and when the outputs are actually disabled.
[3] Skew between any two outputs of the same package switching in the same direction.
.
.
Table 11. Dynamic characteristics for temperature range 40 C to +125 C[1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 9; for wave forms see Figure 7 and Figure 8.
Symbol Parameter
Conditions
VCC(B)
Unit
2.5 V 0.2 V
3.3 V 0.3 V
5.0 V 0.5 V
Min
Max
Min
Max
Min
Max
VCC(A) = 1.8 V 0.15 V
tPHL
tPLH
tPHL
tPLH
ten
HIGH to LOW
propagation delay
A to B
-
-
-
-
-
5.8
8.5
5.5
6.7
200
-
-
-
-
-
5.9
8.5
5.7
5.7
200
-
-
-
-
-
7.3
8.8
5.9
0.7
200
ns
ns
ns
ns
ns
LOW to HIGH
propagation delay
A to B
HIGH to LOW
propagation delay
B to A
LOW to HIGH
propagation delay
B to A
enable time
OE to A; B
NTS0102
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
10 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
Table 11. Dynamic characteristics for temperature range 40 C to +125 C[1] …continued
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 9; for wave forms see Figure 7 and Figure 8.
Symbol Parameter
Conditions
VCC(B)
Unit
2.5 V 0.2 V
3.3 V 0.3 V
5.0 V 0.5 V
Min
Max
30
Min
Max
30
Min
Max
30
[2]
[2]
tdis
disable time
OE to A; no external load
-
-
-
-
-
-
ns
ns
ns
ns
ns
ns
OE to B; no external load
30
30
30
OE to A
OE to B
A port
-
250
220
11.9
13.5
-
250
220
11.7
11.4
-
250
220
9.5
9.5
-
-
-
tTLH
LOW to HIGH
output transition
time
3.2
3.3
2.3
2.7
1.8
2.7
B port
tTHL
HIGH to LOW
output transition
time
A port
B port
2.0
2.9
7.4
9.5
1.9
2.8
7.5
9.4
1.7
2.8
16.7 ns
12.5 ns
[3]
tsk(o)
tW
output skew time
pulse width
data rate
between channels
data inputs
-
20
-
0.8
-
-
20
-
0.8
-
-
20
-
0.8
-
ns
ns
fdata
50
50
50
Mbps
VCC(A) = 2.5 V 0.2 V
tPHL
tPLH
tPHL
tPLH
HIGH to LOW
propagation delay
A to B
A to B
B to A
B to A
-
-
-
-
4.0
4.4
3.8
3.2
-
-
-
-
4.2
5.2
4.5
2.0
-
-
-
-
4.3
5.5
5.4
0.9
ns
ns
ns
ns
LOW to HIGH
propagation delay
HIGH to LOW
propagation delay
LOW to HIGH
propagation delay
ten
enable time
disable time
OE to A; B
-
200
25
-
200
25
-
200
25
ns
ns
ns
ns
ns
ns
ns
[2]
[2]
tdis
OE to A; no external load
OE to B; no external load
OE to A
-
-
-
-
-
-
25
25
25
-
220
220
9.3
-
220
220
8.3
9.7
-
220
220
7.8
8.3
OE to B
-
-
-
tTLH
LOW to HIGH
output transition
time
A port
2.8
3.2
2.6
2.9
1.8
2.4
B port
10.4
tTHL
HIGH to LOW
output transition
time
A port
B port
1.9
2.2
7.2
9.8
1.9
2.4
6.9
8.4
1.8
2.6
6.7
8.3
ns
ns
[3]
tsk(o)
tW
output skew time
pulse width
data rate
between channels
data inputs
-
20
-
0.8
-
-
20
-
0.8
-
-
20
-
0.8
-
ns
ns
fdata
50
50
50
Mbps
VCC(A) = 3.3 V 0.3 V
tPHL
HIGH to LOW
propagation delay
A to B
A to B
-
-
-
-
-
-
3.0
5.3
-
-
3.9
5.5
ns
ns
tPLH
LOW to HIGH
propagation delay
NTS0102
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Product data sheet
Rev. 3 — 17 November 2011
11 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
Table 11. Dynamic characteristics for temperature range 40 C to +125 C[1] …continued
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 9; for wave forms see Figure 7 and Figure 8.
