NX3DV221GM [NXP]
High-speed USB 2.0 switch with enable; 高速USB 2.0开关启用型号: | NX3DV221GM |
厂家: | NXP |
描述: | High-speed USB 2.0 switch with enable |
文件: | 总18页 (文件大小:1034K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
NX3DV221
High-speed USB 2.0 switch with enable
Rev. 2 — 9 November 2011
Product data sheet
1. General description
The NX3DV221 is a high-bandwidth switch designed for the switching of high-speed USB
2.0 signals in handset and consumer applications, such as cell phones, digital cameras,
and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (1
GHz) of this switch allows signal to pass with minimum edge and phase distortion. The
device multiplexes differential outputs from a USB host device to one of two
corresponding outputs. The switch is bidirectional and offers little or no attenuation of the
high-speed signals at the outputs. It is designed for low bit-to-bit skew and high
channel-to-channel noise isolation, and is compatible with various standards, such as
high-speed USB 2.0 (480 Mbps).
2. Features and benefits
Wide supply voltage range from 2.3 V to 3.6 V
Switch voltage accepts signals up to 5.5 V
1.8 V control logic at VCC = 3.6 V
Low-power mode when OE is HIGH (2 A maximum)
6 (maximum) ON resistance
0.1 (typical) ON resistance mismatch between channels
6 pF (typical) ON-state capacitance
High bandwidth (1.0 GHz typical)
Latch-up performance exceeds 100 mA per JESD 78B Class II Level A
ESD protection:
HBM JESD22-A114F Class 3A exceeds 8000 V
CDM JESD22-C101E exceeds 1000 V
HBM exceeds 12000 V for I/O to GND protection
Specified from 40 C to +85 C
3. Applications
Routes signals for USB 1.0, 1.1 and 2.0
NX3DV221
NXP Semiconductors
High-speed USB 2.0 switch with enable
4. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
NX3DV221GM
40 C to +85 C
XQFN10U plastic extremely thin quad flatpackage; no leads;
SOT1049-2
10 terminals; UTLP based; body 2 1.55 0.5 mm
5. Marking
Table 2.
Marking
Type number
Marking code[1]
NX3DV221GM
x21
[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.
6. Functional diagram
8
7
1
D+
D-
1D+
2
3
1D-
2D+
V
CC
4
2D-
CHARGE
PUMP
6
9
OE
S
CONTROLLOGIC
001aao078
Fig 1. Logic symbol
NX3DV221
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
2 of 18
NX3DV221
NXP Semiconductors
High-speed USB 2.0 switch with enable
7. Pinning information
7.1 Pinning
NX3DV221
1D+
1D-
2D+
2D-
1
2
3
4
9
8
7
6
S
D+
D-
OE
001aao079
Transparent top view
Fig 2. Pin configuration SOT1049-2 (XQFN10U)
7.2 Pin description
Table 3.
Symbol
1D+
1D
2D+
2D
GND
OE
Pin description
Pin
Description
1
2
3
4
5
6
7
8
9
10
independent input or output
independent input or output
independent input or output
independent input or output
ground (0 V)
output enable input (active LOW)
common input or output
common input or output
select input
D
D+
S
VCC
supply voltage
8. Functional description
Table 4.
Function table[1]
Input
Channel
S
L
OE
L
D+ = 1D+; D = 1D
D+ = 2D+; D = 2D
switches off
H
X
L
H
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care.
NX3DV221
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
3 of 18
NX3DV221
NXP Semiconductors
High-speed USB 2.0 switch with enable
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
VCC
VI
Parameter
Conditions
S, OE input
VI < 0.5 V
Min
0.5
0.5
0.5
50
50
-
Max
+4.6
+7.0
+7.0
-
Unit
V
supply voltage
input voltage
[1]
[2]
V
VSW
IIK
switch voltage
input clamping current
V
mA
mA
mA
mA
mA
C
ISK
switch clamping current VI < 0.5 V
switch current
-
ISW
120
+100
-
ICC
supply current
-
IGND
Tstg
Ptot
ground current
100
65
-
storage temperature
+150
250
[3]
total power dissipation
Tamb = 40 C to +125 C
mW
[1] The minimum input voltage rating may be exceeded if the input current rating is observed.
[2] The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed.
[3] For XQFN10U packages: above 132 C the value of Ptot derates linearly with 14.1 mW/K.
10. Recommended operating conditions
Table 6.
Recommended operating conditions
Symbol Parameter
Conditions
Min
2.3
0
Max
3.6
Unit
V
VCC
VI
supply voltage
input voltage
S, OE input
VCC
5.5
V
VSW
Tamb
switch voltage
ambient temperature
0
V
40
+85
C
11. Static characteristics
Table 7.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground 0 V).
