NTS0104GU12 [NXP]
Dual supply translating transceiver; open drain; auto direction sensing; 双电源转换收发器;漏极开路;自动方向感应型号: | NTS0104GU12 |
厂家: | NXP |
描述: | Dual supply translating transceiver; open drain; auto direction sensing |
文件: | 总26页 (文件大小:218K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
NTS0104
Dual supply translating transceiver; open drain; auto
direction sensing
Rev. 2 — 27 April 2011
Product data sheet
1. General description
The NTS0104 is a 4-bit, dual supply translating transceiver with auto direction sensing,
that enables bidirectional voltage level translation. It features two 4-bit input-output ports
(An and Bn), one output enable input (OE) and two supply pins (VCC(A) and VCC(B)). VCC(A)
can be supplied at any voltage between 1.65 V and 3.6 V and VCC(B) can be supplied at
any voltage between 2.3 V and 5.5 V, making the device suitable for translating between
any of the voltage nodes (1.8 V, 2.5 V, 3.3 V and 5.0 V). Pins An and OE are referenced to
V
CC(A) and pins Bn are referenced to VCC(B). A LOW level at pin OE causes the outputs to
assume a high-impedance OFF-state. This device is fully specified for partial power-down
applications using IOFF. The IOFF circuitry disables the output, preventing the damaging
backflow current through the device when it is powered down.
2. Features and benefits
Wide supply voltage range:
VCC(A): 1.65 V to 3.6 V and VCC(B): 2.3 V to 5.5 V
Maximum data rates:
Push-pull: 50 Mbps
IOFF circuitry provides partial Power-down mode operation
Inputs accept voltages up to 5.5 V
ESD protection:
HBM JESD22-A114E Class 2 exceeds 2500 V for A port
HBM JESD22-A114E Class 3B exceeds 8000 V for B port
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101E exceeds 1500 V
IEC61000-4-2 contact discharge exceeds 8000 V for B port
Latch-up performance exceeds 100 mA per JESD 78B Class II
Multiple package options
Specified from −40 °C to +85 °C and −40 °C to +125 °C
3. Applications
I2C/SMBus
UART
GPIO
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
4. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature
range
Name
Description
Version
NTS0104D
−40 °C to +125 °C SO14
plastic small outline package; 14 leads;
body width 3.9 mm
SOT108-1
SOT402-1
NTS0104PW
NTS0104BQ
−40 °C to +125 °C TSSOP14
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
−40 °C to +125 °C DHVQFN14 plastic dual in-line compatible thermal enhanced very SOT762-1
thin quad flat package; no leads; 14 terminals;
body 2.5 × 3 × 0.85 mm
NTS0104GU16
NTS0104GU12
−40 °C to +125 °C XQFN16
−40 °C to +125 °C XQFN12
plastic, extremely thin quad flat package; no leads;
16 terminals; body 1.80 × 2.60 × 0.50 mm
SOT1161-1
SOT1174-1
plastic, extremely thin quad flat package; no leads;
12 terminals; body 1.70 × 2.0 × 0.50 mm
5. Marking
Table 2.
Marking
Type number
NTS0104D
Marking code
NTS0104D
NTS0104
S0104
NTS0104PW
NTS0104BQ
NTS0104GU16
NTS0104GU12
s4
s4
NTS0104
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© NXP B.V. 2011. All rights reserved.
Product Specification
Rev. 2 — 27 April 2011
2 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
6. Functional diagram
GATE BIAS
OE
A1
B1
A2
A3
A4
B2
GATE BIAS
B3
GATE BIAS
B4
V
CC(A)
V
CC(B)
GATE BIAS
001aan110
Fig 1. Logic symbol
NTS0104
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© NXP B.V. 2011. All rights reserved.
Product Specification
Rev. 2 — 27 April 2011
3 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
7. Pinning information
7.1 Pinning
NTS0104
terminal 1
index area
NTS0104
2
3
4
5
6
13
12
11
10
9
A1
A2
B1
B2
B3
B4
n.c.
1
2
3
4
5
6
7
14
13
12
11
10
9
V
V
CC(B)
CC(A)
A1
B1
B2
B3
B4
n.c.
OE
A3
A2
A3
A4
(1)
GND
n.c.
A4
n.c.
GND
001aan112
8
Transparent top view
001aan111
(1) This is not a supply pin, the substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad
however if it is soldered the solder land should remain
floating or be connected to GND.
Fig 2. Pin configuration SO14 (SOT108-1) and
TSSOP14 (SOT402-1)
Fig 3. Pin configuration DHVQFN14 (SOT762-1)
terminal 1
index area
NTS0104
terminal 1
index area
A1
A2
A3
A4
1
2
3
4
12 B1
11 B2
10 B3
V
CC(A)
1
2
3
4
5
11
V
CC(B)
A1
10 B1
NTS0104
A2
A3
A4
9
8
7
B2
B3
9
B4
B4
001aan113
001aan114
Transparent top view
Transparent top view
Fig 4. Pin configuration XQFN16 (SOT1161-1)
Fig 5. Pin configuration XQFN12 (SOT1174-1)
NTS0104
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© NXP B.V. 2011. All rights reserved.
