NX3L4684TK,132 [NXP]

NX3L4684 - Low-ohmic dual single-pole double-throw analog switch SON 10-Pin;
NX3L4684TK,132
型号: NX3L4684TK,132
厂家: NXP    NXP
描述:

NX3L4684 - Low-ohmic dual single-pole double-throw analog switch SON 10-Pin

光电二极管 输出元件
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中文:  中文翻译
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NX3L4684  
Low-ohmic dual single-pole double-throw analog switch  
Rev. 8 — 3 April 2014  
Product data sheet  
1. General description  
The NX3L4684 is a dual low-ohmic single-pole double-throw analog switch, suitable for  
use as an analog or digital multiplexer/demultiplexer. Each switch has a digital select input  
(nS), two independent inputs/outputs (nY0 and nY1) and a common input/output (nZ).  
Schmitt trigger action at the digital inputs makes the circuit tolerant to slower input rise and  
fall times. Low threshold digital inputs allows this device to be driven by 1.8 V logic levels  
in 3.3 V applications without significant increase in supply current ICC. This makes it  
possible for the NX3L4684 to switch 4.3 V signals with a 1.8 V digital controller,  
eliminating the need for logic level translation. The NX3L4684 allows signals with  
amplitude up to VCC to be transmitted from nZ to nY0 or nY1; or from nY0 or nY1 to nZ. Its  
low ON resistance (0.3 for Y0 port, 0.5 for Y1 port) and flatness (0.1 ) ensures  
minimal attenuation and distortion of transmitted signals.  
2. Features and benefits  
Wide supply voltage range from 1.4 V to 4.3 V  
Very low ON resistance (peak) for Y0 port:  
0.8 (typical) at VCC = 1.4 V  
0.5 (typical) at VCC = 1.65 V  
0.3 (typical) at VCC = 2.3 V  
0.25 (typical) at VCC = 2.7 V  
0.25 (typical) at VCC = 4.3 V  
Break-before-make switching  
High noise immunity  
ESD protection:  
HBM JESD22-A114F Class 3A exceeds 4000 V  
MM JESD22-A115-A exceeds 200 V  
CDM AEC-Q100-011 revision B exceeds 1000 V  
IEC61000-4-2 contact discharge exceeds 6000 V for switch ports  
CMOS low-power consumption  
Latch-up performance exceeds 100 mA per JESD 78B Class II Level A  
1.8 V control logic at VCC = 3.6 V  
Control input accepts voltages above supply voltage  
Very low supply current, even when input is below VCC  
High current handling capability (350 mA continuous current under 3.3 V supply)  
Specified from 40 C to +85 C and from 40 C to +125 C  
 
 
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
3. Applications  
Cell phone  
PDA  
Portable media player  
4. Ordering information  
Table 1.  
Ordering information  
Package  
Temperature range Name  
Type number  
Description  
Version  
NX3L4684GM 40 C to +125 C  
XQFN10  
plastic extremely thin quad flatpackage; no leads;  
10 terminals; body 2 1.55 0.5 mm  
SOT1049-3  
NX3L4684TK 40 C to +125 C  
HVSON10  
plastic thermal enhanced very thin small outline  
SOT650-2  
package; no leads; 10 terminals; 3 3 0.85 mm  
5. Marking  
Table 2.  
Marking  
Type number  
NX3L4684GM  
NX3L4684TK  
Marking code  
D84  
D84  
6. Functional diagram  
<ꢀ  
6
=
ꢀ<ꢁ  
ꢀ6  
ꢂ<ꢁ  
ꢂ6  
ꢀ=  
ꢂ=  
<ꢁ  
ꢀ<ꢀ  
ꢂ<ꢀ  
ꢀꢀꢁDDMꢀꢂꢃ  
ꢀꢀꢁDDFꢄꢃꢃ  
Fig 1. Logic symbol  
Fig 2. Logic diagram (one switch)  
NX3L4684  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 8 — 3 April 2014  
2 of 24  
 
 
 
 
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
7. Pinning information  
7.1 Pinning  
1;ꢀ/ꢁꢂꢃꢁ  
terminal 1  
index area  
NX3L4684  
ꢀ<ꢁ  
ꢂ<ꢁ  
ꢂ6  
1
2
3
4
5
10  
9
V
2Y1  
2Z  
CC  
1Y1  
1Z  
ꢀ6  
ꢀ=  
8
2S  
ꢂ=  
7
1S  
2Y0  
GND  
ꢀ<ꢀ  
ꢂ<ꢀ  
6
1Y0  
001aaj087  
DDDꢅꢀꢀꢄꢆꢇꢆ  
7UDQVSDUHQWꢃWRSꢃYLHZ  
Transparent top view  
Fig 3. Pin configuration SOT1049-3 (XQFN10)  
Fig 4. Pin configuration SOT650-2 (HVSON10)  
7.2 Pin description  
Table 3.  
Symbol  
Pin description  
Pin  
Description  
SOT1049-3  
SOT650-2  
1Y0  
1S  
1
2
3
4
5
6
7
8
9
10  
5
4
3
2
1
10  
9
8
7
6
independent input or output  
select input  
1Z  
common output or input  
independent input or output  
supply voltage  
1Y1  
VCC  
2Y1  
2Z  
independent input or output  
common output or input  
select input  
2S  
2Y0  
GND  
independent input or output  
ground (0 V)  
NX3L4684  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 8 — 3 April 2014  
3 of 24  
 
