PCA9546APW [NXP]

4-channel I2C switch with reset; 带复位4通道I2C开关
PCA9546APW
型号: PCA9546APW
厂家: NXP    NXP
描述:

4-channel I2C switch with reset
带复位4通道I2C开关

解复用器 开关 逻辑集成电路 光电二极管
文件: 总25页 (文件大小:141K)
中文:  中文翻译
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PCA9546A  
4-channel I2C switch with reset  
Rev. 03 — 6 April 2005  
Product data sheet  
1. General description  
The PCA9546A is a quad bi-directional translating switch controlled via the I2C-bus. The  
SCL/SDA upstream pair fans out to four downstream pairs, or channels. Any individual  
SCx/SDx channel or combination of channels can be selected, determined by the  
contents of the programmable control register.  
An active LOW reset input allows the PCA9546A to recover from a situation where one of  
the downstream I2C-buses is stuck in a LOW state. Pulling the RESET pin LOW resets the  
I2C-bus state machine and causes all the channels to be deselected as does the internal  
Power-On Reset (POR) function.  
The pass gates of the switches are constructed such that the VDD pin can be used to limit  
the maximum high voltage which will be passed by the PCA9546A. This allows the use of  
different bus voltages on each pair, so that 1.8 V or 2.5 V or 3.3 V parts can communicate  
with 5 V parts without any additional protection. External pull-up resistors pull the bus up  
to the desired voltage level for each channel. All I/O pins are 5 V tolerant.  
2. Features  
1-of-4 bi-directional translating switches  
I2C-bus interface logic; compatible with SMBus standards  
Active LOW reset input  
3 address pins allowing up to 8 devices on the I2C-bus  
Channel selection via I2C-bus, in any combination  
Power-up with all switch channels deselected  
Low Ron switches  
Allows voltage level translation between 1.8 V, 2.5 V, 3.3 V and 5 V buses  
No glitch on power-up  
Supports hot insertion  
Low stand-by current  
Operating power supply voltage range of 2.3 V to 5.5 V  
5 V tolerant Inputs  
0 kHz to 400 kHz clock frequency  
ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per  
JESD22-A115, and 1000 V CDM per JESD22-C101  
Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA  
Three packages offered: SO16, TSSOP16, and HVQFN16  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
3. Ordering information  
Table 1:  
Ordering information  
Tamb = 40 °C to +85 °C  
Type number  
Package  
Name  
Description  
Version  
PCA9546ABS  
PCA9546AD  
HVQFN16 plastic thermal enhanced very thin quad flat package; SOT629-1  
no leads; 16 terminals; body 4 × 4 × 0.85 mm  
SO16  
plastic small outline package; 16 leads;  
body width 3.9 mm  
SOT109-1  
SOT403-1  
PCA9546APW TSSOP16 plastic thin shrink small outline package; 16 leads;  
body width 4.4 mm  
Standard packing quantities and other packaging data are available at  
www.standardics.philips.com/packaging.  
4. Marking  
Table 2:  
Marking codes  
Type number  
PCA9546ABS  
PCA9546AD  
PCA9546APW  
Topside mark  
546A  
PCA9546AD  
PA9546A  
9397 750 14318  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 03 — 6 April 2005  
2 of 25  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
5. Block diagram  
PCA9546A  
SC0  
SC1  
SC2  
SC3  
SD0  
SD1  
SD2  
SD3  
V
SS  
SWITCH CONTROL LOGIC  
V
DD  
POWER-ON  
RESET  
RESET  
SCL  
SDA  
A0  
A1  
A2  
INPUT  
FILTER  
2
I C-BUS  
CONTROL  
002aab188  
Fig 1. Block diagram of PCA9546A  
9397 750 14318  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 03 — 6 April 2005  
3 of 25  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
6. Pinning information  
6.1 Pinning  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
A0  
A1  
V
DD  
SDA  
SCL  
A2  
RESET  
SD0  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
A0  
A1  
V
DD  
SDA  
SCL  
A2  
PCA9546AD  
RESET  
SD0  
SC0  
SC3  
SD3  
SC2  
SD2  
PCA9546APW  
12 SC3  
SD1  
SC0  
11  
10  
9
SD1  
SD3  
SC2  
SD2  
SC1  
SC1  
V
SS  
V
SS  
002aab185  
002aab186  
Fig 2. Pin configuration for SO16  
Fig 3. Pin configuration for TSSOP16  
terminal 1  
index area  
1
2
3
4
12  
11  
10  
9
RESET  
SD0  
SCL  
A2  
PCA9546ABS  
SC0  
SC3  
SD3  
SD1  
002aab187  
Transparent top view  
Fig 4. Pin configuration for HVQFN16 (transparent top view)  
9397 750 14318  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 03 — 6 April 2005  
4 of 25  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
6.2 Pin description  
Table 3:  
Symbol  
Pin description  
Pin  
Description  
SO, TSSOP HVQFN  
A0  
1
15  
16  
1
address input 0  
address input 1  
active LOW reset input  
serial data 0  
A1  
2
RESET  
SD0  
SC0  
SD1  
SC1  
VSS  
3
4
2
5
3
serial clock 0  
serial data 1  
6
4
7
5
6[1]  
serial clock 1  
supply ground  
serial data 2  
8
SD2  
SC2  
SD3  
SC3  
A2  
9
7
10  
11  
12  
13  
14  
15  
16  
8
serial clock 2  
serial data 3  
9
10  
11  
12  
13  
14  
serial clock 3  
address input 2  
serial clock line  
serial data line  
supply voltage  
SCL  
SDA  
VDD  
[1] HVQFN package die supply ground is connected to both the VSS pin and the exposed center pad. The VSS  
pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and  
board-level performance, the exposed pad needs to be soldered to the board using a corresponding  
thermal pad on the board, and for proper heat conduction through the board thermal vias need to be  
incorporated in the PCB in the thermal pad region.  