Product Specification
Rev. 2 — 27 April 2011
4 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
7.2 Pin description
Table 3.
Symbol
Pin description
Pin
Description
SOT108-1,SOT402-1 SOT1161-1 SOT1174-1
and SOT762-1
VCC(A)
1
16
1
supply voltage A
A1, A2, A3, A4 2, 3, 4, 5
1, 2, 3, 4
5, 14, 15
6, 7
2, 3, 4, 5
data input or output (referenced to VCC(A)
)
n.c.
GND
OE
6, 9
7
-
not connected
6
ground (0 V)
8
8
12
output enable input (active HIGH; referenced to VCC(A))
B4, B3, B2, B1 10, 11, 12, 13
VCC(B) 14
9, 10, 11, 12 7, 8, 9, 10 data input or output (referenced to VCC(B))
13
11
supply voltage B
8. Functional description
Table 4.
Function table[1]
Supply voltage
VCC(A)
Input
Input/output
VCC(B)
OE
L
An
Bn
1.65 V to VCC(B)
1.65 V to VCC(B)
GND[2]
2.3 V to 5.5 V
2.3 V to 5.5 V
GND[2]
Z
Z
H
input or output
Z
output or input
Z
X
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
[2] When either VCC(A) or VCC(B) is at GND level, the device goes into power-down mode.
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
VCC(A)
VCC(B)
VI
Parameter
Conditions
Min
Max
+6.5
+6.5
+6.5
+6.5
Unit
V
supply voltage A
supply voltage B
input voltage
−0.5
−0.5
−0.5
−0.5
V
[1][2]
[1][2]
[1][2]
A port and OE input
B port
V
V
VO
output voltage
Active mode
A or B port
−0.5
VCCO + 0.5
V
[1]
Power-down or 3-state mode
A port
−0.5
−0.5
−50
−50
-
+4.6
+6.5
-
V
B port
V
IIK
input clamping current
output clamping current
output current
VI < 0 V
mA
mA
mA
mA
IOK
IO
VO < 0 V
-
[2]
VO = 0 V to VCCO
ICC(A) or ICC(B)
±50
100
ICC
supply current
-
NTS0104
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© NXP B.V. 2011. All rights reserved.
Product Specification
Rev. 2 — 27 April 2011
5 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
Table 5.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
IGND
Parameter
Conditions
Min
−100
−65
-
Max
-
Unit
mA
°C
ground current
Tstg
storage temperature
total power dissipation
+150
250
[3]
Ptot
Tamb = −40 °C to +125 °C
mW
[1] The minimum input and minimum output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] VCCO is the supply voltage associated with the output.
[3] For SO14 packages: above 70 °C the value of Ptot derates linearly at 8 mW/K.
For TSSOP14 packages: above 60 °C the value of Ptot derates linearly at 5.5 mW/K.
For DHVQFN14 packages: above 60 °C the value of Ptot derates linearly at 4.5 mW/K.
For XQFN12 packages: above 128 °C the value of Ptot derates linearly with 11.5 mW/K.
For XQFN16 packages: above 135 the value of Ptot derates linearly at 16.9 mW/K.
10. Recommended operating conditions
Table 6.
Symbol
VCC(A)
VCC(B)
Tamb
Recommended operating conditions[1][2]
Parameter
Conditions
Min
1.65
2.3
Max
3.6
Unit
V
supply voltage A
supply voltage B
5.5
V
ambient temperature
−40
+125
°C
Δt/ΔV
input transition rise and fall rate A or B port; push-pull driving
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
-
-
10
10
ns/V
ns/V
OE input
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
[1] The A and B sides of an unused I/O pair must be held in the same state, both at VCCI or both at GND.
[2] VCC(A) must be less than or equal to VCC(B)
.
11. Static characteristics
Table 7.
Typical static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 °C.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
II
input leakage
current
OE input; VI = 0 V to 3.6 V; VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
-
-
±1
μA
μA
μA
μA
pF
[1]
IOZ
IOFF
OFF-stateoutput A or B port; VO = 0 V or VCCO; VCC(A) = 1.65 V to 3.6 V;
current
-
-
-
-
-
±1
±1
±1
-
VCC(B) = 2.3 V to 5.5 V
power-off
A port; VI or VO = 0 V to 3.6 V;
-
leakage current VCC(A) = 0 V; VCC(B) = 0 V to 5.5 V
B port; VI or VO = 0 V to 5.5 V;
VCC(B) = 0 V; VCC(A) = 0 V to 3.6 V
-
CI
input
OE input; VCC(A) = 3.3 V; VCC(B) = 3.3 V
2
capacitance
NTS0104
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© NXP B.V. 2011. All rights reserved.
