PCA9551D,118 [NXP]
PCA9551 - 8-bit I2C-bus LED driver with programmable blink rates SOP 16-Pin;
| 型号： | PCA9551D,118 |
| 厂家： | 
NXP |
| 描述： | PCA9551 - 8-bit I2C-bus LED driver with programmable blink rates SOP 16-Pin PC 驱动 光电二极管 接口集成电路 |
| 文件： | 总26页 (文件大小：169K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PCA9551
8-bit I2C-bus LED driver with programmable blink rates
Rev. 08 — 31 July 2008
Product data sheet
1. General description
The PCA9551 LED blinker blinks LEDs in I2C-bus and SMBus applications where it is
necessary to limit bus traffic or free up the I2C-bus master's (MCU, MPU, DSP, chip set,
etc.) timer. The uniqueness of this device is the internal oscillator with two programmable
blink rates. To blink LEDs using normal I/O expanders like the PCF8574 or PCA9554, the
bus master must send repeated commands to turn the LED on and off. This greatly
increases the amount of traffic on the I2C-bus and uses up one of the master's timers.
The PCA9551 LED blinker instead requires only the initial set-up command to program
BLINK RATE 1 and BLINK RATE 2 (i.e., the frequency and duty cycle) for each individual
output. From then on, only one command from the bus master is required to turn each
individual open-drain output on, off, or to cycle at BLINK RATE 1 or BLINK RATE 2.
Maximum output sink current is 25 mA per bit and 100 mA per package.
Any bits not used for controlling the LEDs can be used for General Purpose parallel
Input/Output (GPIO) expansion.
The active LOW hardware reset pin (RESET) and Power-On Reset (POR) initializes the
registers to their default state, all zeroes, causing the bits to be set HIGH (LED off).
Three hardware address pins on the PCA9551 allow eight devices to operate on the same
bus.
The newer Fast-mode Plus PCA9634 8-bit LED controller offers an individual PWM
dimming control for each channel for better color mixing capabilities with a global PWM for
dimming or blinking all channels at the same time. There are 126 possible address
combinations and the maximum output sink current is 25 mA per bit and 200 mA per
package.
2. Features
I 8 LED drivers (on, off, flashing at a programmable rate)
I 2 selectable, fully programmable blink rates (frequency and duty cycle) between
0.148 Hz and 38 Hz (6.74 seconds and 0.026 seconds)
I Input/outputs not used as LED drivers can be used as regular GPIOs
I Internal oscillator requires no external components
I I2C-bus interface logic compatible with SMBus
I Internal power-on reset
I Noise filter on SCL/SDA inputs
I Active LOW reset input
I 8 open-drain outputs directly drive LEDs to 25 mA
I Edge rate control on outputs
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
I No glitch on power-up
I Supports hot insertion
I Low standby current
I Operating power supply voltage range of 2.3 V to 5.5 V
I 0 Hz to 400 kHz clock frequency
I ESD protection exceeds 2000 V HBM per JESD22-A114, 150 V MM per
JESD22-A115 and 1000 V CDM per JESD22-C101
I Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
I Packages offered: SO16, TSSOP16, HVQFN16
3. Ordering information
Table 1.
Ordering information
Tamb = −40 °C to +85 °C.
Type number
Topside
mark
Package
Name
Description
Version
PCA9551D
PCA9551D SO16
plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
SOT403-1
PCA9551PW
PCA9551
TSSOP16
plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
PCA9551BS
9551
HVQFN16
plastic thermal enhanced very thin quad flat package;
SOT629-1
no leads; 16 terminals; body 4 × 4 × 0.85 mm
4. Block diagram
A0 A1 A2
PCA9551
INPUT
REGISTER
2
SCL
SDA
INPUT
FILTERS
I C-BUS
LED SELECT (LSn)
REGISTER
CONTROL
0
1
V
DD
POWER-ON
RESET
LEDn
RESET
BLINK0
BLINK1
PRESCALER 0
REGISTER
PWM0
REGISTER
PRESCALER 1
REGISTER
PWM1
REGISTER
OSCILLATOR
V
SS
002aac504
Only one I/O shown for clarity.