7. Functional description  
Refer to Figure 1 “Block diagram of PCA9546A” on page 3.  
7.1 Device address  
Following a START condition, the bus master must output the address of the slave it is  
accessing. The address of the PCA9546A is shown in Figure 5. To conserve power, no  
internal pull-up resistors are incorporated on the hardware selectable address pins and  
they must be pulled HIGH or LOW.  
1
1
1
0
A2 A1 A0 R/W  
fixed  
hardware  
selectable  
002aab189  
Fig 5. Slave address  
The last bit of the slave address defines the operation to be performed. When set to  
logic 1 a read is selected, while a logic 0 selects a write operation.  
9397 750 14318  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 03 — 6 April 2005  
5 of 25  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
7.2 Control register  
Following the successful acknowledgement of the slave address, the bus master will send  
a byte to the PCA9546A, which will be stored in the control register. If multiple bytes are  
received by the PCA9546A, it will save the last byte received. This register can be written  
and read via the I2C-bus.  
channel selection bits  
(read/write)  
7
6
5
4
3
2
1
0
X
X
X
X
B3 B2 B1 B0  
channel 0  
channel 1  
channel 2  
channel 3  
002aab190  
Fig 6. Control register  
7.2.1 Control register definition  
One or several SCx/SDx downstream pair, or channel, is selected by the contents of the  
control register. This register is written after the PCA9546A has been addressed. The  
4 LSBs of the control byte are used to determine which channel is to be selected. When a  
channel is selected, the channel will become active after a STOP condition has been  
placed on the I2C-bus. This ensures that all SCx/SDx lines will be in a HIGH state when  
the channel is made active, so that no false conditions are generated at the time of  
connection.  
Table 4:  
D7  
Control register: Write—channel selection; Read—channel status  
D6  
D5  
D4  
B3  
B2  
B1  
B0  
0
Command  
channel 0 disabled  
channel 0 enabled  
channel 1 disabled  
channel 1 enabled  
channel 2 disabled  
channel 2 enabled  
channel 3 disabled  
channel 3 enabled  
X
X
X
X
X
X
X
X
X
1
0
1
X
X
X
X
X
X
X
X
X
X
X
0
1
X
0
1
0
X
0
X
0
X
0
X
0
X
0
X
0
X
0
no channel selected;  
power-up/reset default state  
Remark: Several channels can be enabled at the same time. Example: B3 = 0, B2 = 1,  
B1 = 1, B0 = 0, means that channel 0 and channel 3 are disabled and channel 1 and  
channel 2 are enabled. Care should be taken not to exceed the maximum bus  
capacitance.  
9397 750 14318  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 03 — 6 April 2005  
6 of 25  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
7.3 RESET input  
The RESET input is an active LOW signal which may be used to recover from a bus fault  
condition. By asserting this signal LOW for a minimum of tWL, the PCA9546A will reset its  
registers and I2C-bus state machine and will deselect all channels. The RESET input must  
be connected to VDD through a pull-up resistor.  
7.4 Power-on reset  
When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9546A in  
a reset condition until VDD has reached VPOR. At this point, the reset condition is released  
and the PCA9546A registers and I2C-bus state machine are initialized to their default  
states—all zeroes—causing all the channels to be deselected. Thereafter, VDD must be  
lowered below 0.2 V to reset the device.  
7.5 Voltage translation  
The pass gate transistors of the PCA9546A are constructed such that the VDD voltage can  
be used to limit the maximum voltage that will be passed from one I2C-bus to another.  
002aaa964  
5.0  
V
o(sw)  
(V)  
4.0  
(1)  
(2)  
(3)  
3.0  
2.0  
1.0  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
DD  
5.5  
(V)  
V
(1) maximum  
(2) typical  
(3) minimum  
Fig 7. Pass gate voltage versus supply voltage  
Figure 7 shows the voltage characteristics of the pass gate transistors (note that the graph  
was generated using the data specified in Section 11 “Static characteristics” of this data  
sheet). In order for the PCA9546A to act as a voltage translator, the Vo(sw) voltage should  
be equal to, or lower than the lowest bus voltage. For example, if the main bus was  
running at 5 V, and the downstream buses were 3.3 V and 2.7 V, then Vo(sw) should be  
equal to or below 2.7 V to effectively clamp the downstream bus voltages. Looking at  
Figure 7, we see that Vo(sw)(max) will be at 2.7 V when the PCA9546A supply voltage is  
3.5 V or lower, so the PCA9546A supply voltage could be set to 3.3 V. Pull-up resistors  
can then be used to bring the bus voltages to their appropriate levels (see Figure 14).  
