PCD5032TD [NXP]
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| 型号： | PCD5032TD |
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INTEGRATED CIRCUITS
DATA SHEET
PCD5032
ADPCM CODEC for digital cordless
telephones
1997 Apr 03
Product specification
Supersedes data of August 1993
File under Integrated Circuits, IC17
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
CONTENTS
1
2
3
4
5
6
7
FEATURES
APPLICATIONS
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
7.1
Digital interfaces
ADPCM interface
PCM interface
7.1.1
7.1.2
7.1.3
7.1.4
7.2
7.2.1
7.2.2
7.2.3
7.3
7.3.1
7.3.2
7.3.3
7.3.4
I2C-bus interface
Fast mute
Analog parts and I2C-bus programming
Input and output
Sidetone
Tone generator and ringer
Modes of operation
Standby mode
Active mode
Test loops
Reset
8
HANDLING
9
LIMITING VALUES
10
11
12
13
14
DC AND AC CHARACTERISTICS
FILTER CHARACTERISTICS
APPLICATION INFORMATION
PACKAGE OUTLINES
SOLDERING
14.1
Introduction
14.2
14.3
14.3.1
14.3.2
14.3.3
14.4
Reflow soldering
Wave soldering
QFP
SO
Method (QFP and SO)
Repairing soldered joints
15
16
17
DEFINITIONS
LIFE SUPPORT APPLICATIONS
PURCHASE OF PHILIPS I2C COMPONENTS
1997 Apr 03
2
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
1
FEATURES
2
APPLICATIONS
• G.721 compliant ADPCM encoding and decoding
• Digital Enhanced Cordless Telephony (DECT)
• CT2 cordless
• ‘Bitstream’ analog-to-digital and digital-to-analog
conversion
• Speech compression.
• On-chip receive and transmit filter
• On-chip ringer and tone generator
3
GENERAL DESCRIPTION
• Programmable gain of receive and transmit path
The PCD5032 is a CMOS device designed for use in
Digital Enhanced Cordless Telephone systems (DECT),
but also suitable for other cordless telephony applications
such as CT2. The PCD5032 performs analog-to-digital
and digital-to-analog conversion, ADPCM encoding and
decoding compliant to CCITT recommendation “G.721
(blue book, 1988)”. The PCD5032 contains on-chip
microphone and earpiece amplifiers. The device can be
used in both handset and base station designs.
• Serial ADPCM interface with independent timing for
maximum flexibility
• Linear PCM data accessible for digital echo cancelling
• Programmable via I2C-bus interface
• Fast receiver mute input via pin
• On-chip reference voltage
• On-chip symmetrical supply for electret microphone
• Few external components
• Low power consumption in standby mode
• Low supply voltage (single supply 2.7 V up to 5.5 V)
• CMOS technology
• Minimized EMC on digital outputs.
4
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
PCD5032H
QFP44
SO28
plastic quad flat package; 44 leads (lead length 2.35 mm);
body 14 × 14 × 2.2 mm
SOT205-1
PCD5032T
plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
1997 Apr 03
3
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
5
BLOCK DIAGRAM
EM7A86
1997 Apr 03
4
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
6
PINNING
SYMBOL
PIN(1)(2)
TYPE
DESCRIPTION
QFP44
SO28
RESET
1
2
3
4
−
5
I
reset input; active HIGH
not connected
n.c.
−
RPE
O
receiver PCM output enable (active LOW); direction from ADPCM
interface to earpiece
RPI
n.c.
PO
4
5
6
7
8
9
6
−
7
−
8
9
I
receiver PCM input; direction from ADPCM interface to earpiece
−
O
−
I
not connected
PCM data output
n.c.
TPI
TPE
not connected
transmitter PCM input; direction from microphone to ADPCM interface
O
transmitter PCM output enable (active LOW);
direction from microphone to ADPCM interface
n.c.
10
11
12
13
14
15
16
17
18
19
−
10
11
−
−
I
not connected
SCL
SDA
n.c.
serial clock input; I2C-bus
serial data input; I2C-bus
not connected
address select input; I2C-bus
transmitter audio positive input (microphone)
not connected
I
−
I
A0
12
13
−
TM+
n.c.
