P3Z22V10-BDH [NXP]

3V zero power, TotalCMOS, universal PLD device; 3V零功耗, TotalCMOS ,通用PLD器件
P3Z22V10-BDH
型号: P3Z22V10-BDH
厂家: NXP    NXP
描述:

3V zero power, TotalCMOS, universal PLD device
3V零功耗, TotalCMOS ,通用PLD器件

文件: 总16页 (文件大小:192K)
中文:  中文翻译
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INTEGRATED CIRCUITS  
P3Z22V10  
3V zero power, TotalCMOS , universal  
PLD device  
Product specification  
1997 Jul 18  
Supersedes data of 1997 May 15  
IC27 Data Handbook  
Philips  
Semiconductors  
Philips Semiconductors  
Product specification  
3V zero power, TotalCMOS , universal PLD device  
P3Z22V10  
FEATURES  
Programmable output polarity  
Synchronous preset/asynchronous reset capability  
Industry’s first TotalCMOS 22V10 – both CMOS design and  
process technologies  
Security bit prevents unauthorized access  
Fast Zero Power (FZP ) design technique provides ultra-low  
power and high speed  
Electronic signature for identification  
Static current of less than 45µA  
Design entry and verification using industry standard CAE tools  
Reprogrammable using industry standard device programmers  
Dynamic current 1/10 to 1/1000 that of competitive devices  
Pin-to-pin delay of only 10ns  
True Zero Power device with no turbo bits or power down  
schemes  
DESCRIPTION  
The P3Z22V10 is the first SPLD to combine high performance with  
low power, without the need for “turbo bits” or other power down  
schemes. To achieve this, Philips Semiconductors has used their  
FZP design technique, which replaces conventional sense  
amplifier methods for implementing product terms (a technique that  
has been used in PLDs since the bipolar era) with a cascaded chain  
of pure CMOS gates. This results in the combination of low power  
and high speed that has previously been unattainable in the PLD  
arena. For 5V operation, Philips Semiconductors offers the  
P5Z22V10 that offers high speed and low power in a 5V  
implementation.  
Function/JEDEC map compatible with  
Bipolar, UVCMOS, EECMOS 22V10s  
Multiple packaging options featuring PCB-friendly flow-through  
pinouts (SOL and TSSOP)  
24-pin TSSOP—uses 93% less in-system space than a 28-pin  
PLCC  
24-pin SOL  
28-pin PLCC with standard JEDEC pin-out  
Available in commercial and industrial operating ranges  
Supports mixed voltage systems–5V tolerant I/Os  
The P3Z22V10 uses the familiar AND/OR logic array structure,  
which allows direct implementation of sum-of-products equations.  
This device has a programmable AND array which drives a fixed OR  
array. The OR sum of products feeds an “Output Macro Cell”  
(OMC), which can be individually configured as a dedicated input, a  
combinatorial output, or a registered output with internal feedback.  
