概述
规格参数
数据手册OT406 概述
Four-quadrant triac, enhanced noise immunity 四象限三端双向可控硅，增强抗噪声能力 TRIAC
OT406 规格参数
| 是否Rohs认证： | 符合 | 生命周期： | Transferred |
| 零件包装代码： | SC-73 | 包装说明： | PLASTIC, SC-73, 4 PIN |
| 针数： | 4 | Reach Compliance Code： | compliant |
| HTS代码： | 8541.30.00.80 | 风险等级： | 5.74 |
| Is Samacsys： | N | 其他特性： | SENSITIVE GATE |
| 外壳连接： | MAIN TERMINAL 2 | 配置： | SINGLE |
| 换向电压的临界上升率-最小值： | 0.5 V/us | 关态电压最小值的临界上升速率： | 10 V/us |
| 最大直流栅极触发电流： | 5 mA | 最大直流栅极触发电压： | 1.3 V |
| 最大维持电流： | 7 mA | JESD-30 代码： | R-PDSO-G4 |
| JESD-609代码： | e3 | 最大漏电流： | 0.5 mA |
| 湿度敏感等级： | 1 | 元件数量： | 1 |
| 端子数量： | 4 | 最高工作温度： | 150 °C |
| 最低工作温度： | -40 °C | 封装主体材料： | PLASTIC/EPOXY |
| 封装形状： | RECTANGULAR | 封装形式： | SMALL OUTLINE |
| 认证状态： | Not Qualified | 最大均方根通态电流： | 1 A |
| 断态重复峰值电压： | 600 V | 子类别： | TRIACs |
| 表面贴装： | YES | 端子面层： | Matte Tin (Sn) |
| 端子形式： | GULL WING | 端子位置： | DUAL |
| 触发设备类型： | 4 QUADRANT LOGIC LEVEL TRIAC | Base Number Matches： | 1 |
OT406 数据手册
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PDF下载OT406
Four-quadrant triac, enhanced noise immunity
Rev. 01 — 19 May 2008
Product data sheet
1. Product profile
1.1 General description
Passivated sensitive gate triac in a SOT223 surface-mountable plastic package
1.2 Features
I Sensitive gate
I Gate triggering in four quadrants
I Direct interfacing to low power gate drive
circuits
I Direct interfacing to logic level ICs
I Enhanced immunity to voltage
I Blocking voltage to 600 V
transients and noise
1.3 Applications
I Home appliances
I Low power motor control
I Low power loads in industrial process
control
I Low power AC fan speed controllers
1.4 Quick reference data
I VDRM ≤ 600 V
I IGT ≤ 3 mA
I ITSM ≤ 12.5 A (t = 20 ms)
I IT(RMS) ≤ 1 A
I IGT ≤ 5 mA (T2− G+)
2. Pinning information
Table 1.
Pinning
Pin
1
Description
Simplified outline
Graphic symbol
main terminal 1 (T1)
main terminal 2 (T2)
gate (G)
4
T2
T1
G
2
3
sym051
4
mounting base; main terminal 2 (T2)
1
2
3
SOT223
OT406
NXP Semiconductors
Four-quadrant triac, enhanced noise immunity
3. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
plastic surface-mounted package with increased heatsink; 4 leads
Version
OT406
SC-73
SOT223
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDRM
Parameter
Conditions
Min
Max
600
600
1
Unit
repetitive peak off-state voltage
repetitive peak reverse voltage
RMS on-state current
-
-
-
V
V
A
VRRM
IT(RMS)
full sine wave; Tsp ≤ 103 °C; see
Figure 4 and 5
ITSM
non-repetitive peak on-state current full sine wave; Tj = 25 °C prior to
surge; see Figure 2 and 3
t = 20 ms
-
-
-
12.5
13.8
1.28
A
t = 16.7 ms
A
A2s
I2t
I2t for fusing
tp = 10 ms
dIT/dt
rate of rise of on-state current
ITM = 1 A; IG = 20 mA;
dIG/dt = 0.2 A/µs
T2+ G+
T2+ G−
T2− G−
T2− G+
-
50
50
50
10
1
A/µs
A/µs
A/µs
A/µs
A
-
-
-
IGM
peak gate current
peak gate power
-
PGM
PG(AV)
Tstg
Tj
-
2
W
average gate power
storage temperature
junction temperature
over any 20 ms period
-
0.1
+150
125
W
−40
°C
-
°C
OT406_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 19 May 2008
