P308 [NXP]

Smart eID; 聪明的eID


型号：	P308
厂家：	NXP
描述：	Smart eID 聪明的eID
文件：	总8页 (文件大小：47K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

P304/P308/P310G002 family

Smart eID

Rev. 01 — 29 July 2008

Product short data sheet

1. General description

1.1 Smart eID family approach

The Smart eID family members feature a modular set of devices with:

• 4 KB to 10 KB EEPROM

• Secured triple-DES coprocessor

• ISO/IEC 14443 type A Contactless Interface Unit (CIU)

• EEPROM with minimum 100000 cycles endurance and minimum 20 years retention

time

• Pre-installed applications compliant to ICAO document 9303

• Command set compliant to ISO/IEC 7816-4

• Compliant to ISO/IEC 18013-3 (using BAP in conﬁguration 1)

1.2 Smart eID family properties

Smart eID is designed to complement general-purpose smart card controllers in the NXP

Semiconductors range of identiﬁcation products for eGovernment applications. It is an

“all-in” functionality product supporting ISO/IEC 7816 data structures, including those

deﬁned in ICAO document 9303. Smart eID is designed for low-end conﬁgurations in

identiﬁcation cards, driving licences or other eGovernment applications. The learning

curve for implementers is quick, as the product is based on well-known standards. By

using Smart eID, applications can be developed and validated within days. The Smart eID

family can be regarded as low-end products due to their limited memory size. Triple-DES

symmetric cryptography and the ISO/IEC 14443 type A contactless interface are

supported.

The ﬁle system allows the creation of pre-conﬁgured applications that provide data groups

within the application. Access to these data groups can be according to one of three

modes: completely open (“LDS” – according to the Logical Data Structure deﬁned in ICAO

document 9303), protected with Basic Access Control and Secure Messaging (“BAC” – as

deﬁned in ICAO document 9303). A third conﬁguration provides an additional mechanism

to update data groups after issuing the electronic document to the holder as well as a

feature to protect against cloning. These additional features make Smart eID particularly

useful for ID cards, driving licences, and other eGovernment applications.

Compliance to existing MRTD (Machine Readable Travel Document) inspection

equipment can be obtained by conﬁguration settings according to ICAO document 9303.

For driving licence applications, it can be conﬁgured to comply with ISO/IEC 18013-3,

using BAP (Basic Access Protocol) security in conﬁguration 1.

P304/P308/P310G002 family

NXP Semiconductors

Smart eID

1.3 Naming convention

Table 1.

Naming convention

P3xxG002zz Smart eID platform

amount of non-volatile memory in KB, increasing count for further product options

package type

1.4 Architecture overview

Every member of the Smart eID product family consists of hardware and software

components. The overall deliverable is a module for integration into a contactless smart

card or other contactless device. This module comes pre-conﬁgured with application

software and is ready to be personalized by NXP Semiconductors direct or indirect

customers.

1.4.1 Hardware platform

Every member of the Smart eID product family uses a proven, NXP-developed smart card

processor as the physical basis for its implementation. Chips are packaged in standard

modules ready to be bonded to an antenna coil and embedded in contactless cards.

NXP Semiconductors reserves the right to change aspects of manufacturing technology,

including, but not limited to: silicon chip design, silicon die size, choice of silicon

technology, silicon chip packaging. All aspects of the hardware platform relevant to NXP

Semiconductors direct or indirect customers are documented in the full data sheet and

other documents available for the Smart eID product family and its individual members.

