PCA9540BGD,125 [NXP]
PCA9540B - 2-channel I²C-bus multiplexer SON 8-Pin;
| 型号： | PCA9540BGD,125 |
| 厂家： | 
NXP |
| 描述： | PCA9540B - 2-channel I²C-bus multiplexer SON 8-Pin PC 光电二极管 逻辑集成电路 |
| 文件： | 总26页 (文件大小：363K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PCA9540B
2-channel I2C-bus multiplexer
Rev. 5 — 12 February 2013
Product data sheet
1. General description
The PCA9540B is a 1-of-2 bidirectional translating multiplexer, controlled via the I2C-bus.
The SCL/SDA upstream pair fans out to two SCx/SDx downstream pairs, or channels.
Only one SCx/SDx channel is selected at a time, determined by the contents of the
programmable control register.
A power-on reset function puts the registers in their default state and initializes the I2C-bus
state machine with no channels selected.
The pass gates of the multiplexer are constructed such that the VDD pin can be used to
limit the maximum high voltage that will be passed by the PCA9540B. This allows the use
of different bus voltages on each SCx/SDx pair, so that 1.8 V, 2.5 V or 3.3 V parts can
communicate with 5 V parts without any additional protection. External pull-up resistors
can pull the bus up to the desired voltage level for this channel. All I/O pins are 5 V
tolerant.
2. Features and benefits
1-of-2 bidirectional translating multiplexer
I2C-bus interface logic; compatible with SMBus standards
Channel selection via I2C-bus
Power up with all multiplexer channels deselected
Low Ron switches
Allows voltage level translation between 1.8 V, 2.5 V, 3.3 V and 5 V buses
No glitch on power-up
Supports hot insertion
Low standby current
Operating power supply voltage range of 2.3 V to 5.5 V
5 V tolerant inputs
0 Hz to 400 kHz clock frequency
ESD protection exceeds 2000 V HBM per JESD22-A114, and 1000 V CDM per
JESD22-C101
Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
Packages offered: SO8, TSSOP8, XSON8U
PCA9540B
NXP Semiconductors
2-channel I2C-bus multiplexer
3. Ordering information
Table 1.
Ordering information
Type number
Topside
marking
Package
Name
Description
plastic small outline package; 8 leads; body width 3.9 mm
plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1
Version
PCA9540BD
PA9540B
SO8
SOT96-1
PCA9540BDP 9540B
PCA9540BGD 40B
TSSOP8
XSON8U plastic extremely thin small outline package; no leads; 8 terminals; SOT996-2
UTLP based; body 3 2 0.5 mm
3.1 Ordering options
Table 2.
Ordering options
Type number Orderable
part number
Package Packing method
Minimum
order quantity
Temperature range
PCA9540BD
PCA9540BD,112
PCA9540BD,118
SO8
SO8
Tube, bulk pack
2000
Tamb = 40 C to +85 C
Tamb = 40 C to +85 C
Tamb = 40 C to +85 C
Tamb = 40 C to +85 C
Tamb = 40 C to +85 C
Reel pack, SMD, 13-inch 2500
PCA9540BDP PCA9540BDP,118
PCA9540BDP/DG,118 TSSOP8 Reel pack, SMD, 13-inch 2500
TSSOP8 Reel pack, SMD, 13-inch 2500
PCA9540BGD PCA9540BGD,125
XSON8U Reel pack, reverse
3000
4. Block diagram
PCA9540B
SD0
SD1
SC0
SC1
V
SS
SWITCH CONTROL LOGIC
POWER-ON
RESET
V
DD
SCL
SDA
INPUT
FILTER
2
I C-BUS
CONTROL
002aae715
Fig 1. Block diagram of PCA9540B
PCA9540B
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 12 February 2013
2 of 26
PCA9540B
NXP Semiconductors
2-channel I2C-bus multiplexer
5. Pinning information
5.1 Pinning
1
2
3
4
8
7
6
5
SCL
SDA
SC1
SD1
1
2
3
4
8
7
6
5
SCL
SDA
SC1
SD1
PCA9540BD
PCA9540BDP
V
DD
V
V
V
SS
DD
SS
SD0
SC0
SD0
SC0
002aae714
002aae713
Fig 2. Pin configuration for SO8
Fig 3. Pin configuration for TSSOP8
SCL
SDA
1
2
3
4
8
7
6
5
SC1
SD1
PCA9540BGD
V
V
SS
DD
SD0
SC0
002aae753
Transparent top view
Fig 4. Pin configuration for XSON8U
5.2 Pin description
Table 3.