I
−
I
TM−
n.c.
14
−
transmitter audio negative input (microphone)
not connected
−
O
VREF−
15
negative reference voltage output; internally generated, intended for
electret microphone supply
VREF+
20
16
O
positive reference voltage output; internally generated, intended for
electret microphone supply
n.c.
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
−
17
18
−
−
O
O
−
O
P
−
P
−
I
not connected
VGA
RE−
n.c.
analog signal ground output
receiver audio negative output (earpiece)
not connected
RE+
VDD
n.c.
19
20
−
receiver audio positive output (earpiece)
positive supply voltage (2.7 V to 5.5 V)
not connected
VSS
n.c.
21
−
negative supply voltage (0 V)
not connected
TEST
BZ−
n.c.
22
23
−
test mode input; to be connected to VSS in normal application
ringer negative output
O
−
O
I
not connected
BZ+
CLK
n.c.
24
25
−
ringer positive output
clock input
−
not connected
1997 Apr 03
5
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
PIN(1)(2)
SYMBOL
DCLK
TYPE
DESCRIPTION
QFP44
36
SO28
26
I
data clock input (ADPCM)
TAD
37
27
O
transmitter ADPCM data output; direction from microphone to ADPCM
interface
n.c.
38
39
−
−
not connected
TAS
28
I
transmitter ADPCM sync input; direction from microphone to ADPCM
interface
n.c.
40
41
−
−
not connected
RAS
1
I
receiver ADPCM sync input; direction from ADPCM interface to
earpiece
RAD
42
2
I
receiver ADPCM data input; direction from ADPCM interface to
earpiece
n.c.
43
44
−
−
not connected
RFM
3
I
receiver fast mute input; direction from ADPCM interface to earpiece
Notes
1. QFP44 package:
Pins 1, 3, 4, 6, 8, 9, 11, 12, 14, 30, 34, 36, 37, 39, 41, 42 and 44 are digital pins.
Pins 15, 17, 23, 25, 31 and 33 are analog pins.
Pins 19, 20, 22, 26, and 28 are general pins.
2. SO28 package:
Pins 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 22, 25, 26, 27 and 28 are digital pins.
Pins 13, 14, 18, 19, 23 and 24 are analog pins.
Pins 15, 16, 17, 20 and 21 are general pins.
1997 Apr 03
6
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
1
2
33
32
31
30
29
28
27
26
25
RESET
n.c
BZ+
n.c.
BZ–
TEST
n.c.
3
RPE
RPI
n.c.
4
5
V
6
PCD5032H
SS
PO
n.c.
7
n.c.
V
8
TPI
DD
9
TPE
n.c.
RE+
10
24 n.c.
23 RE–
SCL 11
MEA787
Fig.2 Pin configuration QFP44 (SOT205-1).
handbook, halfpage
RAS
RAD
RFM
RESET
RPE
RPI
TAS
TAD
DCLK
CLK
BZ+
1
2
28
27
26
25
24
3
4
5
23 BZ−
6
PO
TEST
22
21
20
19
18
17
16
15
7
PCD5032T
TPI
8
V
V
SS
DD
TPE
9
SCL
RE+
RE−
VGA
V
10
11
SDA
A0 12
TM+
13
REF+
TM− 14
V
REF−
MGK070
Fig.3 Pin configuration SO28 (SOT136-1).
7
1997 Apr 03
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
For the receive direction the PCM data is output on pin PO
and read from pin RPI. For the transmit direction the PCM
data is output on pin PO and read from pin TPI. To enable
bus structures to be used in base stations the PCM output
PO is in high-impedance state when not active. Inputs TPI
and RPI have internal pull-down.
7
FUNCTIONAL DESCRIPTION
Digital interfaces
7.1
7.1.1
ADPCM INTERFACE
The ADPCM receive and transmit data pins, RAD and
TAD, carry 4-bit words of serial data. The received and
transmitted data are controlled separately by the
synchronization pins RAS and TAS.