Symbol Parameter
Conditions
Tamb = 25 C
Tamb =-40 C to +85 C Unit
Min
Typ
Max
Min
Max
VIH
VIL
HIGH-level
input voltage
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0.46VCC
-
V
V
V
V
V
0.46VCC
-
LOW-level
input voltage
-
-
-
0.25VCC
0.25VCC
1.8
VIK
II
input clamping VCC = 2.7 V, 3.6 V;
voltage
II = 18 mA
input leakage
current
S, OE input;
VCC = 0 V, 2.7 V, 3.6;
VI = GND to 3.6 V
-
0.01
-
-
1
A
NX3DV221
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
4 of 18
NX3DV221
NXP Semiconductors
High-speed USB 2.0 switch with enable
Table 7.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground 0 V).
Symbol Parameter
Conditions
Tamb = 25 C
Tamb =-40 C to +85 C Unit
Min
Typ
Max
Min
Max
IOFF
power-off
leakage current
per pin; VCC = 0 V
VSW = 0 V to 2.7 V
VSW = 0 V to 3.6 V
VSW = 0 V to 5.25 V
nD+ and nD- ports;
-
-
-
0.01
0.01
0.01
-
-
-
-
-
-
2.0
2.0
3.0
A
A
A
IS(OFF)
OFF-state
leakage current see Figure 3
VCC = 2.7 V, 3.6 V
-
-
-
-
1
A
ICC
supply current VCC = 2.7 V, 3.6 V
OE = GND
-
-
18.5
0.01
-
-
-
-
30
2
A
A
OE = VCC (low power mode)
S, OE input;
supply current one input at 1.8 V;
other inputs at GND or VCC
ICC
additional
VCC = 2.7 V
VCC = 3.6 V
-
-
-
0.8
12.5
1
-
-
-
-
-
-
1.8
20
A
A
pF
CI
input
VSW = GND or VCC
VCC = 2.5 V, 3.3 V
;
;
;
2.5
capacitance
CS(OFF) OFF-state
capacitance
VSW = GND or VCC
VCC = 2.5 V, 3.3 V
-
-
3
6
-
-
-
-
5.0
7.5
pF
pF
CS(ON)
ON-state
VSW = GND or VCC
VCC = 2.5 V, 3.3 V
capacitance
11.1 Test circuits
V
CC
switch
S
OE
V
IL
V
1
2
IH
S
1Dn
2Dn
1
2
V
IL
or V
V
IH
IH
V
V
IH
IH
Dn
switch
I
S
OE
GND
V
V
O
I
001aao080
VI = 0 V; VO = 0 V to 5.25 V
Fig 3. Test circuit for measuring OFF-state leakage current
NX3DV221
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
5 of 18
NX3DV221
NXP Semiconductors
High-speed USB 2.0 switch with enable
11.2 ON resistance
Table 8.
ON resistance
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for graphs see Figure 5.
Symbol Parameter
Conditions
Tamb = 40 C to +85 C
Tamb = 40 C to +85 C Unit
Min
Typ[1]
Max
Min
Max
RON
ON resistance
VCC = 2.3 V, 3.0 V
see Figure 4
VI = 0 V;
II = 30 mA
-
-
3.6
4.3
-
-
-
-
6
7
VI = 2.4 V;
II = 15 mA
[2]
[3]
RON
ON resistance
mismatch
between channels
VCC = 2.3 V, 3.0 V
VI = 0 V;
II = 30 mA
-
-
0.1
0.1
-
-
-
-
-
-
VI = 1.7 V;
II = 15 mA
RON(flat)
ON resistance
(flatness)
VCC = 2.3 V, 3.0 V;
VI = 0 V to VCC
II = 30 mA
-
-
0.8
0.7
-
-
-
-
-
-
II = 15 mA
[1] Typical values are measured at Tamb = 25 C.
[2] Measured at identical VCC, temperature and input voltage.
[3] Flatness is defined as the difference between the maximum and minimum value of ON resistance measured at identical VCC and
temperature.
11.3 ON resistance test circuit and waveforms
V
V
CC
switch
S
OE
V
SW
V
V
IL
1
2
IL
S
1Dn
2Dn
1
2
V
IL
or V
IH
V
IH
V
IL
Dn
switch
OE
GND
V
IL
V
I
SW
I
001aao081
RON = VSW / ISW
.
Fig 4. Test circuit for measuring ON resistance
NX3DV221
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
6 of 18
NX3DV221
NXP Semiconductors
High-speed USB 2.0 switch with enable
001aao082
5.0
R
ON
(Ω)
4.5
4.0
3.5
3.0
0
1
2
3
V (V)
I
Fig 5. ON resistance as a function of input voltage
12. Dynamic characteristics
Table 9.
Dynamic characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for test circuit see Figure 9.
