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PDTA124EEF,115 [NXP]

100mA, 50V, PNP, Si, SMALL SIGNAL TRANSISTOR, PLASTIC, SC-89, 3 PIN;
PDTA124EEF,115
型号： PDTA124EEF,115
厂家： NXP    NXP
描述：

100mA, 50V, PNP, Si, SMALL SIGNAL TRANSISTOR, PLASTIC, SC-89, 3 PIN

开关 光电二极管 晶体管
文件： 总14页 (文件大小：175K)
中文：  中文翻译
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DISCRETE SEMICONDUCTORS  
DATA SHEET  
PDTA124E series  
PNP resistor-equipped transistors;  
R1 = 22 kΩ, R2 = 22 kΩ  
Product data sheet  
2004 Aug 02  
Supersedes data of 2003 Apr 14  
NXP Semiconductors  
Product data sheet  
PNP resistor-equipped transistors;  
R1 = 22 kΩ, R2 = 22 kΩ  
PDTA124E series  
FEATURES  
QUICK REFERENCE DATA  
• Built-in bias resistors  
SYMBOL  
PARAMETER  
TYP. MAX. UNIT  
• Simplified circuit design  
VCEO  
collector-emitter  
voltage  
−
−50  
V
• Reduction of component count  
• Reduced pick and place costs.  
IO  
output current (DC)  
bias resistor  
−
−100 mA  
R1  
R2  
22  
22  
−
−
kΩ  
kΩ  
bias resistor  
APPLICATIONS  
• General purpose switching and amplification  
• Inverter and interface circuits  
• Circuit driver.  
DESCRIPTION  
PNP resistor-equipped transistor (see “Simplified outline,  
symbol and pinning” for package details).  
PRODUCT OVERVIEW  
PACKAGE  
TYPE NUMBER  
MARKING CODE  
NPN COMPLEMENT  
PHILIPS  
EIAJ  
PDTA124EE  
PDTA124EEF  
PDTA124EK  
PDTA124EM  
PDTA124ES  
PDTA124ET  
PDTA124EU  
SOT416  
SOT490  
SC-75  
SC-89  
SC-59  
SC-101  
SC-43  
−
05  
3R  
PDTC124EE  
PDTC124EEF  
PDTC124EK  
PDTC124EM  
PDTC124ES  
PDTC124ET  
PDTC124EU  
SOT346  
05  
SOT883  
DH  
SOT54 (TO-92)  
SOT23  
TA124E  
*05(1)  
*05(1)  
SOT323  
SC-70  
Note  
1. * = p: Made in Hong Kong.  
* = t: Made in Malaysia.  
* = W: Made in China.  
2004 Aug 02  
2
NXP Semiconductors  
Product data sheet  
PNP resistor-equipped transistors;  
R1 = 22 kΩ, R2 = 22 kΩ  
PDTA124E series  
SIMPLIFIED OUTLINE, SYMBOL AND PINNING  
PINNING  
TYPE NUMBER  
SIMPLIFIED OUTLINE AND SYMBOL  
PIN  
1
DESCRIPTION  
base  
PDTA124ES  
2
collector  
emitter  
handbook, halfpage  
2
3
3
R1  
1
2
3
1
R2  
MAM338  
PDTA124EE  
PDTA124EEF  
PDTA124EK  
PDTA124ET  
PDTA124EU  
1
2
3
base  
emitter  
collector  
handbook, halfpage  
3
3
2
R1  
R2  
1
1
2
Top view  
MDB271  
PDTA124EM  
1
2
3
base  
emitter  
collector  
handbook, halfpage  
3
2
R1  
2
1
3
R2  
1
Bottom view  
MDB267  
2004 Aug 02  
3
NXP Semiconductors  
Product data sheet  
PNP resistor-equipped transistors;  
R1 = 22 kΩ, R2 = 22 kΩ  
PDTA124E series  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
SYMBOL  
PARAMETER  
CONDITIONS  
open emitter  
MIN.  
MAX.  