Fig 1. Block diagram of PCA9551
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
2 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
5. Pinning information
5.1 Pinning
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
A0
A1
V
A0
A1
V
DD
DD
SDA
SDA
A2
SCL
A2
SCL
LED0
LED1
LED2
LED3
RESET
LED7
LED6
LED5
LED4
LED0
LED1
LED2
LED3
RESET
LED7
LED6
LED5
LED4
PCA9551D
PCA9551PW
V
SS
V
SS
002aac500
002aac501
Fig 2. Pin configuration for SO16
Fig 3. Pin configuration for TSSOP16
terminal 1
index area
1
2
3
4
12
11
10
9
A2
LED0
LED1
LED2
SCL
RESET
LED7
LED6
PCA9551BS
002aac502
Transparent top view
Fig 4. Pin configuration for HVQFN16
5.2 Pin description
Table 2.
Symbol Pin
SO16, TSSOP16 HVQFN16
Pin description
Description
A0
1
15
16
1
address input 0
address input 1
address input 2
LED driver 0
LED driver 1
LED driver 2
LED driver 3
supply ground
LED driver 4
LED driver 5
LED driver 6
A1
2
A2
3
LED0
LED1
LED2
LED3
VSS
4
2
5
3
6
4
7
5
6[1]
8
LED4
LED5
LED6
9
7
10
11
8
9
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
3 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
Table 2.
Symbol Pin
SO16, TSSOP16 HVQFN16
Pin description …continued
Description
LED7
RESET
SCL
12
13
14
15
16
10
11
12
13
14
LED driver 7
reset input (active LOW)
serial clock line
serial data line
SDA
VDD
supply voltage
[1] HVQFN16 package die supply ground is connected to both VSS pin and exposed center pad. VSS pin must
be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board
level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad
on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the
PCB in the thermal pad region.
6. Functional description
Refer to Figure 1 “Block diagram of PCA9551”.
6.1 Device address
Following a START condition, the bus master must output the address of the slave it is
accessing. The address of the PCA9551 is shown in Figure 5. To conserve power, no
internal pull-up resistors are incorporated on the hardware selectable address pins and
they must be pulled HIGH or LOW.
slave address
1
1
0
0
A2 A1 A0 R/W
fixed
hardware
selectable
002aac505
Fig 5. PCA9551 slave address
The last bit of the address byte defines the operation to be performed. When set to logic 1
a read is selected, while a logic 0 selects a write operation.
6.2 Control register
Following the successful acknowledgement of the slave address, the bus master will send
a byte to the PCA9551, which will be stored in the Control register.
0
0
0
AI
0
B2 B1 B0
register address
002aac506
Auto-Increment flag
Reset state: 00h
Fig 6. Control register
The lowest 3 bits are used as a pointer to determine which register will be accessed.
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
4 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
If the Auto-Increment (AI) flag is set, the three low order bits of the Control register are
automatically incremented after a read or write. This allows the user to program the
registers sequentially. The contents of these bits will rollover to ‘000’ after the last register
is accessed.
When the Auto-Increment flag is set (AI = 1) and a read sequence is initiated, the
sequence must start by reading a register different from ‘0' (B2 B1 B0 ≠ 000).
Only the 3 least significant bits are affected by the AI flag. Unused bits must be
programmed with zeroes.
6.2.1 Control register definition
Table 3.
Register summary
B2
0
B1
0
B0
0
Symbol
INPUT
PSC0
PWM0
PSC1
PWM1
LS0
Access
Description
read only
read/write
read/write
read/write
read/write
read/write
read/write
input register
0
0
1
frequency prescaler 0
PWM register 0
0
1
0
0
1
1
frequency prescaler 1
PWM register 1
1
0
0
1
0
1
LED0 to LED3 selector
LED4 to LED7 selector
1
1
0
LS1
6.3 Register descriptions
6.3.1 INPUT - Input register
The INPUT register reflects the state of the device pins. Writes to this register will be
acknowledged but will have no effect.
Table 4.
Bit
INPUT - Input register description
7
LED7
X
6
LED6
X
5
LED5
X
4
LED4
X
3
LED3
X
2
LED2
X
1
LED1
X
0
LED0
X
Symbol
Default
Remark: The default value ‘X’ is determined by the externally applied logic level (normally
logic 1) when used for directly driving LED with pull-up to VDD
.
6.3.2 PSC0 - Frequency Prescaler 0
PSC0 is used to program the period of the PWM output.
The period of BLINK0 = (PSC0 + 1) / 38.
