NTS0304EPW_技术文档

NTS0304E

4-bit dual supply translating transceiver; open drain; auto

direction sensing

Rev. 1 — 01 February 2019

Product data sheet

1. General description

The NTS0304E is a 4-bit, dual supply translating transceiver family with auto direction

sensing, that enables bidirectional voltage level translation. It features eight 1-bit

input-output ports (A and B), one output enable input (OE) and two supply pins (V_CC(A)

and V_CC(B)). V_CC(A)can be supplied at any voltage between 0.95 V and 3.6 V. V_CC(B)can

be supplied at any voltage between 1.65 V and 5.5 V. This flexibility makes the device

suitable for translating between any of the voltage nodes (0.95 V, 1.2 V, 1.8 V, 2.5 V, 3.3 V

and 5.0 V). Pins A and OE are referenced to V_CC(A)and pin B is referenced to V_CC(B). A

LOW level at pin OE causes the outputs to assume a high-impedance OFF-state.

2. Features and benefits

 Wide supply voltage range:

 V_CC(A): 0.95 V to 3.6 V and V_CC(B): 1.65 V to 5.5 V

 No power-sequencing required

 Maximum data rate

 Open-drain: 2 Mbps

 Push-pull: 20 Mbps

 Longer one-shot pulse for driving larger capacitive loads with much reduced ringing

and overshoot

 A-side and OE inputs accept voltages up to 3.6 V and are 3.6 V tolerant

 B-side inputs accept voltages up to 5.5 V and are 5.5 V tolerant

 ESD protection:

 IEC 61000-4-2 Class 4, 8 kV contact for B-side port

 HBM JESD22-A114E Class 2 exceeds 2000 V for both ports

 CDM JESD22-C101E exceeds 1000 V for both ports

 Latch-up performance exceeds 100 mA per JESD 78B Class II

 Package options: TSSOP14 and WLCSP12

 Specified from 40 C to +125 C

3. Applications

 I²C/SMBus, UART

 GPIO

NTS0304E

NXP Semiconductors

4-bit dual supply translating transceiver; open drain; auto direction

sensing

4. Ordering information

Table 1.

Ordering information

Type number

Topside

marking

Package

Name

Description

Version

NTS0304EUK

NTS0304EPW

S4

WLCSP12 wafer level chip scale package; 12 balls with 0.4 mm pitch; SOT1390-10

1.42 x 1.97 x 0.525 mm

NTS0304

TSSOP14

plastic thin shrink small outline package; 14 leads;

body width 4.4 mm

SOT402-1

4.1 Ordering options

Table 2.

Ordering options

Type number

Orderable

part number

Package

WLCSP12

TSSOP14

Packing method

Minimum

order quantity

Temperature

T_amb= 40 C to +125 C

NTS0304EUK

NTS0304EPW

NTS0304EUKZ

NTS0304EPWJ

reel 7" q1/t1 *special 4000

mark chips dp

reel 13" q1/t1

2500

T_amb= 40 C to +125 C

*standard mark smd

5. Functional diagram

GATE BIAS

OE

A1

B1

An

Bn

V

CC(B)

CC(A)

aaa-031817

Fig 1. Logic symbol

NTS0304E

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Product data sheet

Rev. 1 — 01 February 2019

2 of 26

NTS0304E

NXP Semiconductors

4-bit dual supply translating transceiver; open drain; auto direction

sensing

6. Pinning information

6.1 Pinning

NTS0304E

ball A1

index area

1

2

3

A

B

C

D

1

2

3

4

5

6

7

14

13

12

11

10

9

V

CC(B)

CC(A)

A1

B1

B2

B3

B4

n.c.

OE

A2

A3

NTS0304EPW

A4

n.c.

GND

Transparent top view

8

aaa-031818

aaa-031040

Fig 2. NTS0304EPW Pin configuration

Fig 3. NTS0304EUK Pin configuration WLCSP12

6.2 Pin description

Table 3.

Symbol

NTS0304E Pin description

Ball

Description

SOT402-1

WLCSP12

V_CC(A)

1

B2

supply voltage A

A1, A2, A3, A4 2, 3, 4, 5

A3, B3, C3, D3

data input or output (referenced to V_CC(A)

)

n.c.