Symbol Parameter
Conditions
Tamb = 25 C
Tamb = 40 C to +85 C Unit
Min Typ[1] Max
Min
Max
[2][3]
tpd
propagation delay Dn to nDn or nDn to Dn;
see Figure 6
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
-
-
0.25
0.25
-
-
-
-
-
-
ns
ns
[3]
ten
enable time
S to Dn, nDn;
see Figure 8
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
-
-
-
-
-
-
-
-
50
30
ns
ns
[3]
OE to Dn, nDn;
see Figure 8
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
-
-
-
-
-
-
-
-
32
17
ns
ns
[3]
tdis
disable time
S to Dn, nDn;
see Figure 8
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
-
-
-
-
-
-
-
-
23
12
ns
ns
[3]
OE to Dn, nDn;
see Figure 8
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
-
-
-
-
-
-
-
-
12
10
ns
ns
NX3DV221
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
7 of 18
NX3DV221
NXP Semiconductors
High-speed USB 2.0 switch with enable
Table 9.
Dynamic characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for test circuit see Figure 9.
Symbol Parameter
Conditions
Tamb = 25 C
Tamb = 40 C to +85 C Unit
Min Typ[1] Max
Min
Max
[4]
[4]
tsk(o)
output skew time
see Figure 7
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
see Figure 6
-
-
0.1
0.1
-
-
-
-
0.2
0.2
ns
ns
tsk(p)
pulse skew time
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
-
-
0.1
0.1
-
-
-
-
0.2
0.2
ns
ns
[1] Typical values are measured at Tamb = 25 C and VCC = 2.5 V and 3.3 V respectively.
[2] The propagation delay is the calculated RC time constant of the typical ON resistance of the switch and the specified load capacitance,
when driven by an ideal voltage source (zero output impedance).
[3] tpd is the same as tPLH and tPHL
[4] Guaranteed by design.
.
12.1 Waveforms, test circuit and graphs
800 mV
input
400 mV
50%
t
t
PLH
PHL
V
OH
output
50%
V
OL
001aao083
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
tsk(p) = |tPHL tPLH|.
Fig 6. The data input to output propagation delay times and pulse skew time
NX3DV221
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
8 of 18
NX3DV221
NXP Semiconductors
High-speed USB 2.0 switch with enable
800 mV
input
50%
400 mV
(1)
PLH
(1)
t
t
PHL
V
OH
output 1
output 2
50%
V
OL
t
t
sk(o)
sk(o)
V
OH
50%
V
OL
(2)
PLH
(2)
t
PHL
t
001aao084
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
sk(o) = |tPLH(1) tPLH(2)| or |tPHL(1) tPHL(2)|.
t
Fig 7. Output skew time
V
I
S, OE input
output
V
V
M
M
GND
t
en
t
dis
V
OH
V
V
V
X
X
OFF to HIGH
HIGH to OFF
GND
t
en
t
dis
V
OH
V
X
X
output
HIGH to OFF
OFF to HIGH
GND
001aao085
Measurement points are given in Table 10.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 8. Enable and disable times
Table 10. Measurement points
Supply voltage
VCC
Input
Output
VX
VM
VI
2.3 V to 3.6 V
0.5VI
1. 8 V
0.9VOH
NX3DV221
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
9 of 18
NX3DV221
NXP Semiconductors
High-speed USB 2.0 switch with enable
V
CC
1Dn
2Dn
Dn
OE
V
IL
G
V
V
= V
CC
R
C
R
C
L
I
EXT
L
L
L
GND
001aao086
Test data is given in Table 11.
Definitions test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
VEXT = External voltage for measuring switching times.
VI may be connected to S or OE.
Fig 9. Test circuit for switching times
Table 11. Test data
Supply voltage
VCC
Input
VI
Load
tr, tf
CL
RL
2.3 V to 3.6 V
1.8 V
5 ns
50 pF
500
+ 0.5 V
-0.5 V
Time scale (0.25 ns/DIV)
001aao087
Fig 10. Eye-pattern 480 Mbps USB signal with no switch.
NX3DV221
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Product data sheet
Rev. 2 — 9 November 2011
10 of 18
NX3DV221
NXP Semiconductors
High-speed USB 2.0 switch with enable
+ 0.5 V
-0.5 V
Time scale (0.25 ns/DIV)
001aao088
Fig 11. Eye-pattern 480 Mbps USB signal with switch (normally closed path)
+ 0.5 V
-0.5 V
Time scale (0.25 ns/DIV)
001aao089
Fig 12. Eye-pattern 480 Mbps USB signal with switch (normally open path)
NX3DV221
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
11 of 18
NX3DV221
NXP Semiconductors
High-speed USB 2.0 switch with enable
12.2 Additional dynamic characteristics
Table 12. Additional dynamic characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); VI = GND or VCC (unless otherwise
specified); tr = tf 5 ns; Tamb = 25 C.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
[1][2]
[1][2]
[1][2]
f(3dB) 3 dB frequency
RL = 50 ; see Figure 13
VCC = 2.3 V to 2.7 V
response
-
-
1.0
-
-
GHz
GHz
VCC = 3.0 V to 3.6 V
1.0
iso
isolation (OFF-state)
fi = 250 MHz; RL = 50 ; see Figure 14
VCC = 2.3 V to 2.7 V
-
-
38
38
-
-
dB
dB
VCC = 3.0 V to 3.6 V
Xtalk
crosstalk
between switches;
fi = 250 MHz; RL = 50 ; see Figure 15
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
-
-
40
40
-
-
dB
dB
[1] fi is biased at 350 mV.
