PCA1602 [NXP]
32 kHz watch circuits with EEPROM; 与EEPROM 32 kHz钟表电路
| 型号： | PCA1602 |
| 厂家： | 
NXP |
| 描述： | 32 kHz watch circuits with EEPROM |
| 文件： | 总16页 (文件大小：89K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
PCA16xx series
32 kHz watch circuits with
EEPROM
1997 Dec 12
Product specification
Supersedes data of 1997 Apr 21
File under Integrated Circuits, IC16
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
• Stop function for accurate timing
FEATURES
• Power-on reset for fast testing
• 32 kHz oscillator, amplitude regulated with excellent
frequency stability
• Various test modes for testing the mechanical parts of
the watch and the IC.
• High immunity of the oscillator to leakage currents
• Time calibration electrically programmable and
reprogrammable (via EEPROM)
GENERAL DESCRIPTION
• A quartz crystal is the only external component required
• Very low current consumption; typically 170 nA
• Detector for silver-oxide or lithium battery voltage levels
• Indication for battery end-of-life
The PCA16xx series devices are CMOS integrated circuits
specially suited for battery-operated,
quartz-crystal-controlled wrist-watches, with bipolar
stepping motors.
ORDERING INFORMATION
TYPE
PACKAGE(1)
NUMBER
NAME
DESCRIPTION
VERSION
PCA1601U/10
PCA1602T
−
chip on foil
−
PMFP8
plastic micro flat package; 8 leads (straight)
chip with bumps on tape
chip in tray
SOT144-1
PCA1603U/7
PCA1604U
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
PCA1604U/10
PCA1605U/7
PCA1606U/10
PCA1607U
chip on foil
chip with bumps on tape
chip on foil
chip in tray
PCA1608U
chip in tray
PCA1611U
chip in tray
PCA1621U/7
PCA1621U/10
PCA1622U
chip with bumps on tape
chip on foil
chip in tray
PCA1623U/7
PCA1624U
chip with bumps on tape
chip in tray
PCA1625U/7
PCA1626U
chip with bumps on tape
chip in tray
PCA1627U/7
PCA1628U
chip with bumps on tape
chip in tray
PCA1629U/7
chip with bumps on tape
Note
1. Figure 1 and Chapter “Package outline” show details of standard package, available for specified devices and for
large orders only.
Chapter “Chip dimensions and bonding pad locations” shows exact pad locations for other delivery formats.
1997 Dec 12
2
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
PINNING
SYMBOL
VSS
PIN
DESCRIPTION
ground (0 V)
1
2
3
4
5
6
7
8
V
1
2
3
4
8
7
6
5
RESET
M2
SS
TEST
OSC IN
OSC OUT
VDD
test output
TEST
OSC IN
PCA16xxT
oscillator input
oscillator output
positive supply voltage
motor 1 output
motor 2 output
reset input
M1
V
OSC OUT
DD
MSA973
M1
M2
Fig.1 Pin configuration, PCA16xxT, (PMFP8).
RESET
FUNCTIONAL DESCRIPTION AND TESTING
Motor pulse
Customer testing
An output frequency of 32 Hz is provided at RESET (pin 8)
to be used for exact frequency measurement. Every
minute a jitter occurs as a result of time calibration, which
occurs 90 to 150 ms after disconnecting the RESET from
The motor pulse width (tP) and the cycle times (tT) are
given in Chapter “Available types”.
VDD
.
Voltage level detector
Connecting the RESET to VDD stops the motor pulses
leaving them in a HIGH impedance 3-state condition and a
32 Hz signal without jitter is produced at the TEST pin.
A debounce circuit protects accidental stoppages due to
mechanical shock to the watch (tDEB = 14.7 to 123.2 ms).
The supply voltage is compared with the internal voltage
reference VLIT and VEOL every minute. The first voltage
level detection is carried out 30 ms after a RESET.
Lithium mode
Connecting RESET to VSS activates Tests 1 and 2 and
disables the time calibration.
If a lithium voltage is detected (VDD ≥ VLIT), the circuit will
operate in the lithium mode. The motor pulse will be
produced with a 75% duty factor.
Test 1, VDD > VEOL. Normal function takes place except
the voltage detection cycle (tV) is 125 ms and the cycle
time tT1 is 31.25 ms. At pin TEST a minute signal is
available at 8192 times its normal frequency.