GND

OE

6, 9

7

-

not connected

D2

ground (0 V)

8

C2

output enable input (active HIGH; referenced to V_CC(A))

B4, B3, B2, B1 10, 11, 12, 13

V_CC(B)14

D1, C1, B1, A1

A2

data input or output (referenced to V_CC(B)

)

supply voltage B

7. Functional description

Table 4.

Function table^[1]

Supply voltage

V_CC(A)

Input

OE

L

Input/output

V_CC(B)

A

B

0.95 V to V_CC(B)

GND^[2]

1.65 V to 5.5 V

GND^[2]

Z

H

input or output

Z

output or input

Z

X

[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.

[2] When either V_CC(A)or V_CC(B)is at GND level, the device goes into power-down mode.

NTS0304E

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Product data sheet

Rev. 1 — 01 February 2019

3 of 26

NTS0304E

NXP Semiconductors

4-bit dual supply translating transceiver; open drain; auto direction

sensing

8. Limiting values

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).

Symbol

V_CC(A)

V_CC(B)

V_I

Parameter

Conditions

Min

Max

+4.6

+6.5

Unit

V

supply voltage A

supply voltage B

input voltage

0.5

V

[1][2]

A port and OE input

B port

V

V_O

output voltage

Active mode

A or B port

0.5

V_CCO+ 0.5

V

[1]

Power-down or 3-state mode

A port

0.5

50

-

+4.6

+6.5

-

V

B port

V

I_IK

input clamping current

output clamping current

output current

V_I< 0 V

mA

C

I_OK

I_O

V_O< 0 V

-

[2]

V_O= 0 V to V_CCO

I_CC(A)or I_CC(B)

50

100

-

I_CC

I_GND

T_stg

supply current

-

ground current

100

65

storage temperature

+150

[1] The minimum input and minimum output voltage ratings may be exceeded if the input and output current ratings are observed.

[2] V_CCOis the supply voltage associated with the output.

9. Recommended operating conditions

Table 6.

Symbol

V_CC(A)

V_CC(B)

V_{I_EN}

Recommended operating conditions^[1][2]

Parameter

Conditions

Min

0.95

1.65

-0.3

40

Max

Unit

V

[2]

supply voltage A

3.6

supply voltage B

5.5

V

EN input voltage

V_CC(A)+0.3

+125

+85

V

T_amb

ambient temperature

C

[3]

[2]

T_J

junction temperature

t/V

input transition rise and fall rate A or B port; push-pull driving

V_CC(A)= 0.95 V to 3.6 V;

V_CC(B)= 1.65 V to 5.5 V

-

10

ns/V

OE input

V_CC(A)= 0.95 V to 3.6 V;

V_CC(B)= 1.65 V to 5.5 V

[1] The A and B sides of an unused I/O pair must be held in the same state, both at V_CCIor both at GND.

[2] _CC(A)must be less than or equal to V_CC(B)

V

.

[3] The T_Jlimits shall be supported by proper thermal PCB design taking the power consumption and the thermal resistance as listed in

Table 7 into account.

NTS0304E

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Product data sheet

Rev. 1 — 01 February 2019

4 of 26

NTS0304E

NXP Semiconductors

4-bit dual supply translating transceiver; open drain; auto direction

sensing

10. Thermal characteristics

Table 7.

Symbol

Thermal resistance information

Rating

NTS0304EPW

(TSSOP14)

NTS0304EUK

(WLCSP12)

R_JA

Junction to ambient

114.9

1.6

57.8

0.2

_JT

Junction to top characterization

11. Static characteristics

Table 8.

Typical static characteristics

At recommended operating conditions; voltages are referenced to GND (ground = 0 V); T_amb= 25 C.

Symbol Parameter

Conditions

Min

Typ

Max

Unit

I_I

input leakage

current

OE input; V_I= 0 V to 3.6 V; V_CC(A)= 0.95 V to 3.6 V;

V_CC(B)= 1.65 V to 5.5 V

-

1

A

[1]

I_OZ

C_I

OFF-stateoutput A or B port; V_O= 0 V or V_CCO; V_CC(A)= 0.95 V to 3.6 V;

-

1

A

current

V_CC(B)= 1.65 V to 5.5 V

input

OE input; V_CC(A)= 3.3 V; V_CC(B)= 3.3 V

1

-

pF

capacitance

C_I/O

input/output

capacitance

A port

-

4

-

pF

B port

7.5

11

A or B port; V_CC(A)= 3.3 V; V_CC(B)= 3.3 V

[1] V_CCOis the supply voltage associated with the output.