−50  
UNIT  
VCBO  
VCEO  
VEBO  
VI  
collector-base voltage  
collector-emitter voltage  
emitter-base voltage  
input voltage  
−
−
−
V
V
V
open base  
−50  
−10  
open collector  
positive  
−
−
−
−
+10  
V
V
negative  
−40  
IO  
output current (DC)  
peak collector current  
total power dissipation  
SOT54  
−100  
−100  
mA  
mA  
ICM  
Ptot  
Tamb ≤ 25 °C  
note 1  
−
−
−
−
−
−
−
500  
250  
250  
200  
150  
250  
250  
+150  
150  
+150  
mW  
mW  
mW  
mW  
mW  
mW  
mW  
°C  
SOT23  
note 1  
SOT346  
note 1  
SOT323  
note 1  
SOT416  
note 1  
SOT490  
notes 1 and 2  
notes 2 and 3  
SOT883  
Tstg  
Tj  
storage temperature  
junction temperature  
operating ambient temperature  
−65  
−
°C  
Tamb  
−65  
°C  
Notes  
1. Refer to standard mounting conditions.  
2. Reflow soldering is the only recommended soldering method.  
3. Refer to SOT883 standard mounting conditions; FR4 with 60 μm copper strip line.  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
in free air  
VALUE  
UNIT  
Rth j-a  
thermal resistance from junction to ambient  
SOT54  
note 1  
250  
500  
500  
625  
833  
500  
500  
K/W  
K/W  
K/W  
K/W  
K/W  
K/W  
K/W  
SOT23  
note 1  
SOT346  
SOT323  
SOT416  
SOT490  
SOT883  
note 1  
note 1  
note 1  
notes 1 and 2  
notes 2 and 3  
Notes  
1. Refer to standard mounting conditions.  
2. Reflow soldering is the only recommended soldering method.  
3. Refer to SOT883 standard mounting conditions; FR4 with 60 μm copper strip line.  
2004 Aug 02  
4
NXP Semiconductors  
Product data sheet  
PNP resistor-equipped transistors;  
R1 = 22 kΩ, R2 = 22 kΩ  
PDTA124E series  
CHARACTERISTICS  
Tamb = 25 °C unless otherwise specified.  
SYMBOL  
ICBO  
PARAMETER  
CONDITIONS  
VCB = −50 V; IE = 0  
MIN.  
TYP. MAX. UNIT  
collector-base cut-off current  
collector-emitter cut-off current  
−
−
−100  
−1  
nA  
μA  
μA  
μA  
ICEO  
VCE = −30 V; IB = 0  
−
−
VCE = −30 V; IB = 0; Tj = 150 °C  
VEB = −5 V; IC = 0  
−
−
−50  
−180  
−
IEBO  
hFE  
emitter-base cut-off current  
DC current gain  
−
−
VCE = −5 V; IC = −5 mA  
60  
−
−
VCEsat  
Vi(off)  
Vi(on)  
R1  
collector-emitter saturation voltage IC = −10 mA; IB = −0.5 mA  
−
−150  
−0.8  
−
mV  
V
input-off voltage  
input-on voltage  
input resistor  
IC = −100 μA; VCE = −5 V  
IC = −5 mA; VCE = −0.3 V  
−
−1.1  
−1.7  
22  
−2.5  
15.4  
V
28.6  
kΩ  
R2  
-------  
resistor ratio  
0.8  
1
1.2  
3
R1  
Cc  
collector capacitance  
IE = ie = 0; VCB = −10 V; f = 1 MHz  
−
−
pF  
2004 Aug 02  
5
NXP Semiconductors  
Product data sheet  
PNP resistor-equipped transistors;  
R1 = 22 kΩ, R2 = 22 kΩ  
PDTA124E series  
PACKAGE OUTLINES  
Plastic surface-mounted package; 3 leads  
SOT416  
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
1
2
c
e
b
w
M
B
1
p
L
p
e
detail X  
0
0.5  
1 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
A
UNIT  
b
c
D
E
e
e
H
L
p
Q
v
w
p
1
E
max  
0.30  
0.15  
0.25  
0.10  
1.8  
1.4  
0.9  
0.7  
1.75  