In a typical handset application, pin PO is directly
connected to RPI and TPI. If additional data processing is
required (echo cancellation in a base station, for example),
a data processing unit may be placed between PO and
RPI or between PO and TPI.
On detection of a HIGH level on RAS (with a rising edge
on DCLK), the receiver will read 4 ADPCM bits on the next
4 HIGH-to-LOW transitions of DCLK. Likewise, on
reception of a HIGH level on TAS, the transmitter will
output 4 ADPCM bits on the next 4 LOW-to-HIGH
transitions of DCLK. Figure 4 is the ADPCM timing
diagram. During the time that the ADPCM data output
(TAD) is not activated, it will be in a high-impedance state,
enabling a bus structure to be used in a multi-line base
station. Input RAD has an internal pull-down resistor.
The data format is serial, 2’s complement, MSB first. PO
outputs 16 bits (14 data bits followed by 2 zeroes). TPI and
RPI read 14 data bits. The bit frequency is 3456 kHz
(CLK). Data output PO changes on the falling edge of CLK
(see Figs. 5 and 6).
For interfacing to digital signal processors, signals TPE
and RPE (both active LOW) mark the position of the
transmit and receive PCM data on pin PO (see Fig.7).
TPE and RPE change on the rising edge of CLK.
The minimum frequency on the DCLK input is 1⁄54fCLK
.
The maximum value equals the clock frequency, and any
value in between may be chosen. The RAS signal controls
the start of each conversion in a frame at an 8 kHz rate.
The master clock ‘CLK’ must be locked to the frequency of
Outputs RPE and TPE have low impedance only from half
a CLK cycle after the active state. The rest of the time they
are in high impedance state. Thus a wired-OR
configuration can be made when only one DSP serial input
port is used for reading both transmit and receive data.
An external pull-up is required.
‘RAS’, with a ratio fCLK = 432 × fRAS
.
7.1.2
PCM INTERFACE
To enable additional data processing in a base station
both transmit and receive linear PCM data paths are
accessible.
DCLK
RAS/TAS
RAD/TAD
01
02
03
04
MGK073
MSB
LSB
Fig.4 ADPCM timing.
1997 Apr 03
8
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
CLK
RPE/TPE
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
MSB LSB
PO
RPE/TPE
MGK075
low impedance
Fig.5 PCM output timing.
CLK
RPE/TPE
PO
01 02 03 04 05 06 07 08 09 10 11 12 13 14
MSB
LSB
RPI/TPI
MGK076
low impedance
Fig.6 PCM input timing.
RAS
TPE
RPE
PO
16 BITS
TX
16 BITS
RX
14 BITS
TPI
RPI
14 BITS
163 CLK CYCLES
81 CLK CYCLES
188 CLK CYCLES
MGK074
Fig.7 PCM timing.
9
1997 Apr 03
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
I2C-BUS INTERFACE
With the address select pin A0 it is possible to have two
independently programmed PCD5032 CODECs in a base
station (two outside lines). If more CODECs are used in a
base station then the address pin can be used as a select
signal. Detailed description of the I2C-bus specification is
given in the brochure “The I2C-bus and how to use it”. This
may be ordered using the code 9398 393 40011.
7.1.3
The mode of operation and transmitter/receiver gain is
programmed through the I2C-bus serial interface.
The I2C-bus address of the device is shown in Fig.8.
Each function can be accessed by writing one 8-bit word
to the ADPCM CODEC. For this reason the 8-bit word is
divided into two fields:
handbook, halfpage
0
0
1
1
0
0
A0
0
• bit 7, bit 6: function
(WRITE ONLY)
MGK071
• bit 5 to bit 0: value/setting.
Table 1 gives an overview of the I2C-bus programming
options.
Fig.8 I2C-bus address.
Table 1 Overview of I2C-bus programming options
FUNCTION
Operation mode
Receiver control
Transmitter control
Ringer
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
TONE
BIT 2
PON
BIT 1
T1
BIT 0
T0
0
0
1
1
0
1
0
1
−
−
RV2
ST1
BF2
RV1
ST0
BF1
RV0
RG2
TG2
BV2
RG1
TG1
BV1
RG0
TG0
BV0
MUTE
BF0
Table 1 definitions:
blanked, so that the ADPCM decoder output signal goes to
zero. To ensure immediate silence on the analog outputs
RE+ and RE−, the linear PCM input data of the receive
filter is set to zero as well.