Product Specification
Rev. 2 — 27 April 2011
6 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
Table 7.
Typical static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 °C.
Symbol Parameter
Conditions
Min
Typ
4
Max
Unit
pF
CI/O
input/output
capacitance
A port
-
-
-
-
-
-
B port
7
pF
A or B port; VCC(A) = 3.3 V; VCC(B) = 3.3 V
9
pF
[1] VCCO is the supply voltage associated with the output.
Table 8.
Typical supply current
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 °C.
VCC(A)
VCC(B)
3.3 V
Unit
2.5 V
5.0 V
ICC(A)
0.1
0.1
-
ICC(B)
0.5
0.1
-
ICC(A)
0.1
ICC(B)
1.5
ICC(A)
0.1
ICC(B)
1.8 V
2.5 V
3.3 V
4.6
3.8
2.8
μA
μA
μA
0.1
0.8
0.1
0.1
0.1
0.1
Table 9.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
−40 °C to +85 °C
−40 °C to +125 °C
Unit
Min
Max
Min
Max
VIH
HIGH-level
A port
input voltage
[1]
[1]
VCC(A) = 1.65 V to 1.95 V;
VCC(B) = 2.3 V to 5.5 V
VCCI − 0.2
VCCI − 0.4
-
-
VCCI − 0.2
VCCI − 0.4
-
-
V
V
VCC(A) = 2.3 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
B port
[1]
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
VCCI − 0.4
-
VCCI − 0.4
-
V
V
V
V
V
V
OE input
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
0.65VCC(A)
-
0.65VCC(A)
-
VIL
LOW-level
A or B port
input voltage
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
-
0.15
-
0.15
OE input
VCC(A) = 1.65 V to 3.6 V;
-
0.35VCC(A)
-
0.35VCC(A)
VCC(B) = 2.3 V to 5.5 V
VOH
HIGH-level
A or B port; IO = −20 μA
output voltage
[2]
[2]
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
0.67VCCO
-
0.67VCCO
-
VOL
LOW-level
A or B port; IO = 1 mA
output voltage
VI ≤ 0.15 V;
-
0.4
-
0.4
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
NTS0104
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© NXP B.V. 2011. All rights reserved.
Product Specification
Rev. 2 — 27 April 2011
7 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
Table 9.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions −40 °C to +85 °C
−40 °C to +125 °C
Unit
Min
Max
Min
Max
II
input leakage OE input; VI = 0 V to 3.6 V;
-
±2
-
±12
μA
current
VCC(A) = 1.65 V to 3.6 V;
CC(B) = 2.3 V to 5.5 V
V
[2]
IOZ
OFF-state
A or B port; VO = 0 V or VCCO
;
-
±2
-
±12
μA
output current VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
IOFF
power-off
leakage
current
A port; VI or VO = 0 V to 3.6 V;
CC(A) = 0 V; VCC(B) = 0 V to 5.5 V
-
-
±2
±2
-
-
±12
±12
μA
μA
V
B port; VI or VO = 0 V to 3.6 V;
VCC(B) = 0 V; VCC(A) = 0 V to 3.6 V
[1]
ICC
supply current VI = 0 V or VCCI; IO = 0 A
ICC(A)
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
-
2.4
-
15
μA
VCC(A) = 3.6 V; VCC(B) = 0 V
VCC(A) = 0 V; VCC(B) = 5.5 V
ICC(B)
-
-
2.2
-
-
15
μA
μA
−1
−8
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
-
12
-
30
μA
V
CC(A) = 3.6 V; VCC(B) = 0 V
-
-
−1
-
-
−5
μA
μA
VCC(A) = 0 V; VCC(B) = 5.5 V
ICC(A) + ICC(B)
1
6
VCC(A) = 1.65 V to 3.6 V;
VCC(B) = 2.3 V to 5.5 V
-
14.4
-
45
μA
[1] VCCI is the supply voltage associated with the input.
[2] VCCO is the supply voltage associated with the output.
12. Dynamic characteristics
Table 10. Dynamic characteristics for temperature range −40 °C to +85 °C[1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7.
Symbol Parameter
Conditions
VCC(B)
Unit
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5.0 V ± 0.5 V
Min
Max
Min
Max
Min
Max
VCC(A) = 1.8 V ± 0.15 V
tPHL
tPLH
tPHL
tPLH
HIGH to LOW
propagation delay
A to B
A to B
B to A
B to A
-
-
-
-
4.6
6.8
4.4
5.3
-
-
-
-
4.7
6.8
4.5
4.5
-
-
-
-
5.8
7.0
4.7
0.5
ns
ns
ns
ns
LOW to HIGH
propagation delay
HIGH to LOW
propagation delay
LOW to HIGH
propagation delay
NTS0104
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© NXP B.V. 2011. All rights reserved.