Table 9.

Typical supply current

At recommended operating conditions; voltages are referenced to GND (ground = 0 V); T_amb= 25 C.

V_CC(B)

1.65 V

I_CC(A)

2.5 V

I_CC(A)

3.3 V

I_CC(A)

5.0 V

I_CC(A)

I_CC(B)

V_CC(A)

0.95 V

1.2 V

1.8 V

2.5 V

3.3 V

Unit

0.1

0.2

-

0.5

0.1

0.5

0.1

3

2

A

0.1

-

NTS0304E

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Product data sheet

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5 of 26

NTS0304E

NXP Semiconductors

4-bit dual supply translating transceiver; open drain; auto direction

sensing

Table 10. Static characteristics

At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

Symbol Parameter

Conditions

40 C to +85 C

40 C to +125 C

Unit

Min

Max

Min

Max

V_IH

HIGH-level

A port

input voltage

[1]

V_CC(A)= 0.95 V to 1.65 V;

V_CC(B)= 1.65 V to 5.5 V

V_CCI 0.2

V_CCI 0.4

-

V_CCI 0.2

V_CCI 0.4

-

V

V_CC(A)= 1.65 V to 3.6 V;

V_CC(B)= 2.3 V to 5.5 V

B port

[1]

V_CC(A)= 0.95 V to 3.6 V;

V_CC(B)= 1.65 V to 5.5 V

V_CCI 0.4

-

V_CCI 0.4

-

V

OE input

V_CC(A)= 0.95 V to 3.6 V;

0.65V_CC(A)

V_CC(B)= 1.65 V to 5.5 V

V_IL

LOW-level

A or B port

input voltage

V_CC(A)= 0.95 V to 1.65 V;

V_CC(B)= 1.65 V to 5.5 V

-

0.13

0.15

-

0.13

0.15

V

V_CC(A)= 1.65 V to 3.6 V;

V_CC(B)= 2.3 V to 5.5 V

OE input

V_CC(A)= 0.95 V to 3.6 V;

-

0.35V_CC(A)

-

0.35V_CC(A)

V

V_CC(B)= 1.65 V to 5.5 V

V_OHA

HIGH-level

I_O= 20 A

output voltage

[2]

V_CC(B)= 1.65 V to 5.5 V;

V_CCI= V_CC(B)- 0.4 V

[2]

V_CC(A)= 1.65 V to 3.6 V

V_CC(A)= 0.95 V to 1.65 V

I_O= 20 A

0.8V_CC(A)

-

0.75V_CC(A)

0.62V_CC(A)

-

V

0.65V_CC(A)

V_OHB

HIGH-level

output voltage

[2]

V_CC(A)= 0.95 V to 3.6 V;

V_CC(B)= 1.65 V to 5.5 V;

V_CCI= V_CC(A)- 0.2 V

0.8V_CC(B)

-

0.75V_CC(B)

-

V

V_OL

LOW-level

A or B port; I_O= 1 mA

output voltage

V_I 0.15 V;

V_CC(A)= 0.95 V to 3.6 V;

V_CC(B)= 1.65 V to 5.5 V

-

0.30

2

-

0.30

12

V

I_I

input leakage OE input; V_I= 0 V to 3.6 V;

current

A

V_CC(A)= 0.95 V to 3.6 V;

V_CC(B)= 1.65 V to 5.5 V

[2]

I_OZ

OFF-state

A or B port; V_O= 0 V or V_CCO

;

2

output current V_CC(A)= 0.95 V to 3.6 V;

V_CC(B)= 1.65 V to 5.5 V

NTS0304E

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Product data sheet

Rev. 1 — 01 February 2019

6 of 26

NTS0304E

NXP Semiconductors

4-bit dual supply translating transceiver; open drain; auto direction

sensing

Table 10. Static characteristics …continued

At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions 40 C to +85 C

40 C to +125 C

Unit

Min

Max

Min

Max

[1]

