PCA9420 [NXP]

Power management IC for low-power microcontroller applications;
PCA9420
型号: PCA9420
厂家: NXP    NXP
描述:

Power management IC for low-power microcontroller applications

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PCA9420  
Power management IC for low-power microcontroller  
applications  
Rev. 2 — 26 January 2021  
Product data sheet  
1 General description  
The PCA9420 is a highly-integrated Power Management IC (PMIC), targeted to provide  
a full power management solution for low power microcontroller applications or other  
similar applications.  
The device consists of a linear battery charger capable of charging up to 315 mA current.  
It has an I2C programmable Constant Current (CC) and Constant Voltage (CV) values  
for flexible configuration. Various built-in protection features such as input overvoltage  
protection, overcurrent protection, thermal protection, etc. are also provided for safe  
battery charging. It also features JEITA compliant charging.  
The device also integrates two step-down (buck) DC/DC converters which have I2C  
programmable output voltage. Both buck regulators have integrated high-side and low-  
side switches and related control circuitry, to minimize the external component counts;  
a Pulse-Frequency Modulation (PFM) approach is utilized to achieve better efficiency  
under light load condition. Other protection features such as overcurrent protection,  
under-voltage lockout (UVLO), etc. are also provided. By default, the input for these  
regulators is powered by either VIN or VBAT, whichever is greater.  
In addition, two on-chip LDO regulators are provided to power up various voltage rails in  
the system.  
Other features such as FM+ I2C-bus interface, chip enable, interrupt signal, etc. are also  
provided.  
The chip is offered in 2.09 mm x 2.09 mm, 5 x 5 bump, 0.4 mm pitch WLCSP package;  
and 3 mm x 3 mm, 24-pin QFN package.  
2 Features and Benefits  
Linear battery charger for charging single cell li-ion battery  
20 V tolerance on VIN pin  
Programmable input OVP (5.5 V or 6 V)  
Programmable constant current (up to 315 mA) and pre-charge low voltage current  
threshold  
Programmable constant voltage regulation  
Programmable automatic recharge voltage and termination current threshold  
Built-in protection features such as input OVP, battery SCP, thermal protection  
JEITA compliant  
Battery attached detection  
Over-temperature protection  
 
 
NXP Semiconductors  
PCA9420  
Power management IC for low-power microcontroller applications  
Two step-down DC/DC converters  
Very low quiescent current  
Programmable output voltage  
SW1: core buck converter, 0.5 V~1.5 V output, 25 mV/step, and a fixed 1.8 V, up to  
250 mA  
SW2: system buck converter, 1.5 V~2.1 V/2.7 V~3.3 V output, 25 mV/step, up to  
500 mA  
Low power mode for extra power saving  
Two LDOs  
Programmable output voltage regulation  
LDO1: always-on LDO, 1.70 V~1.90 V output, 25 mV/step, up to 1 mA  
LDO2: system LDO, 1.5 V~2.1 V/2.7 V~3.3 V output, 25 mV/step, up to 250 mA  
1 MHz I2C-bus slave interface  
-40 °C ~ +85 °C ambient temperature range  
Offered in 5 x 5 bump-array WLCSP and 24-pin QFN package  
3 Applications  
Low power microcontroller application  
4 Ordering information  
Table 1.ꢀOrdering information  
Type number  
Topside Package  
marking  
Name  
Description  
Version  
PCA9420BS  
PCA9420UK  
420  
HVQFN24  
plastic thermal enhanced very thin quad flat package; no SOT905-1  
leads; 24 terminals; body 3 x 3 x 0.85 mm  
9420  
WLCSP25  
wafer level chip-scale package, 25 terminals, 0.4 mm  
pitch, 2.09 mm x 2.09 mm x 0.525 mm body  
SOT1401-4  
4.1 Ordering options  
Table 2.ꢀOrdering options  
Type number Orderable part Package  
number  
Packing method  
Minimum order  
quantity  
Temperature range  
PCA9420BS  
PCA9420BSAZ HVQFN24  
REEL 7" Q2 NDP  
1400  
3000  
-40°C to +85°C  
-40°C to +85°C  
PCA9420UK PCA9420UKZ  
WLCSP25  
REEL 7" Q1 DP CHIPS  
PCA9420  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2021. All rights reserved.  
Product data sheet  
Rev. 2 — 26 January 2021  
2 / 82  
 
 
 
 
 
NXP Semiconductors  
PCA9420  
Power management IC for low-power microcontroller applications  
5 Simplified block diagram  
Reverse  
Blocking  
VIN  
VIN ≤ 6V  
2.2µF/  
ASYS  
4.7µF/  
10V  
OVP  
Detection  
10V  
Thermal  
Max 315mA  
If VIN is greater than 6V, the  
voltage rating on the capacitor of  
2.2µF/10V shall be changed to a  
higher voltage than a maximum  
voltage in applications.  
Regulation (5.5V default or  
6V over I2C)  
VBAT  
Linear Charger  
(80°C to  
EN  
115°C)  
1µF/  
10V  
1
2
A programmed  
ICHG_CC  
X
I2  
C
Battery  
absence  
detection  
+ (VBAT)  
1-Cell  
Li-Ion  
Battery  
Watchdog  
(disable, 16s,  
32s, 64s)  
ASYS_  
Pre-  
warning  
+
-
100mV  
- (GND)  
+
VIN_  
UVLO  
200mV  
Input Current Limit (typical): 85mA, 255mA, 425mA, 595mA, 765mA, 935mA,  
1105mA, or disable  
-
3.3V,3.4V,  
3.5V (default),3.6V  
Linear charger: 0mA to 315mA in 5mA steps for charge current  
2.9V,3.1V(default),  
3.3V,3.5V  
*
: Regardless of mode setting  
+
ASYS_  
UVLO  
Regulator  
TDIE  
+
Default (V)* Output Range  
1.0  
Resolution Max Current  
100mV  
Thermal  
shutdown  
-
20°C  
-
BUCK1  
BUCK2  
0.5V to 1.5V and fixed 1.8V  
25mV  
250mA  
500mA  
(MTP)  
1.8  
(MTP)  
1.8  
1.5V to 2.1V or 2.7V to 3.3V 25mV  
2.4V,2.5V, 2.6V,  
2.7V (default)  
3-bit  
programmable  
(95°C to 125°C  
in 5°C steps)  
25mV  
25mV  
LDO1  
LDO2  
1.7V to 1.9V  
1mA  
(MTP)  
3.3  
(MTP)  
1.5V to 2.1V or 2.7V to 3.3V  
250mA  
TDIE  
20°C  
+
-
Thermal  
warning  
PSYS1  
ASYS  
1µF/  
10V  
2-bit  
STEP-DOWN  
CONVERTER 1  
250mA  
(0.5V-1.5V  
in 25mV steps  
& fixed 1.8V)  
programmable  
(75°C to 90°C  
in 5°C steps)  
PGND1  
2.2µH  
Default:1.0V  
ENTER  
SHIP_EN_x=1  
VDDCORE  
LX1  
SHIP  
MODE  
EXIT  
10µF/  
6.3V  
Valid VIN  
2.5V  
OR  
or VBAT  
SW1_OUT  
I2  
C
50Ω  
EN  
1MΩ  
Debounce  
Filter  
Power-on  
from off or  
ship-mode  
ON  
OFF  
(200µs)  
On-Key  
ON  
PSYS2  
Valid VIN  
ASYS  
2.2µF/  
10V  
STEP-DOWN  
CONVERTER 2  
500mA  
SHIP_WKUP_CFG=0  
PGND2  
2.2µH  
PCA9420  
Long-Key  
Debounce  
Filter  
(4s, 8s(default)  
,12s,16s)  
Default:1.8V  
VDDIO_1,2,3,  
and/or 4  
(1.5V-2.1V in  
25mV steps)  
(or 2.7V-3.3V  
in 25mV steps)  
Recycle  
Power rails  
LX2  
Main  
Control  
Blocks  
10µF/  
6.3V  
VDD1V8 and  
other 1.8V power  
SW2_OUT  
Add 1.2V  
offset  
I2  
C
50Ω  
Power-down  
sequence  
i.MXRT*  
RT600  
PWR_DN_EN=1  
EN  
VDDIO_1  
+
-
VBAT_  
BKUP_  
UVLO  
100mV  
SCL  
Option  
Option: can be remove if an  
PMIC_I2C_SCL  
(VDDIO_1)  
VBAT  
1.9V  
Up to 1MHz  
VBAT_BKUP  
internal pull-up is available  
R
I2C Interface  
on i.MXRT* device  
SDA  
INTB  
PMIC_I2C_SDA  
(VDDIO_1)  
0.47µF/  
6.3V  
ASYS  
VDD_AO1V8  
Coin  
battery  
IN  
R1  
R2  
PMIC_IRQN  
(VDD_AO1V8)  
LDO1  
1mA  
Interrupts  
LDO1_OUT  
VDD_AO1V8  
Always-on  
1.8V  
(1.7V-1.9V  
in 25mV steps)  
1µF/  
6.3V  
50Ω  
SYSRSTn  
R1=R2=20kΩ to 220kΩ  
RESETN  
(VDD_AO1V8)  
Power-Good  
&
Reset  
I2  
C
EN  
EN  
ASYS  
IN  
I2  
C
i.MXRT*  
RT600  
ASYS  
LDO2  
250mA  
Default:  
3.3V  
LDO2_OUT  
50µA  
5µA  
VDDIO_1,2,3,  
and/or 4  
(1.5V-2.1V in  
25mV steps)  
(or 2.7V-3.3V  
in 25mV steps)  
2.2µF/  
6.3V  
50Ω  
USB1_VDD3V3  
and other  
3V power  
TS  
ADC  
NTC  
Control  
Block  
Add 1.2V  
offset  
I2  
C
NTC  
Can be connected to any ADC  
β
selction  
EN  
I2C  
MODESEL0  
MODESEL1  
PMIC_MODE0  
(VDD_AO1V8)  
3-bit programmable  
From 3434k to 4750k  
MODE  
SELECTION  
PMIC_MODE1  
(VDD_AO1V8)  
EN_MODE_SEL_BY_PIN_x=1 (x can be 0, 1, 2 or 3)  
25-Bump WLCSP, 0.4mm pitch,  
2.09mm x 2.09mm  
Note: All directions for the arrows in the schematic are  
made from the PCA9420 perspective.  
MODESEL1  
MODESEL0 Output Voltage Setting  
LOW (0)  
LOW (0)  
HIGH (1)  
HIGH (1)  
LOW (0)  
HIGH (1)  
LOW (0)  
HIGH (1)  
Mode Setting 0  
Mode Setting 1  
AGND1 AGND2  
AGND3  
Mode Setting 2  
Mode Setting 3  
Short on PCB  
aaa-033067  
Figure 1.ꢀSimplified block diagram  
PCA9420  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2021. All rights reserved.  
Product data sheet  
Rev. 2 — 26 January 2021  
3 / 82  
 
 
NXP Semiconductors  
PCA9420  
Power management IC for low-power microcontroller applications  
6 Pinning information  
6.1 Pinning  
terminal 1  
index area  
LX2  
1
2
17 ASYS  
16 VIN  
PSYS2  
PCA9420BS  
SW2_OUT  
3
15 LDO2_OUT  
Exposed pad  
ON  
4
5
14 TS  
SCL  
13 VBAT_BKUP  
aaa-033076  
Transparent top view  
Figure 2.ꢀPCA9420BS pinout (HVQFN24) – top view  
pin A1  
index area  
1
3
5
2
4
PSYS  
1
PGND  
1
PGND  
2
VBAT  
LX1  
A
B
SW1_  
OUT  
AGND  
1
SW2_  
OUT  
ASYS  
VIN  
LX2  
AGND  
2
PSYS  
2
TS  
ON  
C
D
E
LDO2  
_OUT  
VBAT_  
BKUP  
SYS  
RSTn  
INTB  
SCL  
LDO1  
_OUT  
AGND  
3
MODE  
SEL1  
MODE  
SEL0  
SDA  
aaa-033077  
Figure 3.ꢀPCA9420UK pinout (WLCSP25) – top view  
PCA9420  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2021. All rights reserved.  
Product data sheet  
Rev. 2 — 26 January 2021  
4 / 82  
 
 
 
 
NXP Semiconductors  
PCA9420  
Power management IC for low-power microcontroller applications  
6.2 Pin description  
Table 3.ꢀPin Description  
Symbol  
Pin  
Pin Type  
Description  
HVQFN24  
WLCSP25  
INPUT SUPPLY  
VIN  
16  
C1  
P
Input supply voltage. Bypass with a 2.2µF/10V ceramic  
capacitor. If VIN is greater than 6V, the voltage rating shall  
be changed to a higher voltage than the maximum voltage  
in applications.  
ASYS  
17  
13  
B1  
D2  
P
P
Bypass output of VIN and input supply voltage for LDO2,  
connect with a typical 4.7µF or 10µF/10V decoupling  
capacitor.  
VBAT_BKUP  
Backup battery input voltage. LDO1 is powered by the  
greater of ASYS or VAT_BKUP. If a back-up battery with a  
coin cell is not connected, connect the pin to VBAT power  
domain. Connect with a typical 0.47µF/6.3V decoupling  
capacitor.  
LINEAR CHARGER  
VBAT  
18  
A1  
C2  
P
I
Battery (+) connection point. A typical 1µF/10V decoupling  
capacitor should be connected between VBAT to system  
ground.  
TS  
14  
Battery temperature sensing pin. An external thermistor is  
connected between TS pin and system ground.  
BUCK1 STEP_DOWN CONVERTER (SW1)  
PSYS1  
20  
A2  
P
Input supply for SW1. Bypass with a typical 1µF/10V  
ceramic capacitor. Connect to ASYS power domain as short  
as possible in the system.  
LX1  
22  
19  
23  
A3  
B2  
A4  
P
I
Switching node for SW1. Connect to a 2.2µH inductor.  
Feedback pin. Bypass with a 10µF/6.3V ceramic capacitor.  
SW1_OUT  
PGND1  
P
Power ground for buck 1 (SW1). Connect ground nodes of  
two bypass capacitors for PSYS1 and SW1_OUT as close  
to PGND1 pin as possible in the system.  
BUCK2 STEP_DOWN CONVERTER (SW2)  
PSYS2  
2
C5  
P
Input supply for SW2. Bypass with a typical 2.2µF/10V  
ceramic capacitor. Connect to ASYS power domain as short  
as possible in the system.  
LX2  
1
B5  
B4  
A5  
P
I
Switching node for SW2. Connect to a 2.2µH inductor.  
Feedback pin. Bypass with a 10µF/6.3V ceramic capacitor.  
SW2_OUT  
PGND2  
3
24  
P
Power ground for buck 2 (SW2). Connect ground nodes of  
two bypass capacitors for PSYS2 and SW2_OUT as close  
to PGND2 pin as possible in the system.  
LOW_DROPOUT REGULATORS (LDO1 and LDO2)  
LDO1_OUT  
12  
E1  
P
LDO1 output. It is always-ON supply. The input supply is a  
higher voltage between ASYS and VBAT_BKUP. Bypass  
with a 1µF/6.3V ceramic capacitor.  
PCA9420  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2021. All rights reserved.  
Product data sheet  
Rev. 2 — 26 January 2021  
5 / 82  
 
 
NXP Semiconductors  
PCA9420  
Power management IC for low-power microcontroller applications  
Table 3.ꢀPin Description...continued  
Symbol  
Pin  
Pin Type  
Description  
HVQFN24  
15  
WLCSP25  
LDO2_OUT  
D1  
P
LDO2 output. The input supply is ASYS. Bypass with a  
2.2µF/6.3V ceramic capacitor.  
LOGIC INPUTS  
ON Pin with an internal pull-up resistor, 1MΩ typ, to either  
2.5V or VBAT. Refer to Section 8.3 for more details.  
ON  
4
C4  
I
MODESEL0  
7
8
E4  
E3  
I
I
Mode selection input pin #1  
Mode selection input pin #2  
MODESEL1  
LOGIC OUTPUTS  
Interrupt output, Open-drain type. Place a pull-up resistor  
from 20kΩ to 220kΩ to a system I/O supply rail.  
INTB  
10  
11  
D4  
D3  
O
O
Reset output for external MCU, Open-drain type. Place a  
pull-up resistor from 20kΩ to 220kΩ to a system I/O supply  
rail.  
SYSRSTn  
SERIAL I2C INTERFACE  
I2C Interface clock pin. Place a pull-up resistor between  
2.2kΩ and 10kΩ to a system I/O supply rail.  
I2C Interface data pin. Place a pull-up resistor between  
2.2kΩ and 10kΩ to a system I/O supply rail.  
SCL  
SDA  
5
6
D5  
E5  
I
I/O  
DEVICE GROUND  
AGND1  
AGND2  
AGND3  
9
B3  
C3  
E2  
P
P
P
Analog ground. It shall be connected to system ground  
through a via. Do not connect AGND1 and AGND2 to  
PGND1 or PGND2 on the top PCB layer in the system.  
21  
Exposed  
Pad  
Exposed pad. Connect to system ground  
P = Power, I = Input, I/O = input/output  
PCA9420  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2021. All rights reserved.  
Product data sheet  
Rev. 2 — 26 January 2021  
6 / 82  
NXP Semiconductors  
PCA9420  
Power management IC for low-power microcontroller applications  
7 System configuration diagram  
If VIN is greater than 6V, the voltage  
rating on the capacitor of 2.2µF/10V  
shall be changed to a higher  
voltage than a maximum voltage  
in applications.  
A1  
VBAT  
1µF/  
10V  
Input Current Limit (typical): 85mA, 255mA, 425mA, 595mA, 765mA, 935mA,  
1105mA, or disable  
Linearcharger: 0mA to 315mA in 5mA steps for charge current  
+ (VBAT)  
1-Cell  
Li-Ion  
Battery  
Input Supply  
* : Regardless of mode setting  
VIN ≤ 6V C1  
VBUS  
VIN  
Default (V)*  
2.2µF/  
10V  
Regulator  
Output Range  
Resolution Max Current  
1.0  
(MTP)  
1.8  
(MTP)  
1.8  
(MTP)  
3.3  
(MTP)  
BUCK1  
BUCK2  
0.5V to 1.5V and fixed 1.8V  
25mV  
250mA  
500mA  
- (GND)  
1.5V to 2.1V or 2.7V to 3.3V 25mV  
GND  
B1  
ASYS  
25mV  
25mV  
LDO1  
LDO2  
1.7V to 1.9V  
1mA  
4.7µF/  
10V  
1.5V to 2.1V or 2.7V to 3.3V  
250mA  
C4  
ON  
OFF  
On-Key  
button  
A2  
A4  
ON  
If the pin is not used,  
leave the pin open  
PSYS1  
PGND1  
1µF/  
10V  
2.2µH  
Default:1.0V  
A3  
B2  
VBAT  
LX1  
VDDCORE  
10µF/  
6.3V  
D2  
VBAT_BKUP  
0.47µF/  
6.3V  
SW1_OUT  
If a coil cell is not used, tie  
with the VBAT power domain  
Coin  
battery  
E1  
C5  
A5  
VDD_AO1V8  
LDO1_OUT  
ASYS  
2.2µF/  
10V  
PSYS2  
PGND2  
Always-on  
1.8V  
1µF/  
6.3V  
PCA9420  
i.MXRT  
RT5xx  
RT6xx  
2.2µH  
Default:1.8V  
B5  
B4  
VDDIO_1,2,3,  
and/or 4  
LX2  
10µF/  
6.3V  
VDD1V8 and  
other 1.8V power  
SW2_OUT  
Default:  
3.3V  
D1  
VDDIO_1,2,3,  
and/or 4  
i.MXRT  
RT5xx  
RT6xx  
LDO2_OUT  
2.2µF/  
6.3V  
VDDIO_1  
Option  
USB1_VDD3V3  
and other  
3V.3V power  
D5  
E5  
PMIC_I2C_SCL  
(VDDIO_1)  
SCL  
Option: can be removed if an  
internal pull-up R is available  
on i.MXRT* device  
If the pin is not used,  
leave the pin open  
E4  
E3  
PMIC_MODE0  
(VDD_AO1V8)  
PMIC_I2C_SDA  
(VDDIO_1)  
MODESEL0  
SDA  
INTB  
VDD_AO1V8  
PMIC_MODE1  
(VDD_AO1V8)  
MODESEL1  
R1  
R2  
D4  
D3  
PMIC_IRQN  
(VDD_AO1V8)  
(x can be 0, 1, 2 or 3)  
EN_MODE_SEL_BY_PIN_x=1  
MODESEL1  
MODESEL0 Output Voltage Setting  
LOW (0)  
LOW (0)  
HIGH (1)  
HIGH (1)  
LOW (0)  
HIGH (1)  
LOW (0)  
HIGH (1)  
Mode Setting 0  
RESETN  
(VDD_AO1V8)  
SYSRSTn  
Mode Setting 1  
Mode Setting 2  
Mode Setting 3  
R1=R2=100-220kΩ  
C2  
If the pin is not used,  
leave the pin open  
Note: All directions for the arrows in the  
schematic are made from the PCA9420  
perspective.  
ADC  
TS  
Can be connected to any ADC  
NTC  
25-Bump WLCSP, 0.4mm pitch,  
2.1mm x 2.1mm  
AGND1 AGND2  
AGND3  
E2  
B3  
C3  
aaa-033078  
Short on PCB  
Figure 4.ꢀSystem configuration diagram; i.MXRT series  
PCA9420  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2021. All rights reserved.  
Product data sheet  
Rev. 2 — 26 January 2021  
7 / 82  
 
 
NXP Semiconductors  
PCA9420  
Power management IC for low-power microcontroller applications  
VIN  
LDO1_OUT  
(AO_LDO)  
VDD_BAT  
VDD_IO  
ASYS  
PSYS1  
PSYS2  
LDO2_OUT  
(System LDO)  
PGND  
VBAT_BKUP  
LX1  
VDD_CORE  
SW1_OUT  
(Core Buck)  
K4 Family MCU  
PCA9420  
VBAT  
TS  
VDD_SYS  
LX2  
Battery  
Pack  
SW2_OUT  
(SYS Buck)  
T
SYSRSTn  
MODESEL0  
MODESEL1  
ON  
RESET_n  
SPM_LPREQ  
RTC_WAKEUP_n  
LPI2Cn_SCL  
SCL  
AGND1/2/3  
LPI2Cn_SDA  
SDA  
INTB  
GPIO_n  
aaa-033079  
Figure 5.ꢀSystem configuration diagram; K4-family MCU  
PCA9420  
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Power management IC for low-power microcontroller applications  
8 Functional description  
8.1 ASYS  
The ASYS pin serves as the input power pin for SW1, SW2 and LDO2. Internally by  
default it’s powered by either VIN or VBAT, whichever is greater. The internal ASYS input  
selection circuit ensures a seamless transition when its input source changes from VIN to  
VBAT, or vice versa.  
Through I2C register setting selection (SYS_INPUT_SEL [1:0]), the user also has the  
option to choose the ASYS input source. However, upon power cycling and/or chip reset,  
the ASYS input source goes back to the default setting (option 1 below).  
SYS_INPUT_SEL [1:0]  
1. 2b’00: From either VBAT or VIN, whichever is greater (default setting);  
2. 2b’01: From VBAT only;  
3. 2b’10: From VIN only;  
4. 2b’11: Disconnect from VBAT or VIN (not a normal operation condition, for test  
purposes only).  
An I2C programmable pre-warning ASYS voltage threshold (ASYS_PRE_WARNING  
[1:0]) can also be used to indicate when ASYS voltage drops below the ASYS pre-  
warning threshold voltage, which triggers an interrupt event.  
If any peripheral regulators are connected to ASYS node, the ASYS node follows a VIN  
voltage up to a programmed OVP threshold (either 5.5V or 6V) with a various voltage  
difference depending on a load current.  