[2] Vi = 632 mV (p-p).
12.3 Test circuits
350 mV
V
CC
switch
S
OE
V
V
IL
1
2
IL
R
L
S
1Dn
2Dn
1
2
V
IL
or V
IH
V
V
IL
IH
Dn
switch
OE
V
IL
f
dB
i
GND
001aao090
Adjust fi voltage to obtain 0 dBm level at output. Increase fi frequency until dB meter reads 3 dB.
Fig 13. Test circuit for measuring the frequency response when switch is in ON-state
NX3DV221
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Product data sheet
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12 of 18
NX3DV221
NXP Semiconductors
High-speed USB 2.0 switch with enable
V
CC
350 mV
350 mV
switch
S
OE
V
V
1
2
IH
IH
R
R
L
L
V
V
IL
IH
S
1Dn
2Dn
1
2
V
IL
or V
V
IH
IH
Dn
switch
OE
f
dB
i
GND
001aao091
Adjust fi voltage to obtain 0 dBm level at input.
Fig 14. Test circuit for measuring isolation (OFF-state)
V
CC
350 mV 350 mV
R
R
L
L
S
1Dn
2Dn
1
V
IL
or V
V
IH
Dn
2
OE
IH
50 Ω
f
i
dB
GND
001aao092
Fig 15. Test circuit for measuring crosstalk
NX3DV221
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
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High-speed USB 2.0 switch with enable
13. Package outline
XQFN10U: plastic extremely thin quad flat package; no leads; 10 terminals;
UTLP based; body 2 x 1.55 x 0.5 mm
SOT1049-2
D
B
A
terminal 1
index area
E
A
A
1
detail X
e
2
L
C
L
1
e
y
C
1
y
M
M
v
C
C
A
B
5
w
4
3
2
1
6
7
e
1
b
e
3
1/2 e
8
1
9
terminal 1
index area
10
metal area
must not be soldered
X
0
2.5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A
1
b
D
E
e
e
1
e
2
e
3
L
L
v
w
y
y
1
1
max 0.50 0.05 0.30 1.65
2.1
2.0
1.9
0.4
0.3
0.2
0.15
0.08
0.00
mm
0.58
0.5
1.16
1.5
0.1
0.05
0.1
0.05
nom
min
0.03
0.00
1.55
1.45
0.23
0.15
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
- - -
JEDEC
JEITA
08-04-22
10-02-05
SOT1049-2
- - -
MO-255
Fig 16. Package outline SOT1049-2 (XQFN10U)
NX3DV221
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
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High-speed USB 2.0 switch with enable
14. Abbreviations
Table 13. Abbreviations
Acronym
CDM
Description
Charged Device Model
Complementary Metal Oxide Semiconductor
ElectroStatic Discharge
Human Body Model
CMOS
ESD
HBM
MM
Machine Model
15. Revision history
Table 14. Revision history
Document ID
NX3DV221 v.2
Modifications:
NX3DV221 v.1
Release date
20111109
Data sheet status
Change notice
Supersedes
Product data sheet
-
NX3DV221 v.1
• Legal pages updated.
20110421 Product data sheet
-
-
NX3DV221
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
15 of 18
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High-speed USB 2.0 switch with enable
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
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Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
16.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
16.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
NX3DV221
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
16 of 18
NX3DV221
NXP Semiconductors
High-speed USB 2.0 switch with enable
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NX3DV221
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 9 November 2011
17 of 18
NX3DV221
NXP Semiconductors
High-speed USB 2.0 switch with enable
18. Contents
1
2
3
4
5
6
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
7
7.1
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
8
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
9
10
11
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Test circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
ON resistance. . . . . . . . . . . . . . . . . . . . . . . . . . 6
ON resistance test circuit and waveforms . . . . 6
11.1
11.2
11.3
12
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Waveforms, test circuit and graphs . . . . . . . . . 8
Additional dynamic characteristics . . . . . . . . . 12
Test circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
12.1
12.2
12.3
13
14
15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
16.1
16.2
16.3
16.4
17
18
Contact information. . . . . . . . . . . . . . . . . . . . . 17
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 9 November 2011
Document identifier: NX3DV221
相关型号:
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