2
Advanced 0.5µ E CMOS process  
1000 erase/program cycles guaranteed  
20 years data retention guaranteed  
Varied product term distribution with up to 16 product terms per  
output for complex functions  
ORDERING INFORMATION  
PROPAGATION  
TEMPERATURE  
RANGE  
DRAWING  
NUMBER  
ORDER CODE  
PACKAGE  
28-pin PLCC  
OPERATING RANGE  
DELAY  
10ns  
10ns  
10ns  
15ns  
15ns  
15ns  
15ns  
15ns  
15ns  
P3Z22V10-DA  
P3Z22V10-DD  
P3Z22V10-DDH  
P3Z22V10-BA  
P3Z22V10-BD  
P3Z22V10-BDH  
P3Z22V10IBA  
P3Z22V10IBD  
P3Z22V10IBDH  
0 to +70°C  
0 to +70°C  
0 to +70°C  
0 to +70°C  
0 to +70°C  
0 to +70°C  
–40 to +85°C  
–40 to +85°C  
–40 to +85°C  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 3.3V ±10%  
= 3.3V ±10%  
= 3.3V ±10%  
= 3.3V ±10%  
= 3.3V ±10%  
= 3.3V ±10%  
= 3.3V ±10%  
= 3.3V ±10%  
= 3.3V ±10%  
SOT261-3  
SOT137-1  
SOT355-1  
SOT261-3  
SOT137-1  
SOT355-1  
SOT261-3  
SOT137-1  
SOT355-1  
24-pin SOL  
24-pin TSSOP  
28-pin PLCC  
24-pin SOL  
24-pin TSSOP  
28-pin PLCC  
24-pin SOL  
24-pin TSSOP  
2
1997 Jul 18  
853–2004 18193  
Philips Semiconductors  
Product specification  
3V zero power, TotalCMOS , universal PLD device  
P3Z22V10  
PIN CONFIGURATIONS  
28-Pin PLCC  
PIN DESCRIPTIONS  
PIN LABEL  
I1 – I11  
NC  
DESCRIPTION  
Dedicated Input  
Not Connected  
4
3
2
1
28 27 26  
I3  
I4  
5
6
25 F7  
24 F6  
23 F5  
22 NC  
21 F4  
20 F3  
19 F2  
F0 – F9  
I0/CLK  
Macrocell Input/Output  
Dedicated Input/Clock Input  
Supply Voltage  
I5  
7
V
CC  
NC  
I6  
8
GND  
Ground  
9
I7  
10  
11  
I8  
12 13 14 15 16 17 18  
SP00474  
24-Pin SOL and 24-Pin TSSOP  
IO/CLK  
1
2
3
4
5
6
7
8
9
24 V  
CC  
I1  
I2  
I3  
I4  
I5  
I6  
I7  
I8  
23 F9  
22 F8  
21 F7  
20 F6  
19 F5  
18 F4  
17 F3  
16 F2  
15 F1  
14 F0  
13 I11  
I9 10  
I10 11  
GND 12  
AP00475  
3
1997 Jul 18  
Philips Semiconductors  
Product specification  
3V zero power, TotalCMOS , universal PLD device  
P3Z22V10  
LOGIC DIAGRAM  
CLK/I0  
1
24  
V
CC  
0
3
4
7
8
11 12 15 16 19 20 23 24 27 28 31 32 35 36 39 40 43  
AR  
0
1
1
1
0
0
0
1
0
1
AR  
D
23 F9  
22 F8  
21 F7  
20 F6  
19 F5  
18 F4  
17 F3  
16 F2  
15 F1  
14 F0  
Q
Q
9
SP  
0
1
10  
20  
1
1
0
0
0
1
0
1
AR  
D
Q
Q
SP  
0
1
I1  
I2  
I3  
I4  
I5  
I6  
I7  
I8  
2
3
4
5
6
7
8
9
21  
1
1
0
0
0
1
0
1
AR  
D
Q
Q
SP  
33  
34  
0
1
1
1
0
0
0
1
0
1
AR  
D
Q
Q
SP  
48  
49  
0
1
1
1
0
0
0
1
0
1
AR  
D
Q
Q
SP  
65  
66  
0
1
1
1
0
0
0
1
0
1
AR  
D
Q
Q
SP  
82  
83  
0
1
1
1
0
0
0
1
0
1
AR  
D
Q
Q
SP  
97  
98  
0
1
1
1
0
0
0
1
0
1
AR  
D
Q
Q
SP  
110  
0
1
111  
121  
1
1
0
0
0
1
0
1
AR  
D
Q
Q
SP  
0
1
122  
130  
1
1
0
0
0
1
0
1
AR  
D
Q
Q
SP  
0
1
I9 10  
I10 11  
SP  
131  
13 I11  
0
3
4
7
8
11 12 15 16 19 20 23 24 27 28 31 32 35 36 39 40 43  
GND 12  
NOTE:  
Programmable connection.  