Symbol Parameter
Conditions
VCC(B)
Unit
2.5 V 0.2 V
3.3 V 0.3 V
5.0 V 0.5 V
Min
Max
Min
Max
Min
Max
tPHL
tPLH
HIGH to LOW
propagation delay
B to A
B to A
-
-
-
3.2
-
4.2
ns
ns
LOW to HIGH
-
-
-
3.2
-
3.3
propagation delay
ten
enable time
disable time
OE to A; B
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
200
20
-
200
20
ns
ns
ns
ns
ns
ns
ns
[2]
[2]
tdis
OE to A; no external load
OE to B; no external load
OE to A
-
-
-
-
20
20
-
280
220
7.0
8.0
-
280
220
7.4
9.3
OE to B
-
-
tTLH
LOW to HIGH
output transition
time
A port
2.3
2.5
1.9
2.1
B port
tTHL
HIGH to LOW
output transition
time
A port
B port
-
-
-
-
2.0
2.3
6.8
9.3
1.9
2.4
6.3
9.5
ns
ns
[3]
tsk(o)
tW
output skew time
pulse width
data rate
between channels
data inputs
-
-
-
-
-
-
-
20
-
0.8
-
-
20
-
0.8
-
ns
ns
fdata
50
50
Mbps
[1] ten is the same as tPZL and tPZH
tdis is the same as tPLZ and tPHZ
[2] Delay between OE going LOW and when the outputs are actually disabled.
.
.
[3] Skew between any two outputs of the same package switching in the same direction.
13. Waveforms
V
I
An, Bn
input
V
M
GND
t
t
PHL
PLH
V
OH
90 %
Bn, An
output
V
M
10 %
V
OL
t
t
THL
TLH
001aal918
Measurement points are given in Table 12.
VOL and VOH are typical output voltage levels that occur with the output load.
Fig 7. The data input (An, Bn) to data output (Bn, An) propagation delay times
NTS0102
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Product data sheet
Rev. 3 — 17 November 2011
12 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
V
I
OE input
V
M
GND
t
t
PLZ
PZL
V
CCO
output
V
LOW-to-OFF
OFF-to-LOW
M
V
X
V
OL
t
t
PHZ
PZH
V
OH
V
Y
output
HIGH-to-OFF
OFF-to-HIGH
V
M
GND
outputs
enabled
outputs
disabled
outputs
enabled
001aal919
Measurement points are given in Table 12.
OL and VOH are typical output voltage levels that occur with the output load.
V
Fig 8. Enable and disable times
Table 12. Measurement points[1][2]
Supply voltage
VCCO
Input
Output
VM
VM
VX
VY
1.8 V 0.15 V
2.5 V 0.2 V
3.3 V 0.3 V
5.0 V 0.5 V
0.5VCCI
0.5VCCI
0.5VCCI
0.5VCCI
0.5VCCO
0.5VCCO
0.5VCCO
0.5VCCO
VOL + 0.15 V
VOL + 0.15 V
VOL + 0.3 V
VOL + 0.3 V
VOH 0.15 V
VOH 0.15 V
VOH 0.3 V
VOH 0.3 V
[1] VCCI is the supply voltage associated with the input.
[2] VCCO is the supply voltage associated with the output.
NTS0102
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Product data sheet
Rev. 3 — 17 November 2011
13 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
t
W
V
I
90 %
negative
pulse
V
M
V
M
10 %
0 V
t
t
r
f
t
t
f
r
V
I
90 %
positive
pulse
V
V
M
M
10 %
0 V
t
W
V
EXT
V
CC
R
L
V
V
O
I
G
DUT
C
L
R
L
001aal963
Test data is given in Table 13.
All input pulses are supplied by generators having the following characteristics: PRR 10 MHz; ZO = 50 ; dV/dt 1.0 V/ns.
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
VEXT = External voltage for measuring switching times.