• TONE: ‘tone/ringer’ section for tone generator output;
tones can be sent to ringer or receiver DAC
• PON: power-on (active)
If the mute signal is switched off again, then the ADPCM
decoder output settles gradually from the zero to the
appropriate PCM signal level. No audible clicks will occur.
• T1 and T0: test loops
• RG2 to RG0: receiver gain
• TG2 to TG0: transmitter gain
• RV2 to RV0: receiver volume
• BV2 to BV0: tone volume
• BF2 to BF0: tone frequency
• ST1 to ST0: sidetone level.
The sidetone level is not affected by the mute function.
7.2
Analog parts and I2C-bus programming
7.2.1
INPUT AND OUTPUT
The analog input pins TM+ and TM− can be connected
directly to a microphone. For electret microphones
capacitive coupling is required (see Chapter 12, Fig.13).
The earpiece must be a low-ohmic device (>100 Ω
differential).
Programming the ADPCM CODEC is possible in active
mode as well as in standby mode. A reset clears all
I2C-bus registers.
7.1.4
FAST MUTE
The microphone and earpiece amplifiers have the
possibility of gain control via the I2C-bus interface. Further
the sending and receiving direction can be muted
separately. Analog gain control for the receive path can be
set in steps of 1 dB. Digital volume control can be set in
6 dB steps. Table 2 gives an overview of the gain control
options.
The RFM (Receiver Fast Mute) pin enables fast muting of
the received signal if erroneous data is present on the
ADPCM interface.
Muting is done in the same way as the receiver mute via
the I2C-bus. The input data of the ADPCM decoder is
1997 Apr 03
10
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
Table 2 Overview of gain control options
Table 3 Sidetone level options
FUNCTION
I2C-CODE
GAIN
NOTE
FUNCTION I2C-CODE
OPTION
NOTE
Receiver
gain (relative)
01XXX101 −3 dB
01XXX110 −2 dB
Sidetone
1000XXXX No local
default
sidetone
1001XXXX Level = −12 dB
1010XXXX Level = −18 dB
01XXX111
−1 dB
01XXX000 0 dB
01XXX001 +1 dB
01XXX010 +2 dB
01XXX011 +3 dB
01XXX100 +4 dB
01000XXX 0 dB
01001XXX −6 dB
01010XXX −12 dB
01011XXX −18 dB
01100XXX −24 dB
01101XXX −30 dB
default
1011XXXX
Level = −24 dB
Table 4 Tone output frequency/volume options
FUNCTION I2C-CODE
OPTION
NOTE
default
Volume
(relative)
11XXX000
11XXX001
11XXX010
11XXX011
11XXX100
11XXX101
11XXX110
11XXX111
11000XXX
11001XXX
11010XXX
11011XXX
11100XXX
11101XXX
11110XXX
11111XXX
Signal off
−29 dB
−23 dB
−17 dB
−11 dB
−5 dB
Receiver
volume
default
sinewave
sinewave
sinewave
sinewave
sinewave
sinewave
squarewave
−0 dB
01110XXX
01111XXX
−36 dB
+4 dB
RX MUTE
Frequency
400 Hz
421 Hz
444 Hz
800 Hz
1000 Hz
1067 Hz
1333 Hz
2000 Hz
Transmitter
gain (relative)
10XXX101 −3 dB
10XXX110 −2 dB
10XXX111
−1 dB
10XXX000 0 dB
10XXX001 +1 dB
10XXX010 +2 dB
10XXX011 +3 dB
10XXX100 +4 dB
10XX1XXX TX MUTE
default
Transmitter
mute
default OFF
The ringer output (BZ) is differential and is intended for
low-ohmic devices. If the ringer is switched off then both
outputs are low. The output signal is a pulse density
modulated block wave (on a 32 kHz basic pulse rate) to
generate a sinewave-like output signal, see Fig.9. Volume
is controlled by changing the pulse width of each pulse.