SP00059  
4
1997 Jul 18  
Philips Semiconductors  
Product specification  
3V zero power, TotalCMOS , universal PLD device  
P3Z22V10  
CLK/I0  
I1 – I11  
1
11  
PROGRAMMABLE AND ARRAY  
(44 × 132)  
8
10  
12  
14  
16  
16  
14  
12  
10  
8
OUTPUT  
MACRO  
CELL  
OUTPUT  
MACRO  
CELL  
OUTPUT  
MACRO  
CELL  
OUTPUT  
MACRO  
CELL  
OUTPUT  
MACRO  
CELL  
OUTPUT  
MACRO  
CELL  
OUTPUT  
MACRO  
CELL  
OUTPUT  
MACRO  
CELL  
OUTPUT  
MACRO  
CELL  
OUTPUT  
MACRO  
CELL  
F0  
F1  
F2  
F3  
F4  
F5  
F6  
F7  
F8  
F9  
SP00060A  
Figure 1.  
Functional Diagram  
132 product terms:  
FUNCTIONAL DESCRIPTION  
– 120 product terms (arranged in 2 groups of 8, 10, 12, 14, and 16)  
used to form logical sums  
The P3Z22V10 implements logic functions as sum-of-products  
expressions in a programmable-AND/fixed-OR logic array.  
User-defined functions are created by programming the connections  
of input signals into the array. User-configurable output structures in  
the form of I/O macrocells further increase logic flexibility.  
– 10 output enable terms (one for each I/O)  
– 1 global synchronous preset product term  
– 1 global asynchronous clear product term  
At each input-line/product-term intersection there is an EEPROM  
memory cell which determines whether or not there is a logical  
connection at that intersection. Each product term is essentially a  
44-input AND gate. A product term which is connected to both the  
True and Complement of an input signal will always be FALSE, and  
thus will not affect the OR function that it drives. When all the  
connections on a product term are opened, a Don’t Care state exists  
and that term will always be TRUE.  
ARCHITECTURE OVERVIEW  
The P3Z22V10 architecture is illustrated in Figure 1. Twelve  
dedicated inputs and 10 I/Os provide up to 22 inputs and 10 outputs  
for creation of logic functions. At the core of the device is a  
programmable electrically-erasable AND array which drives a  
fixed-OR array. With this structure, the P3Z22V10 can implement up  
to 10 sum-of-products logic expressions.  
Associated with each of the 10 OR functions is an I/O macrocell  
which can be independently programmed to one of 4 different  
configurations. The programmable macrocells allow each I/O to  
create sequential or combinatorial logic functions with either  
Active-High or Active-Low polarity.  
Variable Product Term Distribution  
The P3Z22V10 provides 120 product terms to drive the 10 OR  
functions. These product terms are distributed among the outputs in  
groups of 8, 10, 12, 14, and 16 to form logical sums (see Logic  
Diagram). This distribution allows optimum use of device resources.  
AND/OR Logic Array  
The programmable AND array of the P3Z22V10 (shown in the Logic  
Diagram) is formed by input lines intersecting product terms. The  
input lines and product terms are used as follows:  
44 input lines:  
– 24 input lines carry the True and Complement of the signals  
applied to the 12 input pins  
– 20 additional lines carry the True and Complement values of  
feedback or input signals from the 10 I/Os  
5
1997 Jul 18  
Philips Semiconductors  
Product specification  
3V zero power, TotalCMOS , universal PLD device  
P3Z22V10  
S
1
S
0
OUTPUT CONFIGURATION  
1
1
0
0
0
1
0
1
0
0
1
1
0
Registered/Active-LOW/Macrocell feedback  
Registered/Active-HIGH/Macrocell feedback  
Combinatorial/Active-LOW/Pin feedback  
Combinatorial/Active-HIGH/Pin feedback  
AR  
1
0
1
D
Q
F
CLK  
Q
0 = Unprogrammed fuse  
1 = Programmed fuse  
SP  
S
1
S
0
0
1
SP00484  
Figure 2.  