Silver-oxide mode
If the voltage level detected is between VLIT and VEOL, the
circuit will operate in silver-oxide mode.
Test 2(2), VDD < VEOL. The voltage detection cycle (tV) is
31.25 ms and the motor pulse period (tT2) = 31.25 ms.
Battery end-of-life(1)
Test and reset mode are terminated by disconnecting the
RESET pin.
If the battery end-of-life is detected (VDD ≤ VEOL), the
motor pulse will be produced without chopping. To indicate
this condition, bursts of 4 pulses are produced every 4 s.
Test 3, VDD > 5.1 V. Motor pulses with a time period of
tT3 = 31.25 ms and n × 122 µs are produced to check the
contents of the EEPROM. At pin TEST the motor pulse
period signal (tT) is available at 1024 times its normal
frequency. The circuit returns to normal operation when
VDD < 2.5 V between two motor pulses.
Power-on reset
For correct operation of the Power-on reset the rise time of
VDD from 0 V to 2.1 V should be less than 0.1 ms.
All resettable flip-flops are reset. Additionally the polarity of
the first motor pulse is positive: VM1 − VM2 ≥ 0 V.
(2) Only applicable for types with the battery end-of-life detector.
(1) Only available for types with a 1 s motor pulse.
1997 Dec 12
3
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
3. VDD is decreased to 2.5 V during a motor pulse to
initialize a storing sequence.
Time calibration
Taking a normal quartz crystal with frequency 32768kHz,
frequency deviation (∆f/f) of ±15 × 10−6 and CL = 8.2 pF;
the oscillator frequency is offset (by using non-symmetrical
internal oscillator input and output capacitances of 10 pF
and 15 pF) such that the frequency deviation is
4. The first VDD pulse to 5.1 V erases the contents of
EEPROM.
5. When the EEPROM is erased a logic 1 is at the TEST
pin.
positive-only. This positive deviation can then be
compensated for to maintain time-keeping accuracy.
6. VDD is increased to 5.1 V to read the data by pulsing
VDD n times to 4.5 V. After the n edge, VDD is
decreased to 2.5 V.
Once the positive frequency deviation is measured, a
corresponding number ‘n’ (see Table 1) is programmed
into the device’s EEPROM. This causes n pulses of
frequency 8192 Hz to be inhibited every minute of
operation, which achieves the required calibration.
7. VDD is increased to 5.1 V to store n bits in the
EEPROM.
8. VDD is decreased to 2.5 V to terminate the storing
sequence and to return to operating mode.
The programming circuit is shown in Fig.2. The required
number n is programmed into EEPROM by varying VDD
according to the steps shown in Fig.3, which are
explained below:
9. VDD is increased to 5.1 V to check writing from the
motor pulse period tT3.
10. VDD is decreased to the operation voltage between
two motor pulses to return to operating mode.
(Decreasing VDD during the motor pulse would restart
the programming mode).
1. The positive quartz frequency deviation (∆f/f) is
measured, and the corresponding values of n are
found according to Table 1.
The time calibration can be reprogrammed up to 100
times.
2. VDD is increased to 5.1 V allowing the contents of the
EEPROM to be checked from the motor pulse period
tT3 at nominal frequency.
Table 1 Quartz crystal frequency deviation, n and tT3
FREQUENCY
NUMBER OF
SIGNAL GENERATOR
DEVIATION
∆f/f
tT3
(ms)
PULSES
(n)
(× 10−6)
V
SS
RESET
M2
1
2
3
8
7
6
0(1)
0
1
2
.
31.250(2)
+2.03
31.372
TEST
+4.06
31.494
PCA16xx
SERIES
M
.
.
OSC IN
OSC OUT
M1
V
.
.
.
32 kHz
.
.
.
DD
4
5
+127.89
63
38.936
MSA975
Notes
1. Increments of 2.03 × 10−6/step.
Fig.2 Circuit for programming the time calibration.
2. Increments of 122 µs/step.
1997 Dec 12
4
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
SM9A48
1997 Dec 12
5
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
AVAILABLE TYPES
Refer to Fig.4 and to Chapters “Ordering information” and “Functional description and testing”.
