NX5P2924UKZ_技术文档

NX5P2924

Logic controlled high-side power switch

Rev. 1 — 24 February 2014

Product data sheet

1. General description

The NX5P2924 is a high-side load switch which features a low ON resistance N-channel

MOSFET with controlled slew rate that supports 2.5 A of continuous current. Designed for

operation from 0.8 V to 5.5 V, it is used in power domain isolation applications to reduce

power dissipation and extend battery life. The enable logic includes integrated logic level

translation making the device compatible with lower voltage processors and controllers.

The NX5P2924 is ideal for portable, battery operated applications due to low ground

current.

2. Features and benefits

 Wide supply voltage range from 0.8 V to 5.5 V

 Very low ON resistance:

 14 m (typical) at a supply voltage of 1.2 V

 14 m (typical) at a supply voltage of 1.8 V

 High noise immunity

 1.2 V control logic; Integrated EN pull-down resistor

 High current handling capability (2.5 A continuous current)

 Turn-on slew rate limiting

 ESD protection:

 HBM JESD22-A114F Class 3A exceeds 4000 V

 CDM AEC-Q100-011 revision B exceeds 1000 V

 Specified from 40 C to +85 C

3. Applications

 Cell phone

 Digital cameras and audio devices

 Portable and battery-powered equipment

NX5P2924

NXP Semiconductors

Logic controlled high-side power switch

4. Ordering information

Table 1.

Ordering information

Type number

Package

Temperature range

40 C to +85 C

Name

Description

Version

NX5P2924UK

WLCSP6

wafer level chip-scale package; 6 bumps;

0.87 x 1.37 x 0.5 mm

NX5P2924

5. Marking

Table 2.

Marking codes

Type number

NX5P2924UK

Marking code

24

6. Functional diagram

EN

VIN

VOUT

001aao342

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Fig 2. Logic diagram

NX5P2924

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Product data sheet

Rev. 1 — 24 February 2014

2 of 17

NX5P2924

NXP Semiconductors

Logic controlled high-side power switch

7. Pinning information

7.1 Pinning

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Fig 3. Pin configuration for WLCSP6

Fig 4. Ball mapping for WLCSP6

7.2 Pin description

Table 3.

Symbol

VIN

Pin description

Description

A2, B2

C1

input voltage

GND

ground (0 V)

EN

C2

enable input (active HIGH)

output voltage

VOUT

A1, B1

8. Functional description

Table 4.

Function table^[1]

Input EN

Switch

L

switch OFF

switch ON

H

[1] H = HIGH voltage level; L = LOW voltage level.

NX5P2924

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Product data sheet

Rev. 1 — 24 February 2014

3 of 17

NX5P2924

NXP Semiconductors

Logic controlled high-side power switch

9. Limiting values

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).

Symbol

Parameter

Conditions

Min

0.5

50

-

Max

+6.0

V_I(VIN)

-

Unit

V

[1]

[2]

V_I

input voltage

input EN

input VIN

V

V_SW

I_IK

switch voltage

output VOUT

input EN: V_I(EN)< 0.5 V

V

input clamping current

mA

C

I_SK

switch clamping current input VIN: V_I(VIN)< 0.5 V

output VOUT: V_O(VOUT)< 0.5 V

-

output VOUT: V_O(VOUT)> V_I(VIN)0.5 V

50

I_SW

switch current

V_SW> 0.5 V

-

2500

+125

T_j(max)

maximum junction

temperature

40

T_stg

P_tot

storage temperature

total power dissipation

65

+150

470

C

[3]

-

mW

[1] The minimum input voltage rating may be exceeded if the input current rating is observed.

[2] The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed.

[3] The (absolute) maximum power dissipation depends on the junction temperature T_j. Higher power dissipation is allowed with lower

ambient temperatures. The conditions to determine the specified values are T_amb= 85 °C and the use of a two layer PCB.

10. Recommended operating conditions

Table 6.

Recommended operating conditions

Symbol Parameter

Conditions

Min

0.8

Max

5.5

Unit

V

V_I

input voltage

T_amb

ambient temperature

40

+85

C

NX5P2924

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Product data sheet

Rev. 1 — 24 February 2014

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NXP Semiconductors

Logic controlled high-side power switch

11. Thermal characteristics

Table 7.

Symbol

R_th(j-a)

Thermal characteristics

Parameter

Conditions

Typ

Unit

[1]

thermal resistance from junction to ambient

139

K/W

[1] R_th(j-a)is dependent upon board layout. To minimize R_th(j-a), ensure that all pins have a solid connection to larger copper layer areas. In

multi-layer PCBs, the second layer should be used to create a large heat spreader area below the device. Avoid using solder-stop

varnish under the device.