8.2 VBAT_BKUP (back-up battery input)  
Internally, the input power source for LDO1 is provided by either VBAT_BKUP or ASYS,  
whichever is greater. When a coin cell battery (or similar battery) is used in the system  
as a backup battery, it can be connected to VBAT_BKUP; thus the LDO1 is powered  
by either ASYS or the backup battery. When no such backup battery is used, the  
VBAT_BKUP pin should always be connected to VBAT.  
8.3 ON  
The ON pin has the following functions implemented:  
1. ON pin has internal 1MΩ pull-up resistor to either 2.5V or VBAT depending on VBAT  
voltage. If VBAT is less than 3V, ON is pulled up to 2.5V and if VBAT is greater than  
3V, it is pulled to VBAT.  
Falling edge (filtered after deglitching time, 200µs typ), active-low signal enables the  
chip. If the chip stays in ship mode before applying ON falling edge, upon the filtered  
falling edge of the ON pin, the chip exits ship mode to start up into Mode Setting 0.  
If the device is already in the middle of power-up or power-down sequence, the falling  
edge applied on the ON pin is ignored by the chip.  
1. Long press (duration time, 4s, 8s, 12s or 16s, is programmable via I2C,  
ON_GLT_LONG [1:0]). If the logic low signal is applied continuously over a  
programmed duration, the chip gets reset and recycles all power rails to their default  
values  
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Power management IC for low-power microcontroller applications  
2. Also, in mode setting 0, 1, 2, or 3, an I2C bit “ON_CFG_x“ (x=0, 1, 2, or 3) is reserved;  
by setting its value to either 0 or 1, the user can configure whether a mode setting  
switches back to Mode Setting 0 or not, upon a valid falling edge detected from “ON”  
pin. Refer to ON_CFG_x bit description in the relation registers for more details.  
3. The filtered falling edge on the ON pin resets the bit of EN_MODE_SEL_BY_PIN_A to  
the default value, 0, at 22h register.  
8.4 TS  
With the temperature sensing pin, the external thermistor (NTC) is connected between  
the TS pin and ground. The thermistor may be included in the battery pack to monitor the  
battery pack temperature, or it may be an additional component user chooses to have on  
the board level to monitor the temperature at a chosen area.  
The voltage at TS pin is monitored, and the user can enable the feature through I2C-bus  
interface (NTC_EN) to implement JEITA compliant charging at a safe temperature. Per  
JEITA standard, there are four temperature threshold settings:  
1. Cold threshold (T1, 0°C as example)  
2. Cool threshold (T2, 10°C as example)  
3. Warm threshold (T3, 45°C as example)  
4. Hot threshold (T4, 60°C as example)  
Each of the above temperature thresholds represents a voltage threshold. When the  
monitored temperature, T, falls into a different temperature zone, the charger should  
adjust the charging method accordingly:  
1. T > T4 or T < T1, i.e., when the temperature is in a “cold” or “hot” zone, charging is  
suspended, as well as the safety timer;  
2. T1 < T < T2, charging current is reduced by 50% of the programmed current level;  
3. T2 < T < T3, normal charging;  
4. T3 < T < T4, the CV mode regulating voltage should be set as VBAT_REG [5:0] –  
ΔVBAT_REG(HOT), 140mV typical  
To disable this function, set NTC_EN to “0”.  
8.5 Mode setting  
When the MCU operates in different modes such as overdrive run mode or low power  
mode, it may require the power supply to operate in different settings accordingly (for  
example, enable/disable of each rail, output voltage of each rail, etc.) to achieve a better  
performance and efficiency.  
On the PCA9420, there are four modes of registers representing Mode Setting A/B/C/  
D to accommodate such requirements from MCU, where Mode Setting A is the default  
mode setting (i.e., the initial mode setting upon initial power up). Depending on the user’s  
preference, switching among different mode settings can be controlled by either the  
external signal (ON pin), external pins (MODESEL0/1) or I2C.  
Within each mode setting, the user can program the follow parameters providing great  
flexibility to accommodate different MCU operation modes:  
1. Enable/disable of the four output voltage rails  
2. Voltage setting of the four output voltage rails  
3. Ship mode enable/disable  
4. Watchdog timer setting  
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Power management IC for low-power microcontroller applications  
5. Mode control selection (EN_MODE_SEL_BY_PIN_x, x=0, 1, 2, or 3)  
EN_MODE_SEL_BY_PIN_x = 0: under current mode setting, mode setting switch is  
controlled by internal I2C register bits MODE0_I2C and/or MODE1_I2C only; signal  
applied on external MODESEL0/MODESEL1 pins is ignored.  
EN_MODE_SEL_BY_PIN_x = 1: under current mode setting, mode setting switch is  
controlled by signal applied on external MODESEL0 and/or MODESEL1 pins only, not by  
internal I2C register bits MODE0_I2C and MODE1_I2C.  
1. Mode setting switches back to Mode Setting A triggered by ON pin falling edge. Refer  
to register description for “ON_CFG_x” bit for more details.  
In the event of switching from one mode setting (initial mode setting) to another mode  
setting (target mode setting):  
1. If one output rail remains enabled in both initial mode setting and target mode setting  
but with different output voltage in each setting, such voltage transition should happen  
when the mode setting switch command (from either internal I2C setting or external  
signal) is received;  
2. If there are output rails which may be enabled or disabled from initial mode setting to  
target mode setting, then always make sure these rails which change from disabled  
to enabled take higher priority over rails which change from enabled to disabled, i.e.,  
make sure all the rails change from disabled status to enabled status (reaches 90% of  
its target value) first, and then start to disable these rails, changing from enable status  
to disable status.  
8.6 Mode selection by external pins (MODESEL0, MODESEL1)  
Up on initial power-up, PCA9420 enters its default setting (Mode Setting  
0). While operating under Mode Setting 0, by default the I2C register bit,  
EN_MODE_SEL_BY_PINEN_MODE_SEL_BY_PIN_0, is set to “0”, and the external  
signal applied on the MODESEL0 and MODESEL1 pins are ignored. Only when the user  
sets EN_MODE_SEL_BY_PINEN_MODE_SEL_BY_PIN_0 to “1”, can the mode control  
on the chip be programmed via MODESEL0 and MODESEL1 pin signal settings.  
Table 4.ꢀMode Selection by external pins (MODESEL0, MODESEL1)  
MODESEL1 pin voltage level  
MODESEL0 pin voltage level  
All Settings from  
Mode Setting 0  
Mode Setting 1  
Mode Setting 2  
Mode Setting 3  
LOW (0)  
LOW (0)  
HIGH (1)  
HIGH (1)  
LOW (0)  
HIGH (1)  
LOW (0)  
HIGH (1)  
8.7 SYSRSTn  
The SYSRSTn is implemented as an open-drain output signal. It is used as an output of  
“power-good” indication as well as to reset the microcontroller system.  
The SYSRSTn signal is held from high to low under one of following conditions:  
1. When any of the enabled voltage rail output voltage drops below 90% (typ) of its  
target value.  
2. When any of the enabled voltage rail output voltage goes above 110% (typ) of its  
target value  
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Power management IC for low-power microcontroller applications  
If any of the voltage rail is disabled by the user (by setting the corresponding enable  
bit in I2C register in each mode setting, i.e., LDO1_EN_x, LDO2_EN_x, SW1_EN_x,  
SW2_EN_x), the SYSRSTn signal should NOT assert (stays high) under such scenario.  
This also applies during the power-up/power-down sequence events, i.e., during power-  
up or power-down event, the SYSRSTn signal should assert when any of the enabled rail  
has not reaches the 90% ~ 110% of its target value. In other words, the SYSRSTn = 0  
(low) needs to remain at such state until all enabled rails reach 90% of the target values.  
1. When a programmed watchdog timer expires (only when watchdog timer is enabled)  
Once the condition that caused the SYSRSTn signal to go low is removed, then the  
SYSRSTn should refresh accordingly.  
Meanwhile, during the voltage change on-the-fly, this could be caused by:  
1. Mode setting remains the same, but the user chooses to change one or some of the  
enabled output rail voltage by programming its output voltage I2C register setting  
2. Mode setting changes by setting different values on MODESEL0/MODESEL1 pins or  
MODE0_I2C/MODE1_I2C bits, and it causes one or some of the output rail voltage  
change  
In such case, the SYSRSTn signal does NOT assert when any of the enabled voltage  
rail output voltage is in the middle of the transition from initial output voltage level to  
target level.  
8.8 SHIP mode  
PCA9420 features a “SHIP mode”, in which the chip provides the lowest quiescent  
consumption.  
To enter the SHIP mode, set the bit of SHIP_EN_x (x can be 0, 1, 2 or 3) in each Mode  
register to 1. Once the bit is set to 1, the ship mode immediately takes place regardless  
of any operation under any mode setting. It means that the SHIP mode has a higher  
priority over any conditions and operations.  
Upon request to enter the ship mode while the device is running in active mode, a power-  
down sequence should take place first and then enter the ship mode. Once the device  
enters ship mode, all the I2C register values are reset to their default setting.  
To exit ship mode, one of the following conditions must be satisfied:  
1. ON pin falling edge (filtered) applied, less than the long-press duration of time  
2. A valid VIN attached. For the VIN attached plugin event, depending on  
OPERATION_SEL_FROM_SHIPMODE bit setting, there are two possible operations  
as described below:  
a. OPERATION_SEL_FROM_SHIPMODE=0, upon VIN attached, the chip enables  
the charging process, as well as start the power-up sequence for LDO1/LDO2/  
SW1/SW2 per the setting  
b. OPERATION_SEL_FROM_SHIPMODE=1, upon VIN attached, the chip enables  
the charging process, LDO1/LDO2/SW1/SW2 remains in shutdown mode and the  
chip will only enable the power-up sequence upon ON pin falling edge signal.  
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Power management IC for low-power microcontroller applications  
8.9 Watchdog timer  
PCA9420 provides an on-chip watchdog timer, the duration of this watchdog can be  
programmed via I2C register setting (WD_TIMER_x [1:0] in each mode configuration  
registers), or disabled if needed in each mode setting.  
Upon initial enable, the watchdog timer starts counting. If the watchdog timer expires  
before reset, an interrupt signal is issued (WD_TIMER). Depending on the I2C register  
setting (nEN_CHG_IN_WATCHDOG), the following action is also taken:  
1. nEN_CHG_IN_WATCHDOG = 0: when the watchdog timer expires, the following  
operations are expected.  
The SYSRSTn signal asserted (high to low)  
Charging is continued based on battery condition  
All settings for LDO1/LDO2/SW1/SW2 set to Mode 0 settings  
2. nEN_CHG_IN_WATCHDOG=1: when the watchdog timer expires, the following  
operations are expected.  
The SYSRSTn signal asserted (high to low)  
Charging is suspended  
All settings for LDO1/LDO2/SW1/SW2 set to Mode 0 settings  
The following events reset the watchdog timer:  
1. When WD_TIMER_CLR bit is set to 3b’001 at 0Dh register  
2. When the device changes the mode settings  
8.10 Regulators  
There are four regulators on PCA9420, which include two buck regulators and two LDOs.  
Table 5 shows the outline for each regulator:  
Table 5.ꢀ Regulator summary  
Regulator name  
SW1 (Core Buck)  
SW2 (System Buck)  
Output regulation voltage range  
0.5V ~ 1.5V and a fixed 1.8V  
1.5V ~ 2.1V or 2.7V~3.3V  
Adjustable resolution  
25mV/step  
Max output current  
Up to 250mA  
Up to 500mA  
Up to 1mA  
25mV/step  
LDO1 (Always-on LDO) 1.7V ~ 1.9V  
LDO2 (System LDO) 1.5V ~ 2.1V or 2.7V~3.3V  
25mV/step  
25mV/step  
Up to 250mA  
For each rail, its output target voltage can be set independently in mode setting 0, 1, 2 or  
3. User can also choose to switch among any of the mode settings.  
8.10.1 Enable/disable and active discharge  
Enable/disable: Each rail can be enabled/disabled via I2C register setting independently  
in each mode setting.  
Active discharge: Additionally, there is an active discharge resistor on each rail, and  
the user can choose to enable/disable such feature through I2C register setting, so that  
when the output rail is disabled, it can quickly discharge the output voltage to ground.  
In addition, the active discharge is also enabled during voltage step down. This can be  
disabled by MTP bit.  
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8.10.2 Power-good indication  
There is an output voltage comparator for each rail, comparing the actual output voltage  
against 90% and 110% of its target value; when the actual voltage is between 90% and  
110% of its target value, the read-only related bits in I2C register, Regulator Status_1  
(address: 20h) are updated accordingly to report the output voltage status (Power-good  
Indication). These comparators can be enabled/disabled by setting I2C register bit,  
PG_EN. A corresponding interrupt is triggered if unmasked. During steady state, only  
90% threshold is monitored.  
The power-good indication is shown as “not good”, and refreshes upon the completion of  
any of the following events:  
1. During the power-up sequence stage  
2. During power-down sequence stage  
3. During the on-the-fly change of output voltage  
8.10.3 Power-up/down sequence and on-the-fly voltage change  
Power-up sequence  
The device initiates the default power-up sequence in three different conditions.  
Condition 1) The device is off with no any power supply (No valid VIN and No battery  
with 2.7V or above attached). In this condition, two signals below are able to start the  
default power-up sequence.  
A valid VIN supply on VIN pin  
A voltage on ASYS higher than ASYS_UVLO, a 2.8V typical  
Condition 2) The device stays off by enabling SHIPMODE or in SHIP mode with a  
battery ≥ 2.8V attached. In this condition, two signals are able to start the default power-  
up sequence.  
A valid VIN supply on VIN pin  
A falling edge on ON key over a 200µs  
Condition 3) The device stays off by enabling PWR_DN_EN bit setting to 1 with a  
battery ≥ 2.8V attached. In this condition, only one signal is able to start the default  
power-up sequence.  
A falling edge on ON key over a 200µs  
Condition 4) The device stays at VIN OVP condition with no any valid supply attached  
at VBAT. In result, all enabled power rails have been off. The following condition re-  
initiates the power-up sequence.  
The VIN goes below its VIN OVP hysteresis (typ 100mV)  
The power-up sequence by ON key=Low over the debounce time is described as shown  
in Figure 6.  
For the power-up sequence, the chip can set the default sequence per the customer  
requirement at factory setting (i.e. MTP option), from one of the 64 options. Once the chip  
enters the power-down stage, the power-down sequence is implemented as the reverse  
of the power-up sequence (i.e., first up, last down).  
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Power management IC for low-power microcontroller applications  
The ON Key shall be pulled high  
t
ON_LONG_PRESS  
to avoid power recycle initiated  
by a programmed ON long-Press  
timer expired  
(ON Long-Press Timer, 4s,8s,12s or 16s)  
TON_DEBOUNCE  
=200µs  
ON Key  
TPWDOWN_DLY_INTERVAL  
=2ms  
PWR_DN_EN bit=1  
OR  
Position 1  
90%  
2
3
4 (NOTE)  
SHIP_EN_x bit=1  
Default-On Rails  
Position 4  
3
2
1
TPWUP_DLY_INTERVAL  
=1ms  
SYSRSTn  
CONTROL BY PROCESSOR  
POWER-UP SEQUENCE  
POWER-DOWN SEQUENCE  
POWER-OFF STATE  
NOTE: BUCK1, BUCK2, LDO1 and LDO2 can be assigned to any of position 1-4  
Figure 6.ꢀPower-up/down sequence  
aaa-033080  
On-the-fly output voltage change sequence  
On-the-fly output voltage change is defined as the following: for any output rail, its  
output voltage changes from one level (initial level) to another level (target level). Note  
this assumes the output rail is always enabled before and after the on-the-fly change  
transition. It does not include the case when any output rail is changed from disabled  
state to enabled state, or vice versa.  
If a user prefers to change any rail voltage on-the-fly, depending on the scenarios listed  
below, the chip behavior is described as the following:  
1. While the chip remains in its current operation mode, and the user programs the  
output voltage setting I2C register value or enables/disables any or some of output  
voltage rail(s), the chip simply executes the I2C command  
2. While the user chooses to switch modes, i.e. change mode between any of the two  
mode settings among Mode 0/1/2/3, and if this involves on-the-fly voltage change for  
one or some output rails, such change should occur simultaneously when the chip  
switches from initial mode to the target mode.  
CAUTION: The user should not send an I2C command related to changing the setting of  
the output rails during the power up/down or mode setting change process.  
8.10.4 BUCK1 (SW1, core buck regulator)  
The SW1 supplies the core power.  
Its output voltage can be programmed via I2C from 0.5V to 1.5V at 25mV step and a fixed  
1.8V, which is capable of providing up to 250mA loading. The application circuit uses  
typical 2.2µH inductor and 10µF/6.3V output capacitor.  
8.10.5 BUCK2 (SW2, system buck regulator)  
The SW2 output voltage can be programmed via I2C register from 1.5V to 2.1V, or from  
2.7V to 3.3V in both at 25mV/step and is capable of providing up to 500mA loading. The  
application circuit uses a 2.2µH inductor and 10µF output capacitor.  
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In SW2, a pass-through mode is implemented. When its input (ASYS) is close to the  
output voltage (within typical 200mV), the SW2 enters the pass-through mode operation;  
the high-side switch is fully turned on and the low-side switch is turned off, and the output  
voltage can be calculated as input voltage – (RDSON*ILOAD), where RDSON is the on-  
resistance of the high-side switch, and the ILOAD refers to the load current. When the  
input voltage rises again, so that the voltage different between input and output crosses  
the typical 250mV threshold, the SW2 exits the pass-through mode and re- enters the  
normal switching mode operation.  
While SW2 operates in pass-through mode, protection features such as over-current  
protection are also implemented as well.  
VPSYS2  
50mV  
(VPSYS2 - VSW2_Regulation)=200mV  
Delta V  
VSW2_Regulation  
Delta V=RRDS_ON_High_side x ILOAD  
SW2 in pass-through mode  
SW2 in regulation mode  
SW2 in regulation mode  
aaa-033081  
Figure 7.ꢀPass-Through mode of BUCK2 (SW2)  
8.10.6 LDO1 (always-on LDO)  
The LDO1 (Always-on LDO) output can be programmed from 1.7V to 1.9V at 25mV step,  
depending on the system requirements (selectable through I2C register). Typically, a  
1µF/6.3V MLCC output capacitor providing at least 1mA loading capability is needed.  
8.10.7 LDO2 (system LDO)  
The LDO2 (system LDO) output can be programmed via the I2C register from 1.5V  
to 2.1V, or 2.7V to 3.3V at 25mV/step. Typically, a 2.2µF/6.3V MLCC output capacitor  
providing at least 250mA loading current is needed.  
8.11 Linear battery charger  
The battery charger is a linear charger. Its charging is done through a linear switch with  
the following output protections:  
Reverse current protection  
(triggers when VIN < VBAT+ VIN2BAT_HEADROOM*)  
Charging current limiting  
(a function of programmed threshold and battery temperature)  
VBAT short circuit protection  
short circuit output voltage threshold: (typ 0.8V with 80mV hysteresis)  
Maximum output sourcing current during “short circuit” detection ~ 13mA  
(VIN2BAT_HEADROOM = 100mV, typical)  
If the battery voltage is below the VBAT_LOW threshold, the battery is considered  
discharged and a preconditioning cycle begins. The amount of pre-charge current  
(ICHG_LOW) can be programmed through I2C register setting. This feature is useful  
when there is a load connected directly across the battery (at VBAT pin) “stealing” the  
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battery current. The pre-charge current can be set higher to account for the system  
loading while allowing the battery to be properly conditioned. Once the battery voltage  
has charged to the VBAT_LOW threshold, fast charge is initiated and a programmed fast  
charge current (ICHG_CC) is applied. The fast charge constant current is programmed  
using I2C register. The constant current provides the bulk of the charge. Power  
dissipation in the device is greatest in fast charge with a lower battery voltage.  
If the device reaches a programmed thermal regulation threshold temperature from 85°C  
to 115°C in 5°C steps, the device enters thermal regulation. Thermal regulation increases  
the safe-charging-timer period by 2x and reduces the charge current in half (if the initial  
current is 5mA, it will remain unchanged) to keep the temperature from rising any further  
when battery charger works in constant current charging mode, or at a reduced regulated  
voltage when battery charger works in constant voltage charging mode.  
Figure 8 shows the charging profile with a dead battery condition. Once the cell has  
charged to the regulation voltage (VBAT_REG) the voltage loop takes control and holds  
the battery at the regulation voltage until the current tapers to the termination threshold  
(ICHG_TOPOFF).  
8.11.1 Battery charging management  
Battery charging management supports typical constant current/constant voltage  
charging profile for single cell Li-Ion battery, as well as pre-qualification (dead battery, low  
battery), top-off mode, etc.; JEITA and thermal regulation compliant.  
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VBAT  
3.6V to 4.6V, 20mV steps, 4.2V Default  
BAT_REG  
V
VBAT_RESTART  
(=VBAT_REG-140mV or 240mVtyp)  
VBAT  
tDGL_BAT_RESTART=50ms  
2.5V  
(2.3V,2.4V,2.6V by MTP)  
VBAT_LOW  
1.9V  
(1.7V,1.8V,2V by MTP)  
VBAT_DEAD  
0V  
Time  
Recharge Mode  
(Fast Charge Mode)  
Trickle Charge  
(Dead Battery)  
Mode  
Pre-charge  
(Low-Voltage)  
Mode  
Top-OFF  
Mode  
Fast Charge Mode  
Fast Charge Mode  
Charging Done Mode  
Input & Charge Current  
85mA to 1105mA programmable  
IVIN__LIM  
5mA to 315mA programmable in 5mA steps  
I
CHG_CC  
Shall be updated with 1mA to 20mA Programmable  
in 1mA steps due to top-off problem  
1mA to 63mA programmable  
in 1mA steps  
CHG_LOW  
di/dt=3mA/µs  
I
tDGL_BAT_LOW2CC=50µs  
1mA to 63mA programmable  
in 1mA steps  
Current to battery  
I
CHG_TOPOFF  
ICHG_TOPOFF  
1mA to 63mA programmable  
in 1mA steps  
t
DGL_BAT_CC2TOPOFF=20ms  
I
CHG_DEAD  
ICHG=0mA  
0mA  
OFF  
t
DGL_BAT_DEAD2LOW=50µs  
T
CHG_TOPOFF  
Time  
T
CHG_TOPOFF started  
T
CHG_TOPOFF expired  
15, 30, 45,  
or 60min  
T
CHG_PREQ  
ON  
reset  
3, 5, 7, or 9 hours  
ON  
OFF  
OFF  
T
CHG_FAST  
reset  
0, 6.4, 12.8, or 19.2min  
T
CHG_TOPOFF  
ON  
reset  
aaa-033082  
Figure 8.ꢀTypical Charging Profile Example  
PCA9420  
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Power management IC for low-power microcontroller applications  
Device in non-charging mode  
- VIN < VINUVLO  
- CHG_EN=0 or 1  
- TJ < TJ(OFF), 150°C  
Charging Stopped  
VIN has been validated  
&&  
A programmed watchdog timer expired in  
nEN_CHG_IN_WATCHDOG=1  
&& WD_TIMER_A/B/C/D=2b01, 10, or 11  
or  
Battery attached  
&&  
CHG_EN=1  
TJ ≥ a programmed TSHDN  
or  
One of the safety timers (TCHG_PREQ & TCHG_FAST) expired  
Device in Dead Battery Charging  
- Charge current=ICHG_DEAD  
- TCHG_PREQ started counting  
VBAT ≤ VBAT_DEAD  
Any Charging State  
VBAT > VBAT_DEAD  
&&  
tDGL_BAT_DEAD2LOW, 50µs  
Charging in Thermal Regulation  
_1  
2
- ICHG= (A programmed ICHG_CC) x  
VBAT ≤> VBAT_LOW  
&&  
tDGL_BAT_CC2LOW, 50ms  
Device in Pre-Charge  
(Low Voltage) Mode  
- Charge current=ICHG_LOW  
TJ = A programmed TTHEM_REGULATION  
Any Charging State  
VBAT > VBAT_LOW  
&&  
tDGL_BAT_LOW2CC, 50µs  
Device in Fast Charge Mode  
- Charge current=ICHG_CC  
- TCHG_PREQ reset  
- TCHG_FAST started counting  
ICHG > 2x ICHG_TOPOFF or  
20mA, whichever is lower  
ICHG < ICHG_TOPOFF for  
tDGL_BAT_CC2TOPOFF, 20ms  
VBAT-VBAT_REG ≤ VBAT_RESTART, 140mV typ  
(240mV by MTP)  
&&  
Device in Top-Off Mode  
- TCHG_FAST reset  
- TCHG_TOPOFF started counting  
t
DGL_BAT_RESTART, 50ms  
TCHG_TOPOFF expired  
Device in DONE Mode  
- TCHG_TOPOFF reset  
- ICHG=0mA  
aaa-033083  
Figure 9.ꢀCharger State Diagram  
PCA9420  
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8.11.2 Battery temperature sensing and JEITA-compliant charging profile  
45°C  
10°C  
0°C  
Programmed VBAT_REG  
Hot fault  
No operation  
charge disable  
during cold fault  
Programmed ICHG  
(100%)  
50%  
1.0  
Cold fault  
1.4  
0
0.2  
0.4  
0.6  
0.8  
1.2  
VCOLD  
1.6  
1.8  
VHOT VWARM  
VCOOL  
Termination  
disable  
TS voltage-V  
aaa-033084  
Figure 10.ꢀOperation over TS bias voltage for JEITA  
8.11.3 Low-battery/dead-battery (pre-qualification) charging  
If the battery is detected and VBAT < VBAT_LOW, the charger initiates pre-charging  
using a predefined (I2C register) current.  