 
 
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
8. Functional description  
Table 4.  
Function table[1]  
Input nS  
Channel on  
nY0  
L
H
nY1  
[1] H = HIGH voltage level;  
L = LOW voltage level.  
9. Limiting values  
Table 5.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).  
Symbol  
VCC  
VI  
Parameter  
Conditions  
Min  
0.5  
0.5  
0.5  
50  
-
Max  
+4.6  
+4.6  
Unit  
V
supply voltage  
input voltage  
[1]  
[2]  
select input nS  
V
VSW  
IIK  
switch voltage  
input clamping current  
switch input nY0 or nY1  
VI < 0.5 V  
VCC + 0.5 V  
-
mA  
ISK  
switch clamping current VI < 0.5 V or VI > VCC + 0.5 V  
50  
350  
mA  
mA  
ISW  
switch current  
VSW > 0.5 V or VSW < VCC + 0.5 V;  
-
source or sink current  
VSW > 0.5 V or VSW < VCC + 0.5 V;  
pulsed at 1 ms duration, < 10 % duty cycle;  
peak current  
-
500  
mA  
Tstg  
Ptot  
storage temperature  
total power dissipation  
65  
+150  
250  
C  
[3]  
Tamb = 40 C to +125 C  
-
mW  
[1] The minimum input voltage rating may be exceeded if the input current rating is observed.  
[2] The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed but may not  
exceed 4.6 V.  
[3] For XQFN10 packages: above 132 C the value of Ptot derates linearly with 14.1 mW/K.  
For HVSON10 packages: above 135 C the value of Ptot derates linearly with 17.2 mW/K.  
10. Recommended operating conditions  
Table 6.  
Recommended operating conditions  
Symbol Parameter  
Conditions  
Min  
1.4  
0
Max  
4.3  
Unit  
V
VCC  
VI  
supply voltage  
input voltage  
select input nS  
4.3  
V
[1]  
[2]  
VSW  
Tamb  
t/V  
switch voltage  
switch input nY0 or nY1  
0
VCC  
+125  
200  
V
ambient temperature  
input transition rise and fall rate  
40  
-
C  
ns/V  
VCC = 1.4 V to 4.3 V  
[1] To avoid sinking GND current from terminal nZ when switch current flows in terminal nYn, the voltage drop across the bidirectional  
switch must not exceed 0.4 V. If the switch current flows into terminal nZ, no GND current will flow from terminal nYn. In this case, there  
is no limit for the voltage drop across the switch.  
[2] Applies to select input nS signal levels.  
NX3L4684  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 8 — 3 April 2014  
4 of 24  
 
 
 
 
 
 
 
 
 
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
11. Static characteristics  
Table 7.  
Static characteristics  
At recommended operating conditions; voltages are referenced to GND (ground 0 V).  
Symbol Parameter  
Conditions  
Tamb = 25 C  
Tamb = 40 C to +125 C Unit  
Min  
Typ  
Max  
Min  
Max  
Max  
(85 C) (125 C)  
VIH  
HIGH-level  
input voltage  
VCC = 1.4 V to 1.6 V  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V to 3.6 V  
VCC = 3.6 V to 4.3 V  
VCC = 1.4 V to 1.6 V  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V to 3.6 V  
VCC = 3.6 V to 4.3 V  
0.9  
0.9  
1.1  
1.3  
1.4  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0.9  
0.9  
1.1  
1.3  
1.4  
-
-
-
-
-
V
V
V
V
V
V
V
V
V
V
A  
-
-
-
-
-
-
-
-
-
VIL  
LOW-level  
input voltage  
0.3  
0.4  
0.5  
0.5  
0.6  
-
0.3  
0.4  
0.5  
0.5  
0.6  
0.5  
0.3  
0.3  
0.4  
0.5  
0.6  
1  
-
-
-
-
-
-
-
-
II  
input leakage select input nS;  
-
-
current  
VI = GND to 4.3 V;  
VCC = 1.4 V to 4.3 V  
IS(OFF)  
OFF-state  
leakage  
current  
nYn port; see Figure 5  
VCC = 1.4 V to 3.6 V  
VCC = 3.6 V to 4.3 V  
nZ port; see Figure 6  
VCC = 1.4 V to 3.6 V  
VCC = 3.6 V to 4.3 V  
-
-
-
-
5  
-
-
10  
50  
100 nA  
200 nA  
10  
IS(ON)  
ON-state  
leakage  
current  
-
-
-
-
5  
-
-
20  
50  
200 nA  
400 nA  
10  
ICC  
supply current VI = VCC or GND;  
VSW = GND or VCC  
VCC = 3.6 V  
VCC = 4.3 V  
-
-
-
-
100  
150  
-
-
300  
500  
3000 nA  
5000 nA  
ICC  
additional  
supply current  
VSW = GND or VCC  
VI = 2.6 V; VCC = 4.3 V  
VI = 2.6 V; VCC = 3.6 V  
VI = 1.8 V; VCC = 4.3 V  
VI = 1.8 V; VCC = 3.6 V  
VI = 1.8 V; VCC = 2.5 V  
-
-
-
-
-
-
2.0  
0.35  
7.0  
2.5  
50  
4.0  
0.7  
10.0  
4.0  
200  
-
-
-
-
-
-
-
7
1
7
1
A  
A  
A  
A  
nA  
pF  
15  
5
15  
5
300  
-
500  
-
CI  
input  
1.0  
capacitance  
CS(OFF) OFF-state  
capacitance  
port nY0  
port nY1  
port nY0  
port nY1  
-
-
-
-
65  
35  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
pF  
pF  
pF  
pF  
CS(ON)  
ON-state  
260  
160  
capacitance  
NX3L4684  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 8 — 3 April 2014  
5 of 24  
 