Pin description
Symbol
SCL
SDA
VDD
Pin
1
Description
serial clock line
serial data line
supply voltage
serial data 0
2
3
SD0
SC0
VSS
4
5
serial clock 0
supply ground
serial data 1
6
SD1
SC1
7
8
serial clock 1
PCA9540B
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 12 February 2013
3 of 26
PCA9540B
NXP Semiconductors
2-channel I2C-bus multiplexer
6. Functional description
Refer to Figure 1 “Block diagram of PCA9540B”.
6.1 Device addressing
Following a START condition the bus master must output the address of the slave it is
accessing. The address of the PCA9540B is shown in Figure 5.
slave address
1
1
1
0
0
0
0
R/W
fixed
002aae716
Fig 5. Slave address
The last bit of the slave address defines the operation to be performed. When set to
logic 1 a read is selected, while a logic 0 selects a write operation.
6.2 Control register
Following the successful acknowledgement of the slave address, the bus master will send
a byte to the PCA9540B which will be stored in the Control register. If multiple bytes are
received by the PCA9540B, it will save the last byte received. This register can be written
and read via the I2C-bus.
channel selection bits
(read/write)
7
6
5
4
3
2
1
0
X
X
X
X
X
B2 B1 B0
002aae717
enable bit
Fig 6. Control register
6.2.1 Control register definition
A SCx/SDx downstream pair, or channel, is selected by the contents of the Control
register. This register is written after the PCA9540B has been addressed. The 2 LSBs of
the control byte are used to determine which channel is to be selected. When a channel is
selected, it will become active after a STOP condition has been placed on the I2C-bus.
This ensures that all SCx/SDx lines will be in a HIGH state when the channel is made
active, so that no false conditions are generated at the time of connection.
PCA9540B
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 12 February 2013
4 of 26
PCA9540B
NXP Semiconductors
2-channel I2C-bus multiplexer
Table 4.
Control register: Write — channel selection; Read — channel status
D7
X
D6
X
D5
X
D4
X
D3
X
B2
0
B1
X
0
B0
X
0
Command
no channel selected
channel 0 enabled
channel 1 enabled
no channel selected
X
X
X
X
X
1
X
X
X
X
X
1
0
1
X
X
X
X
X
1
1
X
0
0
0
0
0
0
0
0
no channel selected;
power-up default state
6.3 Power-on reset
When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9540B in
a reset condition until VDD has reached VPOR. At this point, the reset condition is released
and the PCA9540B registers and I2C-bus state machine are initialized to their default
states (all zeroes), causing all the channels to be deselected. Thereafter, VDD must be
lowered below 0.2 V to reset the device.
6.4 Voltage translation
The pass gate transistors of the PCA9540B are constructed such that the VDD voltage can
be used to limit the maximum voltage that will be passed from one I2C-bus to another.
002aaa964
5.0
V
o(sw)
(V)
4.0
(1)
(2)
(3)
3.0
2.0
1.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
DD
5.5
(V)
V
(1) maximum
(2) typical
(3) minimum
Fig 7. Pass gate voltage versus supply voltage
Figure 7 shows the voltage characteristics of the pass gate transistors (note that the graph
was generated using the data specified in Section 11 “Static characteristics” of this
data sheet). In order for the PCA9540B to act as a voltage translator, the Vo(sw) voltage
should be equal to, or lower than the lowest bus voltage. For example, if the main bus was
running at 5 V, and the downstream buses were 3.3 V and 2.7 V, then Vo(sw) should be
equal to or below 2.7 V to effectively clamp the downstream bus voltages. Looking at
PCA9540B
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 12 February 2013
5 of 26
PCA9540B
NXP Semiconductors
2-channel I2C-bus multiplexer
Figure 7, we see that Vo(sw)(max) will be at 2.7 V when the PCA9540B supply voltage is
3.5 V or lower so the PCA9540B supply voltage could be set to 3.3 V. Pull-up resistors
can then be used to bring the bus voltages to their appropriate levels (see Figure 14).