Remark: Prescaler calculation is different between the PCA9551 and other PCA955x
LED blinkers. A divider ratio of 38 instead of 44 is used. This different divider ratio causes
the blinking frequency to be 13 % (1 − 38 / 44) lower when the same 8-bit word is used.
The programmed value of Frequency Prescaler 0 must be adjusted to compensate for this
difference in applications where the PCA9551 is used in conjunction with other PCA955x
LED blinkers and the observed blinking frequencies need to be the same.
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
5 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
Table 5.
PSC0 - Frequency Prescaler 0 register description
Bit
7
6
5
4
3
2
1
0
Symbol
Default
PSC0[7] PSC0[6] PSC0[5] PSC0[4] PSC0[3] PSC0[2] PSC0[1] PSC0[0]
1
1
1
1
1
1
1
1
6.3.3 PWM0 - Pulse Width Modulation 0
The PWM0 register determines the duty cycle of BLINK0. The outputs are LOW (LED off)
when the count is less than the value in PWM0 and HIGH when it is greater. If PWM0 is
programmed with 00h, then the PWM0 output is always LOW.
The duty cycle of BLINK0 = (256 − PWM0) / 256.
Table 6.
Bit
PWM0 - Pulse Width Modulation 0 register description
7
6
5
4
3
2
1
0
Symbol
PWM0
[7]
PWM0
[6]
PWM0
[5]
PWM0
[4]
PWM0
[3]
PWM0
[2]
PWM0
[1]
PWM0
[0]
Default
1
0
0
0
0
0
0
0
6.3.4 PSC1 - Frequency Prescaler 1
PSC1 is used to program the period of the PWM output.
The period of BLINK1 = (PSC1 + 1) / 38.
Remark: Prescaler calculation is different between the PCA9551 and other PCA955x
LED blinkers. A divider ratio of 38 instead of 44 is used. This different divider ratio causes
the blinking frequency to be 13 % (1 − 38 / 44) lower when the same 8-bit word is used.
The programmed value of Frequency Prescaler 1 must be adjusted to compensate for this
difference in applications where the PCA9551 is used in conjunction with other PCA955x
LED blinkers and the observed blinking frequencies need to be the same.
Table 7.
Bit
PSC1 - Frequency Prescaler 1 register description
7
6
5
4
3
2
1
0
Symbol
Default
PSC1[7] PSC1[6] PSC1[5] PSC1[4] PSC1[3] PSC1[2] PSC1[1] PSC1[0]
1
1
1
1
1
1
1
1
6.3.5 PWM1 - Pulse Width Modulation 1
The PWM1 register determines the duty cycle of BLINK1. The outputs are LOW (LED off)
when the count is less than the value in PWM1 and HIGH when it is greater. If PWM1 is
programmed with 00h, then the PWM1 output is always LOW (LED off).
The duty cycle of BLINK1 = (256 − PWM1) / 256.
Table 8.
Bit
PWM1 - Pulse Width Modulation 1 register description
7
6
5
4
3
2
1
0
Symbol
PWM1
[7]
PWM1
[6]
PWM1
[5]
PWM1
[4]
PWM1
[3]
PWM1
[2]
PWM1
[1]
PWM1
[0]
Default
1
0
0
0
0
0
0
0
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
6 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
6.3.6 LS0 to LS1 - LED selector registers
The LSn LED select registers determine the source of the LED data.
00 = output is set LOW (LED on)
01 = output is set high-impedance (LED off; default)
10 = output blinks at PWM0 rate
11 = output blinks at PWM1 rate
Table 9.
LS0 to LS1 - LED selector registers bit description
Legend: * default value.
Register Bit
Value
Description
LS0 - LED0 to LED3 selector
LS0
7:6
5:4
3:2
1:0
01*
01*
01*
01*
LED3 selected
LED2 selected
LED1 selected
LED0 selected
LS1 - LED4 to LED7 selector
LS1
7:6
5:4
3:2
1:0
01*
01*
01*
01*
LED7 selected
LED6 selected
LED5 selected
LED4 selected
6.4 Pins used as GPIOs
LED pins not used to control LEDs can be used as general purpose I/Os (GPIOs).
For use as input, set LEDn to high-impedance (01) and then read the pin state via the
Input register.