1.45  
0.45  
0.15  
0.23  
0.13  
0.95  
0.60  
mm  
0.1  
1
0.5  
0.2  
0.2  
REFERENCES  
JEDEC JEITA  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
04-11-04  
06-03-16  
SOT416  
SC-75  
2004 Aug 02  
6
NXP Semiconductors  
Product data sheet  
PNP resistor-equipped transistors;  
R1 = 22 kΩ, R2 = 22 kΩ  
PDTA124E series  
Plastic surface-mounted package; 3 leads  
SOT490  
D
B
E
A
X
H
v
M
A
E
3
A
c
1
2
e
b
w M  
1
B
p
L
p
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
UNIT  
b
c
D
E
e
e
H
L
v
w
A
p
p
1
E
0.8  
0.6  
0.33  
0.23  
0.2  
0.1  
1.7  
1.5  
0.95  
0.75  
1.7  
1.5  
0.5  
0.3  
mm  
1.0  
0.5  
0.1  
0.1  
REFERENCES  
JEDEC JEITA  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
05-07-28  
06-03-16  
SOT490  
SC-89  
2004 Aug 02  
7
NXP Semiconductors  
Product data sheet  
PNP resistor-equipped transistors;  
R1 = 22 kΩ, R2 = 22 kΩ  
PDTA124E series  
Plastic surface-mounted package; 3 leads  
SOT346  
E
A
D
B
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
L
p
e
b
w M  
B
1
p
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
UNIT  
A
b
c
D
E
e
e
H
L
Q
v
w
A
p
1
p
1
E
1.3  
1.0  
0.1  
0.013  
0.50  
0.35  
0.26  
0.10  
3.1  
2.7  
1.7  
1.3  
3.0  
2.5  
0.6  
0.2  
0.33  
0.23  
mm  
1.9  
0.95  
0.2  
0.2  
REFERENCES  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
JEDEC  
JEITA  
04-11-11  
06-03-16  
SOT346  
TO-236  
SC-59A  
2004 Aug 02  
8
NXP Semiconductors  
Product data sheet  
PNP resistor-equipped transistors;  
R1 = 22 kΩ, R2 = 22 kΩ  
PDTA124E series  
Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm  
SOT883  
L
L
1
2
b
3
b
e
1
1
e
1
A
A
1
E
D
0
0.5  
1 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
1
UNIT  
A
b
b
D
E
e
e
L
L
1
1
1
max.  
0.50  
0.46  
0.20 0.55 0.62 1.02  
0.12 0.47 0.55 0.95  
0.30 0.30  
0.22 0.22  
mm  
0.03  
0.35 0.65  
Note  
1. Including plating thickness  
REFERENCES  
JEDEC  
OUTLINE  
VERSION  
EUROPEAN  
PROJECTION  
ISSUE DATE  
IEC  
JEITA  
03-02-05  
03-04-03  
SOT883  
SC-101  
2004 Aug 02  
9
NXP Semiconductors  
Product data sheet  
PNP resistor-equipped transistors;  
R1 = 22 kΩ, R2 = 22 kΩ  
PDTA124E series  
Plastic single-ended leaded (through hole) package; 3 leads  
SOT54  
c
E
d
A
L
b
1
2
e
1
e
D
3
b
1
L
1
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
L
1
UNIT  
A
b
b
c
D
d
E
e
e
L
1
1
max.  
5.2  
5.0  
0.48  
0.40  
0.66  
0.55  
0.45  
0.38  
4.8  
4.4  
1.7  
1.4  
4.2  
3.6  
14.5  
12.7  
mm  
2.54  
1.27  
2.5  
Note  
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
04-06-28  
04-11-16  
SOT54  
TO-92  
SC-43A  
2004 Aug 02  
10  
NXP Semiconductors  
Product data sheet  
PNP resistor-equipped transistors;  
R1 = 22 kΩ, R2 = 22 kΩ  
PDTA124E series  
Plastic surface-mounted package; 3 leads  
SOT23  
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
e
b
w M  
B
1
L
p
p
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
UNIT  
b
c
D
E
e
e
H
L
Q
v
w
A
p
p
1
E
max.  