Fig 9. Test circuit for measuring switching times
Table 13. Test data
Supply voltage
VCC(A)
Input
VI[1]
Load
CL
VEXT
[2]
[3]
VCC(B)
t/V
RL
tPLH, tPHL tPZH, tPHZ tPZL, tPLZ
1.65 V to 3.6 V 2.3 V to 5.5 V VCCI
1.0 ns/V
15 pF
50 k, 1 M open
open
2VCCO
[1] VCCI is the supply voltage associated with the input.
[2] For measuring data rate, pulse width, propagation delay and output rise and fall measurements, RL = 1 M; for measuring enable and
disable times, RL = 50 K.
[3]
VCCO is the supply voltage associated with the output.
NTS0102
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
14 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
14. Application information
14.1 Applications
Voltage level-translation applications. The NTS0102 can be used in point-to-point
applications to interface between devices or systems operating at different supply
voltages. The device is primarily targeted at I2C or 1-wire which use open-drain drivers, it
may also be used in applications where push-pull drivers are connected to the ports,
however the NTB0102 may be more suitable.
1.8 V
3.3 V
1.8 V
V
V
CC(B)
3.3 V
0.1 μF
0.1 μF
1 μF
CC(A)
SYSTEM
SYSTEM
CONTROLLER
OE
NTS0102
A1
A2
B1
B2
DATA
DATA
001aam491
Fig 10. Typical operating circuit
14.2 Architecture
The architecture of the NTS0102 is shown in Figure 11. The device does not require an
extra input signal to control the direction of data flow from A to B or B to A.
V
V
CC(B)
CC(A)
T1
T2
ONE
ONE
SHOT
SHOT
10 kΩ
10 kΩ
GATE BIAS
T3
A
B
001aal965
Fig 11. Architecture of NTS0102 I/O cell (one channel)
The NTS0102 is a "switch" type voltage translator, it employs two key circuits to enable
voltage translation:
1. A pass-gate transistor (N-channel) that ties the ports together.
2. An output edge-rate accelerator that detects and accelerates rising edges on the I/O
pins.
NTS0102
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Product data sheet
Rev. 3 — 17 November 2011
15 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
The gate bias voltage of the pass gate transistor (T3) is set at approximately one
threshold voltage above the VCC level of the low-voltage side. During a LOW-to-HIGH
transition the output one-shot accelerates the output transition by switching on the PMOS
transistors (T1, T2) bypassing the 10 k pull-up resistors and increasing current drive
capability. The one-shot is activated once the input transition reaches approximately
V
CCI/2; it is de-activated approximately 50 ns after the output reaches VCCO/2. During the
acceleration time the driver output resistance is between approximately 50 and 70 . To
avoid signal contention and minimize dynamic ICC, the user should wait for the one-shot
circuit to turn-off before applying a signal in the opposite direction. Pull-up resistors are
included in the device for DC current sourcing capability.
14.3 Input driver requirements
As the NTS0102 is a switch type translator, properties of the input driver directly effect the
output signal. The external open-drain or push-pull driver applied to an I/O determines the
static current sinking capability of the system; the max data rate, HIGH-to-LOW output
transition time (tTHL) and propagation delay (tPHL) are dependent upon the output
impedance and edge-rate of the external driver. The limits provided for these parameters
in the datasheet assume a driver with output impedance below 50 is used.
14.4 Output load considerations
The maximum lumped capacitive load that can be driven is dependant upon the one-shot
pulse duration. In cases with very heavy capacitive loading there is a risk that the output
will not reach the positive rail within the one-shot pulse duration.
To avoid excessive capacitive loading and to ensure correct triggering of the one-shot it's
recommended to use short trace lengths and low capacitance connectors on NTS0102
PCB layouts. To ensure low impedance termination and avoid output signal oscillations
and one-shot re-triggering, the length of the PCB trace should be such that the round trip
delay of any reflection is within the one-shot pulse duration (approximately 50 ns).
14.5 Power up
During operation VCC(A) must never be higher than VCC(B), however during power-up
VCC(A) VCC(B) does not damage the device, so either power supply can be ramped up
first. There is no special power-up sequencing required. The NTS0102 includes circuitry
that disables all output ports when either VCC(A) or VCC(B) is switched off.