12. Static characteristics

Table 8.

Static characteristics

V_I(VIN)= 1.0 V to 5.5 V, unless otherwise specified; Voltages are referenced to GND (ground = 0 V).

Symbol Parameter

Conditions

T_amb= 25 C

T_amb= 40 C to +85 C Unit

Min Typ^[1]Max

Min

Max

V_IH

HIGH-level input EN input; V_I(VIN)= 0.8 V

voltage

-

0.7

-

V

EN input; V_I(VIN)= 1.0 V to 1.2 V

0.9

-

0.9

-

V

EN input; V_I(VIN)= 1.2 V to 2.5 V

EN input; V_I(VIN)= 2.5 V to 5.5 V

EN input; V_I(VIN)= 0.8 V

1.2

-

1.2

-

V

1.2

-

0.25

-

1.2

-

V

V_IL

LOW-level input

voltage

-

V

EN input; V_I(VIN)= 1.0 V to 1.2 V

EN input; V_I(VIN)= 1.2 V to 2.5 V

EN input; V_I(VIN)= 2.5 V to 5.5 V

VOUT output; V_I(VIN)= 0.8 V

VOUT output; V_I(VIN)= 1.0 V

VOUT output; V_I(VIN)= 1.2 V

VOUT output; V_I(VIN)= 1.8 V

VOUT output; V_I(VIN)= 3.3 V

VOUT output; V_I(VIN)= 5.5 V

VOUT open

0.3

0.4

0.6

-

0.3

V

-

0.4

V

-

0.6

V

R_dch

discharge

resistance

4.00

1.40

1.30

-

k

-

1.27 1.50

1.25 1.50

I_(VIN)

supply current

EN = HIGH; V_I(VIN)= 1.0 V;

see Figure 5 and Figure 6

-

25

30

-

35

50

A

EN = HIGH; V_I(VIN)= 1.8 V;

see Figure 5 and Figure 6

EN = HIGH; V_I(VIN)= 3.6 V;

see Figure 5 and Figure 6

45

65

EN = HIGH; V_I(VIN)= 5.5 V;

see Figure 5 and Figure 6

75

105

0.8

1.0

1.2

1.5

EN = LOW; V_I(VIN)= 1.0 V;

see Figure 7 and Figure 8

0.1

EN = LOW; V_I(VIN)= 1.8 V;

see Figure 7 and Figure 8

EN = LOW; V_I(VIN)= 3.6 V;

see Figure 7 and Figure 8

EN = LOW; V_I(VIN)= 5.5 V;

see Figure 7 and Figure 6

NX5P2924

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Product data sheet

Rev. 1 — 24 February 2014

5 of 17

NX5P2924

NXP Semiconductors

Logic controlled high-side power switch

Table 8.

Static characteristics …continued

V_I(VIN)= 1.0 V to 5.5 V, unless otherwise specified; Voltages are referenced to GND (ground = 0 V). …continued

Symbol Parameter

Conditions

T_amb= 25 C

T_amb= 40 C to +85 C Unit

Min Typ^[1]Max

Min

Max

I_S(OFF)

OFF-state

leakage current

EN = LOW; V_I(VIN)= 1.8 V;

V_I(VOUT)= 0 V; see Figure 9 and 10

-

0.5

220

-

3.5

-

A

k

EN = LOW; V_I(VIN)= 3.6 V;

5.0

7.5

160

-

V_I(VOUT)= 0 V; see Figure 9 and 10

EN = LOW; V_I(VIN)= 5.5 V;

V_I(VOUT)= 0 V; see Figure 9 and 10

R_pd

C_I

pull-down

resistance

EN input

330

input capacitance EN

-

3

-

pF

nF

C_S(ON)ON-state

capacitance

VIN; VOUT

0.5

[1] All typical values are measured at V_I(VIN)= 3.6 V and T_amb= 25 C unless otherwise specified.

12.1 Graphs

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V_I(EN)= V_I(VIN)

.

V_I(EN)= V_I(VIN)

_amb= 85 C.

(2) T_amb= 25 C.

(3) T_amb= 40 C.

.

(1)

V

_I(VIN)= 5.5 V.

(1) T

(2) V_I(VIN)= 3.6 V.

(3) V_I(VIN)= 1.8 V.

(4)

V_I(VIN)= 1.0 V.

Fig 5. Typical supply current versus temperature

Fig 6. Typical supply current versus input voltage on

pin VIN

NX5P2924

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Product data sheet

Rev. 1 — 24 February 2014

6 of 17

NX5P2924

NXP Semiconductors

Logic controlled high-side power switch

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V_I(EN)= GND.

_I(VIN)= 5.5 V.

V

_I(EN)= GND.