For use as output, connect external pull-up resistor to the pin and size it according to the
DC recommended operating characteristics. LEDn output pin is HIGH when the output is
programmed as high-impedance, and LOW when the output is programmed LOW through
the ‘LED selector’ register. The output can be pulse-width controlled when PWM0 or
PWM1 are used.
6.5 Power-on reset
When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9551 in
a reset condition until VDD has reached VPOR. At that point, the reset condition is released
and the PCA9551 registers are initialized to their default states, all the outputs in the
OFF state. Thereafter, VDD must be lowered below 0.2 V to reset the device.
6.6 External RESET
A reset can be accomplished by holding the RESET pin LOW for a minimum of tw(rst). The
PCA9551 registers and I2C-bus state machine will be held in their default states until the
RESET input is once again HIGH.
This input requires a pull-up resistor to VDD if no active connection is used.
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
7 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
7. Characteristics of the I2C-bus
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two
lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be
connected to a positive supply via a pull-up resistor when connected to the output stages
of a device. Data transfer may be initiated only when the bus is not busy.
7.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the HIGH period of the clock pulse as changes in the data line at this time
will be interpreted as control signals (see Figure 7).
SDA
SCL
data line
stable;
data valid
change
of data
allowed
mba607
Fig 7. Bit transfer
7.1.1 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW
transition of the data line while the clock is HIGH is defined as the START condition (S). A
LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP
condition (P) (see Figure 8).
SDA
SCL
SDA
SCL
S
P
STOP condition
START condition
mba608
Fig 8. Definition of START and STOP conditions
7.2 System configuration
A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The
device that controls the message is the ‘master’ and the devices which are controlled by
the master are the ‘slaves’ (see Figure 9).
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
8 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
SDA
SCL
SLAVE
TRANSMITTER/
RECEIVER
MASTER
2
MASTER
TRANSMITTER/
RECEIVER
SLAVE
RECEIVER
MASTER
TRANSMITTER
I C-BUS
TRANSMITTER/
RECEIVER
MULTIPLEXER
SLAVE
002aaa966
Fig 9. System configuration
7.3 Acknowledge
The number of data bytes transferred between the START and the STOP conditions from
transmitter to receiver is not limited. Each byte of eight bits is followed by one
acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,
whereas the master generates an extra acknowledge related clock pulse.
A slave receiver which is addressed must generate an acknowledge after the reception of
each byte. Also a master must generate an acknowledge after the reception of each byte
that has been clocked out of the slave transmitter. The device that acknowledges has to
pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable
LOW during the HIGH period of the acknowledge related clock pulse; set-up and hold
times must be taken into account.
A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter must leave the data line HIGH to enable the master to generate a STOP
condition.
data output
by transmitter
not acknowledge
data output
by receiver
acknowledge
SCL from master
1
2
8
9
S
clock pulse for
START
condition
acknowledgement
002aaa987
Fig 10. Acknowledgement on the I2C-bus
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
9 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
7.4 Bus transactions
SCL
1
2
3
4
5
6
7
8
9
slave address
A2 A1 A0
command byte
AI B2 B1 B0
data to register
DATA 1
SDA
S
1
1
0
0
0
A
0
0
0
0
A
A
START condition
R/W acknowledge
from slave
acknowledge
from slave
acknowledge
from slave
write to register
t
v(Q)
data out from port
DATA 1 VALID
002aac507
Fig 11. Write to register
slave address
A2 A1 A0
command byte
AI B2 B1 B0 A
(cont.)
SDA
S
1
1
0
0
0
A
0
0
0
0
START condition
R/W
acknowledge
from slave
acknowledge
from slave
slave address
data from register
DATA (first byte)
data from register
DATA (last byte)
(cont.)
S
1
1
0
0
A2 A1 A0
1
A
A
NA P
Auto-Increment
register address
if AI = 1
(repeated)
START condition
R/W
acknowledge
from master
no acknowledge STOP
from master condition
acknowledge
from slave
at this moment master-transmitter becomes master-receiver
and slave-receiver becomes slave-transmitter
002aac508
Fig 12. Read from register
no acknowledge
from master
slave address
A2 A1 A0
data from port
DATA 1
data from port
DATA 4
SDA
S
1
1
0
0
1
A
A
NA
P
START condition
R/W acknowledge
from slave
acknowledge
from master
STOP
condition
read from
port
t
t
su(D)
h(D)
data into
port
DATA 2
DATA 3
DATA 4
002aac509
Remark: This figure assumes the command byte has previously been programmed with 00h.