2. Features

2.1 Standard family features

I EEPROM: choice of 4 KB, 8 KB, 10 KB

N Data retention time: 20 years minimum

N Endurance: 100000 cycles minimum

I ISO/IEC 7816 LDS-compatible ﬁle system implementation supporting open access,

BAC and BAC plus operating modes

I Conﬁgurable authentication and security settings to match customer system

requirements

I Conﬁgurable access conditions for elementary ﬁles

I Possible activation of the UPDATE BINARY command in BAC plus operating mode

I Life cycle management system

I ISO/IEC 7816-4 compliant subset of the commands for ﬁle manipulation

I Proprietary commands for easier personalization and transport key exchange

I Flexible support for one ﬁxed functionality ID capable application

I Flexible ﬁle system based on ICAO LDS structure

P304_P308_P310G002_FAM_SDS_1

Product short data sheet

Rev. 01 — 29 July 2008

2 of 8

P304/P308/P310G002 family

NXP Semiconductors

Smart eID

2.2 Product-speciﬁc family features

I P304G002 and P308G002:

N 7-byte unique identiﬁer (cascade level two according to ISO/IEC 14443-3)

I P310G002:

N 4-byte unique identiﬁer

N With MIFARE 4 KB emulation

2.3 Security features

I Support for ICAO BAC and ISO/IEC 8013-3 in BAP conﬁguration 1

I Self-securing ﬁle system

I Data encryption on RF channel with replay attack protection

I Hardware DES using 112-bit keys, featuring key version

I Data authenticity by 8 bytes CMAC

I Authentication on application level

I Hardware exception sensors

2.4 RF interface: ISO/IEC 14443 type A

I Contactless transmission of data and powered by the RF ﬁeld (no battery needed)

I Operating distance: up to 100 mm (depending on antenna geometry)

I Operating frequency: 13.56 MHz

I Fast data transfer: 106 kbit/s, 212 kbit/s, 424 kbit/s

I High data integrity: 16-bit CRC, parity, bit coding, bit counting; CMAC; MAC

I True deterministic anticollision mechanism

I Compliant to ISO/IEC 14443-4 type A protocol

2.5 Supported command set

I SELECT FILE

I READ BINARY

I UPDATE BINARY

I GET CHALLENGE

I MUTUAL AUTHENTICATE

I GET DATA

I INTERNAL AUTHENTICATE

I CREATE FILE

I ACTIVATE FILE

I LOAD IMAGE (proprietary)

I VERIFY IMAGE (proprietary)

P304_P308_P310G002_FAM_SDS_1

Product short data sheet

Rev. 01 — 29 July 2008

3 of 8

P304/P308/P310G002 family

NXP Semiconductors

Smart eID

3. Applications

I Driving licence

I eGovernment

I National identity card

I Corporate card

I Vehicle registration sticker

4. Quick reference data

Table 2.

Symbol Parameter

C_issinput capacitance

Quick reference data

Conditions

Min

Typ

Max Unit

measured on pads LA and LB;

test frequency at 17.4 MHz;

13.5

_amb= 25 °C; V_DD= 0 V

operating frequency measured on pads LA and LB;

_amb= 25 °C

f_oper

13.56 -

MHz

5. Ordering information

Table 3.

Ordering information

Type number Package^[1]

Name

Description

Version

SOT500-2

P304G002A4

P308G002A4

P310G002A4

PLLMC^[2]plastic leadless module carrier package; 35 mm

wide tape

[1] For further package options, please contact your local NXP sales representative or to the NXP

Semiconductors sales department. To obtain NXP Semiconductors sales ofﬁce addresses, please e-mail

salesaddresses@nxp.com.

[2] This package is also known as MOB4.

Table 4.

Product types and features

Product

type

EEPROM MIFARE 4 KB Coprocessor

ISO/IEC 7816 Interface option

IO pads

(KB)

emulation

DES

yes

AES

P304G002

P308G002

P310G002

contactless interface

yes

P304_P308_P310G002_FAM_SDS_1

Product short data sheet

Rev. 01 — 29 July 2008

4 of 8

P304/P308/P310G002 family

NXP Semiconductors

Smart eID

6. Functional diagram

Data stored in Smart eID EEPROM

File system

Applications - ICAO 9303 based

Operating system

Smart eID hardware

loop antenna

(size and proportions

not to scale)

Smart eID

physical module

Smart eID

logical content

001aai433

Fig 1. Functional diagram of P304/P308/P310G002 family

7. Limiting values

Table 5.

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to

_SS(ground = 0 V).