I_CC

supply current V_I= 0 V or V_CCI; I_O= 0 A

I_CC(A)

V_CC(A)= 0.95 V to 3.6 V;

V_CC(B)= 1.65 V to 5.5 V

-

2.4

-

15

A

V

_CC(A)= 3.6 V; V_CC(B)= 0 V

V_CC(A)= 0 V; V_CC(B)= 5.5 V

I_CC(B)

-

2.2

-

15

A

1

8

V_CC(A)= 0.95 V to 3.6 V;

V_CC(B)= 1.65 V to 5.5 V

-

18

-

51

A

V_CC(A)= 3.6 V; V_CC(B)= 0 V

V_CC(A)= 0 V; V_CC(B)= 5.5 V

I_CC(A)+ I_CC(B)

-

1

-

5

A

18

46

V_CC(A)= 0.95 V to 3.6 V;

V_CC(B)= 1.65 V to 5.5 V

-

14.4

-

59

A

[1] V_CCIis the supply voltage associated with the input.

[2] _CCOis the supply voltage associated with the output.

V

NTS0304E

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Product data sheet

Rev. 1 — 01 February 2019

7 of 26

NTS0304E

NXP Semiconductors

4-bit dual supply translating transceiver; open drain; auto direction

sensing

12. Dynamic characteristics

Table 11. Dynamic characteristics for temperature range 40 C to +125 C^[1]

Voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 6; for wave forms, see Figure 4 and Figure 5.

Symbol Parameter

Conditions

V_CC(B)

3.3 V

Unit

1.8 V

Max

5.0 V

Max

Min

Max

Min

V_CC(A)= 0.95V

t_PHL

t_PLH

t_PHL

t_PLH

HIGH to LOW

propagation delay

A to B

B to A

-

20

14.8

9.2

-

11.1

12.5

5.2

-

12.3 ns

12.2 ns

LOW to HIGH

propagation delay

HIGH to LOW

propagation delay

5.2

1.4

ns

LOW to HIGH

8.8

2.9

propagation delay

t_en

enable time

disable time

OE to A; B

-

200

100

250

220

15.3

17.0

-

200

100

250

220

15.1

14.0

-

200

100

250

220

ns

[2]

t_dis

OE to A; no external load

OE to B; no external load

OE to A

-

OE to B

-

t_TLH

LOW to HIGH

output transition

time

A port

6.0

2.2

4.0

1.8

4.0

11.1 ns

20.0 ns

B port

t_THL

HIGH to LOW

output transition

time

A port

B port

0.9

1.6

18.0

22.0

0.7

2.8

9.0

0.6

3.2

9.0

ns

10.7

14.2 ns

t_W

pulse width

data rate

data inputs

49

-

49

-

49

-

ns

[3]

f_data

20

Mbps

[1] t_enis the same as t_PZLand t_PZH

t_disis the same as t_PLZand t_PHZ

[2] Delay between OE going LOW and when the outputs are disabled.

[3] Assuming a maximum one-shot accelerator pulse length of 50ns and equal time for 1 and 0 bit information

.

NTS0304E

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Product data sheet

Rev. 1 — 01 February 2019

8 of 26

NTS0304E

NXP Semiconductors

4-bit dual supply translating transceiver; open drain; auto direction

sensing

Table 12. Dynamic characteristics for temperature range 40 C to +125 C^[1]

Voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 6; for wave forms, see Figure 4 and Figure 5.

Symbol Parameter

Conditions

V_CC(B)

3.3 V

Unit

2.5 V

Max

5.0 V

Max

Min

Max

Min

V_CC(A)= 1.8 V

t_PHL

t_PLH

t_PHL

t_PLH

HIGH to LOW

propagation delay

A to B

B to A

-

5.8

8.5

5.5

6.7

-

5.9

8.5

5.7

-

7.3

8.8

5.9

1.4

ns

LOW to HIGH

propagation delay

HIGH to LOW

propagation delay

LOW to HIGH

propagation delay

t_en

enable time

disable time

OE to A; B

-

200

100

250

220

11.9

13.5

-

200

100

250

220

11.7

14.5

-

200

100

250

220

9.5

ns

[2]