SPECIFICATIONS
SHORT
TYPE
NUMBER
PERIOD
DELIVERY
FORMAT(1)
PULSE
WIDTH tP
(ms)
BATTERY
EOL
tT
(s)
DRIVE
(%)
EEPROM
REMARKS
DETECTION
1601
1602
1603
1604
1605
1606
1607
U/10
T
1
1
7.8
7.8
7.8
7.8
4.8
6.8
5.8
100
75
yes
yes
yes
yes
yes
yes
yes
no
no
no
no
no
no
no
U/7
U/10
U/7
U/10
U
20
5
100
75
5
75
10
5
100
100
75
1.5 V and
2.1 V Lithium
1608
U
5
7.8
100
75
yes
no
1.5 V and
2.1 V Lithium
1611
1621
1622
1623
1624
U
U/7
U
1
6.8
4.8
4.8
4.8
3.9
75
100
100
75
yes
yes
yes
yes
yes
no
no
20
1
yes
no
U
20
12
U
75
56
no
1.5 V and
2.1 V Lithium
1625
1626
1627
U/7
U
5
5.8
5.8
5.8
75
yes
yes
yes
no
no
no
20
20
100
U/7
100
75
1.5 V and
2.1 V Lithium
1628
1629
U
20
5
5.8
6.8
75
75
yes
yes
no
no
U/7
Note
1. U = Chip in trays; U/7 = chip with bumps on tape; U/10 = chip on foil.
T = SOT144-1.
V
M1 - M2
t
t
P
T
2t
T
MSA977
Fig.4 Motor output waveform (normal operation).
1997 Dec 12
6
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC134).
SYMBOL
VDD
PARAMETER
supply voltage
CONDITIONS
VSS = 0 V; note 1
MIN.
−1.8
MAX.
+6
UNIT
V
V
VI
all input voltages
VSS
VDD
output short-circuit duration
operating ambient temperature
storage temperature
indefinite
+60
Tamb
Tstg
−10
−30
°C
°C
+100
Note
1. Connecting the battery with reversed polarity does not destroy the circuit, but in this condition a large current flows,
which will rapidly discharge the battery.
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
advisable to take handling precautions appropriate to handling MOS devices. Advice can be found in
“Data Handbook IC16, General, Handling MOS Devices”.
CHARACTERISTICS
VDD = 1.55 V; VSS = 0 V; fosc = 32.768 kHz; Tamb = 25 °C; crystal: RS = 20 kΩ; C1 = 2 to 3 fF; CL = 8 to 10 pF;
C0 = 1 to 3 pF; unless otherwise specified.
Immunity against parasitic impedance = 20 MΩ from one pin to an adjacent pin.
SYMBOL
Supply
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
VDD
supply voltage
Tamb = −10 to +60 °C
transient; VDD = 1.2 to 2.5 V
programming
1.2
1.5
−
2.5
V
∆VDD
VDDP
∆VDDP
IDD1
supply voltage variation
supply voltage pulse
supply voltage pulse variation
supply current
−
0.25
5.2
V
5.0
0.55
−
5.1
0.6
170
190
V
programming
0.65
260
300
V
between motor pulses
nA
nA
IDD2
supply current
between motor pulses;
VDD = 2.1 V
−
IDD3
IDD4
IDD5
supply current
supply current
supply current
stop mode; pin 8 connected to
VDD
−
−
−
180
220
−
280
360
600
nA
nA
nA
stop mode; pin 8 connected to
VDD; VDD = 2.1 V
VDD = 2.1 V;
Tamb = −10 to +60 °C
1997 Dec 12
7
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
Motor output
Vsat
Rsc
tT
saturation voltage Σ (P + N)
RL = 2 kΩ; Tamb = −10 to +60 °C
−
150
200
200
300
mV
short-circuit resistance Σ (P + N) Itransistor < 1 mA
−
Ω
cycle time
note 1
tP
pulse width
note 2
Oscillator
VOSC ST
gm
starting voltage
1.2
6
−
−
−
−
V
transconductance
start-up time
Vi(p-p) ≤ 50 mV
15
1
µS
s
tosc
−
∆f/f
frequency stability
∆VDD = 100 mV
−
0.05 × 0.3 ×
10−6
10−6
Ci
input capacitance
output capacitance
8
10
12
pF
pF
Co
12
15
18
Voltage level detector
VLIT
threshold voltage
lithium mode
1.65
1.27
−
1.80
1.38
10
1.95
1.46
−
V
VEOL
∆VVLD
TCVLD
tV
threshold voltage
battery end-of-life
V
hysteresis of threshold
temperature coefficient
voltage detection cycle
mV
mV/K
s
−
−1
−
−
60
−
Reset input
fo
output frequency
output voltage swing
edge time
−
32
−
−
−
−
−
−
Hz
V
∆Vo