Fig 13. Read Input Port register
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
10 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
8. Application design-in information
5 V
5 V
10 kΩ 10 kΩ 10 kΩ
V
2
DD
I C-BUS/SMBus
PCA9551
MASTER
SDA
SDA
SCL
LED0
SCL
LED1
LED2
LED3
LED4
LED5
LED6
LED7
RESET
GPIOs
A2
A1
A0
V
SS
002aac510
LED0 to LED5 are used as LED drivers.
LED6 and LED7 are used as regular GPIOs.
Fig 14. Typical application
8.1 Minimizing IDD when the I/Os are used to control LEDs
When the I/Os are used to control LEDs, they are normally connected to VDD through a
resistor as shown in Figure 14. Since the LED acts as a diode, when the LED is off the
I/O VI is about 1.2 V less than VDD. The supply current, IDD, increases as VI becomes
lower than VDD and is specified as ∆IDD in Table 12 “Static characteristics”.
Designs needing to minimize current consumption, such as battery power applications,
should consider maintaining the I/O pins greater than or equal to VDD when the LED is off.
Figure 15 shows a high value resistor in parallel with the LED. Figure 16 shows VDD less
than the LED supply voltage by at least 1.2 V. Both of these methods maintain the I/O VI
at or above VDD and prevents additional supply current consumption when the LED is off.
3.3 V
5 V
V
DD
V
100 kΩ
V
DD
DD
LED
LED
LEDn
LEDn
002aac189
002aac190
Fig 15. High value resistor in parallel with
the LED
Fig 16. Device supplied by a lower voltage
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
11 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
8.2 Programming example
The following example will show how to set LED0 to LED3 on. It will then set LED4 and
LED5 to blink at 1 Hz at a 50 % duty cycle. LED6 and LED7 will be set to blink at 4 Hz and
at a 25 % duty cycle.
Table 10. Programming PCA9551
Program sequence
I2C-bus
S
START
PCA9551 address with A0 to A2 = LOW
PSC0 subaddress + Auto-Increment
Set prescaler PSC0 to achieve a period of 1 second:
PSC0 + 1
C0h
11h
25h
Blink period = 1 =
-----------------------
38
PSC0 = 37
Set PWM0 duty cycle to 50 %:
80h
09h
C0h
256 – PWM0
= 0.5
--------------------------------
256
PWM0 = 128
Set prescaler PSC1 to achieve a period of 0.25 seconds:
PSC1 + 1
Blink period = 0.25 =
-----------------------
38
PSC1 = 9
Set PWM1 output duty cycle to 25 %:
256 – PWM1
= 0.25
--------------------------------
256
PWM1 = 192
Set LED0 to LED3 on
00h
FAh
P
Set LED4 and LED5 to PWM0, and LED6 or LED7 to PWM1
STOP
9. Limiting values
Table 11. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDD
Parameter
Conditions
Min
Max
Unit
V
supply voltage
−0.5
+6.0
5.5
VI/O
voltage on an input/output pin
output current on pin LEDn
ground supply current
total power dissipation
storage temperature
ambient temperature
V
SS − 0.5
V
IO(LEDn)
ISS
-
±25
100
400
+150
+85
mA
mA
mW
°C
-
Ptot
-
Tstg
−65
−40
Tamb
operating
°C
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
12 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
10. Static characteristics
Table 12. Static characteristics
VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol Parameter
Supplies
Conditions
Min
Typ[1]
Max
Unit
VDD
IDD
supply voltage
supply current
2.3
-
-
5.5
V
operating mode; VDD = 5.5 V;
VI = VDD or VSS; fSCL = 100 kHz
350
500
µA
Istb
standby current
Standby mode; VDD = 5.5 V;
VI = VDD or VSS; fSCL = 0 kHz
-
-