When it is under the dead-battery condition, the charging current ICHG_DEAD is  
programmed by ICHG_DEAD [5:0]; and when it is under the low-battery condition, the  
charging current ICHG_LOW is programmed by ICHG_LOW [5:0]. When VBAT ≥ VBAT_LOW  
the charger moves to the next state, fast charging mode.  
,
8.11.4 Constant current charging/constant voltage charging (fast charging) and  
termination  
When VBAT ≥ VBAT_LOW, the charger enters Fast Charge Mode (Constant Current). In this  
state, the battery voltage VBAT continues to rise, while the battery is being charged with  
the current set by ICHG_CC [5:0], until VBAT reaches the maximum allowable voltage  
set by VBAT_REG [5:0].  
At this time, the charger enters the Constant Voltage (CV) mode. While operating in  
the CV mode, the voltage is still regulated at the level set by VBAT_REG [5:0], and the  
charging current continues to decrease.  
When the charging current drops below the top-off current threshold, set by  
ICHG_TOPOFF [5:0], the charger enters TOPOFF mode, and upon expiration of  
TOPOFF timer (set by T_TOPOFF [1:0]), the charger enters DONE mode.  
PCA9420  
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PCA9420  
Power management IC for low-power microcontroller applications  
8.11.5 Charger safety timers  
Two sets of charging safety timers are implemented on PCA9420. These timers  
ensure the charging is terminated if the charging time is longer than its predefined limit  
(programmed via I2C registers) at given states:  
Pre-qualification timer, set by ICHG_PREQ_TIMER [1:0], 15min ~ 60min  
Fast charge timer, set by ICHG_FAST_TIMER [1:0], 3hr ~ 9hr  
8.11.6 Recharging  
While in DONE mode, if the voltage of VBAT stays below (a programmed VBAT_REG –  
140mV or 240mV) over the deglitch time (tDGL_BAT_RESTART), 50ms the battery charger  
resumes back to Constant Current (CC) Mode.  
8.11.7 Starting a new charge cycle  
When a VIN plug in, VBAT attached, or CHG_EN are set to “1”, the device initializes a  
new charging process.  
8.11.8 Battery attach detection  
The device has a unique battery detection scheme with two comparators, 1.9V and 3.4V.  
when the detection scheme is executed, a 5mA current sink is activated to determine  
battery presence by detection the fall threshold, VBAT_DET_LOW, 1.9V typ. In addition,  
a 5mA current source is used to detect battery voltage whether it stays above the  
threshold, VBAT_DET_UP, 3.4V. if both conditions are met, absence of battery is declared.  
8.12 Hardware and software reset  
Please refer to description for ON pin for the hardware reset function by a long time  
ON key pressed. The "software reset” is achieved by setting “1” to SW_RST bit in I2C  
register. If the user writes a “1” to this bit, it resets all other I2C register bits to their default  
setting; this bit is cleared and reset back to “0” as well.  
9 I2C-bus interface and register  
The PCA9420 implements an I2C-bus slave interface to communicate with the host  
system. The interface supports Fast Mode plus Fm+ with up to 1 Mbit/s. A detailed  
description of the I2C-bus specification is given in UM10204, Rev. 06, 4 April 2014 ,“ I2C-  
bus specification and user manual”.  
Features such as clock-stretching and 10-bit slave address are not supported; general  
call is supported by default but can be disabled via metal option. Auto increment with  
address wrap-around is supported as well.  
9.1 I2C slave address  
Following a START condition, the bus master must send the target slave address  
followed by a read or write operation. The slave address of the PCA9420 is shown below:  
PCA9420  
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Power management IC for low-power microcontroller applications  
Table 6.ꢀI2C Slave Address  
Bit 7  
1
Bit 6  
1
Bit 5  
0
Bit 4  
Bit 3  
0
Bit 2  
0
Bit 1  
1
Bit 0  
0/1  
0
Fixed  
Fixed  
Fixed  
MTP option  
Fixed  
Fixed  
Fixed  
R/W  
Bit 4 should be reserved as MTP option, with its default value set as “0” but can be  
trimmed to “1” when needed.  
9.2 General call and device ID addresses  
The device implements two different addresses for general call and device ID.  
9.3 Register type  
There are four register types used on the device:  
Read and Write (R/W)  
Read Only (R)  
Write Only (W)  
Write and Clear (W/C)  
For Write and Clear (W/C), a write to a register with a bit-mask specifies which interrupts  
to clear.  
For example, if the status register shows 8’b0000_1001 as an interrupt status (i.e.  
interrupt [0] and interrupt [3] are both set), user may write 8’b0000_1000, meaning the  
intent is to only clear interrupt [3] (but interrupt [0] should NOT be “cleared”). If the intent  
is to clear both interrupts, then the user could write back 8’b0000_1001.  
9.4 Register map  
Table 7.ꢀRegister map  
Address  
(Hex)  
Register Name  
Description  
Type  
Reset  
Value  
(Binary)  
System Control Registers  
00  
01  
02  
03  
Device Information, DEV_INFO  
Device ID, revision  
R
0000 0000  
0000 0000  
0000 0000  
0011 1111  
Top Level Interrupt Status, TOP_INT Top level interrupt event status  
R/C  
W/C  
R/W  
Sub Level Interrupt_0, SUB_INT0  
Sub-level interrupt indication_0  
Sub Level Interrupt_0 Mask, SUB_  
INT0_MASK  
Sub-level interrupt mask for SUB_  
INT0  
04  
05  
Sub Level Interrupt_1, SUB_INT1  
Sub-level interrupt indication_1  
W/C  
R/W  
0000 0000  
0111 1111  
Sub Level Interrupt_1 Mask, SUB_  
INT1_MASK  
Sub-level interrupt mask for SUB_  
INT1  
06  
07  
Sub Level Interrupt_2, SUB_INT2  
Sub-level interrupt indication_2  
W/C  
R/W  
0000 0000  
1111 1111  
Sub Level Interrupt_2 Mask, SUB_  
INT2_MASK  
Sub-level interrupt mask for SUB_  
INT2  
08  
09  
RSVD  
Reserved  
R/W  
R/W  
0000 0000  
0100 0001  
Top Level Control_0, TOP_CNTL0  
Top level system control_0  
PCA9420  
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PCA9420  
Power management IC for low-power microcontroller applications  
Table 7.ꢀRegister map...continued  
Address  
(Hex)  
Register Name  
Description  
Type  
Reset  
Value  
(Binary)  
0A  
Top Level Control_1, TOP_CNTL1  
Top Level Control_2, TOP_CNTL2  
Top Level Control_3, TOP_CNTL3  
Top Level Control_4, TOP_CNTL4  
RSVD  
Top level system control_1  
Top level system control_2  
Top level system control_3  
Top level system control_4  
Reserved  
R/W  
R/W  
R/W  
W
1000 1001  
1100 1110  
0000 0001  
0000 0000  
0B  
0C  
0D  
0E – 0F  
Battery Charger Control  
Battery Charger Control_0, CHG_  
10  
11  
12  
13  
14  
15  
16  
17  
18  
Battery charger control register_0  
Battery charger control register_1  
Battery charger control register_2  
Battery charger control register_3  
Battery charger control register_4  
Battery charger control register_5  
Battery charger control register_6  
Battery charger control register_7  
Battery charger status indication_0  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R
0000 0011  
0000 1000  
0000 0100  
0000 1000  
0000 0100  
0001 1110  
1001 0101  
0010 0100  
0001 0000  
CNTL0  
Battery Charger Control_1, CHG_  
CNTL1  
Battery Charger Control_2, CHG_  
CNTL2  
Battery Charger Control_3, CHG_  
CNTL3  
Battery Charger Control_4, CHG_  
CNTL4  
Battery Charger Control_5, CHG_  
CNTL5  
Battery Charger Control_6, CHG_  
CNTL6  
Battery Charger Control_7, CHG_  
CNTL7  
Battery Charger Status_0, CHG_  
STATUS_0  
Battery Charger Status_1, CHG_  
STATUS_1  
19  
1A  
Battery charger status indication_1  
Battery charger status indication_2  
R
R
R
0000 0000  
0111 1000  
0000 0000  
Battery Charger Status_2, CHG_  
STATUS_2  
Battery Charger Status_3, CHG_  
STATUS_3  
1B  
Battery charger status indication_3  
Reserved  
1C – 1F  
RSVD  
Regulator Control  
20  
21  
Regulator Status, REG_STATUS  
Regulators status indication  
R
0000 0000  
0000 0000  
Active Discharge Control, ACT_  
DISCHARGE_CNTL_1  
Active Discharge control register  
R/W  
Mode Configuration Mode Setting 0_ Mode configuration settings for  
0, MODECFG_0_0 Mode 0_0  
22  
23  
R/W  
R/W  
R/W  
0001 0100  
0000 1100  
0100 1111  
Mode Configuration Mode Setting 0_ Mode configuration settings for  
1, MODECFG_0_1 Mode 0_1  
Mode Configuration Mode Setting 0_ Mode configuration settings for  
24  
2, MODECFG_0_2  
Mode 0_2  
PCA9420  
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PCA9420  
Power management IC for low-power microcontroller applications  
Table 7.ꢀRegister map...continued  
Address  
(Hex)  
Register Name  
Description  
Type  
Reset  
Value  
(Binary)  
Mode Configuration Mode Setting 0_ Mode configuration settings for  
3, MODECFG_0_3 Mode 0_3  
25  
26  
27  
28  
29  
2A  
2B  
2C  
2D  
2E  
2F  
30  
31  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
0011 1001  
0001 1100  
0100 1100  
0100 1111  
0000 1100  
0001 1100  
0100 1100  
0100 1111  
0000 1100  
0001 1100  
0100 1100  
0100 1111  
0000 1100  
Mode Configuration Mode Setting 1_ Mode configuration settings for  
0, MODECFG_1_0 Mode 1_0  
Mode Configuration Mode Setting 1_ Mode configuration settings for  
1, MODECFG_1_1 Mode 1_1  
Mode Configuration Mode Setting 1_ Mode configuration settings for  
2, MODECFG_1_2 Mode 1_2  
Mode Configuration Mode Setting 1_ Mode configuration settings for  
3, MODECFG_1_3 Mode 1_3  
Mode Configuration Mode Setting 2_ Mode configuration settings for  
0, MODECFG_2_0 Mode 2_0  
Mode Configuration Mode Setting 2_ Mode configuration settings for  
1, MODECFG_2_1 Mode 2_1  
Mode Configuration Mode Setting 2_ Mode configuration settings for  
2, MODECFG_2_2 Mode 2_2  
Mode Configuration Mode Setting 2_ Mode configuration settings for  
3, MODECFG_2_3 Mode 2_3  
Mode Configuration Mode Setting 3_ Mode configuration settings for  
0, MODECFG_3_0 Mode 3_0  
Mode Configuration Mode Setting 3_ Mode configuration settings for  
1, MODECFG_3_1 Mode 3_1  
Mode Configuration Mode Setting 3_ Mode configuration settings for  
2, MODECFG_3_2 Mode 3_2  
Mode Configuration Mode Setting 3_ Mode configuration settings for  
3, MODECFG_3_3  
Mode 3_3  
9.5 Register description  
9.5.1 Device information (DEV_INFO, address 00h)  
The device identification code stores a unique identifier for each version and/or revision  
of device, so that the connected MCU recognizes it automatically.  
This is a READ ONLY register.  
Table 8.ꢀDEV_INFO register bit description  
Bit  
7
Symbol  
Default value Type  
Function  
DEV_ID [4]  
DEV_ID [3]  
DEV_ID [2]  
DEV_ID [1]  
0
0
0
0
R
R
R
R
Device ID  
6
5
4
PCA9420  
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PCA9420  
Power management IC for low-power microcontroller applications  
Table 8.ꢀDEV_INFO register bit description...continued  
Bit  
3
Symbol  
Default value Type  
Function  
DEV_ID [0]  
DEV_REV [2]  
DEV_REV [1]  
DEV_REV [0]  
0
0
0
0
R
R
R
R
2
Device revision  
1
0
9.5.2 Top level interrupt status (TOP_INT, address 01h)  
The top-level interrupt register contains flags indicating various top level interrupt events  
as indicated below. An event will be latched and only its first occurrence triggers the  
interrupt signal INTB (if it is not being masked). Reoccurring events will not change the  
flag's status or trigger an additional interrupt. If multiple interrupt events happen, its  
corresponding interrupt bits in the related registers will be “triggered”, however, the INTB  
signal will be only triggered upon the first interrupt event.  
The interrupt event reporting on the device is structured in a two-layer configuration. The  
interrupt events are grouped as (1) system level; (2) charger block; (3) buck regulator  
block; (4) LDO block. When any interrupt event is triggered, based on which mode it  
falls into, the related bit for that mode in TOP_INT flags “1”. Any of the related bits in  
TOP_INT will only change back to 0 when all the interrupt events in its affiliated mode  
have been cleared.  
This is READ Only register.  
Table 9.ꢀTOP_INT register bit description  
Bit  
7
Symbol  
RSVD  
Default value  
Type  
R
Function  
0
0
0
0
0
Reserved bit  
Reserved bit  
Reserved bit  
Reserved bit  
6
RSVD  
R
5
RSVD  
R
4
RSVD  
R
3
SYS_INT  
R
System level interrupt event trigger indication 0: no system level  
interrupt event triggered 1: system level interrupt event triggered  
2
1
0
CHG_INT  
SW_INT  
LDO_INT  
0
0
0
R
R
R
Linear battery charger block interrupt event trigger indication 0: no  
linear battery charger block interrupt event triggered  
1: linear battery charger block interrupt event triggered  
Buck regulator blocks (SW1, SW2) interrupt event trigger indication 0:  
no interrupt event on SW1 and/or SW2 blocks triggered  
1: interrupt event on SW1 and/or SW2 blocks triggered  
LDO block (LDO1, LDO2) interrupt event trigger indication 0: no  
interrupt event on LDO1 and/or LDO2 blocks triggered 1: interrupt  
event on LDO1 and/or LDO2 blocks triggered  
9.5.3 Sub level interrupt_0 (SUB_INT0, address 02h)  
The sub-level interrupt register contains flags indicating the second-tier interrupt event.  
For this register, it contains system level related interrupt events.  
This is WRITE AND CLEAR register.  
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Power management IC for low-power microcontroller applications  
Table 10.ꢀSub_INT0 register bit description  
Bit  
7
Symbol  
Default value Type  
Function  
RSVD  
0
0
0
0
W/C  
W/C  
W/C  
W/C  
Reserved bit  
6
RSVD  
Reserved bit  
5
ON_PUSH_INT  
ON falling edge longer than 5ms happened  
Die temperature pre-warning interrupt  
4
TEMP_  
PREWARNING  
1: die temp ≥ TWARNING; 0: die temp < TWARNING TWARNING  
threshold is configured by T_WARNING [1:0]  
3
2
THEM_SHDN  
0
0
W/C  
W/C  
Thermal shutdown interrupt  
0: thermal shutdown is not triggered  
1: die temp ≥ TSHDN (set in THEM_SHDN [2:0], thermal shutdown is  
triggered  
ASYS_  
ASYS Pre-Warning Voltage Interrupt:  
PREWARNING  
0: ASYS voltage does NOT fall below the threshold set in ASYS_  
PREWARNING [1:0]  
1: ASYS voltage falls below the threshold set in ASYS_PREWARNING  
[1:0]  
1
0
WD_TIMER  
0
0
W/C  
W/C  
Watchdog Timer Expiration Interrupt:  
0: The watchdog timer expiration has not happened since the last time  
this bit was cleared.  
1: The watchdog timer expiration has happened since the last time this  
bit was cleared.  
VIN  
Input Voltage Interrupt  
0: The VIN_OK bit has not changed since the last time this bit was  
cleared.  
1: The VIN _OK bit has changed since the last time this bit was  
cleared.  
9.5.4 Sub level interrupt_0 mask (Sub_INT0_Mask, address 03h)  
This is a READ AND WRITE register.  
Table 11.ꢀSub_INT0_Mask bit description  
Bit  
Symbol  
Default  
value  
Type  
Function  
7
6
5
RSVD  
0
0
1
R/W  
R/W  
R/W  
Reserved bit  
Reserved bit  
RSVD  
ON_PUSH_INT_MASK  
ON Key falling interrupt mask bit  
0: Not Masked  
1: Masked  
4
3
TEMP_PREWARNING_MASK  
THEM_SHDN_MASK  
1
1
R/W  
R/W  
Die temp pre-warning interrupt mask bit  
0: Not Masked  
1: Masked  
Thermal shutdown interrupt mask bit  
0: Not Masked  
1: Masked  
PCA9420  
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Power management IC for low-power microcontroller applications  
Table 11.ꢀSub_INT0_Mask bit description...continued  
Bit  
Symbol  
Default  
value  
Type  
Function  
2
ASYS_PREWARNING_MASK  
1
1
1
R/W  
ASYS Pre-Warning Voltage Interrupt Mask bit  
0: Not Masked  
1: Masked  
1
0
WD_TIMER_MASK  
VIN_MASK  
R/W  
R/W  
Watchdog Timer Expiration Interrupt Mask bit  
0: Not Masked  
1: Masked  
Input Voltage Interrupt Mask bit  
0: Not Masked  
1: Masked  
9.5.5 Sub level interrupt_1 (Sub_INT1, address 04h)  
The sub-level interrupt register contains flags indicating the second-tier interrupt event.  
For this register, it contains battery charger related interrupt events.  
This is WRITE AND CLEAR register.  
Table 12.ꢀSub_INT1 register bit description  
Bit  
7
Symbol  
RSVD  
Default value Type  
Function  
0
0
0
W/C  
W/C  
W/C  
Reserved bit  
6
RSVD  
Reserved bit  
5
VIN_ILIM  
Input Current Limit Interrupt:  
0: no Input current limit has been triggered since the last  
time this bit is cleared;  
1: input current limit event is triggered since last time this bit  
is cleared.  
4
3
2
1
ICHG_FAST_TIMER  
ICHG_PREQ_TIMER  
BATTERY_DETECTION  
VBAT  
0
0
0
0
W/C  
W/C  
W/C  
W/C  
Fast Charging Timer Expiration Interrupt:  
0: The fast charging timer expiration has not happened  
since the last time this bit was cleared.  
1: The fast charging timer expiration has happened since  
the last time this bit was cleared.  
Pre-qualification Charging Timer Expiration Interrupt:  
0: The pre-qual charging timer expiration has not happened  
since the last time this bit was cleared.  
1: The pre-qual charging timer expiration has happened  
since the last time this bit was cleared.  
Battery presence Interrupt  
0: The VBAT_DET_OK bit has not changed since the last  
time this bit was cleared.  
1: The VBAT_DET_OK bit has changed since the last time  
this bit was cleared.  
Battery Interrupt  
0: The VBAT_OK bit has not changed since the last time  
this bit was cleared.  
1: The VBAT_OK bit has changed since the last time this bit  
was cleared.  
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PCA9420  
Power management IC for low-power microcontroller applications  
Table 12.ꢀSub_INT1 register bit description...continued  
Bit  
Symbol  
Default value Type  
W/C  
Function  
0
CHG_OK  
0
Charger Status Interrupt  
0: The CHG_OK bit has not changed since the last time this  
bit was cleared.  
1: The CHG_OK bit has changed since the last time this bit  
was cleared  
9.5.6 Sub level interrupt_1 mask (Sub_INT1_Mask, address 05h)  
This is a READ AND WRITE register.  
Table 13.ꢀSub_INT1_Mask register bit description  
Bit Symbol  
Default  
value  
Type Function  
7
6
5
RSVD  
0
1
1
R/W  
R/W  
R/W  
Reserved bit  
Reserved bit  
RSVD  
VIN_ILIM_MASK  
Input Current Limit Interrupt Mask bit  
0: Not Masked  
1: Masked  
4
3
2
1
0
ICHG_FAST_TIMER_MASK  
ICHG_PREQ_TIMER_MASK  
BATTERY_DETECTION_MASK  
VBAT_MASK  
1
1
1
1
1
R/W  
R/W  
R/W  
R/W  
R/W  
Fast Charging Timer Expiration Interrupt Mask bit  
0: Not Masked  
1: Masked  
Pre-qual Charging Timer Expiration Interrupt Mask bit  
0: Not Masked  
1: Masked  
Battery presence Interrupt Mask bit  
0: Not Masked  
1: Masked  
Battery Interrupt Mask bit  
0: Not Masked  
1: Masked  
CHG_OK_MASK  
Charger Interrupt Mask bit  
0: Not Masked  
1: Masked  
9.5.7 Sub level interrupt_2 (Sub_INT2, address 06h)  
The sub-level interrupt register contains flags indicating the second-tier interrupt event.  
For this register, it contains LDO1/LDO2, SW1/SW2 related interrupt events.  
This is WRITE AND CLEAR register.  
Table 14.ꢀSub_INT2 register bit description  
Bit  
7
Symbol  
RSVD  
RSVD  
RSVD  
Default value Type  
Function  
0
0
0
W/C  
W/C  
W/C  
Reserved bit  
Reserved bit  
Reserved bit  
6
5
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PCA9420  
Power management IC for low-power microcontroller applications  
Table 14.ꢀSub_INT2 register bit description...continued  
Bit  
4
Symbol  
RSVD  
Default value Type  
Function  
0
0
W/C  
W/C  
Reserved bit  
3
VOUTSW1  
SW1 Output Voltage Interrupt  
0: The VOUTSW1_OK bit has not changed since the last time this bit  
was cleared.  
1: The VOUTSW1_OK bit has changed since the last time this bit was  
cleared.  
2
1
0
VOUTSW2  
VOUTLDO1  
VOUTLDO2  
0
0
0
W/C  
W/C  
W/C  
SW2 Output Voltage Interrupt  
0: The VOUTSW2_OK bit has not changed since the last time this bit  
was cleared.  
1: The VOUTSW2_OK bit has changed since the last time this bit was  
cleared.  
LDO1 Output Voltage Interrupt  
0: The VOUTLDO1_OK bit has not changed since the last time this bit  
was cleared.  
1: The VOUTLDO1_OK bit has changed since the last time this bit was  
cleared.  
LDO2 Output Voltage Interrupt  
0: The VOUTLDO2_OK bit has not changed since the last time this bit  
was cleared.  
1: The VOUTLDO2_OK bit has changed since the last time this bit was  
cleared.  