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
11.1 Test circuits  
switch nS  
V
CC  
1
2
V
IH  
V
IL  
nS  
nZ  
nY0  
nY1  
1
2
V
or V  
IH  
IL  
switch  
I
S
V
V
O
I
GND  
012aaa000  
VI = 0.3 V or VCC 0.3 V; VO = VCC 0.3 V or 0.3 V.  
Fig 5. Test circuit for measuring OFF-state leakage current  
switch nS  
V
CC  
1
2
V
IH  
V
IL  
nS  
nZ  
nY0  
nY1  
1
2
V
or V  
IH  
IL  
switch  
I
S
V
V
I
O
GND  
012aaa001  
VI = 0.3 V or VCC 0.3 V; VO = VCC 0.3 V or 0.3 V.  
Fig 6. Test circuit for measuring ON-state leakage current  
NX3L4684  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 8 — 3 April 2014  
6 of 24  
 
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
11.2 ON resistance  
Table 8.  
ON resistance  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for graphs see Figure 9 to Figure 21.  
Symbol Parameter  
Conditions  
Tamb = 40 C to +85 C  
Tamb = 40 C to  
+125 C  
Unit  
Min  
Typ[1]  
Max  
Min  
Max  
RON(peak) ON resistance  
(peak)  
port nY0; see Figure 7;  
VI = GND to VCC; ISW = 100 mA  
VCC = 1.4 V  
VCC = 1.65 V  
VCC = 2.3 V  
VCC = 2.7 V  
VCC = 4.3 V  
-
-
-
-
-
0.85  
0.55  
0.35  
0.30  
0.30  
2.0  
0.8  
-
-
-
-
-
2.2  
0.9  
0.6  
0.5  
0.5  
0.5  
0.45  
0.45  
port nY1; see Figure 7;  
VI = GND to VCC; ISW = 100 mA  
VCC = 1.4 V  
VCC = 1.65 V  
VCC = 2.3 V  
-
-
-
-
-
1.65  
0.95  
0.55  
0.50  
0.50  
3.7  
1.6  
-
-
-
-
-
4.1  
1.7  
0.9  
0.9  
0.9  
0.8  
VCC = 2.7 V  
0.75  
0.75  
VCC = 4.3 V  
[2]  
RON  
ON resistance  
mismatch between  
channels  
VI = GND to VCC; ISW = 100 mA  
VCC = 1.4 V  
-
-
-
-
-
0.15  
0.15  
0.04  
0.04  
0.04  
0.3  
0.2  
-
-
-
-
-
0.3  
0.3  
0.1  
0.1  
0.1  
VCC = 1.65 V  
VCC = 2.3 V  
0.08  
0.075  
0.075  
VCC = 2.7 V  
VCC = 4.3 V  
[3]  
RON(flat)  
ON resistance  
(flatness)  
port nY0; VI = GND to VCC  
ISW = 100 mA  
;
VCC = 1.4 V  
VCC = 1.65 V  
VCC = 2.3 V  
VCC = 2.7 V  
VCC = 4.3 V  
-
-
-
-
-
0.5  
0.25  
0.1  
1.7  
0.6  
-
-
-
-
-
1.8  
0.7  
0.2  
0.2  
0.1  
0.15  
0.20  
0.2  
0.1  
0.25  
[3]  
port nY1; VI = GND to VCC  
ISW = 100 mA  
;
VCC = 1.4 V  
VCC = 1.65 V  
VCC = 2.3 V  
VCC = 2.7 V  
VCC = 4.3 V  
-
-
-
-
-
1.0  
0.5  
3.3  
1.2  
0.3  
0.3  
0.4  
-
-
-
-
-
3.6  
1.3  
0.15  
0.13  
0.2  
0.35  
0.35  
0.45  
[1] Typical values are measured at Tamb = 25 C.  
[2] Measured at identical VCC, temperature and input voltage.  
[3] Flatness is defined as the difference between the maximum and minimum value of ON resistance measured at identical VCC and  
temperature.  
NX3L4684  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 8 — 3 April 2014  
7 of 24  
 