More Information can be found in application note AN262, “PCA954X family of I2C/SMBus
multiplexers and switches”.
7. Characteristics of the I2C-bus
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two
lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be
connected to a positive supply via a pull-up resistor when connected to the output stages
of a device. Data transfer may be initiated only when the bus is not busy.
7.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the HIGH period of the clock pulse as changes in the data line at this time
will be interpreted as control signals (see Figure 8).
SDA
SCL
data line
stable;
data valid
change
of data
allowed
mba607
Fig 8. Bit transfer
7.2 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW
transition of the data line while the clock is HIGH is defined as the START condition (S).
A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP
condition (P) (see Figure 9).
SDA
SCL
S
P
STOP condition
START condition
mba608
Fig 9. Definition of START and STOP conditions
PCA9540B
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 12 February 2013
6 of 26
PCA9540B
NXP Semiconductors
2-channel I2C-bus multiplexer
7.3 System configuration
A device generating a message is a ‘transmitter’, a device receiving is the ‘receiver’. The
device that controls the message is the ‘master’ and the devices which are controlled by
the master are the ‘slaves’ (see Figure 10).
SDA
SCL
SLAVE
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER/
RECEIVER
2
SLAVE
RECEIVER
MASTER
TRANSMITTER
I C-BUS
MULTIPLEXER
SLAVE
002aaa966
Fig 10. System configuration
7.4 Acknowledge
The number of data bytes transferred between the START and the STOP conditions from
transmitter to receiver is not limited. Each byte of eight bits is followed by one
acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,
whereas the master generates an extra acknowledge related clock pulse.
A slave receiver which is addressed must generate an acknowledge after the reception of
each byte. Also, a master must generate an acknowledge after the reception of each byte
that has been clocked out of the slave transmitter. The device that acknowledges has to
pull down the SDA line during the acknowledge clock pulse so that the SDA line is stable
LOW during the HIGH period of the acknowledge related clock pulse; set-up and hold
times must be taken into account.
A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter must leave the data line HIGH to enable the master to generate a STOP
condition.
data output
by transmitter
not acknowledge
data output
by receiver
acknowledge
SCL from master
1
2
8
9
S
clock pulse for
START
condition
acknowledgement
002aaa987
Fig 11. Acknowledgement on the I2C-bus
PCA9540B
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 12 February 2013
7 of 26
PCA9540B
NXP Semiconductors
2-channel I2C-bus multiplexer
7.5 Bus transactions
slave address
control register
SDA
S
1
1
1
0
0
0
0
0
A
X
X
X
X
X
B2 B1 B0
A
P
START condition
R/W acknowledge
from slave
acknowledge
from slave
STOP condition
002aae719
Fig 12. Write control register
last byte
slave address
control register
SDA
S
1
1
1
0
0
0
0
1
A
X
X
X
X
X
B2 B1 B0 NA
P
START condition
R/W acknowledge
from slave
no acknowledge
from master
STOP condition
002aae720
Fig 13. Read control register
8. Application design-in information
V
= 2.7 V to 5.5 V
DD
V
= 3.3 V
DD
V = 2.7 V to 5.5 V
SDA
SCL
SDA
SCL
SD0
SC0
channel 0
V = 2.7 V to 5.5 V
channel 1
PCA9540B
2
I C-bus/SMBus master
SD1
SC1
V
SS
002aae721
Fig 14. Typical application
PCA9540B
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 12 February 2013
8 of 26
PCA9540B
NXP Semiconductors
2-channel I2C-bus multiplexer
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Voltages are referenced to ground (VSS = 0 V).