Output Macro Cell Logic Diagram  
S
S
= 0  
= 0  
S
S
= 0  
= 1  
0
1
0
1
AR  
D
Q
F
F
CLK  
Q
SP  
a. Registered/Active-LOW  
c. Combinatorial/Active-LOW  
S
S
= 1  
= 0  
S
S
= 1  
= 1  
0
1
0
1
AR  
D
Q
Q
F
F
CLK  
SP  
b. Registered/Active-HIGH  
Figure 3.  
d. Combinatorial/Active-HIGH  
Output Macro Cell Configurations  
SP00376  
Programmable I/O Macrocell  
Output type  
The output macrocell provides complete control over the  
The signal from the OR array can be fed directly to the output pin  
(combinatorial function) or latched in the D-type flip-flop (registered  
function). The D-type flip-flop latches data on the rising edge of the  
clock and is controlled by the global preset and clear terms. When  
the synchronous preset term is satisfied, the Q output of the register  
will be set HIGH at the next rising edge of the clock input. Satisfying  
the asynchronous clear term will set Q LOW, regardless of the clock  
state. If both terms are satisfied simultaneously, the clear will  
override the preset.  
architecture of each output. the ability to configure each output  
independently permits users to tailor the configuration of the  
P3Z22V10 to the precise requirements of their designs.  
Macrocell Architecture  
Each I/O macrocell, as shown in Figure 2, consists of a D-type  
flip-flop and two signal-select multiplexers. The configuration of each  
macrocell of the P3Z22V10 is determined by the two EEPROM bits  
controlling these multiplexers. These bits determine output polarity,  
and output type (registered or non-registered). Equivalent circuits for  
the macrocell configurations are illustrated in Figure 3.  
6
1997 Jul 18  
Philips Semiconductors  
Product specification  
3V zero power, TotalCMOS , universal PLD device  
P3Z22V10  
from the I/O pin. In this case, the pin can be used as a dedicated  
input, a dedicated output, or a bi-directional I/O.  
Program/Erase Cycles  
The P3Z22V10 is 100% testable, erases/programs in seconds, and  
guarantees 1000 program/erase cycles.  
Power-On Reset  
To ease system initialization, all flip-flops will power-up to a reset  
condition and the Q output will be low. The actual output of the  
P3Z22V10 will depend on the programmed output polarity. The V  
rise must be monotonic.  
Output Polarity  
Each macrocell can be configured to implement Active-High or  
Active-Low logic. Programmable polarity eliminates the need for  
external inverters.  
CC  
Design Security  
Output Enable  
The P3Z22V10 provides a special EEPROM security bit that  
The output of each I/O macrocell can be enabled or disabled under  
the control of its associated programmable output enable product  
term. When the logical conditions programmed on the output enable  
term are satisfied, the output signal is propagated to the I/O pin.  
Otherwise, the output buffer is driven into the high-impedance state.  
prevents unauthorized reading or copying of designs programmed  
into the device. The security bit is set by the PLD programmer,  
either at the conclusion of the programming cycle or as a separate  
step, after the device has been programmed. Once the security bit is  
set, it is impossible to verify (read) or program the P3Z22V10 until  
the entire device has first been erased with the bulk-erase function.  
Under the control of the output enable term, the I/O pin can function  
as a dedicated input, a dedicated output, or a bi-directional I/O.  
Opening every connection on the output enable term will  
permanently enable the output buffer and yield a dedicated output.  
Conversely, if every connection is intact, the enable term will always  
be logically FALSE and the I/O will function as a dedicated input.  
TotalCMOS Design Technique  
for Fast Zero Power  
Philips is the first to offer a TotalCMOS SPLD, both in process  
technology and design technique. Philips employs a cascade of  
CMOS gates to implement its Sum of Products instead of the  
traditional sense amp approach. This CMOS gate implementation  
allows Philips to offer SPLDs which are both high performance and low  
power, breaking the paradigm that to have low power, you must accept  
Register Feedback Select  
When the I/O macrocell is configured to implement a registered  
function (S1 = 0) (Figures 3a or 3b), the feedback signal to the AND  
array is taken from the Q output.  
low performance. Refer to Figure 4 and Table 1 showing the I vs.  
DD  
Frequency of our P3Z22V10 TotalCMOS SPLD.  
Bi-directional I/O Select  
When configuring an I/O macrocell to implement a combinatorial  
function (S1 = 1) (Figures 3c or 3d), the feedback signal is taken  
30  
25  
20  
TYPICAL  
I
DD  
15  
10  
5
(mA)  
0
1
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
110  
120  
130  
FREQUENCY (MHz)  
SP00443  
Figure 4.  