2 of 13
OT406
NXP Semiconductors
Four-quadrant triac, enhanced noise immunity
003aac259
2.0
conduction form
Ptot
angle
factor
a
(W)
(degrees)
1.6
1.2
0.8
0.4
0.0
30
60
90
120
180
4
α = 180°
2.8
2.2
1.9
1.57
α
120°
90°
60°
30°
0
0.2
0.4
0.6
0.8
1
1.2
IT(RMS) (A)
α = conduction angle
Fig 1. Total power dissipation as a function of RMS on-state current; maximum values
003aac260
16
ITSM
(A)
12
8
I
I
TSM
t
T
4
1/f
= 25 °C max
T
j(init)
0
1
10
102
103
number of cycles
f = 50 Hz
Fig 2. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
OT406_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 19 May 2008
3 of 13
OT406
NXP Semiconductors
Four-quadrant triac, enhanced noise immunity
003aac262
103
I
I
TSM
t
T
ITSM
(A)
t
p
102
T
= 25 °C max
j(init)
(1)
(2)
10
1
10-5
10-4
10-3
10-2
10-1
tp (s)
tp ≤ 20 ms
(1) dIT/dt limit
(2) T2− G+ quadrant limit
Fig 3. Non-repetitive peak on-state current as a function of pulse width; maximum values
003aac269
003aac270
8
1.2
IT(RMS)
(A)
IT(RMS)
(A)
6
4
2
0.8
0.4
0
0
-50
10-2
10-1
1
10
0
50
100
150
sp (°C)
T
surge duration (s)
f = 50 Hz
Tsp = 103 °C
Fig 4. RMS on-state current as a function of surge
duration; maximum values
Fig 5. RMS on-state current as a function of solder
point temperature; maximum values
OT406_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 19 May 2008
4 of 13
OT406
NXP Semiconductors
Four-quadrant triac, enhanced noise immunity
5. Thermal characteristics
Table 4.
Symbol
Rth(j-sp)
Thermal characteristics
Parameter
Conditions
Min
Typ
Max
Unit
thermal resistance from junction to full cycle; see Figure 6
solder point
-
-
15
K/W
Rth(j-a)
thermal resistance from junction to full cycle
ambient
for minimum footprint
see Figure 13
-
-
156
70
-
-
K/W
K/W
for pad area
see Figure 14
003aac210
102
Zth(j-sp)
(K/W)
10
1
P
10-1
10-2
t
tp
10-1
1
10
10-5
10-4
10-3
10-2
tp (s)
Fig 6. Transient thermal impedance from junction to solder point as a function of pulse width
OT406_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 19 May 2008
5 of 13
OT406
NXP Semiconductors
Four-quadrant triac, enhanced noise immunity
6. Static characteristics
Table 5.
Static characteristics
Tj = 25 °C unless otherwise specified.
Symbol Parameter Conditions
IGT gate trigger current
Min
Typ
Max
Unit
VD = 12 V; IT = 0.1 A; see Figure 8
T2+ G+
-
-
-
-
-
-
-
-
3
3
3
5
mA
mA
mA
mA
T2+ G−
T2− G−
T2− G+
IL
latching current
VD = 12 V; IG = 0.1 A; see Figure 10
T2+ G+
-
-
7
mA
mA
mA
mA
mA
V
T2+ G−
-
-
20
7
T2− G−
-
-
T2− G+
-
-
7
IH
holding current
VD = 12 V; IG = 0.1 A; see Figure 11
IT = 1 A; see Figure 9
VD = 12 V; IT = 0.1 A; see Figure 7
VD = VDRM; IT = 0.1 A; Tj = 125 °C
VD = VDRM(max); Tj = 125 °C
-
-
7
VT
VGT
on-state voltage
gate trigger voltage
-
1.3
1.6
1.3
-
-
-
-
-
V
0.2
-
V
ID
off-state current
0.5
mA
OT406_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 19 May 2008
6 of 13
OT406
NXP Semiconductors
Four-quadrant triac, enhanced noise immunity
7. Dynamic characteristics
Table 6.