Symbol
VDD
VI
Parameter
Conditions
Min
Max
+7.0
+7.0
20
Unit
V
supply voltage
0.5
input voltage
0.5
V
II
input current
-
mA
mA
mA
mA
mW
C
IO
output current
-
25
IDD
supply current
-
100
100
400
ISS
ground supply current
total power dissipation
storage temperature
ambient temperature
-
Ptot
Tstg
Tamb
Tj(max)
-
60
40
-
+150
+85
operating
C
[1]
maximum junction
temperature
125
C
[1] The performance capability of a high-performance integrated circuit in conjunction with its thermal
environment can create junction temperatures which are detrimental to reliability. The maximum junction
temperature of this integrated circuit should not exceed 125 C.
10. Thermal characteristics
Table 6.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
Conditions
Typ
158
120
Unit
thermal resistance from junction SO8 package
to ambient
C/W
C/W
TSSOP8 package
PCA9540B
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 12 February 2013
9 of 26
PCA9540B
NXP Semiconductors
2-channel I2C-bus multiplexer
11. Static characteristics
Table 7.
Static characteristics at VDD = 2.3 V to 3.6 V
VSS = 0 V; Tamb = 40 C to +85 C; unless otherwise specified.
See Table 8 for VDD = 3.6 V to 5.5 V.
Symbol Parameter
Supply
Conditions
Min
Typ
Max
Unit
VDD
IDD
supply voltage
supply current
2.3
-
-
3.6
50
V
operating mode; VDD = 3.6 V;
20
A
no load; VI = VDD or VSS
SCL = 100 kHz
;
f
Istb
standby current
standby mode; VDD = 3.6 V;
-
-
0.1
1.6
1
A
no load; VI = VDD or VSS
fSCL = 0 kHz
;
[1]
VPOR
power-on reset voltage
no load; VI = VDD or VSS
2.1
V
Input SCL; input/output SDA
VIL
VIH
IOL
LOW-level input voltage
HIGH-level input voltage
LOW-level output current
0.5
-
+0.3VDD
V
0.7VDD
-
6
-
V
VOL = 0.4 V
VOL = 0.6 V
VI = VDD or VSS
VI = VSS
3
-
mA
mA
A
pF
6
-
-
IL
leakage current
1
-
-
+1
8
Ci
input capacitance
7
Pass gate
Ron
ON-state resistance
switch output voltage
VDD = 3.0 V to 3.6 V; VO = 0.4 V;
IO = 15 mA
5
7
11
16
31
55
VDD = 2.3 V to 2.7 V; VO = 0.4 V;
IO = 10 mA
Vo(sw)
Vi(sw) = VDD = 3.3 V; Io(sw) = 100 A
-
1.9
-
-
V
V
Vi(sw) = VDD = 3.0 V to 3.6 V;
1.6
2.8
Io(sw) = 100 A
Vi(sw) = VDD = 2.5 V; Io(sw) = 100 A
-
1.5
-
-
V
V
Vi(sw) = VDD = 2.3 V to 2.7 V;
1.1
2.0
Io(sw) = 100 A
IL
leakage current
VI = VDD or VSS
VI = VSS
1
-
+1
5
A
Cio
input/output capacitance
-
2.5
pF
[1] VDD must be lowered to 0.2 V in order to reset part.
PCA9540B
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 12 February 2013
10 of 26
PCA9540B
NXP Semiconductors
2-channel I2C-bus multiplexer
Table 8.
Static characteristics at VDD = 3.6 V to 5.5 V
VSS = 0 V; Tamb = 40 C to +85 C; unless otherwise specified.
See Table 7 for VDD = 2.3 V to 3.6 V.
