NZX10A [NXP]

Single Zener diodes; 单齐纳二极管
NZX10A
型号: NZX10A
厂家: NXP    NXP
描述:

Single Zener diodes
单齐纳二极管

二极管 齐纳二极管 测试
文件: 总12页 (文件大小:61K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
NZX series  
Single Zener diodes  
Rev. 02 — 3 June 2009  
Product data sheet  
1. Product profile  
1.1 General description  
General-purpose Zener diodes in a SOD27 (SC-40) small hermetically sealed glass  
package.  
1.2 Features  
I Total power dissipation: Ptot 500 mW  
I Low differential resistance  
I Low leakage current  
I AEC-Q101 qualified  
1.3 Applications  
I General regulation functions  
1.4 Quick reference data  
Table 1.  
Quick reference data  
Tj = 25 °C unless otherwise specified.  
Symbol Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
[1]  
VF  
forward voltage  
IF = 200 mA  
-
-
1.5  
V
[1] Pulse test: tp 300 µs; δ ≤ 0.02.  
2. Pinning information  
Table 2.  
Pinning  
Pin  
1
Description  
cathode  
Simplified outline  
Graphic symbol  
[1]  
k
a
2
anode  
2
1
006aaa152  
[1] The marking band indicates the cathode.  
NZX series  
NXP Semiconductors  
Single Zener diodes  
3. Ordering information  
Table 3.  
Ordering information  
Type number  
Package  
Name  
Description  
Version  
NZX2V4A to NZX36X[1] SC-40  
hermetically sealed glass package; axial leaded;  
2 leads  
SOD27  
[1] The series consists of 111 types with nominal working voltages from 2.4 V to 36 V.  
4. Marking  
Table 4.  
Marking codes  
Type number  
Marking code  
NZX2V4A to NZX36X  
the diodes are type branded  
5. Limiting values  
Table 5.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
IF  
Parameter  
Conditions  
Min  
Max  
250  
Unit  
mA  
mW  
°C  
forward current  
-
Ptot  
total power dissipation  
junction temperature  
ambient temperature  
storage temperature  
Ttp 25 °C  
-
500  
Tj  
-
175  
Tamb  
Tstg  
55  
65  
+175  
+175  
°C  
°C  
6. Thermal characteristics  
Table 6.  
Symbol  
Rth(j-a)  
Thermal characteristics  
Parameter  
Conditions  
Min Typ Max Unit  
[1]  
[1]  
thermal resistance from junction to in free air  
ambient  
-
-
380 K/W  
Rth(j-t)  
thermal resistance from junction to  
tie-point  
-
-
300 K/W  
[1] Device mounted on an FR4 Printed-Circuit Board (PCB) without metallization pad;  
maximum lead length 8 mm.  
NZX_SER_2  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 02 — 3 June 2009  
2 of 12  
NZX series  
NXP Semiconductors  
Single Zener diodes  
006aab601  
3
10  
δ = 1  
R
th(j-a)  
0.75  
0.50  
0.33  
0.20  
(K/W)  
2
10  
0.10  
0.05  
0.02  
0.01  
10  
0.001  
1
10  
1  
2
3
4
5
1
10  
10  
10  
10  
10  
t
(ms)  
p
Fig 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values  
7. Characteristics  
Table 7.  
Characteristics  
Tj = 25 °C unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Unit  
1.5  
[1]  
VF  
forward voltage  
IF = 200 mA  
-
-
V
[1] Pulse test: tp 300 µs; δ ≤ 0.02.  
Table 8.  
Characteristics per type; NZX2V4A to NZX18C  
Tj = 25 °C unless otherwise specified.  
NZXxxx  
Sel  
Working voltage  
VZ (V)  
Differential Reverse current  
resistance  
IR (µA)  
rdif ()  
IZ = 5 mA  
IZ = 5 mA  
Min  
2.3  
2.4  
2.5  
2.6  
2.7  
2.8  
2.9  
3.0  
3.1  
3.2  
3.3  
Max  
2.5  
2.6  
2.7  
2.8  
2.9  
3.0  
3.1  
3.2  
3.3  
3.4  
3.5  
Max  
Max  
VR (V)  
2V4  
2V7  
A
B
A
B
C
A
B
C
A
B
C
100  
50  
1
100  
100  
100  
20  
10  
5
1
1
1
3V0  
3V3  
NZX_SER_2  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 02 — 3 June 2009  
3 of 12  
NZX series  
NXP Semiconductors  
Single Zener diodes  
Table 8.  
Characteristics per type; NZX2V4A to NZX18C …continued  
Tj = 25 °C unless otherwise specified.  
NZXxxx  
Sel  
Working voltage  
VZ (V)  
Differential Reverse current  
resistance  
IR (µA)  
rdif ()  
IZ = 5 mA  
IZ = 5 mA  
Max  
Min  
3.4  