t_dis

OE to A; no external load

OE to B; no external load

OE to A

-

OE to B

-

t_TLH

LOW to HIGH

output transition

time

A port

3.2

3.3

1.2

2.7

1.1

2.7

B port

13.5 ns

t_THL

HIGH to LOW

output transition

time

A port

B port

1.2

2.6

7.4

9.5

1.0

2.2

7.5

9.4

1.0

2.8

16.7 ns

12.5 ns

t_W

pulse width

data rate

data inputs

49

-

49

-

49

-

ns

[3]

f_data

20

Mbps

V_CC(A)= 2.5 V

t_PHL

t_PLH

t_PHL

t_PLH

HIGH to LOW

propagation delay

A to B

B to A

-

4.0

4.4

3.8

3.2

-

4.2

5.2

4.5

2.0

-

4.3

5.5

5.4

1.5

ns

LOW to HIGH

propagation delay

HIGH to LOW

propagation delay

LOW to HIGH

propagation delay

t_en

enable time

disable time

OE to A; B

-

200

100

220

10

-

200

100

220

8.3

-

200

100

220

7.8

ns

[2]

t_dis

OE to A; no external load

OE to B; no external load

OE to A

-

OE to B

-

t_TLH

LOW to HIGH

output transition

time

A port

2.8

3.2

1.4

2.9

1.2

2.4

B port

10.4

15.5

16.9 ns

t_THL

HIGH to LOW

output transition

time

A port

B port

1.0

2.2

7.2

9.8

1.0

2.4

6.9

8.4

1.0

2.6

6.7

8.3

ns

NTS0304E

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Product data sheet

Rev. 1 — 01 February 2019

9 of 26

NTS0304E

NXP Semiconductors

4-bit dual supply translating transceiver; open drain; auto direction

sensing

Table 12. Dynamic characteristics for temperature range 40 C to +125 C^[1]…continued

Voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 6; for wave forms, see Figure 4 and Figure 5.

Symbol Parameter

Conditions

V_CC(B)

3.3 V

Unit

2.5 V

Max

5.0 V

Max

Min

49

-

Min

Max

-

Min

49

-

t_W

pulse width

data rate

data inputs

-

49

-

ns

[3]

f_data

20

Mbps

V_CC(A)= 3.3 V

t_PHL

t_PLH

t_PHL

t_PLH

HIGH to LOW

propagation delay

A to B

B to A

-

3.0

5.3

3.2

-

3.9

5.5

4.2

3.3

ns

LOW to HIGH

propagation delay

HIGH to LOW

propagation delay

LOW to HIGH

propagation delay

t_en

enable time

disable time

OE to A; B

-

200

100

280

220

13.1

14.2

-

200

100

280

220

7.4

ns

[2]

t_dis

OE to A; no external load

OE to B; no external load

OE to A

-

OE to B

-

t_TLH

LOW to HIGH

output transition

time

A port

1.2

2.5

1.1

2.1

B port

16.0 ns

t_THL

HIGH to LOW

output transition

time

A port

B port

-

1.0

2.3

6.8

9.3

1.0

2.4

6.3

9.5

ns

t_W

pulse width

data rate

data inputs

-

49

-

49

-

ns

[3]

f_data

20

Mbps

[1] t_enis the same as t_PZLand t_PZH

t_disis the same as t_PLZand t_PHZ

[2] Delay between OE going LOW and when the outputs are disabled.

[3] Assuming a maximum one-shot accelerator pulse length of 50ns and equal time for 1 and 0 bit information

.

NTS0304E

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Product data sheet

Rev. 1 — 01 February 2019

10 of 26

NTS0304E

NXP Semiconductors

4-bit dual supply translating transceiver; open drain; auto direction

sensing

13. Waveforms

V

I

V

A, B input

GND

M

t

PLH

PHL

V

OH

90 %

B, A output

V

M

10 %

OL

t

THL

TLH

001aan321

Measurement points are given in Table 13.

V_OLand V_OHare typical output voltage levels that occur with the output load.

Fig 4. The data input (A, B) to data output (B, A) propagation delay times

V

I

OE input

V

M

GND

t

PLZ

PZL

V

CCO

output

V

LOW-to-OFF

OFF-to-LOW

M

V

X

V

OL

t

PHZ

PZH

V

OH

V

Y

output

HIGH-to-OFF

OFF-to-HIGH

V

M

GND

outputs

enabled

outputs

disabled

outputs

enabled

001aal919

Measurement points are given in Table 13.