In the square wave mode a full square wave is generated
and results in the maximum volume. The volume settings
(in dB) are given for the first harmonic signal component.
7.2.2
SIDETONE
With the I2C-bus interface the (local) sidetone level can be
set to −12, −18, −24 dB, or switched off. See Table 3.
The sidetone level is independent of the receiver volume
control setting.
7.2.3
TONE GENERATOR AND RINGER
The PCD5032 contains a programmable tone generator
which can be used for generating ringer tones (BZ+, BZ−)
or local information tones in the receive path (RE+, RE−).
By setting the TONE bit (bit 3) in the operation mode
register, the tone output will be directed to the receiver
DAC, otherwise the tones will be sent to the ringer output
stage. Table 4 shows the possible frequency and volume
settings.
1997 Apr 03
11
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
7.3
Modes of operation
7.3.3
TEST LOOPS
The ADPCM CODEC has a ‘Standby mode’, an ‘Active
mode’ and three operating modes: ‘Normal mode’ and two
loop modes. Table 5 gives details of setting the various
modes via the I2C-bus.
Both test loops can be used for test or evaluation
purposes.
Loop 1 is intended for testing the audio path and A/D, D/A
converters, the ADPCM transcoder is not addressed in this
mode. The ADPCM data is directly looped back towards
the radio interface.
7.3.1
STANDBY MODE
After a reset the ADPCM CODEC will by default be in
standby mode. All I2C-bus settings will be cleared.
Standby mode can also be explicitly set using the code
shown in Table 5.
The PCM data is looped from transmit filter output to
receive filter input.
Loop 2 is intended for testing the audio path including
ADPCM encoding and decoding.
In standby mode all circuits are switched off, except for the
I2C-bus interface. Before going to standby mode the
PCD5032 performs a reset of the ADPCM transcoder,
digital filters and auxiliary logic functions. The I2C-bus
interface registers are not cleared.
7.3.4
RESET
After an external reset pulse the circuit will perform an
internal reset procedure. The reset pulse must be active
for at least 10 CLK cycles. 125 µs (the duration of 1 cycle
at 8 kHz) after RESET has gone LOW, the internal reset is
completed and the PCD5032 goes into standby mode.
At that moment the ADPCM CODEC is ready to be
programmed.
7.3.2
ACTIVE MODE
Active mode is set using the code shown in Table 5. Once
active mode has been set, the ADPCM CODEC is by
default in normal mode, but can explicitly be set to one of
the two test loops or back to normal mode using the codes
shown in Table 5.
A reset clears all I2C-bus registers and resets the ADPCM
transcoder, digital filters and auxiliary logic functions.
Table 5 Modes of operation
FUNCTION
Standby mode
I2C-CODE
DESCRIPTION
NOTE
00XXX0XX
00XXX1XX
00XXXX00
Power-down
Active
default after reset
Active mode
Normal mode
Normal operation
default after active
mode set
Loop 1
Loop 2
00XXXX01
00XXXX10
Loopback on ADPCM side and on PCM side
without using ADPCM transcoder
Loopback on TM+/TM− through ADPCM
transcoder
0
0 1 0 1 0 1 1 1 1 0 1 0 1 0 0 0 0 −1 0 −1 0 −1 −1 −1 −1 0 −1 0 −1 0 0
+V
DD
0
−V
DD
MGK072
Fig.9 Tone output example.
1997 Apr 03
12
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
8
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, it is good practice to take
normal precautions appropriate to handling MOS devices. Details of recommended precautions are given in “Handling
MOS devices”, which is published in the General Information section of several of Philips data handbooks.
9
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER
MIN.
−0.5
MAX.