Product Specification
Rev. 2 — 27 April 2011
8 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
Table 10. Dynamic characteristics for temperature range −40 °C to +85 °C[1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7.
Symbol Parameter
Conditions
VCC(B)
Unit
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5.0 V ± 0.5 V
Min
Max
200
35
Min
Max
200
35
Min
Max
200
35
ten
enable time
disable time
OE to A; B
-
-
-
ns
ns
ns
ns
ns
ns
ns
[2]
[2]
tdis
OE to A; no external load
OE to B; no external load
OE to A
-
-
-
-
-
-
35
35
35
-
230
200
9.5
-
230
200
9.3
9.1
-
230
200
7.6
7.6
OE to B
-
-
-
tTLH
LOW to HIGH
output transition
time
A port
3.2
3.3
2.3
2.7
1.8
2.7
B port
10.8
tTHL
HIGH to LOW
output transition
time
A port
B port
2.0
2.9
5.9
7.6
1.9
2.8
6.0
7.5
1.7
2.8
13.3 ns
10.0 ns
[3]
tsk(o)
tW
output skew time
pulse width
data rate
between channels
data inputs
-
20
-
0.7
-
-
20
-
0.7
-
-
20
-
0.7
-
ns
ns
fdata
50
50
50
Mbps
VCC(A) = 2.5 V ± 0.2 V
tPHL
tPLH
tPHL
tPLH
HIGH to LOW
propagation delay
A to B
A to B
B to A
B to A
-
-
-
-
3.2
3.5
3.0
2.5
-
-
-
-
3.3
4.1
3.6
1.6
-
-
-
-
3.4
4.4
4.3
0.7
ns
ns
ns
ns
LOW to HIGH
propagation delay
HIGH to LOW
propagation delay
LOW to HIGH
propagation delay
ten
enable time
disable time
OE to A; B
-
200
35
-
200
35
-
200
35
ns
ns
ns
ns
ns
ns
ns
[2]
[2]
tdis
OE to A; no external load
OE to B; no external load
OE to A
-
-
-
-
-
-
35
35
35
-
200
200
7.4
8.3
-
200
200
6.6
7.9
-
200
200
6.2
6.8
OE to B
-
-
-
tTLH
LOW to HIGH
output transition
time
A port
2.8
3.2
2.6
2.9
1.8
2.4
B port
tTHL
HIGH to LOW
output transition
time
A port
B port
1.9
2.2
5.7
7.8
1.9
2.4
5.5
6.7
1.8
2.6
5.3
6.6
ns
ns
[3]
tsk(o)
tW
output skew time
pulse width
data rate
between channels
data inputs
-
20
-
0.7
-
-
20
-
0.7
-
-
20
-
0.7
-
ns
ns
fdata
50
50
50
Mbps
VCC(A) = 3.3 V ± 0.3 V
tPHL
HIGH to LOW
propagation delay
A to B
A to B
-
-
-
-
-
-
2.4
4.2
-
-
3.1
4.4
ns
ns
tPLH
LOW to HIGH
propagation delay
NTS0104
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product Specification
Rev. 2 — 27 April 2011
9 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
Table 10. Dynamic characteristics for temperature range −40 °C to +85 °C[1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7.
Symbol Parameter
Conditions
VCC(B)
Unit
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5.0 V ± 0.5 V
Min
Max
Min
Max
Min
Max
tPHL
tPLH
HIGH to LOW
propagation delay
B to A
B to A
-
-
-
2.5
-
3.3
ns
ns
LOW to HIGH
-
-
-
2.5
-
2.6
propagation delay
ten
enable time
disable time
OE to A; B
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
200
35
-
200
35
ns
ns
ns
ns
ns
ns
ns
[2]
[2]
tdis
OE to A; no external load
OE to B; no external load
OE to A
-
-
-
-
35
35
-
260
200
5.6
6.4
-
260
200
5.9
7.4
OE to B
-
-
tTLH
LOW to HIGH
output transition
time
A port
2.3
2.5
1.9
2.1
B port
tTHL
HIGH to LOW
output transition
time
A port
B port
-
-
-
-
2.0
2.3
5.4
7.4
1.9
2.4
5.0
7.6
ns
ns
[3]
tsk(o)
tW
output skew time
pulse width
data rate
between channels
data inputs
-
-
-
-
-
-
-
20
-
0.7
-
-
20
-
0.7
-
ns
ns
fdata
50
50
Mbps
[1] ten is the same as tPZL and tPZH
tdis is the same as tPLZ and tPHZ
[2] Delay between OE going LOW and when the outputs are actually disabled.
[3] Skew between any two outputs of the same package switching in the same direction.
.
.
Table 11. Dynamic characteristics for temperature range −40 °C to +125 °C[1]
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7.