14.6 Enable and disable
An output enable input (OE) is used to disable the device. Setting OE = LOW
causes all I/Os to assume the high-impedance OFF-state. The disable time (tdis with no
external load) indicates the delay between when OE goes LOW and when outputs
actually become disabled. The enable time (ten) indicates the amount of time the user
must allow for one one-shot circuitry to become operational after OE is taken HIGH. To
ensure the high-impedance OFF-state during power-up or power-down, pin OE should be
tied to GND through a pull-down resistor, the minimum value of the resistor is determined
by the current-sourcing capability of the driver.
NTS0102
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
16 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
14.7 Pull-up or pull-down resistors on I/Os lines
Each A port I/O has an internal 10 k pull-up resistor to VCC(A), and each B port I/O has
an internal 10 k pull-up resistor to VCC(B). If a smaller value of pull-up resistor is required,
an external resistor must be added parallel to the internal 10 k, this will effect the VOL
level. When OE goes LOW the internal pull-ups of the NTS0102 are disabled.
NTS0102
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
17 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
15. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
SOT505-2
D
E
A
X
c
H
v
M
y
A
E
Z
5
8
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
detail X
1
4
e
w
M
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
A
A
A
b
c
D
E
e
H
E
L
L
p
UNIT
v
w
y
Z
θ
1
2
3
p
max.
0.15
0.00
0.95
0.75
0.38
0.22
0.18
0.08
3.1
2.9
3.1
2.9
4.1
3.9
0.47
0.33
0.70
0.35
8°
0°
mm
1.1
0.65
0.25
0.5
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-01-16
SOT505-2
- - -
Fig 12. Package outline SOT505-2 (TSSOP8)
NTS0102
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
18 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm
SOT833-1
b
1
2
3
4
4×
(2)
L
L
1
e
8
7
6
5
e
1
e
1
e
1
8×
A
(2)
A
1
D
E
terminal 1
index area
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
A
1
UNIT
b
D
E
e
e
1
L
L
1
max max
0.25
0.17
2.0
1.9
1.05
0.95
0.35 0.40
0.27 0.32
mm
0.5 0.04
0.6
0.5
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
- - -
07-11-14
07-12-07
SOT833-1
- - -
MO-252
Fig 13. Package outline SOT833-1 (XSON8)
NTS0102
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
19 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
XSON8U: plastic extremely thin small outline package; no leads;
8 terminals; UTLP based; body 3 x 2 x 0.5 mm
SOT996-2
D
B
A
E
A
A
1
detail X
terminal 1
index area
e
1
C
M
M
v
C
C
A
B
b
e
L
1
y
1
y
w
C
1
4
L
2
L
8
5
X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
b
D
E
e
e
1
L
L
L
v
w
y
y
1
1
1
2
max
0.05 0.35
0.00 0.15
2.1
1.9
3.1
2.9
0.5
0.3
0.15
0.05
0.6
0.4
mm
0.5
0.5
1.5
0.1
0.05 0.05
0.1
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
- - -
JEDEC
JEITA
07-12-18
07-12-21
SOT996-2
- - -
Fig 14. Package outline SOT996-2 (XSON8U)
NTS0102
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Product data sheet
Rev. 3 — 17 November 2011
20 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
XSON8: extremely thin small outline package; no leads;
8 terminals; body 1.35 x 1 x 0.5 mm
SOT1089
E
terminal 1
index area
D
A
A
1
detail X
(2)
(4×)
e
L
(2)
(8×)
b
4
5
e
1
1
8
terminal 1
index area
L
1
X
0
0.5
1 mm
scale
Dimensions
Unit
(1)