9.5.8 Sub level interrupt_2 mask (Sub_INT2_Mask, address 07h)  
This is a READ AND WRITE register.  
Table 15.ꢀSub_INT2_Mask register bit description  
Bit  
7
Symbol  
RSVD  
Default value Type  
Function  
1
1
1
1
1
R/W  
R/W  
R/W  
R/W  
R/W  
Reserved bit  
Reserved bit  
Reserved bit  
Reserved bit  
6
RSVD  
5
RSVD  
4
RSVD  
3
VOUTSW1 _MASK  
VOUTSW1 Voltage Interrupt Mask bit  
0: Not Masked  
1: Masked  
2
1
0
VOUTSW2 _MASK  
VOUTLDO1 _MASK  
VOUTLDO2_MASK  
1
1
1
R/W  
R/W  
R/W  
VOUTSW2 Voltage Interrupt Mask bit  
0: Not Masked  
1: Masked  
VOUTLDO1 Voltage Interrupt Mask bit  
0: Not Masked  
1: Masked  
VOUTLDO2 Voltage Interrupt Mask bit  
0: Not Masked  
1: Masked  
08h register: Reserved  
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PCA9420  
Power management IC for low-power microcontroller applications  
9.5.9 Top level control_0 (TOP_CTL0, address 09h)  
This register contains various configuration bits for top level related functions, part 0. This  
is a READ AND WRITE register.  
Table 16.ꢀTOP_CNTL0 register bit description  
Bit  
7
Symbol  
Default value Type  
010 R/W  
Function  
VIN_ILIM_SEL  
[2:0]  
VIN input current limit selection: (min/typ/max)  
000: 74mA/85mA/98mA, (another default setting by MTP)  
001: 222mA/255mA/293mA  
6
5
010: 370mA/425mA/489mA (default setting)  
011: 517mA/595mA/684mA  
100: 665mA/765mA/880mA  
101: 813mA/935mA/1075mA  
110: 961mA/1105mA/1271mA  
111: Input current limit disabled  
[Note] 1-bit MTP, VIN_ILIM_SEL [1], should be reserved to  
change the default value for this function  
4
OPERATION_SEL_  
FROM_SHIPMODE  
0
R/W  
Ship mode wakeup configuration setting  
0: upon VIN plug in, the chip will enable the battery charging  
process, AND start the power-up sequence for LDO1/LDO2/  
SW1/SW2 per the setting  
1: upon VIN plug in, the chip will enable the charging process,  
LDO1/LDO2/SW1/SW2 remain in shutdown mode and the chip  
will only enable the power-up sequence upon ON pin falling  
edge  
[Note] 1-bit MTP should be reserved to change the default value  
for this function  
3
2
PWR_DN_EN[1]  
0
0
R/W  
R/W  
Power-down Sequence Enable  
0: Do not start power-down sequence  
1: Start power-down sequence  
nEN_CHG_IN_  
WATCHDOG  
Configure operations in a programmed watchdog timer expired  
0: When the programmed watchdog timer expires, the following  
operations take place.  
SYSRSTn signal asserts (high to low)  
Charging is continued  
LDO1/LDO2/SW1/SW2 enters the mode 0 setting  
1: When the programmed watchdog timer expires, the following  
operations take place.  
SYSRSTn signal asserts (high to low)  
Charging is disabled  
LDO1/LDO2/SW1/SW2 enters the mode 0 setting  
1
0
RSVD  
0
1
R/W  
R/W  
Reserved bit  
PGood_EN  
LDO1, LDO2, SW1, SW2 Output Voltage Status Indication  
0: Output voltage power-good comparators are disabled.  
This will also set “VOUTSW1 _OK”, “VOUTSW2 _OK”,  
“VOUTLDO1_OK” and “VOUTLDO2 _OK” bits to 0  
1: Output voltage power-good comparators are enabled  
[1] A valid VIN does not generate the initial power-up sequence if all power rails have been turned off by setting PWR_DN_EN to 1. The use of PWR_DN_EN  
bit is prohibited to be used in any application that requires power-up sequence by both VIN and ON key.  
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PCA9420  
Power management IC for low-power microcontroller applications  
The use of SHIP_EN_x (x can be 0, 1, 2 &3) is recommended for the application.  
9.5.10 Top level control_1 (TOP_CTL1, address 0Ah)  
This register contains various configuration bits for top level related functions, part 1. This  
is a READ AND WRITE register.  
Table 17.ꢀTOP_CNTL1 register bit description  
Bit  
Symbol  
Default  
value  
Type  
Function  
7
6
ASYS_PREWARNING  
[1:0]  
10  
00  
R/W  
ASYS Program a pre-warning voltage threshold on ASYS  
00: 3.3V  
01: 3.4V  
10: 3.5V  
11: 3.6V  
5
4
ASYS_INPUT_SEL  
[1:0]  
R/W  
ASYS input source selection  
00: ASYS is power by either VBAT or VIN (VIN has higher  
priority over VBAT if both are presented)  
01: ASYS is powered by VBAT only  
10: ASYS is powered by VIN only  
11: ASYS is disconnected to either VBAT or VIN (for internal  
testing purpose only)  
3
2
RSVD  
1
0
R/W  
R/W  
Reserved bit  
VIN_OVP_SEL  
VIN over-voltage protection threshold (rising) selection  
0: 5.50V  
1: 6.0V  
Note: The current default value for VIN_OVP_SEL is set  
at 5.5V, but it should be MTP programmable  
1
0
VIN_UVLO_SEL  
[1:0]  
01  
R/W  
Program an under-voltage lockout threshold (falling) on VIN  
00: 2.9V  
01: 3.1V  
10: 3.3V  
11: 3.5V  
9.5.11 Top level control_2 (TOP_CTL2, address 0Bh)  
This register contains various configuration bits for top level related functions, part 2. This  
is a READ AND WRITE register.  
Table 18.ꢀTOP_CNTL2 register bit description  
Bit  
7
Symbol  
Default value Type  
Function  
ASYS_UVLO_SEL  
[1:0]  
11  
R/W  
Program a UVLO threshold on ASYS  
00: 2.4V  
01: 2.5V  
10: 2.6V  
11: 2.7V  
6
5
TERM_DIS  
0
R/W  
Enable/Disable the charge termination control. In this mode,  
the fast charge timer is reset.  
0: Enable charge termination mode  
1: Disable charge termination mode  
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PCA9420  
Power management IC for low-power microcontroller applications  
Table 18.ꢀTOP_CNTL2 register bit description...continued  
Bit  
4
Symbol  
Default value Type  
011 R/W  
Function  
THEM_SHDN  
[2:0]  
Program a thermal shutdown threshold, TSHDN, in  
rising(hysteresis with 20°C)  
3
000: 95°C  
2
001: 100°C  
010: 105°C  
011: 110°C  
100: 115°C  
101: 120°C  
110: 125°C  
111: reserved  
1
0
DIE_TEMP_WARNING 10  
[1:0]  
R/W  
Program a Die temperature warning threshold  
00: 75°C  
01: 80°C  
10: 85°C  
11: 90°C  
9.5.12 Top level control_3 (TOP_CTL3, address 0Ch)  
This register contains various configuration bits for top level related functions, part 3. This  
is a READ AND WRITE register.  
Table 19.ꢀTOP_CNTL3 register bit description  
Bit  
7
Symbol  
RSVD  
Default value Type  
Function  
0
0
0
0
0
R/W  
R/W  
R/W  
R/W  
R/W  
Reserved bit  
Reserved bit  
Reserved bit  
6
RSVD  
5
RSVD  
4
MODE1_I2C  
MODE0_I2C  
Depending on EN_MODE_SEL_BY_PIN_x (x=”0”, or “1”, or “2”,  
or “3”) bit setting, the chip mode control is set by either the I2C bit  
MODE1_I2C/ MODE0_I2C value, or the signal applied on external  
MODESEL1/ MODESEL1 pins. Refer to EN_MODE_SEL_BY_PIN  
description for more details.  
3
With EN_MODE_SEL_BY_PIN=0, the mode selection is determined  
by the following:  
[MODE1_I2C: MODE0_I2C] = 00, mode 0 setting  
[MODE1_I2C: MODE0_I2C] = 01, mode 1 setting  
[MODE1_I2C: MODE0_I2C] = 10, mode 2 setting  
[MODE1_I2C: MODE0_I2C] = 11, mode 3 setting  
2
SW_RST  
0
W/C  
R/W  
Chip software reset bit. If user write “1” to this bit, it will reset all other  
I2C register bit to its default setting and cycle the regulator outputs,  
and meanwhile, this bit will be clear and reset back to “0” as well.  
1
0
ON_GLT_LONG 01  
[1:0]  
Program a long glitch timer on ON key  
00: 4s  
01: 8s  
10: 12s  
11: 16s  
Note: 2-bit MTP should be reserved to change the default setting  
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PCA9420  
Power management IC for low-power microcontroller applications  
9.5.13 Top level control_4 (TOP_CTL4, address 0Dh)  
This register contains various configuration bits for top level related functions, part 4. This  
is a WRITE ONLY register.  
Table 20.ꢀTOP_CNTL4 register bit description  
Bit  
7
Symbol  
Default value Type  
Function  
RSVD  
00000  
W
Reserved bit  
6
5
4
3
2
WD_TIMER_CLR 000  
[2:0]  
W
Watchdog Timer Reset.  
001: When written 001 to WD_TIMER_CLR [2:0], the watchdog timer  
is reset.  
1
0
All other values: when written to WD_TIMER_CLR [2:0], watchdog  
timer remains unaffected.  
9.5.14 Battery charger control_0 (CHG_CTL0, address 10h)  
This register stores the linear battery charge related control registers, part 0. This is a  
READ AND WRITE register.  
Table 21.ꢀCHG_CNTL0 register bit description  
Bit  
7
Symbol  
Default value Type  
Function  
CHG_LOCK  
[4:0]  
00000  
R/W  
Critical charger related setting lock.  
CHG_LOCK [4:0] = 10101, these registers which are labeled as  
“locked by CHG_LOCK” can be accessed to perform I2C “write”  
command.  
6
5
CHGN_LOCK [4:0] ≠ 10101, these registers which are labeled as  
“locked by CHG_LOCK” can NOT be accessed to perform I2C “write”  
command. In such case when “write” command is performed on these  
locked registers, it will keep the present register value.  
4
3
2
1
0
NTC_EN  
0
R/W  
R/W  
R/W  
Enable TS pin external thermistor (NTC) control in charger  
0: Disable Thermistor (NTC) control in charger  
1: Enable Thermistor (NTC) control in charger  
CHG_TIMER_EN 1  
Enable the fast charge timer and pre-qual timer  
0: Disable both fast charge timer and pre-qual timer  
1: Enable both fast charge timer and pre-qual timer  
CHG_EN  
1
Enable the linear battery charger  
0: Disable charger  
1: Enable charger  
Note: The default value for this bit should be MTP programmable  
9.5.15 Battery charger control_1 (CHG_CTL1, address 11h)  
This register stores the linear battery charge related control registers, part 1.  
This is a READ AND WRITE register, and this register is locked by CHG_LOCK.  
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NXP Semiconductors  
PCA9420  
Power management IC for low-power microcontroller applications  
Table 22.ꢀCHG_CNTL1 register bit description  
Bit  
7
Symbol  
RSVD  
RSVD  
Default value Type  
Function  
0
R/W  
R/W  
R/W  
Reserved bit  
6
0
Reserved bit  
5
ICHG_CC  
[5:0]  
001000  
Program a fast charge current  
Note: The current default value for ICHG_CC [5:0] is set at 40mA,  
but it should be MTP programmable.  
4
3
2
1
0
Table 23.ꢀLinear battery charger constant current (CC) setting  
00h: 0mA  
10h: 80mA  
11h: 85mA  
20h: 160mA  
21h: 165mA  
22h: 170mA  
23h: 175mA  
24h: 180mA  
25h: 185mA  
26h: 190mA  
27h: 195mA  
28h: 200mA  
29h: 205mA  
2Ah: 210mA  
2Bh: 215mA  
2Ch: 220mA  
2Dh: 225mA  
2Eh: 230mA  
2Fh: 235mA  
30h: 240mA  
31h: 245mA  
32h: 250mA  
33h: 255mA  
34h: 260mA  
35h: 265mA  
36h: 270mA  
37h: 275mA  
38h: 280mA  
39h: 285mA  
3Ah: 290mA  
3Bh: 295mA  
3Ch: 300mA  
3Dh: 305mA  
3Eh: 310mA  
3Fh: 315mA  
01h: 5mA  
02h: 10mA  
03h: 15mA  
04h: 20mA  
05h: 25mA  
06h: 30mA  
07h: 35mA  
08h: 40mA (default)  
09h: 45mA  
0Ah: 50mA  
0Bh: 55mA  
0Ch: 60mA  
0Dh: 65mA  
0Eh: 70mA  
0Fh: 75mA  
12h: 90mA  
13h: 95mA  
14h: 100mA  
15h: 105mA  
16h: 110mA  
17h: 115mA  
18h: 120mA  
19h: 125mA  
1Ah: 130mA  
1Bh: 135mA  
1Ch: 140mA  
1Dh: 145mA  
1Eh: 150mA  
1Fh: 155mA  
9.5.16 Battery charger control_2 (CHG_CTL2, address 12h)  
This register stores the present status of chip, part 2, linear battery charger related  
status. This is a READ AND WRITE register, and this register is locked by  
CHG_LOCK.  
Table 24.ꢀCHG_CNTL2 register bit description  
Bit  
7
Symbol  
RSVD  
RSVD  
Default value Type  
Function  
0
0
R/W  
R/W  
Reserved bit  
Reserved bit  
6
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Power management IC for low-power microcontroller applications  
Table 24.ꢀCHG_CNTL2 register bit description...continued  
Bit  
5
Symbol  
Default value Type  
Function  
ICHG_TOPOFF 000100b  
[5:0]  
R/W  
Program a top-off current  
Note: The current default value for ICHG_TOPOFF [5:0] is set at  
4mA, but it should be MTP programmable.  
4
3
2
1
0
Table 25.ꢀLinear battery charger top-off charge current setting  
00h: 0mA  
10h: 16mA  
11h: 17mA  
12h: 18mA  
13h: 19mA  
14h: 20mA  
15h: 21mA  
16h: 22mA  
17h: 23mA  
18h: 24mA  
19h: 25mA  
1Ah: 26mA  
1Bh: 27mA  
1Ch: 28mA  
1Dh: 29mA  
1Eh: 30mA  
1Fh: 31mA  
20h: 32mA  
21h: 33mA  
22h: 34mA  
23h: 35mA  
24h: 36mA  
25h: 37mA  
26h: 38mA  
27h: 39mA  
28h: 40mA  
29h: 41mA  
2Ah: 42mA  
2Bh: 43mA  
2Ch: 44mA  
2Dh: 45mA  
2Eh: 46mA  
2Fh: 47mA  
30h: 48mA  
31h: 49mA  
32h: 50mA  
33h: 51mA  
34h: 52mA  
35h: 53mA  
36h: 54mA  
37h: 55mA  
38h: 56mA  
39h: 57mA  
3Ah: 58mA  
3Bh: 59mA  
3Ch: 60mA  
3Dh: 61mA  
3Eh: 62mA  
3Fh: 63mA  
01h: 1mA  
02h: 2mA  
03h: 3mA  
04h: 4mA (default)  
05h: 5mA  
06h: 6mA  
07h: 7mA  
08h: 8mA  
09h: 9mA  
0Ah: 10mA  
0Bh: 11mA  
0Ch: 12mA  
0Dh: 13mA  
0Eh: 14mA  
0Fh: 15mA  
9.5.17 Battery charger control_3 (CHG_CTL3, address 13h)  
This register stores the present status of chip, part 3, linear battery charger related  
status. This is a READ AND WRITE register, and this register is locked by  
CHG_LOCK.  
Table 26.ꢀCHG_CNTL3 register bit description  
Bit  
7
Symbol  
RSVD  
RSVD  
Default value Type  
Function  
0
0
R/W  
R/W  
Reserved bit  
Reserved bit  
6
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PCA9420  
Power management IC for low-power microcontroller applications  
Table 26.ꢀCHG_CNTL3 register bit description...continued  
Bit  
5
Symbol  
Default value Type  
R/W  
Function  
ICHG_LOW [5:0] 001000  
Program a pre-charge (Low battery charge current)  
Note: Current value set in ICHG_LOW [5:0] should NOT be higher  
than the value set in ICHG_LOW [5:0].  
4
3
Note: The current default value for ICHG_LOW [5:0] is set at 8mA,  
ICHG_LOW [4:3] should be MTP programmable.  
2
1
0
Table 27.ꢀLow battery charge current setting  
00h: 0mA  
10h: 16mA  
20h: 32mA  
21h: 33mA  
22h: 34mA  
23h: 35mA  
24h: 36mA  
25h: 37mA  
26h: 38mA  
27h: 39mA  
28h: 40mA  
29h: 41mA  
2Ah: 42mA  
2Bh: 43mA  
2Ch: 44mA  
2Dh: 45mA  
2Eh: 46mA  
2Fh: 47mA  
30h: 48mA  
31h: 49mA  
32h: 50mA  
33h: 51mA  
34h: 52mA  
35h: 53mA  
36h: 54mA  
37h: 55mA  
38h: 56mA  
39h: 57mA  
3Ah: 58mA  
3Bh: 59mA  
3Ch: 60mA  
3Dh: 61mA  
3Eh: 62mA  
3Fh: 63mA  
01h: 1mA  
11h: 17mA  
12h: 18mA  
13h: 19mA  
14h: 20mA  
15h: 21mA  
16h: 22mA  
17h: 23mA  
18h: 24mA  
19h: 25mA  
1Ah: 26mA  
1Bh: 27mA  
1Ch: 28mA  
1Dh: 29mA  
1Eh: 30mA  
1Fh: 31mA  
02h: 2mA  
03h: 3mA  
04h: 4mA  
05h: 5mA  
06h: 6mA  
07h: 7mA  
08h: 8mA (default)  
09h: 9mA  
0Ah: 10mA  
0Bh: 11mA  
0Ch: 12mA  
0Dh: 13mA  
0Eh: 14mA  
0Fh: 15mA  
9.5.18 Battery charger control_4 (CHG_CTL4, address 14h)  
This register stores the present status of chip, part 4, linear battery charger related  
status. This is a READ AND WRITE register, and this register is locked by  
CHG_LOCK.  
Table 28.ꢀCHG_CNTL4 register bit description  
Bit  
7
Symbol  
RSVD  
RSVD  
Default value Type  
Function  
0
0
R/W  
R/W  
Reserved bit  
Reserved bit  
6
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PCA9420  
Power management IC for low-power microcontroller applications  
Table 28.ꢀCHG_CNTL4 register bit description...continued  
Bit  
5
Symbol  
Default value Type  
000100 R/W  
Function  
ICHG_DEAD  
[5:0]  
Program a Dead battery charge current  
Note: Current value set in ICHG_DEAD [5:0] should NOT be greater  
than the value set in ICHG_LOW [5:0].  
4
3
Note: The current default value for ICHG_DEAD [5:0] is set  
at 4mA, ICHG_DEAD [2] and ICHG_DEAD [4] should be MTP  
programmable.  
2
1
0
Table 29.ꢀDead battery charge current setting  
00h: 0mA  
10h: 16mA  
20h: 32mA  
21h: 33mA  
22h: 34mA  
23h: 35mA  
24h: 36mA  
25h: 37mA  
26h: 38mA  
27h: 39mA  
28h: 40mA  
29h: 41mA  
2Ah: 42mA  
2Bh: 43mA  
2Ch: 44mA  
2Dh: 45mA  
2Eh: 46mA  
2Fh: 47mA  
30h: 48mA  
31h: 49mA  
32h: 50mA  
33h: 51mA  
34h: 52mA  
35h: 53mA  
36h: 54mA  
37h: 55mA  
38h: 56mA  
39h: 57mA  
3Ah: 58mA  
3Bh: 59mA  
3Ch: 60mA  
3Dh: 61mA  
3Eh: 62mA  
3Fh: 63mA  
01h: 1mA  
11h: 17mA  
12h: 18mA  
13h: 19mA  
14h: 20mA  
15h: 21mA  
16h: 22mA  
17h: 23mA  
18h: 24mA  
19h: 25mA  
1Ah: 26mA  
1Bh: 27mA  
1Ch: 28mA  
1Dh: 29mA  
1Eh: 30mA  
1Fh: 31mA  
02h: 2mA  
03h: 3mA  
04h: 4mA (default)  
05h: 5mA  
06h: 6mA  
07h: 7mA  
08h: 8mA  
09h: 9mA  
0Ah: 10mA  
0Bh: 11mA  
0Ch: 12mA  
0Dh: 13mA  
0Eh: 14mA  
0Fh: 15mA  
9.5.19 Battery charger control_5 (CHG_CTL5, address 15h)  
This register stores the present status of chip, part 5, linear battery charger related  
status. This is a READ AND WRITE register, and this register is locked by  
CHG_LOCK.  
Table 30.ꢀCHG_CNTL5 register bit description  
Bit  
7
Symbol  
Default value Type  
Function  
RSVD  
0
R/W  
R/W  
Reserved bit  
6
VBAT_RESTART 0  
Program a threshold for recharge  
0: 140mV below a programmed VBAT_REG  
1: 240mV below a programmed VBAT_REG  
Note: The default value should be 1-bit MTP programmable.  
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PCA9420  
Power management IC for low-power microcontroller applications  
Table 30.ꢀCHG_CNTL5 register bit description...continued  
Bit  
5
Symbol  
Default value Type  
011110 R/W  
Function  
VBAT_REG  
[5:0]  
Program a battery regulation voltage, VBAT_REG  
Note: The current default value for VBAT_REG [5:0] is set at  
4.20V, but it should be MTP programmable.  
4
3
2
1
0
Table 31.ꢀVBATREG, linear battery charger regulated battery voltage setting  
00h: 3.60V  
01h: 3.62V  
02h: 3.64V  
03h: 3.66V  
04h: 3.68V  
05h: 3.70V  
06h: 3.72V  
07h: 3.74V  
08h: 3.76V  
09h: 3.78V  
0Ah: 3.80V  
0Bh: 3.82V  
0Ch: 3.84V  
0Dh: 3.86V  
0Eh: 3.88V  
0Fh: 3.90V  
10h: 3.92V  
11h: 3.94V  
12h: 3.96V  
13h: 3.98V  
14h: 4.00V  
15h: 4.02V  
16h: 4.04V  
17h: 4.06V  
18h: 4.08V  
19h: 4.10V  
1Ah: 4.12V  
1Bh: 4.14V  
1Ch: 4.16V  
1Dh: 4.18V  
1Eh: 4.20V  
1Fh: 4.22V  
20h: 4.24V  
21h: 4.26V  
22h: 4.28V  
23h: 4.30V  
24h: 4.32V  
25h: 4.34V  
26h: 4.36V  
27h: 4.38V  
28h: 4.40V  
29h: 4.42V  
2Ah: 4.44V  
2Bh: 4.46V  
2Ch: 4.48V  
2Dh: 4.50V  
2Eh: 4.52V  
2Fh: 4.54V  
30h: 4.56V  
31h: 4.58V  
32h: 4.60V  
33~3Fh: 4.60V  
9.5.20 Battery charger control_6 (CHG_CTL6, address 16h)  
This register stores the present status of chip, part 7, linear battery charger related  
status. This is a READ AND WRITE register, and this register is locked by  
CHG_LOCK.  