Typical I vs. Frequency @ V = 3.3V, 25°C (10-bit counter)  
DD DD  
Table 1. Typical I vs. Frequency  
DD  
V
DD  
= 3.3V@25°C  
FREQ (MHz)  
Typical I (mA)  
1
10  
20  
30  
40  
50  
60  
8.9  
70  
80  
90  
100  
14.5  
110  
120  
130  
0.2  
1.5  
3.0  
4.5  
6.0  
7.4  
10.4  
11.8  
13.2  
15.8  
17.0  
18.2  
DD  
7
1997 Jul 18  
Philips Semiconductors  
Product specification  
3V zero power, TotalCMOS , universal PLD device  
P3Z22V10  
1
ABSOLUTE MAXIMUM RATINGS  
LIMITS  
SYMBOL  
PARAMETER  
UNIT  
MIN.  
–0.5  
–0.5  
–0.5  
–30  
–100  
0
MAX.  
4.6  
V
V
V
Supply voltage  
Input voltage  
Output voltage  
Input current  
Output current  
V
V
DD  
2
5.5  
5.5  
I
2
V
OUT  
I
I
30  
100  
75  
mA  
mA  
°C  
°C  
°C  
IN  
OUT  
T
T
T
Allowable thermal rise ambient to junction  
Junction temperature range  
R
–40  
–65  
150  
150  
J
Storage temperature range  
STG  
NOTES:  
1. Stresses above those listed may cause malfunction or permanent damage to the device. This is a stress rating only. Functional operation at  
these or any other condition above those indicated in the operational and programming specification of the device is not implied.  
2. Except F7, where max = V + 0.5V.  
DD  
OPERATING RANGE  
PRODUCT GRADE  
Commercial  
TEMPERATURE  
0 to +70°C  
VOLTAGE  
3.3 ± 10% V  
3.3 ± 10% V  
Industrial  
–40 to +85°C  
8
1997 Jul 18  
Philips Semiconductors  
Product specification  
3V zero power, TotalCMOS , universal PLD device  
P3Z22V10  
DC ELECTRICAL CHARACTERISTICS FOR COMMERCIAL GRADE DEVICES  
Commercial: 0°C T  
+70°C; 3.0 V 3.6V  
amb  
DD  
LIMITS  
TYP.  
SYMBOL  
PARAMETER  
TEST CONDITIONS  
UNITS  
MIN.  
MAX.  
0.8  
V
V
V
V
V
Input voltage low  
V
V
= 3.0V  
= 3.6V  
V
V
IL  
DD  
Input voltage high  
Input clamp voltage  
Output voltage low  
Output voltage high  
2
IH  
I
DD  
V
= 3.0V; I = –18mA  
–1.2  
0.5  
V
DD  
IN  
V
DD  
= 3.0V; I = 8mA  
V
OL  
OH  
OL  
V
= 3.0V; I = –4mA  
2.4  
–10  
–10  
–10  
–10  
V
DD  
OH  
V
IN  
= 0 to V  
10  
10  
10  
10  
45  
2
µA  
DD  
I
I
Input leakage current  
2
V
IN  
= V to 5.5V  
DD  
V
IN  
= 0 to V  
µA  
DD  
I
I
I
3-Stated output leakage current  
Standby current  
OZ  
2
V
IN  
= V to 5.5V  
DD  
V
= 3.6V; T = 0°C  
amb  
25  
.5  
µA  
mA  
mA  
DDQ  
DDD  
DD  
V
= 3.6V; T  
= 0°C @ 1MHz  
= 0°C @ 50MHz  
amb  
DD  
amb  
1
Dynamic current  
V
DD  
= 3.6V; T  
10  
15  
1 pin/time for no longer than 1 se-  
cond  
I
Short circuit output current  
–15  
5
–100  
mA  
SC  
C
C
C
Input pin capacitance  
Clock input capacitance  
I/O pin capacitance  
T
= 25°C; f = 1MHz  
= 25°C; f = 1MHz  
= 25°C; f = 1MHz  
8
pF  
pF  
pF  
IN  
amb  
T
12  
10  
CLK  
I/O  
amb  
T
amb  
NOTES:  
1. These parameters measured with a 10-bit up counter, with all outputs enabled and unloaded. Inputs are tied to V or ground. These  
DD  
parameters are not 100% tested, but are calculated at initial characterization and at any time the design is modified where current may be  
affected.  