Symbol Parameter
Supply
Conditions
Min
Typ
Max
Unit
VDD
IDD
supply voltage
supply current
3.6
-
-
5.5
V
operating mode; VDD = 5.5 V;
65
100
A
no load; VI = VDD or VSS
fSCL = 100 kHz
;
Istb
standby current
standby mode; VDD = 5.5 V;
no load; VI = VDD or VSS
-
-
0.3
1.6
1
A
[1]
VPOR
power-on reset voltage
no load; VI = VDD or VSS
2.1
V
Input SCL; input/output SDA
VIL
VIH
IOL
LOW-level input voltage
HIGH-level input voltage
LOW-level output current
0.5
-
-
-
-
-
-
6
+0.3VDD
V
0.7VDD
6
V
VOL = 0.4 V
VOL = 0.6 V
VI = VSS
3
-
mA
mA
A
A
pF
6
-
IIL
LOW-level input current
HIGH-level input current
input capacitance
1
1
-
+1
+1
8
IIH
VI = VDD
Ci
VI = VSS
Pass gate
Ron
ON-state resistance
switch output voltage
VDD = 4.5 V to 5.5 V; VO = 0.4 V;
IO = 15 mA
4
9
24
Vo(sw)
Vi(sw) = VDD = 5.0 V; Io(sw) = 100 A
-
3.6
-
-
V
V
Vi(sw) = VDD = 4.5 V to 5.5 V;
2.6
4.5
Io(sw) = 100 A
IL
leakage current
VI = VDD or VSS
VI = VSS
1
-
+1
5
A
Cio
input/output capacitance
-
2.5
pF
[1] VDD must be lowered to 0.2 V in order to reset part.
PCA9540B
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 12 February 2013
11 of 26
PCA9540B
NXP Semiconductors
2-channel I2C-bus multiplexer
12. Dynamic characteristics
Table 9.
Symbol
Dynamic characteristics
Parameter
Conditions
Standard-mode Fast-mode I2C-bus Unit
I2C-bus
Min
Max
Min
Max
tPD
propagation delay
from SDA to SDx,
or SCL to SCx
-
0.3[1]
-
0.3[1] ns
fSCL
tBUF
SCL clock frequency
0
100
-
0
400 kHz
bus free time between a STOP and
START condition
4.7
1.3
-
s
[2]
tHD;STA
hold time (repeated) START
condition
4.0
-
0.6
-
s
tLOW
LOW period of the SCL clock
HIGH period of the SCL clock
4.7
4.0
4.7
-
-
-
1.3
0.6
0.6
-
-
-
s
s
s
tHIGH
tSU;STA
set-up time for a repeated START
condition
tSU;STO
tHD;DAT
tSU;DAT
tr
set-up time for STOP condition
data hold time
4.0
0[3]
250
-
-
0.6
0[3]
-
0.9
-
s
s
ns
3.45
-
data set-up time
100
[4]
[4]
rise time of both SDA and SCL
signals
1000
20 + 0.1Cb
300 ns
300 ns
400 pF
tf
fall time of both SDA and SCL
signals
-
300
20 + 0.1Cb
Cb
capacitive load for each bus line
-
-
400
50
-
-
tSP
pulse width of spikes that must be
suppressed by the input filter
50
ns
[5]
[5]
tVD;DAT
data valid time
HIGH-to-LOW
LOW-to-HIGH
-
-
-
1
0.6
1
-
-
-
1
0.6
1
s
s
s
tVD;ACK
data valid acknowledge time
[1] Pass gate propagation delay is calculated from the 20 typical Ron and the 15 pF load capacitance.
[2] After this period, the first clock pulse is generated.
[3] A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIH(min) of the SCL signal) in order to
bridge the undefined region of the falling edge of SCL.
[4] Cb = total capacitance of one bus line in pF.
[5] Measurements taken with 1 k pull-up resistor and 50 pF load.