Table 32.ꢀCHG_CNTL6 register bit description  
Bit  
Symbol  
Default value Type  
Function  
7
NTC_RES_SEL  
1
R/W  
External thermistor typical resistance selection: 0: 100kΩ  
1: 10kΩ  
6
TIMER_2X  
0
R/W  
Charging Safety Timer Extension:  
0: Both pre-qual and fast charge timer duration keeps as the values set  
in ICHG_PREQ_TIMER [1:0] and ICHG_FAST_TIMER [1:0]  
1: Both pre-qual and fast charge timer duration is extended to 2x of the  
values set in ICHG_PREQ_TIMER [1:0] and ICHG_FAST_TIMER [1:0]  
PCA9420  
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PCA9420  
Power management IC for low-power microcontroller applications  
Table 32.ꢀCHG_CNTL6 register bit description...continued  
Bit  
5
Symbol  
Default value Type  
Function  
ICHG_FAST_  
TIMER [1:0]  
01  
01  
R/W  
R/W  
R/W  
Linear battery charger fast charge timer setting: 00: 3hr; 01: 5hr; 10:  
7hr; 11: 9hr  
4
3
ICHG_PREQ_  
TIMER [1:0]  
Linear battery charger pre-qualification charge timer setting: 00: 15  
min; 01: 30 min; 10: 45 min; 11: 60 min  
2
1
T_TOPOFF [1:0] 01  
TOPOFF Timer setting:  
00: 0min; 01: 6.4min; 10: 12.8min; 11: 19.2min  
0
9.5.21 Battery charger control_7 (CHG_CTL7, address 17h)  
This register stores the present status of chip, part 7, linear battery charger related  
status. This is a READ AND WRITE register.  
Table 33.ꢀCHG_CNTL7 register bit description  
Bit  
Symbol  
Default value Type  
Function  
7:5  
NTC_BETA_SEL 001  
[2:0]  
R/W  
Set the thermistor beta value selection (see below)  
4
3
2
1
0
RSVD  
RSVD  
0
R/W  
R/W  
R/W  
Reserved bit  
0
Reserved bit  
THM_REG  
[2:0]  
100  
Thermal regulation threshold setting (see below)  
Table 34.ꢀSet the thermistor beta value selection  
000: 3434k  
001: 3610k  
010: 3934k  
011: 3950k  
100: 4100k  
101: 4311k  
110: 4543k  
111: 4750k  
Table 35.ꢀThermal regulation threshold setting  
000: 80°C  
001: 85°C  
010: 90°C  
011: 95°C  
100: 100°C  
101: 105°C  
110: 110°C  
111: 115°C  
9.5.22 Battery charger status_0 (CHG_STATUS_0, address 18h)  
This register stores the present status of the linear battery charger, part 0. This is a  
READ ONLY register.  
Table 36.ꢀCHG_STATUS_0 register bit description  
Bit  
Symbol  
Default value Type  
Function  
7
VBAT_DET_OK  
0
R
VBAT Detection Status:  
0: No valid battery attachment detected. 1: Battery attachment  
detected.  
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PCA9420  
Power management IC for low-power microcontroller applications  
Table 36.ꢀCHG_STATUS_0 register bit description...continued  
Bit  
Symbol  
Default value Type  
Function  
6
VBAT_OK  
0
R
(Only valid with VBAT_DET_OK = 1)  
VBAT status, refer to BAT_DETAIL_STATUS [2:0] for more details  
0: the battery is invalid/missing, or charger reset is active, i.e.  
BAT_DETAIL_STATUS [2:0] = 0b000, 0b111  
1: the battery is OK. i.e. BAT_DETAIL_STATUS [2:0] = 0b001, 0b010,  
0b011, 0b100, 0b101  
5
4
VIN_OK  
0
1
R
R
VIN status, refer to VIN_STATUS [1:0] for more details  
0: VIN voltage is invalid. i.e. VIN_STATUS [1:0] ≠ 0b11  
1: VIN voltage is valid. i.e. VIN_STATUS [1:0] = 0b11  
CHG_OK  
Charger status  
0: The charger has suspended due to the following conditions: TS_  
DETAIL_STATUS [2:0] = 001’b or 100’b; or SFTY_TIMER_STATUS  
[1:0] ≠ 00’b  
1: The charger is OK  
3
2
1
0
RSVD  
RSVD  
RSVD  
RSVD  
0
0
0
0
R
R
R
R
Reserved bit  
Reserved bit  
Reserved bit  
Reserved bit  
9.5.23 Battery charger status_1 (CHG_STATUS_1, address 19h)  
This register stores the present status of the linear battery charger, part 1. This is a  
READ ONLY register.  
Table 37.ꢀCHG_STATUS_1 register bit description  
Bit  
7
Symbol  
Default value Type  
Function  
VIN_STATUS  
00  
R
VIN Status  
00: VIN is invalid. VIN<VIN_UVLO  
01: VIN is invalid. VIN< VBAT+VIN_HEADROOM and VIN>VIN_UVLO  
10: VIN is invalid. VIN>VIN_OVP  
6
11: VIN is valid. VIN>VIN_UVLO, VIN>VBAT+VIN2BAT_HEADROOM,  
VIN<VIN_OVP  
1
4
RSVD  
0
0
R
R
Reserved bit  
TREG_STATUS  
Temperature Regulation Loop Status  
0: Die junction temperature is less than the threshold set by THM_  
REG and the full charge current limit is available.  
1: Die junction temperature is greater than the threshold set by THEM_  
REG, and the charge current limit may be folding back to reduce  
power dissipation.  
3
2
1
0
RSVD  
RSVD  
RSVD  
RSVD  
0
0
0
0
R
R
R
R
Reserved bit  
Reserved bit  
Reserved bit  
Reserved bit  
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Power management IC for low-power microcontroller applications  
9.5.24 Battery charger status_2 (CHG_STATUS_2, address 1Ah)  
This register stores the present status of the linear battery charger, part 2.  
This is a READ ONLY register. The status of this register is only valid when VIN_OK = 1  
Table 38.ꢀCHG_STATUS_2 register bit description  
Bit  
7
Symbol  
Default value Type  
Function  
RSVD  
0
R
R
Reserved bit  
6
BAT_DETAIL_  
STATUS  
[2:0]  
111  
Battery conditions in details  
000: Battery missing, not attached  
5
001: Battery detection in-progress 010: VBAT < VBAT_DEAD  
011: VBAT_DEAD < VBAT < VBAT_LOW  
4
100: VBAT_LOW < VBAT < (VBAT_REG – VBAT_RESTART  
)
101: VBAT > (VBAT_REG – VBAT_RESTART  
)
110: reserved  
111: battery charger is in reset  
3
2
1
0
RSVD  
0
R
R
Reserved bit  
BAT_CHG_  
STATUS  
[2:0]  
000  
Charge conditions in details:  
000: Charger in Idle State  
001: Charger in Dead-Battery State  
010: Charger in Low-Battery State  
011-100: Charger in Fast Charging state in either CC or CV  
101: Charger in Top-off State  
110: Charger in Done State  
111: Reserved  
9.5.25 Battery charger status_3 (CHG_STATUS_3, address 1Bh)  
This register stores the present status of the linear battery charger, part 3. This is a  
READ ONLY register.  
Table 39.ꢀCHG_STATUS_3 register bit description  
Bit  
Symbol  
Default value Type  
Function  
7
TS_STATUS  
0
R
0: TS_DETAIL_STATUS [2:0] = 000. Battery temp is normal, no impact  
on normal charging.  
1: TS_DETAIL_STATUS [2:0] ≠ 000.  
6
5
4
TS_DETAIL_  
STATUS  
[2:0]  
000  
R
000: Battery Temperature Nominal, T2 ≤ T ≤ T3  
001: Battery Temperature is Cold, T < T1  
010: Battery Temperature is Cool, T1 ≤ T < T2  
011: Battery Temperature is Warm, T3 < T ≤ T4  
100: Battery Temperature is Hot, T > T4  
3
2
RSVD  
0
0
R
R
Reserved bit  
CHIP_TEMP_  
STATUS  
Chip Temp Status:  
0: Thermal regulation not activated  
1: Thermal regulation activated  
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PCA9420  
Power management IC for low-power microcontroller applications  
Table 39.ꢀCHG_STATUS_3 register bit description...continued  
Bit  
1
Symbol  
Default value Type  
Function  
SFTY_TIMER_S 00  
TATUS  
R
00: Safety Timers having No Effect on Battery Charging  
01: Pre-qual Timer expires, battery charging suspended  
10: Fast Timer expires, battery Charging suspended  
11: Battery short test fails, battery charging suspended  
0
[1:0]  
1Ch ~ 1Fh registers: Reserved  
9.5.26 Regulator status (REG_STATUS, address 20h)  
This register stores the present status of the SW1, SW2, LDO1, LDO2. This is a READ  
ONLY register.  
Table 40.ꢀREG_STATUS register bit description  
Bit  
Symbol  
Default value Type  
Function  
7
VOUTSW1 _OK  
0
R
R
R
R
SW1 VOUT “Power-good” Status  
0: VOUT_SW1 is not OK, i.e., VOUTSW1 / VOUTSW1(nominal) ≤  
90% or VOUTSW1 / VOUTSW1(nominal) ≥ 110%  
1: VOUT_SW1 is OK, i.e., 110% > VOUTSW1 / VOUTSW1(nominal) >  
90%  
6
5
4
VOUTSW2 _OK  
0
SW2 VOUT “Power-good” Status  
0: VOUT_SW2 is not OK, i.e., VOUTSW2 / VOUTSW2(nominal) ≤  
90% or VOUTSW2 / VOUTSW2(nominal) ≥ 110%  
1: VOUT_SW2 is OK, i.e., 110% > VOUTSW2 / VOUTSW2(nominal) >  
90%  
VOUTLDO1 _OK 0  
LDO1VOUT “Power-good” Status  
0: VOUTLDO1 is not OK, i.e., VOUTLDO1 / VOUTLDO1 (nominal) ≤  
90% or VOUT LDO1 / VOUT LDO1 (nominal) ≥ 110%  
1: VOUTLDO1 is OK, i.e., 110% > VOUTLDO1 / VOUTLDO1 (nominal)  
> 90%  
VOUTLDO2_OK  
0
LDO2VOUT “Power-good” Status  
0: VOUTLDO2 is not OK, i.e., VOUTLDO2 / VOUTLDO2 (nominal) ≤  
90% or VOUTLDO2 / VOUTLDO2 (nominal) ≥ 110%  
1: VOUTLDO2 is OK, i.e., 110% > VOUTLDO2 / VOUTLDO2 (nominal)  
> 90%  
3
2
1
0
RSVD  
RSVD  
RSVD  
RSVD  
0
0
0
0
R
R
R
R
Reserved bit  
Reserved bit  
Reserved bit  
Reserved bit  
9.5.27 Active Discharge Regulator control (ACT_DISCHARGE_CNTL, address 21h)  
This register stores the control functions of the SW1, SW2, LDO1, LDO2. This is a READ  
AND WRITE register.  
Table 41.ꢀACT_DISCHARGE_CNTL register bit description  
Bit  
Symbol  
Default value Type Function  
7
RSVD  
0
R/W Reserved bit  
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PCA9420  
Power management IC for low-power microcontroller applications  
Table 41.ꢀACT_DISCHARGE_CNTL register bit description...continued  
Bit  
6
Symbol  
RSVD  
RSVD  
RSVD  
Default value Type Function  
0
0
0
R/W Reserved bit  
R/W Reserved bit  
R/W Reserved bit  
5
4
3
nEN_SW1_BLEED 0  
R/W SW1 Output Active Discharge Turn-on Control in the regulator disabled  
0: Enable output discharge bleeding resistor disabled  
1: Disable Output discharge bleeding resistor  
2
1
nEN_SW2_BLEED 0  
R/W SW2 Output Active Discharge Turn-on Control in the regulator disabled  
0: Enable output discharge bleeding resistor disabled  
1: Disable Output discharge bleeding resistor  
nEN_LDO1_  
BLEED  
0
0
R/W LDO1 Output Active Discharge Turn-on Control in the regulator  
disabled  
0: Enable output discharge bleeding resistor disabled  
1: Disable Output discharge bleeding resistor  
0
nEN_LDO2_  
BLEED  
R/W LDO2 Output Active Discharge Turn-on Control in the regulator  
disabled  
0: Enable output discharge bleeding resistor disabled  
1: Disable Output discharge bleeding resistor  
9.5.28 Mode configuration mode setting 0_0 (MODECFG_0_0, address 22h)  
This register contains mode setting 0, part 0 configuration register. This is a READ AND  
WRITE register.  
Table 42.ꢀMODECFG_0_0 register bit description  
Bit  
Symbol  
Default value Type  
Function  
7
SHIP_EN_0  
0
R/W  
Ship mode enable/disable in mode setting 0  
0: Device is NOT set in ship mode  
1: Device is set in ship mode  
6
EN_MODE_  
SEL_BY_PIN_0  
0
R/W  
MODESEL0/MODESEL1 Control Selection in mode setting 0:  
0: mode control by internal I2C register bits, MODE0_I2C and/or  
MODE1_I2C only; signal applied on external MODESEL0/MODESEL1  
pins is ignored.  
1: mode control by signal applied on external MODESEL0 and/or  
MODESEL1 pins only, not by internal I2C register bits, MODE0_I2C  
and MODE1_I2C  
[1-bit MTP to set default value]  
5
4
3
2
1
0
SW1_OUT_0  
[5:0]  
010100  
R/W  
SW1 output voltage for mode setting 0 (see below).  
[Note: The default value for SW1 _OUT_0[5:0] is set at 1.00V, but it  
should be MTP programmable.]  
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PCA9420  
Power management IC for low-power microcontroller applications  
Table 43.ꢀSW1 output voltage for Mode Setting 0  
001110=0.850V  
000000=0.500V  
000001=0.525V  
000010=0.550V  
000011=0.575V  
000100=0.600V  
000101=0.625V  
000110=0.650V  
000111=0.675V  
001000=0.700V  
001001=0.725V  
001010=0.750V  
001011=0.775V  
001100=0.800V  
001101=0.825V  
011100=1.200V  
011101=1.225V  
011110=1.250V  
011111=1.275V  
100000=1.300V  
100001=1.325V  
100010=1.350V  
100011=1.375V  
100100=1.400V  
100101=1.425V  
100110=1.450V  
100111=1.475V  
101000=1.500V  
101001~111110=1.5V  
111111 = 1.8V  
001111=0.875V  
010000=0.900V  
010001=0.925V  
010010=0.950V  
010011=0.975V  
010100=1.000V  
010101=1.025V  
010110=1.050V  
010111=1.075V  
011000=1.100V  
011001=1.125V  
011010=1.150V  
011011=1.175V  
9.5.29 Mode configuration mode setting 0_1 (MODECFG_0_1, address 23h)  
This register contains mode setting A, part 1 configuration register. This is a READ AND  
WRITE register.  
Table 44.ꢀMODECFG_0_1 register bit description  
Bit  
7
Symbol  
RSVD  
Default value Type  
Function  
0
0
R/W  
R/W  
Reserved bit  
6
ON_CFG_0  
Mode configuration upon falling edge applied on “ON” pin in  
Mode Setting 0:  
0: upon valid falling edge applied on “ON” pin, the device  
will switch back to mode 0 setting (if the device is currently  
operating in mode 0 setting, then no mode switch)  
1: upon valid falling edge applied on “ON” pin, no mode  
switch, the device stays in its current mode setting operation  
5
SW2_OUT_0_OFFSET  
0
R/W  
R/W  
SW2 output voltage offset selection in mode setting 0  
0: SW2 Output Voltage = SW2_OUT_0_LSB [4:0] + 0V  
1: SW2 Output Voltage = SW2_OUT_0_LSB [4:0] + 1.2V  
4
3
2
1
0
SW2_OUT_0_LSB  
[4:0]  
01100  
SW2 default output voltage for mode setting 0 (see below).  
Note: The default value for SW2_OUT_A_LSB [4:0] is set  
at 1.8V, but it should be MTP programmable.  
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PCA9420  
Power management IC for low-power microcontroller applications  
Table 45.ꢀSW2 default output voltage for mode setting 0  
00000=1.500V  
00001=1.525V  
00010=1.550V  
00011=1.575V  
00100=1.600V  
00101=1.625V  
00110=1.650V  
00111=1.675V  
01000=1.700V  
01001=1.725V  
01010=1.750V  
01011=1.775V  
01100=1.800V  
01101=1.825V  
01110=1.850V  
01111=1.875V  
10000=1.900V  
10001=1.925V  
10010=1.950V  
10011=1.975V  
10100=2.000V  
10101=2.025V  
10110=2.050V  
10111=2.075V  
11000=2.100V  
11001-11111=2.1V  
9.5.30 Mode configuration mode setting 0_2 (MODECFG_0_2, address 24h)  
This register contains mode setting 0, part 2 configuration register. This is a READ AND  
WRITE register.  
Table 46.ꢀMODECFG_0_2 register bit description  
Bit  
7
Symbol  
Default value Type  
Function  
LDO1_ OUT_0  
[3:0]  
0100  
R/W  
LDO1 default output voltage for mode setting 0 (see below).  
Note: The default value for LDO1_OUT_0 [3:0] is set at 1.8V, but it  
should be MTP programmable.  
6
5
4
3
SW1_EN_0  
SW2_EN_0  
LDO1_EN_0  
LDO2_EN_0  
1
1
1
1
R/W  
R/W  
R/W  
R/W  
SW1 Enable Control in mode setting 0:  
0: SW1 disabled  
1: SW1 enabled  
[Note] reserve 1-bit MTP to set its default value  
2
1
0
SW2 Enable Control in mode setting 0:  
0: SW2 disabled  
1: SW2 enabled  
[Note] reserve 1-bit MTP to set its default value  
LDO1 Enable Control in mode setting 0:  
0: LDO1 disabled  
1: LDO1 enabled  
[Note] reserve 1-bit MTP to set its default value  
LDO2 Enable Control in mode setting 0:  
0: LDO2 disabled  
1: LDO2 enabled  
[Note] reserve 1-bit MTP to set its default value  
Table 47.ꢀLDO1 default output voltage for mode setting 0  
0000: 1.700V  
0001: 1.725V  
0010: 1.750V  
0011: 1.775V  
0100: 1.800V  
0101: 1.825V  
0110: 1.850V  
0111: 1.875V  
1000: 1.900V  
1001~1111:1.9V  
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Power management IC for low-power microcontroller applications  
9.5.31 Mode configuration mode setting 0_3 (MODECFG_0_3, address 25h)  
This register contains mode setting 0, part 3 configuration register. This is a READ AND  
WRITE register.  
Table 48.ꢀMODECFG_0_3 register bit description  
Bit  
7
Symbol  
Default value Type  
Function  
WD_TIMER_0  
[1:0]  
00  
R/W  
Watchdog timer setting in mode setting 0:  
00: Watchdog Timer Disabled  
01: Watchdog Timer = 16s  
6
10: Watchdog Timer = 32s  
11: Watchdog Timer = 64s  
[2-bit MTP to set default value]  
5
LDO2_OUT_0_  
OFFSET  
1
R/W  
R/W  
LDO2 output voltage offset selection in mode setting 0:  
0: LDO2 Output Voltage = LDO2_OUT_0_LSB[4:0] + 0V  
1: LDO2 Output Voltage = LDO2_OUT_0_LSB[4:0] + 1.2V  
[1-bit MTP to set default value]  
4
3
2
1
0
LDO2_OUT_0_  
11001  
LDO2 default output voltage for mode setting 0 (see below).  
LSB  
[4:0]  
Note: The default value for LDO2_OUT_0_LSB [4:0] is set at 3.3V,  
but it should be MTP programmable.  
Table 49.ꢀLDO2 default output voltage for mode setting 0  
00000=1.500V  
00001=1.525V  
00010=1.550V  
00011=1.575V  
00100=1.600V  
00101=1.625V  
00110=1.650V  
00111=1.675V  
01000=1.700V  
01001=1.725V  
01010=1.750V  
01011=1.775V  
01100=1.800V  
01101=1.825V  
01110=1.850V  
01111=1.875V  
10000=1.900V  
10001=1.925V  
10010=1.950V  
10011=1.975V  
10100=2.000V  
10101=2.025V  
10110=2.050V  
10111=2.075V  
11000=2.100V  
11001-11111=2.1V  
9.5.32 Mode configuration mode setting 1_0 (MODECFG_1_0, address 26h)  
This register contains mode setting 1, part 0 configuration register. This is a READ AND  
WRITE register.  
Table 50.ꢀMODECFG_1_0 register bit description  
Bit  
Symbol  
Default value Type  
R/W  
Function  
7
SHIP_EN_1  
0
Ship mode enable/disable in mode setting 1 0: Device is NOT set in  
ship mode  
1: Device is set in ship mode  
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Power management IC for low-power microcontroller applications  
Table 50.ꢀMODECFG_1_0 register bit description...continued  
Bit  
Symbol  
Default value Type  
Function  
6
EN_MODE_  
SEL_BY_PIN_1  
0
R/W  
MODESEL0/MODESEL1 Control Selection in mode setting 1:  
0: mode control by internal I2C register bits, MODE0_I2C and/or  
MODE1_I2C only; signal applied on external MODESEL0/MODESEL1  
pins is ignored.  
1: mode control by signal applied on external MODESEL0 and/or  
MODESEL1 pins only, not by internal I2C register bits, MODE0_I2C  
and MODE1_I2C  
5
4
3
2
1
0
SW1_OUT_1  
[5:0]  
011100  
R/W  
SW1 output voltage for mode setting 1 (see below).  
Table 51.ꢀSW1 output voltage for Mode Setting 1  
001110=0.850V  
000000=0.500V  
000001=0.525V  
000010=0.550V  
000011=0.575V  
000100=0.600V  
000101=0.625V  
000110=0.650V  
000111=0.675V  
001000=0.700V  
001001=0.725V  
001010=0.750V  
001011=0.775V  
001100=0.800V  
001101=0.825V  
011100=1.200V  
011101=1.225V  
011110=1.250V  
011111=1.275V  
100000=1.300V  
100001=1.325V  
100010=1.350V  
100011=1.375V  
100100=1.400V  
100101=1.425V  
100110=1.450V  
100111=1.475V  
101000=1.500V  
101001~111110=1.5V  
111111 = 1.8V  
001111=0.875V  
010000=0.900V  
010001=0.925V  
010010=0.950V  
010011=0.975V  
010100=1.000V  
010101=1.025V  
010110=1.050V  
010111=1.075V  
011000=1.100V  
011001=1.125V  
011010=1.150V  
011011=1.175V  
9.5.33 Mode configuration mode setting 1_1 (MODECFG_1_1, address 27h)  
This register contains mode setting 1, part 1 configuration register. This is a READ AND  
WRITE register.  
Table 52.ꢀMODECFG_1_1 register bit description  
Bit  
Symbol  
Default value Type  
R/W  
Function  
7
RSVD  
0
Reserved bit  
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Power management IC for low-power microcontroller applications  
Table 52.ꢀMODECFG_1_1 register bit description...continued  
Bit  
Symbol  
Default value Type  
Function  
6
ON_CFG_1  
1
R/W  
Mode configuration upon falling edge applied on “ON” pin in Mode  
Setting B:  
0: upon valid falling edge applied on “ON” pin, the device will switch  
back to mode 0 setting (if the device is currently operating in mode 0  
setting, then no mode switch)  
1: upon valid falling edge applied on “ON” pin, no mode switch, the  
device stays in its current mode setting operation  
5
SW2_OUT_1_  
OFFSET  
0
R/W  
R/W  
SW2 output voltage offset selection in mode setting 1  
0: SW2 Output Voltage = SW2_OUT_1_LSB[4:0] + 0V  
1: SW2 Output Voltage = SW2_OUT_1_LSB[4:0] + 1.2V  
4
3
2
1
0
SW2_OUT_1_  
LSB  
01100  
SW2 default output voltage for mode setting 1 (see below).  
[4:0]  
Table 53.ꢀSW2 default output voltage for mode setting 1  
00000=1.500V  
00001=1.525V  
00010=1.550V  
00011=1.575V  
00100=1.600V  
00101=1.625V  
00110=1.650V  
00111=1.675V  
01000=1.700V  
01001=1.725V  
01010=1.750V  
01011=1.775V  
01100=1.800V  
01101=1.825V  
01110=1.850V  
01111=1.875V  
10000=1.900V  
10001=1.925V  
10010=1.950V  
10011=1.975V  
10100=2.000V  
10101=2.025V  
10110=2.050V  
10111=2.075V  
11000=2.100V  
11001-11111=2.1V  
9.5.34 Mode configuration mode setting 1_2 (MODECFG_1_2, address 28h)  
This register contains mode setting 1, part 2 configuration register. This is a READ AND  
WRITE register.  
