PBYR2150CT [NXP]

Schottky barrier double diode; 肖特基势垒二极管双
PBYR2150CT
型号: PBYR2150CT
厂家: NXP    NXP
描述:

Schottky barrier double diode
肖特基势垒二极管双

二极管
文件: 总5页 (文件大小:72K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
page  
M3D087  
PBYR2150CT  
Schottky barrier double diode  
1996 Oct 14  
Preliminary specification  
Philips Semiconductors  
Preliminary specification  
Schottky barrier double diode  
PBYR2150CT  
FEATURES  
DESCRIPTION  
Low switching losses  
Low forward voltage  
High breakdown voltage  
Fast recovery time  
The PBYR2150CT is a Schottky barrier double diode, fabricated in planar  
technology, and encapsulated in a SOT223 plastic SMD package.  
Guard ring protected  
Plastic SMD package.  
4
4
APPLICATIONS  
Low power, switched-mode  
1
3
power supplies  
Rectification  
2
Polarity protection.  
1
2
3
PINNING  
MAM086  
Top view  
PIN  
DESCRIPTION  
anode (a1)  
1
2
3
4
Marking code: BYR215.  
common cathode  
anode (a2)  
Fig.1 Simplified outline (SOT223), pin configuration and symbol.  
common cathode  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
Per diode  
VR  
continuous reverse voltage  
repetitive peak reverse voltage  
crest working reverse voltage  
average forward current  
150  
V
V
V
A
VRRM  
VRWM  
IF(AV)  
150  
150  
1
Tamb = 85 °C; Rth j-a = 70 K/W;  
note 1; VR(equiv) = 0.2 V; note 2  
IFSM  
non-repetitive peak forward current t = 8.3 ms half sinewave;  
JEDEC method  
10  
A
1996 Oct 14  
2
Philips Semiconductors  
Preliminary specification  
Schottky barrier double diode  
PBYR2150CT  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
Per diode  
Tstg  
storage temperature  
+150  
°C  
°C  
°C  
65  
Tj  
junction temperature  
+150  
80  
65  
Tamb  
operating ambient temperature  
Notes  
1. Refer to SOT223 standard mounting conditions.  
2. For Schottky barrier diodes thermal run-away has to be considered, as in some applications, the reverse power  
losses PR are a significant part of the total power losses. Nomograms for determination of the reverse power losses  
PR and IF(AV) rating will be available on request.  
ELECTRICAL CHARACTERISTICS  
Tamb = 25 °C unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
MAX.  
UNIT  
Per diode  
VF  
forward voltage  
see Fig.2  
IF = 0.1 A; note 1  
400  
mV  
IF = 0.5 A; note 1  
650  
850  
690  
1
mV  
mV  
mV  
mA  
mA  
IF = 1 A; note 1  
IF = 1 A; Tj = 100 °C; note 1  
VR = VRRMmax; note 1; see Fig.3  
IR  
reverse current  
VR = VRRMmax; Tj = 100 °C; note 1;  
10  
see Fig.3  
Cd  
diode capacitance  
VR = 4 V; f = 1 MHz; see Fig.4  
100  
pF  
Note  
1. Pulsed test: tp = 300 µs; δ = 0.02.  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
thermal resistance from junction to ambient  
CONDITIONS  
VALUE  
70  
UNIT  
K/W  
Rth j-a  
note 1  
Note  
1. Refer to SOT223 standard mounting conditions.  
1996 Oct 14  
3
Philips Semiconductors  
Preliminary specification  
Schottky barrier double diode  
PBYR2150CT  
GRAPHICAL DATA  
MGD767  
MGD766  
2  
10  
10  
handbook, halfpage  
handbook, halfpage  
I
F
I
R
(A)  
(A)  
1
(4)  
(3)  
3  
10  
1  
10  
(4)  
(3)  
(2)  
(1)  
2  
10  
(2)  
(1)  
4  
10  
3  
10  
4  
10  
5  
10  
5  
10  
6  
6  
10  
10  
0
50  
100  
150  
0
0.2  
0.4  
0.6  
0.8  
V
(V)  
V
(V)  
R
F
(1) Tamb = 25 °C.  
(1) Tamb = 25 °C.  
(2)  
Tamb = 60 °C.  
(2) Tamb = 60 °C.  
(3) Tamb = 80 °C.  
(4) Tamb = 100 °C.  
(3) Tamb = 80 °C.  
(4) Tamb = 100 °C.  
Fig.2 Forward current as a function of forward  
voltage; typical values.  
Fig.3 Reverse current as a function of reverse  
voltage; typical values.  
MGD768  
250  
handbook, halfpage  
C
d
(pF)  
200  
150  
100  
50  
0
0
50  
100  
V
(V)  
R
f = 1 MHz.  
Fig.4 Diode capacitance as a function of reverse  
voltage; typical values.  
1996 Oct 14  
4
Philips Semiconductors  
Preliminary specification  
Schottky barrier double diode  
PBYR2150CT  
PACKAGE OUTLINE  
0.95  
0.85  
0.1 S  
S
seating plane  
0.32  
0.24  
6.7  
6.3  
3.1  
2.9  
B
M
0.2  
A
4
A
0.10  
0.01  
3.7  
3.3  
7.3  
6.7  
o
o
16  
16  
max  
1
2
3
o
10  
max  
0.80  
0.60  
1.80  
max  
M
2.3  
0.1  
B
(4x)  
MSA035 - 1  
4.6  
Dimensions in mm.  
Fig.5 SOT223.  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1996 Oct 14  
5

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