_OLand V_OHare typical output voltage levels that occur with the output load.

V

Fig 5. Enable and disable times

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Product data sheet

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Table 13. Measurement points^[1][2]

Supply voltage

V_CCO

Input

Output

V_M

V_X

V_Y

0.95 V

0.5V_CCI

0.5V_CCO

V_OL+ 0.1 V

V_OL+ 0.15 V

V_OL+ 0.3 V

V_OH 0.1 V

V_OH 0.15 V

V_OH 0.3 V

1.8 V  0.15 V

2.5 V  0.2 V

3.3 V  0.3 V

5.0 V  0.5 V

[1] V_CCIis the supply voltage associated with the input.

[2] V_CCOis the supply voltage associated with the output.

t

W

V

I

90 %

negative

pulse

V

M

10 %

0 V

t

r

f

t

f

r

V

I

90 %

positive

pulse

V

M

10 %

0 V

t

W

V

EXT

V

CC

R

L

V

O

I

G

DUT

C

L

R

L

001aal963

Test data is given in Table 14.

All input pulses are supplied by generators having the following characteristics: PRR  10 MHz; Z_O= 50 ; dV/dt  1.0 V/ns.

R_L= Load resistance.

C_L= Load capacitance including jig and probe capacitance.

V_EXT= External voltage for measuring switching times.

Fig 6. Test circuit for measuring switching times

Table 14. Test data

Supply voltage

V_CC(A)

Input

V_I^[1]

Load

C_L

V_EXT

[2]

[3]

V_CC(B)

t/V

R_L

t_PLH, t_PHLt_PZH, t_PHZt_PZL, t_PLZ

0.95 V to 3.6 V 1.65 V to 5.5 V V_CCI

 1.0 ns/V

15 pF

50 k, 1 M open

open

2V_CCO

[1] V_CCIis the supply voltage associated with the input.

[2] For measuring data rate, pulse width, propagation delay and output rise and fall measurements, R_L= 1 M. For measuring enable and

disable times, R_L= 50 K.

[3] V_CCOis the supply voltage associated with the output.

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14. Application information

14.1 Applications

Voltage level-translation applications. The NTS0304E can be used in point-to-point

applications to interface between devices or systems operating at different supply

voltages. The device is primarily targeted at I²C or 4-wire which use open-drain drivers. It

may also be used in applications where push-pull drivers are connected to the ports,

however the NTB010x or the newer lower voltage NTB030x series of devices are more

suitable.

1.8 V

3.3 V

1.8 V

V

CC(B)

3.3 V

CC(A)

0.1 μF

1 μF

OE

SYSTEM

CONTROLLER

NTS0304x

SYSTEM

DATA

A

B

DATA

aaa-031126

Fig 7. Typical operating circuit

14.2 Architecture

The architecture of the NTS0304E is shown in Figure 8. The device does not require an

extra input signal to control the direction of data flow from A to B or B to A.

V

CC(A)

V

CC(B)

T1

T2

ONE-SHOT

AND SLEW

RATE

ONE-SHOT

AND SLEW

RATE

CONTROL

10 kΩ

GATE BIAS CONTROL

T3

A

B

HBM JESD22-A114E

IEC61000-4-2

aaa-031819

Fig 8. Architecture of NTS0304E I/O cell

The NTS0304E is a “switch” type voltage translator, it employs two key circuits to enable

voltage translation:

1. A pass-gate transistor (N-channel) that ties the ports together.

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2. An output edge-rate accelerator that detects and accelerates rising edges on the I/O

pins.

The gate bias voltage of the pass gate transistor (T3) is set at approximately one

threshold voltage above the V_CClevel of the low-voltage side. During a LOW-to-HIGH

transition, the output one-shot accelerates the output transition by switching on the PMOS

transistors (T1, T2). It bypasses the 10 k pull-up resistors and increases the current

drive capability. The one-shot is activated once the input transition reaches approximately

V

_CCI/2; it is deactivated approximately 50 ns after the output reaches V_CCO/2. During the

acceleration time, the driver output resistance is between approximately 50  and 70 .