1.9
-
3.0
µA
µA
∆IDD
additional quiescent supply Standby mode; VDD = 5.5 V;
800
current
every LED I/O at VI = 4.3 V;
SCL = 0 kHz
f
[2]
VPOR
power-on reset voltage
no load; VI = VDD or VSS
-
1.7
2.2
V
Input SCL; input/output SDA
VIL
VIH
IOL
IL
LOW-level input voltage
HIGH-level input voltage
LOW-level output current
leakage current
−0.5
-
+0.3VDD
V
0.7VDD
-
5.5
-
V
VOL = 0.4 V
VI = VDD = VSS
VI = VSS
3
6.5
-
mA
µA
pF
−1
-
+1
5
Ci
input capacitance
3.7
I/Os
VIL
VIH
IOL
LOW-level input voltage
HIGH-level input voltage
LOW-level output current
−0.5
-
-
+0.8
5.5
V
V
2.0
VOL = 0.4 V
[3]
[3]
[3]
VDD = 2.3 V
6
9
-
-
-
mA
mA
mA
VDD = 3.0 V
8
11
14
VDD = 5.0 V
10
VOL = 0.7 V
[3]
[3]
[3]
VDD = 2.3 V
11
14
17
−1
-
14
18
24
-
-
mA
mA
mA
µA
VDD = 3.0 V
-
VDD = 5.0 V
-
ILI
input leakage current
VDD = 3.6 V; VI = 0 V or VDD
+1
5
Cio
input/output capacitance
2.1
pF
Select inputs A0, A1, A2; RESET
VIL
VIH
LOW-level input voltage
HIGH-level input voltage
−0.5
2.0
2.0
−1
-
+0.8
V
A0; RESET
A1; A2
-
5.5
V
-
VDD + 0.5
V
ILI
Ci
input leakage current
input capacitance
-
+1
5
µA
pF
-
2.3
[1] Typical limits at VDD = 3.3 V, Tamb = 25 °C.
[2] VDD must be lowered to 0.2 V in order to reset part.
[3] Each I/O must be externally limited to a maximum of 25 mA and the device must be limited to a maximum current of 100 mA.
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
13 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
002aac191
002aac192
20 %
(1)
20 %
(1)
percent
percent
variation
variation
0 %
(2)
0 %
−20 %
−40 %
(2)
(3)
−20 %
(3)
−40 %
−40
−20
0
20
40
60
80
amb
100
(°C)
−40
−20
0
20
40
60
80
amb
100
(°C)
T
T
(1) maximum
(2) average
(3) minimum
(1) maximum
(2) average
(3) minimum
Fig 17. Typical frequency variation over process at
DD = 2.3 V to 3.0 V
Fig 18. Typical frequency variation over process at
VDD = 3.0 V to 5.5 V
V
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
14 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
11. Dynamic characteristics
Table 13. Dynamic characteristics
Symbol
Parameter
Conditions
Standard-mode
I2C-bus
Fast-mode I2C-bus Unit
Min
0
Max
100
-
Min
0
Max
400
-
fSCL
tBUF
SCL clock frequency
kHz
bus free time between a STOP and
START condition
4.7
1.3
µs
tHD;STA
tSU;STA
hold time (repeated) START condition
4.0
4.7
-
-
0.6
0.6
-
-
µs
µs
set-up time for a repeated START
condition
tSU;STO
tHD;DAT
tVD;ACK
tVD;DAT
set-up time for STOP condition
data hold time
4.0
-
-
0.6
-
-
µs
ns
ns
ns
ns
ns
µs
µs
ns
ns
ns
0
0
[1]
[2]
[2]
data valid acknowledge time
data valid time
-
600
600
1500
-
-
600
600
600
-
LOW-level
HIGH-level
-
-
-
-
tSU;DAT
tLOW
tHIGH
tr
data set-up time
250
4.7
4.0
-
100
1.3
LOW period of the SCL clock
HIGH period of the SCL clock
rise time of both SDA and SCL signals
fall time of both SDA and SCL signals
-
-
-
0.6
-
[3]
[3]
1000
300
50
20 + 0.1Cb
20 + 0.1Cb
-
300
300
50
tf
-
tSP
pulse width of spikes that must be
suppressed by the input filter
-
Port timing
tv(Q)
data output valid time
data input set-up time
data input hold time
-
100
1
200
-
100
1
200
ns
ns
µs
tsu(D)
-
-
-
-
th(D)
Reset timing
tw(rst)
trec(rst)
trst
reset pulse width
8
0
-
-
-
8
0
-
-
-
ns
ns
ns
reset recovery time
reset time
[4][5]
400
400
[1] tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA (out) LOW.
[2] tVD;DAT = minimum time for SDA data output to be valid following SCL LOW.