 
 
 
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
11.3 ON resistance test circuit and graphs  
V
SW  
V
switch nS  
V
CC  
1
2
V
V
IL  
nS  
nZ  
IH  
nY0  
nY1  
1
2
V
or V  
IH  
IL  
switch  
V
I
SW  
I
GND  
012aaa002  
RON = VSW / ISW  
.
Fig 7. Test circuit for measuring ON resistance  
001aah800  
ꢀꢀꢁDDJꢃꢈꢆ  
ꢀꢍꢇ  
0.8  
5
R
(Ω)  
21ꢃ  
ON  
ꢋȍꢌ  
ꢀꢍꢂ  
0.6  
(1)  
ꢋꢀꢌ  
ꢁꢍꢅ  
ꢁꢍꢉ  
0.4  
(2)  
ꢋꢂꢌ  
ꢋꢈꢌ  
(3)  
(4)  
ꢋꢉꢌ  
ꢂꢃ  
(5)  
0.2  
ꢋꢊꢌ  
(6)  
ꢋꢇꢌ  
0
0
1
2
3
4
5
ꢀꢃ  
ꢈꢃ  
ꢉꢃ  
V (V)  
I
9 ꢃꢋ9ꢌꢃ  
,
(1) VCC = 1.5 V.  
(2) CC = 1.8 V.  
(1) VCC = 1.5 V.  
(2) CC = 1.8 V.  
V
V
(3) VCC = 2.5 V.  
(4) VCC = 2.7 V.  
(3) VCC = 2.5 V.  
(4) VCC = 2.7 V.  
(5)  
(6) VCC = 4.3 V.  
Measured at Tamb = 25 C.  
V
CC = 3.3 V.  
(5)  
(6) VCC = 4.3 V.  
Measured at Tamb = 25 C.  
VCC = 3.3 V.  
Fig 8. Typical ON resistance as a function of input  
voltage (nY0 port)  
Fig 9. Typical ON resistance as a function of input  
voltage (nY1 port)  
NX3L4684  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 8 — 3 April 2014  
8 of 24  
 