Symbol Parameter
Conditions
VCC(B)
Unit
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5.0 V ± 0.5 V
Min
Max
Min
Max
Min
Max
VCC(A) = 1.8 V ± 0.15 V
tPHL
tPLH
tPHL
tPLH
ten
HIGH to LOW
propagation delay
A to B
-
-
-
-
-
5.8
8.5
5.5
6.7
200
-
-
-
-
-
5.9
8.5
5.7
5.7
200
-
-
-
-
-
7.3
8.8
5.9
0.7
200
ns
ns
ns
ns
ns
LOW to HIGH
propagation delay
A to B
HIGH to LOW
propagation delay
B to A
LOW to HIGH
propagation delay
B to A
enable time
OE to A; B
NTS0104
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© NXP B.V. 2011. All rights reserved.
Product Specification
Rev. 2 — 27 April 2011
10 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
Table 11. Dynamic characteristics for temperature range −40 °C to +125 °C[1] …continued
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7.
Symbol Parameter
Conditions
VCC(B)
Unit
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5.0 V ± 0.5 V
Min
Max
45
Min
Max
45
Min
Max
45
[2]
[2]
tdis
disable time
OE to A; no external load
-
-
-
-
-
-
ns
ns
ns
ns
ns
ns
OE to B; no external load
45
45
45
OE to A
OE to B
A port
-
250
220
11.9
13.5
-
250
220
11.7
11.4
-
250
220
9.5
9.5
-
-
-
tTLH
LOW to HIGH
output transition
time
3.2
3.3
2.3
2.7
1.8
2.7
B port
tTHL
HIGH to LOW
output transition
time
A port
B port
2.0
2.9
7.4
9.5
1.9
2.8
7.5
9.4
1.7
2.8
16.7 ns
12.5 ns
[3]
tsk(o)
tW
output skew time
pulse width
data rate
between channels
data inputs
-
20
-
0.8
-
-
20
-
0.8
-
-
20
-
0.8
-
ns
ns
fdata
50
50
50
Mbps
VCC(A) = 2.5 V ± 0.2 V
tPHL
tPLH
tPHL
tPLH
HIGH to LOW
propagation delay
A to B
A to B
B to A
B to A
-
-
-
-
4.0
4.4
3.8
3.2
-
-
-
-
4.2
5.2
4.5
2.0
-
-
-
-
4.3
5.5
5.4
0.9
ns
ns
ns
ns
LOW to HIGH
propagation delay
HIGH to LOW
propagation delay
LOW to HIGH
propagation delay
ten
enable time
disable time
OE to A; B
-
200
45
-
200
45
-
200
45
ns
ns
ns
ns
ns
ns
ns
[2]
[2]
tdis
OE to A; no external load
OE to B; no external load
OE to A
-
-
-
-
-
-
45
45
45
-
220
220
9.3
10.4
-
220
220
8.3
9.7
-
220
220
7.8
8.3
OE to B
-
-
-
tTLH
LOW to HIGH
output transition
time
A port
2.8
3.2
2.6
2.9
1.8
2.4
B port
tTHL
HIGH to LOW
output transition
time
A port
B port
1.9
2.2
7.2
9.8
1.9
2.4
6.9
8.4
1.8
2.6
6.7
8.3
ns
ns
[3]
tsk(o)
tW
output skew time
pulse width
data rate
between channels
data inputs
-
20
-
0.8
-
-
20
-
0.8
-
-
20
-
0.8
-
ns
ns
fdata
50
50
50
Mbps
VCC(A) = 3.3 V ± 0.3 V
tPHL
HIGH to LOW
propagation delay
A to B
A to B
-
-
-
-
-
-
3.0
5.3
-
-
3.9
5.5
ns
ns
tPLH
LOW to HIGH
propagation delay
NTS0104
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Product Specification
Rev. 2 — 27 April 2011
11 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
Table 11. Dynamic characteristics for temperature range −40 °C to +125 °C[1] …continued
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7.
Symbol Parameter
Conditions
VCC(B)
Unit
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5.0 V ± 0.5 V
Min
Max
Min
Max
Min
Max
tPHL
tPLH
HIGH to LOW
propagation delay
B to A
B to A
-
-
-
3.2
-
4.2
ns
ns
LOW to HIGH
-
-
-
3.2
-
3.3
propagation delay
ten
enable time
disable time
OE to A; B
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
200
45
-
200
45
ns
ns
ns
ns
ns
ns
ns
[2]
[2]
tdis
OE to A; no external load
OE to B; no external load
OE to A
-
-
-
-
45
45
-
280
220
7.0
8.0
-
280
220
7.4
9.3
OE to B
-
-
tTLH
LOW to HIGH
output transition
time
A port
2.3
2.5
1.9
2.1
B port
tTHL
HIGH to LOW
output transition
time
A port
B port
-
-
-
-
2.0
2.3
6.8
9.3
1.9
2.4
6.3
9.5
ns
ns
[3]
tsk(o)
tW
output skew time
pulse width
data rate
between channels
data inputs
-
-
-
-
-
-
-
20
-
0.8
-
-
20
-
0.8
-
ns
ns
fdata
50
50
Mbps
[1] ten is the same as tPZL and tPZH
tdis is the same as tPLZ and tPHZ
[2] Delay between OE going LOW and when the outputs are actually disabled.