To avoid signal contention and minimize dynamic I_CC, the user should wait for the

one-shot circuit to turn-off before applying a signal in the opposite direction. Pull-up

resistors are included in the device for DC current sourcing capability.

14.3 Input driver requirements

As the NTS0304E is a switch type translator, properties of the input driver directly effect

the output signal. The external open-drain or push-pull driver applied to an I/O determines

the static current sinking capability of the system. The max data rate, HIGH-to-LOW

output transition time (t_THL), and propagation delay (t_PHL), are dependent upon the output

impedance and edge-rate of the external driver. The limits provided for these parameters

in the data sheet assume a driver with output impedance below 50  is used.

14.4 Output load considerations

The maximum lumped capacitive load that can be driven is dependent upon the one-shot

pulse duration. In cases with very heavy capacitive loading, there is a risk that the output

does not reach the positive rail within the one-shot pulse duration. The NTS0304E has a

longer one-shot pulse for driving larger capacitive loads.

To avoid excessive capacitive loading and to ensure correct triggering of the one-shot,

use short trace lengths and low capacitance connectors on NTS0304E PCB layouts. The

length of the PCB trace should be such that the round-trip delay of any reflection is within

the one-shot pulse duration (approximately 50 ns). It ensures low impedance termination

and avoids output signal oscillations and one-shot retriggering.

14.5 Output single shot slew rate control

Integrated slew-rate control and timed increase of the one-shot driver output current

reduce EMI. An additional comparator circuit on the V_OUTside starts to reduce the

one-shot driver current when V_OUT> 0.65V_OUTwith a slight delay, so it can safely drive

the output voltage to a safe high-level while at the same time reducing the driver strength

early enough to reduce overshoots and ringing.

14.6 Power-up

During operation, V_CC(A)must never be higher than V_CC(B). However, during power-up,

V_CC(A) V_CC(B)does not damage the device, so either power supply can be ramped up

first. There is no special power-up sequencing required. The NTS0304E includes circuitry

that disables all output ports when either V_CC(A)or V_CC(B)is switched off.

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Product data sheet

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4-bit dual supply translating transceiver; open drain; auto direction

sensing

14.7 Enable and disable

An output enable input (OE) is used to disable the device. Setting OE = LOW causes all

I/Os to assume the high-impedance OFF-state. The disable time (t_diswith no external

load) indicates the delay between when OE goes LOW and when outputs actually

become disabled. The enable time (t_en) indicates the amount of time the user must allow

for one one-shot circuitry to become operational after OE is taken HIGH. To ensure the

high-impedance OFF-state during power-up or power-down, pin OE should be tied to

GND through a pull-down resistor. The current-sourcing capability of the driver determines

the minimum value of the resistor.

14.8 Pull-up or pull-down resistors on I/Os lines

The A port I/O has an internal 10 k pull-up resistor to V_CC(A). The B port I/O has an

internal 10 k pull-up resistor to V_CC(B). If a smaller value of pull-up resistor is required,

add an external resistor in parallel to the internal 10 k. This pull-up resistor effects the

V

_OLlevel. When OE goes LOW, the internal pull-ups of the NTS0304E are disabled.

14.9 ESD protection on I/Os lines

The NTS0304E contains rail to rail ESD protection structures connecting the A and B I/O

to their respective supply. As a consequence, if a supply pin is pulled low, the related I/Os

are pulled low too through the upper ESD protection diode and the 10 k pull-up resistor.

Additionally, besides the normal HBM and CDM ESD protection features on both A and B

Port I/O the B Port I/O features integrated ESD protection to IEC 61000-4-2 Class 4

system ESD level of 8kV contact for when users plug cameras, games, and other items

into their USB or video ports in real-world ESD stress applications.

NTS0304E

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Product data sheet

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15. Package outline

Fig 9. Package outline SOT1390-10 (WLCSP12) 1 of 2

NTS0304E

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4-bit dual supply translating transceiver; open drain; auto direction

sensing

Fig 10. Package outline SOT1390-10 (WLCSP12) 2 of 2

NTS0304E

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TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm

SOT402-1

D

E

A

X

c

y

H

v

M

A

E

Z

8

14

Q

(A )

3

A

2

A

1

pin 1 index

θ

L

p

L

1

7

detail X

w

M

b

p

e

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

A

(1)

(2)

(1)

UNIT

A

b

c

D

E

e

H

L

Q

v

w

y

Z

θ

1

2

3

p

E

p

max.