9397 750 14318  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 03 — 6 April 2005  
7 of 25  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
More Information can be found in Application Note AN262: PCA954X family of I2C/SMBus  
multiplexers and switches.  
8. Characteristics of the I2C-bus  
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two  
lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be  
connected to a positive supply via a pull-up resistor when connected to the output stages  
of a device. Data transfer may be initiated only when the bus is not busy.  
8.1 Bit transfer  
One data bit is transferred during each clock pulse. The data on the SDA line must remain  
stable during the HIGH period of the clock pulse as changes in the data line at this time  
will be interpreted as control signals (see Figure 8).  
SDA  
SCL  
data line  
stable;  
data valid  
change  
of data  
allowed  
mba607  
Fig 8. Bit transfer  
8.2 START and STOP conditions  
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW  
transition of the data line while the clock is HIGH is defined as the START condition (S).  
A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP  
condition (P) (see Figure 9).  
SDA  
SCL  
SDA  
SCL  
S
P
STOP condition  
START condition  
mba608  
Fig 9. Definition of START and STOP conditions  
8.3 System configuration  
A device generating a message is a ‘transmitter’, a device receiving is the ‘receiver’. The  
device that controls the message is the ‘master’ and the devices which are controlled by  
the master are the ‘slaves’ (see Figure 10).  
9397 750 14318  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 03 — 6 April 2005  
8 of 25  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
SDA  
SCL  
SLAVE  
TRANSMITTER/  
RECEIVER  
MASTER  
MASTER  
TRANSMITTER/  
RECEIVER  
2
SLAVE  
RECEIVER  
MASTER  
TRANSMITTER  
I C  
TRANSMITTER/  
MULTIPLEXER  
RECEIVER  
SLAVE  
002aaa966  
Fig 10. System configuration  
8.4 Acknowledge  
The number of data bytes transferred between the START and the STOP conditions from  
transmitter to receiver is not limited. Each byte of eight bits is followed by one  
acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,  
whereas the master generates an extra acknowledge related clock pulse.  
A slave receiver which is addressed must generate an acknowledge after the reception of  
each byte. Also, a master must generate an acknowledge after the reception of each byte  
that has been clocked out of the slave transmitter. The device that acknowledges has to  
pull down the SDA line during the acknowledge clock pulse so that the SDA line is stable  
LOW during the HIGH period of the acknowledge related clock pulse; setup and hold  
times must be taken into account.  
A master receiver must signal an end of data to the transmitter by not generating an  
acknowledge on the last byte that has been clocked out of the slave. In this event, the  
transmitter must leave the data line HIGH to enable the master to generate a STOP  
condition.  
data output  
by transmitter  
not acknowledge  
data output  
by receiver  
acknowledge  
SCL from master  
1
2
8
9
S
clock pulse for  
START  
condition  
acknowledgement  
002aaa987  
Fig 11. Acknowledgement on the I2C-bus  
9397 750 14318  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 03 — 6 April 2005  
9 of 25  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
8.5 Bus transactions  
Data is transmitted to the PCA9546A control register using the Write mode as shown in  
Figure 12.  
slave address  
control register  
SDA  
S
1
1
1
0
A2 A1 A0  
0
A
X
X
X
X
B3 B2 B1 B0  
A
P
START condition  
R/W acknowledge  
from slave  
acknowledge  
from slave  
STOP condition  
002aab196  
Fig 12. Write control register  
Data is read from PCA9546A using the Read mode as shown in Figure 13.  
last byte  
slave address  
control register  
SDA  
S
1
1
1
0
A2 A1 A0  
1
A
X
X
X
X
B3 B2 B1 B0 NA  
P
START condition  
R/W acknowledge  
from slave  
no acknowledge  
from master  
STOP condition  
002aab197  
Fig 13. Read control register  
9397 750 14318  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 03 — 6 April 2005  
10 of 25  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
9. Application design-in information  
V
= 2.7 V to 5.5 V  
DD  
V
= 3.3 V  
DD  
V = 2.7 V to 5.5 V  
SDA  
SCL  
SDA  
SCL  
SD0  
SC0  
channel 0  
V = 2.7 V to 5.5 V  
RESET  
2
I C/SMBus master  
SD1  
SC1  
channel 1  
V = 2.7 V to 5.5 V  
PCA9546A  
SD2  
channel 2  
SC2  
V = 2.7 V to 5.5 V  
A2  
A1  
A0  
SD3  
SC3  
channel 3  
V
SS  
002aab198  
Fig 14. Typical application  
9397 750 14318  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 03 — 6 April 2005  
11 of 25  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
10. Limiting values  
Table 5:  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Voltages are referenced to VSS (ground = 0 V). [1]  
Symbol  
VDD  
VI  
Parameter  
Conditions  
Min  
Max  
+7.0  
+7.0  
±20  
Unit  
V
supply voltage  
0.5  
input voltage  
0.5  
V
II  
input current  
-
mA  
mA  
mA  
mA  
mW  
°C  
IO  
output current  
-
±25  
IDD  
supply current  
-
±100  
±100  
400  
ISS  
ground supply current  
total power dissipation  
storage temperature  
operating ambient temperature  
-
Ptot  
Tstg  
Tamb  
-
60  
40  
+150  
+85  
°C  
[1] The performance capability of a high-performance integrated circuit in conjunction with its thermal  
environment can create junction temperatures which are detrimental to reliability. The maximum junction  
temperature of this integrated circuit should not exceed 150 °C.  