2. Does not apply to F7.  
AC ELECTRICAL CHARACTERISTICS FOR COMMERCIAL GRADE DEVICES  
Commercial: 0°C T  
+70°C; 3.0 V 3.6V  
amb  
DD  
–B  
–D  
SYMBOL  
PARAMETER  
UNIT  
MIN.  
MAX.  
MIN.  
MAX.  
t
t
t
t
t
t
t
t
t
t
t
t
t
f
f
f
t
t
Input or feedback to non-registered output  
Setup time from input, feedback or SP to Clock  
Clock to output  
15  
10  
ns  
ns  
PD  
4.5  
3.5  
SU  
10  
6
9
4.5  
0
ns  
CO  
CF  
1
Clock to feedback  
ns  
Hold time  
0
ns  
H
Asynchronous Reset to registered output  
Asynchronous Reset width  
Asynchronous Reset recovery time  
Synchronous Preset recovery time  
Width of Clock LOW  
17  
17  
ns  
AR  
5
5
ns  
ARW  
ARR  
SPR  
WL  
WH  
R
6
6
6
6
ns  
ns  
3
3
3
3
ns  
Width of Clock HIGH  
ns  
Input rise time  
20  
20  
20  
20  
ns  
Input fall time  
ns  
F
2
Maximum internal frequency (1/t + t  
)
CF  
95  
69  
125  
80  
MHz  
MHz  
MHz  
ns  
MAX1  
MAX2  
MAX3  
EA  
SU  
1
Maximum external frequency (1/t + t  
)
CO  
SU  
1
Maximum clock frequency (1/t + t  
)
WH  
167  
167  
WL  
Input to Output Enable  
Input to Output Disable  
9
9
9
9
ns  
ER  
Capacitance  
C
C
Input pin capacitance  
Output capacitance  
10  
10  
10  
10  
pF  
pF  
IN  
OUT  
NOTES:  
1. These parameters are not 100% tested, but are calculated at initial characterization and at any time the design is modified where frequency  
may be affected.  
2. These parameters measured with a 10-bit up counter, with all outputs enabled and unloaded. Inputs are tied to V or ground. These  
DD  
parameters are not 100% tested, but are calculated at initial characterization and at any time the design is modified where frequency may be  
affected.  
9
1997 Jul 18  
Philips Semiconductors  
Product specification  
3V zero power, TotalCMOS , universal PLD device  
P3Z22V10  
DC ELECTRICAL CHARACTERISTICS FOR INDUSTRIAL GRADE DEVICES  
Industrial: –40°C T  
+85°C; 3.0 V 3.6V  
amb  
DD  
LIMITS  
TYP.  
SYMBOL  
PARAMETER  
TEST CONDITIONS  
UNITS  
MIN.  
MAX.  