(1)

V

(1) T_amb= 85 C.

(2) V_I(VIN)= 3.6 V.

(3) V_I(VIN)= 1.8 V.

(4) V_I(VIN)= 1.0 V.

(2) T_amb= 25 C.

(3) T_amb= 40 C.

Fig 7. Typical supply current versus temperature

Fig 8. Typical supply current versus input voltage on

pin VIN

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(1) V_I(VIN)= 1.8 V.

(2) _I(VIN)= 3.6 V.

(3) V_I(VIN)= 5.5 V.

(1)

(2)

T

_amb= 85 C.

_amb= 25 C.

V

T

(3) T_amb= 40 C.

Fig 9. Typical OFF-state leakage current versus

temperature

Fig 10. Typical OFF-state leakage current versus input

voltage on pin VIN

NX5P2924

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Product data sheet

Rev. 1 — 24 February 2014

7 of 17

NX5P2924

NXP Semiconductors

Logic controlled high-side power switch

12.2 ON resistance

Table 9.

ON resistance

At recommended operating conditions; voltages are referenced to GND (ground = 0 V)

Symbol Parameter Conditions T_amb= 25 C

Min Typ Max

T_amb= 40 C to +85 C Unit

Min

Max

R_ON

ON resistance V_I(EN)= 1.5 V; I_LOAD= 200 mA;

see Figure 11, Figure 12 and

Figure 13

V_I(VIN)= 0.8 V to 5.5 V

-

14

-

20

m

12.3 ON resistance test circuit and graphs

V

SW

EN

V

IH

VIN

VOUT

V

I

GND

LOAD

001aao350

R_ON= V_SW/ I_LOAD

.

Fig 11. Test circuit for measuring ON resistance

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(1) V_I(VIN)= 1.0 V.

(2) _I(VIN)= 3.6 V.

(3) V_I(VIN)= 5.5 V.

(1)

(2)

T

_amb= 85 C.

_amb= 25 C.

V

T

(3) T_amb= 40 C.

Fig 12. ON resistance versus temperature

Fig 13. ON resistance versus input voltage

NX5P2924

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Product data sheet

Rev. 1 — 24 February 2014

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NX5P2924

NXP Semiconductors

Logic controlled high-side power switch

13. Dynamic characteristics

Table 10. Dynamic characteristics

At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 15.

Symbol Parameter

Conditions

T_amb= 25 C

T_amb= 40 C to +85 C

Unit

Min

Typ

Max

Min

Max

t_en

t_dis

t_on

t_off

enable time

disable time

turn-on time

turn-off time

EN to VOUT; see Figure 14,

16, 17, 18 and 20

V_I(VIN)= 0.8 V

V_I(VIN)= 1.0 V

V_I(VIN)= 3.6 V

V_I(VIN)= 5.5 V

-

600

240

90

-

s

90

EN to VOUT; see Figure 14,

19 and 21

V_I(VIN)= 0.8 V

V_I(VIN)= 1.0 V

V_I(VIN)= 3.6 V

V_I(VIN)= 5.5 V

-

210

20

5

-

s

4

EN to VOUT; see Figure 14,

16, 17, 18 and 20

V_I(VIN)= 0.8 V

-

1000

350

240

290

-

s

V

_I(VIN)= 1.0 V

V_I(VIN)= 3.6 V

V_I(VIN)= 5.5 V

EN to VOUT; see Figure 14,

19 and 21

V_I(VIN)= 0.8 V

V_I(VIN)= 1.0 V

V_I(VIN)= 3.6 V

V_I(VIN)= 5.5 V

VOUT; see Figure 14

V_I(VIN)= 0.8 V

V_I(VIN)= 1.0 V

V_I(VIN)= 3.6 V

V_I(VIN)= 5.5 V

VOUT; see Figure 14

V_I(VIN)= 0.8 V

V_I(VIN)= 1.0 V

V_I(VIN)= 3.6 V

V_I(VIN)= 5.5 V

-

220.0

22.3

7.2

-

s

6.0

t_TLH

LOW to HIGH

output

transition time

-

400

110

150

200

-

s

20

50

70

t_THL

HIGH to LOW

output

transition time

-

10.0

2.3

-

s

2.2

2.0

NX5P2924

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Product data sheet

Rev. 1 — 24 February 2014

9 of 17

NX5P2924

NXP Semiconductors

Logic controlled high-side power switch

13.1 Waveforms, graphs and test circuit

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Measurement points are given in Table 11.

Logic level: V_OHis the typical output voltage that occurs with the output load.