8^o

0^o

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

5.1

4.9

4.5

4.3

6.6

6.2

0.75

0.50

0.4

0.3

0.72

0.38

mm

1.1

0.65

1

0.2

0.13

0.1

0.25

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-18

SOT402-1

MO-153

Fig 11. NTS0304E Package outline SOT402-1 (TSSOP14)

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sensing

16. Soldering

Fig 12. Soldering footprint for SOT1390-10 (WLCSP12) 1 of 3

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sensing

Fig 13. Soldering footprint for SOT1390-10 (WLCSP12) 2 of 3

NTS0304E

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4-bit dual supply translating transceiver; open drain; auto direction

sensing

Fig 14. Soldering footprint for SOT1390-10 (WLCSP12) 3 of 3

NTS0304E

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4-bit dual supply translating transceiver; open drain; auto direction

sensing

Footprint information for reflow soldering of TSSOP14 package

SOT402-1

Hx

Gx

P2

(0.125)

By

Hy Gy

Ay

C

D2 (4x)

D1

P1

Generic footprint pattern

Refer to the package outline drawing for actual layout

solder land

occupied area

DIMENSIONS in mm

P1 P2 Ay

By

C

D1

D2

Gx

Gy

Hx

Hy

0.650 0.750 7.200 4.500 1.350 0.400 0.600 4.950 5.300 5.800 7.450

sot402-1_fr

Fig 15. Soldering footprint for SOT402-1 (TSSOP14)

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sensing

17. Abbreviations

Table 15. Abbreviations

Acronym

CDM

DUT

Description

Charged Device Model

Device Under Test

ESD

ElectroStatic Discharge

GPIO

HBM

I²C

General Purpose Input Output

Human Body Model

Inter-Integrated Circuit

IEC

International Electrotechnical Commission

Machine Model

MM

PCB

Printed-Circuit Board

PMOS

SMBus

UART

Positive Metal Oxide Semiconductor

System Management Bus

Universal Asynchronous Receiver Transmitter

18. Revision history

Table 16. Revision history

Document ID

Release date Data sheet status

Change notice

Supersedes

NTS0304E v.1.0 20190201

Product data sheet

-

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19. Legal information

19.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

Suitability for use — NXP Semiconductors products are not designed,

19.2 Definitions

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

19.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

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Product data sheet

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sensing

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

19.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

20. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

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sensing

21. Contents

1

General description. . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits . . . . . . . . . . . . . . . . . . . . 1

2

3

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2

Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

4

4.1

5

6

6.1

6.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

7

Functional description . . . . . . . . . . . . . . . . . . . 3

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

Recommended operating conditions. . . . . . . . 4

Thermal characteristics . . . . . . . . . . . . . . . . . . 5

Static characteristics. . . . . . . . . . . . . . . . . . . . . 5

Dynamic characteristics . . . . . . . . . . . . . . . . . . 8

Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

8

9

10

11

12

13

14

Application information. . . . . . . . . . . . . . . . . . 13

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Input driver requirements . . . . . . . . . . . . . . . . 14

Output load considerations. . . . . . . . . . . . . . . 14

Output single shot slew rate control . . . . . . . . 14

Power-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Enable and disable. . . . . . . . . . . . . . . . . . . . . 15

Pull-up or pull-down resistors on I/Os lines . . 15

ESD protection on I/Os lines . . . . . . . . . . . . . 15

14.1

14.2

14.3

14.4

14.5

14.6

14.7

14.8

14.9

15

16

17

18

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 23

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 23

19

Legal information. . . . . . . . . . . . . . . . . . . . . . . 24

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 25

19.1

19.2

19.3

19.4

20

21

Contact information. . . . . . . . . . . . . . . . . . . . . 25

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 01 February 2019

Document identifier: NTS0304E


型号：	NTS0304EPW
厂家：	NXP
描述：	4-bit dual supply translating transceiver; open drain; auto direction sensing
文件：	总26页 (文件大小：680K)
中文：	中文翻译
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NTS0304EPW [NXP]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E