0.8  
V
V
V
V
V
Input voltage low  
V
V
= 3.0V  
= 3.6V  
V
V
IL  
DD  
Input voltage high  
Input clamp voltage  
Output voltage low  
Output voltage high  
2
IH  
I
DD  
V
= 3.0V; I = –18mA  
–1.2  
0.5  
V
DD  
IN  
V
DD  
= 3.0V; I = 8mA  
V
OL  
OH  
OL  
V
= 3.0V; I = –4mA  
2.4  
–10  
–10  
–10  
–10  
V
DD  
OH  
V
IN  
= 0 to V  
10  
10  
10  
10  
45  
µA  
µA  
µA  
µA  
µA  
DD  
I
I
Input leakage current  
2
V
IN  
= V to 5.5V  
DD  
V
IN  
= 0 to V  
DD  
I
I
3-Stated output leakage current  
Standby current  
OZ  
2
V
IN  
= V to 5.5V  
DD  
V
= 3.6V; T = –40°C  
amb  
30  
.5  
DDQ  
DD  
V
= 3.6V; T  
= –40°C @  
DD  
amb  
3
mA  
mA  
mA  
1MHz  
1
I
Dynamic current  
DDD  
SC  
V
= 3.6V; T  
= –40°C @  
DD  
amb  
10  
20  
50MHz  
1 pin/time for no longer than 1 se-  
cond  
I
Short circuit output current  
–15  
5
–100  
C
C
C
Input pin capacitance  
Clock input capacitance  
I/O pin capacitance  
T
= 25°C; f = 1MHz  
= 25°C; f = 1MHz  
= 25°C; f = 1MHz  
8
pF  
pF  
pF  
IN  
amb  
T
amb  
12  
10  
CLK  
I/O  
T
amb  
NOTES:  
1. These parameters measured with a 10-bit up counter, with all outputs enabled and unloaded. Inputs are tied to V or ground. These  
DD  
parameters are not 100% tested, but are calculated at initial characterization and at any time the design is modified where current may be  
affected.  
2. Does not apply to F7.  
AC ELECTRICAL CHARACTERISTICS FOR INDUSTRIAL GRADE DEVICES  
Industrial: –40°C T  
+85°C; 3.0 V 3.6V  
amb  
DD  
LIMITS  
SYMBOL  
PARAMETER  
UNIT  
MIN.  
MAX.  
t
t
t
t
t
t
t
t
t
t
t
t
t
f
f
f
t
t
Input or feedback to non-registered output  
Setup time from input, feedback or SP to Clock  
Clock to output  
15  
ns  
ns  
PD  
5
SU  
10.5  
6
ns  
CO  
CF  
1
Clock to feedback  
ns  
Hold time  
0
ns  
H
Asynchronous Reset to registered output  
Asynchronous Reset width  
Asynchronous Reset recovery time  
Synchronous Preset recovery time  
Width of Clock LOW  
17  
ns  
AR  
5
ns  
ARW  
ARR  
SPR  
WL  
WH  
R
6
6
ns  
ns  
3
3
ns  
Width of Clock HIGH  
ns  
Input rise time  
20  
20  
ns  
Input fall time  
ns  
F
2
Maximum internal frequency (1/t + t  
)
91  
65  
MHz  
MHz  
MHz  
ns  
MAX1  
MAX2  
MAX3  
EA  
SU  
CF  
1
Maximum external frequency (1/t + t  
)
SU  
CO  
1
Maximum clock frequency (1/t + t  
)
WH  
167  
WL  
Input to Output Enable  
Input to Output Disable  
11  
11  
ns  
ER  
Capacitance  
C
C
Input pin capacitance  
Output capacitance  
10  
12  
pF  
pF  
IN  
OUT  
NOTES:  
1. These parameters are not 100% tested, but are calculated at initial characterization and at any time the design is modified where frequency  
may be affected.  
2. These parameters measured with a 10-bit up counter, with all outputs enabled and unloaded. Inputs are tied to V or ground. These  
DD  
parameters are not 100% tested, but are calculated at initial characterization and at any time the design is modified where frequency may be  
affected.  
10  
1997 Jul 18  
Philips Semiconductors  
Product specification  
3V zero power, TotalCMOS , universal PLD device  
P3Z22V10  
TEST LOAD CIRCUIT  
V
+3.3V  
S
1
CC  
C
C
2
R
1
1
I
0
F
0
C
R
L
2
DUT  
INPUTS  
F
I
n
n
OE  
CK  
GND  
NOTE:  
C
R
and C are to bypass V to GND.  
1
1
2 CC  
= 300, R = 300, C = 35pF.  
2
L
SP00478  
THEVENIN EQUIVALENT  
V
L
= 1.65V  
150Ω  
DUT OUTPUT  
35pF  
SP00479A  
VOLTAGE WAVEFORM  
+3.0V  
90%  
10%  
0V  
t
R
t
F
1.5ns  
1.5ns  
MEASUREMENTS:  
All circuit delays are measured at the +1.5V level of  
inputs and outputs, unless otherwise specified.  