Symbol Parameter

Limiting values

Conditions

Min

Max

Unit

[1]

V_esd

electrostatic discharge

voltage

pads VDD, VSS, CLK,

RST_N, IO1, IO2, IO3

±4.0

[1]

[2]

[3]

pads LA, LB

±2.0

P_tot

T_stg

total power dissipation

storage temperature

°C

[1] MIL Standard 883-D method 3015; human body model; C = 100 pF, R = 1.5 kΩ; T_amb= −25 °C to +85 °C.

[2] Depending on appropriate thermal resistance of the package.

[3] Depending on delivery type, refer to NXP Semiconductors General Speciﬁcation for 8 inch Wafers and to

NXP Semiconductors Contact & Dual Interface Chip Card Module Speciﬁcation.

P304_P308_P310G002_FAM_SDS_1

Product short data sheet

Rev. 01 — 29 July 2008

5 of 8

P304/P308/P310G002 family

NXP Semiconductors

Smart eID

8. Abbreviations

Table 6.

Abbreviations

Description

Acronym

AES

BAC

BAP

CMAC

CRC

DES

eID

Advanced Encryption Standard

Basic Access Control

Basic Access Protocol

Cryptographic MAC

Cyclic Redundancy Check

Data Encryption Standard

electronic Identity Document

Electrically Erasable Programmable Read-Only Memory

Film Frame Carrier

EEPROM

FFC

ICAO

IEC

International Civil Aviation Organization

International Electrotechnical Commission

Input Output

ISO

International Standardization Organization

1024 bytes

LDS

Logical Data Structure

MAC

Message Authentication Code

Radio Frequency

9. Revision history

Table 7.

Revision history

Document ID

Release date Data sheet status

Change notice

Supersedes

P304_P308_P310G002_FAM_SDS_1 20080729

Product short data sheet

P304_P308_P310G002_FAM_SDS_1

Product short data sheet

Rev. 01 — 29 July 2008

6 of 8

P304/P308/P310G002 family

NXP Semiconductors

Smart eID

10. Legal information

10.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Deﬁnition

Objective [short] data sheet

This document contains data from the objective speciﬁcation for product development.

This document contains data from the preliminary speciﬁcation.

This document contains the product speciﬁcation.

Preliminary [short] data sheet Qualiﬁcation

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Deﬁnitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

10.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

10.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

10.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

MIFARE — is a trademark of NXP B.V.

11. Contact information

For more information, please visit: http://www.nxp.com

For sales ofﬁce addresses, please send an email to: salesaddresses@nxp.com

P304_P308_P310G002_FAM_SDS_1

Product short data sheet

Rev. 01 — 29 July 2008

7 of 8

P304/P308/P310G002 family

NXP Semiconductors

Smart eID

12. Contents

General description . . . . . . . . . . . . . . . . . . . . . . 1

1.1

1.2

1.3

1.4

1.4.1

Smart eID family approach . . . . . . . . . . . . . . . . 1

Smart eID family properties . . . . . . . . . . . . . . . 1

Naming convention . . . . . . . . . . . . . . . . . . . . . . 2

Architecture overview . . . . . . . . . . . . . . . . . . . . 2

Hardware platform . . . . . . . . . . . . . . . . . . . . . . 2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Standard family features. . . . . . . . . . . . . . . . . . 2

Product-speciﬁc family features . . . . . . . . . . . . 3

Security features. . . . . . . . . . . . . . . . . . . . . . . . 3

RF interface: ISO/IEC 14443 type A. . . . . . . . . 3

Supported command set . . . . . . . . . . . . . . . . . 3

2.1

2.2

2.3

2.4

2.5

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Quick reference data . . . . . . . . . . . . . . . . . . . . . 4

Ordering information. . . . . . . . . . . . . . . . . . . . . 4

Functional diagram . . . . . . . . . . . . . . . . . . . . . . 5

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6

Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7

Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

10.1

10.2

10.3

10.4

Contact information. . . . . . . . . . . . . . . . . . . . . . 7

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 29 July 2008

Document identifier: P304_P308_P310G002_FAM_SDS_1

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