[3] Cb = total capacitance of one bus line in pF.
[4] Resetting the device while actively communicating on the bus may cause glitches or errant STOP conditions.
[5] Upon reset, the full delay will be the sum of trst and the RC time constant of the SDA bus.
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
15 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
ACK or read cycle
START
SCL
SDA
30 %
t
rst
RESET
LEDn
50 %
50 %
50 %
t
rec(rst)
t
w(rst)
t
rst
50 %
LED off
002aac193
Fig 19. Definition of RESET timing
SDA
t
t
t
t
SP
t
r
f
HD;STA
BUF
t
LOW
SCL
t
t
t
SU;STO
HD;STA
SU;STA
t
t
t
SU;DAT
HD;DAT
HIGH
P
S
Sr
P
002aaa986
Fig 20. Definition of timing
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
16 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
START
condition
(S)
bit 7
MSB
(A7)
STOP
condition
(P)
bit 6
(A6)
bit 0 acknowledge
(R/W) (A)
protocol
t
t
t
HIGH
SU;STA
LOW
1
/f
SCL
SCL
SDA
t
t
BUF
f
t
r
t
t
t
t
t
t
HD;DAT
VD;DAT
VD;ACK
SU;STO
002aab175
HD;STA
SU;DAT
Rise and fall times refer to VIL and VIH
.
Fig 21. I2C-bus timing diagram
12. Test information
V
open
DD
V
SS
V
R
500 Ω
DD
L
V
V
O
I
PULSE
DUT
GENERATOR
C
50 pF
L
R
T
002aab880
RL = load resistor for LEDn. RL for SDA and SCL > 1 kΩ (3 mA or less current).
CL = load capacitance includes jig and probe capacitance.
RT = termination resistance should be equal to the output impedance Zo of the pulse generators.
Fig 22. Test circuitry for switching times
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
17 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
13. Package outline
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
v
c
y
H
M
A
E
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
e
w
M
detail X
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.39
0.014 0.0075 0.38
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.020
0.028
0.012
inches
0.069
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT109-1
076E07
MS-012
Fig 23. Package outline SOT109-1 (SO16)
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
18 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
Q
(A )
3
A
2
A
A
1
pin 1 index
θ
L
p
L
1
8
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.40
0.06
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT403-1
MO-153
Fig 24. Package outline SOT403-1 (TSSOP16)
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
19 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
HVQFN16: plastic thermal enhanced very thin quad flat package; no leads;
16 terminals; body 4 x 4 x 0.85 mm
SOT629-1
B
A
D
terminal 1
index area
A
A
1
E
c
detail X
e
1
C
1/2 e
y
y
e
v
M
M
b
C
C
A B
C
1
w
5
8
L
9
4
1
e
e
E
h
2
1/2 e
12
terminal 1
index area
16
13
X
D
h
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
(1)
A
(1)
(1)
UNIT
A
b
c
E
e
e
1
e
2
y
D
D
E
L
v
w
y
1
1
h
h
max.
0.05 0.38
0.00 0.23
4.1
3.9
2.25
1.95
4.1
3.9
2.25
1.95
0.75
0.50
mm
0.05
0.1
1
0.2
0.65
1.95 1.95
0.1 0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
01-08-08
02-10-22
SOT629-1
- - -
MO-220
- - -
Fig 25. Package outline SOT629-1 (HVQFN16)
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
20 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
14. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe you must take normal precautions appropriate to handling
integrated circuits.
15. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
© NXP B.V. 2008. All rights reserved.
PCA9551_8
Product data sheet
Rev. 08 — 31 July 2008
21 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
15.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 26) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 14 and 15
Table 14. SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
235
≥ 350
220
< 2.5
≥ 2.5
220
220
Table 15. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 26.