1.1  
0.9  
0.48  
0.38  
0.15  
0.09  
3.0  
2.8  
1.4  
1.2  
2.5  
2.1  
0.45  
0.15  
0.55  
0.45  
mm  
0.1  
1.9  
0.95  
0.2  
0.1  
REFERENCES  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
JEDEC  
JEITA  
04-11-04  
06-03-16  
SOT23  
TO-236AB  
2004 Aug 02  
11  
NXP Semiconductors  
Product data sheet  
PNP resistor-equipped transistors;  
R1 = 22 kΩ, R2 = 22 kΩ  
PDTA124E series  
Plastic surface-mounted package; 3 leads  
SOT323  
D
B
E
A
X
H
y
v M  
A
E
3
Q
A
A
1
c
1
2
L
p
e
b
w
M B  
1
p
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
max  
A
UNIT  
b
c
D
E
e
e
H
E
L
Q
v
w
p
p
1
1.1  
0.8  
0.4  
0.3  
0.25  
0.10  
2.2  
1.8  
1.35  
1.15  
2.2  
2.0  
0.45  
0.15  
0.23  
0.13  
mm  
0.1  
1.3  
0.65  
0.2  
0.2  
REFERENCES  
JEDEC JEITA  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
04-11-04  
06-03-16  
SOT323  
SC-70  
2004 Aug 02  
12  
NXP Semiconductors  
Product data sheet  
PNP resistor-equipped transistors;  
R1 = 22 kΩ, R2 = 22 kΩ  
PDTA124E series  
DATA SHEET STATUS  
DOCUMENT  
STATUS(1)  
PRODUCT  
STATUS(2)  
DEFINITION  
Objective data sheet  
Development  
This document contains data from the objective specification for product  
development.  
Preliminary data sheet  
Product data sheet  
Qualification  
Production  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Notes  
1. Please consult the most recently issued document before initiating or completing a design.  
2. The product status of device(s) described in this document may have changed since this document was published  
and may differ in case of multiple devices. The latest product status information is available on the Internet at  
URL http://www.nxp.com.  
DISCLAIMERS  
operation of the device at these or any other conditions  
above those given in the Characteristics sections of this  
document is not implied. Exposure to limiting values for  
extended periods may affect device reliability.  
General ⎯ Information in this document is believed to be  
accurate and reliable. However, NXP Semiconductors  
does not give any representations or warranties,  
expressed or implied, as to the accuracy or completeness  
of such information and shall have no liability for the  
consequences of use of such information.  
Terms and conditions of sale ⎯ NXP Semiconductors  
products are sold subject to the general terms and  
conditions of commercial sale, as published at  
http://www.nxp.com/profile/terms, including those  
pertaining to warranty, intellectual property rights  
infringement and limitation of liability, unless explicitly  
otherwise agreed to in writing by NXP Semiconductors. In  
case of any inconsistency or conflict between information  
in this document and such terms and conditions, the latter  
will prevail.  
Right to make changes ⎯ NXP Semiconductors  
reserves the right to make changes to information  
published in this document, including without limitation  
specifications and product descriptions, at any time and  
without notice. This document supersedes and replaces all  
information supplied prior to the publication hereof.  
Suitability for use ⎯ NXP Semiconductors products are  
not designed, authorized or warranted to be suitable for  
use in medical, military, aircraft, space or life support  
equipment, nor in applications where failure or malfunction  
of an NXP Semiconductors product can reasonably be  
expected to result in personal injury, death or severe  
property or environmental damage. NXP Semiconductors  
accepts no liability for inclusion and/or use of NXP  
Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at  
the customer’s own risk.  
No offer to sell or license ⎯ Nothing in this document  
may be interpreted or construed as an offer to sell products  
that is open for acceptance or the grant, conveyance or  
implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Export control ⎯ This document as well as the item(s)  
described herein may be subject to export control  
regulations. Export might require a prior authorization from  
national authorities.  
Quick reference data ⎯ The Quick reference data is an  
extract of the product data given in the Limiting values and  
Characteristics sections of this document, and as such is  
not complete, exhaustive or legally binding.  
Applications ⎯ Applications that are described herein for  
any of these products are for illustrative purposes only.  
NXP Semiconductors makes no representation or  
warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Limiting values ⎯ Stress above one or more limiting  
values (as defined in the Absolute Maximum Ratings  
System of IEC 60134) may cause permanent damage to  
the device. Limiting values are stress ratings only and  
2004 Aug 02  
13  
NXP Semiconductors  
Customer notification  
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal  
definitions and disclaimers. No changes were made to the technical content, except for package outline  
drawings which were updated to the latest version.  
Contact information  
For additional information please visit: http://www.nxp.com  
For sales offices addresses send e-mail to: salesaddresses@nxp.com  
© NXP B.V. 2009  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
R75/07/pp14  
Date of release: 2004 Aug 02  
Document order number: 9397 750 13652  

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