Dynamic characteristics
Symbol Parameter
Conditions
Min
Typ
Max Unit
dVD/dt
rate of rise of off-state voltage VDM = 0.67VDRM(max); Tj = 110 °C; exponential
10
-
-
V/µs
waveform; gate open circuit
dVcom/dt rate of change of
commutating voltage
VDM = 400 V; Tj = 110 °C; ITM = 1 A;
dIcom/dt = 0.44 A/ms
0.5
-
-
V/µs
003aaa209
003aaa205
1.6
4
V
I
GT
GT
I
GT(25°C)
V
GT(25°C)
1.2
3
(1)
(2)
(3)
(4)
0.8
0.4
0
2
1
0
−50
0
50
100
150
−50
0
50
100
150
T (°C)
j
T (°C)
j
(1) T2+ G+
(2) T2+ G−
(3) T2− G−
(4) T2− G+
Fig 7. Normalized gate trigger voltage as a function
of junction temperature
Fig 8. Normalized gate trigger current as a function
of junction temperature
OT406_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 19 May 2008
7 of 13
OT406
NXP Semiconductors
Four-quadrant triac, enhanced noise immunity
003aac258
003aaa203
3
2
IT
I
L
(A)
I
L(25°C)
1.6
2
1.2
0.8
(1)
(2)
(3)
1
0.4
0
0
−50
0
0.4
0.8
1.2
1.6
2
0
50
100
150
V
T (V)
T (°C)
j
Vo = 1.254 V; Rs = 0.31 Ω
(1) Tj = 125 °C; typical values
(2) Tj = 125 °C; maximum values
(3) Tj = 25 °C; maximum values
Fig 9. On-state current as a function of on-state
voltage
Fig 10. Normalized latching current as a function of
junction temperature
003aaa204
3
I
H
I
H(25°C)
2
1
0
−50
0
50
100
150
T (°C)
j
Fig 11. Normalized holding current as a function of junction temperature
OT406_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 19 May 2008
8 of 13
OT406
NXP Semiconductors
Four-quadrant triac, enhanced noise immunity
8. Package outline
Plastic surface-mounted package with increased heatsink; 4 leads
SOT223
D
B
E
A
X
c
y
H
v
M
A
E
b
1
4
Q
A
A
1
L
1
2
3
p
e
b
p
w
M
B
detail X
1
e
0
2
4 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
b
b
c
D
E
e
e
H
L
p
Q
v
w
y
p
1
1
1
E
1.8
1.5
0.10 0.80
0.01 0.60
3.1
2.9
0.32
0.22
6.7
6.3
3.7
3.3
7.3
6.7
1.1
0.7
0.95
0.85
mm
4.6
2.3
0.2
0.1
0.1
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
04-11-10
06-03-16
SOT223
SC-73
Fig 12. Package outline SOT223 (SC-73)
OT406_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 19 May 2008
9 of 13
OT406
NXP Semiconductors
Four-quadrant triac, enhanced noise immunity
9. Mounting
9.1 Mounting instructions
3.8 min
1.5
min
6.3
1.5
min
(3×)
2.3
1.5
min
4.6
001aab508
All dimensions are in mm
Fig 13. Minimum footprint SOT223
9.2 Printed-circuit board
36
18
4.5
4.6
60
9
10
7
15
50
001aab509
All dimensions are in mm
Printed-circuit board: FR4 epoxy glass (1.6 mm thick), copper laminate (35 µm thick)
Fig 14. Printed-circuit board pad area SOT223
OT406_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 19 May 2008
10 of 13
OT406
NXP Semiconductors
Four-quadrant triac, enhanced noise immunity
10. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
OT406_1
20080519
Product data sheet
-
-
OT406_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 19 May 2008
11 of 13
OT406
NXP Semiconductors
Four-quadrant triac, enhanced noise immunity
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
11.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
11.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
OT406_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 19 May 2008
12 of 13
OT406
NXP Semiconductors
Four-quadrant triac, enhanced noise immunity
13. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2
3
4
5
6
7
8
Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
9
9.1
9.2
Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Mounting instructions . . . . . . . . . . . . . . . . . . . 10
Printed-circuit board . . . . . . . . . . . . . . . . . . . . 10
10
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11
11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
11.1
11.2
11.3
11.4
12
13
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 19 May 2008
Document identifier: OT406_1
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