3.5  
3.6  
3.7  
3.8  
3.9  
4.0  
4.1  
4.2  
4.3  
4.4  
4.5  
4.6  
4.7  
4.8  
4.9  
5.0  
5.1  
5.2  
5.3  
5.4  
5.5  
5.6  
5.7  
5.8  
6.0  
6.1  
6.3  
6.4  
6.6  
6.7  
6.9  
Max  
3.6  
3.7  
3.8  
3.9  
4.0  
4.1  
4.2  
4.3  
4.4  
4.5  
4.6  
4.7  
4.8  
4.9  
5.0  
5.1  
5.2  
5.3  
5.5  
5.6  
5.7  
5.8  
5.9  
6.0  
6.1  
6.3  
6.4  
6.6  
6.7  
6.9  
7.0  
7.2  
Max  
VR (V)  
3V6  
3V9  
4V3  
A
B
C
A
B
C
A
B
C
D
A
B
C
D
A
B
C
D
A
B
C
D
E
A
B
C
D
E
A
B
C
D
100  
5
1
100  
100  
3
3
1
1
4V7  
5V1  
5V6  
100  
100  
40  
3
2
1
2
2
2
6V2  
6V8  
15  
15  
3
2
4
4
NZX_SER_2  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 02 — 3 June 2009  
4 of 12  
NZX series  
NXP Semiconductors  
Single Zener diodes  
Table 8.  
Characteristics per type; NZX2V4A to NZX18C …continued  
Tj = 25 °C unless otherwise specified.  
NZXxxx  
Sel  
Working voltage  
VZ (V)  
Differential Reverse current  
resistance  
IR (µA)  
rdif ()  
IZ = 5 mA  
IZ = 5 mA  
Max  
Min  
7.0  
Max  
7.3  
Max  
VR (V)  
7V5  
A
B
C
D
X
A
B
C
D
A
B
C
D
E
A
B
C
D
A
B
C
D
A
B
C
D
X
A
B
C
A
B
C
15  
1
5
7.2  
7.6  
7.3  
7.7  
7.5  
7.9  
7.07  
7.7  
7.45  
8.1  
8V2  
9V1  
20  
20  
0.7  
0.5  
5
6
7.9  
8.3  
8.1  
8.5  
8.3  
8.7  
8.5  
8.9  
8.7  
9.1  
8.9  
9.3  
9.1  
9.5  
9.3  
9.7  
10  
11  
12  
9.5  
9.9  
25  
25  
35  
0.2  
0.1  
0.1  
7
8
8
9.7  
10.1  
10.3  
10.6  
10.8  
11.1  
11.3  
11.6  
11.9  
12.1  
12.4  
12.7  
12.03  
12.9  
13.1  
13.4  
13.7  
14.0  
14.3  
9.9  
10.2  
10.4  
10.7  
10.9  
11.1  
11.4  
11.6  
11.9  
12.2  
11.44  
12.4  
12.6  
12.9  
13.2  
13.5  
13.8  
13  
14  
35  
35  
0.1  
8
0.05  
9.8  
NZX_SER_2  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 02 — 3 June 2009  
5 of 12  
NZX series  
NXP Semiconductors  
Single Zener diodes  
Table 8.  
Characteristics per type; NZX2V4A to NZX18C …continued  
Tj = 25 °C unless otherwise specified.  
NZXxxx  
Sel  
Working voltage  
VZ (V)  
Differential Reverse current  
resistance  
IR (µA)  
rdif ()  
IZ = 5 mA  
IZ = 5 mA  
Max  
Min  
Max  
14.7  
15.1  
15.5  
15.09  
15.9  
16.5  
17.1  
17.7  
18.3  
19.0  
Max  
VR (V)  
15  
A
B
C
X
A
B
C
A
B
C
14.1  
14.5  
14.9  
14.35  
15.3  
15.7  
16.3  
16.9  
17.5  
18.1  
40  
0.05  
10.5  
16  
18  
45  
55  
0.05  
0.05  
11.2  
12.6  
NZX_SER_2  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 02 — 3 June 2009  
6 of 12  
NZX series  
NXP Semiconductors  
Single Zener diodes  
Table 9.  
Characteristics per type; NZX20A to NZX36X  
Tj = 25 °C unless otherwise specified.  
NZXxxx  
Sel  
Working voltage  
VZ (V)  
Differential Reverse current  
resistance  
rdif ()  
IZ = 2 mA  
Max  
IR (µA)  
IZ = 2 mA  
Min  
Max  
19.7  
20.4  
21.2  
21.9  
22.6  
23.3  
24.0  
24.7  
25.5  
23.77  
26.6  
27.6  
28.6  
28.39  
29.6  
30.6  
31.6  
30.51  
32.6  
33.6  
34.5  
35.7  
36.8  
38.0  
37.19  
Max  
VR (V)  
20  
22  
24  
A
B
C
A
B
C
A
B
C
X
A
B
C
X
A
B
C
X
A
B
C
A
B
C
X
18.8  
19.5  
20.2  
20.9  
21.6  
22.3  
22.9  
23.6  
24.3  
22.61  
25.2  
26.2  
27.2  
26.99  
28.2  
29.2  
30.2  
29.02  
31.2  
32.2  
33.2  
34.2  
35.3  
36.4  
35.36  
60  
0.05  
14  
65  
70  
0.05  
0.05  
15.4  
16.8  
27  
30  
80  
0.05  
0.05  
18.9  
21  
100  
33  
36  
120  
140  
0.05  
0.05  
23.1  
25.2  
NZX_SER_2  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 02 — 3 June 2009  
7 of 12  
NZX series  
NXP Semiconductors  
Single Zener diodes  
mbg781  
mbg783  
300  
0
S
Z
I
F
4V3  
(mV/K)  
(mA)  
200  
1  
3V9  
3V6  
100  
2  
3  
3V3  
3V0  
2V4  
2V7  
0
0.6  
0
20  
40  
60  
0.8  
1
I
(mA)  
Z
V
(V)  
F
Tj = 25 °C  
NZX2V4 to NZX4V3  
Tj = 25 °C to 150 °C  
Fig 2. Forward current as a function of forward  
voltage; typical values  
Fig 3. Temperature coefficient as a function of  