9397 750 14318  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 03 — 6 April 2005  
12 of 25  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
11. Static characteristics  
Table 6:  
DC characteristics  
VDD = 2.3 V to 3.6 V; VSS = 0 V; Tamb = 40 °C to +85 °C; unless otherwise specified.  
See Table 7 on page 14 for VDD = 4.5 V to 5.5 V. [1]  
Symbol  
Supply  
VDD  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
supply voltage  
supply current  
2.3  
-
-
3.6  
50  
V
IDD  
Operating mode; VDD = 3.6 V; no load;  
VI = VDD or VSS; fSCL = 100 kHz  
16  
µA  
Istb  
standby current  
Standby mode; VDD = 3.6 V; no load;  
VI = VDD or VSS  
-
-
0.1  
1.6  
1
µA  
[2]  
VPOR  
power-on reset voltage  
no load; VI = VDD or VSS  
2.1  
V
Input SCL; input/output SDA  
VIL  
VIH  
IOL  
LOW-level input voltage  
HIGH-level input voltage  
0.5  
-
0.3VDD  
V
0.7VDD  
-
6
V
LOW-level output current VOL = 0.4 V  
VOL = 0.6 V  
3
-
-
mA  
mA  
µA  
pF  
6
-
-
IL  
leakage current  
VI = VDD or VSS  
1  
-
-
+1  
13  
Ci  
input capacitance  
VI = VSS  
12  
Select inputs A0 to A2, RESET  
VIL  
LOW-level input voltage  
HIGH-level input voltage  
input leakage current  
input capacitance  
0.5  
0.7VDD  
1  
-
0.3VDD  
V
VIH  
-
VDD + 0.5  
V
ILI  
pin at VDD or VSS  
VI = VSS  
-
+1  
3
µA  
pF  
Ci  
-
1.6  
Pass gate  
Ron  
on-state resistance  
switch output voltage  
VDD = 3.67 V; VO = 0.4 V; IO = 15 mA  
5
7
11  
16  
30  
55  
VDD = 2.3 V to 2.7 V; VO = 0.4 V;  
IO = 10 mA  
Vo(sw)  
Vi(sw) = VDD = 3.3 V; Io(sw) = 100 µA  
-
1.9  
-
-
V
V
Vi(sw) = VDD = 3.0 V to 3.6 V;  
1.6  
2.8  
I
o(sw) = 100 µA  
Vi(sw) = VDD = 2.5 V; Io(sw) = 100 µA  
-
1.5  
-
-
V
V
Vi(sw) = VDD = 2.3 V to 2.7 V;  
1.1  
2.0  
I
o(sw) = 100 µA  
IL  
leakage current  
VI = VDD or VSS  
1  
-
+1  
5
µA  
Cio  
input/output capacitance VI = VSS  
-
3
pF  
[1] For operation between published voltage ranges, refer to the worst-case parameter in both ranges.  
[2] VDD must be lowered to 0.2 V in order to reset part.  
9397 750 14318  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 03 — 6 April 2005  
13 of 25  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
Table 7:  
DC characteristics  
VDD = 4.5 V to 5.5 V; VSS = 0 V; Tamb = 40 °C to +85 °C; unless otherwise specified.  
See Table 6 on page 13 for VDD = 2.3 V to 3.6 V. [1]  
Symbol  
Supply  
VDD  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
supply voltage  
supply current  
4.5  
-
-
5.5  
V
IDD  
Operating mode; VDD = 5.5 V;  
65  
100  
µA  
no load; VI = VDD or VSS  
;
fSCL = 100 kHz  
Istb  
standby current  
Standby mode; VDD = 5.5 V;  
no load; VI = VDD or VSS  
-
-
0.3  
1.7  
1
µA  
[2]  
VPOR  
power-on reset voltage  
no load; VI = VDD or VSS  
2.1  
V
Input SCL; input/output SDA  
VIL  
VIH  
IOL  
LOW-level input voltage  
HIGH-level input voltage  
0.5  
-
0.3VDD  
V
0.7VDD  
-
6
-
V
LOW-level output current VOL = 0.4 V  
VOL = 0.6 V  
3
6
1
1
-
-
mA  
mA  
µA  
µA  
pF  
-
-
IIL  
IIH  
Ci  
LOW-level input current  
HIGH-level input current  
input capacitance  
VI = VSS  
VI = VDD  
VI = VSS  
-
1
1
13  
-
12  
Select inputs A0 to A2, RESET  
VIL  
LOW-level input voltage  
HIGH-level input voltage  
input leakage current  
input capacitance  
0.5  
0.7VDD  
1  
-
0.3VDD  
V
VIH  
-
VDD + 0.5  
V
ILI  
pin at VDD or VSS  
VI = VSS  
-
+1  
3
µA  
pF  
Ci  
-
2
Pass gate  
Ron  
on-state resistance  
switch output voltage  
VDD = 4.5 V to 5.5 V; VO = 0.4 V;  
IO = 15 mA  
4
9
24  
-
V
V
Vo(sw)  
Vi(sw) = VDD = 5.0 V;  
-
3.6  
-
I
o(sw) = 100 µA  
Vi(sw) = VDD = 4.5 V to 5.5 V;  
o(sw) = 100 µA  
VI = VDD or VSS  
2.6  
4.5  
I
IL  
leakage current  
1  
-
+1  
5
µA  
Cio  
input/output capacitance VI = VSS  
-
3
pF  
[1] For operation between published voltage ranges, refer to the worst-case parameter in both ranges.  