.
.
[3] Skew between any two outputs of the same package switching in the same direction.
13. Waveforms
V
I
An, Bn
input
V
M
GND
t
t
PHL
PLH
V
OH
90 %
Bn, An
output
V
M
10 %
V
OL
t
t
THL
TLH
001aal918
Measurement points are given in Table 12.
VOL and VOH are typical output voltage levels that occur with the output load.
Fig 6. The data input (An, Bn) to data output (Bn, An) propagation delay times
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Product Specification
Rev. 2 — 27 April 2011
12 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
V
I
OE input
V
M
GND
t
t
PLZ
PZL
V
CCO
output
V
LOW-to-OFF
OFF-to-LOW
M
V
X
V
OL
t
t
PHZ
PZH
V
OH
V
Y
output
HIGH-to-OFF
OFF-to-HIGH
V
M
GND
outputs
enabled
outputs
disabled
outputs
enabled
001aal919
Measurement points are given in Table 12.
VOL and VOH are typical output voltage levels that occur with the output load.
Fig 7. Enable and disable times
Table 12. Measurement points[1][2]
Supply voltage
VCCO
Input
Output
VM
VM
VX
VY
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5.0 V ± 0.5 V
0.5VCCI
0.5VCCI
0.5VCCI
0.5VCCI
0.5VCCO
0.5VCCO
0.5VCCO
0.5VCCO
VOL + 0.15 V
VOL + 0.15 V
VOL + 0.3 V
VOL + 0.3 V
VOH − 0.15 V
VOH − 0.15 V
VOH − 0.3 V
VOH − 0.3 V
[1] VCCI is the supply voltage associated with the input.
[2] VCCO is the supply voltage associated with the output.
NTS0104
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Product Specification
Rev. 2 — 27 April 2011
13 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
t
W
V
I
90 %
negative
pulse
V
M
V
M
10 %
0 V
t
f
t
r
t
r
t
f
V
I
90 %
positive
pulse
V
M
V
M
10 %
0 V
t
W
V
EXT
V
CC
R
L
L
V
V
O
I
G
DUT
C
R
L
001aal920
Test data is given in Table 13.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz; ZO = 50 Ω; dV/dt ≥ 1.0 V/ns.
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
VEXT = External voltage for measuring switching times.
Fig 8. Test circuit for measuring switching times
Table 13. Test data
Supply voltage
VCC(A)
Input
VI[1]
Load
CL
VEXT
[2]
[3]
VCC(B)
Δt/ΔV
RL
tPLH, tPHL tPZH, tPHZ tPZL, tPLZ
1.65 V to 3.6 V 2.3 V to 5.5 V VCCI
≤ 1.0 ns/V
15 pF
50 kΩ, 1 MΩ open
open
2VCCO
[1] VCCI is the supply voltage associated with the input.
[2] For measuring data rate, pulse width, propagation delay and output rise and fall measurements, RL = 1 MΩ; for measuring enable and
disable times, RL = 50 kΩ.
[3] VCCO is the supply voltage associated with the output.
NTS0104
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Product Specification
Rev. 2 — 27 April 2011
14 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
14. Application information
14.1 Applications
Voltage level-translation applications. The NTS0104 can be used in point-to-point
applications to interface between devices or systems operating at different supply
voltages. The device is primarily targeted at I2C or 1-wire which use open-drain drivers, it
may also be used in applications where push-pull drivers are connected to the ports,
however the NTB0104 may be more suitable.
1.8 V
3.3 V
0.1 μF
0.1 μF
1 μF
V
V
CC(A) CC(B)
OE
1.8 V
SYSTEM
CONTROLLER
3.3 V
SYSTEM
NTS0104
A1
A2
A3
A4
B1
B2
B3
B4
DATA
DATA
GND
001aan115
Fig 9. Typical operating circuit
14.2 Architecture
The architecture of the NTS0104 is shown in Figure 10. The device does not require an
extra input signal to control the direction of data flow from A to B or B to A.
V
CC(A)
V
CC(B)
T1
T2
ONE
ONE
SHOT
SHOT
10 kΩ
10 kΩ
GATE BIAS
T3
A
B
001aal965
Fig 10. Architecture of NTS0104 I/O cell (one channel)
The NTS0104 is a "switch" type voltage translator, it employs two key circuits to enable
voltage translation:
1. A pass-gate transistor (N-channel) that ties the ports together.
2. An output edge-rate accelerator that detects and accelerates rising edges on the I/O
pins.