tedge
Iim
R = 1 MΩ; C = 10 pF
R = 1 MΩ; C = 10 pF
note 3
1.4
−
1
µs
nA
nA
peak input current
average input current
−
320
10
Ii(av)
−
Test mode
cycle time for motor pulses in:
tT1
test 1
test 2
−
−
125
−
−
ms
ms
tT2
31.25
tT3
test 3
see Chapter “Available types”
tDEB
debounce time
RESET = VDD
14.7
−
123.2 ms
Battery end-of-life
tEOL end-of-life sequence
tE1
−
−
−
4
−
−
−
s
motor pulse width
see “Available types”
tP
ms
ms
tE2
time between pulses
31.25
Notes
1. Cycle time can be changed to one of the following values: 1, 5, 10, 12 or 20 s (see Chapter “Available types”).
2. Pulse width can be varied from 2 ms to 15.7 ms in steps of 1 ms (see Chapter “Available types”).
3. Duty factor is 1 : 32 and RESET = VDD or VSS
.
1997 Dec 12
8
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
CHIP DIMENSIONS AND BONDING PAD LOCATIONS
y
V
SS
OSC OUT
OSC IN
TEST
PCA16xxU
SERIES
1.44 mm
0
0
x
V
M1
M2
RESET
DD
2.02 mm
MSA976
Chip area: 2.91 mm2.
Bonding pad dimensions: 110 µm × 110 µm.
Chip thickness: 200 ±25 µm, with bumps: 270 ±25 µm.
Fig.5 Bonding pad locations, PCA16xxU series, 8 terminals.
Table 2 Bonding pad locations (dimensions in µm)
All x/y coordinates are referenced to the centre of pad (VDD), see Fig.5.
PAD
x
y
VSS
1290
940
1100
1100
1100
1100
0
TEST
OSC IN
OSC OUT
VDD
481
−102
0
M1
578
0
M2
930
0
RESET
1290
−497.5
0
chip corner (max. value)
−170
1997 Dec 12
9
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
APPLICATION INFORMATION
1.55 V
V
SS
RESET
M2
1
8
7
6
TEST
2
PCA16xx
SERIES
(1)
M
OSC IN
M1
V
3
4
DD
OSC OUT
5
MSA974
(1) Quartz crystal case should be connected to VDD. Stray capacitance and leakage resistance from RESET, M1 or M2 to OSC IN should be less than
0.5 pF or larger than 20 MΩ.
Fig.6 Typical application circuit diagram.
1997 Dec 12
10
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
PACKAGE OUTLINE
PMFP8: plastic micro flat package; 8 leads (straight)
SOT144-1
D
E
X
c
m
t
n
H
E
8
5
Q
2
A
2
Q
pin 1 index
1
L
detail X
1
4
e
w M
b
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
m
max.
n
max.
(1)
A
H
E
Q
Q
2
UNIT
b
c
e
L
t
w
2
D
E
1
0.90
0.70
0.40
0.25
0.19
0.12
3.1
2.9
3.1
2.9
4.6
4.4
0.40
0.30
0.40
0.30
mm
0.80
0.75
0.26
0.3
0.95
0.1
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
94-01-25
95-01-24
SOT144-1
1997 Dec 12
11
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
SOLDERING
Introduction
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
1997 Dec 12
12
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Dec 12
13
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
NOTES
1997 Dec 12
14
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
NOTES
1997 Dec 12
15
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04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Indonesia: see Singapore
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Uruguay: see South America
Vietnam: see Singapore
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
Middle East: see Italy
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Internet: http://www.semiconductors.philips.com
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1997
SCA54
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
417087/1200/03/pp16
Date of release: 1997 Dec 12
Document order number: 9397 750 03142
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