+6.5
UNIT
VDD
IDD
VI
supply voltage
supply current
all input voltages
DC input current
BZ+, BZ−
V
−150
−0.5
+150
mA
V
VDD + 0.5
II
−150
−50
+150
+50
mA
mA
mA
RE+, RE−
all other pins
−10
+10
IO
DC output current
BZ+, BZ−
−150
−50
−10
−
+150
+50
mA
mA
mA
mW
°C
RE+, RE−
all other pins
+10
Ptot
total power dissipation
storage temperature
500
Tstg
Tamb
−65
−25
+150
+70
operating ambient temperature
°C
1997 Apr 03
13
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
10 DC AND AC CHARACTERISTICS
VDD = 2.7 to 5.5 V; VSS = 0 V; CLK = 3456 kHz; Tamb = −25 to +70 °C; all voltages with respect to VSS; unless
otherwise specified. Specifications valid in active mode, except standby supply current.
SYMBOL
General
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VDD
IDD
operating supply voltage
operating supply current
standby supply current
input leakage current
2.7
−
−
5.5
V
no load; Tamb = 25°C; note 1
Tamb = 25°C; note 1
7
14
mA
µA
µA
V
Istb
−
20
100
+1
ILI
VSS ≤ VI ≤ VDD
−1
−
VGA
VREF+
VREF−
analog signal ground voltage
positive reference voltage
negative reference voltage
0.48VDD
0.8
0.5VDD 0.52VDD
note 2
note 2
1.0
1.2
V
−0.8
−1.0
−1.2
V
Digital I/O
VIL
LOW level input voltage
HIGH level input voltage
LOW level output voltage
HIGH level output voltage
note 3
note 3
note 3
note 3
0
−
0.3VDD
VDD
0.4
V
VIH
0.7VDD
−
V
VOL
−
−
V
VOH
V
DD −o.4
−
VDD
−
V
Rpd(int)
fDCLK
internal pull-down resistance note 3
−
150
−
kΩ
kHz
kHz
DCLK frequency
note 4
note 4
1⁄54fCLK = 64
fCLK
−
fRAS, fTAS RAS, TAS frequency
−
8
I2C-bus timing
fSCL
SCL clock frequency
tolerable pulse spike width
bus free time
−
−
−
−
−
−
−
−
−
−
−
−
−
100
50
−
kHz
ns
µs
µs
µs
µs
µs
µs
µs
ns
ns
µs
tSW
−
tBUF
4.7
4.7
4.0
4.7
4.0
−
tSU;STA
tHD;STA
tLOW
tHIGH
tr
set-up time repeated START
hold time START condition
SCL LOW time
−
−
−
SCL HIGH time
−
rise time SDA and SCL
fall time SDA and SCL
data set-up time
1.0
0.3
−
tf
−
tSU;DAT
tHD;DAT
tSU;STO
250
0
data hold time
−
set-up time STOP condition
4.0
−
Analog inputs; note 5
Zi(TM+)
Zi(TM−)
Vi
input impedance, TM+
note 6
−
125
125
12
−
kΩ
kΩ
mV
mV
dB
dB
input impedance, TM−
nominal input level
note 6
−
−
RMS value; note 7
RMS value; note 8
−
−
Vi(max)
Gv(min)
Gv(max)
maximum input signal
minimum voltage gain
maximum voltage gain
−
56
−
−4
+3
−3
−2
+5
+4
1997 Apr 03
14
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
SYMBOL
Gv(step)
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
dB
voltage gain, step size
−
−
1
−
THDTX
total harmonic distortion
(transmitted)
note 9
note 6
−
−40
dB
Receiver audio output
Zo
output impedance
−
10
550
1250
−3
+4
1
−
Ω
Vo(rms)
output signal level (RMS
value)
0 dBm0; note 10
−
−
mV
mV
dB
dB
dB
dB
dB
dB
3.14 dBm0; note 11
−
−
Gv(min)
Gv(max)
Gv(step)
Gvol
minimum voltage gain
maximum voltage gain
voltage gain, step size
volume control range
volume step size
−4
+3
−
−2
+5
−
−36
−
−
0
Gvol(step)
THDRX
6.0
−
−
total harmonic distortion
(received)
note 12
−
−40
Ringer output; notes 5 and 13
Zo
output impedance
−
14
29
+4
Ω
Gvol
volume control range
−29
−
dB
Notes
1. All outputs left open. IDD measured with all inputs connected to VSS, except: CLK and DCLK connected to 3.456 MHz;
RAS and TAS connected to 8 kHz. Istb measured with all inputs connected to VSS, except: TM+, TM− left open.