[2] VDD must be lowered to 0.2 V in order to reset part.  
9397 750 14318  
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Product data sheet  
Rev. 03 — 6 April 2005  
14 of 25  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
12. Dynamic characteristics  
Table 8:  
Dynamic characteristics  
Symbol Parameter  
Conditions  
Standard-mode  
I2C-bus  
Fast-mode I2C-bus Unit  
Min Max  
Min  
Max  
tPD  
propagation delay from SDA to SDn, or  
-
0.3[1]  
-
0.3 [1]  
ns  
SCL to SCn  
fSCL  
tBUF  
SCL clock frequency  
0
100  
-
0
400  
-
kHz  
bus free time between a STOP and  
START condition  
4.7  
1.3  
µs  
tHD;STA  
hold time (repeated) START condition.  
After this period, the first clock pulse is  
generated.  
4.0  
-
0.6  
-
µs  
tLOW  
LOW period of the SCL clock  
HIGH period of the SCL clock  
4.7  
4.0  
4.7  
-
-
-
1.3  
0.6  
0.6  
-
-
-
µs  
µs  
µs  
tHIGH  
tSU;STA  
setup time for a repeated START  
condition  
tSU;STO  
tHD;DAT  
tSU;DAT  
tr  
setup time for STOP condition  
data hold time  
4.0  
0[2]  
-
0.6  
0[2]  
-
µs  
µs  
ns  
ns  
µs  
µs  
ns  
3.45  
-
0.9  
-
data setup time  
250  
100  
[3]  
[3]  
rise time of both SDA and SCL signals  
fall time of both SDA and SCL signals  
capacitive load for each bus line  
-
-
-
-
1000 20 + 0.1Cb  
300  
300  
400  
50  
tf  
300  
400  
50  
20 + 0.1Cb  
Cb  
-
-
tSP  
pulse width of spikes which must be  
suppressed by the input filter  
[4]  
[4]  
tVD;DAT  
data valid time  
HIGH-to-LOW  
LOW-to-HIGH  
-
-
-
1
-
-
-
1
µs  
µs  
µs  
0.6  
1
0.6  
1
tVD;ACK  
RESET  
tw(rst)L  
trst  
data valid Acknowledge  
LOW-level reset time  
4
-
-
-
4
-
-
-
ns  
ns  
ns  
reset time (SDA clear)  
500  
0
500  
0
tREC;STA  
recovery time to START condition  
[1] Pass gate propagation delay is calculated from the 20 typical Ron and the 15 pF load capacitance.  
[2] A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIH(min) of the SCL signal) in order to  
bridge the undefined region of the falling edge of SCL.  
[3] Cb = total capacitance of one bus line in pF.  
[4] Measurements taken with 1 kpull-up resistor and 50 pF load.  
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Product data sheet  
Rev. 03 — 6 April 2005  
15 of 25  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
SDA  
t
t
t
t
t
r
f
HD;STA  
SP  
BUF  
t
LOW  
SCL  
t
t
t
SU;STO  
HD;STA  
SU;STA  
t
t
t
SU;DAT  
HD;DAT  
HIGH  
P
S
Sr  
P
002aaa986  
Fig 15. Definition of timing on the I2C-bus  
ACK or read cycle  
START  
SCL  
SDA  
30 %  
t
rst  
RESET  
LEDx  
50 %  
50 %  
50 %  
t
REC;STA  
t
w(rst)L  
t
rst  
50 %  
LED off  
002aab174  
Fig 16. Definition of RESET timing  
START  
condition  
(S)  
bit 7  
MSB  
(A7)  
STOP  
condition  
(P)  
bit 6  
(A6)  
bit 0 acknowledge  
(R/W) (A)  
protocol  
t
t
t
HIGH  
SU;STA  
LOW  
1
/f  
SCL  
SCL  
SDA  
t
t
BUF  
f
t
r
t
t
t
t
t
t
HD;DAT  
VD;DAT  
VD;ACK  
SU;STO  
002aab175  
HD;STA  
SU;DAT  
Rise and fall times refer to VIL and VIH  
.