A
A
b
D
E
e
e
1
L
L
1
1
max 0.5 0.04 0.20 1.40 1.05
0.35 0.40
0.15 1.35 1.00 0.55 0.35 0.30 0.35
0.12 1.30 0.95 0.27 0.32
mm nom
min
Note
1. Including plating thickness.
2. Visible depending upon used manufacturing technology.
sot1089_po
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
10-04-09
10-04-12
SOT1089
MO-252
Fig 15. Package outline SOT1089 (XSON8)
NTS0102
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Product data sheet
Rev. 3 — 17 November 2011
21 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
XQFN10: plastic, extremely thin quad flat package; no leads;
10 terminals; body 1.40 x 1.80 x 0.50 mm
SOT1160-1
X
D
B
A
E
terminal 1
index area
A
A
1
A
3
detail X
e
1
e
C
v
C A
B
b
y
C
1
y
w
C
3
5
L
2
1
6
7
e
2
terminal 1
index area
10
8
L
1
0
1
2 mm
w
scale
Dimensions
(1)
Unit
A
A
A
b
D
E
e
e
e
2
L
L
1
v
y
y
1
1
3
1
max 0.5 0.05
mm nom
min
0.25 1.5 1.9
0.127 0.20 1.4 1.8 0.4 0.8 0.4 0.40 0.50 0.1 0.05 0.05 0.05
0.15 1.3 1.7 0.35 0.45
0.45 0.55
0.00
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
sot1160-1_po
References
Outline
version
European
projection
Issue date
IEC
- - -
JEDEC
- - -
JEITA
- - -
09-12-28
09-12-29
SOT1160-1
Fig 16. Package outline SOT1160-1 (XQFN10)
NTS0102
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
22 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
XQFN8: plastic, extremely thin quad flat package; no leads;
8 terminals; body 1.4 x 1.2 x 0.5 mm
SOT1309-1
B
A
E
D
A
A
1
A
3
terminal 1
index area
detail X
e
1
v
C
C
A
B
C
b
w
terminal 1
index area
y
1
y
e
C
2
4
L
1
b
5
8
6
X
L
1
0
3 mm
scale
Dimensions
Unit
A
A
1
A
3
b
D
E
e
e
1
L
L
v
w
y
y
1
1
max 0.50 0.025
mm nom
min
0.25 1.45 1.25
0.127 0.20 1.40 1.20 0.4 0.8 0.30 0.40 0.10 0.05 0.05 0.05
0.15 1.35 1.15 0.25 0.35
0.35 0.45
0.00
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included
sot1309-1_po
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
11-08-18
11-08-23
SOT1309-1
MO-255
Fig 17. Package outline SOT1309-1 (XQFN8)
NTS0102
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
23 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
16. Abbreviations
Table 14. Abbreviations
Acronym
CDM
CMOS
DUT
Description
Charged Device Model
Complementary Metal Oxide Semiconductor
Device Under Test
ESD
ElectroStatic Discharge
GPIO
General Purpose Input Output
Human Body Model
HBM
I2C
Inter-Integrated Circuit
MM
Machine Model
PCB
Printed Circuit Board
PMOS
SMBus
UART
UTLP
Positive Metal Oxide Semiconductor
System Management Bus
Universal Asynchronous Receiver Transmitter
Ultra Thin Leadless Package
17. Revision history
Table 15. Revision history
Document ID
NTS0102 v.3
Modifications:
NTS0102 v.2
NTS0102 v.1
Release date
20111117
Data sheet status
Change notice
Supersedes
Product data sheet
-
NTS0102 v.2
• Added type number NTS0102GU8 (SOT1309-1/XQFN8 package).
20110411
Product data sheet
-
NTS0102 v.1
-
20100921
Product data sheet
-
NTS0102
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
24 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
18.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
18.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
NTS0102
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
25 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NTS0102
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 17 November 2011
26 of 27
NTS0102
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
20. Contents
1
2
3
4
5
6
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
7
7.1
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
8
Functional description . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 6
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
9
10
11
12
13
14
Application information. . . . . . . . . . . . . . . . . . 15
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Input driver requirements . . . . . . . . . . . . . . . . 16
Output load considerations. . . . . . . . . . . . . . . 16
Power up . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Enable and disable. . . . . . . . . . . . . . . . . . . . . 16
Pull-up or pull-down resistors on I/Os lines . . 17
14.1
14.2
14.3
14.4
14.5
14.6
14.7
15
16
17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 24
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 24
18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 25
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 26
18.1
18.2
18.3
18.4
19
20
Contact information. . . . . . . . . . . . . . . . . . . . . 26
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 17 November 2011
Document identifier: NTS0102
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