2. The reference voltage is available on VREF+ and VREF− and is measured with respect to VGA. The voltage outputs
are intended for electret microphone supply and can deliver 400 µA.
3. Digital inputs and outputs are CMOS-levels compatible. The outputs and inputs can sink or source 1 mA. Pull-down
resistors are present at pins RPI, TPI, TEST, RAD.
4. Any frequency between min. and max. is allowed for DCLK. The signals CLK and RAS/TAS must be
frequency-locked and will have a ratio of fCLK/fRAS = 432
5. All analog input/output voltages are measured differentially. The circuit is designed for use with an electret
microphone.
6. Frequency band is 300 Hz to 3400 Hz. Maximum load capacitance = 100 pF differentially, or 200 pF each pin.
7. Nominal signal level gives −10 dBm0 on the PCM interface (G.711/G.712). Value given for TX gain setting 0 dB.
8. Nominal signal level gives 3.14 dBm0 on the PCM interface, with larger input signals the digital output will be
saturated. Value given for TX gain setting 0 dB.
9. Transmitter gain setting = 0 dB and input signal level = 40 mV (RMS) (will generate 0 dBm0 on PCM interface
according to G.711).
10. PCM signal level is 0 dBm0 and RX gain setting 0 dB. With a load of 300 Ω between RE+ and RE− the signal level
results in an output power of 1 mW. The maximum output current is 10 mA.
11. PCM signal level is +3.14 dBm0 and RX gain setting +4 dB. The maximum output current is 10 mA.
12. PCM signal level is 0 dBm0 (G.711).
13. For maximum output power the load resistance should equal the typical output impedance (specified at
ILOAD −20 mA). The absolute maximum value of output power given in Chapter 9 defines the minimum load
resistance.
1997 Apr 03
15
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
11 FILTER CHARACTERISTICS
VDD = 2.7 to 5.5 V; VSS = 0 V; Tamb = −25 to +70 °C.
SYMBOL PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Transmitter
RPB
passband ripple
−
−
0.5
dB
(300 to 3000 Hz)
frequency response
f = 50 Hz
−35
−35
−35
−60
−
−
−
−
−2
−2
−2
−2
dB
dB
dB
dB
f = 3400 Hz
f = 4600 Hz
f = 8000 Hz
Analog-to-Digital converter
S/N signal-to-noise ratio
Digital-to-Analog converter
S/N signal-to-noise ratio
Group delay
Fig.10; notes 1 and 2
Fig.10; notes 1 and 2
35
35
−
−
−
−
dB
dB
td(TX)
td(RX)
td(g)
transmitter
receiver
note 3
note 3
−
−
−
400
525
tbf
µs
µs
µs
−
group delay distortion (Loop 1) Fig.11
tbf
tbf
Notes
1. Frequency band is 300 Hz to 3400 Hz. Maximum load capacitance = 100 pF differentially, or 200 pF each pin.
2. Measured with psophometric filter (CCITT G.223). Only fulfilled at VDD noise level less than 40 mV (peak value)
(0 to 20 kHz). Measured on sample basis at VDD = 3.0 V,Tamb = 25 °C, compliant with G.712. Signal level is
−40 dBm0 on PCM interface; 0.4 mV (RMS) on analog input. Gain setting is 0 dB.
3. Group delay includes ADPCM/PCM conversion; signal frequency = 1.5 kHz. Value given is for RAS/TAS signals
asserted simultaneously.
handbook, halfpage
80
1.75 ms
handbook, halfpage
70
1.5 ms
S/(N + T
)
t
HD
d(g)
60
50
40
30
20
10
0
1.25 ms
1.0 ms
750.0 µs
500.0 µs
250.0 µs
0.0
33
27
22
CCITT G.712
G.712
300 600 1000 1500
500
2600
2800
3400
frequency (Hz)
−70 −60 −50 −40 −30 −20 −10
0
+10
MGK077
input level (dBm0)
MGK078
Fig.10 Typical performance of AD and DA in
cascade.