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
001aah805  
ꢀꢀꢁDDJꢃꢈꢃ  
ꢀꢍꢇ  
0.8  
5
R
(Ω)  
21  
ON  
ꢋȍꢌ  
ꢀꢍꢂ  
ꢁꢍꢅ  
ꢁꢍꢉ  
0.6  
ꢋꢀꢌꢃ  
ꢋꢂꢌꢃ  
ꢋꢈꢌꢃ  
ꢋꢉꢌꢃ  
0.4  
(1)  
(2)  
(3)  
0.2 (4)  
0
0
1
2
3
V (V)  
I
9 ꢃꢋ9ꢌ  
,
(1) Tamb = 125 C.  
(1) Tamb = 125 C.  
(2) amb = 85 C.  
(2)  
Tamb = 85 C.  
T
(3) Tamb = 25 C.  
(4) Tamb = 40 C.  
(3) Tamb = 25 C.  
(4) Tamb = 40 C.  
Fig 10. ON resistance as a function of input voltage;  
VCC = 1.5 V (nY0 port)  
Fig 11. ON resistance as a function of input voltage;  
VCC = 1.5 V (nY1 port)  
001aah801  
ꢀꢀꢁDDJꢃꢈꢈ  
ꢀꢍꢁ  
0.6  
5
21ꢃ  
ꢋȍꢌ  
R
ON  
(Ω)  
ꢁꢍꢅ  
ꢋꢀꢌꢃ  
ꢋꢂꢌꢃ  
ꢋꢈꢌꢃ  
ꢋꢉꢌꢃ  
0.4  
ꢁꢍꢇ  
ꢁꢍꢉ  
ꢁꢍꢂ  
(1)  
(2)  
(3)  
0.2  
(4)  
0
0
1
2
3
V (V)  
I
9 ꢃꢋ9ꢌ  
,
(1) Tamb = 125 C.  
(2) Tamb = 85 C.  
(1) Tamb = 125 C.  
(2) Tamb = 85 C.  
(3)  
Tamb = 25 C.  
(3)  
Tamb = 25 C.  
(4) Tamb = 40 C.  
(4) Tamb = 40 C.  
Fig 12. ON resistance as a function of input voltage;  
VCC = 1.8 V (nY0 port)  
Fig 13. ON resistance as a function of input voltage;  
VCC = 1.8 V (nY1 port)  
NX3L4684  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 8 — 3 April 2014  
9 of 24  
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
001aah802  
ꢀꢀꢁDDJꢃꢈꢉ  
ꢀꢍꢁ  
0.6  
5
21ꢃ  
ꢋȍꢌ  
R
ON  
(Ω)  
ꢁꢍꢅ  
0.4  
ꢁꢍꢇ  
ꢁꢍꢉ  
ꢁꢍꢂ  
ꢋꢀꢌꢃ  
ꢋꢂꢌꢃ  
ꢋꢈꢌꢃ  
ꢋꢉꢌꢃ  
(1)  
(2)  
(3)  
0.2  
(4)  
0
0
1
2
3
V (V)  
I
9 ꢃꢋ9ꢌ  
,
(1) Tamb = 125 C.  
(2) amb = 85 C.  
(1) Tamb = 125 C.  
(2) amb = 85 C.  
T
T
(3) Tamb = 25 C.  
(4) Tamb = 40 C.  
(3) Tamb = 25 C.  
(4) Tamb = 40 C.  
Fig 14. ON resistance as a function of input voltage;  
VCC = 2.5 V (nY0 port)  
Fig 15. ON resistance as a function of input voltage;  
VCC = 2.5 V (nY1 port)  
001aah803  
001aah802  
0.6  
0.6  
R
ON  
R
ON  
(Ω)  
(Ω)  
0.4  
0.4  
(1)  
(1)  
(2)  
(3)  
(2)  
(3)  
0.2  
0.2  
(4)  
(4)  
0
0
0
1
2
3
0
1
2
3
V (V)  
I
V (V)  
I
(1) Tamb = 125 C.  
(2) amb = 85 C.  
(1) Tamb = 125 C.  
(2) amb = 85 C.  
T
T
(3) Tamb = 25 C.  
(4) Tamb = 40 C.  
(3) Tamb = 25 C.  
(4) Tamb = 40 C.  
Fig 16. ON resistance as a function of input voltage;  
VCC = 2.7 V (nY0 port)  
Fig 17. ON resistance as a function of input voltage;  
VCC = 2.7 V (nY1 port)  
NX3L4684  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 8 — 3 April 2014  
10 of 24  
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
001aah804  
ꢀꢀꢁDDJꢃꢈꢊ  
ꢀꢍꢁ  
0.6  
5
21  
ꢋȍꢌ  
R
ON  
(Ω)  
ꢁꢍꢅ  
ꢁꢍꢇ  
ꢁꢍꢉ  
ꢁꢍꢂ  
0.4  
ꢋꢀꢌꢃ  
ꢋꢂꢌꢃ  
ꢋꢈꢌꢃ  
ꢋꢉꢌꢃ  
(1)  
(2)  
(3)  
(4)  
0.2  
0
0
1
2
3
4
V (V)  
I
9 ꢃꢋ9ꢌ  
,
(1) Tamb = 125 C.  
(2) amb = 85 C.  
(1) Tamb = 125 C.  
(2) amb = 85 C.  
T
T
(3) Tamb = 25 C.  
(4) Tamb = 40 C.  
(3) Tamb = 25 C.  
(4) Tamb = 40 C.  
Fig 18. ON resistance as a function of input voltage;  
VCC = 3.3 V (nY0 port)  
Fig 19. ON resistance as a function of input voltage;  
VCC = 3.3 V (nY1 port)  
001aaj895  
ꢀꢀꢁDDMꢂꢊꢈ  
ꢀꢍꢁ  
0.6  
5
21  
ꢋȍꢌ  
R
ON  
(Ω)  
ꢁꢍꢅ  
ꢁꢍꢇ  
ꢁꢍꢉ  
ꢁꢍꢂ  
0.4  
ꢋꢀꢌꢃ  
ꢋꢂꢌꢃ  
ꢋꢈꢌꢃ  
ꢋꢉꢌ  
(1)  
(2)  
(3)  
(4)  
0.2  
0
0
1
2
3
4
5
V (V)  
I
9 ꢃꢋ9ꢌ  
,
(1) Tamb = 125 C.  
(2) Tamb = 85 C.  
(1) Tamb = 125 C.  
(2) Tamb = 85 C.  
(3)  
Tamb = 25 C.  
(3)  
Tamb = 25 C.  
(4) Tamb = 40 C.  
(4) Tamb = 40 C.  
Fig 20. ON resistance as a function of input voltage;  
VCC = 4.3 V (nY0 port)  
Fig 21. ON resistance as a function of input voltage;  
VCC = 4.3 V (nY1 port)  
NX3L4684  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 8 — 3 April 2014  
11 of 24  
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
12. Dynamic characteristics  
Table 9.  
Dynamic characteristics  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for load circuit see Figure 24.  
Symbol Parameter  
Conditions  
Tamb = 25 C  
Tamb = 40 C to +125 C Unit  
Min Typ[1] Max  
Min  
Max  
Max  
(85 C) (125 C)  
ten  
enable time  
nS to nZ or nYn;  
see Figure 22  
VCC = 1.4 V to 1.6 V  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V to 3.6 V  
VCC = 3.6 V to 4.3 V  
-
-
-
-
-
50  
35  
24  
20  
20  
100  
80  
-
-
-
-
-
130  
85  
130  
95  
ns  
ns  
ns  
ns  
ns  
50  
45  
55  
60  
50  
50  
55  
45  
55  
tdis  
disable time  
nS to nZ or nYn;  
see Figure 22  
VCC = 1.4 V to 1.6 V  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V to 3.6 V  
VCC = 3.6 V to 4.3 V  
-
-
-
-
-
30  
18  
11  
9
70  
55  
25  
20  
20  
-
-
-
-
-
80  
60  
30  
25  
25  
90  
65  
35  
30  
30  
ns  
ns  
ns  
ns  
ns  
9
[2]  
tb-m  
break-before-make see Figure 23  
time  
VCC = 1.4 V to 1.6 V  
-
-
-
-
-
20  
19  
13  
10  
10  
-
-
-
-
-
9
7
4
2
1
-
-
-
-
-
-
-
-
-
-
ns  
ns  
ns  
ns  
ns  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V to 3.6 V  
VCC = 3.6 V to 4.3 V  
[1] Typical values are measured at Tamb = 25 C and VCC = 1.5 V, 1.8 V, 2.5 V, 3.3 V and 4.3 V respectively.  
[2] Break-before-make guaranteed by design.  
NX3L4684  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 8 — 3 April 2014  
12 of 24  
 