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
22 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 26. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
16. Abbreviations
Table 16. Abbreviations
Acronym
CDM
DSP
DUT
ESD
GPIO
HBM
I2C-bus
I/O
Description
Charged-Device Model
Digital Signal Processor
Device Under Test
ElectroStatic Discharge
General Purpose Input/Output
Human Body Model
Inter-Integrated Circuit bus
Input/Output
IC
Integrated Circuit
LED
Light Emitting Diode
MCU
MM
MicroController Unit
Machine Model
MPU
POR
PWM
RC
MicroProcessor Unit
Power-On Reset
Pulse Width Modulation; Pulse Width Modulator
Resistor-Capacitor network
System Management Bus
SMBus
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
23 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
17. Revision history
Table 17. Revision history
Document ID
PCA9551_8
Modifications:
Release date
Data sheet status
Change notice
Supersedes
20080731
Product data sheet
-
PCA9551_7
• Section 1 “General description”: added (new) 5th paragraph
• Table 12 “Static characteristics”, sub-section “I/Os”: changed symbol “IL” to “ILI” (input leakage
current)
• Table 13 “Dynamic characteristics”, sub-section “Reset timing”: changed Min value for tw(rst)
from “6 ns” to “8 ns” (for both Standard-mode and Fast-mode)
• updated soldering information
PCA9551_7
PCA9551_6
20070223
20061107
20041001
Product data sheet
Product data sheet
Product data sheet
-
-
-
PCA9551_6
PCA9551_5
PCA9551_4
PCA9551_5
(9397 750 13726)
PCA9551_4
(9397 750 11462)
20030505
20030220
20020927
20020513
Product data
Product data
Product data
Product data
853-2343 29858
(20030424)
PCA9551_3
PCA9551_2
PCA9551_1
-
PCA9551_3
(9397 750 11155)
853-2343 29331
(20021220)
PCA9551_2
(9397 750 10328)
853-2343 28878
(20020909)
PCA9551_1
-
(9397 750 10104)
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
24 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
to result in personal injury, death or severe property or environmental
18.2 Definitions
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
18.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
I2C-bus — logo is a trademark of NXP B.V.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PCA9551_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 31 July 2008
25 of 26
PCA9551
NXP Semiconductors
8-bit I2C-bus LED driver with programmable blink rates
20. Contents
1
2
3
4
General description . . . . . . . . . . . . . . . . . . . . . . 1
18
Legal information . . . . . . . . . . . . . . . . . . . . . . 25
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 25
18.1
18.2
18.3
18.4
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
19
20
Contact information . . . . . . . . . . . . . . . . . . . . 25
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
6
6.1
6.2
6.2.1
6.3
6.3.1
6.3.2
6.3.3
6.3.4
6.3.5
6.3.6
6.4
Functional description . . . . . . . . . . . . . . . . . . . 4
Device address. . . . . . . . . . . . . . . . . . . . . . . . . 4
Control register . . . . . . . . . . . . . . . . . . . . . . . . . 4
Control register definition . . . . . . . . . . . . . . . . . 5
Register descriptions . . . . . . . . . . . . . . . . . . . . 5
INPUT - Input register. . . . . . . . . . . . . . . . . . . . 5
PSC0 - Frequency Prescaler 0 . . . . . . . . . . . . . 5
PWM0 - Pulse Width Modulation 0. . . . . . . . . . 6
PSC1 - Frequency Prescaler 1 . . . . . . . . . . . . . 6
PWM1 - Pulse Width Modulation 1. . . . . . . . . . 6
LS0 to LS1 - LED selector registers . . . . . . . . . 7
Pins used as GPIOs . . . . . . . . . . . . . . . . . . . . . 7
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 7
External RESET . . . . . . . . . . . . . . . . . . . . . . . . 7
6.5
6.6
7
Characteristics of the I2C-bus. . . . . . . . . . . . . . 8
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
START and STOP conditions . . . . . . . . . . . . . . 8
System configuration . . . . . . . . . . . . . . . . . . . . 8
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 10
7.1
7.1.1
7.2
7.3
7.4
8
8.1
Application design-in information . . . . . . . . . 11
Minimizing IDD when the I/Os are used to
control LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Programming example . . . . . . . . . . . . . . . . . . 12
8.2
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12
Static characteristics. . . . . . . . . . . . . . . . . . . . 13
Dynamic characteristics . . . . . . . . . . . . . . . . . 15
Test information. . . . . . . . . . . . . . . . . . . . . . . . 17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
Handling information. . . . . . . . . . . . . . . . . . . . 21
10
11
12
13
14
15
Soldering of SMD packages . . . . . . . . . . . . . . 21
Introduction to soldering . . . . . . . . . . . . . . . . . 21
Wave and reflow soldering . . . . . . . . . . . . . . . 21
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
15.1
15.2
15.3
15.4
16
17
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 23
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 24
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 31 July 2008
Document identifier: PCA9551_8
相关型号：
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