working current; typical values  
mbg782  
10  
12  
11  
S
Z
(mV/K)  
10  
9V1  
5
8V2  
7V5  
6V8  
6V2  
5V6  
5V1  
0
4V7  
5  
0
4
8
12  
16  
20  
I
(mA)  
Z
NZX4V7 to NZX12  
Tj = 25 °C to 150 °C  
Fig 4. Temperature coefficient as a function of working current; typical values  
NZX_SER_2  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 02 — 3 June 2009  
8 of 12  
NZX series  
NXP Semiconductors  
Single Zener diodes  
8. Package outline  
0.56  
max  
25.4  
min  
4.25  
max  
25.4  
min  
1.85  
max  
Dimensions in mm  
05-12-22  
Fig 5. Package outline SOD27 (SC-40)  
9. Packing information  
Table 10. Packing methods  
The indicated -xxx are the last three digits of the 12NC ordering code.[1]  
Type number[2]  
Package  
Description  
Packing quantity  
5000  
10000  
-
NZX2V4A to NZX36X SOD27  
26 mm tape ammopack, axial  
52 mm tape ammopack, axial  
52 mm reel pack, axial  
-143  
-
-
-133  
-113  
[1] For further information and the availability of packing methods, see Section 12.  
[2] The series consists of 111 types with nominal working voltages from 2.4 V to 36 V.  
NZX_SER_2  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 02 — 3 June 2009  
9 of 12  
NZX series  
NXP Semiconductors  
Single Zener diodes  
10. Revision history  
Table 11. Revision history  
Document ID  
NZX_SER_2  
Modifications:  
Release date  
20090603  
Data sheet status  
Change notice  
Supersedes  
Product data sheet  
-
NZX_SER_1  
42 type numbers added  
Section 1.1 “General description”: amended  
Figure 1: updated  
Table 5: Ptot condition amended  
NZX_SER_1  
20080724  
Product data sheet  
-
-
NZX_SER_2  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 02 — 3 June 2009  
10 of 12  
NZX series  
NXP Semiconductors  
Single Zener diodes  
11. Legal information  
11.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
11.2 Definitions  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
11.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
11.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
12. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
NZX_SER_2  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 02 — 3 June 2009  
11 of 12  
NZX series  
NXP Semiconductors  
Single Zener diodes  
13. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1  
1.2  
1.3  
1.4  
General description. . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1  
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Thermal characteristics. . . . . . . . . . . . . . . . . . . 2  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Packing information. . . . . . . . . . . . . . . . . . . . . . 9  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10  
3
4
5
6
7
8
9
10  
11  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
11.1  
11.2  
11.3  
11.4  
12  
13  
Contact information. . . . . . . . . . . . . . . . . . . . . 11  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2009.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 3 June 2009  
Document identifier: NZX_SER_2  

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VISHAY

SI9130CG-T1-E3

Pin-Programmable Dual Controller - Portable PCs

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SI9130LG-T1-E3

Pin-Programmable Dual Controller - Portable PCs

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VISHAY

SI9130_11

Pin-Programmable Dual Controller - Portable PCs

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VISHAY

SI9137

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9137DB

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9137LG

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9122E

500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification Drivers

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