Table 54.ꢀMODECFG_1_2 register bit description  
Bit  
7
Symbol  
Default value Type  
Function  
LDO1_ OUT_1  
[3:0]  
0100  
R/W  
LDO1 default output voltage for mode setting 1 (see below).  
6
5
4
3
SW1_EN_1  
1
R/W  
SW1 Enable Control in mode setting 1:  
0: SW1 disabled  
1: SW1 enabled  
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Power management IC for low-power microcontroller applications  
Table 54.ꢀMODECFG_1_2 register bit description...continued  
Bit  
Symbol  
Default value Type  
Function  
2
SW2_EN_1  
1
1
1
R/W  
R/W  
R/W  
SW2 Enable Control in mode setting 1:  
0: SW2 disabled  
1: SW2 enabled  
1
0
LDO1_EN_1  
LDO2_EN_1  
LDO1 Enable Control in mode setting 1:  
0: LDO1 disabled  
1: LDO1 enabled  
LDO2 Enable Control in mode setting 1:  
0: LDO2 disabled  
1: LDO2 enabled  
Table 55.ꢀLDO1 default output voltage for mode setting 1  
0000: 1.700V  
0001: 1.725V  
0010: 1.750V  
0011: 1.775V  
0100: 1.800V  
0101: 1.825V  
0110: 1.850V  
0111: 1.875V  
1000: 1.900V  
1001~1111:1.9V  
9.5.35 Mode configuration mode setting 1_3 (MODECFG_1_3, address 29h)  
This register contains mode setting 1, part 3 configuration register. This is a READ AND  
WRITE register.  
Table 56.ꢀMODECFG_1_3 register bit description  
Bit  
7
Symbol  
Default value Type  
Function  
WD_TIMER_1  
[1:0]  
00  
R/W  
Watchdog timer setting in mode setting 1:  
00: Watchdog Timer Disabled  
01: Watchdog Timer = 16s  
6
10: Watchdog Timer = 32s  
11: Watchdog Timer = 64s  
5
LDO2_OUT_1_OFFSET  
0
R/W  
R/W  
LDO2 output voltage offset selection in mode setting 1:  
0: LDO2 Output Voltage = LDO2_OUT_1_LSB[4:0] + 0V  
1: LDO2 Output Voltage = LDO2_OUT_1_LSB[4:0] + 1.2V  
4
3
2
1
0
LDO2_OUT_1_LSB  
[4:0]  
01100  
LDO2 default output voltage for mode setting 1 (see below)  
Table 57.ꢀLDO2 default output voltage for mode setting 1  
00000=1.500V  
00001=1.525V  
00010=1.550V  
00011=1.575V  
01001=1.725V  
01010=1.750V  
01011=1.775V  
01100=1.800V  
10010=1.950V  
10011=1.975V  
10100=2.000V  
10101=2.025V  
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Power management IC for low-power microcontroller applications  
Table 57.ꢀLDO2 default output voltage for mode setting 1...continued  
00100=1.600V  
00101=1.625V  
00110=1.650V  
00111=1.675V  
01000=1.700V  
01101=1.825V  
01110=1.850V  
01111=1.875V  
10000=1.900V  
10001=1.925V  
10110=2.050V  
10111=2.075V  
11000=2.100V  
11001-11111=2.1V  
9.5.36 Mode configuration mode setting 2_0 (MODECFG_2_0, address 2Ah)  
This register contains mode setting 2, part 0 configuration register. This is a READ AND  
WRITE register.  
Table 58.ꢀMODECFG_2_0 register bit description  
Bit  
Symbol  
Default value Type  
Function  
7
SHIP_EN_2  
0
R/W  
Ship mode enable/disable in mode setting 2  
0: Device is NOT set in ship mode  
1: Device is set in ship mode  
6
EN_MODE_  
SEL_BY_PIN_2  
0
R/W  
MODESEL0/MODESEL1 Control Selection in mode setting 2  
0: mode control by internal I2C register bits, MODE0_I2C and/or  
MODE1_I2C only; signal applied on external MODESEL0/MODESEL1  
pins is ignored.  
1: mode control by signal applied on external MODESEL0 and/or  
MODESEL1 pins only, not by internal I2C register bits, MODE0_I2C  
and MODE1_I2C  
5
4
3
2
1
0
SW1_OUT_2  
[5:0]  
011100  
R/W  
SW1 output voltage for mode setting 2 (see below).  
Table 59.ꢀSW1 output voltage for Mode Setting 2  
000000=0.500V  
001110=0.850V  
001111=0.875V  
011100=1.200V  
011101=1.225V  
011110=1.250V  
011111=1.275V  
100000=1.300V  
100001=1.325V  
100010=1.350V  
100011=1.375V  
100100=1.400V  
100101=1.425V  
000001=0.525V  
000010=0.550V  
000011=0.575V  
000100=0.600V  
000101=0.625V  
000110=0.650V  
000111=0.675V  
001000=0.700V  
001001=0.725V  
010000=0.900V  
010001=0.925V  
010010=0.950V  
010011=0.975V  
010100=1.000V  
010101=1.025V  
010110=1.050V  
010111=1.075V  
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Power management IC for low-power microcontroller applications  
Table 59.ꢀSW1 output voltage for Mode Setting 2...continued  
001010=0.750V  
001011=0.775V  
001100=0.800V  
001101=0.825V  
011000=1.100V  
011001=1.125V  
011010=1.150V  
011011=1.175V  
100110=1.450V  
100111=1.475V  
101000=1.500V  
101001~111110=1.5V  
111111 = 1.8V  
9.5.37 Mode configuration mode setting 2_1 (MODECFG_2_1, address 2Bh)  
This register contains mode setting 2, part 1 configuration register. This is a READ AND  
WRITE register.  
Table 60.ꢀMODECFG_2_1 register bit description  
Bit  
Symbol  
Default  
value  
Type  
Function  
7
6
RSVD  
0
1
R/W  
R/W  
Reserved bit  
ON_CFG_2  
Mode configuration upon falling edge applied on “ON” pin in  
Mode setting 2  
0: upon valid falling edge applied on “ON” pin, the device  
will switch back to mode 0 setting (if the device is currently  
operating in mode 0 setting, then no mode switch)  
1: upon valid falling edge applied on “ON” pin, no mode  
switch, the device stays in its current mode setting operation  
5
SW2_OUT_2_OFFSET  
0
R/W  
R/W  
SW2 output voltage offset selection in mode setting 2  
0: SW2 Output Voltage = SW2_OUT_2_LSB[4:0] + 0V  
1: SW2 Output Voltage = SW2_OUT_2_LSB[4:0] + 1.2V  
4
3
2
1
0
SW2_OUT_2_LSB  
[4:0]  
01100  
SW2 default output voltage for mode setting 2 (see below)  
Table 61.ꢀSW2 default output voltage for mode setting 2  
00000=1.500V  
00001=1.525V  
00010=1.550V  
00011=1.575V  
00100=1.600V  
00101=1.625V  
00110=1.650V  
00111=1.675V  
01000=1.700V  
01001=1.725V  
01010=1.750V  
01011=1.775V  
01100=1.800V  
01101=1.825V  
01110=1.850V  
01111=1.875V  
10000=1.900V  
10001=1.925V  
10010=1.950V  
10011=1.975V  
10100=2.000V  
10101=2.025V  
10110=2.050V  
10111=2.075V  
11000=2.100V  
11001-11111=2.1V  
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Power management IC for low-power microcontroller applications  
9.5.38 Mode configuration mode setting 2_2 (MODECFG_2_2, address 2Ch)  
This register contains mode setting 2, part 2 configuration register. This is a READ AND  
WRITE register.  
Table 62.ꢀMODECFG_2_2 register bit description  
Bit  
7
Symbol  
Default value Type  
Function  
LDO1_ OUT_2  
[3:0]  
0100  
R/W  
LDO1 default output voltage for mode setting 2 (see below).  
6
5
4
3
SW1_EN_2  
SW2_EN_2  
LDO1_EN_2  
LDO2_EN_2  
1
1
1
1
R/W  
R/W  
R/W  
R/W  
SW1 Enable Control in mode setting 2  
0: SW1 disabled  
1: SW1 enabled  
2
1
0
SW2 Enable Control in mode setting 2  
0: SW2 disabled  
1: SW2 enabled  
LDO1 Enable Control in mode setting 2  
0: LDO1 disabled  
1: LDO1 enabled  
LDO2 Enable Control in mode setting 2  
0: LDO2 disabled  
1: LDO2 enabled  
Table 63.ꢀLDO1 default output voltage for mode setting 2  
0000: 1.700V  
0001: 1.725V  
0010: 1.750V  
0011: 1.775V  
0100: 1.800V  
0101: 1.825V  
0110: 1.850V  
0111: 1.875V  
1000: 1.900V  
1001~1111:1.9V  
9.5.39 Mode configuration mode setting 2_3 (MODECFG_2_3, address 2Dh)  
This register contains mode setting 2, part 3 configuration register. This is a READ AND  
WRITE register.  
Table 64.ꢀMODECFG_2_3 register bit description  
Bit  
7
Symbol  
Default value Type  
Function  
WD_TIMER_2  
[1:0]  
00  
R/W  
Watchdog timer setting in mode setting 2  
00: Watchdog Timer Disabled  
01: Watchdog Timer = 16s  
6
10: Watchdog Timer = 32s  
11: Watchdog Timer = 64s  
5
LDO2_OUT_2_  
OFFSET  
0
R/W  
LDO2 output voltage offset selection in mode setting 2  
0: LDO2 Output Voltage = LDO2_OUT_2_LSB[4:0] + 0V  
1: LDO2 Output Voltage = LDO2_OUT_2_LSB[4:0] + 1.2V  
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PCA9420  
Power management IC for low-power microcontroller applications  
Table 64.ꢀMODECFG_2_3 register bit description...continued  
Bit  
4
Symbol  
Default value Type  
01100 R/W  
Function  
LDO2_OUT_2_  
LDO2 default output voltage for mode setting 2 (see below).  
LSB  
[4:0]  
3
2
1
0
Table 65.ꢀLDO2 default output voltage for mode setting 2  
00000=1.500V  
00001=1.525V  
00010=1.550V  
00011=1.575V  
00100=1.600V  
00101=1.625V  
00110=1.650V  
00111=1.675V  
01000=1.700V  
01001=1.725V  
01010=1.750V  
01011=1.775V  
01100=1.800V  
01101=1.825V  
01110=1.850V  
01111=1.875V  
10000=1.900V  
10001=1.925V  
10010=1.950V  
10011=1.975V  
10100=2.000V  
10101=2.025V  
10110=2.050V  
10111=2.075V  
11000=2.100V  
11001-11111=2.1V  
9.5.40 Mode configuration mode setting 3_0 (MODECFG_3_0, address 2Eh)  
This register contains mode setting 3, part 0 configuration register. This is a READ AND  
WRITE register.  
Table 66.ꢀMODECFG_3_0 register bit description  
Bit  
Symbol  
Default value Type  
Function  
7
SHIP_EN_3  
0
R/W  
Ship mode enable/disable in mode setting 3  
0: Device is NOT set in ship mode  
1: Device is set in ship mode  
6
EN_MODE_  
SEL_BY_PIN_3  
0
R/W  
MODESEL0/MODESEL1 Control Selection in mode setting 3  
0: mode control by internal I2C register bits, MODE0_I2C and/or  
MODE1_I2C only; signal applied on external MODESEL0/MODESEL1  
pins is ignored.  
1: mode control by signal applied on external MODESEL0 and/or  
MODESEL1 pins only, not by internal I2C register bits, MODE0_I2C  
and MODE1_I2C  
5
4
3
2
1
0
SW1_OUT_3  
[5:0]  
011100  
R/W  
SW1 output voltage for mode setting 3 (see below).  
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Power management IC for low-power microcontroller applications  
Table 67.ꢀSW1 output voltage for mode setting 3  
001110=0.850V  
000000=0.500V  
000001=0.525V  
000010=0.550V  
000011=0.575V  
000100=0.600V  
000101=0.625V  
000110=0.650V  
000111=0.675V  
001000=0.700V  
001001=0.725V  
001010=0.750V  
001011=0.775V  
001100=0.800V  
001101=0.825V  
011100=1.200V  
011101=1.225V  
011110=1.250V  
011111=1.275V  
100000=1.300V  
100001=1.325V  
100010=1.350V  
100011=1.375V  
100100=1.400V  
100101=1.425V  
100110=1.450V  
100111=1.475V  
101000=1.500V  
101001~111110=1.5V  
111111 = 1.8V  
001111=0.875V  
010000=0.900V  
010001=0.925V  
010010=0.950V  
010011=0.975V  
010100=1.000V  
010101=1.025V  
010110=1.050V  
010111=1.075V  
011000=1.100V  
011001=1.125V  
011010=1.150V  
011011=1.175V  
9.5.41 Mode configuration mode setting 3_1 (MODECFG_3_1, address 2Fh)  
This register contains mode setting 3, part 1 configuration register. This is a READ AND  
WRITE register.  
Table 68.ꢀMODECFG_3_1 register bit description  
Bit  
7
Symbol  
RSVD  
Default value Type  
Function  
0
1
R/W  
R/W  
Reserved bit  
6
ON_CFG_3  
Mode configuration upon falling edge applied on “ON” pin in  
mode setting 3  
0: upon valid falling edge applied on “ON” pin, the device  
will switch back to mode 0 setting (if the device is currently  
operating in mode 0 setting, then no mode switch)  
1: upon valid falling edge applied on “ON” pin, no mode  
switch, the device stays in its current mode setting operation  
5
SW2_OUT_3_OFFSET  
0
R/W  
R/W  
SW2 output voltage offset selection in mode setting 3  
0: SW2 Output Voltage = SW2_OUT_3_LSB[4:0] + 0V  
1: SW2 Output Voltage = SW2_OUT_3_LSB[4:0] + 1.2V  
4
3
2
1
0
SW2_OUT_3_LSB  
[4:0]  
01100  
SW2 default output voltage for mode setting 3 (see below).  
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Table 69.ꢀSW2 default output voltage for mode setting 3  
00000=1.500V  
00001=1.525V  
00010=1.550V  
00011=1.575V  
00100=1.600V  
00101=1.625V  
00110=1.650V  
00111=1.675V  
01000=1.700V  
01001=1.725V  
01010=1.750V  
01011=1.775V  
01100=1.800V  
01101=1.825V  
01110=1.850V  
01111=1.875V  
10000=1.900V  
10001=1.925V  
10010=1.950V  
10011=1.975V  
10100=2.000V  
10101=2.025V  
10110=2.050V  
10111=2.075V  
11000=2.100V  
11001-11111=2.1V  
9.5.42 Mode configuration mode setting 3_2 (MODECFG_3_2, address 30h)  
This register contains mode setting 3, part 2 configuration register. This is a READ AND  
WRITE register.  
Table 70.ꢀMODECFG_3_2 register bit description  
Bit  
7
Symbol  
Default value Type  
Function  
LDO1_ OUT_3  
[3:0]  
0100  
R/W  
LDO1 default output voltage for mode setting 3 (see below).  
6
5
4
3
SW1_EN_3  
SW2_EN_3  
LDO1_EN_3  
LDO2_EN_3  
1
1
1
1
R/W  
R/W  
R/W  
R/W  
SW1 Enable Control in mode setting 3  
0: SW1 disabled  
1: SW1 enabled  
2
1
0
SW2 Enable Control in mode setting 3  
0: SW2 disabled  
1: SW2 enabled  
LDO1 Enable Control in mode setting 3  
0: LDO1 disabled  
1: LDO1 enabled  
LDO2 Enable Control in mode setting 3  
0: LDO2 disabled  
1: LDO2 enabled  
Table 71.ꢀLDO1 default output voltage for mode setting 3  
0000: 1.700V  
0001: 1.725V  
0010: 1.750V  
0011: 1.775V  
0100: 1.800V  
0101: 1.825V  
0110: 1.850V  
0111: 1.875V  
1000: 1.900V  
1001~1111:1.9V  
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Power management IC for low-power microcontroller applications  
9.5.43 Mode configuration mode setting 3_3 (MODECFG_3_3, address 31h)  
This register contains mode setting 3, part 3 configuration register. This is a READ AND  
WRITE register.  
Table 72.ꢀMODECFG_3_3 register bit description  
Bit  
Symbol  
Default  
value  
Type  
Function  
7
6
WD_TIMER_3 [1:0]  
00  
R/W  
Watchdog timer setting in mode setting 3  
00: Watchdog Timer Disabled  
01: Watchdog Timer = 16s  
10: Watchdog Timer = 32s  
11: Watchdog Timer = 64s  
5
LDO2_OUT_3_OFFSET  
0
R/W  
R/W  
LDO2 output voltage offset selection in mode setting D  
0: LDO2 Output Voltage = LDO2_OUT_3_LSB[4:0] + 0V  
1: LDO2 Output Voltage = LDO2_OUT_3_LSB[4:0] + 1.2V  
4
3
2
1
0
LDO2_OUT_3_LSB  
[4:0]  
01100  
LDO2 default output voltage for mode setting 3 (see below)  
Table 73.ꢀLDO2 default output voltage for mode setting 3  
00000=1.500V  
00001=1.525V  
00010=1.550V  
00011=1.575V  
00100=1.600V  
00101=1.625V  
00110=1.650V  
00111=1.675V  
01000=1.700V  
01001=1.725V  
01010=1.750V  
01011=1.775V  
01100=1.800V  
01101=1.825V  
01110=1.850V  
01111=1.875V  
10000=1.900V  
10001=1.925V  
10010=1.950V  
10011=1.975V  
10100=2.000V  
10101=2.025V  
10110=2.050V  
10111=2.075V  
11000=2.100V  
11001-11111=2.1V  
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10 Limiting values  
Table 74.ꢀLimiting values  
Symbol  
Parameter  
Conditions  
Min  
-0.3  
-0.3  
-2  
Max  
20  
6
Unit  
V
Voltage range  
VIN  
(with respect to AGND)  
ASYS, VBAT, VBAT_BKUP  
LX1, LX2  
V
6
V
SW1_OUT, SW2_OUT  
LDO1, LDO2  
-0.3  
-0.3  
-0.3  
6
V
6
V
SDA, SCL, MODESEL0,  
MODESEL1, ON, TS, SYSRSTn,  
INTB  
6
V
PGND to AGND  
-0.3  
–40  
0.3  
5
V
IO(sink)  
Tj  
Output sink current  
on pins SYSRSTn,  
INTB, SDA, SCL  
mA  
Junction temperature  
125  
°C  
11 ESD ratings  
Table 75.ꢀLimiting values  
Symbol  
Parameter  
Conditions  
Min  
Max  
Unit  
V(ESD)  
Electrostatic  
discharge  
Human body model (HBM)  
Charged device model (CDM)  
-
-
2000  
500  
V
V
12 Recommended operating conditions  
Table 76.ꢀRecommended operating conditions  
Symbol  
VIN  
Parameter  
Conditions  
Min  
3.3  
0
Max  
Unit  
V
Supply Voltage  
Input/output voltage  
VIN  
5.5  
3.6  
VIO  
SDA, SCL, MODESEL0,  
MODESEL1, SYSRSTn  
V
Tamb  
Tj  
Ambient Temperature  
Junction Temperature  
Storage Temperature  
-40  
-40  
-55  
85  
°C  
°C  
°C  
125  
150  
Tstg  
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13 Electrical characteristics  
Unless otherwise specified, VVIN=5V, VVBAT=3.8V, LDO1_OUT=1.8V, LDO2_OUT=1.8V.  
CVIN=2.2µF/10V, CASYS=4.7µF/10V, CVBAT=1µF/10V, CLDO1_OUT=1µF/6.3V,  
CLDO2_OUT=2.2µF/6.3V, CSW1_OUT=10µF/6.3V, CSW2_OUT=10µF/6.3V, LSW1 =2.2µH, LSW2  
=2.2µH, Tamb= -40°C ~ +85°C, Typical value at Tamb=25°C  
13.1 Top level parameter  
Table 77.ꢀEC table for Top level  
Symbol Parameter  
VBAT QUIESCENT CURRENT  
IBAT_NOLOAD1 VBAT quiescent Current  
Conditions  
Min  
Typ  
Max  
Unit  
TJ = 25°C  
TJ = 85°C[1]  
2.9  
4.5  
4.5  
8
µA  
VBAT=4.5V  
SW1, SW2, LDO1, LDO2  
enabled, no load. No  
switching on SW1, SW2.  
VIN = open, charger disabled  
[1]  
IBAT_NOLOAD2  
VBAT quiescent Current  
TJ = 25°C  
TJ = 85°C  
3.5  
5.5  
5
µA  
VBAT = 4.5V SW1, SW2,  
LDO1, LDO2  
11  
enabled, no load.  
Switching on SW1, SW2.  
VIN = open, charger disabled  
[1]  
IBAT_DISABLE  
VBAT quiescent Current  
TJ = 25°C  
TJ = 85°C  
750  
1200  
3000  
nA  
nA  
VBAT = 4.5V SW1, SW2,  
LDO1, LDO2  
1500  
Disabled  
VIN = open, charger disabled  
IBAT_SHIP  
VBAT quiescent current  
VBAT=4.5V  
100  
150  
VIN =open, Ship  
Mode activated at TJ  
= 25°C  
VIN  
VINUVLO  
VIN Under voltage  
lock-out  
I2C programmable  
in 200mV steps, VIN  
Falling  
2.9  
3.5  
V
VINUVLO Accuracy  
VINUVLO_HYS  
VINOVP  
-5  
+5  
%
Hysteresis on VINUVLO  
200  
mV  
V
I2C programmable  
at 5.5V or 6V, VIN  
Rising  
5.5  
6.0  
VINOVP Accuracy  
Input over- voltage protection  
threshold  
-3.5  
+3.5  
%
VINOVP Hysteresis  
tDGL(VINOVP)  
VIN Falling  
100  
20  
mV  
µs  
Input over-voltage blanking  
time  
VIN: 5 V → 7V, 1V/  
µs  
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Power management IC for low-power microcontroller applications  
Table 77.ꢀEC table for Top level...continued  
Symbol  
Parameter  
Conditions  
Min  
Typ  
85  
Max  
98  
Unit  
VIN Current Limit  
Input current limit  
VIN_ILIM [2:0] = 000 74  
VIN_ILIM [2:0] = 010 370  
mA  
425  
489  
ASYS  
VASYS_UVLO_RISING  
VASYS_UVLO_FALLING  
ASYS in rising  
ASYS in falling  
By MTP  
2.8  
2.7  
2.4  
V
V
%VASYS_UVLO_FALLING  
ASYS UVLO  
Accuracy  
-3.5  
+3.5  
%
VASYS_UVLO_HYS  
ASYS UVLO  
Hysteresis  
400mV for 2.4V  
falling threshold  
100  
mV  
ms  
or 400  
TASYS_SW_DELAY  
Time when ASYS  
voltage is switched  
between VIN and  
VBAT  
0.5  
VASYS_PREWARNING  
ASYS Pre-Warning Threshold ASYS falling, I2C  
3.3  
3.4  
3.5  
3.6  
V
Accuracy  
programmable  
%VASYS_PREWARNING  
ASYS Pre-Warning Threshold  
Accuracy  
-4  
+4  
%
VASYS_PREWARNING_HYS ASYS Pre-warning Threshold  
Hysteresis  
100  
1.9  
mV  
VBAT_BKUP  
VBAT_BKUP UVLO  
VBAT_BKUP falling  
edge  
V
VBAT_BKUP  
-5  
5
%
UVLO Accuracy  
VBAT_BKUP  
100  
mV  
°C  
UVLO Hysteresis  
PROTECTION[1]  
TWARNING  
Pre-warning temperature  
2-bit programmable,  
T_WARNING [1:0]  
75  
80  
85  
90  
TWARNING_HYS  
TSHDN  
Pre-warning threshold  
Hysteresis  
20  
°C  
°C  
Thermal shutdown  
3-bit  
95  
to  
programmable,THEM_  
SHDN [2:0], in 5°C  
steps  
125  
TSHDN_HYS  
Thermal shutdown Hysteresis  
20  
°C  
WATCHDOG & SAFETY TIMER  
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PCA9420  
Power management IC for low-power microcontroller applications  
Table 77.ꢀEC table for Top level...continued  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
TWD_TIMER Range  
Watchdog Timer  
When enabled via  
I2C Programming  
-15%  
Disable +15%  
s
16  
32  
64  
TCHG_PREQ  
Pre-qualification Charging  
Safety Timer Range  
I2C Programmable, -15%  
15min/step [Note]  
When under  
thermal fold- back  
status, the timer  
will extend by 2x  
automatically  
15  
30  
45  
60  
+15%  
+15%  
min  
hrs  
TCHG_FAST  
Fast (CC and CV) Charging  
Safety Timer Range  
I2C Programmable, -15%  
2hr/step [Note]  
3
5
7
9
When under  
thermal fold- back  
status, the timer  
will extend by 2x  
automatically  
POWER UP/DOWN SEQUENCE TIMING[1]  
TPWUP_DLY_INI  
Power up Initial delay  
Time from ON signal  
asserts to the first  
output rail reaches  
90% of its nominal  
value  
2
ms  
TPWDN_DLY_INTERVAL  
TPWUP_DLY_INTERVAL  
Power down interval delay  
Power up interval delay  
Delay between  
power rail  
2
1
ms  
ms  
For power-up: this  
is the time from  
previous voltage  
rail reaches 90% of  
its nominal value to  
the time when the  
following voltage  
rail reaches its 90%  
nominal value  
For power-down:  
this is the time  
from the previous  
voltage rail starts  
falling to the time the  
following rail starts  
falling  
[1] Guaranteed by design and characterization; not tested in production.  