Fig.11 Group delay distortion: Transmit and
Receive (loop measurement).
1997 Apr 03
16
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
12 APPLICATION INFORMATION
13824 kHz crystal
1.9 GHz
control
data
sync
earpiece
microphone
ringer
RECEIVER
RSSl
DCLK
BURST MODE
CONTROLLER
(PCD5040)
ADPCM
CODEC
(PCD5032)
data
CLK
control
data
TRANSMITTER
3
2
RF SECTION
modulator out
VCO output
microcontroller bus
MICROCONTROLLER
2
I C bus
SYNTHESIZER
LCD DISPLAY
KEYBOARD
f
MEA788
REF
Fig.12 Typical block diagram for a DECT handset.
1997 Apr 03
17
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
TPE RPE
3
TPI
RPI
PO
9
8
4
6
CLK
RAS
RAD
DCLK
TAS
BZ+
BZ–
RE+
33
31
25
23
20
15
34
41
42
36
39
37
44
buzzer
burst mode
controller
TAD
RFM
loudspeaker
RE–
V
100 Ω
REF+
PCD5032
1 kΩ
100 nF
100 nF
TM+
47
microphone
µF
TM–
V
17
19
1kΩ
100 Ω
REF–
SDA
SCL
12
100
nF
100
nF
micro-
controller
11
1
RESET
VGA
22
26
28
30
TEST A0
SS
14
V
V
47
DD
µF
100
nF
47
µF
2.7 to 5.5 V
MEA789
Fig.13 Typical handset application diagram for the PCD5032 in QFP44 package.
1997 Apr 03
18
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
13 PACKAGE OUTLINES
QFP44: plastic quad flat package; 44 leads (lead length 2.35 mm); body 14 x 14 x 2.2 mm
SOT205-1
y
X
A
33
23
Z
34
22
E
e
Q
A
H
2
E
E
A
(A )
3
A
1
w M
p
θ
b
L
p
pin 1 index
L
44
12
detail X
1
11
Z
v
M
D
A
e
w M
b
p
D
B
H
v
M
B
D
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
Q
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.
7o
0o
0.25 2.3
0.05 2.1
0.50 0.25 14.1 14.1
0.35 0.14 13.9 13.9
19.2 19.2
18.2 18.2
2.0
1.2
1.2
0.9
2.4
1.8
2.4
1.8
mm
1
2.60
0.25
2.35
0.3 0.15 0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-04
SOT205-1
133E01A
1997 Apr 03
19
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
SO28: plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
D
E
A
X
c
y
H
v
M
A
E
Z
28
15
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
14
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
18.1
17.7
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
1.27
0.050
1.4
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.71
0.014 0.009 0.69
0.30
0.29
0.42
0.39
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
91-08-13
95-01-24
SOT136-1
075E06
MS-013AE
1997 Apr 03
20
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
If wave soldering cannot be avoided, the following
conditions must be observed:
14 SOLDERING
14.1 Introduction
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
• The footprint must be at an angle of 45° to the board
direction and must incorporate solder thieves
downstream and at the side corners.
Even with these conditions, do not consider wave
soldering the following packages: QFP52 (SOT379-1),
QFP100 (SOT317-1), QFP100 (SOT317-2),
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
QFP100 (SOT382-1) or QFP160 (SOT322-1).
14.3.2 SO
14.2 Reflow soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
Reflow soldering techniques are suitable for all QFP and
SO packages.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our “Quality
Reference Manual” (order code 9397 750 00192).
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
14.3.3 METHOD (QFP AND SO)
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
14.4 Repairing soldered joints
14.3 Wave soldering
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
14.3.1 QFP
Wave soldering is not recommended for QFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
1997 Apr 03
21
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
15 DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
16 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
17 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1997 Apr 03
22
Philips Semiconductors
Product specification
ADPCM CODEC for digital cordless
telephones
PCD5032
NOTES
1997 Apr 03
23
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Internet: http://www.semiconductors.philips.com
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1997
SCA54
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
437027/1200/02/pp24
Date of release: 1997 Apr 03
Document order number: 9397 750 01525
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