PBYR1025D [NXP]

Rectifier diodes Schottky barrier; 整流二极管肖特基势垒


型号：	PBYR1025D
厂家：	NXP
描述：	Rectifier diodes Schottky barrier 整流二极管肖特基势垒整流二极管
文件：	总5页 (文件大小：52K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Philips Semiconductors

Product specification

Rectifier diodes

Schottky barrier

PBYR1025D series

FEATURES

SYMBOL

QUICK REFERENCE DATA

• Low forward volt drop

• Fast switching

• Reverse surge capability

• High thermal cycling performance

• Low thermal resistance

V_R= 20 V/ 25 V

I_F(AV)= 10 A

tab

V_F≤ 0.41 V

GENERAL DESCRIPTION

PINNING

SOT428

Schottky rectifier diodes in

DESCRIPTION

no connection

cathode¹

anode

tab

surface mounting plastic envelope.

Intended for use as output rectifiers

in low voltage, high frequency

switched mode power supplies.

The PBYR1025D series is supplied

in the SOT428 surface mounting

package.

tab cathode

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134)

SYMBOL PARAMETER CONDITIONS

MIN.

MAX.

UNIT

PBYR10

20D

25D

V_RRM

V_RWM

Peak repetitive reverse

voltage

Working peak reverse

voltage

Continuous reverse voltage

V_R

_mb≤ 120 ˚C

I_F(AV)

Average rectified forward

current

square wave; δ = 0.5; T_mb≤ 140 ˚C

I_FRM

I_FSM

Repetitive peak forward

current

Non-repetitive peak forward t = 10 ms

100

110

current

t = 8.3 ms

sinusoidal; T_j= 125 ˚C prior to

surge; with reapplied V_RRM(max)

pulse width and repetition rate

limited by T_{j max}

I_RRM

T_j

Peak repetitive reverse

surge current

Operating junction

temperature

150

175

˚C

T_stg

Storage temperature

- 65

1 It is not possible to make connection to pin 2 of the SOT428 package.

April 1998

Rev 1.000

Philips Semiconductors

Product specification

Rectifier diodes

Schottky barrier

PBYR1025D series

THERMAL RESISTANCES

SYMBOL PARAMETER

CONDITIONS

MIN. TYP. MAX. UNIT

R_{th j-mb}

R_{th j-a}

Thermal resistance junction

to mounting base

K/W

Thermal resistance junction pcb mounted, minimum footprint, FR4

to ambient

board

ELECTRICAL CHARACTERISTICS

T_j= 25 ˚C unless otherwise specified

SYMBOL PARAMETER

CONDITIONS

MIN. TYP. MAX. UNIT

V_F

Forward voltage

I_F= 10 A; T_j= 125˚C

I_F= 20 A; T_j= 125˚C

I_F= 20 A

0.33 0.41

0.43 0.55

0.51

0.6

I_R

Reverse current

V_R= V_RWM

V_R= V_RWM; T_j= 100˚C

V_R= 5 V; f = 1 MHz, T_j= 25˚C to 125˚C

C_d

Junction capacitance

700

April 1998

Rev 1.000

Philips Semiconductors

Product specification

Rectifier diodes

Schottky barrier

PBYR1025D series

Forward dissipation, PF (W)

PBYL1625

0.5

IR / A

PBYR2025CT

Tmb(max) / C

D = 1.0

100mA

10mA

1mA

120

130

140

150

Vo = 0.32 V

Rs = 0.009 Ohms

Tj = 150 C

125

100

0.2

0.1

D =

100uA

10uA

Average forward current, IF(AV) (A)

VR / V

Fig.1. Maximum forward dissipation P_F= f(I_F(AV));

square current waveform where I_F(AV)=I_F(RMS)x √D.

Fig.4. Typical reverse leakage current; I_R= f(V_R);

parameter T_j

PBYR2025CT

Forward dissipation, PF (W) PBYL1625

Tmb(max) / C

Cd / pF

10000

1000

100

126

130

134

138

142

146

150

Vo = 0.32 V

Rs = 0.009 Ohms

a = 1.57

1.9

2.2

2.8

100

Average forward current, IF(AV) (A)

VR / V

Fig.2. Maximum forward dissipation P_F= f(I_F(AV));

square current waveform where I_F(AV)=I_F(RMS)x √D.

Fig.5. Typical junction capacitance; C_d= f(V_R);

f = 1 MHz; T_j= 25˚C to 125 ˚C.

Transient thermal impedance, Zth j-mb (K/W)

PBYR2025CT

IF / A

typ

max

Tj = 25 C

Tj = 125 C

0.1

0.01

D =

0.001

1us

10us 100us 1ms

10ms 100ms

10s

0.2

0.4

0.6

0.8

pulse width, tp (s)

VF / V

PBYL1625

Fig.3. Typical and maximum forward characteristic

I_F= f(V_F); parameter T_j

Fig.6. Transient thermal impedance; Z_{th j-mb}= f(t_p).

April 1998

Rev 1.000

Philips Semiconductors

Product specification

Rectifier diodes

Schottky barrier

PBYR1025D series

MECHANICAL DATA

Dimensions in mm : Net Mass: 1.4 g

seating plane

1.1

2.38 max

0.93 max

5.4

6.73 max

tab

4 min

4.6

6.22 max

0.5 min

10.4 max

0.5

0.3

0.5

0.8 max

(x2)

2.285 (x2)

Fig.7. SOT428 : centre pin connected to mounting base.

MOUNTING INSTRUCTIONS

Dimensions in mm

7.0

2.15

2.5

1.5

4.57

Fig.8. SOT428 : soldering pattern for surface mounting.

Notes

1. Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent

damage to MOS gate oxide.

2. Epoxy meets UL94 V0 at 1/8".

April 1998

Rev 1.000

Philips Semiconductors

Product specification

Rectifier diodes

Schottky barrier

PBYR1025D series

DEFINITIONS

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one

or more of the limiting values may cause permanent damage to the device. These are stress ratings only and

operation of the device at these or at any other conditions above those given in the Characteristics sections of

this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Philips Electronics N.V. 1998

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the

The information presented in this document does not form part of any quotation or contract, it is believed to be

accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any

consequence of its use. Publication thereof does not convey nor imply any license under patent or other

industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these

products can be reasonably expected to result in personal injury. Philips customers using or selling these products

for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting

from such improper use or sale.

April 1998

Rev 1.000

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