PCA9540B
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 12 February 2013
12 of 26
PCA9540B
NXP Semiconductors
2-channel I2C-bus multiplexer
0.7 × V
0.3 × V
DD
SDA
DD
t
t
t
t
SP
t
r
f
HD;STA
BUF
t
LOW
0.7 × V
0.3 × V
DD
SCL
DD
t
t
t
SU;STO
HD;STA
SU;STA
t
t
t
SU;DAT
HD;DAT
HIGH
P
S
Sr
P
002aaa986
Fig 15. Definition of timing on the I2C-bus
PCA9540B
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 12 February 2013
13 of 26
PCA9540B
NXP Semiconductors
2-channel I2C-bus multiplexer
13. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
4
e
w
M
detail X
b
p
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches 0.069
0.01 0.004
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT96-1
076E03
MS-012
Fig 16. Package outline SOT96-1 (SO8)
PCA9540B
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PCA9540B
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2-channel I2C-bus multiplexer
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
A
(A )
2
A
3
A
1
pin 1 index
θ
L
p
L
1
4
detail X
e
w M
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
A
A
A
b
c
D
E
e
H
E
L
L
p
UNIT
v
w
y
Z
θ
1
2
3
p
max.
0.15
0.05
0.95
0.80
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
5.1
4.7
0.7
0.4
0.70
0.35
6°
0°
mm
1.1
0.65
0.25
0.94
0.1
0.1
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-04-09
03-02-18
SOT505-1
Fig 17. Package outline SOT505-1 (TSSOP8)
PCA9540B
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2-channel I2C-bus multiplexer
XSON8: plastic extremely thin small outline package; no leads;
8 terminals; body 3 x 2 x 0.5 mm
SOT996-2
D
B
A
E
A
A
1
detail X
terminal 1
index area
e
1
C
v
C
C
A
B
b
e
L
1
y
1
y
w
C
1
4
L
2
L
8
5
X
0
1
2 mm
scale
Dimensions (mm are the original dimensions)
(1)
Unit
A
A
1
b
D
E
e
e
1
L
L
1
L
2
v
w
y
y
1
max
mm nom 0.5
min
0.05 0.35 2.1 3.1
0.00 0.15 1.9 2.9
0.5 0.15 0.6
0.3 0.05 0.4
0.5 1.5
0.1 0.05 0.05 0.1
sot996-2_po
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
07-12-21
12-11-20
SOT996-2
Fig 18. Package outline SOT996-2 (XSON8U)
PCA9540B
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PCA9540B
NXP Semiconductors
2-channel I2C-bus multiplexer
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
PCA9540B
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Product data sheet
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2-channel I2C-bus multiplexer
14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 19) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 10 and 11
Table 10. SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350
235
350
220
< 2.5
2.5
220
220
Table 11. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 19.
PCA9540B
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NXP Semiconductors
2-channel I2C-bus multiplexer
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 19. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
PCA9540B
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Product data sheet
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NXP Semiconductors
2-channel I2C-bus multiplexer
15. Soldering: PCB footprints
5.50
0.60 (8×)
1.30
4.00 6.60 7.00
1.27 (6×)
solder lands
sot096-1_fr
placement accuracy ± 0.25
Dimensions in mm
occupied area
Fig 20. PCB footprint for SOT96-1 (SO8); reflow soldering
1.20 (2×)
enlarged solder land
0.60 (6×)
0.3 (2×)
1.30
4.00 6.60 7.00
1.27 (6×)
5.50
board direction
solder lands
solder resist
placement accurracy ± ±0.25
sot096-1_fw
occupied area
Dimensions in mm
Fig 21. PCB footprint for SOT96-1 (SO8); wave soldering
PCA9540B
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Product data sheet
Rev. 5 — 12 February 2013
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PCA9540B
NXP Semiconductors
2-channel I2C-bus multiplexer
3.600
2.950
0.725
0.125
0.125
5.750 3.600
3.200 5.500
1.150
0.600
0.450
0.650
sot505-1_fr
solder lands
occupied area
Dimensions in mm
Fig 22. PCB footprint for SOT505-1 (TSSOP8); reflow soldering
PCA9540B
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Product data sheet
Rev. 5 — 12 February 2013
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PCA9540B
NXP Semiconductors
2-channel I2C-bus multiplexer
2.400 pa + oa
2.000
0.500
0.250
0.500
0.025
0.025
3.400
pa + oa
4.250
2.000 4.000
0.900
placement area
occupied area
Dimensions in mm
solder lands
solder paste
sot996-2_fr