NTS0104
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Product Specification
Rev. 2 — 27 April 2011
15 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
The gate bias voltage of the pass gate transistor (T3) is set at approximately one
threshold voltage above the VCC level of the low-voltage side. During a LOW-to-HIGH
transition the output one-shot accelerates the output transition by switching on the PMOS
transistors (T1, T2) bypassing the 10 kΩ pull-up resistors and increasing current drive
capability. The one-shot is activated once the input transition reaches approximately
V
CCI/2; it is de-activated approximately 50 ns after the output reaches VCCO/2. During the
acceleration time the driver output resistance is between approximately 50 Ω and 70 Ω. To
avoid signal contention and minimize dynamic ICC, the user should wait for the one-shot
circuit to turn-off before applying a signal in the opposite direction. Pull-up resistors are
included in the device for DC current sourcing capability.
14.3 Input driver requirements
As the NTS0104 is a switch type translator, properties of the input driver directly effect the
output signal. The external open-drain or push-pull driver applied to an I/O determines the
static current sinking capability of the system; the max data rate, HIGH-to-LOW output
transition time (tTHL) and propagation delay (tPHL) are dependent upon the output
impedance and edge-rate of the external driver. The limits provided for these parameters
in the datasheet assume a driver with output impedance below 50 Ω is used.
14.4 Output load considerations
The maximum lumped capacitive load that can be driven is dependant upon the one-shot
pulse duration. In cases with very heavy capacitive loading there is a risk that the output
will not reach the positive rail within the one-shot pulse duration.
To avoid excessive capacitive loading and to ensure correct triggering of the one-shot it's
recommended to use short trace lengths and low capacitance connectors on NTS0104
PCB layouts. To ensure low impedance termination and avoid output signal oscillations
and one-shot re-triggering, the length of the PCB trace should be such that the round trip
delay of any reflection is within the one-shot pulse duration (approximately 50 ns).
14.5 Power up
During operation VCC(A) must never be higher than VCC(B), however during power-up
VCC(A) ≥ VCC(B) does not damage the device, so either power supply can be ramped up
first. There is no special power-up sequencing required. The NTS0104 includes circuitry
that disables all output ports when either VCC(A) or VCC(B) is switched off.
14.6 Enable and disable
An output enable input (OE) is used to disable the device. Setting OE = LOW
causes all I/Os to assume the high-impedance OFF-state. The disable time (tdis with no
external load) indicates the delay between when OE goes LOW and when outputs
actually become disabled. The enable time (ten) indicates the amount of time the user
must allow for one one-shot circuitry to become operational after OE is taken HIGH. To
ensure the high-impedance OFF-state during power-up or power-down, pin OE should be
tied to GND through a pull-down resistor, the minimum value of the resistor is determined
by the current-sourcing capability of the driver.
NTS0104
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Product Specification
Rev. 2 — 27 April 2011
16 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
14.7 Pull-up or pull-down resistors on I/Os lines
Each A port I/O has an internal 10 kΩ pull-up resistor to VCC(A), and each B port I/O has
an internal 10 kΩ pull-up resistor to VCC(B). If a smaller value of pull-up resistor is required,
an external resistor must be added parallel to the internal 10 kΩ, this will effect the VOL
level. When OE goes LOW the internal pull-ups of the NTS0104 are disabled.
NTS0104
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Product Specification
Rev. 2 — 27 April 2011
17 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
15. Package outline
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
v
c
y
H
M
A
E
Z
8
14
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
7
e
detail X
w
M
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.75
1.27
0.05
1.05
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches
0.041
0.01 0.004
0.069
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT108-1
076E06
MS-012
Fig 11. Package outline SOT108-1 (SO14)
NTS0104
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© NXP B.V. 2011. All rights reserved.
Product Specification
Rev. 2 — 27 April 2011
18 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
E
A
X
c
y
H
v
M
A
E
Z
8
14
Q
(A )
3
A
2
A
A
1
pin 1 index
θ
L
p
L
1
7
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.72
0.38
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT402-1
MO-153
Fig 12. Package outline SOT402-1 (TSSOP14)
NTS0104
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Product Specification
Rev. 2 — 27 April 2011
19 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
14 terminals; body 2.5 x 3 x 0.85 mm
SOT762-1
B
A
D
A
A
1
E
c
detail X
terminal 1
index area
C
terminal 1
index area
e
1
y
y
e
b
v
M
C
C
A
B
C
1
w
M
2
6
L
1
7
8
E
h
e
14
13
9
D
h
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
(1)
(1)
UNIT
A
b
c
E
e
e
1
y
D
D
E
L
v
w
y
1
h
h
1
max.