 
 
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
12.1 Waveform and test circuits  
V
I
V
nS input  
M
t
GND  
t
en  
dis  
V
OH  
V
V
X
X
nZ output  
OFF to HIGH  
HIGH to OFF  
nY1 connected to V  
EXT  
GND  
t
t
en  
dis  
V
OH  
V
V
X
X
nZ output  
nY0 connected to V  
EXT  
HIGH to OFF  
OFF to HIGH  
012aaa003  
GND  
Measurement points are given in Table 10.  
Logic level: VOH is typical output voltage level that occurs with the output load.  
Fig 22. Enable and disable times  
Table 10. Measurement points  
Supply voltage  
VCC  
Input  
VM  
Output  
VX  
1.4 V to 4.3 V  
0.5VCC  
0.9VOH  
NX3L4684  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 8 — 3 April 2014  
13 of 24  
 
 
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
V
CC  
nS  
nZ  
nY0  
nY1  
G
V
= 1.5 V  
EXT  
V
V
R
L
C
L
V
I
O
GND  
012aaa004  
a. Test circuit.  
9
,
ꢁꢍꢊ9  
,
ꢁꢍꢄ9  
2
ꢁꢍꢄ9  
2
9
2
W
EꢎP  
ꢀꢀꢁDDJꢃꢉꢇ  
b. Input and output measurement points  
Fig 23. Test circuit for measuring break-before-make timing  
V
CC  
nS  
nZ  
nY0  
nY1  
1
2
switch  
G
V
V
V
R
L
C
L
V
= 1.5 V  
EXT  
I
O
GND  
012aaa005  
Test data is given in Table 11.  
Definitions test circuit:  
RL = Load resistance.  
CL = Load capacitance including jig and probe capacitance.  
VEXT = External voltage for measuring switching times.  
Fig 24. Load circuit for switching times  
Table 11. Test data  
Supply voltage  
VCC  
Input  
VI  
Load  
CL  
tr, tf  
2.5 ns  
RL  
1.4 V to 4.3 V  
VCC  
35 pF  
50   
NX3L4684  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 8 — 3 April 2014  
14 of 24  
 