Fig 17. I2C-bus timing diagram  
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Product data sheet  
Rev. 03 — 6 April 2005  
16 of 25  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
13. Package outline  
SO16: plastic small outline package; 16 leads; body width 3.9 mm  
SOT109-1  
D
E
A
X
c
y
H
v
M
A
E
Z
16  
9
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
8
e
w
M
detail X  
b
p
0
2.5  
scale  
5 mm  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
10.0  
9.8  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.27  
0.05  
1.05  
0.041  
1.75  
0.25  
0.01  
0.25  
0.01  
0.25  
0.1  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.39  
0.014 0.0075 0.38  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.020  
0.028  
0.012  
inches  
0.069  
0.01 0.004  
Note  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT109-1  
076E07  
MS-012  
Fig 18. Package outline SOT109-1 (SO16)  
9397 750 14318  
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Product data sheet  
Rev. 03 — 6 April 2005  
17 of 25  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm  
SOT403-1  
D
E
A
X
c
y
H
v
M
A
E
Z
9
16  
Q
(A )  
3
A
2
A
A
1
pin 1 index  
θ
L
p
L
1
8
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(2)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.  
8o  
0o  
0.15  
0.05  
0.95  
0.80  
0.30  
0.19  
0.2  
0.1  
5.1  
4.9  
4.5  
4.3  
6.6  
6.2  
0.75  
0.50  
0.4  
0.3  
0.40  
0.06  
mm  
1.1  
0.65  
0.25  
1
0.2  
0.13  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-18  
SOT403-1  
MO-153  
Fig 19. Package outline SOT403-1 (TSSOP16)  
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Product data sheet  
Rev. 03 — 6 April 2005  
18 of 25  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
HVQFN16: plastic thermal enhanced very thin quad flat package; no leads;  
16 terminals; body 4 x 4 x 0.85 mm  
SOT629-1  
B
A
D
terminal 1  
index area  
A
A
1
E
c
detail X  
e
1
C
1/2 e  
y
y
e
v
M
M
b
C
C
A B  
C
1
w
5
8
L
9
4
1
e
e
E
h
2
1/2 e  
12  
terminal 1  
index area  
16  
13  
X
D
h
0
2.5  
scale  
5 mm  
DIMENSIONS (mm are the original dimensions)  
(1)  
A
(1)  
(1)  
UNIT  
A
b
c
E
e
e
1
e
2
y
D
D
E
L
v
w
y
1
1
h
h
max.  
0.05 0.38  
0.00 0.23  
4.1  
3.9  
2.25  
1.95  
4.1  
3.9  
2.25  
1.95  
0.75  
0.50  
mm  
0.05  
0.1  
1
0.2  
0.65  
1.95 1.95  
0.1 0.05  
Note  
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
01-08-08  
02-10-22  
SOT629-1  
- - -  
MO-220  
- - -  
Fig 20. Package outline SOT629-1 (HVQFN16)  
9397 750 14318  
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Product data sheet  
Rev. 03 — 6 April 2005  
19 of 25  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
14. Soldering  
14.1 Introduction to soldering surface mount packages  
This text gives a very brief insight to a complex technology. A more in-depth account of  
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages  
(document order number 9398 652 90011).  
There is no soldering method that is ideal for all surface mount IC packages. Wave  
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch  
SMDs. In these situations reflow soldering is recommended.  
14.2 Reflow soldering  
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and  
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement. Driven by legislation and  
environmental forces the worldwide use of lead-free solder pastes is increasing.  
Several methods exist for reflowing; for example, convection or convection/infrared  
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)  
vary between 100 seconds and 200 seconds depending on heating method.  
Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste  
material. The top-surface temperature of the packages should preferably be kept:  
below 225 °C (SnPb process) or below 245 °C (Pb-free process)  
for all BGA, HTSSON..T and SSOP..T packages  
for packages with a thickness 2.5 mm  
for packages with a thickness < 2.5 mm and a volume 350 mm3 so called  
thick/large packages.  
below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a  
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.  
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.  
14.3 Wave soldering  
Conventional single wave soldering is not recommended for surface mount devices  
(SMDs) or printed-circuit boards with a high component density, as solder bridging and  
non-wetting can present major problems.  
To overcome these problems the double-wave soldering method was specifically  
developed.  
If wave soldering is used the following conditions must be observed for optimal results:  
Use a double-wave soldering method comprising a turbulent wave with high upward  
pressure followed by a smooth laminar wave.  
For packages with leads on two sides and a pitch (e):  
larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be  
parallel to the transport direction of the printed-circuit board;  
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Product data sheet  
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PCA9546A  
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4-channel I2C switch with reset  
smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the  
transport direction of the printed-circuit board.  
The footprint must incorporate solder thieves at the downstream end.  
For packages with leads on four sides, the footprint must be placed at a 45° angle to  
the transport direction of the printed-circuit board. The footprint must incorporate  
solder thieves downstream and at the side corners.  
During placement and before soldering, the package must be fixed with a droplet of  
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the adhesive is cured.  
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C  
or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.  
A mildly-activated flux will eliminate the need for removal of corrosive residues in most  
applications.  
14.4 Manual soldering  
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage  
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be  
limited to 10 seconds at up to 300 °C.  