0.05 0.30
0.00 0.18
3.1
2.9
1.65
1.35
2.6
2.4
1.15
0.85
0.5
0.3
mm
0.05
0.1
1
0.2
0.5
2
0.1
0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-10-17
03-01-27
SOT762-1
- - -
MO-241
- - -
Fig 13. Package outline SOT762-1 (DHVQFN14)
NTS0104
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Product Specification
Rev. 2 — 27 April 2011
20 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
XQFN16: plastic, extremely thin quad flat package; no leads;
16 terminals; body 1.80 x 2.60 x 0.50 mm
SOT1161-1
X
D
B
A
E
terminal 1
index area
A
A
1
A
3
detail X
e
1
C
v
w
C A
C
B
e
b
y
1
y
C
5
8
L
4
1
9
e
e
2
12
terminal 1
index area
16
13
L
1
0
1
2 mm
scale
Dimensions
(1)
Unit
A
A
1
A
3
b
D
E
e
e
1
e
2
L
L
1
v
w
y
y
1
max 0.5 0.05
mm nom
min
0.25 1.9 2.7
0.127 0.20 1.8 2.6 0.4 1.2 1.2 0.40 0.50 0.1 0.05 0.05 0.05
0.15 1.7 2.5 0.35 0.45
0.45 0.55
0.00
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
sot1161-1_po
References
Outline
version
European
projection
Issue date
IEC
- - -
JEDEC
- - -
JEITA
- - -
09-12-28
09-12-29
SOT1161-1
Fig 14. Package outline SOT1161-1 (XQFN16)
NTS0104
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product Specification
Rev. 2 — 27 April 2011
21 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
XQFN12: plastic, extremely thin quad flat package; no leads;
12 terminals; body 1.70 x 2.00 x 0.50 mm
SOT1174-1
X
D
B
A
E
terminal 1
index area
A
A
1
A
3
detail X
C
∅ v
∅ w
C A
C
B
b
y
1
y
C
5
1
7
e
1
e
11
terminal 1
index area
L
1
L
0
1
2 mm
scale
Dimensions
(1)
Unit
A
A
1
A
3
b
D
E
e
e
1
L
L
1
v
w
y
y
1
max 0.5 0.05
mm nom
min
0.25 1.8 2.1
0.55
0.127 0.20 1.7 2.0 0.4 1.6 0.50 0.15 0.1 0.05 0.05 0.05
0.15 1.6 1.9 0.45
0.00
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
sot1174-1_po
References
Outline
version
European
projection
Issue date
IEC
- - -
JEDEC
JEITA
- - -
10-04-07
10-04-21
SOT1174-1
MO-288
Fig 15. Package outline SOT1174-1 (XQFN12)
NTS0104
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product Specification
Rev. 2 — 27 April 2011
22 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
16. Abbreviations
Table 14. Abbreviations
Acronym
CDM
CMOS
DUT
Description
Charged Device Model
Complementary Metal Oxide Semiconductor
Device Under Test
ESD
ElectroStatic Discharge
GPIO
General Purpose Input Output
Human Body Model
HBM
I2C
Inter-Integrated Circuit
MM
Machine Model
SMBus
UART
System Management Bus
Universal Asynchronous Receiver Transmitter
17. Revision history
Table 15. Revision history
Document ID
NTS0104 v.2
Modifications:
Release date
20110427
Data sheet status
Change notice
Supersedes
Product data sheet
-
NTS0104 v.1
• Added Table 8: total supply current (typical).
• SOT1174 changed to SOT1174-1.
NTS0104 v.1
20101125
Product data sheet
-
-
NTS0104
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product Specification
Rev. 2 — 27 April 2011
23 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
suitable for use in medical, military, aircraft, space or life support equipment,
18.2 Definitions
nor in applications where failure or malfunction of an NXP Semiconductors
product can reasonably be expected to result in personal injury, death or
severe property or environmental damage. NXP Semiconductors accepts no
liability for inclusion and/or use of NXP Semiconductors products in such
equipment or applications and therefore such inclusion and/or use is at the
customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. The product is not designed, authorized or warranted to be
NTS0104
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product Specification
Rev. 2 — 27 April 2011
24 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NTS0104
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product Specification
Rev. 2 — 27 April 2011
25 of 26
NTS0104
NXP Semiconductors
Dual supply translating transceiver; open drain; auto direction sensing
20. Contents
1
2
3
4
5
6
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
7
7.1
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
8
Functional description . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 6
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
9
10
11
12
13
14
Application information. . . . . . . . . . . . . . . . . . 15
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Input driver requirements . . . . . . . . . . . . . . . . 16
Output load considerations. . . . . . . . . . . . . . . 16
Power up . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Enable and disable. . . . . . . . . . . . . . . . . . . . . 16
Pull-up or pull-down resistors on I/Os lines . . 17
14.1
14.2
14.3
14.4
14.5
14.6
14.7
15
16
17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 23
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 23
18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 24
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 25
18.1
18.2
18.3
18.4
19
20
Contact information. . . . . . . . . . . . . . . . . . . . . 25
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 27 April 2011
Document identifier: NTS0104
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