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PCA9420  
Power management IC for low-power microcontroller applications  
13.2 Battery charger  
Table 78.ꢀEC table for Linear Charger  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
LINEAR CHARGER  
VBAT_REG  
VBAT regulation  
voltage range  
I2C programmable,  
20mV/step  
3.60  
-0.75  
-1  
4.60  
0.75  
1
V
%VBAT_REG  
VBAT_REG Regulation IOUT=0 mA to 200 mA;  
Voltage Accuracy  
%
%
VIN= 5V, Tamb=25°C  
IOUT=0 mA to 200 mA;  
VIN= 5V, Tamb=-40°C~  
+85°C  
ICHG_CC  
Constant charging  
current value  
I2C programmable,  
5
315  
mA  
VBAT_REG > VBAT  
>
VBAT_LOW; VIN = 5V  
%ICHG_CC  
ICHG_CC Accuracy  
VBAT_REG > VBAT >  
VBAT_LOW; VIN = 5V  
ICHG_CC > 40mA  
ICHG_CC ≤ 40mA  
-6  
+6  
%
-12  
120  
+12  
160  
%
ΔVBAT_REG (HOT)  
VBAT_REG reduction in T3 < VTS < T4 in TS  
warm condition enabled  
140  
250  
130  
mV  
[1]  
RDS_ON_VIN_TO_ASYS  
RDS_ON between VIN VIN = 5V at 50mA  
and ASYS  
360  
175  
mΩ  
mΩ  
[1]  
RDS_ON_ASYS_TO_VBAT  
RDS_ON between  
ASYS and VBAT  
VBAT = 3.8V at 50mA  
DEAD BATTERY IN PRECHARGE MODE  
VBAT_DEAD  
Dead battery charge [Note: reserve 2-bit MTP  
to low battery charge for programmability,  
1.9  
50  
V
transition threshold  
1.7V/1.8V/1.9V/2.0V]  
%VBAT_DEAD Accuracy  
tDGL_BAT_DEAD2LOW  
-4.5  
+4.5  
%
Deglitch time from  
dead battery charge  
to low battery charge  
transition  
µs  
ICHG_DEAD  
I2C programmable,1mA/  
step  
1
63  
mA  
%
%ICHG_DEAD  
ICHG_DEAD Accuracy  
VBAT =1V, ICHG_DEAD  
=4mA  
-12  
+12  
LOW BATTERY IN PRECHARGE MODE  
VBAT_LOW  
Precharge to fast-  
charge transition  
threshold  
[Note: reserve 2-bit MTP  
for programmability,  
2.3V/2.4V/2.5V/2.6V]  
2.5  
50  
V
%VBAT_LOW  
VBAT_LOW Accuracy  
-3.5  
+3.5  
%
tDGL_BAT_LOW2CC  
Deglitch time on pre-  
charge to fast-charge  
transition  
µs  
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Power management IC for low-power microcontroller applications  
Table 78.ꢀEC table for Linear Charger...continued  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
ICHG_LOW  
I2C programmable,1mA/  
step  
1
63  
mA  
%ICHG_LOW  
ICHG_LOW Accuracy  
VBAT =2V, ICHG_DEAD  
=8mA  
-10  
+10  
%
tDGL_BAT_CC2LOW  
Deglitch time from  
fast-charge to low  
battery charge  
transition  
50  
ms  
TOP-OFF MODE  
ICHG_TOPOFF  
ICHG_TOPOFF  
I2C programmable,1mA/  
step  
1
63  
mA  
programmed value  
ICHG_TOPOFF Accuracy  
ICHG_TOPOFF ≥ 8mA  
-15  
+15  
+20  
%
%
ICHG_TOPOFF < 8mA, test -20  
4mA only in production  
tDGL_BAT_CC2TOPOFF  
ICHG_TOPOFF detection  
deglitch time on fast  
charging to top-off  
charging transition  
20  
ms  
RECHARGE MODE  
VBAT_RESTART  
Charging restart  
threshold voltage  
When below VBAT_  
95  
140  
240  
165  
270  
mV  
ms  
REG [Note: reserve 1-bit  
MTP bit to set the typical  
value, 140mV or 240mV]  
185  
tDGL_BAT_RESTART  
Deglitch time,  
recharge threshold  
detected  
50  
BATTERY PRESENCE DETECTION  
IBAT_DET_SINK  
Sink current during  
battery detection  
VIN = 5V; Battery absent  
VIN = 5V; Battery absent  
5
mA  
ms  
mA  
ms  
V
tDGL(BAT_DET_SINK)  
IBAT_DET_SOURCE  
tDGL(BAT_DET_SOURCE)  
VBAT_DET_LOW  
Deglitch time, for  
sinking current  
300  
5
Source current during VIN = 5V; Battery absent  
battery detection  
Deglitch time, for  
sourcing current  
VIN = 5V; Battery absent  
300  
1.9  
Battery detection  
lower threshold  
VIN = 5V; Battery absent  
[Note: reserve 2-bit MTP  
for programmability,  
1.7V/1.8V/1.9V/2.0V]  
VBAT_DET_UP  
Battery detection  
upper threshold  
VIN = 5V; Battery absent  
[Note: reserve 2-bit MTP  
for programmability,  
3.4  
V
3.2V/3.3V/3.4V/3.5V]  
BATTERY-PACK NTC MONITOR (TS)  
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PCA9420  
Power management IC for low-power microcontroller applications  
Table 78.ꢀEC table for Linear Charger...continued  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
INTC-10k  
NTC thermistor bias  
current  
VTS < ASYS-200mV  
44  
50  
56  
µA  
(-12%)  
(+12%)  
INTC-DIS-10k  
10k NTC bias current VTS < ASYS-200mV  
4.4  
5
5.6  
µA  
when charging is  
disabled  
(-12%)  
(+12%)  
VTS(0°C)  
TS threshold voltage NTC_BETA_SEL [2:0] = 1.171  
1.372  
110  
1.45  
V
at 0°C  
000  
VTS(0°C)_HYS  
VTS(0°C)  
mV  
Hysteresis Threshold  
VTS(10°C)  
TS threshold voltage NTC_BETA_SEL [2:0] = 0.813  
0.900  
70  
0.999  
0.303  
0.187  
V
at 10°C  
000  
VTS(10°C)_HYS  
VTS(10°C)  
mV  
Hysteresis Threshold  
VTS(45°C)  
TS threshold voltage NTC_BETA_SEL [2:0] = 0.205  
0.246  
24  
V
at 45°C  
000  
VTS(45°C)_HYS  
VTS(45°C)  
mV  
Hysteresis Threshold  
VTS(60°C)  
TS threshold voltage NTC_BETA_SEL [2:0] = 0.128  
0.151  
20  
V
at 60°C  
000  
VTS(60°C)_HYS  
VTS(60°C)  
mV  
Hysteresis Threshold  
TDGL (TS)  
CTS  
Deglitch time for TS  
pin  
50  
10  
ms  
nF  
Maximum Decoupling  
Capacitor  
THERMAL REGULATION[1]  
TTHEM_REGULATION Thermal regulation  
I2C Programmable, 5°C/ 80  
step  
115  
°C  
°C  
(fold-back) range  
TTHEM_REGULATION_HYS Thermal regulation  
(fold-back) Hysteresis  
20  
[1] Guaranteed by design and characterization; not tested in production.  
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PCA9420  
Power management IC for low-power microcontroller applications  
13.3 BUCK1 (SW1)  
Table 79.ꢀEC table for BUCK1 (SW1)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
VIN(SW1)  
Input voltage  
range for CORE  
BUCK  
Input is PSYS1, guaranteed by design 2.5  
5.5  
V
IOUT(SW1) MAX  
VSW1 Range  
Max Output  
Current  
Over VPSYS1, guaranteed by design  
250  
0.5  
-3  
mA  
V
Output range for I2C programmable from 0.5V to 1.5V  
CORE BUCK in 25mV/step, a fixed 1.8V  
1.5  
+3  
VSW1_OUT Accuracy CORE BUCK DC Over full VPSYS1, IOUT(SW1)  
,
%
Output Accuracy -40°C ≤ Tamb ≤ +85°C, for all  
VSW1_OUT except for 500mV and 1.8V  
Over full VPSYS1, IOUT(SW1)  
,
-3.5  
-4  
+3.5  
+4  
-40°C ≤ Tamb ≤ +85°C, for only  
VSW1_OUT =1.8V  
Over full VPSYS1, IOUT(SW1)  
,
-40°C ≤ Tamb ≤ +85°C, for only  
VSW1_OUT =0.5V  
ΔVSW1 / Δ VPSYS1  
DC Line  
regulation  
VSW1(NOM)+0.5V < VPSYS1 < 5.5V,  
IOUT(SW1) = 250mA  
0.15  
%/V  
ΔVSW1 / ΔIOUT(SW1) DC Load  
regulation  
0 mA < IOUT(SW1) < 250mA  
-40°C ≤ Tamb ≤ +85°C[1]  
0.008  
%/mA  
TON (SW1)  
110  
240  
700  
350  
ns  
[1]  
IIN(SW1)  
Quiescent current SW1 enabled, IOUT(SW1) = 0, no  
switching  
nA  
Inductor value  
L
2.2  
µH  
[1]  
RDSON(SW1)  
High Side P-FET VPSYS1=5V  
RDSON  
500  
900  
450  
mΩ  
Low Side N-FET VPSYS1=5V  
RDSON  
250  
50  
RSTDN(SW1)  
SW1 Output  
Active Discharge  
Resistance  
Ω
ILIM(SW1)  
Internal Peak  
Current Limit  
Cycle by cycle peak current limit  
700  
950  
50  
1200  
mA  
ns  
tONMIN(SW1)  
tOFFMIN(SW1)  
Minimum On-  
Time  
Minimum-Off  
Time  
10  
ns  
tSSTART(SW1)  
Efficiency[1]  
Soft-start time  
VSW1OUT=1.2V  
@IOUT=10µA  
@IOUT=100µA  
@IOUT=65mA  
@IOUT=125mA  
1.2  
ms  
%
%
%
%
VPSYS1=5V,  
VSW1OUT=1.5V  
> 76  
> 84  
> 86  
> 86  
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PCA9420  
Power management IC for low-power microcontroller applications  
Table 79.ꢀEC table for BUCK1 (SW1)...continued  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
@IOUT=250mA  
> 84  
%
[1] Guaranteed by design and characterization; not tested in production.  
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PCA9420  
Power management IC for low-power microcontroller applications  
13.4 BUCK2 (SW2)  
Table 80.ꢀEC table for BUCK2 (SW2)ꢀ  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
VIN(SW2)  
Input voltage  
Input is VPSYS2  
2.5  
5.5  
V
range for SW2  
IOUT(SW2)MAX  
VSW2_RANGE  
Maximum Output Over VPSYS2  
Current  
Output range for I2C programmable, 25mV/step  
SW2  
500  
mA  
V
1.5  
2.7  
-2  
2.1  
3.3  
2
VSW2_Accuracy  
SW2 DC Output Over full VPSYS2, IOUT(SW2)  
,
%
%
Accuracy  
Tamb=room temp  
Over full VPSYS2, IOUT(SW2)  
temperature range  
,
-3  
3
ΔVSW2 / Δ VPSYS2  
DC Line  
regulation  
VSW2OUT(NOM)+0.5V < VPSYS2  
5.5V, IOUT(SW1) = 500 mA  
<
0.15  
%/V  
ΔVSW2 / ΔIOUT(SW2) DC Load  
regulation  
0 mA < IOUT(SW1) < 500 mA  
0.008  
%/mA  
TON (SW2)  
IIN(SW2)[1]  
250  
360  
700  
490  
ns  
Quiescent current SW2 enabled, IOUT(SW2) =0,  
no switching  
nA  
Inductor value  
L
2.2  
µH  
[1]  
RDSON(SW2)  
High Side P-FET VPSYS2=5V  
RDSON  
250  
450  
250  
mΩ  
Low Side N-FET VPSYS2=5V  
RDSON  
125  
50  
RSTDN(SW2)  
SW2 Output  
Active Discharge  
Resistance  
Ω
ILIM(SW2)  
Peak Current  
Limit  
Cycle by cycle peak current limit  
900  
1300  
1800  
mA  
tONMIN(SW2)  
tOFFMIN(SW2)  
tSSTART(SW2)  
Efficiency[1]  
Min. On Time  
Max On Time  
Softstart time  
50  
ns  
ns  
ms  
%
10  
VSW2OUT=1.8V  
@IOUT=10µA  
1.8  
VPSYS25V  
VSW2OUT=1.8V  
> 78  
> 87  
> 88  
> 88  
> 86  
@IOUT=100µA  
@IOUT=125mA  
@IOUT=250mA  
@IOUT=500mA  
[1] Guaranteed by design and characterization; not tested in production.  
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PCA9420  
Power management IC for low-power microcontroller applications  
13.5 LDO1 (Always-On LDO)  
Table 81.ꢀEC table for LDO1  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
VIN_LDO1  
Input voltage  
Whichever is higher between VBAT_ 2.0  
5.5  
V
range for Always- BKUP and ASYS  
On LDO  
IOUT_LDO1_MAX  
IOUT_LDO1_LIMIT  
VLDO1_OUT Range  
Maximum Output  
DC Current  
1
mA  
mA  
V
Internal Current  
Limit  
LDO1_OUT = GND  
1.4  
1.700  
-3  
3.3  
7.0  
LDO1 nominal  
output voltage  
I2C Programmable, 25mV/step  
Over VIN_LDO1, I OUT= 0~1mA  
1.900  
+3  
VLDO1_OUT  
Accuracy  
LDO1 Output  
Voltage Accuracy  
%
ΔVLDO1_OUT  
(VLDO1_OUT(NOM)  
ΔVIN_LDO1)  
/
DC Line  
regulation  
VLDO1_OUT(NOM)+0.5V < VIN_LDO1  
5V, I OUT= 1mA  
<
1
%/V  
x
x
ΔVLDO1_OUT  
(VLDO1_OUT(NOM)  
ΔV x ΔIOUT  
/
DC Load  
regulation  
0 mA < I OUT < 1 mA  
1
%/mA  
dB  
)
Power Supply  
Rejection Ratio  
(PSRR)[1]  
40  
IIN(LDO1)  
Quiescent current I OUT =0mA  
Dropout Voltage I OUT=1mA  
94  
50  
nA  
mV  
Ω
[1][2]  
VDROPOUT(LDO1)  
RSTDN(LDO1)  
200  
LDO1 Output  
Active Discharge  
Resistance  
[1] Guaranteed by design and characterization; not tested in production.  
[2] Dropout voltage is defined as the input-to-output difference in the predefined load when the output is below 100mV to the nominal regulation voltage.  
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PCA9420  
Power management IC for low-power microcontroller applications  
13.6 LDO2 (System LDO)  
Table 82.ꢀEC table for LDO2  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
VIN_LDO2  
Input voltage  
range  
ASYS  
2.5  
5.5  
V
IOUT_LDO2_MAX  
Maximum Output  
Current  
250  
300  
mA  
mA  
V
[1]  
IOUT_LDO2_LIMIT  
Internal Current  
Limit  
LDO2_OUT = GND  
450  
600  
VLDO2_OUT Range  
LDO2 output  
voltage range  
programmable 25mV steps  
1.5  
2.7  
-3.5  
2.1  
3.3  
3.5  
VLDO2_OUT  
Accuracy  
LDO2 Output  
Accuracy  
Over VIN_LDO2, IOUT  
,
%
temperature  
ΔVLDO2_OUT  
(VLDO2_OUT(NOM)  
ΔVIN_LDO2  
/
DC Line  
regulation  
VLDO2_OUT(NOM)+0.5V < VIN_LDO2  
5.5V, IOUT = 250 mA  
<
0.35  
%/V  
x
x
)
ΔVLDO2_OUT  
(VLDO2_OUT(NOM)  
ΔIOUT  
/
DC Load  
regulation  
0 mA < IOUT < 250 mA  
0.0065  
%/mA  
dB  
)
PSRR[1]  
Power Supply  
Rejection Ratio  
40  
IIN(LDO2)  
Quiescent current IOUT =0mA  
Dropout Voltage IOUT=100mA  
450  
nA  
mV  
Ω
[2]  
VDROPOUT(LDO2)  
150  
RSTDN(LDO2)  
LDO2 Output  
Active Discharge  
Resistance  
150  
[1] Guaranteed by design and characterization; not tested in production.  
[2] Dropout voltage is defined as the input-to-output difference in the predefined load when the output is below 100mV to the nominal regulation voltage.  
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NXP Semiconductors  
PCA9420  
Power management IC for low-power microcontroller applications  
13.7 I2C Interface and Logic I/O  
Table 83.ꢀEC table for I2C and Logic  
Symbol Parameter  
SERIAL INTERFACE (SCL & SDA)  
Conditions  
Min  
Typ  
Max  
Unit  
VPULLUP  
Range[1]  
Pullup Voltage Range  
1.5  
3.6  
V
FI2C  
VIH  
I2C Clock frequency  
On SCL  
0
1000  
kHz  
V
High-level Input voltage  
Low-level Input voltage  
1.5  
VIL  
0.5  
0.4  
V
Vhys  
Hysteresis of Schmitt  
trigger inputs  
0.01  
0
V
VOL  
IOL  
Low-level output voltage  
at 3mA sink current  
V
Low-level output current VOL =0.4 V; Standard and Fast  
modes  
3
mA  
VOL =0.6 V; Fast mode  
6
mA  
µA  
IIL  
Low-level input current  
Capacitance of IO pin  
Pin voltage: 0.1xVpullup to 0.9x  
Vpullup max  
-10  
10  
10  
CI  
pF  
µs  
tHD,STA  
Hold time (repeated)  
START condition  
Fast mode plus; After this period,  
the first clock pulse is generated  
0.26  
tLOW  
LOW period of I2C clock Fast mode plus  
HIGH period of I2C clock Fast mode plus  
0.5  
µs  
µs  
µs  
tHIGH  
tSU,STA  
0.26  
0.26  
Setup time (repeated)  
START condition  
Fast mode plus  
tHD,DAT  
tSU,DAT  
tr  
Data Hold time  
Data Setup time  
Fast mode plus  
Fast mode plus  
Fast mode plus  
0
µs  
ns  
ns  
50  
Rise time of I2C_SCL  
and  
120  
120  
I2C_SDA signals  
tf  
Fall time of I2C_SCL and Fast mode plus  
I2C_SDA signals  
ns  
µs  
µs  
tSU,STO  
tBUF  
Setup time for STOP  
condition  
Fast mode plus  
0.26  
0.5  
Bus free time between  
STOP and START  
Fast mode plus  
condition  
tVD,DAT  
tVD,ACK  
Data valid time  
Fast mode plus  
0.45  
0.45  
µs  
µs  
Data valid acknowledge Fast mode plus  
time  
tSP  
Pulse width of spikes that  
must be suppressed by  
input filter  
0
50  
ns  
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PCA9420  
Power management IC for low-power microcontroller applications  
Table 83.ꢀEC table for I2C and Logic...continued  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
MODESEL0/MODESEL1  
VIH1  
Logic Input High  
1.5  
V
Threshold  
VIL1  
Logic Input Low  
Threshold  
0.4  
1
V
ILK1  
Logic Pin Leakage  
Current  
Pulled up to 5.0V  
0.1  
1
µA  
µs  
tdebounce_1  
Debounce time  
for MODESEL0,  
MODESEL1  
ON  
VIH2  
Logic Input High  
Threshold  
Note: ON pin internally pulled up, no 70% *  
V
external pull-up voltage needed.  
VBAT  
VIL2  
Logic Input Low  
Threshold  
0.4  
V
tdebounce  
Debounce time for ON  
To initiate the default power-up  
sequence  
200  
µs  
SYSRSTn, INTB  
VOL1  
Low-level output voltage  
at 1mA sink current  
0.5  
0.1  
V
ILK2  
Logic Pin Leakage  
Current  
Pulled up to 5.0V  
0.01  
µA  
V
VPULLUP1  
Minimum Supply Voltage  
for valid Open-drain  
signal  
1.5  
[1] Guaranteed by design and characterization; not tested in production.  
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PCA9420  
Power management IC for low-power microcontroller applications  
14 Package outline  
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;  
24 terminals; body 3 x 3 x 0.85 mm  
SOT905-1  
D
B
A
terminal 1  
index area  
E
A
A
1
c
detail X  
C
e
b
1
e
y
C
1
y
M
v
w
C A  
C
B
1
b
M
6
7
11  
12  
L
13  
5
e
e
b
1
E
h
2
17  
1
LC  
terminal 1  
index area  
24  
23  
19  
18  
X
D
h
L
1
LC  
0
1.5  
3 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
A
(1)  
(1)  
UNIT  
A
b
b
c
D
D
E
E
e
e
e
2
L
L
LC  
v
w
y
y
1
1
1
h
h
1
1
max  
0.05 0.25 0.45  
0.00 0.15 0.35  
3.1  
2.9  
2.05  
1.75  
3.1  
2.9  
2.05  
1.75  
0.35  
0.15  
0.1  
0.0  
0.3  
0.2  
mm  
1
0.2  
0.4  
1.8  
1.8  
0.1  
0.05 0.05  
0.1  
Note  
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included  
REFERENCES  
OUTLINE  
VERSION  
EUROPEAN  
PROJECTION  
ISSUE DATE  
IEC  
JEDEC  
JEITA  
06-03-13  
06-03-31  
SOT905-1  
- - -  
- - -  
- - -  
Figure 11.ꢀPackage outline SOT905-1 (HVQFN24)  
PCA9420  
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NXP Semiconductors  
PCA9420  
Power management IC for low-power microcontroller applications  
Figure 12.ꢀPackage outline SOT1397-7 (WLCSP25) (1 of 2)  
PCA9420  
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PCA9420  
Power management IC for low-power microcontroller applications  
Figure 13.ꢀPackage outline SOT1397-7 (WLCSP25) (2 of 2)  
PCA9420  
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PCA9420  
Power management IC for low-power microcontroller applications  
15 Packing information  
15.1 SOT905-1 HVQFN24; reel dry pack, SMD, 7" Q2 standard product  
orientation ordering code (12NC) ending 547  
15.1.1 Dimensions and quantities  
Table 84.ꢀDimensions and quantities  
Reel dimensions  
d × w (mm) [1]  
SPQ/PQ  
(pcs) [2]  
Reels  
per box  
178 × 12  
1400  
1
[1] d = reel diameter; w = tape width.  