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
12.2 Additional dynamic characteristics  
Table 12. Additional dynamic characteristics  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); VI = GND or VCC (unless otherwise  
specified); tr = tf 2.5 ns.  
Symbol Parameter  
Conditions  
Tamb = 25 C  
Unit  
Min  
Typ  
Max  
[1]  
THD  
total harmonic  
distortion  
fi = 20 Hz to 20 kHz; RL = 32 ; see Figure 25  
VCC = 1.4 V; VI = 1 V (p-p)  
-
-
-
-
-
-
0.06  
0.02  
0.02  
0.02  
0.02  
0.01  
-
-
-
-
-
-
%
%
%
%
%
%
VCC = 1.65 V; VI = 1.2 V (p-p)  
VCC = 2.3 V; VI = 1.5 V (p-p)  
VCC = 2.7 V; VI = 2 V (p-p)  
VCC = 4.3 V; VI = 2 V (p-p)  
VCC = 3.0 V; VI = 1 V (p-p); RL = 600   
RL = 50 ; see Figure 26  
[1]  
[1]  
f(3dB)  
3 dB frequency  
response  
port nY0; VCC = 1.4 V to 4.3 V  
port nY1; VCC = 1.4 V to 4.3 V  
fi = 100 kHz; RL = 50 ; see Figure 27  
VCC = 1.4 V to 4.3 V  
-
-
15  
20  
-
-
MHz  
MHz  
iso  
isolation (OFF-state)  
crosstalk voltage  
-
90  
-
dB  
Vct  
between digital inputs and switch;  
fi = 1 MHz; CL = 50 pF; RL = 50 ; see Figure 28  
VCC = 1.4 V to 3.6 V  
VCC = 3.6 V to 4.3 V  
-
-
0.5  
0.7  
-
-
V
V
[1]  
Xtalk  
Qinj  
crosstalk  
between switches;  
fi = 100 kHz; RL = 50 ; see Figure 29  
VCC = 1.4 V to 4.3 V  
-
90  
-
dB  
charge injection  
fi = 1 MHz; CL = 0.1 nF; RL = 1 M; Vgen = 0 V;  
Rgen = 0 ; see Figure 30  
VCC = 1.5 V  
VCC = 1.8 V  
VCC = 2.5 V  
VCC = 3.3 V  
VCC = 4.3 V  
-
-
-
-
-
10  
14  
21  
30  
50  
-
-
-
-
-
pC  
pC  
pC  
pC  
pC  
[1] fi is biased at 0.5VCC  
.
NX3L4684  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 8 — 3 April 2014  
15 of 24  
 
 
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
12.3 Test circuits  
V
0.5V  
CC  
CC  
switch nS  
R
L
1
2
V
IL  
nS  
nZ  
nY0  
nY1  
1
2
V
or V  
IH  
IL  
switch  
V
IH  
f
D
i
GND  
012aaa006  
Fig 25. Test circuit for measuring total harmonic distortion  
V
0.5V  
CC  
CC  
switch nS  
R
L
1
2
V
IL  
nS  
nZ  
nY0 1  
nY1 2  
V
or V  
IH  
IL  
switch  
V
IH  
f
dB  
i
GND  
012aaa007  
Adjust fi voltage to obtain 0 dBm level at output. Increase fi frequency until dB meter reads 3 dB.  
Fig 26. Test circuit for measuring the frequency response when channel is in ON-state  
0.5V  
V
0.5V  
CC  
CC  
CC  
switch nS  
R
L
R
L
1
2
V
IH  
nS  
nZ  
nY0  
nY1  
1
2
V
or V  
IH  
IL  
switch  
V
IL  
f
dB  
i
GND  
012aaa008  
Adjust fi voltage to obtain 0 dBm level at input.  
Fig 27. Test circuit for measuring isolation (OFF-state)  
NX3L4684  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 8 — 3 April 2014  
16 of 24  
 
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
switch nS  
V
CC  
1
2
V
IL  
V
IH  
nS  
nZ  
nY0  
nY1  
1
2
switch  
0.5V  
logic  
input  
G
V
R
L
R
L
C
L
V
O
V
I
0.5V  
CC  
CC  
012aaa009  
a. Test circuit  
logic  
input (nS)  
off  
on  
off  
V
V
O
ct  
012aaa010  
b. Input and output pulse definitions  
Fig 28. Test circuit for measuring crosstalk voltage between digital inputs and switch  
0.5V  
CC  
1S  
1Y0 or 1Z  
50  
V
IH  
R
L
1Z or 1Y0  
CHANNEL  
ON  
f
V
V
O1  
i
0.5V  
CC  
2S  
V
IL  
R
L
2Y0 or 2Z  
2Z or 2Y0  
CHANNEL  
OFF  
R
50  
i
V
V
O2  
001aaj088  
20 log10 (VO2 / VO1) or 20 log10 (VO1 / VO2).  
Fig 29. Test circuit for measuring crosstalk between switches  
NX3L4684  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 8 — 3 April 2014  
17 of 24  
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
V
CC  
nS  
nZ  
nY0  
nY1  
1
2
switch  
R
gen  
G
V
V
R
L
C
L
I
O
V
gen  
GND  
012aaa011  
a. Test circuit.  
logic  
input  
(nS) off  
on  
off  
V
O
ΔV  
O
012aaa012  
b. Input and output pulse definitions  
Definition: Qinj = VO CL.  
VO = output voltage variation.  
Rgen = generator resistance.  
Vgen = generator voltage.  
Fig 30. Test circuit for measuring charge injection  
NX3L4684  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 8 — 3 April 2014  
18 of 24  
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
13. Package outline  
XQFN10: plastic, extremely thin quad flat package; no leads;  
10 terminals; body 1.55 x 2.00 x 0.50 mm  
SOT1049-3  
X
D
B
A
E
terminal 1  
index area  
A
A
1
c
detail X  
C
Æ v  
C
C
A
B
b
5
y
1
y
Æ w  
C
4
6
e
1
e
9
b
1
1
10  
terminal 1  
index area  
L
L
1
0
1
2 mm  
w
scale  
Dimensions  
(1)  
Unit  
A
A
1
b
b
1
c
D
E
e
e
1
L
L
v
y
y
1
1
max 0.5 0.05 0.25 0.33  
mm nom  
min  
1.65 2.1  
0.20 0.28 0.127 1.55 2.0 0.5 1.5 0.43 0.35 0.1 0.05 0.05 0.05  
0.00 0.15 0.23 1.45 1.9 0.38 0.30  
0.48 0.40  
Note  
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.  
sot1049-3_po  
References  
Outline  
version  
European  
projection  
Issue date  
IEC  
- - -  
JEDEC  
MO255  
JEITA  
- - -  
10-12-06  
11-03-30  
SOT1049-3  
Fig 31. Package outline SOT1049-3 (XQFN10)  
NX3L4684  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 8 — 3 April 2014  
19 of 24  
 