When using a dedicated tool, all other leads can be soldered in one operation within  
2 seconds to 5 seconds between 270 °C and 320 °C.  
14.5 Package related soldering information  
Table 9:  
Package [1]  
Suitability of surface mount IC packages for wave and reflow soldering methods  
Soldering method  
Wave  
Reflow[2]  
BGA, HTSSON..T[3], LBGA, LFBGA, SQFP,  
SSOP..T[3], TFBGA, VFBGA, XSON  
not suitable  
suitable  
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,  
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,  
HVSON, SMS  
not suitable[4]  
suitable  
PLCC[5], SO, SOJ  
suitable  
suitable  
LQFP, QFP, TQFP  
not recommended[5] [6]  
not recommended[7]  
not suitable  
suitable  
SSOP, TSSOP, VSO, VSSOP  
CWQCCN..L[8], PMFP[9], WQCCN..L[8]  
suitable  
not suitable  
[1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);  
order a copy from your Philips Semiconductors sales office.  
[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the  
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or  
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn  
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit  
Packages; Section: Packing Methods.  
[3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no  
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with  
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package  
body peak temperature must be kept as low as possible.  
9397 750 14318  
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Product data sheet  
Rev. 03 — 6 April 2005  
21 of 25  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the  
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink  
on the top side, the solder might be deposited on the heatsink surface.  
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave  
direction. The package footprint must incorporate solder thieves downstream and at the side corners.  
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is  
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.  
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger  
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.  
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered  
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by  
using a hot bar soldering process. The appropriate soldering profile can be provided on request.  
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.  
15. Abbreviations  
Table 10: Abbreviations  
Acronym  
CDM  
ESD  
HBM  
IC  
Description  
Charged Device Model  
Electro Static Discharge  
Human Body Model  
Integrated Circuit  
LSB  
Least Significant Bit  
Machine Model  
MM  
MSB  
PCB  
Most Significant Bit  
Printed-Circuit Board  
16. Revision history  
Table 11: Revision history  
Document ID  
PCA9546A_3  
Modifications:  
Release date Data sheet status  
20050406 Product data sheet  
Change notice  
Doc. number  
Supersedes  
-
9397 750 14318 PCA9546A_2  
The format of this data sheet has been redesigned to comply with the new presentation and  
information standard of Philips Semiconductors.  
Section 2 “Features” on page 1:  
7th bullet: changed ‘RDSON’ to ‘Ron’  
16th bullet: changed ‘JESDEC’ to ‘JEDEC’  
Figure 4 “Pin configuration for HVQFN16 (transparent top view)” on page 4:  
added pin 1 indicator notch and center pad  
changed pin 1 from ‘A2’ to ‘RESET’  
Section 6.2 “Pin description” on page 5: added Table note 1 and its reference at HVQFN pin 6.  
Section 7.2.1 “Control register definition” on page 6, third sentence: changed ‘The 2 LSBs of the  
control byte ...to ‘The 4 LSBs of the control byte ...’  
Section 7.5 “Voltage translation” on page 7:  
Figure 7 modified and title changed from ‘Vpass voltage versus VDD’ to ‘Pass gate voltage versus  
supply voltage’  
2nd paragraph: changed symbol ‘Vpass’ and ‘Vpass(max)’ to ‘Vo(sw)’ and ‘Vo(sw)(max)’, respectively.  
9397 750 14318  
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Product data sheet  
Rev. 03 — 6 April 2005  
22 of 25  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
Table 11: Revision history …continued  
Document ID  
Release date Data sheet status  
Change notice  
Doc. number  
Supersedes  
Modifications  
(continued):  
Added Section 8.5 “Bus transactions” on page 10; moved Figure 12 “Write control register” and  
Figure 13 “Read control register” to this section.  
Table 5 “Limiting values” on page 12:  
In the description line below table title, changed ‘referenced to GND’ to ‘referenced to VSS  
Removed (old) table note [1], as this statement is now covered in Section 19 “Disclaimers”  
Table 6 “DC characteristics” on page 13:  
added (new) Table note 1  
changed symbol ‘RON’ to ‘Ron’ and its parameter from ‘switch resistance’ to ‘on-state resistance’  
changed symbol ‘Vpass’ to ‘Vo(sw)  
under Conditions column: changed ‘Vswin’ to ‘Vi(sw)’; changed ‘Iswout’ to Io(sw)  
Table 7 “DC characteristics” on page 14:  
added (new) Table note 1  
sub-section ‘Select inputs A0 to A2, RESET’: changed ILI(max) from ‘+50 µA’ to ‘+1 µA’.  