Fig 14. Switching times

Table 11. Measurement points

Supply voltage

V_I(VIN)

EN Input

V_M

Output

V_X

V_Y

1.0 V to 5.5 V

0.5  V_I(EN)

0.1  V_OH

0.9  V_OH

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Test data is given in Table 12.

Definitions test circuit:

R_L= Load resistance.

C_L= Load capacitance including jig and probe capacitance.

V_EXT= External voltage for measuring switching times.

Fig 15. Test circuit for measuring switching times

Table 12. Test data

Supply voltage

V_EXT

Input

Load

V_I(EN)

C_L

R_L

1.0 V to 5.5 V

1.5 V

0.1 F

10 

NX5P2924

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Product data sheet

Rev. 1 — 24 February 2014

10 of 17

NX5P2924

NXP Semiconductors

Logic controlled high-side power switch

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V_I(VIN)= 1 V; R_L= 10 ; C_L= 0.1 F; T_amb= 25 C.

(1) VOUT

V_I(VIN)= 3.6 V; R_L= 10 ; C_L= 0.1 F; T_amb= 25 C.

(1) VOUT

(2) EN

(3) I_I(VIN)

Fig 16. Typical enable time at V_I(VIN)= 1 V; C_L= 0.1 F

Fig 17. Typical enable time at V_I(VIN)= 3.6 V;

C_L= 0.1 F

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V_I(VIN)= 5.5 V; R_L= 10 ; C_L= 0.1 F; T_amb= 25 C.

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R_L= 10 ; C_L= 0.1 F; T_amb= 25 C

(1) V_I(VIN)= 5.5 V

(2) _I(VIN)= 3.6 V

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V

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(3) V_I(VIN)= 1.0 V

(4) EN

Fig 18. Typical enable time at V_I(VIN)= 5.5 V;

Fig 19. Typical disable time

C_L= 0.1 F

NX5P2924

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 1 — 24 February 2014

11 of 17

NX5P2924

NXP Semiconductors

Logic controlled high-side power switch

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Fig 20. Typical enable time at V_I(VIN)= 3.6 V; C_L= 20 F Fig 21. Typical disable time at V_I(VIN)= 3.6 V;

C_L= 20 F

NX5P2924

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 1 — 24 February 2014

12 of 17

NX5P2924

NXP Semiconductors

Logic controlled high-side power switch

14. Package outline

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Fig 22. Package outline NX5P2924

NX5P2924

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 1 — 24 February 2014

13 of 17

NX5P2924

NXP Semiconductors

Logic controlled high-side power switch

15. Abbreviations

Table 13. Abbreviations

Acronym

CDM

Description

Charged Device Model

DUT

Device Under Test

ESD

ElectroStatic Discharge

HBM

Human Body Model

IEC

International Electrotechnical Commission

Metal-Oxide Semiconductor Field Effect Transistor

MOSFET

16. Revision history

Table 14. Revision history

Document ID

Release date

20140224

Data sheet status

Change notice

Supersedes

NX5P2924 v.1

Product data sheet

-

NX5P2924

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 1 — 24 February 2014

14 of 17

NX5P2924

NXP Semiconductors

Logic controlled high-side power switch

17. Legal information

17.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

Suitability for use — NXP Semiconductors products are not designed,

17.2 Definitions

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

17.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

NX5P2924

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 1 — 24 February 2014

15 of 17

NX5P2924

NXP Semiconductors

Logic controlled high-side power switch

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

17.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

18. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NX5P2924

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 1 — 24 February 2014

16 of 17

NX5P2924

NXP Semiconductors

Logic controlled high-side power switch

19. Contents

1

2

3

4

5

6

General description. . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

7

7.1

7.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

8

Functional description . . . . . . . . . . . . . . . . . . . 3

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

Recommended operating conditions. . . . . . . . 4

Thermal characteristics . . . . . . . . . . . . . . . . . . 5

9

10

11

12

Static characteristics. . . . . . . . . . . . . . . . . . . . . 5

Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

ON resistance. . . . . . . . . . . . . . . . . . . . . . . . . . 8

ON resistance test circuit and graphs. . . . . . . . 8

12.1

12.2

12.3

13

13.1

14

Dynamic characteristics . . . . . . . . . . . . . . . . . . 9

Waveforms, graphs and test circuit . . . . . . . . 10

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14

15

16

17

Legal information. . . . . . . . . . . . . . . . . . . . . . . 15

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16

17.1

17.2

17.3

17.4

18

19

Contact information. . . . . . . . . . . . . . . . . . . . . 16

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 24 February 2014

Document identifier: NX5P2924


型号：	NX5P2924UKZ
厂家：	NXP
描述：	NX5P2924 - Logic controlled high-side power switch 驱动接口集成电路
文件：	总17页 (文件大小：323K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

NX5P2924UKZ [NXP]

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