Fig 23. PCB footprint for SOT996-2 (XSON8U); reflow soldering
PCA9540B
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Product data sheet
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PCA9540B
NXP Semiconductors
2-channel I2C-bus multiplexer
16. Abbreviations
Table 12. Abbreviations
Acronym
CDM
ESD
Description
Charged-Device Model
ElectroStatic Discharge
Human Body Model
Inter-Integrated Circuit bus
Input/Output
HBM
I2C-bus
I/O
IC
Integrated Circuit
LSB
Least Significant Bit
Power-On Reset
POR
SMBus
System Management Bus
17. Revision history
Table 13. Revision history
Document ID
PCA9540B v.5
Modifications:
Release date
Data sheet status
Change notice
Supersedes
20130212
Product data sheet
-
PCA9540B v.4
• Section 2 “Features and benefits”, 13th bullet item: deleted phrase “200 V MM per JESD2-A115”
• Added Section 3.1 “Ordering options”
• Table 5 “Limiting values”: added Tj(max) limits
• Added Section 10 “Thermal characteristics”
• Figure 15 “Definition of timing on the I2C-bus” modified: added 0.3 VDD and 0.7 VDD reference
lines
• Added Section 15 “Soldering: PCB footprints”
PCA9540B v.4
PCA9540B v.3
20090903
20090528
20040929
Product data sheet
Product data sheet
Product data sheet
-
-
-
PCA9540B v.3
PCA9540B v.2
PCA9540B v.1
PCA9540B v.2
(9397 750 13731)
PCA9540B v.1
20040413
Product data
-
-
(9397 750 12918)
PCA9540B
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Product data sheet
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NXP Semiconductors
2-channel I2C-bus multiplexer
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
18.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
PCA9540B
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Product data sheet
Rev. 5 — 12 February 2013
24 of 26
PCA9540B
NXP Semiconductors
2-channel I2C-bus multiplexer
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
I2C-bus — logo is a trademark of NXP B.V.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PCA9540B
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Product data sheet
Rev. 5 — 12 February 2013
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NXP Semiconductors
2-channel I2C-bus multiplexer
20. Contents
1
General description. . . . . . . . . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3
3.1
4
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
Functional description . . . . . . . . . . . . . . . . . . . 4
Device addressing . . . . . . . . . . . . . . . . . . . . . . 4
Control register. . . . . . . . . . . . . . . . . . . . . . . . . 4
Control register definition . . . . . . . . . . . . . . . . . 4
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 5
Voltage translation . . . . . . . . . . . . . . . . . . . . . . 5
6.1
6.2
6.2.1
6.3
6.4
7
Characteristics of the I2C-bus . . . . . . . . . . . . . 6
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
START and STOP conditions . . . . . . . . . . . . . . 6
System configuration . . . . . . . . . . . . . . . . . . . . 7
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Bus transactions. . . . . . . . . . . . . . . . . . . . . . . . 8
7.1
7.2
7.3
7.4
7.5
8
Application design-in information . . . . . . . . . . 8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9
Thermal characteristics . . . . . . . . . . . . . . . . . . 9
Static characteristics. . . . . . . . . . . . . . . . . . . . 10
Dynamic characteristics . . . . . . . . . . . . . . . . . 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
9
10
11
12
13
14
Soldering of SMD packages . . . . . . . . . . . . . . 17
Introduction to soldering . . . . . . . . . . . . . . . . . 17
Wave and reflow soldering . . . . . . . . . . . . . . . 17
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 17
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 18
14.1
14.2
14.3
14.4
15
16
17
Soldering: PCB footprints. . . . . . . . . . . . . . . . 20
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 23
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 23
18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 24
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 25
18.1
18.2
18.3
18.4
19
20
Contact information. . . . . . . . . . . . . . . . . . . . . 25
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 12 February 2013
Document identifier: PCA9540B
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