[2] Packing quantity dependent on specific product type. View ordering and availability details at NXP order portal, or contact  
your local NXP representative.  
15.1.2 Product orientation  
pin 1  
aaa-006538  
Pin 1 is in quadrant 2.  
Figure 14.ꢀProduct orientation in carrier tape  
15.1.3 Carrier tape dimensions  
4 mm  
A
K
0
0
W
B
0
P
1
T
direction of feed  
001aao148  
Not drawn to scale.  
Figure 15.ꢀCarrier tape dimensions  
Table 85.ꢀCarrier tape dimensions  
In accordance with IEC 60286-3/EIA-481.  
A0 (mm)  
B0 (mm)  
K0 (mm)  
T (mm)  
0.30 ± 0.5  
P1 (mm)  
W (mm)  
3.30 ± 0.1  
3.30 ± 0.1  
1.10 ± 0.1  
8.0 ± 0.1  
12 +.3/-.0  
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PCA9420  
Power management IC for low-power microcontroller applications  
15.2 SOT1401-4 WLCSP25; reel dry pack, SMD, 7" Q1 standard product  
orientation ordering code (12NC) ending 012  
15.2.1 Dimensions and quantities  
Table 86.ꢀDimensions and quantities  
Reel dimensions  
d × w (mm) [1]  
SPQ/PQ  
(pcs) [2]  
Reels  
per box  
180 × 8  
3000  
1
[1] d = reel diameter; w = tape width.  
[2] Packing quantity dependent on specific product type. View ordering and availability details at NXP order portal, or contact  
your local NXP representative.  
15.2.2 Product orientation  
ball 1  
aaa-017857  
Ball 1 is in quadrant 1.  
Figure 16.ꢀProduct orientation in carrier tape  
15.2.3 Carrier tape dimensions  
4 mm  
A
K
0
0
W
B
0
P
1
T
direction of feed  
001aao148  
Not drawn to scale.  
Figure 17.ꢀCarrier tape dimensions  
Table 87.ꢀCarrier tape dimensions  
In accordance with IEC 60286-3/EIA-481.  
A0 (mm)  
B0 (mm)  
K0 (mm)  
T (mm)  
P1 (mm)  
W (mm)  
2.27 ± 0.05  
2.27 ± 0.05  
0.67 ± 0.05  
0.25 ± 0.02  
4.0 ± 0.10  
8 +0.30/-0.10  
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NXP Semiconductors  
PCA9420  
Power management IC for low-power microcontroller applications  
16 Revision history  
Table 88.ꢀRevision history  
Document ID  
PCA9420 v.2  
Modifications:  
Release date  
20210126  
Data sheet status  
Change notice  
Supersedes  
Product data sheet  
-
PCA9420 v.1.1  
Table 7: Corrected reset value for 03 SUB_INT0_MASK, 13 CHG_CNTL3, 23  
MODECFG_0_1  
Table 11: Corrected default value for 5 ON_PUSH_INT_MASK  
Table 16: Removed text "(the default factory setting for the initial power up)"  
Table 26: Corrected default value for ICHG_LOW [5:0]  
Table 36 : Changed invalid to valid for VIN_OK  
Table 44 : Changed default value for ON_CFG_0; deleted "1-bit MTP to set default value"  
Added packing information for SOT905-1 and SOT1401-4  
PCA9420 v.1.1  
Modifications:  
20191024  
Product data sheet  
-
PCA9420 v.1.0  
Table 10 and Table 11: Bit 5 updated from "reserved" to "ON_PUSH_INT".  
Changed orderable part number, packing method and minimum order quantity for  
PCA9420BS.  
PCA9420 v.1.0  
20190601  
Product data sheet  
-
-
PCA9420  
All information provided in this document is subject to legal disclaimers.  
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Product data sheet  
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NXP Semiconductors  
PCA9420  
Power management IC for low-power microcontroller applications  
17 Legal information  
17.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Definition  
Objective [short] data sheet  
Development  
This document contains data from the objective specification for product  
development.  
Preliminary [short] data sheet  
Product [short] data sheet  
Qualification  
Production  
This document contains data from the preliminary specification.  
This document contains the product specification.  
[1] Please consult the most recently issued document before initiating or completing a design.  
[2] The term 'short data sheet' is explained in section "Definitions".  
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple  
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
17.2 Definitions  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors and its suppliers accept no liability for  
inclusion and/or use of NXP Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at the customer’s own  
risk.  
Draft — A draft status on a document indicates that the content is still  
under internal review and subject to formal approval, which may result  
in modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included in a draft version of a document and shall have no  
liability for the consequences of use of such information.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is  
intended for quick reference only and should not be relied upon to contain  
detailed and full information. For detailed and full information see the  
relevant full data sheet, which is available on request via the local NXP  
Semiconductors sales office. In case of any inconsistency or conflict with the  
short data sheet, the full data sheet shall prevail.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes  
no representation or warranty that such applications will be suitable  
for the specified use without further testing or modification. Customers  
are responsible for the design and operation of their applications and  
products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications  
and products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with  
their applications and products. NXP Semiconductors does not accept any  
liability related to any default, damage, costs or problem which is based  
on any weakness or default in the customer’s applications or products, or  
the application or use by customer’s third party customer(s). Customer is  
responsible for doing all necessary testing for the customer’s applications  
and products using NXP Semiconductors products in order to avoid a  
default of the applications and the products or of the application or use by  
customer’s third party customer(s). NXP does not accept any liability in this  
respect.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product  
is deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
17.3 Disclaimers  
Limited warranty and liability — Information in this document is believed  
to be accurate and reliable. However, NXP Semiconductors does not  
give any representations or warranties, expressed or implied, as to the  
accuracy or completeness of such information and shall have no liability  
for the consequences of use of such information. NXP Semiconductors  
takes no responsibility for the content in this document if provided by an  
information source outside of NXP Semiconductors. In no event shall NXP  
Semiconductors be liable for any indirect, incidental, punitive, special or  
consequential damages (including - without limitation - lost profits, lost  
savings, business interruption, costs related to the removal or replacement  
of any products or rework charges) whether or not such damages are based  
on tort (including negligence), warranty, breach of contract or any other  
legal theory. Notwithstanding any damages that customer might incur for  
any reason whatsoever, NXP Semiconductors’ aggregate and cumulative  
liability towards customer for the products described herein shall be limited  
in accordance with the Terms and conditions of commercial sale of NXP  
Semiconductors.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those  
given in the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Right to make changes — NXP Semiconductors reserves the right to  
make changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
PCA9420  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2021. All rights reserved.  
Product data sheet  
Rev. 2 — 26 January 2021  
77 / 82  
 
NXP Semiconductors  
PCA9420  
Power management IC for low-power microcontroller applications  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or  
the grant, conveyance or implication of any license under any copyrights,  
patents or other industrial or intellectual property rights.  
Translations — A non-English (translated) version of a document is for  
reference only. The English version shall prevail in case of any discrepancy  
between the translated and English versions.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
17.4 Trademarks  
Notice: All referenced brands, product names, service names and  
trademarks are the property of their respective owners.  
PCA9420  
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© NXP B.V. 2021. All rights reserved.  
Product data sheet  
Rev. 2 — 26 January 2021  
78 / 82  
NXP Semiconductors  
PCA9420  
Power management IC for low-power microcontroller applications  
Tables  
Tab. 1.  
Tab. 2.  
Tab. 3.  
Tab. 4.  
Ordering information ..........................................2  
Ordering options ................................................2  
Pin Description ..................................................5  
Mode Selection by external pins  
Tab. 47. LDO1 default output voltage for mode  
setting 0 ...........................................................45  
Tab. 48. MODECFG_0_3 register bit description ..........46  
Tab. 49. LDO2 default output voltage for mode  
(MODESEL0, MODESEL1) .............................11  
Regulator summary .........................................13  
I2C Slave Address .......................................... 22  
Register map ...................................................22  
DEV_INFO register bit description .................. 24  
TOP_INT register bit description .....................25  
setting 0 ...........................................................46  
Tab. 5.  
Tab. 6.  
Tab. 7.  
Tab. 8.  
Tab. 9.  
Tab. 50. MODECFG_1_0 register bit description ..........46  
Tab. 51. SW1 output voltage for Mode Setting 1 ...........47  
Tab. 52. MODECFG_1_1 register bit description ..........47  
Tab. 53. SW2 default output voltage for mode  
setting 1 ...........................................................48  
Tab. 10. Sub_INT0 register bit description ....................26  
Tab. 11. Sub_INT0_Mask bit description ...................... 26  
Tab. 12. Sub_INT1 register bit description ....................27  
Tab. 13. Sub_INT1_Mask register bit description ..........28  
Tab. 14. Sub_INT2 register bit description ....................28  
Tab. 15. Sub_INT2_Mask register bit description ..........29  
Tab. 16. TOP_CNTL0 register bit description ................30  
Tab. 17. TOP_CNTL1 register bit description ................31  
Tab. 18. TOP_CNTL2 register bit description ................31  
Tab. 19. TOP_CNTL3 register bit description ................32  
Tab. 20. TOP_CNTL4 register bit description ................33  
Tab. 21. CHG_CNTL0 register bit description ...............33  
Tab. 22. CHG_CNTL1 register bit description ...............34  
Tab. 23. Linear battery charger constant current  
Tab. 54. MODECFG_1_2 register bit description ..........48  
Tab. 55. LDO1 default output voltage for mode  
setting 1 ...........................................................49  
Tab. 56. MODECFG_1_3 register bit description ..........49  
Tab. 57. LDO2 default output voltage for mode  
setting 1 ...........................................................49  
Tab. 58. MODECFG_2_0 register bit description ..........50  
Tab. 59. SW1 output voltage for Mode Setting 2 ...........50  
Tab. 60. MODECFG_2_1 register bit description ..........51  
Tab. 61. SW2 default output voltage for mode  
setting 2 ...........................................................51  
Tab. 62. MODECFG_2_2 register bit description ..........52  
Tab. 63. LDO1 default output voltage for mode  
setting 2 ...........................................................52  
(CC) setting .....................................................34  
Tab. 24. CHG_CNTL2 register bit description ...............34  
Tab. 25. Linear battery charger top-off charge  
Tab. 64. MODECFG_2_3 register bit description ..........52  
Tab. 65. LDO2 default output voltage for mode  
setting 2 ...........................................................53  
current setting ................................................. 35  
Tab. 66. MODECFG_3_0 register bit description ..........53  
Tab. 67. SW1 output voltage for mode setting 3 ........... 54  
Tab. 68. MODECFG_3_1 register bit description ..........54  
Tab. 69. SW2 default output voltage for mode  
setting 3 ...........................................................55  
Tab. 70. MODECFG_3_2 register bit description ..........55  
Tab. 71. LDO1 default output voltage for mode  
Tab. 26. CHG_CNTL3 register bit description ...............35  
Tab. 27. Low battery charge current setting ..................36  
Tab. 28. CHG_CNTL4 register bit description ...............36  
Tab. 29. Dead battery charge current setting ................37  
Tab. 30. CHG_CNTL5 register bit description ...............37  
Tab. 31. VBATREG, linear battery charger regulated  
battery voltage setting .....................................38  
setting 3 ...........................................................55  
Tab. 32. CHG_CNTL6 register bit description ...............38  
Tab. 33. CHG_CNTL7 register bit description ...............39  
Tab. 34. Set the thermistor beta value selection ........... 39  
Tab. 35. Thermal regulation threshold setting ............... 39  
Tab. 36. CHG_STATUS_0 register bit description .........39  
Tab. 37. CHG_STATUS_1 register bit description .........40  
Tab. 38. CHG_STATUS_2 register bit description .........41  
Tab. 39. CHG_STATUS_3 register bit description .........41  
Tab. 40. REG_STATUS register bit description .............42  
Tab. 41. ACT_DISCHARGE_CNTL register bit  
Tab. 72. MODECFG_3_3 register bit description ..........56  
Tab. 73. LDO2 default output voltage for mode  
setting 3 ...........................................................56  
Tab. 74. Limiting values ................................................ 57  
Tab. 75. Limiting values ................................................ 57  
Tab. 76. Recommended operating conditions ...............57  
Tab. 77. EC table for Top level ..................................... 58  
Tab. 78. EC table for Linear Charger ............................61  
Tab. 79. EC table for BUCK1 (SW1) .............................64  
Tab. 80. EC table for BUCK2 (SW2)ꢀ ...........................66  
Tab. 81. EC table for LDO1 .......................................... 67  
Tab. 82. EC table for LDO2 .......................................... 68  
Tab. 83. EC table for I2C and Logic ..............................69  
Tab. 84. Dimensions and quantities .............................. 74  
Tab. 85. Carrier tape dimensions ..................................74  
Tab. 86. Dimensions and quantities .............................. 75  
Tab. 87. Carrier tape dimensions ..................................75  
Tab. 88. Revision history ...............................................76  
description ....................................................... 42  
Tab. 42. MODECFG_0_0 register bit description ..........43  
Tab. 43. SW1 output voltage for Mode Setting 0 ...........44  
Tab. 44. MODECFG_0_1 register bit description ..........44  
Tab. 45. SW2 default output voltage for mode  
setting 0 ...........................................................45  
Tab. 46. MODECFG_0_2 register bit description ..........45  
PCA9420  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2021. All rights reserved.  
Product data sheet  
Rev. 2 — 26 January 2021  
79 / 82  
NXP Semiconductors  
PCA9420  
Power management IC for low-power microcontroller applications  
Figures  
Fig. 1.  
Fig. 2.  
Fig. 3.  
Fig. 4.  
Simplified block diagram ................................... 3  
Fig. 10. Operation over TS bias voltage for JEITA ....... 20  
PCA9420BS pinout (HVQFN24) – top view .......4  
PCA9420UK pinout (WLCSP25) – top view ...... 4  
System configuration diagram; i.MXRT  
Fig. 11.  
Package outline SOT905-1 (HVQFN24) ......... 71  
Fig. 12. Package outline SOT1397-7 (WLCSP25)  
(1 of 2) ............................................................ 72  
series .................................................................7  
System configuration diagram; K4-family  
Fig. 13. Package outline SOT1397-7 (WLCSP25)  
(2 of 2) ............................................................ 73  
Fig. 5.  
MCU .................................................................. 8  
Power-up/down sequence ...............................15  
Pass-Through mode of BUCK2 (SW2) ............16  
Typical Charging Profile Example ................... 18  
Charger State Diagram ................................... 19  
Fig. 14. Product orientation in carrier tape ................... 74  
Fig. 15. Carrier tape dimensions ..................................74  
Fig. 16. Product orientation in carrier tape ................... 75  
Fig. 17. Carrier tape dimensions ..................................75  
Fig. 6.  
Fig. 7.  
Fig. 8.  
Fig. 9.  
PCA9420  
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© NXP B.V. 2021. All rights reserved.  
Product data sheet  
Rev. 2 — 26 January 2021  
80 / 82  
NXP Semiconductors  
PCA9420  
Power management IC for low-power microcontroller applications  
Contents  
1
General description ............................................ 1  
9.5.4  
Sub level interrupt_0 mask (Sub_INT0_  
2
3
4
4.1  
5
Features and Benefits ........................................ 1  
Applications .........................................................2  
Ordering information .......................................... 2  
Ordering options ................................................ 2  
Simplified block diagram ................................... 3  
Pinning information ............................................ 4  
Pinning ...............................................................4  
Pin description ...................................................5  
System configuration diagram .......................... 7  
Functional description ........................................9  
ASYS ................................................................. 9  
VBAT_BKUP (back-up battery input) .................9  
ON ..................................................................... 9  
TS .................................................................... 10  
Mode setting ....................................................10  
Mode selection by external pins  
(MODESEL0, MODESEL1) ............................. 11  
SYSRSTn .........................................................11  
SHIP mode ...................................................... 12  
Watchdog timer ................................................13  
Regulators ........................................................13  
Enable/disable and active discharge ............... 13  
Power-good indication ..................................... 14  
Power-up/down sequence and on-the-fly  
voltage change ................................................ 14  
BUCK1 (SW1, core buck regulator) .................15  
BUCK2 (SW2, system buck regulator) .............15  
LDO1 (always-on LDO) ................................... 16  
LDO2 (system LDO) ........................................16  
Linear battery charger ..................................... 16  
Battery charging management .........................17  
Battery temperature sensing and JEITA-  
compliant charging profile ................................20  
Low-battery/dead-battery (pre-qualification)  
charging ........................................................... 20  
Constant current charging/constant voltage  
Mask, address 03h) .........................................26  
Sub level interrupt_1 (Sub_INT1, address  
04h) ..................................................................27  
Sub level interrupt_1 mask (Sub_INT1_  
Mask, address 05h) .........................................28  
Sub level interrupt_2 (Sub_INT2, address  
06h) ..................................................................28  
Sub level interrupt_2 mask (Sub_INT2_  
Mask, address 07h) .........................................29  
Top level control_0 (TOP_CTL0, address  
09h) ..................................................................30  
Top level control_1 (TOP_CTL1, address  
0Ah) ................................................................. 31  
Top level control_2 (TOP_CTL2, address  
0Bh) ................................................................. 31  
Top level control_3 (TOP_CTL3, address  
0Ch) ................................................................. 32  
Top level control_4 (TOP_CTL4, address  
0Dh) ................................................................. 33  
Battery charger control_0 (CHG_CTL0,  
address 10h) ....................................................33  
Battery charger control_1 (CHG_CTL1,  
address 11h) ....................................................33  
Battery charger control_2 (CHG_CTL2,  
address 12h) ....................................................34  
Battery charger control_3 (CHG_CTL3,  
address 13h) ....................................................35  
Battery charger control_4 (CHG_CTL4,  
address 14h) ....................................................36  
Battery charger control_5 (CHG_CTL5,  
address 15h) ....................................................37  
Battery charger control_6 (CHG_CTL6,  
address 16h) ....................................................38  
Battery charger control_7 (CHG_CTL7,  
address 17h) ....................................................39  
Battery charger status_0 (CHG_STATUS_  
0, address 18h) ............................................... 39  
Battery charger status_1 (CHG_STATUS_  
1, address 19h) ............................................... 40  
Battery charger status_2 (CHG_STATUS_  
2, address 1Ah) ...............................................41  
Battery charger status_3 (CHG_STATUS_  
3, address 1Bh) ...............................................41  
Regulator status (REG_STATUS, address  
20h) ..................................................................42  
Active Discharge Regulator control (ACT_  
DISCHARGE_CNTL, address 21h) ................. 42  
Mode configuration mode setting 0_0  
(MODECFG_0_0, address 22h) ...................... 43  
Mode configuration mode setting 0_1  
(MODECFG_0_1, address 23h) ...................... 44  
Mode configuration mode setting 0_2  
(MODECFG_0_2, address 24h) ...................... 45  
Mode configuration mode setting 0_3  
9.5.5  
9.5.6  
6
9.5.7  
6.1  
6.2  
7
9.5.8  
8
9.5.9  
8.1  
8.2  
8.3  
8.4  
8.5  
8.6  
9.5.10  
9.5.11  
9.5.12  
9.5.13  
9.5.14  
9.5.15  
9.5.16  
9.5.17  
9.5.18  
9.5.19  
9.5.20  
9.5.21  
9.5.22  
9.5.23  
9.5.24  
9.5.25  
9.5.26  
9.5.27  
9.5.28  
9.5.29  
9.5.30  
9.5.31  
8.7  
8.8  
8.9  
8.10  
8.10.1  
8.10.2  
8.10.3  
8.10.4  
8.10.5  
8.10.6  
8.10.7  
8.11  
8.11.1  
8.11.2  
8.11.3  
8.11.4  
charging (fast charging) and termination ......... 20  
Charger safety timers ...................................... 21  
Recharging .......................................................21  
Starting a new charge cycle ............................ 21  
Battery attach detection ...................................21  
Hardware and software reset .......................... 21  
I2C-bus interface and register ......................... 21  
I2C slave address ............................................21  
General call and device ID addresses .............22  
Register type ................................................... 22  
Register map ................................................... 22  
Register description .........................................24  
Device information (DEV_INFO, address  
8.11.5  
8.11.6  
8.11.7  
8.11.8  
8.12  
9
9.1  
9.2  
9.3  
9.4  
9.5  
9.5.1  
00h) ..................................................................24  
Top level interrupt status (TOP_INT,  
address 01h) ....................................................25  
Sub level interrupt_0 (SUB_INT0, address  
9.5.2  
9.5.3  
02h) ..................................................................25  
(MODECFG_0_3, address 25h) ...................... 46  
PCA9420  
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© NXP B.V. 2021. All rights reserved.  
Product data sheet  
Rev. 2 — 26 January 2021  
81 / 82  
NXP Semiconductors  
PCA9420  
Power management IC for low-power microcontroller applications  
9.5.32  
9.5.33  
9.5.34  
9.5.35  
9.5.36  
9.5.37  
9.5.38  
9.5.39  
9.5.40  
9.5.41  
9.5.42  
9.5.43  
Mode configuration mode setting 1_0  
(MODECFG_1_0, address 26h) ...................... 46  
Mode configuration mode setting 1_1  
(MODECFG_1_1, address 27h) ...................... 47  
Mode configuration mode setting 1_2  
(MODECFG_1_2, address 28h) ...................... 48  
Mode configuration mode setting 1_3  
(MODECFG_1_3, address 29h) ...................... 49  
Mode configuration mode setting 2_0  
(MODECFG_2_0, address 2Ah) ......................50  
Mode configuration mode setting 2_1  
(MODECFG_2_1, address 2Bh) ......................51  
Mode configuration mode setting 2_2  
(MODECFG_2_2, address 2Ch) ......................52  
Mode configuration mode setting 2_3  
(MODECFG_2_3, address 2Dh) ......................52  
Mode configuration mode setting 3_0  
(MODECFG_3_0, address 2Eh) ......................53  
Mode configuration mode setting 3_1  
(MODECFG_3_1, address 2Fh) ...................... 54  
Mode configuration mode setting 3_2  
(MODECFG_3_2, address 30h) ...................... 55  
Mode configuration mode setting 3_3  
(MODECFG_3_3, address 31h) ...................... 56  
Limiting values ..................................................57  
ESD ratings ........................................................57  
Recommended operating conditions .............. 57  
Electrical characteristics ..................................58  
Top level parameter .........................................58  
Battery charger ................................................ 61  
BUCK1 (SW1) ................................................. 64  
BUCK2 (SW2) ................................................. 66  
LDO1 (Always-On LDO) ..................................67  
LDO2 (System LDO) ....................................... 68  
I2C Interface and Logic I/O ............................. 69  
Package outline .................................................71  
Packing information ..........................................74  
SOT905-1 HVQFN24; reel dry pack, SMD,  
7" Q2 standard product orientation ordering  
code (12NC) ending 547 ................................. 74  
Dimensions and quantities .............................. 74  
Product orientation ...........................................74  
Carrier tape dimensions .................................. 74  
SOT1401-4 WLCSP25; reel dry pack,  
10  
11  
12  
13  
13.1  
13.2  
13.3  
13.4  
13.5  
13.6  
13.7  
14  
15  
15.1  
15.1.1  
15.1.2  
15.1.3  
15.2  
SMD, 7" Q1 standard product orientation  
ordering code (12NC) ending 012 ................... 75  
Dimensions and quantities .............................. 75  
Product orientation ...........................................75  
Carrier tape dimensions .................................. 75  
Revision history ................................................ 76  
Legal information ..............................................77  
15.2.1  
15.2.2  
15.2.3  
16  
17  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section 'Legal information'.  
© NXP B.V. 2021.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 26 January 2021  
Document identifier: PCA9420  

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