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
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Fig 32. Package outline SOT650-2 (HVSON10)  
NX3L4684  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 8 — 3 April 2014  
20 of 24  
 
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
14. Abbreviations  
Table 13. Abbreviations  
Acronym  
CDM  
Description  
Charged Device Model  
CMOS  
ESD  
Complementary Metal-Oxide Semiconductor  
ElectroStatic Discharge  
HBM  
Human Body Model  
MM  
Machine Model  
PDA  
Personal Digital Assistant  
15. Revision history  
Table 14. Revision history  
Document ID  
NX3L4684 v.8  
Modifications:  
NX3L4684 v.7  
NX3L4684 v.6  
NX3L4684 v.5  
NX3L4684 v.4  
NX3L4684 v.3  
NX3L4684 v.2  
NX3L4684 v.1  
Release date  
20140403  
Data sheet status  
Change notice  
Supersedes  
Product data sheet  
-
NX3L4684 v.7  
Package outline drawing SOT650-1 changed to SOT650-2 (Figure 32).  
20120618  
20111104  
20110107  
20100324  
20100209  
20090401  
20081127  
Product data sheet  
Product data sheet  
Product data sheet  
Product data sheet  
Product data sheet  
Product data sheet  
Product data sheet  
-
-
-
-
-
-
-
NX3L4684 v.6  
NX3L4684 v.5  
NX3L4684 v.4  
NX3L4684 v.3  
NX3L4684 v.2  
NX3L4684 v.1  
-
NX3L4684  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 8 — 3 April 2014  
21 of 24  
 
 
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
16. Legal information  
16.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
Suitability for use — NXP Semiconductors products are not designed,  
16.2 Definitions  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors and its suppliers accept no liability for  
inclusion and/or use of NXP Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at the customer’s own  
risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Short data sheet A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
16.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information. NXP Semiconductors takes no  
responsibility for the content in this document if provided by an information  
source outside of NXP Semiconductors.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
NX3L4684  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 8 — 3 April 2014  
22 of 24  
 
 
 
 
 
 
 
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
Translations — A non-English (translated) version of a document is for  
reference only. The English version shall prevail in case of any discrepancy  
between the translated and English versions.  
non-automotive qualified products in automotive equipment or applications.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
16.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
17. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
NX3L4684  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2014. All rights reserved.  
Product data sheet  
Rev. 8 — 3 April 2014  
23 of 24  
 
 
NX3L4684  
NXP Semiconductors  
Low-ohmic dual single-pole double-throw analog switch  
18. Contents  
1
2
3
4
5
6
General description. . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
7
7.1  
7.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3  
8
Functional description . . . . . . . . . . . . . . . . . . . 4  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Recommended operating conditions. . . . . . . . 4  
9
10  
11  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5  
Test circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
ON resistance. . . . . . . . . . . . . . . . . . . . . . . . . . 7  
ON resistance test circuit and graphs. . . . . . . . 8  
11.1  
11.2  
11.3  
12  
Dynamic characteristics . . . . . . . . . . . . . . . . . 12  
Waveform and test circuits . . . . . . . . . . . . . . . 13  
Additional dynamic characteristics . . . . . . . . . 15  
Test circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
12.1  
12.2  
12.3  
13  
14  
15  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 21  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 21  
16  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 22  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 22  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
16.1  
16.2  
16.3  
16.4  
17  
18  
Contact information. . . . . . . . . . . . . . . . . . . . . 23  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP Semiconductors N.V. 2014.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 3 April 2014  
Document identifier: NX3L4684  
 

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