sub-section ‘Pass gate’: changed IL(min) from ‘10 µA’ to ‘1 µA’;  
changed IL(max) from ‘+100 µA’ to ‘+1 µA’  
changed symbol ‘RON’ to ‘Ron’ and its parameter from ‘switch resistance’ to ‘on-state resistance’  
changed symbol ‘Vpass’ to ‘Vo(sw)  
under Conditions column: changed ‘Vswin’ to ‘Vi(sw)’; changed ‘Iswout’ to Io(sw)  
Table 8 “Dynamic characteristics” on page 15:  
symbol ‘tR’ changed to ‘tr’; symbol ‘tF’ changed to ‘tf’  
changed symbols ‘tVD;DATL’ and ‘tVD;DATH’ to ‘tVD;DAT’ and added Conditions indicating  
HIGH-to-LOW and LOW-to-HIGH transitions  
changed symbol ‘tWL(rst)’ to ‘tw(rst)L’  
changed parameter for symbol tREC;STA from ‘recovery to START’ to ‘recovery time to START  
condition’  
in Table note 1: changed ‘RON’ to ‘Ron’  
Added Figure 16 and Figure 17  
Added Section 15 “Abbreviations”  
PCA9546A_2  
PCA9546A_1  
20040929  
Objective data sheet  
-
-
9397 750 13991 PCA9546A_1  
9397 750 13308  
20040728  
Objective data sheet  
-
9397 750 14318  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 03 — 6 April 2005  
23 of 25  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
17. Data sheet status  
Level Data sheet status[1] Product status[2] [3]  
Definition  
I
Objective data  
Development  
This data sheet contains data from the objective specification for product development. Philips  
Semiconductors reserves the right to change the specification in any manner without notice.  
II  
Preliminary data  
Qualification  
This data sheet contains data from the preliminary specification. Supplementary data will be published  
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in  
order to improve the design and supply the best possible product.  
III  
Product data  
Production  
This data sheet contains data from the product specification. Philips Semiconductors reserves the  
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant  
changes will be communicated via a Customer Product/Process Change Notification (CPCN).  
[1]  
[2]  
Please consult the most recently issued data sheet before initiating or completing a design.  
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at  
URL http://www.semiconductors.philips.com.  
[3]  
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
18. Definitions  
19. Disclaimers  
Short-form specification The data in a short-form specification is  
extracted from a full data sheet with the same type number and title. For  
detailed information see the relevant data sheet or data handbook.  
Life support — These products are not designed for use in life support  
appliances, devices, or systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips Semiconductors  
customers using or selling these products for use in such applications do so  
at their own risk and agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in accordance with  
the Absolute Maximum Rating System (IEC 60134). Stress above one or  
more of the limiting values may cause permanent damage to the device.  
These are stress ratings only and operation of the device at these or at any  
other conditions above those given in the Characteristics sections of the  
specification is not implied. Exposure to limiting values for extended periods  
may affect device reliability.  
Right to make changes — Philips Semiconductors reserves the right to  
make changes in the products - including circuits, standard cells, and/or  
software - described or contained herein in order to improve design and/or  
performance. When the product is in full production (status ‘Production’),  
relevant changes will be communicated via a Customer Product/Process  
Change Notification (CPCN). Philips Semiconductors assumes no  
responsibility or liability for the use of any of these products, conveys no  
license or title under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that these products are  
free from patent, copyright, or mask work right infringement, unless otherwise  
specified.  
Application information Applications that are described herein for any  
of these products are for illustrative purposes only. Philips Semiconductors  
make no representation or warranty that such applications will be suitable for  
the specified use without further testing or modification.  
20. Contact information  
For additional information, please visit: http://www.semiconductors.philips.com  
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com  
9397 750 14318  
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.  
Product data sheet  
Rev. 03 — 6 April 2005  
24 of 25  
PCA9546A  
Philips Semiconductors  
4-channel I2C switch with reset  
21. Contents  
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
6
6.1  
6.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5  
7
Functional description . . . . . . . . . . . . . . . . . . . 5  
Device address. . . . . . . . . . . . . . . . . . . . . . . . . 5  
Control register . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Control register definition . . . . . . . . . . . . . . . . . 6  
RESET input. . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Voltage translation . . . . . . . . . . . . . . . . . . . . . . 7  
7.1  
7.2  
7.2.1  
7.3  
7.4  
7.5  
8
Characteristics of the I2C-bus. . . . . . . . . . . . . . 8  
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
START and STOP conditions . . . . . . . . . . . . . . 8  
System configuration . . . . . . . . . . . . . . . . . . . . 8  
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 10  
8.1  
8.2  
8.3  
8.4  
8.5  
9
Application design-in information . . . . . . . . . 11  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12  
Static characteristics. . . . . . . . . . . . . . . . . . . . 13  
Dynamic characteristics . . . . . . . . . . . . . . . . . 15  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17  
10  
11  
12  
13  
14  
14.1  
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
Introduction to soldering surface mount  
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 20  
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 20  
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 21  
Package related soldering information . . . . . . 21  
14.2  
14.3  
14.4  
14.5  
15  
16  
17  
18  
19  
20  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 22  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 22  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 24  
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
Contact information . . . . . . . . . . . . . . . . . . . . 24  
© Koninklijke Philips Electronics N.V. 2005  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior  
written consent of the copyright owner. The information presented in this document does  
not form part of any quotation or contract, is believed to be accurate and reliable and may  
be changed without notice. No liability will be accepted by the publisher for any  
consequence of its use. Publication thereof does not convey nor imply any license under  
patent- or other industrial or intellectual property rights.  
Date of release: 6 April 2005  
Document number: 9397 750 14318  
Published in The Netherlands  

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