Input Pulses  
SP00368  
11  
1997 Jul 18  
Philips Semiconductors  
Product specification  
3V zero power, TotalCMOS , universal PLD device  
P3Z22V10  
SWITCHING WAVEFORMS  
INPUT OR  
FEEDBACK  
INPUT OR  
FEEDBACK  
V
V
T
T
t
t
t
H
PD  
S
COMBINATORIAL  
OUTPUT  
CLOCK  
V
V
T
T
t
CO  
REGISTERED  
OUTPUT  
V
T
Combinatorial Output  
Registered Output  
INPUT  
V
T
t
WH  
t
t
ER  
EA  
CLOCK  
V
T
V
– 0.5V  
+ 0.5V  
OH  
OUTPUT  
V
T
V
OL  
t
WL  
Clock Width  
Input to Output Disable/Enable  
t
ARW  
INPUT ASSERTING  
ASYNCHRONOUS  
RESET  
INPUT ASSERTING  
SYNCHRONOUS  
PRESET  
V
V
T
T
t
t
t
t
SPR  
AR  
S
H
REGISTERED  
OUTPUT  
CLOCK  
V
V
V
T
T
T
t
t
ARR  
CO  
REGISTERED  
OUTPUT  
CLOCK  
V
T
V
T
Asynchronous Reset  
Synchronous Preset  
NOTES:  
1. V = 1.5V.  
T
2. Input pulse amplitude 0V to 3.0V.  
3. Input rise and fall times 2.0ns max.  
SP00065  
“AND” ARRAY – (I, B)  
I, B  
I, B  
I, B  
I, B  
I, B  
I, B  
I, B  
I, B  
I, B  
I, B  
I, B  
I, B  
P, D  
P, D  
P, D  
P, D  
STATE  
CODE  
STATE  
TRUE  
CODE  
STATE  
CODE  
STATE  
CODE  
1
O
H
COMPLEMENT  
L
DON’T CARE  
INACTIVE  
SP00008  
NOTE:  
1. This is the initial state.  
12  
1997 Jul 18  
Philips Semiconductors  
Product specification  
3V zero power, TotalCMOS , universal PLD  
device  
P3Z22V10  
PLCC28: plastic leaded chip carrer; 28 leads; pedestal  
SOT261-3  
13  
1997 Jul 18  
Philips Semiconductors  
Product specification  
3V zero power, TotalCMOS , universal PLD  
device  
P3Z22V10  
SO24: plastic small outline package; 24 leads; body width 7.5 mm  
SOT137-1  
14  
1997 Jul 18  
Philips Semiconductors  
Product specification  
3V zero power, TotalCMOS , universal PLD  
device  
P3Z22V10  
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm  
SOT355-1  
15  
1997 Jul 18  
Philips Semiconductors  
Product specification  
3V zero power, TotalCMOS , universal PLD  
device  
P3Z22V10  
DEFINITIONS  
Data Sheet Identification  
Product Status  
Definition  
This data sheet contains the design target or goal specifications for product development. Specifications  
may change in any manner without notice.  
Objective Specification  
Formative or in Design  
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to make changes at any time without notice in order to improve design  
and supply the best possible product.  
Preliminary Specification  
Product Specification  
Preproduction Product  
Full Production  
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes  
at any time without notice, in order to improve design and supply the best possible product.  
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,  
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips  
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,  
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask  
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes  
only. PhilipsSemiconductorsmakesnorepresentationorwarrantythatsuchapplicationswillbesuitableforthespecifiedusewithoutfurthertesting  
or modification.  
LIFE SUPPORT APPLICATIONS  
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,  
orsystemswheremalfunctionofaPhilipsSemiconductorsandPhilipsElectronicsNorthAmericaCorporationProductcanreasonablybeexpected  
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips  
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully  
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.  
Philips Semiconductors  
811 East Arques Avenue  
P.O. Box 3409  
Copyright Philips Electronics North America Corporation 1997  
All rights reserved. Printed in U.S.A.  
Sunnyvale, California 94088–3409  
Telephone 800-234-7381  
Philips  
Semiconductors  

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